CN102083295A - Electronic device and heat radiating module thereof - Google Patents
Electronic device and heat radiating module thereof Download PDFInfo
- Publication number
- CN102083295A CN102083295A CN2009103105451A CN200910310545A CN102083295A CN 102083295 A CN102083295 A CN 102083295A CN 2009103105451 A CN2009103105451 A CN 2009103105451A CN 200910310545 A CN200910310545 A CN 200910310545A CN 102083295 A CN102083295 A CN 102083295A
- Authority
- CN
- China
- Prior art keywords
- radiator
- fluting
- heat
- electronic installation
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an electronic device comprising an electronic element and a heat radiating module mounted on a circuit board. The heat radiating module comprises a heat radiating attached to the electronic element and a shell for hooding the electronic element and the heat radiating which is provided with a plurality of air chutes; and the shell is provided with grooves communicated with the exterior of the shell corresponding to the air chutes of the radiator so that the heat of the radiator is radiated to outside through the grooves. The grooves of the shell are directly communicated with the radiator and the exterior of the electronic device and the efficiency of natural convection is improved through low-temperature gas in external environment.
Description
Technical field
The present invention relates to a kind of electronic installation, be meant a kind of electronic installation especially with heat radiation module.
Background technology
In recent years, the variation rapidly of computer communication and consumer electronics device is being pursued under the compact trend of electronic equipment, and its heat dissipation technology must make improvements along with electronic equipment trend.Present stage is in order to meet the compact requirement of electronic equipment, its built-in system uses the passive heat radiation mode to dispel the heat usually, promptly by at main thermal source (heat-generating electronic elements) mounted on surface radiator and under the heat dissipation environment of free convection, the heat that main electronic component produced on the circuit board is removed, to avoid the use of fan.
Yet, also be provided with other heat-generating electronic elements such as some transistors, electric capacity around the main electronic component of electronic equipment internal.These electronic components also can produce many heats, will cause the internal system gas temperature too high and cause radiating efficiency not good.
Summary of the invention
The present invention aims to provide a kind of electronic installation and heat radiation module thereof that improves main electronic element radiating efficient.
A kind of electronic installation, comprise that one is installed in an electronic component and the heat radiation module on the circuit board, this heat radiation module comprises be sticked a radiator on electronic component and the housing that electronic component and radiator are covered with, described radiator is provided with some air ducts, described housing is provided with the fluting of some connection outside to air duct that should radiator so that the heat of radiator by the fluting heat radiation to outside.
Compared with prior art, the fluting of housing of the present invention directly is communicated with radiator and electronic installation outside, increases the efficient of free convection by the cryogenic gas of external environment condition.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of one embodiment of the invention electronic installation.
Fig. 2 is the three-dimensional exploded view of electronic installation among Fig. 1.
Fig. 3 is the inversion figure of electronic installation among Fig. 2.
Fig. 4 is the cutaway view of electronic installation among Fig. 1.
Embodiment
See also Fig. 1-3, the electronic installation in one embodiment of the invention comprises a circuit board 10 and the heat radiation module 50 that circuit board 10 is enclosed.This circuit board 10 is provided with a main heat-generating electronic elements 21 and places the several times of main heat-generating electronic elements 21 both sides to want heat-generating electronic elements 22.This heat radiation module 50 comprises that one is attached at the radiator 30 on main heat-generating electronic elements 21 surfaces, and circuit board 10 and radiator 30 are covered at housing 40 in it.
This circuit board 10 is the setting of lengthwise shape, and described main heat-generating electronic elements 21 places the middle part of circuit board 10, and described less important heat-generating electronic elements 22 places on the both ends of circuit board 10.This electronic installation is a small-sized electronic product in the present embodiment, as game host, wherein, main heat-generating electronic elements 21 is CPU (central processing unit), it all produces sizable heat when operation, this game host structure is compact, and the space of inner ccontaining heat abstractor is limited, is not suitable for installing fan and carries out active heat radiation.Described less important heat-generating electronic elements 21 is the few chip of the main heat-generating electronic elements of caloric value 21, transistor or the like.
This radiator 30 comprises a pedestal 31 and from pedestal 31 some radiating fins 32 of extending of one upwards.These radiating fins 32 are parallel to each other and form some air ducts that are parallel to each other 33 at interval, and this air duct 33 is communicated with the both sides and the top of radiator 30.Air duct 33 prolongs the horizontal direction extension of circuit board 10 when radiator 30 is mounted on the main heat-generating electronic elements 21, and promptly air duct 33 extends towards the both sides of circuit board.
