US9552026B2 - Mobile terminal - Google Patents

Mobile terminal Download PDF

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Publication number
US9552026B2
US9552026B2 US14/496,649 US201414496649A US9552026B2 US 9552026 B2 US9552026 B2 US 9552026B2 US 201414496649 A US201414496649 A US 201414496649A US 9552026 B2 US9552026 B2 US 9552026B2
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Prior art keywords
heat
mobile terminal
producing element
heat radiator
main body
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Expired - Fee Related, expires
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US14/496,649
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US20150131225A1 (en
Inventor
Shao-Han Chang
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Cloud Network Technology Singapore Pte Ltd
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Hon Hai Precision Industry Co Ltd
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Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, SHAO-HAN
Publication of US20150131225A1 publication Critical patent/US20150131225A1/en
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Assigned to CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD. reassignment CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HON HAI PRECISION INDUSTRY CO., LTD.
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1626Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/21Combinations with auxiliary equipment, e.g. with clocks or memoranda pads

Definitions

  • the subject matter herein generally relates to the field of heat dissipation.
  • a mobile terminal may include a main body and a speaker unit for providing audible information.
  • An upper cover may have a display for displaying a text and other information.
  • a lower cover may be coupled to the upper cover to cooperatively form a space in which various components can be mounted.
  • a printed circuit board (PCB) may be installed in the space. In receiving/transmitting information or using its various functions (such as games or the like), a user may press the display with a finger to input information.
  • the components of the printed circuit board inevitably generate heat due to collisions of electrons caused by operation of the component.
  • the heat generally cannot evenly spread through out but concentrates on a specific portion thereby forming a hot area.
  • the upper cover is usually the hottest part.
  • life span and performance of components of the printed circuit board may deteriorate due to the heating over an extended period.
  • FIG. 1 is a perspective view of a mobile terminal according to an embodiment of the present disclosure.
  • FIG. 2 is an exploded perspective view of the mobile terminal as shown in FIG. 1 .
  • FIG. 3 is a cross-sectional view of the mobile terminal taken along a line III-III of FIG. 1 .
  • FIG. 4 is a perspective view of a back cover of the mobile terminal as shown in FIG. 1 .
  • FIG. 5 is an enlarged view of circled portion V of FIG. 3 .
  • FIG. 6 is an enlarged view of a circled portion according to another embodiment of this disclosure.
  • Coupled is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections.
  • the connection can be such that the objects are permanently connected or releasably connected.
  • outside refers to a region that is beyond the outermost confines of a physical object.
  • inside indicates that at least a portion of a region is partially contained within a boundary formed by the object.
  • substantially is defined to be essentially conforming to the particular dimension, shape, or other feature that the terms modifies, such that the component need not be exact. For example, substantially cylindrical means that the object resembles a cylinder, but can have one or more deviations from a true cylinder.
  • comprising when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
  • FIG. 1 illustrates a mobile terminal 100 according to an embodiment of the present disclosure which can include a main body 110 and a back cover 130 detachably connected to the main body 110 .
  • the main body 110 and the back cover 130 can form a space in which various components can be mounted.
  • the back cover 130 can define a perforated portion 131 to allow the heat from the mobile terminal 100 to escape.
  • FIG. 2 illustrates that the mobile terminal 100 can further include a heat dissipating member 120 positioned in the main body 110 and a battery 140 mounted in the main body 110 to supply electrical energy.
  • the main body 110 can include a front panel 111 , a printed circuit board (PCB) 112 , a heat-producing element 113 and a back panel 114 .
  • the front panel 111 can be used to install a display and/or a keyboard.
  • the PCB 112 can be positioned on the front panel 111 to allow the connection of various components.
  • the heat-producing element 113 installed on the PCB 112 can be a wireless-fidelity (WIFI) power amplification chip, a global positioning system (GPS) chip, or an audio-frequency power amplification chip.
  • WIFI wireless-fidelity
  • GPS global positioning system
  • the heat-producing element 113 can generate a large amount of heat.
  • the heat dissipating member 120 can include a heat-conducting pad 121 and a heat radiator 122 .
  • the heat-conducting pad 121 can be made of a thermally conductive material.
  • a size of the heat-conducting pad 121 can be matched with a size of the upper surface of the heat-producing element 113 to remove the heat from the heat-producing element 113 to the heat radiator 122 .
  • the heat radiator 122 can be a substantially rectangular plate with a concave portion 123 in a central portion thereof.
