CN104460909B - A kind of gap automatic adjusument cold plate heat dissipating method - Google Patents
A kind of gap automatic adjusument cold plate heat dissipating method Download PDFInfo
- Publication number
- CN104460909B CN104460909B CN201410786107.3A CN201410786107A CN104460909B CN 104460909 B CN104460909 B CN 104460909B CN 201410786107 A CN201410786107 A CN 201410786107A CN 104460909 B CN104460909 B CN 104460909B
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- CN
- China
- Prior art keywords
- heat sink
- cold plate
- casing
- cabinet
- circuit board
- Prior art date
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
Abstract
The invention discloses a kind of gap automatic adjusument cold plate heat dissipating methods, and the casing of computer is isolated a part and is used for the heat sink externally to radiate, and increases elastic element between casing and heat sink；Circuit board is installed on cold plate, and heater element thereon is bonded with cold plate, is conducted heat on cold plate；When circuit board and cold plate are not inserted into cabinet, elastic element is in free state, and when circuit board and cold plate insertion cabinet, cold plate is contacted with heat sink, and top pressure heat sink, elastic element are compressed upwards, generates elastic force, the automatic gap eliminated between heat sink and cold plate.Technology using the present invention, the gap between heat sink and cold plate is automatic adjusument, without human intervention.
Description
Technical field
The present invention relates to computer field of radiating, and in particular to a kind of gap automatic adjusument cold plate heat dissipating method.
Background technology
Military computer mostly application is in harsh environment, it is necessary to requirement under meeting high temperature, especially full reinforced
CPCI framework computers, heat density is big, and heat dissipation is even more a technical barrier.Traditional mode using cold plate heat loss through conduction, by
Be limited to the machining accuracy of cold plate, casing, flatness, roughness can not ensure, in addition for ease of board plug use, cold plate with
Certain gap is reserved between casing, causes thermal contact resistance larger, the reliability that these factors result in heat dissipation is relatively low.
The content of the invention
The technical problem to be solved by the present invention is to：A kind of gap automatic adjusument cold plate heat dissipating method is provided.
The technical solution adopted in the present invention is：
The casing of computer is isolated a part for externally radiating by a kind of gap automatic adjusument cold plate heat dissipating method
Heat sink, and increase elastic element between casing and heat sink；Circuit board is installed on cold plate, heater element thereon with
Cold plate is bonded, and is conducted heat on cold plate；When circuit board and cold plate are not inserted into cabinet, elastic element is in free state, when
When circuit board and cold plate insertion cabinet, cold plate is contacted with heat sink, and top pressure heat sink, elastic element are compressed upwards, is generated
Elastic force, the automatic gap eliminated between heat sink and cold plate.
Position in cabinet close to heat sink is provided with guide-rail plate, and the space between guide-rail plate and casing is used for installing circuit
Plate, the circuit board and cold plate are inserted into cabinet by guide-rail plate.
During elastic element free state, heat sink is located at the one side of deviation guide-rail plate, when circuit board is inserted into cabinet, can incite somebody to action
Heat sink pushes inclined casing one side to, this makes elastic element be in compressive state, eliminates the gap between cold plate and heat sink, realizes
It fits closely.
The casing outer surface is there are one opening, and the shape of heat sink is suitable with opening shape, the outer surface of casing opening
Edge stretches out, and heat sink is just caught in opening from the inside, and the edge being extended blocks, and elastic element is arranged at the edge of stretching
Between heat sink edge.
A kind of gap automatic adjusument cold plate radiator, the structure of the radiator include casing, casing outer surface
There are one opening, the shape of heat sink is suitable with opening shape, the outer surface edge stretching of casing opening, and heat sink is from the inside just
Opening is caught in well, and the edge being extended blocks, elastic element is arranged between the edge of stretching and heat sink edge；In cabinet
The position of casing and heat sink is provided with guide-rail plate, the space between guide-rail plate and casing is used for mounting circuit boards, installation
The cold plate of circuit board by guide-rail plate is inserted into cabinet；When circuit board and cold plate are not inserted into cabinet, elastic element is in free shape
State, when circuit board and cold plate insertion cabinet, cold plate is contacted with heat sink, and top pressure heat sink, elastic element are compressed upwards.
Installation has elastic component between casing and heat sink（Such as spring）, circuit is adjusted by the deformation of elastic element
Gap between plate and guide-rail plate.
