CN104427830A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN104427830A CN104427830A CN201310400858.2A CN201310400858A CN104427830A CN 104427830 A CN104427830 A CN 104427830A CN 201310400858 A CN201310400858 A CN 201310400858A CN 104427830 A CN104427830 A CN 104427830A
- Authority
- CN
- China
- Prior art keywords
- cover plate
- circuit board
- electronic device
- radiating block
- electronic installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electronic device. The electronic device comprises a shell with an opening, a circuit board and a cover plate, wherein the circuit board is assembled in the shell; the cover plate is used for closing the opening and can conduct heat; the circuit board is provided with an electronic element and a hollow isolating part surrounding the electronic element; a radiating block is arranged on the inner side of the cover plate, extends into the isolating part and is abutted against the electronic element. The radiating block is isolated by the isolating part of the electronic device, so that heat absorbed by the radiating block can be prevented from spreading into the electronic device; the cover plate can also conduct heat, so that the radiating area is increased.
Description
Technical field
The present invention relates to and a kind of electronic installation.
Background technology
Electronic installation often in heat-generating electronic elements surface installation of heat radiator to dispel the heat to it.So, the heat that radiator absorbs still is collected at electronic installation inside, and make electronic installation internal air temperature too high, rate of heat dissipation is not good.
Summary of the invention
In view of more than, be necessary the electronic installation providing a kind of radiating efficiency good.
A kind of electronic installation, comprise a housing offering an opening, the circuit board and be installed in this housing closes this opening and can the cover plate of heat conduction, this circuit board is provided with the isolation part of an electronic component and the hollow around this electronic component, the inner side of this cover plate is provided with a radiating block, and this radiating block stretches into this isolation part and abuts this electronic component.
Compare prior art, radiating block is isolated by the isolation part of this electronic installation, and the heat diffusion that can prevent radiating block from absorbing is inner to electronic installation, and cover plate also can heat conduction, adds area of dissipation.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of electronic installation of the present invention.
Fig. 2 is the three-dimensional assembly diagram of Fig. 1.
Fig. 3 is the cutaway view of Fig. 2 along III-III line.
Main element symbol description
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Please refer to Fig. 1, the better embodiment of electronic installation 10 of the present invention comprise a housing 12, circuit board 14 and the cover plate 16 be installed in this housing 12.
A square isolation part 142 of projection one electronic component 140 and the hollow around this electronic component 140 on this circuit board 14.
An opening 122 is just offered to this electronic component 140 in the side of this housing 12.
This cover plate 16 is made up of Heat Conduction Material, is provided with a radiating block 162 inside it one-body moldedly.
Please refer to Fig. 2 and Fig. 3, during assembling, this cover plate 16 is installed in this housing 12 and closes this opening 122, and this radiating block 162 to stretch in this isolation part 142 and abuts this electronic component 140.One end away from circuit board 14 of this isolation part 142 abuts the inner side of this cover plate 16.
Because this cover plate 16 is made up of Heat Conduction Material, increase the area of dissipation of electronic installation 10.And owing to being provided with isolation part 142 in electronic installation 10, the conduct heat away of this electronic component 140 can be stoped to the other parts in electronic installation 10.
Claims (2)
1. an electronic installation, comprise a housing offering an opening, the circuit board and be installed in this housing closes this opening and can the cover plate of heat conduction, this circuit board is provided with the isolation part of an electronic component and the hollow around this electronic component, the inner side of this cover plate is provided with a radiating block, and this radiating block stretches into this isolation part and abuts this electronic component.
2. electronic installation as claimed in claim 1, is characterized in that: one end away from circuit board of this isolation part abuts the inner side of this cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310400858.2A CN104427830A (en) | 2013-09-06 | 2013-09-06 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310400858.2A CN104427830A (en) | 2013-09-06 | 2013-09-06 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104427830A true CN104427830A (en) | 2015-03-18 |
Family
ID=52975420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310400858.2A Pending CN104427830A (en) | 2013-09-06 | 2013-09-06 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104427830A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828569A (en) * | 2015-07-28 | 2016-08-03 | 维沃移动通信有限公司 | Heat radiation device and electronic equipment |
| CN106231878A (en) * | 2016-08-30 | 2016-12-14 | 南京市溧水县电子研究所有限公司 | Utilize the heat abstractor of shell direct pressing power component |
| CN106793699A (en) * | 2016-12-29 | 2017-05-31 | 苏州佳世达电通有限公司 | A kind of heat radiation module and electric equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090268394A1 (en) * | 2008-04-29 | 2009-10-29 | King Young Technology Co., Ltd. | Heat-radiating microcomputer case |
| CN102083295A (en) * | 2009-11-27 | 2011-06-01 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and heat radiating module thereof |
| CN203151928U (en) * | 2013-02-26 | 2013-08-21 | 深圳市阿科达汽车电子有限公司 | Heat radiation structure of vehicle-mounted audio/video device and vehicle-mounted audio/video device |
-
2013
- 2013-09-06 CN CN201310400858.2A patent/CN104427830A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090268394A1 (en) * | 2008-04-29 | 2009-10-29 | King Young Technology Co., Ltd. | Heat-radiating microcomputer case |
| CN102083295A (en) * | 2009-11-27 | 2011-06-01 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and heat radiating module thereof |
| CN203151928U (en) * | 2013-02-26 | 2013-08-21 | 深圳市阿科达汽车电子有限公司 | Heat radiation structure of vehicle-mounted audio/video device and vehicle-mounted audio/video device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828569A (en) * | 2015-07-28 | 2016-08-03 | 维沃移动通信有限公司 | Heat radiation device and electronic equipment |
| CN106231878A (en) * | 2016-08-30 | 2016-12-14 | 南京市溧水县电子研究所有限公司 | Utilize the heat abstractor of shell direct pressing power component |
| CN106793699A (en) * | 2016-12-29 | 2017-05-31 | 苏州佳世达电通有限公司 | A kind of heat radiation module and electric equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150318 |
|
| RJ01 | Rejection of invention patent application after publication |