  • the heat radiator 122 can be attached to the back panel 114 . In other embodiments, the heat radiator 122 can be another shape of flat plate.
  • the heat radiator 122 can be made of a metal coated by an insulating layer.
  • the heat radiator 122 with an insulating layer can prevent the heat-producing element 113 from short circuiting when the heat-producing element 113 makes contact with the heat radiator 122 .
  • the heat radiator 122 can be used as an aromatherapy diffuser.
  • a plurality of volatile aromatic blocks 124 can be positioned in the heat radiator 122 .
  • the aromatic blocks 124 can be volatilize by absorbing the heat of the heat radiator 122 .
  • the back cover 130 can be detachably connected to the main body 110 , the back cover 130 can be removed to change the aromatic blocks 124 .
  • the two sides of the back cover 130 can detachably connected to the corresponding sides of the back panel 114 , thus the back cover 130 can be easily installed or demounted from the back panel 114 .
  • FIG. 3 illustrates that the back panel 114 (as shown in FIG. 2 ) can include a support wall 1141 and a base-cover 1142 connected with the support wall 1141 .
  • the support wall 1141 can be detachably connected with the front panel 111 .
  • the support wall 1141 , the base-cover 1142 and the front panel 111 can cooperatively form a receiving portion 115 .
  • the PCB 112 and the heat-producing element 113 can be received in the receiving portion 115 .
  • the base-cover 1142 can define an opening 1143 on the top of the heat-producing element 113 , and the opening 1143 can be configured for receiving the heat dissipating member 120 (as shown in FIG. 2 ) therein.
  • the opening 1143 can be adapted to application requirements of the heat dissipating member 120 .
  • FIG. 4 illustrates that the back panel 114 can be a substantially rectangular plate.
  • the opening 1143 can be located in the substantially central position of the back panel 114 , and can be a squared opening.
  • the back panel 114 can further include a receiving groove 1144 configured to receive the battery 140 .
  • FIG. 5 illustrates that the heat-conducting pad 121 can be sandwiched between the heat-producing element 113 and the heat radiator 122 , and can be in close contact with the heat-producing element 113 and the heat radiator 122 .
  • One surface of the heat-conducting pad 121 can be attached to the upper surface of the heat-producing element 113 , and the other surface of the heat-conducting pad 121 can be attached to the heat radiator 122 .
  • the heat-conducting pad 121 can remove the heat from the heat-producing element 113 and pass it to the heat radiator 122 .
  • the heat radiator 122 can be positioned in the opening 1143 by embedded forming. In at least one embodiment, the heat radiator 122 can be integrated with the main body 110 .
  • a size of the heat radiator 122 is greater than the upper surface of the heat-producing element 113 to increase the heat dissipation area.
  • the opening 1143 can be defined on the top of the heat-producing element 113 .
  • the heat radiator 122 can be positioned in the back panel 114 via the opening 1143 , and the perforated portion 131 can be on the top of the heat radiator 122 .
  • External air can pass into the back cover 130 via the perforated portion 131 and flow over the heat dissipating member 120 to remove the heat from the mobile terminal 100 .
  • the heat dissipating member 120 can effectively improve the heat radiating efficiency and reduce the cost of the mobile terminal 100 without comprising the safety of the product.
  • FIG. 6 illustrates a mobile terminal 100 according to another embodiment of the present disclosure, including a front panel 211 , a PCB 212 positioned on the front panel 211 , a heat-producing element 213 positioned on the PCB 212 , and a back panel 214 .
  • a heat radiator 222 can be integrated with the back panel 214 .
  • a protective cap 250 can be above, and cover, the heat-producing element 213 .
  • the protective cap 250 can be a metal cap used to reduce electromagnetic interference.
  • a first heat-conducting pad 261 can be positioned between the heat-producing element 213 and the protective cap 250 .
  • a size of the first heat-conducting pad 261 can match a size of the heat-producing element 213 to remove the heat from the heat-producing element 213 and pass it to the protective cap 250 .
  • a second heat-conducting pad 262 can be positioned between the protective cap 250 and the heat radiator 222 .
  • a size of the second heat-conducting pad 262 can match a size of the protective cap 250 to remove the heat from the protective cap 250 and pass it to the heat radiator 222 .
  • a perforated portion 231 in the back cover 230 have direct access to the heat radiator 222 and there is no impediment preventing the cooler external air removing the heat from the mobile terminal 100 .
  • the heat radiator 222 can effectively improve the heat radiating efficiency and reduce the cost of the mobile terminal 100 without affecting the safety of the product.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat-dissipating mobile terminal includes a main body, a heat dissipating member positioned in the main body, and a back cover detachably connected to the main body. The main body includes a heat-producing element and the heat dissipating member includes a heat radiator arranged above the heat-producing element. The back cover defines a perforated portion above the heat dissipating member. The heat radiator is integrated with the main body. The heat radiator is exposed to external cooler air by the perforated portion in the back cover. The mobile terminal of the present disclosure effectively improves heat radiating efficiency and reduces cost.