Beneficial effects of the present invention are：Technology using the present invention, the gap between heat sink and cold plate are adjusted to be adaptive
Section, without human intervention.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Reference sign：1st, circuit board, 2, cold plate, 3, heat sink, 4, elastic element, 5, casing, 6, guide-rail plate.
Specific embodiment
Shown with reference to the accompanying drawings, by specific embodiment, the present invention is further described：
Embodiment 1：
The casing 5 of computer is isolated a part for externally dissipating by a kind of gap automatic adjusument cold plate heat dissipating method
The heat sink 3 of heat, and increase elastic element 4 between casing 5 and heat sink 3；Circuit board 1 is installed on cold plate 2, hair thereon
Thermal element is bonded with cold plate, is conducted heat on cold plate；When circuit board 1 and cold plate 2 are not inserted into cabinet, elastic element is in certainly
By state, when circuit board and cold plate insertion cabinet, cold plate is contacted with heat sink, and top pressure heat sink upwards, 4 quilt of elastic element
Compression generates elastic force, the automatic gap eliminated between heat sink and cold plate.
Embodiment 2：
On the basis of embodiment 1, the position in the present embodiment cabinet close to heat sink is provided with guide-rail plate 6, guide-rail plate 6
Space between casing 5 is used for mounting circuit boards 1, the circuit board 1 and cold plate 2 and is inserted into cabinet by guide-rail plate 6.
During elastic element free state, heat sink is located at the one side of deviation guide-rail plate, when circuit board is inserted into cabinet, can incite somebody to action
Heat sink pushes inclined casing one side to, this makes elastic element be in compressive state, eliminates the gap between cold plate and heat sink, realizes
It fits closely.
Embodiment 3：
On the basis of embodiment 1 or 2, there are one opening, the shapes of heat sink 3 for 5 outer surface of casing described in the present embodiment
Suitable with opening shape, the outer surface edge of casing opening is stretched out, and heat sink is just caught in opening from the inside, and the side being extended
Edge blocks, and elastic element 4 is arranged between the edge of stretching and heat sink edge.
Embodiment 4：
On the basis of embodiment 1,2,3, a kind of gap automatic adjusument cold plate radiator of the present embodiment, the heat dissipation
The structure of device includes casing, and casing outer surface is there are one opening, and the shape of heat sink is suitable with opening shape, casing opening
Outer surface edge is stretched out, and heat sink is just caught in opening from the inside, and the edge being extended blocks, and elastic element is arranged at stretching
Edge and heat sink edge between；The position of casing and heat sink is provided with guide-rail plate, guide-rail plate and casing in cabinet
Between space be used for mounting circuit boards, be mounted with that the cold plate of circuit board is inserted into cabinet by guide-rail plate；Circuit board and cold plate are not
When being inserted into cabinet, elastic element is in free state, and when circuit board and cold plate insertion cabinet, cold plate is contacted with heat sink, and
Upward top pressure heat sink, elastic element are compressed.
Installation has elastic component between casing and heat sink（Such as spring）, circuit is adjusted by the deformation of elastic element
Gap between plate and guide-rail plate.
Embodiment of above is merely to illustrate the present invention, and not limitation of the present invention, in relation to the common of technical field
Technical staff without departing from the spirit and scope of the present invention, can also make a variety of changes and modification, therefore all
Equivalent technical solution falls within scope of the invention, and scope of patent protection of the invention should be defined by the claims.
Claims (4)
1. a kind of gap automatic adjusument cold plate heat dissipating method, it is characterised in that：The casing of computer is isolated into a part of use
In the heat sink externally to radiate, and increase elastic element between casing and heat sink；Circuit board is installed on cold plate, thereon
Heater element is bonded with cold plate, is conducted heat on cold plate；When circuit board and cold plate are not inserted into cabinet, elastic element is in certainly
By state, when circuit board and cold plate insertion cabinet, cold plate is contacted with heat sink, and top pressure heat sink upwards, elastic element quilt
Compression generates elastic force, the automatic gap eliminated between heat sink and cold plate.
2. a kind of gap automatic adjusument cold plate heat dissipating method according to claim 1, it is characterised in that：It is close in cabinet
The position of heat sink is provided with guide-rail plate, and the space between guide-rail plate and casing is used for mounting circuit boards, the circuit board and cold
Plate is inserted into cabinet by guide-rail plate；During elastic element free state, heat sink is located at the one side of deviation guide-rail plate, when circuit board is inserted
When entering cabinet to, heat sink can be pushed to inclined casing one side, this makes elastic element be in compressive state, eliminate cold plate and heat sink it
Between gap, realization fits closely.
