CN202514156U - A heat dissipating structure of an electronic device and the electronic device - Google Patents
A heat dissipating structure of an electronic device and the electronic device Download PDFInfo
- Publication number
- CN202514156U CN202514156U CN2011203854138U CN201120385413U CN202514156U CN 202514156 U CN202514156 U CN 202514156U CN 2011203854138 U CN2011203854138 U CN 2011203854138U CN 201120385413 U CN201120385413 U CN 201120385413U CN 202514156 U CN202514156 U CN 202514156U
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- CN
- China
- Prior art keywords
- heater element
- electronic installation
- electronic device
- flexible pcb
- metal profile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipating structure of an electronic device. The heat dissipating structure of the electronic device is applied to the electronic device provided with a highly-heating element. The bottom part of the highly-heating element is connected to a flexible circuit board while the top part of the high-heating element is fixed on a support frame. And the flexible circuit board and the support frame are both arranged on a metal support board. The metal support board is provided with heat conducting glue. In this way, heat generated in the working of the high-heating element can be dissipated through the metal support board and the heat conducting glue, thereby reducing the working temperature of the electronic device.
Description
Technical field
The utility model belongs to technical field of electrical equipment, is meant the radiator structure of electric equipment especially.
Background technology
Along with the fast development of mechanics of communication, more and more powerful portable terminals come out, and the chip frequency that these powerful portable terminals adopt is high, and power is big, the especially 3G and following 4G cell phone, this some performance have particularly outstanding.In addition, the ancillary equipment of mobile phone is also more and more advanced, such as the pixel of camera all more than 500 ten thousand.All these configurations; All brought superpower experience, but that the thing followed is the heating problem of mobile phone is also more and more serious to the user, and if this is not a bit effectively handled; The stability that then is unfavorable for portable terminal work also is unfavorable for improving user's use experience.
The utility model content
The electronic installation that the utility model purpose is that a kind of radiator structure of electronic installation is provided and uses this radiator structure, can't in time to derive the temperature that produces too high and reduce the problem of user's use experience in order to solve in the prior art heat that produces when the work because of the high heater element of electronic installation.
For realizing above-mentioned purpose; The radiator structure of implementing the electronic installation of the utility model comprises a high heater element; The bottom of this high heater element is connected on the flexible PCB; And the top of this high heater element is fixed on the support frame, and this flexible PCB and support frame all be arranged on the metal profile, and this metal profile is provided with heat-conducting glue.
For realizing above-mentioned purpose; The utility model provides a kind of electronic installation; This electronic installation comprises a high heater element, and the bottom of this high heater element is connected on the flexible PCB, and the top of this high heater element is fixed on the support frame; And this flexible PCB and support frame all are arranged on the metal profile, and this metal profile is provided with heat-conducting glue.
According to above-mentioned principal character, this high heater element is a photographing module, is provided with two, is located at respectively on two surfaces of flexible PCB.
According to above-mentioned principal character, this metal profile one end is provided with a breach, and this support frame is arranged in this breach.
According to above-mentioned principal character, this flexible PCB is L-shaped, and high heater element is located on one side of this L shaped flexible PCB, and another side then is attached on the heat-conducting glue of metal profile.
Compared with prior art; The utility model is provided with heat-conducting glue through the metal profile surface at supporting flexible circuit board and support frame; The heat that so produces during this high heating element works can be dispersed rapidly through metal profile and heat-conducting glue, thereby reduces the working temperature of this electronic installation.
Description of drawings
Fig. 1 is the combination sketch map of the radiator structure of the electronic installation of enforcement the utility model.
Fig. 2 is Fig. 1 decomposing schematic representation.
Embodiment
Below in conjunction with accompanying drawing the embodiment of implementing the utility model is elaborated.
See also Fig. 1 and shown in Figure 2; Application sketch map for the radiator structure of the electronic installation of implementing the utility model; The radiator structure of implementing the electronic installation of the utility model comprises high heater element 11, flexible PCB 12 and metal profile 15; Wherein the bottom of this high heater element 11 is connected on the flexible PCB 12; And the top of this high heater element 11 is fixed on the support frame (not shown), and this flexible PCB 12 and support frame all be arranged on the metal profile 15, and this metal profile 15 is provided with heat-conducting glue 16.
In the specific implementation, this electronic installation can be mobile phone, and this high heater element 11 is photographing module (comprising elements such as transducer and camera lens), can be provided with in the present embodiment two (being front camera and rear camera), is located at respectively on two surfaces of flexible PCB 12.And these metal profile 15 1 ends are provided with a breach 17, and this support frame is arranged in this breach 17.
