CN107222668A - Imaging device, imaging device component and electronic installation - Google Patents
Imaging device, imaging device component and electronic installation Download PDFInfo
- Publication number
- CN107222668A CN107222668A CN201710507511.6A CN201710507511A CN107222668A CN 107222668 A CN107222668 A CN 107222668A CN 201710507511 A CN201710507511 A CN 201710507511A CN 107222668 A CN107222668 A CN 107222668A
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- China
- Prior art keywords
- imaging device
- shell
- heat dissipating
- dissipating layer
- electronic installation
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention discloses a kind of imaging device, imaging device component and electronic installation.Imaging device includes shell；It is contained in the camera module in shell；The flexible PCB of camera module is connected, flexible PCB includes the extension stretched out outside shell；Wrap up the first heat dissipating layer of shell；With the second heat dissipating layer of parcel extension, the second heat dissipating layer connects the first heat dissipating layer, and first heat dissipating layer offers through hole, and the shell is exposed by the throughhole portions, and the shell is grounded by the through hole.In above-mentioned imaging device, imaging device component and electronic installation, first heat dissipating layer and the second heat dissipating layer increase the area of dissipation of imaging device, the heat of imaging device is allowd to pass to the external world quickly, avoid the temperature of electronic installation outer surface corresponding with imaging device higher, be conducive to improving Consumer's Experience, and ensure that imaging device can be with normal work.In addition, the earthing of casing can prevent shell formation electrostatic and influence the signal of communication of electronic installation.
Description
Technical field
The present invention relates to field of terminal, more particularly to a kind of imaging device, imaging device component and electronic installation.
Background technology
Mobile phone etc. have shoot function electronic installation in, camera produce heat concentrate so that electronic installation with
The temperature of the corresponding outer surface of camera is higher, influences Consumer's Experience, and may influence camera normal work.
The content of the invention
The present invention provides a kind of imaging device, imaging device component and electronic installation.
The imaging device of embodiment of the present invention includes shell；It is contained in the camera module in the shell；Connection is described
The flexible PCB of camera module, the flexible PCB includes the extension stretched out outside the shell；Wrap up the shell
First heat dissipating layer；With the second heat dissipating layer for wrapping up the extension, second heat dissipating layer connects first heat dissipating layer, described
First heat dissipating layer offers through hole, and the shell is exposed by the throughhole portions, and the shell is grounded by the through hole.
In some embodiments, first heat dissipating layer and/or second heat dissipating layer are graphite flake or graphene film.
In some embodiments, first heat dissipating layer is structure as a whole with second heat dissipating layer.
In some embodiments, the shell includes bottom plate and the side plate extended from the edge of the bottom plate, it is described into
As device includes being arranged on circuit board on the bottom plate, the camera module is arranged on the circuit board, the flexible electrical
Road plate connects the circuit board.
In some embodiments, the quantity of the camera module is two, and two camera modules are disposed on
In the shell.
In some embodiments, the camera module includes：
It is arranged on the imaging sensor on the circuit board；
It is arranged on the camera lens above described image sensor；With
Voice coil motor, the camera lens is arranged in the voice coil motor.
In some embodiments, the flexible PCB includes installation portion, and the installation portion connection is away from the shell
The extension one end, the imaging device includes being arranged on connector on the installation portion.
The imaging device component of embodiment of the present invention includes the imaging dress described in mounting shell and any of the above embodiment
Put, the imaging device is arranged on the mounting shell.
The imaging device component including embodiment of above of the electronic installation of present embodiment and it is arranged on the installation
Display screen on shell, the display screen and the imaging device are located at the opposite both sides of the mounting shell respectively.
In some embodiments, the electronic installation includes main circuit board and electric-conductor, and the main circuit board is arranged on
On the mounting shell, the electric-conductor connects the shell and the main circuit board by the through hole, so that the shell is logical
Cross the main circuit board ground connection.
In above-mentioned imaging device, imaging device component and electronic installation, the first heat dissipating layer and the increase imaging of the second heat dissipating layer
The area of dissipation of device so that the heat of imaging device can pass to the external world quickly, it is to avoid electronic installation and imaging device pair
The temperature for the outer surface answered is higher, is conducive to improving Consumer's Experience, and ensure that imaging device can be with normal work.In addition, outer
Shell is grounded, and can be prevented shell formation electrostatic and be influenceed the signal of communication of electronic installation.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from description of the accompanying drawings below to embodiment is combined
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the floor map of the imaging device component of embodiment of the present invention；
Fig. 2 is the diagrammatic cross-section of the electronic installation of embodiment of the present invention；
Fig. 3 is the front schematic view of the electronic installation of embodiment of the present invention；
Fig. 4 is the side schematic view of the electronic installation of embodiment of the present invention.