3. a kind of gap automatic adjusument cold plate heat dissipating method according to claim 1 or 2, it is characterised in that：The machine
Shell outer surface is there are one opening, and the shape of heat sink is suitable with opening shape, and the outer surface edge of casing opening is stretched out, heat sink
Just be caught in opening from the inside, and the edge being extended blocks, elastic element be arranged at stretching edge and heat sink edge it
Between.
4. a kind of gap automatic adjusument cold plate radiator, it is characterised in that：The structure of the radiator includes casing, machine
Shell outer surface is there are one opening, and the shape of heat sink is suitable with opening shape, and the outer surface edge of casing opening is stretched out, heat sink
Just be caught in opening from the inside, and the edge being extended blocks, elastic element be arranged at stretching edge and heat sink edge it
Between；The position of casing and heat sink is provided with guide-rail plate in cabinet, the space between guide-rail plate and casing is used for installing electricity
Road plate is mounted with that the cold plate of circuit board is inserted into cabinet by guide-rail plate；When circuit board and cold plate are not inserted into cabinet, at elastic element
In free state, when circuit board and cold plate insertion cabinet, cold plate is contacted with heat sink, and top pressure heat sink upwards, elasticity member
Part is compressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410786107.3A CN104460909B (en) | 2014-12-18 | 2014-12-18 | A kind of gap automatic adjusument cold plate heat dissipating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410786107.3A CN104460909B (en) | 2014-12-18 | 2014-12-18 | A kind of gap automatic adjusument cold plate heat dissipating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104460909A CN104460909A (en) | 2015-03-25 |
| CN104460909B true CN104460909B (en) | 2018-05-18 |
Family
ID=52907117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410786107.3A Active CN104460909B (en) | 2014-12-18 | 2014-12-18 | A kind of gap automatic adjusument cold plate heat dissipating method |
Country Status (1)
| Country | Link |
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| CN (1) | CN104460909B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106020400B (en) * | 2016-07-01 | 2018-12-14 | 山东超越数控电子有限公司 | A kind of CPCI module heat dissipating method |
| CN109032310A (en) * | 2018-08-28 | 2018-12-18 | 山东超越数控电子股份有限公司 | A kind of pluggable board heat dissipating method using heat conducting film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2870410Y (en) * | 2006-01-05 | 2007-02-14 | 英业达股份有限公司 | Radiating structure |
| CN101452327A (en) * | 2007-12-06 | 2009-06-10 | 英业达股份有限公司 | Fixing device |
| CN201435040Y (en) * | 2009-03-31 | 2010-03-31 | 上海研祥智能科技有限公司 | Radiator of industrial computer |
| CN103814451A (en) * | 2011-10-05 | 2014-05-21 | 株式会社Kelk | Thermoelectric generator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9042097B2 (en) * | 2012-05-17 | 2015-05-26 | Hamilton Sundstrand Corporation | Two-phase electronic component cooling arrangement |
-
2014
- 2014-12-18 CN CN201410786107.3A patent/CN104460909B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2870410Y (en) * | 2006-01-05 | 2007-02-14 | 英业达股份有限公司 | Radiating structure |
| CN101452327A (en) * | 2007-12-06 | 2009-06-10 | 英业达股份有限公司 | Fixing device |
| CN201435040Y (en) * | 2009-03-31 | 2010-03-31 | 上海研祥智能科技有限公司 | Radiator of industrial computer |
| CN103814451A (en) * | 2011-10-05 | 2014-05-21 | 株式会社Kelk | Thermoelectric generator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104460909A (en) | 2015-03-25 |
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| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Patentee after: SHANDONG CHAOYUE DATA CONTROL ELECTRONICS Co.,Ltd. Address before: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Patentee before: SHANDONG CHAOYUE NUMERICAL CONTROL ELECTRONIC Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190425 Address after: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Co-patentee after: BEIJING MECHANICAL AND ELECTRICAL ENGINEERING GENERAL DESIGN DEPARTMENT Patentee after: SHANDONG CHAOYUE DATA CONTROL ELECTRONICS Co.,Ltd. Address before: 250100 No. 2877 Kehang Road, Sun Village Town, Jinan High-tech District, Shandong Province Patentee before: SHANDONG CHAOYUE DATA CONTROL ELECTRONICS Co.,Ltd. |
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| TR01 | Transfer of patent right |