CN103249282A - Heat pipe water cooling combined heat dissipation device - Google Patents
Heat pipe water cooling combined heat dissipation device Download PDFInfo
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- CN103249282A CN103249282A CN 201310125746 CN201310125746A CN103249282A CN 103249282 A CN103249282 A CN 103249282A CN 201310125746 CN201310125746 CN 201310125746 CN 201310125746 A CN201310125746 A CN 201310125746A CN 103249282 A CN103249282 A CN 103249282A
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Abstract
The invention relates to electronic equipments, in particular to a heat dissipation device for heat generated by a server, a network device, a PC, a laptop and the like. The invention provides the heat pipe water cooling combined heat dissipation device which comprises a heat pipe component, a water proofing component and a water cooling component, wherein the heat pipe component is mounted on each main heating component in the case, the water-stop component is mounted on the heat pipe to segregate the evaporation end and the condensation end of the heat pipe, the water proof component is mounted on the housing of the case or on the water-stop plate inside the case, and the water cooling component is mounted outside the case or in a space segregated with the electronic device inside the case. The scheme provided by the invention has the advantages that the water cooling part is in segregation with the electronic device, so that the risk that the electronic device is damaged because of the leakage of the chilled water is decreased; and as the heat exchange surface of the chilled water and the heat source is increased by the heat flow density adjustable feature of the heat pipe, the heat dissipation efficiency is increased.
Description
Technical field
The present invention relates to electronic equipment, the row who particularly relates to the heat of computer equipments generations such as server, the network equipment, PC, notebook computer looses.
Background technology
The most frequently used water cooling method of present computer housing is that each the main heat generating components in cabinet is installed the water-cooled head, water pipe couples together water-cooled head and cooling water tank etc., its shortcoming is that the water-cooled head is directly installed on the electronic equipment, cooling water can flow directly on the electronic equipment after leaking, and electronic equipment is higher because of the risk that the cooling water leakage damages; Cooling water is confined to the area that the water-cooled head contacts with electronic equipment with the heat exchange area of pyrotoxin in addition, and radiating efficiency is not high.
Summary of the invention
Leak the higher and not high problem of radiating efficiency of the risk of damaging for solving electronic equipment of the prior art because of cooling water, the present invention proposes a kind of heat pipe water-cooled combination heat dissipation equipment, this equipment comprises heat pipe parts, water proof parts and water-cooled parts, the heat pipe parts are installed on each interior main heat generating components of cabinet, the water proof parts are installed on the heat pipe, evaporation ends and the condensation end of heat pipe are isolated, the water proof parts are installed on the water-stop sheet in casing or the cabinet, make the water-cooled parts be installed in the outer or cabinet of cabinet with the isolated space of electronic equipment in.The advantage of this scheme is to make the water-cooled part isolated with electronic equipment, reduce electronic equipment and leaked the risk of damaging because of cooling water, can utilize simultaneously the density of heat flow rate tunable characteristic of heat pipe to increase the heat exchange area of cooling water and pyrotoxin, thereby improve radiating efficiency.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of heat pipe water-cooled combination heat dissipation equipment, comprise the heat pipe parts, water proof parts and water-cooled parts, the heat pipe parts are installed on each interior main heat generating components of cabinet, the water proof parts are installed on the heat pipe, evaporation ends and the condensation end of heat pipe are isolated, the water proof parts are installed on the water-stop sheet in casing or the cabinet, the water-cooled parts are installed in the space that cabinet is outer or cabinet is interior and electronic equipment is isolated, leak the risk of damaging because of cooling water to reduce electronic equipment, can utilize simultaneously the density of heat flow rate tunable characteristic of heat pipe to increase the heat exchange area of cooling water and pyrotoxin, thereby improve radiating efficiency.
The heat pipe parts mainly are made up of heat pipe, and the main heat generating components in the evaporation ends of heat pipe and the cabinet is connected, and main heat generating components is parts such as CPU, mainboard north and south bridge chip, video card, internal memory, hard disk, power supply, and the condensation end of heat pipe partly is connected with water-cooled.
The water proof parts are installed on the heat pipe, and evaporation ends and the condensation end of heat pipe are isolated.The water proof parts can be installed on the water-stop sheet in casing or the cabinet.
The a kind of of water-cooled parts is water tank, includes inlet opening, apopore, tank, and the condensation end of heat pipe is inserted in the tank of water tank, and the heat of heat pipe can be switched directly in the cooling water.
The another kind of water-cooled parts is water-cooled heads, includes inlet opening, apopore, heat-conducting plate, and the condensation end of heat pipe is connected with heat-conducting plate.