Main element symbol description：
Imaging device 100, gap 104；
Shell 10, bottom plate 11, side plate 12, camera module 20, imaging sensor 21, camera lens 22, voice coil motor 23, circuit board
30th, flexible PCB 40, extension 41, installation portion 42, connector 50, the first heat dissipating layer 60, through hole 61, the second heat dissipating layer 70；
Imaging device component 200, mounting shell 210, substrate 211, groove 111, side wall 212, supporter 220；
Electronic installation 300, display screen 310, receiver 320, main circuit board 330, electric-conductor 340.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1 and Fig. 2 is referred to, the imaging device component 200 of embodiment of the present invention includes mounting shell 210, supporter 220
With imaging device 100.Supporter 220 is arranged on mounting shell 210.The bottom surface 102 of imaging device 100 is supported on supporter 220
Above so as to be formed with gap 104 between bottom surface 102 and mounting shell 210.
In above-mentioned imaging device component 200, supporter 220 can avoid imaging device 100 from being contacted with mounting shell 210, from
And the heat for the outer surface for passing to electronic installation 300 by mounting shell 210 by imaging device 100 can be reduced, it is to avoid electronics is filled
Put 300 too high with the temperature of the corresponding outer surface of imaging device 100, improve Consumer's Experience.
Specifically, full air is filled in gap 104, it is therefore, empty because the thermal conductivity factor of air is 0.01~0.04W/mK
The thermal conductivity factor of gas is relatively low, and the heat that imaging device 100 is produced is difficult to pass on mounting shell 210.
Incorporated by reference to Fig. 3 and Fig. 4, above-mentioned imaging device component 200 may apply in electronic installation 300, electronic installation 300
For example, mobile phone, tablet personal computer etc. have the terminal of shoot function.In present embodiment, electronic installation 300 includes imaging device
Component 200 and display screen 310.Display screen 310 is arranged on mounting shell 210, and display screen 310 is located at respectively with imaging device 100
The opposite both sides of mounting shell 210.Therefore, in present embodiment, imaging device 100 is rearmounted imaging device 100.
Because the heat that imaging device 100 is produced is difficult to pass on mounting shell 210, therefore, the outer surface of electronic installation 300
Temperature it is relatively low, be conducive to Consumer's Experience.For example, electronic installation 300 includes receiver 320, receiver 320 is close to imaging device
100 are set.When user carries out voice call immediately after the completion of the shooting of imaging device 100, display screen 310 is towards user, user
Ear can be attached to by receiver 320, because the hull-skin temperature of electronic installation 300 is relatively low, user can carry out logical for a long time
Words, it is ensured that speech quality.
In present embodiment, mounting shell 210 is the center of electronic installation 300.It is, therefore, to be understood that electronic installation 300
The elements such as battery, main circuit board 330, which are respectively mounted, to be arranged on mounting shell 210.
Referring to Fig. 1 and Fig. 2, in some embodiments, mounting shell 210 includes substrate 211 and from substrate 211
The side wall 212 of edge extension, supporter 220 is fixed on substrate 211.
In this way, substrate 211 can provide larger space to install imaging device 100.Substrate 211 can be by plastics system
Into can also be made up of plastics and sheet metal of embedding and injection molding shaping.
In some embodiments, supporter 220 is structure as a whole with substrate 211.For example, the material of supporter 220 is
Plastics, supporter 220 passes through Shooting Technique and the formation integrative-structure of substrate 211.In this way, the connection of supporter 220 and substrate 211
It is simple in construction, and the parts of imaging device component 200 can be reduced, be conducive to imaging device component 200 to assemble.
In some embodiments, substrate 211 forms fluted 2111, and one end of supporter 220 is plugged in groove 2111
In.In this way, groove 2111 is conducive to positioning supporter 220, so that supporter 220 is quickly installed suitable position.Now,
Supporter 220 is Split type structure with substrate 211, and supporter 220 can be fixed on substrate 211 by the mode such as welding or bonding
On.