Description

FIELD
The subject matter herein generally relates to the field of heat dissipation.
BACKGROUND
A mobile terminal may include a main body and a speaker unit for providing audible information. An upper cover may have a display for displaying a text and other information. A lower cover may be coupled to the upper cover to cooperatively form a space in which various components can be mounted. A printed circuit board (PCB) may be installed in the space. In receiving/transmitting information or using its various functions (such as games or the like), a user may press the display with a finger to input information.
The components of the printed circuit board inevitably generate heat due to collisions of electrons caused by operation of the component.
The heat generally cannot evenly spread through out but concentrates on a specific portion thereby forming a hot area. The upper cover is usually the hottest part. Thus, when a user touches the mobile terminal, the user may feel the heat. Furthermore, life span and performance of components of the printed circuit board may deteriorate due to the heating over an extended period.
BRIEF DESCRIPTION OF THE DRAWINGS
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures:
FIG. 1 is a perspective view of a mobile terminal according to an embodiment of the present disclosure.
FIG. 2 is an exploded perspective view of the mobile terminal as shown in FIG. 1.
FIG. 3 is a cross-sectional view of the mobile terminal taken along a line III-III of FIG. 1.
FIG. 4 is a perspective view of a back cover of the mobile terminal as shown in FIG. 1.
FIG. 5 is an enlarged view of circled portion V of FIG. 3.
FIG. 6 is an enlarged view of a circled portion according to another embodiment of this disclosure.
DETAILED DESCRIPTION
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “outside” refers to a region that is beyond the outermost confines of a physical object. The term “inside” indicates that at least a portion of a region is partially contained within a boundary formed by the object. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the terms modifies, such that the component need not be exact. For example, substantially cylindrical means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
FIG. 1 illustrates a mobile terminal 100 according to an embodiment of the present disclosure which can include a main body 110 and a back cover 130 detachably connected to the main body 110. The main body 110 and the back cover 130 can form a space in which various components can be mounted. The back cover 130 can define a perforated portion 131 to allow the heat from the mobile terminal 100 to escape.
FIG. 2 illustrates that the mobile terminal 100 can further include a heat dissipating member 120 positioned in the main body 110 and a battery 140 mounted in the main body 110 to supply electrical energy.
The main body 110 can include a front panel 111, a printed circuit board (PCB) 112, a heat-producing element 113 and a back panel 114. The front panel 111 can be used to install a display and/or a keyboard. The PCB 112 can be positioned on the front panel 111 to allow the connection of various components. The heat-producing element 113 installed on the PCB 112 can be a wireless-fidelity (WIFI) power amplification chip, a global positioning system (GPS) chip, or an audio-frequency power amplification chip. The heat-producing element 113 can generate a large amount of heat.
The heat dissipating member 120 can include a heat-conducting pad 121 and a heat radiator 122. The heat-conducting pad 121 can be made of a thermally conductive material. A size of the heat-conducting pad 121 can be matched with a size of the upper surface of the heat-producing element 113 to remove the heat from the heat-producing element 113 to the heat radiator 122. The heat radiator 122 can be a substantially rectangular plate with a concave portion 123 in a central portion thereof. The heat radiator 122 can be attached to the back panel 114. In other embodiments, the heat radiator 122 can be another shape of flat plate. The heat radiator 122 can be made of a metal coated by an insulating layer. The heat radiator 122 with an insulating layer can prevent the heat-producing element 113 from short circuiting when the heat-producing element 113 makes contact with the heat radiator 122.
