CN107241539A - Imaging device component and electronic installation - Google Patents
Imaging device component and electronic installation Download PDFInfo
- Publication number
- CN107241539A CN107241539A CN201710520453.0A CN201710520453A CN107241539A CN 107241539 A CN107241539 A CN 107241539A CN 201710520453 A CN201710520453 A CN 201710520453A CN 107241539 A CN107241539 A CN 107241539A
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- China
- Prior art keywords
- imaging device
- shell
- heat
- device component
- mounting shell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a kind of imaging device component and electronic installation.Imaging device component includes mounting shell, imaging device and heat-conducting glue.Imaging device is arranged on mounting shell.Imaging device includes shell.Heat-conducting glue surrounds shell.Heat conduction glue sticking shell and mounting shell.In the imaging device component and electronic installation of embodiment of the present invention, heat-conducting glue can increase the area of dissipation of imaging device, so that the heat of imaging device is dispersed into surrounding, so as to reduce the heat for the outer surface for passing to electronic installation by mounting shell by imaging device, in the outer surface heat quantity set for avoiding electronic installation corresponding with imaging device, temperature rise is excessive, improves Consumer's Experience.
Description
Technical field
The present invention relates to field of terminal, more particularly to a kind of imaging device component and electronic installation.
Background technology
In the electronic installation that mobile phone etc. has shoot function, the heat that camera is produced is concentrated so that with camera pair
The hull-skin temperature for the electronic installation answered is higher, influences Consumer's Experience.
The content of the invention
The present invention provides a kind of imaging device component and electronic installation.
The imaging device component of embodiment of the present invention includes mounting shell, imaging device and heat-conducting glue.Imaging device is set
On mounting shell.Imaging device includes shell.Heat-conducting glue surrounds the shell.Shell and the peace described in the heat conduction glue sticking
Fill shell.
In some embodiments, the heat-conducting glue is thermally conductive gel.
In some embodiments, the mounting shell includes substrate and the side wall extended from the edge of the substrate, described
Imaging device is set on the substrate.
In some embodiments, the imaging device includes the camera module being contained in the shell, the shell
The side plate that edge including bottom plate and from the bottom plate extends, the side plate is fixedly connected with the camera module.
In some embodiments, the imaging device includes being arranged on the electricity on the bottom plate and in the shell
Road plate, the camera module includes：It is arranged on the imaging sensor on the circuit board；It is arranged on above described image sensor
Camera lens；And voice coil motor, the camera lens is arranged in the voice coil motor.
In some embodiments, the imaging device includes connecting the circuit board and reached soft outside the shell
Property circuit board.
In some embodiments, the flexible PCB is structure as a whole with the circuit.
In some embodiments, the imaging device includes the connector being arranged on the flexible PCB, described
Connector is located remotely from one end of the flexible PCB of the shell.
In some embodiments, the quantity of the camera module is two, and two camera modules are disposed on
In the shell.
The electronic installation of embodiment of the present invention includes the imaging device component and display screen of any of the above embodiment.It is aobvious
Display screen is arranged on mounting shell, and the display screen and the imaging device are located at the opposite both sides of the mounting shell respectively.
In the imaging device component and electronic installation of embodiment of the present invention, heat-conducting glue can increase the radiating of imaging device
Area, so that the heat of imaging device is dispersed into surrounding, electronics dress is passed to so as to reduce by imaging device by mounting shell
The heat for the outer surface put, it is to avoid in the outer surface heat quantity set of electronic installation corresponding with imaging device, temperature rise is excessive, improves
Consumer's Experience.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from description of the accompanying drawings below to embodiment is combined
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the floor map of the imaging device component of embodiment of the present invention；
Fig. 2 is the diagrammatic cross-section of the electronic installation of embodiment of the present invention；
Fig. 3 is the front schematic view of the electronic installation of embodiment of the present invention；
Fig. 4 is the side schematic view of the electronic installation of embodiment of the present invention.
Main element symbol description：
Imaging device 100, bottom surface 102, gap 104；
Shell 10, bottom plate 11, side plate 12, camera module 20, imaging sensor 21, camera lens 22, voice coil motor 23, circuit board
30th, flexible PCB 40, connector 50；
Imaging device component 200, mounting shell 210, substrate 211, groove 2111, side wall 212, supporter 220, heat-conducting glue
230；
Electronic installation 300, display screen 310, receiver 320.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 2 is referred to, the imaging device component 200 of embodiment of the present invention includes mounting shell 210, supporter 220
With imaging device 100.Supporter 220 is arranged on mounting shell 210.The bottom surface 102 of imaging device 100 is supported on supporter 220
Above so as to be formed with gap 104 between bottom surface 102 and mounting shell 210.