Supporter 220 can be in shapes such as cuboid, cylinder or round estrades.It is preferred that the shape and branch of groove 2111
The form fit of support body 220, so that supporter 220 is connected compacter with groove 2111.
In some embodiments, bottom surface 102 is square, and the quantity of supporter 220 is multiple, multiple 220 points of supporters
The corner location of bottom surface 102 is not connected to.It is preferred that the quantity of supporter 220 is four, four supporters 220 are connected respectively
Four corner locations in bottom surface 102.
In this way, supporter 220 can stably support imaging device 100, it is to avoid imaging device 100 occurs tilting etc. existing
As.
The imaging device 100 of embodiment of the present invention includes shell 10, camera module 20, flexible PCB 40, first and dissipated
The heat dissipating layer 70 of thermosphere 60 and second.Camera module 20 is contained in shell 10.The connection camera of flexible PCB 40 module 20, it is flexible
Circuit board 40 includes the extension 41 stretched out outside shell 10.First heat dissipating layer 60 wraps up shell 10.Second heat dissipating layer 70 parcel prolongs
Extending portion 41.Second heat dissipating layer 70 connects the first heat dissipating layer 60, and the first heat dissipating layer 60 offers through hole 61, and shell 10 passes through through hole 61
Partly expose, shell 10 is grounded by through hole 61.
In the imaging device 100 of embodiment of the present invention, the first heat dissipating layer 60 and the second heat dissipating layer 70 increase imaging device
100 area of dissipation so that the heat of imaging device 100 can pass to the external world quickly, it is to avoid electronic installation 300 is filled with imaging
The temperature for putting 100 corresponding outer surfaces is higher, is conducive to improving Consumer's Experience, and ensure that imaging device 100 can normal work
Make.In addition, the ground connection of shell 10 can prevent the formation electrostatic of shell 10 and influence the signal of communication of electronic installation 300.
Specifically, most of heat of imaging device 100 is produced by camera module 20, and the heat that camera module 20 is produced is first
Pass on shell 10, be then passed to the first heat dissipating layer 60, then pass to the second heat dissipating layer 70.Two heat dissipating layers radiate jointly, can
To reduce the heat on imaging device 100 quickly.
Shell 10 can be made up of stainless steel and other metal materials, for example, shell 10 can be made up of Sheet Metal Forming Technology.Camera mould
Group 20 with shell 10 can it is Nian Jie by viscose glue or weld etc. mode be fixed together, therefore, shell 10 can be in imaging device
100 when falling, and the impact that camera module 20 is subject to is reduced, to ensure that camera module 20 can normally work.
In this way, flexible PCB 40 can cause imaging device 100 to realize data transfer with outer member.For example, camera
The picture signal of acquisition by flexible PCB 40 can be transferred to outer member by module 20, outer member to picture signal at
External image can be obtained after reason.And for example, external element can control camera module 20 photosensitive to obtain by flexible PCB 40
Take external image.
Shell 10 can offer the perforate passed through for flexible PCB 40, so that flexible PCB 40 reaches shell 10
Outside.
It is pointed out that in present embodiment, the first heat dissipating layer 60 parcel shell 10 is referred to：Shell 10 it is all
Outer surface is equipped with the first heat dissipating layer 60；Second heat dissipating layer 70 parcel extension 41 is referred to：All appearances of extension 41
Face is equipped with the second heat dissipating layer 70.
Further, electronic installation 300 includes main circuit board 330 and electric-conductor 340, and electric-conductor 340 is connected by through hole 61
Shell 10 and main circuit board 330 are connect, so that shell 10 is grounded by main circuit board 330.
In this way, the mode that shell 10 is grounded is simple.Specifically, electric-conductor 340 is, for example, metal clips, electric-conductor 340
One end can be fixed on main circuit board 330 by way of welding, and the other end of electric-conductor 340 passes through through hole 61 and flexibly supported
Lean against on shell 10.The reliability of the ground connection of shell 10 can so be improved.
In some embodiments, the first heat dissipating layer 60 and/or the second heat dissipating layer 70 are graphite flake or graphene film.Namely
It is to say, the first heat dissipating layer 60 and the second heat dissipating layer 70 are graphite flake；Or first heat dissipating layer 60 and the second heat dissipating layer 70 be graphite
Alkene piece；Or first in heat dissipating layer 60 and the second heat dissipating layer 70, one of them is graphite flake, and another is graphene film.