Please together consult Fig. 4, housing 40 comprises the top cover 41 of a lengthwise and the bottom 42 that cooperates with top cover 41.Described circuit board 10 is installed on the bottom 42, and the radiating fin 32 of this radiator 30 is towards top cover 41.This top cover 41 is the arcuation setting, comprises a smooth end face 411 and the arc surface 412 of both sides.These top cover 41 middle parts are provided with some parallel flutings 413, and these flutings 413 are arranged on the arc surface 412 of end face 411 and both sides simultaneously, and corresponding radiator 30, so that the air duct 33 of radiator 30 is communicated with the air in the external world by the fluting 413 of top cover 41.These flutings 413 are parallel to the air duct 33 of radiator 30.Housing 40 extends the base plate 45 of two dividing plates 44 and connection dividing plate 44 bottom margins downwards from inner surface.These dividing plates 44 are positioned at the two ends of fluting 413, and radiator 30 is located between the dividing plate 44.Described base plate 45 middle parts are provided with an opening 450 and pass for radiator 30.This base plate 45 surrounds a receiving space in the lump with described dividing plate 44 and separates with less important heat-generating electronic elements 22 with the radiating fin 32 with radiator 30, and described fluting 413 is communicated with this receiving space and outside.Top cover 41 two ends are provided with side cover 46, and side cover 46 is provided with the slotted opening 460 of plurality of vertical, to be communicated with less the air in the less important heat-generating electronic elements 22 and housing 40 external worlds.
During electronic installation work, the heat that main heat-generating electronic elements 21 produces is absorbed by radiator 30 and distributes by radiating fin 32, because radiating fin 32 directly is communicated with electronic installation is outside by the fluting 413 of top cover 41, increase the efficient of free convection by the cryogenic gas of the external environment condition lower, thereby need not to transmit heat through the hot-air of electronic installation inside than internal temperature.In addition, the dividing plate 44 of housing 40 inside and base plate 45 separate radiating fin 32 and less important heat-generating electronic elements 22, and the heat transferred of also avoiding radiating fin 32 is to electronic installation inside, thereby guarantee that electronic installation moves under a lower internal temperature.
Claims (10)
1. electronic installation, comprise one be installed in electronic component on the circuit board, radiator on electronic component and the housing that electronic component and radiator are covered with are sticked, it is characterized in that: described radiator is provided with some air ducts, described housing is provided with the fluting of some connection outside to air duct that should radiator so that the heat of radiator by the fluting heat radiation to outside.
2. electronic installation as claimed in claim 1 is characterized in that: described housing two dividing plates that extend internally, and described radiator is located between two dividing plates, and described fluting is arranged between the dividing plate.
3. electronic installation as claimed in claim 2 is characterized in that: the air duct of described fluting and radiator is parallel to each other.
4. electronic installation as claimed in claim 2, it is characterized in that: described housing comprises that also one connects the base plate of described dividing plate root edge, this base plate is provided with opening and passes for radiator, described dividing plate, base plate are enclosed to form a receiving space to accommodate radiator, and described fluting is communicated with this receiving space and outside.
5. electronic installation as claimed in claim 2 is characterized in that: described circuit board also comprises some second electronic components, and described dividing plate places between the described electronic component and second electronic component.
6. electronic installation as claimed in claim 1 is characterized in that: described housing comprises the smooth end face and the arc surface of both sides, and described fluting is arranged on end face and the arc surface.
One kind the heat radiation module, comprise that one is installed in the housing that radiator and on the electronic component is covered with this radiator, it is characterized in that: described radiator is provided with some air ducts, described housing is provided with the fluting of some connection outside to air duct that should radiator so that the heat of radiator by the fluting heat radiation to outside.
8. heat radiation module as claimed in claim 7, it is characterized in that: extend internally two dividing plates and connect the base plate of described dividing plate root edge of described housing, this base plate is provided with opening and passes for radiator, described dividing plate, base plate are enclosed to form a receiving space to accommodate radiator, and described fluting is communicated with this receiving space and outside.
9. heat radiation module as claimed in claim 7 is characterized in that: the air duct of described fluting and radiator is parallel to each other.