The heat radiator 122 can be used as an aromatherapy diffuser. A plurality of volatile aromatic blocks 124 can be positioned in the heat radiator 122. The aromatic blocks 124 can be volatilize by absorbing the heat of the heat radiator 122. As the back cover 130 can be detachably connected to the main body 110, the back cover 130 can be removed to change the aromatic blocks 124.
The two sides of the back cover 130 can detachably connected to the corresponding sides of the back panel 114, thus the back cover 130 can be easily installed or demounted from the back panel 114.
FIG. 3 illustrates that the back panel 114 (as shown in FIG. 2) can include a support wall 1141 and a base-cover 1142 connected with the support wall 1141. The support wall 1141 can be detachably connected with the front panel 111. The support wall 1141, the base-cover 1142 and the front panel 111 can cooperatively form a receiving portion 115. The PCB 112 and the heat-producing element 113 can be received in the receiving portion 115. The base-cover 1142 can define an opening 1143 on the top of the heat-producing element 113, and the opening 1143 can be configured for receiving the heat dissipating member 120 (as shown in FIG. 2) therein. The opening 1143 can be adapted to application requirements of the heat dissipating member 120.
FIG. 4 illustrates that the back panel 114 can be a substantially rectangular plate. The opening 1143 can be located in the substantially central position of the back panel 114, and can be a squared opening. The back panel 114 can further include a receiving groove 1144 configured to receive the battery 140.
FIG. 5 illustrates that the heat-conducting pad 121 can be sandwiched between the heat-producing element 113 and the heat radiator 122, and can be in close contact with the heat-producing element 113 and the heat radiator 122. One surface of the heat-conducting pad 121 can be attached to the upper surface of the heat-producing element 113, and the other surface of the heat-conducting pad 121 can be attached to the heat radiator 122. The heat-conducting pad 121 can remove the heat from the heat-producing element 113 and pass it to the heat radiator 122. The heat radiator 122 can be positioned in the opening 1143 by embedded forming. In at least one embodiment, the heat radiator 122 can be integrated with the main body 110. A size of the heat radiator 122 is greater than the upper surface of the heat-producing element 113 to increase the heat dissipation area. The opening 1143 can be defined on the top of the heat-producing element 113. The heat radiator 122 can be positioned in the back panel 114 via the opening 1143, and the perforated portion 131 can be on the top of the heat radiator 122.
External air can pass into the back cover 130 via the perforated portion 131 and flow over the heat dissipating member 120 to remove the heat from the mobile terminal 100. The heat dissipating member 120 can effectively improve the heat radiating efficiency and reduce the cost of the mobile terminal 100 without comprising the safety of the product.
FIG. 6 illustrates a mobile terminal 100 according to another embodiment of the present disclosure, including a front panel 211, a PCB 212 positioned on the front panel 211, a heat-producing element 213 positioned on the PCB 212, and a back panel 214. A heat radiator 222 can be integrated with the back panel 214. A protective cap 250 can be above, and cover, the heat-producing element 213. The protective cap 250 can be a metal cap used to reduce electromagnetic interference. A first heat-conducting pad 261 can be positioned between the heat-producing element 213 and the protective cap 250. A size of the first heat-conducting pad 261 can match a size of the heat-producing element 213 to remove the heat from the heat-producing element 213 and pass it to the protective cap 250. A second heat-conducting pad 262 can be positioned between the protective cap 250 and the heat radiator 222. A size of the second heat-conducting pad 262 can match a size of the protective cap 250 to remove the heat from the protective cap 250 and pass it to the heat radiator 222.
A perforated portion 231 in the back cover 230 have direct access to the heat radiator 222 and there is no impediment preventing the cooler external air removing the heat from the mobile terminal 100. The heat radiator 222 can effectively improve the heat radiating efficiency and reduce the cost of the mobile terminal 100 without affecting the safety of the product.
The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of the backlight module 100. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.