In above-mentioned imaging device component 200, supporter 220 can avoid imaging device 100 from being contacted with mounting shell 210, from
And the heat for the outer surface for passing to electronic installation 300 by mounting shell 210 by imaging device 100 can be reduced, it is to avoid with imaging
The hull-skin temperature of the corresponding electronic installation 300 of device 100 is too high, improves Consumer's Experience.
Specifically, full air is filled in gap 104, it is therefore, empty because the thermal conductivity factor of air is 0.01~0.04W/mK
The thermal conductivity factor of gas is relatively low, and the heat that imaging device 100 is produced is difficult to pass on mounting shell 210.
Incorporated by reference to Fig. 3 and Fig. 4, above-mentioned imaging device component 200 may apply in electronic installation 300, electronic installation 300
For example, mobile phone, tablet personal computer etc. have the terminal of shoot function.In present embodiment, electronic installation 300 includes imaging device
Component 200 and display screen 310.Display screen 310 is arranged on mounting shell 210, and display screen 310 is located at respectively with imaging device 100
The opposite both sides of mounting shell 210.Therefore, in present embodiment, imaging device 100 is rearmounted imaging device 100.
Because the heat that imaging device 100 is produced is difficult to pass on mounting shell 210, therefore, the outer surface of electronic installation 300
Temperature it is relatively low, be conducive to Consumer's Experience.For example, electronic installation 300 includes receiver 320, receiver 320 is close to imaging device
100 are set.When user carries out voice call immediately after the completion of the shooting of imaging device 100, display screen 310 is towards user, user
Ear can be attached to by receiver 320, because the hull-skin temperature of electronic installation 300 is relatively low, user can carry out logical for a long time
Words, it is ensured that speech quality.
In present embodiment, mounting shell 210 is the center of electronic installation 300.It is, therefore, to be understood that electronic installation 300
The elements such as battery, main circuit board are installed on mounting shell 210.
In present embodiment, imaging device 100 includes shell 10, and imaging device component 200 includes heat-conducting glue 230, heat conduction
Glue 230 surrounds shell 10, the bonding shell 10 of heat-conducting glue 230 and mounting shell 210.
In this way, heat-conducting glue 230 can increase the area of dissipation of imaging device 100, so that the heat of imaging device 100 is distributed
To surrounding, so as to reduce the heat for the outer surface for passing to electronic installation 300 by mounting shell 210 by imaging device 100, keep away
In the outer surface heat quantity set for exempting from electronic installation 300 corresponding with imaging device 100, temperature rise is excessive, improves Consumer's Experience.
Specifically, when being assembled into as device assembly 200, first imaging device 100 is installed on mounting shell 210, then
The filling heat-conductive glue 230 around shell 10, and heat-conducting glue 230 is bonded shell 10 and mounting shell 210.
It should be noted that heat-conducting glue 230 is with insulating properties, heat-conducting glue 230 is not interfered with around imaging device 100
Electronic component normal work.
In one example, heat-conducting glue 230 is thermally conductive gel.In this way, the heat-conducting effect of heat-conducting glue 230 is preferably, can be compared with
The heat of imaging device 100 is passed to around imaging device 100 soon.Specifically, thermally conductive gel be using silicones as base material,
Addition heat filling and binding material configure form by a certain percentage, and the jelly processed by special process.Heat conduction
Gel has adhesive property, without adhesive layer, while the surface of the out-of-flatness of shell 10 can be covered so as to abundant with shell 10
Contact and improve heat conduction efficiency.
Referring to Fig. 1 and Fig. 2, in some embodiments, mounting shell 210 includes substrate 211 and from substrate 211
The side wall 212 of edge extension, supporter 220 is fixed on substrate 211.
In this way, substrate 211 can provide larger space to install imaging device 100.Substrate 211 can be by plastics system
Into can also be made up of plastics and sheet metal of embedding and injection molding shaping.
In present embodiment, imaging device 100 is arranged on substrate 211.Further, imaging device 211 passes through support
Body 220 is arranged on substrate 211.
In some embodiments, supporter 220 is structure as a whole with substrate 211.For example, the material of supporter 220 is
Plastics, supporter 220 passes through Shooting Technique and the formation integrative-structure of substrate 211.In this way, the connection of supporter 220 and substrate 211
It is simple in construction, and the parts of imaging device component 200 can be reduced, be conducive to imaging device component 200 to assemble.
In some embodiments, substrate 211 forms fluted 2111, and one end of supporter 220 is plugged in groove 2111
In.In this way, groove 2111 is conducive to positioning supporter 220, so that supporter 220 is quickly installed suitable position.Now,
Supporter 220 is Split type structure with substrate 211, and supporter 220 can be fixed on substrate 211 by the mode such as welding or bonding
On.