In this way, the first heat dissipating layer 60 and the second heat dissipating layer 70 thermal conductivity preferably, can quickly geothermal flow pass to the external world with
Reduce the temperature rise of imaging device 100.
In some embodiments, the first heat dissipating layer 60 is structure as a whole with the second heat dissipating layer 70.It is, for example, possible to use one
Large stretch of heat dissipating layer, then first wraps up shell 10 by large stretch of heat dissipating layer, and extension 41 is finally wrapped up again；Or first by large stretch of heat dissipating layer bag
Extension 41 is wrapped up in, large stretch of heat dissipating layer is finally included into shell 10 again, in this way, the first heat dissipating layer 60 is consistent with the second heat dissipating layer 70
Property preferably, be conducive to the heat of the first heat dissipating layer 60 to pass to the second heat dissipating layer 70.
In some embodiments, the quantity of camera module 20 is two, and two camera modules 20 are disposed on shell
In 10.In this way, two camera modules 20 are conducive to improving the image quality of imaging device 100.For example, one of camera module
20 be focal length camera module, and another camera module 20 is wide angle camera module.Two camera modules 20 cooperate to cause
Imaging device 100 obtains quality preferably image.
In some embodiments, shell 10 includes the side plate 12 that bottom plate 11 and the edge from bottom plate 11 extend.Imaging dress
Putting 100 includes circuit board 30 (Printed Circuit Board, PCB), and circuit board 30 is arranged on bottom plate 11.Camera module
20 are arranged on circuit board 30, the connection circuit board 30 of flexible PCB 40.
In this way, circuit board 30 can provide support for camera module 20, so that the position of camera module 20 is more firm.Electricity
Road plate 30 can be fixedly connected with bottom plate 11 by way of bonding.
It is appreciated that the outer surface of bottom plate 11 and the outer surface of side plate 12 are equipped with the first heat dissipating layer 60.
In present embodiment, bottom plate 11 includes bottom surface 102.It is understood that bottom surface 102 is the outer surface of bottom plate 11,
So that imaging device 100 can be supported on supporter 220.
In some embodiments, camera module 20 includes imaging sensor 21, camera lens 22 and voice coil motor 23.Image is passed
Sensor 21 is arranged on circuit board 30.Camera lens 22 is arranged on the top of imaging sensor 21 and is arranged in voice coil motor 23.
In this way, imaging sensor 21 can sense the light outside camera module 20 to obtain external image.Camera lens 22 can be with
External object is imaged on imaging sensor 21 so that imaging sensor 21 obtains preferably image.Voice coil motor 23
Optical axis direction of the camera lens 22 along camera lens 22 can be driven to move to adjust the distance between camera lens 22 and imaging sensor 21, and then
The auto-focusing of camera module 20 is realized, so that camera module 20 obtains quality preferably image.
Specifically, imaging sensor 21 is, for example, complementary metal oxide semiconductor (Complementary Metal
Oxide Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device,
CCD) CIS.Imaging sensor 21 can operationally produce substantial amounts of heat, and heat is passed on circuit board 30, then led to
Oversampling circuit plate 30 is passed on shell 10.Because shell 10 is spaced with mounting shell 210, so that heat is difficult to pass to mounting shell
On 210.
In some embodiments, flexible PCB 40 includes installation portion 42, and installation portion 42 connects prolonging away from shell 10
One end of extending portion 41, imaging device 100 includes the connector 50 being arranged on installation portion 42.
In this way, connector 50 may be connected on the main circuit board 330 of electronic installation 300, so that imaging device 100 can
To realize data transfer with outer member.For example, being provided with the main circuit board 330 of electronic installation 300 corresponding with connector 50
Connector interface 331, connector 50 is inserted into connector interface 331 and can complete connector 50 and be connected with main circuit board 330.
In some embodiments, circuit board 30 is structure as a whole with flexible PCB 40.For example, circuit board 30 and flexibility
Circuit board 40 is respectively a part for Rigid Flex.Circuit board 30 is the hardboard part of Rigid Flex, flexible PCB 40
For the soft board part of Rigid Flex.
In this way, it is simple in construction between circuit board 30 and flexible PCB 40, and the zero of imaging device 100 can be reduced
The quantity of part, so as to reduce the assembling procedure of imaging device 100, to reduce the assembly cost of imaging device 100.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment of the present invention or example.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention is limited by claim and its equivalent.
