CN203369033U - Radiator for integrated circuit in enclosed space - Google Patents
Radiator for integrated circuit in enclosed space Download PDFInfo
- Publication number
- CN203369033U CN203369033U CN 201320437278 CN201320437278U CN203369033U CN 203369033 U CN203369033 U CN 203369033U CN 201320437278 CN201320437278 CN 201320437278 CN 201320437278 U CN201320437278 U CN 201320437278U CN 203369033 U CN203369033 U CN 203369033U
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- China
- Prior art keywords
- integrated circuit
- radiator
- radiation shell
- cover plate
- confined space
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to a radiator for an integrated circuit in enclosed space. The radiator comprises a cover plate, a box cooperating with the cover plate to form enclosed space, a circuit board disposed in the box, and an integrated circuit installed on the circuit board. A heat radiation shell is provided on the outer surface of the integrated circuit. The cover plate comprises a cover part and a radiator part which are integrated. The cover part cooperates with the box to form the enclosed space. The radiator part is arranged above the heat radiation shell of the integrated circuit at a position corresponding to the integrated circuit. The radiator integrates the cover part and the radiator part to form the cover plate, which effectively solves the problem that in enclosed space, an independent radiator in the prior art is decreased in cooling performance or even loses cooling ability due to thermal saturation of air.
Description
[technical field]
The utility model relates to a kind of radiator of circuit, particularly the radiator of integrated circuit in a kind of confined space.
[background technology]
Electronic equipment is comprised of parts such as cover plate, cabinet (or cavity), circuit boards usually, and some high-power integrated circuits on circuit board need to install radiator additional and could work.Existing integrated circuit radiator is an independently heat abstractor, by bonding agent, is bonded on the radiation shell of integrated circuit, and heat abstractor has radiating block+fan form or independent radiating block form.Radiating block has solid metal derby, also other forms such as Surface Groove shape metal derby is arranged.
Existing radiator scheme is effectively dispelled the heat to integrated circuit by the energy of flow of air in non-confined space (as the cabinet with ventilation hole), but in confined space (there is no cabinet, cavity of ventilation hole etc.) due to atmosphere draught-free, air in confined space reach heat saturated after, radiator just can not effectively dispel the heat to integrated circuit.
[utility model content]
In order to overcome the poor technical problem of radiating effect of the confined space inner radiator existed in prior art, the purpose of this utility model is to provide the radiator of integrated circuit in a kind of confined space.
The technical solution adopted in the utility model is: the radiator of integrated circuit in a kind of confined space, comprise cover plate, coordinate the casing that forms a seal cavity with cover plate, be placed in the circuit board in this casing, and be installed on the integrated circuit on this circuit board, described integrated circuit outer surface has a radiation shell, described cover plate comprises integrated cap portion and radiator part, described cap portion coordinates formation one seal cavity with casing, described radiator partly is arranged on the radiation shell top of this integrated circuit, and position is corresponding with integrated circuit.
Further, described radiator be partly one by the lid lower surface projection to downward-extension, this protruding quantity is identical with the quantity of integrated circuit.
Further, between the radiation shell upper surface of the lower surface of described radiator part and integrated circuit, also be provided with heat conductive pad, the thickness of described heat conductive pad is slightly larger than the distance between the radiation shell upper surface on this radiator part lower surface and integrated circuit.
Further, described heat conductive pad is the elastic heat conducting pad, and its shape matches with the radiation shell shape of integrated circuit.
Further, the length of described radiator part and Width size are slightly larger than described integrated circuit radiation shell length and Width size.
Radiator with respect to integrated circuit in confined space of the prior art, the beneficial effects of the utility model are: cap portion and radiator sectoral integration are formed to cover plate, and contacting by heat conductive pad and cooling integrated shell, after taking the heat of integrated circuit to the electronic equipment outer surface, be dispersed in free air, to guarantee the continuous and effective to the radiating effect of integrated circuit, solved existing separated radiator causes heat dispersion decline even to lose the problem of heat-sinking capability in confined space because air is hot saturated, simultaneously because lid surface is exactly the area of dissipation of radiating block, the area of dissipation of the existing separated radiator of this Area Ratio is much larger, therefore by further thus increasing heat radiation effect.
[accompanying drawing explanation]
Fig. 1 is the structural representation of the radiator of the interior integrated circuit of confined space in prior art;
Fig. 2 is the structural representation of the radiator of integrated circuit in the described confined space of the utility model embodiment;
Fig. 3 is the A-A cutaway view of Fig. 2 of the radiator of integrated circuit in the described confined space of the utility model embodiment;
Fig. 4 is the partial enlarged drawing of Fig. 2 of the radiator of integrated circuit in the described confined space of the utility model embodiment.
Description of reference numerals: 1, cover plate, 2, casing, 3, radiation shell, 4, integrated circuit, 5, circuit board, 6, heat conductive pad, 101, cap portion, 102, the radiator part.
[embodiment]
Below in conjunction with drawings and embodiments, the utility model is described in further detail.
Consult shown in Fig. 2, Fig. 3: the present embodiment provides the radiator of integrated circuit in a kind of confined space, comprise cover plate, coordinate the casing that forms a seal cavity with cover plate, be placed in the circuit board in this casing, and be installed on the integrated circuit on this circuit board, the integrated circuit outer surface has a radiation shell, cover plate 1 comprises integrated cap portion 101 and radiator part 102, cap portion 101 coordinates formation one seal cavity with casing 2, radiator part 102 is arranged on radiation shell 3 tops of this integrated circuit 4, and position is corresponding with integrated circuit 4.Because cover plate 1 has adopted integrated design, lid surface is exactly the area of dissipation of radiator part 102, and the area of dissipation of the existing separated radiator of this Area Ratio is much larger, therefore by further thus increasing heat radiation effect.