Supporter 220 can be in shapes such as cuboid, cylinder or round estrades.It is preferred that the shape and branch of groove 2111
The form fit of support body 220, so that supporter 220 is connected compacter with groove 2111.
In some embodiments, bottom surface 102 is square, and the quantity of supporter 220 is multiple, multiple 220 points of supporters
The corner location of bottom surface 102 is not connected to.It is preferred that the quantity of supporter 220 is four, four supporters 220 are connected respectively
Four corner locations in bottom surface 102.
In this way, supporter 220 can stably support imaging device 100, it is to avoid imaging device 100 occurs tilting etc. existing
As.
In some embodiments, imaging device 100 includes camera module 20, and camera module 20 is contained in shell 10,
Shell 10 includes the side plate 12 that bottom plate 11 and the edge from bottom plate 11 extend, and side plate 12 is fixedly connected with camera module 20.
Camera module 20 and shell 10 can the mode such as or welding Nian Jie by viscose glue be fixed together, therefore, shell 10
The impact that camera module 20 is subject to can be reduced when imaging device 100 falls, to ensure that camera module 20 can normally work
Make.
In present embodiment, bottom plate 11 includes bottom surface 102.It is understood that bottom surface 102 is the outer surface of bottom plate 11,
So that imaging device 100 can be supported on supporter 220.
In some embodiments, the quantity of camera module 20 is two, and two camera modules 20 are disposed on shell
In 10.In this way, two camera modules 20 are conducive to improving the image quality of imaging device 100.For example, one of camera module
20 be focal length camera module, and another camera module 20 is wide angle camera module.Two camera modules 20 cooperate to cause
Imaging device 100 obtains quality preferably image.
In some embodiments, shell 10 is structure as a whole with supporter 220.In this way, shell 10 and supporter 220
Attachment structure is simple.
In some embodiments, imaging device 100 includes being arranged on the circuit board on bottom plate 11 and in shell 10
30 (Printed Circuit Board, PCB), camera module 20 includes imaging sensor 21, camera lens 22 and voice coil motor 23.
Imaging sensor 21 is arranged on circuit board 30.Camera lens 22 is arranged on the top of imaging sensor 21 and is arranged on voice coil motor 23
In.
In this way, imaging sensor 21 can sense the light outside camera module 20 to obtain external image.Camera lens 22 can be with
External object is imaged on imaging sensor 21 so that imaging sensor 21 obtains preferably image.Voice coil motor 23
Optical axis direction of the camera lens 22 along camera lens 22 can be driven to move to adjust the distance between camera lens 22 and imaging sensor 21, and then
The auto-focusing of camera module 20 is realized, so that camera module 20 obtains quality preferably image.
Specifically, imaging sensor 21 is, for example, complementary metal oxide semiconductor (Complementary Metal
Oxide Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device,
CCD) CIS.Imaging sensor 21 can operationally produce substantial amounts of heat, and heat is passed on circuit board 30, then led to
Oversampling circuit plate 30 is passed on shell 10.Because shell 10 is spaced with mounting shell 210, so that heat is difficult to pass to mounting shell
On 210.
In some embodiments, imaging device 100 includes flexible PCB 40, the connection circuit board 30 of flexible PCB 40
And reach outside shell 10.
In this way, flexible PCB 40 can cause imaging device 100 to realize data transfer with outer member.For example, image
The picture signal of acquisition by flexible PCB 40 can be transferred to outer member by sensor 21, and outer member is to picture signal
External image can be obtained after processing.And for example, external element can control imaging sensor 21 photosensitive by flexible PCB 40
To obtain external image.
Shell 10 can offer the perforate passed through for flexible PCB 40, so that flexible PCB 40 reaches shell 10
Outside.
Can be set on flexible PCB 40 has connector 50, and connector 50 is located remotely from the flexible PCB 40 of shell 10
One end.
In this way, connector 50 may be connected on the main circuit board of electronic installation 300, so that imaging device 100 can be with
Data transfer is realized with outer member.For example, being provided with connection corresponding with connector 50 on the main circuit board of electronic installation 300
Device interface, connector 50 is inserted into connector interface and can complete connector 50 and be connected with main circuit board.
In some embodiments, circuit board 30 is structure as a whole with flexible PCB 40.For example, circuit board 30 and flexibility
Circuit board 40 is respectively a part for Rigid Flex.Circuit board 30 is the hardboard part of Rigid Flex, flexible PCB 40
For the soft board part of Rigid Flex.