Claims (10)
1. a kind of imaging device, it is characterised in that including：
Shell；
It is contained in the camera module in the shell；
The flexible PCB of the camera module is connected, the flexible PCB includes the extension stretched out outside the shell；
Wrap up the first heat dissipating layer of the shell；With
The second heat dissipating layer of the extension is wrapped up, second heat dissipating layer connects first heat dissipating layer；
First heat dissipating layer offers through hole, and the shell is exposed by the throughhole portions, and the shell passes through described
Through hole is grounded.
2. imaging device as claimed in claim 1, it is characterised in that first heat dissipating layer and/or second heat dissipating layer
For graphite flake or graphene film.
3. imaging device as claimed in claim 1, it is characterised in that first heat dissipating layer is one with second heat dissipating layer
Body structure.
4. imaging device as claimed in claim 1, it is characterised in that the shell includes bottom plate and the edge from the bottom plate
The side plate of extension, the imaging device includes the circuit board being arranged on the bottom plate, and the camera module is arranged on the electricity
On the plate of road, the flexible PCB connects the circuit board.
5. imaging device as claimed in claim 4, it is characterised in that the quantity of the camera module is two, described in two
Camera module is disposed in the shell.
6. imaging device as claimed in claim 4, it is characterised in that the camera module includes：
It is arranged on the imaging sensor on the circuit board；
It is arranged on the camera lens above described image sensor；With
Voice coil motor, the camera lens is arranged in the voice coil motor.
7. imaging device as claimed in claim 1, it is characterised in that the flexible PCB includes installation portion, the installation
One end of the extension of portion's connection away from the shell, the imaging device includes the connection being arranged on the installation portion
Device.
8. a kind of imaging device component, it is characterised in that including：
Mounting shell；With
Imaging device described in claim 1-7 any one, the imaging device is arranged on the mounting shell.
9. a kind of electronic installation, it is characterised in that including：
Imaging device component described in claim 8；With
The display screen on the mounting shell is arranged on, the display screen is respectively arranged at the installation shell phase with the imaging device
The both sides of the back of the body.
10. electronic installation as claimed in claim 9, it is characterised in that the electronic installation includes main circuit board and electric-conductor,
The main circuit board is arranged on the mounting shell, and the electric-conductor connects the shell and the main circuit by the through hole
Plate, so that the shell is grounded by the main circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710507511.6A CN107222668A (en) | 2017-06-28 | 2017-06-28 | Imaging device, imaging device component and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710507511.6A CN107222668A (en) | 2017-06-28 | 2017-06-28 | Imaging device, imaging device component and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107222668A true CN107222668A (en) | 2017-09-29 |
Family
ID=59950461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710507511.6A Pending CN107222668A (en) | 2017-06-28 | 2017-06-28 | Imaging device, imaging device component and electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107222668A (en) |
Cited By (3)
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| CN109451111A (en) * | 2018-11-29 | 2019-03-08 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN111698397A (en) * | 2019-03-13 | 2020-09-22 | 三赢科技（深圳）有限公司 | Camera module and electronic device |
| CN111694201A (en) * | 2019-03-12 | 2020-09-22 | 上海丰宝电子信息科技有限公司 | Camera lens treated by transparent high-temperature-resistant coating |
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| CN104580852A (en) * | 2014-11-28 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Image pick-up device of mobile phone and mobile phone |
| CN104994713A (en) * | 2015-07-14 | 2015-10-21 | 广东欧珀移动通信有限公司 | Mobile terminal and heat radiation structure thereof |
| CN105739618A (en) * | 2016-01-26 | 2016-07-06 | 努比亚技术有限公司 | Middle frame and mobile terminal |
| CN105933582A (en) * | 2016-04-29 | 2016-09-07 | 广东欧珀移动通信有限公司 | Pick-up head and mobile terminal |
| CN207117771U (en) * | 2017-06-28 | 2018-03-16 | 广东欧珀移动通信有限公司 | Imaging device, imaging device component and electronic installation |
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| CN109451111A (en) * | 2018-11-29 | 2019-03-08 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN111694201A (en) * | 2019-03-12 | 2020-09-22 | 上海丰宝电子信息科技有限公司 | Camera lens treated by transparent high-temperature-resistant coating |
| CN111698397A (en) * | 2019-03-13 | 2020-09-22 | 三赢科技（深圳）有限公司 | Camera module and electronic device |
| CN111698397B (en) * | 2019-03-13 | 2021-12-07 | 三赢科技（深圳）有限公司 | Camera module and electronic device |
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