The invention has the beneficial effects as follows: make the water-cooled part isolated with electronic equipment, reduce electronic equipment and leaked the risk of damaging because of cooling water, can utilize simultaneously the density of heat flow rate tunable characteristic of heat pipe to increase the heat exchange area of cooling water and pyrotoxin, thereby improve radiating efficiency.
Description of drawings
Fig. 1 is the structural representation according to heat pipe of the present invention and water tank combined heat radiator.
Fig. 2 is the structural representation according to heat pipe of the present invention and a water-cooled combined heat radiator.
Fig. 3 is the scheme of installation according to heat pipe water-cooled combined heat radiator of the present invention.
Among the figure, 1. heat pipe, 2. water tank, 3. water-stop sheet, 4. evaporation ends, 5. condensation end, 6. inlet opening, 7. apopore, 8. tank, 9. water-cooled head, 10. heat-conducting plate, 11. cabinet water-stop sheets.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
In Fig. 1, embodiments of the invention are a kind of heat pipe and water tank combined heat radiator.
As shown in Figure 1:
A kind of heat pipe and water tank combined heat radiator comprise (1) heat pipe, (2) water tank and (3) water-stop sheet.(2) water tank comprises (6) inlet opening, (7) apopore, (8) tank, and (5) condensation end of (1) heat pipe is inserted in (8) tank of (2) water tank.
In Fig. 2, embodiments of the invention are a kind of heat pipe and a water-cooled combined heat radiator.
As shown in Figure 2:
An a kind of heat pipe and water-cooled combined heat radiator comprises (1) heat pipe, (9) water-cooled head and (3) water-stop sheet.(9) the water-cooled head comprises (6) inlet opening, (7) apopore, (10) heat-conducting plate, and (5) condensation end of (1) heat pipe is connected with (10) heat-conducting plate.
In Fig. 3, embodiments of the invention are a kind of heat pipe water-cooled combined heat radiators, are installed on the PC.
As shown in Figure 3:
A kind of heat pipe water-cooled combined heat radiator is installed on the PC, comprises (1) heat pipe, (2) water tank and (3) water-stop sheet.(3) water-stop sheet is installed on (11) cabinet water-stop sheet.
Claims (4)
1. a heat pipe water-cooled combination heat dissipation equipment is characterized in that: comprise heat pipe parts, water proof parts and water-cooled parts; Described heat pipe parts mainly are made up of heat pipe, and the main heat generating components in the evaporation ends of described heat pipe and the cabinet is connected, and the condensation end of described heat pipe is connected with described water-cooled parts.
2. heat pipe water-cooled according to claim 1 makes up heat dissipation equipment, and it is characterized in that: described water proof parts are installed on the described heat pipe, and evaporation ends and the condensation end of described heat pipe are isolated; Described water proof parts can be installed on the water-stop sheet in casing or the cabinet.
3. heat pipe water-cooled according to claim 1 makes up heat dissipation equipment, and it is characterized in that: a kind of of described water-cooled parts is water tank, includes inlet opening, apopore, tank, and the condensation end of described heat pipe is inserted in the described tank.
4. heat pipe water-cooled according to claim 1 makes up heat dissipation equipment, and it is characterized in that: a kind of of described water-cooled parts is the water-cooled head, includes inlet opening, apopore, heat-conducting plate, and the condensation end of described heat pipe is connected with described heat-conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310125746 CN103249282A (en) | 2013-04-12 | 2013-04-12 | Heat pipe water cooling combined heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310125746 CN103249282A (en) | 2013-04-12 | 2013-04-12 | Heat pipe water cooling combined heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103249282A true CN103249282A (en) | 2013-08-14 |
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ID=48928407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310125746 Pending CN103249282A (en) | 2013-04-12 | 2013-04-12 | Heat pipe water cooling combined heat dissipation device |
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| CN (1) | CN103249282A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104850200A (en) * | 2015-05-29 | 2015-08-19 | 黑龙江大学 | Water-cooled computer and application method thereof |
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
| CN108882636A (en) * | 2018-06-29 | 2018-11-23 | 联想长风科技(北京)有限公司 | A kind of electronic equipment |
-
2013
- 2013-04-12 CN CN 201310125746 patent/CN103249282A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104850200A (en) * | 2015-05-29 | 2015-08-19 | 黑龙江大学 | Water-cooled computer and application method thereof |
| CN108235653A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of liquid-cooling type flat aluminum heat-pipe radiator and its manufacturing method |
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN107979962B (en) * | 2018-01-09 | 2024-02-20 | 无锡巨日电子科技有限公司 | Water-cooled circuit board heat abstractor |
| CN108882636A (en) * | 2018-06-29 | 2018-11-23 | 联想长风科技(北京)有限公司 | A kind of electronic equipment |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130814 |