In this way, it is simple in construction between circuit board 30 and flexible PCB 40, and the zero of imaging device 100 can be reduced
The quantity of part, so as to reduce the assembling procedure of imaging device 100, to reduce the assembly cost of imaging device 100.
To sum up, the imaging device component 200 of embodiment of the present invention includes mounting shell 210, imaging device 100 and heat-conducting glue
230, imaging device 100 is arranged on mounting shell 210, and heat-conducting glue 230 surrounds shell 10, the bonding shell 10 of heat-conducting glue 230 and peace
Fill shell 210.
In the imaging device component 200 of embodiment of the present invention, heat-conducting glue 230 can increase the radiating of imaging device 100
Area, so that the heat of imaging device 100 is dispersed into surrounding, is passed so as to reduce by imaging device 100 by mounting shell 210
To the heat of the outer surface of electronic installation 300, it is to avoid the outer surface heat quantity set of electronic installation 300 corresponding with imaging device 100
In, temperature rise is excessive, improves Consumer's Experience.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment of the present invention or example.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (10)
1. a kind of imaging device component, it is characterised in that including：
Mounting shell；
The imaging device on the mounting shell is arranged on, the imaging device includes shell；With
Around the heat-conducting glue of the shell, shell and the mounting shell described in the heat conduction glue sticking.
2. imaging device component as claimed in claim 1, it is characterised in that the heat-conducting glue is thermally conductive gel.
3. imaging device component as claimed in claim 1, it is characterised in that the mounting shell includes substrate and from the substrate
Edge extension side wall, the imaging device sets on the substrate.
4. imaging device component as claimed in claim 1, it is characterised in that the imaging device includes being contained in the shell
Interior camera module, the shell includes the side plate that bottom plate and the edge from the bottom plate extend, the side plate and the camera
Module is fixedly connected.
5. imaging device component as claimed in claim 4, it is characterised in that the imaging device includes being arranged on the bottom plate
Circuit board upper and in the shell, the camera module includes：
It is arranged on the imaging sensor on the circuit board；
It is arranged on the camera lens above described image sensor；With
Voice coil motor, the camera lens is arranged in the voice coil motor.
6. imaging device component as claimed in claim 5, it is characterised in that the imaging device includes connecting the circuit board
And reach the flexible PCB outside the shell.
7. imaging device component as claimed in claim 6, it is characterised in that the flexible PCB is one with the circuit board
Body structure.
8. imaging device component as claimed in claim 6, it is characterised in that the imaging device includes being arranged on the flexibility
Connector on circuit board, the connector is located remotely from one end of the flexible PCB of the shell.
9. imaging device component as claimed in claim 4, it is characterised in that the quantity of the camera module is two, two
The camera module is disposed in the shell.
10. a kind of electronic installation, it is characterised in that including：
Imaging device component described in claim 1-9 any one；With
The display screen on the mounting shell is arranged on, it is opposite that the display screen is located at the mounting shell with the imaging device respectively
Both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520453.0A CN107241539B (en) | 2017-06-30 | 2017-06-30 | Imaging device assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520453.0A CN107241539B (en) | 2017-06-30 | 2017-06-30 | Imaging device assembly and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107241539A true CN107241539A (en) | 2017-10-10 |
| CN107241539B CN107241539B (en) | 2021-02-02 |
Family
ID=59989969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710520453.0A Active CN107241539B (en) | 2017-06-30 | 2017-06-30 | Imaging device assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107241539B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202514156U (en) * | 2011-10-11 | 2012-10-31 | 捷开通讯科技(上海)有限公司 | A heat dissipating structure of an electronic device and the electronic device |
| US20160062110A1 (en) * | 2014-08-29 | 2016-03-03 | Smk Corporation | Camera module |
| CN105872341A (en) * | 2016-06-08 | 2016-08-17 | 尚艳燕 | Pickup camera |
| CN205545565U (en) * | 2015-12-30 | 2016-08-31 | 南昌欧菲光电技术有限公司 | Imaging module and electron device |
-
2017
- 2017-06-30 CN CN201710520453.0A patent/CN107241539B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202514156U (en) * | 2011-10-11 | 2012-10-31 | 捷开通讯科技(上海)有限公司 | A heat dissipating structure of an electronic device and the electronic device |
| US20160062110A1 (en) * | 2014-08-29 | 2016-03-03 | Smk Corporation | Camera module |
| CN205545565U (en) * | 2015-12-30 | 2016-08-31 | 南昌欧菲光电技术有限公司 | Imaging module and electron device |
| CN105872341A (en) * | 2016-06-08 | 2016-08-17 | 尚艳燕 | Pickup camera |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107241539B (en) | 2021-02-02 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
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