Preferably, this radiator part 102 be one by cap portion 101 lower surfaces the projection to downward-extension, this protruding quantity is identical with the quantity of integrated circuit 4, forms corresponding one by one.In the present embodiment, the shape of cross section of projection is rectangle, can be also other any suitable shapes.Simultaneously, the length of radiator part 102 and Width size are slightly larger than radiation shell 3 length and the Width size of integrated circuit 4, in order to make radiator part 102 can cover the radiation shell 3 of integrated circuit 4 fully like this, the heat that integrated circuit 4 is formed is delivered on radiator part 102 to greatest extent, improves radiating efficiency.
Consult shown in Fig. 4: also be provided with heat conductive pad 6 between radiation shell 3 upper surfaces of the lower surface of radiator part 102 and integrated circuit 4, the upper and lower surface of this heat conductive pad 6 fits with the lower surface of radiation shell 3 upper surfaces and radiator part 102 respectively.The thickness of this heat conductive pad 6 is slightly larger than the distance between radiation shell 3 upper surfaces on these radiator part 102 lower surfaces and integrated circuit 4, and heat conductive pad 6 is the elastic heat conducting pad, and its shape matches with the radiation shell 3 upper surface shapes of integrated circuit 4.In the present embodiment, preferred, the large 0.5mm in gap that Thickness Ratio radiator part 102 lower surfaces of heat conductive pad 6 and 3 upper surfaces of the radiation shell on integrated circuit 4 form.After cover plate covers tightly, elastic heat conducting pad 6 can produce certain distortion, this distortion had both solved the machining accuracy problem, has absorbed radiation shell 3 and radiator part 102 close contacts that the processing dimension error makes again integrated circuit 4, the solution heat conduction problem.
Foregoing detailed description is only exemplary description, and those skilled in the art in the situation that do not break away from the scope and spirit that the utility model is protected, can design various execution modes according to different actual needs.
Claims (5)
1. the radiator of integrated circuit in a confined space, comprise cover plate, coordinate the casing that forms a seal cavity with cover plate, be placed in the circuit board in this casing, and be installed on the integrated circuit on this circuit board, described integrated circuit outer surface has a radiation shell, it is characterized in that: described cover plate (1) comprises integrated cap portion (101) and radiator part (102), described cap portion (101) coordinates formation one seal cavity with casing (2), described radiator part (102) is arranged on radiation shell (3) top of this integrated circuit (4), and position is corresponding with integrated circuit (4).
2. the radiator of integrated circuit in confined space according to claim 1, it is characterized in that: described radiator part (102) be one by cap portion (101) lower surface the projection to downward-extension, this protruding quantity is identical with the quantity of integrated circuit (4).
3. the radiator of integrated circuit in confined space according to claim 2, it is characterized in that: also be provided with heat conductive pad (6) between radiation shell (3) upper surface of the lower surface of described radiator part (102) and integrated circuit (4), the thickness of described heat conductive pad (6) is slightly larger than the distance between radiation shell (3) upper surface on this radiator part (102) lower surface and integrated circuit (4).
4. the radiator of integrated circuit in confined space according to claim 3, it is characterized in that: described heat conductive pad (6) is the elastic heat conducting pad, and its shape matches with radiation shell (3) the upper surface shape of integrated circuit (4).
5. according to the radiator of integrated circuit in the described confined space of any one in claim 2-4, it is characterized in that: the length of described radiator part (102) and radiation shell (3) length and the Width size that the Width size is slightly larger than described integrated circuit (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320437278 CN203369033U (en) | 2013-07-22 | 2013-07-22 | Radiator for integrated circuit in enclosed space |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320437278 CN203369033U (en) | 2013-07-22 | 2013-07-22 | Radiator for integrated circuit in enclosed space |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203369033U true CN203369033U (en) | 2013-12-25 |
Family
ID=49816739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320437278 Expired - Lifetime CN203369033U (en) | 2013-07-22 | 2013-07-22 | Radiator for integrated circuit in enclosed space |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203369033U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270921A (en) * | 2014-09-26 | 2015-01-07 | 中国南方电网有限责任公司电网技术研究中心 | Miniaturization high-protection-level microprocessor protecting device |
| CN104703446A (en) * | 2015-03-27 | 2015-06-10 | 中怡(苏州)科技有限公司 | Electronic device and manufacturing method thereof |
| CN108064124A (en) * | 2016-11-07 | 2018-05-22 | 罗克韦尔自动化技术公司 | With the controller for increasing hot property |
-
2013
- 2013-07-22 CN CN 201320437278 patent/CN203369033U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270921A (en) * | 2014-09-26 | 2015-01-07 | 中国南方电网有限责任公司电网技术研究中心 | Miniaturization high-protection-level microprocessor protecting device |
| CN104703446A (en) * | 2015-03-27 | 2015-06-10 | 中怡(苏州)科技有限公司 | Electronic device and manufacturing method thereof |
| CN108064124A (en) * | 2016-11-07 | 2018-05-22 | 罗克韦尔自动化技术公司 | With the controller for increasing hot property |
| US10912233B2 (en) | 2016-11-07 | 2021-02-02 | Rockwell Automation Technologies, Inc. | Controller with heat sink clamping plate for enhanced thermal properties |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131225 |
|
| CX01 | Expiry of patent term |