CN106922105B

CN106922105B - Cooling fin and electronic equipment

Info

Publication number: CN106922105B
Application number: CN201510999909.7A
Authority: CN
Inventors: 张斌; 韩高才; 孙信华
Original assignee: Xiaomi Inc
Current assignee: Xiaomi Inc
Priority date: 2015-12-25
Filing date: 2015-12-25
Publication date: 2019-02-19
Anticipated expiration: 2035-12-25
Also published as: CN106922105A

Abstract

The disclosure is directed to a kind of cooling fin and electronic equipments, the cooling fin may include: heat radiator body, the heat radiator body is set in the recess at the front end face intermediate region of electronic equipment front shell assemblies, for mainboard and being embedded in and installing to the touch-control display module in the recess and radiate；At least one heat bulge that the heat radiator body extends outward to form, the heat bulge cover the top area of the front end face of the front shell assemblies or at least part of bottom section, to radiate for the functional unit to corresponding position.By the technical solution of the disclosure, the heat dissipation effect of electronic equipment can be enhanced, keep the operation of electronic equipment more smooth.

Description

Cooling fin and electronic equipment

Technical field

This disclosure relates to heat dissipation of terminal technical field more particularly to a kind of cooling fin and electronic equipment.

Background technique

As the function of various aspects in electronic equipment is stronger and stronger, the calorific value accordingly generated is also increasing, even It may influence the normal process flow operation of electronic equipment.

Therefore, it is necessary to continuously improve the radiator structure of electronic equipment, to be adapted to the calorific value constantly increased.

Summary of the invention

The disclosure provides a kind of cooling fin and electronic equipment, to solve deficiency in the related technology.

According to the first aspect of the embodiments of the present disclosure, a kind of cooling fin is provided, comprising:

Heat radiator body, the heat radiator body are set to the recess at the front end face intermediate region of electronic equipment front shell assemblies It is interior, for mainboard and being embedded in and installing to the touch-control display module in the recess and radiate；

At least one heat bulge that the heat radiator body extends outward to form, the heat bulge cover the front housing group The top area of the front end face of part or at least part of bottom section are scattered to carry out for the functional unit to corresponding position Heat.

Optionally, the heat bulge can be by corresponding to the functional group in the top area or the bottom section Hollowed out area at part contacts the functional unit, to radiate to the functional unit.

Optionally, the heat bulge forms the first bending part at the side wall bottom edge of the recess, keeps the heat dissipation convex It rises to be bent to and upwardly extend；And the heat bulge forms the second bending part in the side wall top edge of the recess, makes described Heat bulge, which is bent to, covers the functional unit.

Optionally, when the hollowed out area be cover board by removing the top area or bottom section corresponding position and The side wall of corresponding position in the recess and when being formed, the heat bulge is in first bending part and second bending part Between part and the touch-control display module between form the first spacing, the corresponding side wall of heat bulge and the touch The second spacing is formed between display module, and first spacing is not less than second spacing.

Optionally, the cooling fin is made of graphite flake.

According to the second aspect of an embodiment of the present disclosure, a kind of electronic equipment is provided, comprising:

Positioned at the front end face top area of the front shell assemblies of the electronic equipment or the functional unit of bottom section；

Cooling fin as described in any in above-described embodiment, for radiating to the functional unit.

Optionally, the functional unit includes the camera module at the top area.

Optionally, the cooling fin is adhered to the corresponding position in the front shell assemblies.

The technical scheme provided by this disclosed embodiment can include the following benefits:

As can be seen from the above embodiments, the disclosure, can by using the heat radiating fin structure comprising heat radiator body and heat bulge To make full use of the position of the functional unit in electronic equipment that feature is arranged, on the basis of simple structure change, and meanwhile it is right Mainboard, touch-control display module and functional unit carry out heat conduction and homogenization, so that enhancing dissipates independent functional unit Thermal effect.

It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not The disclosure can be limited.

Detailed description of the invention

The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure Example, and together with specification for explaining the principles of this disclosure.

Fig. 1 is the structural decomposition diagram of a kind of electronic equipment shown according to an exemplary embodiment.

Fig. 2 is the structural decomposition diagram of another electronic equipment shown according to an exemplary embodiment.

Specific embodiment

Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.

Fig. 1 is the structural decomposition diagram of a kind of electronic equipment shown according to an exemplary embodiment, as shown in Figure 1, The front end face of the front shell assemblies 1 of the electronic equipment is equipped with a recess 11, which is used to be embedded in and install the touching of electronic equipment Touch display module 2.Meanwhile being used to be arranged the mainboard (not shown) of electronic equipment at the back side of front shell assemblies 1.

So, in order to solve the problems, such as that touch-control display module 2 and mainboard calorific value are big, as shown in Figure 1, can be in recess 11 Heat radiator body 3 is arranged in surface, and the specification of the heat radiator body 3 is matched with recess 11.So, when heat radiator body 3 is mounted to electronics After equipment, heat radiator body 3 is actually arranged between 11 surfaces of recess and touch-control display module 2, thus on the one hand can be straight It contacts the bottom surface of touch-control display module 2 and radiates to it, on the other hand can pass through " 1 bottom surface of mainboard → front shell assemblies The heat transmission line on 11 surfaces of → recess ", radiates to mainboard.