Claims (11)

What is claimed is:
1. A mobile terminal comprising:
a main body having a front panel, a printed circuit board positioned on the front panel, a back panel detachably connected with the front panel and a back cover detachably connected to the back panel;
a heat-producing element enclosed within the main body; and
a heat dissipating member enclosed within the main body, and the heat dissipating member having a heat radiator integral with the main body;
wherein the back panel comprises a support wall, a base-cover connected to the support wall, and a receiving groove configured to receive a battery, and wherein the support wall is detachably connected to the front panel, and wherein the support wall, the base-cover and the front panel cooperatively form a receiving portion for receiving the printed circuit board and the heat-producing element;
wherein the back cover includes a perforated portion; and
wherein the heat dissipating member is positioned between the heat-producing element and the perforated portion of the back cover.
2. The mobile terminal of claim 1, wherein the heat radiator is made of a metal coated by an insulating layer.
3. The mobile terminal of claim 1, wherein a size of the heat radiator is greater than a size of the upper surface of the heat-producing element.
4. The mobile terminal of claim 1, wherein the heat radiator is a substantially rectangular plate having a concave portion in the central portion thereof.
5. The mobile terminal of claim 1, wherein the heat dissipating member further comprises a heat-conducting pad positioned between the heat-producing element and the heat radiator, and the heat-conducting pad is in close contact with the heat-producing element and the heat radiator.
6. The mobile terminal of claim 5, wherein the heat-conducting pad is made of a thermally conductive material.
7. The mobile terminal of claim 1, wherein the back panel defines an opening, and the heat radiator is positioned in the opening.
8. The mobile terminal of claim 1, wherein the heat radiator is integrated with the back panel.
9. The mobile terminal of claim 1, wherein a protective cap is covered above the heat-producing element, and two heat-conducting pads are positioned on the two opposite surfaces of the protective cap.
10. The mobile terminal of claim 9, wherein the protective cap is a metal cap.
11. The mobile terminal of claim 1, wherein the heat radiator is used as an aromatherapy diffuser, and a volatile aromatic block is positioned in the heat radiator.
US14/496,649 2013-11-11 2014-09-25 Mobile terminal Expired - Fee Related US9552026B2 (en)

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* Cited by examiner, † Cited by third party
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US11375302B2 (en) * 2019-07-22 2022-06-28 AAC Technologies Pte. Ltd. Speaker device and mobile terminal provided with speaker device
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* Cited by examiner, † Cited by third party
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EP3742875B1 (en) * 2019-05-22 2023-07-12 Veoneer Sweden AB Thermal management in an electronic device
CN111010857B (en) * 2019-12-30 2022-02-01 维沃移动通信有限公司 Electronic device

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4629604A (en) * 1983-03-21 1986-12-16 Donald Spector Multi-aroma cartridge player
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material
US5887118A (en) * 1997-02-12 1999-03-23 Motorola, Inc. Olfactory card
US20040203412A1 (en) * 2003-01-22 2004-10-14 Greco Paul M. Communication device having a scent release feature and method thereof
US20050013728A1 (en) * 2003-07-17 2005-01-20 First International Computer Inc. Fragrance generation device
US20050111194A1 (en) * 2003-11-21 2005-05-26 Lg Electronics Inc. Heat radiating system and method for a mobile communication terminal
TWM280025U (en) 2005-01-05 2005-11-01 Power Chan Ind Co Ltd Fragrant USB adapter
US7310539B2 (en) * 2004-04-02 2007-12-18 Hon Hai Precision Industry Co., Ltd. Portable communication device with plural olfactory cuing
US20080070567A1 (en) * 2006-09-14 2008-03-20 Sony Ericsson Mobile Communications Ab Portable Communication Device Having a Scent Emitting Compound
TWM346269U (en) 2008-06-16 2008-12-01 Advantech Co Ltd Housing structure capable of combining heat dissipation device
CN201252711Y (en) 2008-07-02 2009-06-03 研华股份有限公司 Casing body structure capable of combining with a radiator
US7651666B2 (en) * 2006-04-20 2010-01-26 S.C. Johnson & Son, Inc. Air treatment device with reservoir refill
CN101757667A (en) 2008-12-26 2010-06-30 和硕联合科技股份有限公司 Automatic smell-emitting device and electronic device used by same
US7839396B2 (en) * 2006-07-21 2010-11-23 Samsung Electronics Co., Ltd. Display device
US7952881B2 (en) * 2009-03-31 2011-05-31 Motorola Solutions, Inc. Thermal-electrical assembly for a portable communication device
CN102083295A (en) 2009-11-27 2011-06-01 鸿富锦精密工业(深圳)有限公司 Electronic device and heat radiating module thereof
US8111513B2 (en) * 2009-06-04 2012-02-07 Pegatron Corporation Industrial computer
CN202496170U (en) 2011-11-24 2012-10-17 比亚迪股份有限公司 Shielding structure and mobile terminal
US20130141866A1 (en) * 2011-12-02 2013-06-06 Gamal Refai-Ahmed Portable computing device with thermal management
US20130164178A1 (en) * 2011-12-22 2013-06-27 Marcy Carmichael Fragrance Dispenser for use with portable electronic device
CN103220896A (en) 2012-01-20 2013-07-24 光宝科技股份有限公司 Heat dissipation structure and electronic device with same
TW201332425A (en) 2012-01-20 2013-08-01 Lite On Technology Corp Heat dissipation structure and electronic device having the same
US20140092561A1 (en) * 2012-09-29 2014-04-03 Nvidia Corporation Handheld mobile device and back cover for the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4556174B2 (en) * 2004-12-15 2010-10-06 日本電気株式会社 Portable terminal device and heat dissipation method
US7957131B1 (en) * 2009-12-23 2011-06-07 Intel Corporation Electronic device thermal management
CN202383586U (en) * 2011-08-10 2012-08-15 深圳市德龙华乐电子科技有限公司 Portable PC heat radiation apparatus
CN202998207U (en) * 2012-12-12 2013-06-12 何明峰 Handset back cover