10. heat radiation module as claimed in claim 7 is characterized in that: described housing comprises the smooth end face and the arc surface of both sides, and described fluting is arranged on end face and the arc surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103105451A CN102083295A (en) | 2009-11-27 | 2009-11-27 | Electronic device and heat radiating module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103105451A CN102083295A (en) | 2009-11-27 | 2009-11-27 | Electronic device and heat radiating module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102083295A true CN102083295A (en) | 2011-06-01 |
Family
ID=44088976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103105451A Pending CN102083295A (en) | 2009-11-27 | 2009-11-27 | Electronic device and heat radiating module thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102083295A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427830A (en) * | 2013-09-06 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN104640414A (en) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| CN104756619A (en) * | 2012-11-02 | 2015-07-01 | 日立汽车系统株式会社 | Electronic control device |
| CN111316767A (en) * | 2017-05-17 | 2020-06-19 | 株式会社自动网络技术研究所 | Circuit arrangement |
| CN111867285A (en) * | 2020-06-04 | 2020-10-30 | 嵊州市三吉电子有限公司 | Heat dissipation structure for direct current motor controller and installation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2720506Y (en) * | 2004-06-24 | 2005-08-24 | 研华股份有限公司 | Electronic equipment radiating device |
| US20070151705A1 (en) * | 2005-12-30 | 2007-07-05 | Kwan Rita Y | Heat dissipating clamp for dissipating heat of chips in an electrical device |
| CN201039639Y (en) * | 2007-04-29 | 2008-03-19 | 勤诚兴业股份有限公司 | Improved cabinet structure |
| CN101494966A (en) * | 2008-01-22 | 2009-07-29 | 纬创资通股份有限公司 | Radiating module with dedusting mechanism and combination of electronic device and radiating module |
-
2009
- 2009-11-27 CN CN2009103105451A patent/CN102083295A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2720506Y (en) * | 2004-06-24 | 2005-08-24 | 研华股份有限公司 | Electronic equipment radiating device |
| US20070151705A1 (en) * | 2005-12-30 | 2007-07-05 | Kwan Rita Y | Heat dissipating clamp for dissipating heat of chips in an electrical device |
| CN201039639Y (en) * | 2007-04-29 | 2008-03-19 | 勤诚兴业股份有限公司 | Improved cabinet structure |
| CN101494966A (en) * | 2008-01-22 | 2009-07-29 | 纬创资通股份有限公司 | Radiating module with dedusting mechanism and combination of electronic device and radiating module |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104756619A (en) * | 2012-11-02 | 2015-07-01 | 日立汽车系统株式会社 | Electronic control device |
| CN104427830A (en) * | 2013-09-06 | 2015-03-18 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN104640414A (en) * | 2013-11-11 | 2015-05-20 | 富泰华精密电子（郑州）有限公司 | Mobile terminal |
| US9552026B2 (en) | 2013-11-11 | 2017-01-24 | Hon Hai Precision Industry Co., Ltd. | Mobile terminal |
| CN111316767A (en) * | 2017-05-17 | 2020-06-19 | 株式会社自动网络技术研究所 | Circuit arrangement |
| CN111867285A (en) * | 2020-06-04 | 2020-10-30 | 嵊州市三吉电子有限公司 | Heat dissipation structure for direct current motor controller and installation method thereof |
| CN111867285B (en) * | 2020-06-04 | 2023-05-30 | 嵊州市三吉电子有限公司 | Heat dissipation structure for direct current motor controller and mounting method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5828549A (en) | Combination heat sink and air duct for cooling processors with a series air flow | |
| TWI399165B (en) | System for efficiently cooling a processor | |
| US7212404B2 (en) | Integrated heat sink device | |
| CN201138463Y (en) | Computer system with wind-guiding cowl | |
| TW201118543A (en) | Electronic device and heat dissipation module thereof | |
| US7948754B2 (en) | External heat dissipation device | |
| CN101026944A (en) | Radiating device | |
| CN101808490A (en) | Heat dissipating device | |
| CN102083295A (en) | Electronic device and heat radiating module thereof | |
| US7929302B2 (en) | Cooling device | |
| TW201314425A (en) | Radiator device and electronic device using same | |
| CN201821591U (en) | Radiator shell and communication terminal device | |
| CN109152273A (en) | Electronic device | |
| TW201218931A (en) | Mainboard and electronic device employ the sam | |
| US7688590B2 (en) | Thermal module and electronic apparatus using the same | |
| CN113301784B (en) | Heat sink device | |
| US9507378B2 (en) | Flat panel electronic device, auxiliary heat-dissipating means thereof and assembly of both | |
| US20140334094A1 (en) | Heat-Dissipation Structure and Electronic Apparatus Using the Same | |
| US20110042043A1 (en) | Heat dissipation module | |
| JP2016071269A (en) | Electronic apparatus and system | |
| CN101965117B (en) | Radiator | |
| CN111031767A (en) | Electronic equipment and heat dissipation module | |
| CN101539792B (en) | Heat dissipating device | |
| CN207570160U (en) | The mounting structure of circuit board in a kind of refrigeration compressor | |
| CN102253698A (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110601 |