In addition, this flexible PCB 12 is L-shaped, and high heater element is located on the horizontal edge 13 of this L shaped flexible PCB, and another vertical edge 14 then is attached on the heat-conducting glue 16.Preferably, the conductive coefficient of this heat-conducting glue 16 is 4W/m*K.
Thus; The utility model is provided with heat-conducting glue 16 through metal profile 15 surfaces at supporting flexible circuit board 12 and support frame; The heat that produces when so this high heater element 11 is worked can be dispersed rapidly through metal profile 15 and heat-conducting glue 16, thereby reduces the working temperature of this electronic installation.
It is understandable that; Concerning those of ordinary skills; Can be equal to replacement or change according to the technical scheme and the utility model design thereof of the utility model, and all these changes or replacement all should belong to the protection range of the appended claim of the utility model.
Claims (8)
1. the radiator structure of an electronic installation; Comprise a high heater element; The bottom of this high heater element is connected on the flexible PCB; And the top of this high heater element is fixed on the support frame, and this flexible PCB and support frame all are arranged on the metal profile, it is characterized in that: this metal profile is provided with heat-conducting glue.
2. the radiator structure of electronic installation as claimed in claim 1, it is characterized in that: this high heater element is a photographing module, is provided with two, is located at respectively on two surfaces of flexible PCB.
3. the radiator structure of electronic installation as claimed in claim 1, it is characterized in that: this metal profile one end is provided with a breach, and this support frame is arranged in this breach.
4. the radiator structure of electronic installation as claimed in claim 1; It is characterized in that: this flexible PCB is
shape; High heater element is located on one side of flexible PCB of this
shape, and another side then is attached on the heat-conducting glue of metal profile.
5. electronic installation; This electronic installation comprises a high heater element; The bottom of this high heater element is connected on the flexible PCB; And the top of this high heater element is fixed on the support frame, and this flexible PCB and support frame all be arranged on the metal profile, and it is characterized in that: this metal profile is provided with heat-conducting glue.
6. electronic installation as claimed in claim 5 is characterized in that: this high heater element is a photographing module, is provided with two, is located at respectively on two surfaces of flexible PCB.
7. electronic installation as claimed in claim 5 is characterized in that: this metal profile one end is provided with a breach, and this support frame is arranged in this breach.
8. electronic installation as claimed in claim 5; It is characterized in that: this flexible PCB is
shape; High heater element is located on one side of flexible PCB of this
shape, and another side then is attached on the heat-conducting glue of metal profile.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203854138U CN202514156U (en) | 2011-10-11 | 2011-10-11 | A heat dissipating structure of an electronic device and the electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203854138U CN202514156U (en) | 2011-10-11 | 2011-10-11 | A heat dissipating structure of an electronic device and the electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202514156U true CN202514156U (en) | 2012-10-31 |
Family
ID=47066605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203854138U Expired - Fee Related CN202514156U (en) | 2011-10-11 | 2011-10-11 | A heat dissipating structure of an electronic device and the electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202514156U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106922105A (en) * | 2015-12-25 | 2017-07-04 | 小米科技有限责任公司 | Fin and electronic equipment |
| CN107241539A (en) * | 2017-06-30 | 2017-10-10 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN109275323A (en) * | 2018-11-22 | 2019-01-25 | 努比亚技术有限公司 | A kind of mobile terminal and its heat dissipating method, radiator, flexible circuit board |
-
2011
- 2011-10-11 CN CN2011203854138U patent/CN202514156U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106922105A (en) * | 2015-12-25 | 2017-07-04 | 小米科技有限责任公司 | Fin and electronic equipment |
| CN106922105B (en) * | 2015-12-25 | 2019-02-19 | 小米科技有限责任公司 | Cooling fin and electronic equipment |
| CN107241539A (en) * | 2017-06-30 | 2017-10-10 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN107241539B (en) * | 2017-06-30 | 2021-02-02 | Oppo广东移动通信有限公司 | Imaging device assembly and electronic device |
| CN109275323A (en) * | 2018-11-22 | 2019-01-25 | 努比亚技术有限公司 | A kind of mobile terminal and its heat dissipating method, radiator, flexible circuit board |
| CN109275323B (en) * | 2018-11-22 | 2021-12-17 | 努比亚技术有限公司 | Mobile terminal, heat dissipation method and device thereof, and flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121031 Termination date: 20131011 |