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4629604A (en) * 1983-03-21 1986-12-16 Donald Spector Multi-aroma cartridge player
US5300809A (en) * 1989-12-12 1994-04-05 Sumitomo Special Metals Co., Ltd. Heat-conductive composite material
US5887118A (en) * 1997-02-12 1999-03-23 Motorola, Inc. Olfactory card
US20040203412A1 (en) * 2003-01-22 2004-10-14 Greco Paul M. Communication device having a scent release feature and method thereof
US20050013728A1 (en) * 2003-07-17 2005-01-20 First International Computer Inc. Fragrance generation device
US20050111194A1 (en) * 2003-11-21 2005-05-26 Lg Electronics Inc. Heat radiating system and method for a mobile communication terminal
US7310539B2 (en) * 2004-04-02 2007-12-18 Hon Hai Precision Industry Co., Ltd. Portable communication device with plural olfactory cuing
TWM280025U (en) 2005-01-05 2005-11-01 Power Chan Ind Co Ltd Fragrant USB adapter
US7651666B2 (en) * 2006-04-20 2010-01-26 S.C. Johnson & Son, Inc. Air treatment device with reservoir refill
US7839396B2 (en) * 2006-07-21 2010-11-23 Samsung Electronics Co., Ltd. Display device
US20080070567A1 (en) * 2006-09-14 2008-03-20 Sony Ericsson Mobile Communications Ab Portable Communication Device Having a Scent Emitting Compound
TWM346269U (en) 2008-06-16 2008-12-01 Advantech Co Ltd Housing structure capable of combining heat dissipation device
CN201252711Y (en) 2008-07-02 2009-06-03 研华股份有限公司 Casing body structure capable of combining with a radiator
CN101757667A (en) 2008-12-26 2010-06-30 和硕联合科技股份有限公司 Automatic smell-emitting device and electronic device used by same
US7952881B2 (en) * 2009-03-31 2011-05-31 Motorola Solutions, Inc. Thermal-electrical assembly for a portable communication device
US8111513B2 (en) * 2009-06-04 2012-02-07 Pegatron Corporation Industrial computer
CN102083295A (en) 2009-11-27 2011-06-01 鸿富锦精密工业(深圳)有限公司 Electronic device and heat radiating module thereof
CN202496170U (en) 2011-11-24 2012-10-17 比亚迪股份有限公司 Shielding structure and mobile terminal
US20130141866A1 (en) * 2011-12-02 2013-06-06 Gamal Refai-Ahmed Portable computing device with thermal management
US20130164178A1 (en) * 2011-12-22 2013-06-27 Marcy Carmichael Fragrance Dispenser for use with portable electronic device
CN103220896A (en) 2012-01-20 2013-07-24 光宝科技股份有限公司 Heat dissipation structure and electronic device with same
TW201332425A (en) 2012-01-20 2013-08-01 Lite On Technology Corp Heat dissipation structure and electronic device having the same
US20140092561A1 (en) * 2012-09-29 2014-04-03 Nvidia Corporation Handheld mobile device and back cover for the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11368770B2 (en) * 2019-07-22 2022-06-21 AAC Technologies Pte. Ltd. Speaker box device and mobile terminal using same
US11375302B2 (en) * 2019-07-22 2022-06-28 AAC Technologies Pte. Ltd. Speaker device and mobile terminal provided with speaker device
US11375301B2 (en) * 2019-07-22 2022-06-28 AAC Technologies Pte. Ltd. Speaker box device and mobile terminal using same

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