And in embodiment of the disclosure, it is based on foregoing description, heat radiator body 3 further extends outward at least one to be formed and dissipates Hot protrusion 31, for realizing further heat sinking function.As shown in Figure 1, occupied according to the region of 11 pairs of front shell assemblies 1 of recess, The front end face of front shell assemblies 1 can be divided are as follows: top area d1,11 corresponding intermediate regions of recess above recess 11 The d2 and bottom section d3 below recess 11.So, for heat bulge 31 shown in FIG. 1, top area can be covered Subrange 12 at d1, and radiate to the functional unit being arranged at the subrange 12.

In the above-described embodiments, it due to the heat radiating fin structure that heat radiator body 3 and heat bulge 31 are integrated, thus can incite somebody to action The heat progress of functional unit at touch-control display module 2, mainboard and subrange 12 is uniform, shares, and due to filling Divide the relative positional relationship being utilized between the functional unit and mainboard, touch-control display module 2, so that the cooling fin knot of the one For structure while ensuring effective heat dissipation to the functional unit at subrange 12, the structure that not will increase electronic equipment internal is multiple Miscellaneous degree, and convenient for assembling.

Certainly, in Fig. 1 only by corresponding to top area d1 a heat bulge 31 for, with illustrate to top area d1 The radiating treatment of the functional unit at place；In fact, as mentioned previously, heat bulge 31 can also be covered to bottom section d3, And it can be formed simultaneously multiple heat bulges 31 in same heat radiator body 3, and be covered each by top area d1 and bottom At least one of region d3.

Fig. 2 is the structural decomposition diagram of another electronic equipment shown according to an exemplary embodiment, such as Fig. 2 institute Show, by taking camera module 4 of the heat bulge 31 to top area d1 is covered and radiated as an example.In one embodiment, electronics It can be equipped in hollowed out area, such as Fig. 2 on top area d1 or bottom section d3 in the front shell assemblies 1 of equipment and be located at top Hollowed out area 13 at the d1 of region, the hollowed out area 13 can make (or the other function group of camera module 4 set on corresponding position Part) it is directly contacted with heat bulge 31.In the embodiment shown in fig. 1, " function can be understood as to the radiating circuit of functional unit Energy component → 1 → heat bulge of front shell assemblies 31 ", that is, need front shell assemblies 1 to conduct the heat of functional unit；And scheming In embodiment shown in 2, since heat bulge 31 can directly be contacted with camera module 4, thus it may be implemented more preferably to dissipate Thermal effect.

Since the surface of camera module 4 is higher than the bottom surface of recess 11, thus after needing to bend heat bulge 31, The surface of camera module 4 can be fitted in.As shown in Fig. 2, heat bulge 31 can be at the side wall bottom edge 111 of recess 1 The first bending part is formed, heat bulge 31 is bent to and upwardly extends；Then, side wall top edge of the heat bulge 31 in recess 1 112 form the second bending part, are bent to heat bulge 31 and cover to camera module 4.

Wherein, when heat bulge 31 needs the side-walls bending in recess 1, in order to avoid influencing touch-control display module 2 Smoothly in installation to recess 11, as shown in Fig. 2, hollowed out area 13 can be through removal top area d1 (in other embodiments In, can be bottom section d3) in the cover board of corresponding position and recess 11 side wall of corresponding position and formed, then convex when radiating Rise 31 part and touch-control display module 2 between the first bending part and the second bending part between formed the first spacing, heat dissipation it is convex It rises when forming the second spacing between 31 corresponding side walls and touch-control display module 2, it can be ensured that the first spacing is not less than between second Away from so as to occupy recess 11 to avoid it by squeezing heat bulge 31 to the thickness range for the side wall being removed Inner space prevents the insertion and installation that influence touch-control display module 2.

In addition, in the above-described embodiments, the cooling fin for the integral type of use being made of heat radiator body 3 and heat bulge 31 It can be made of graphite flake；Certainly, any heat sink material can be applied in embodiment of the disclosure, and the disclosure is not to this It is limited.

Those skilled in the art will readily occur to its of the disclosure after considering specification and practicing disclosure disclosed herein Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following Claim is pointed out.

It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.

Claims

1. a kind of cooling fin characterized by comprising

Heat radiator body, the heat radiator body are set in the recess at the front end face intermediate region of electronic equipment front shell assemblies, are used In to mainboard and being embedded in and install to the touch-control display module in the recess and radiate；

At least one heat bulge that the heat radiator body extends outward to form, the heat bulge cover the front shell assemblies The top area of front end face or at least part of bottom section, to radiate for the functional unit to corresponding position；

The heat bulge can be by corresponding to the hollow out at the functional unit in the top area or the bottom section Region contacts the functional unit, to radiate to the functional unit；

The heat bulge forms the first bending part at the side wall bottom edge of the recess, is bent to the heat bulge upwards Extend；And the heat bulge forms the second bending part in the side wall top edge of the recess, bends the heat bulge Extremely the functional unit is covered；

When the hollowed out area is by removing on the cover board and the recess of the top area or bottom section corresponding position The side wall of corresponding position and when being formed, part of the heat bulge between first bending part and second bending part Form the first spacing between the touch-control display module, the corresponding side wall of heat bulge and the touch-control display module it Between form the second spacing, and first spacing is not less than second spacing.

2. cooling fin according to claim 1, which is characterized in that the cooling fin is made of graphite flake.

3. a kind of electronic equipment characterized by comprising

Such as cooling fin of any of claims 1-2, for radiating to the functional unit.

4. electronic equipment according to claim 3, which is characterized in that the functional unit includes being located at the top area The camera module at place.

5. electronic equipment according to claim 3, which is characterized in that the cooling fin is adhered in the front shell assemblies Corresponding position.