CN104994713A - Mobile terminal and heat radiation structure thereof - Google Patents

Abstract

The invention discloses a heat radiation structure of a mobile terminal. The heat radiation structure comprises an installation bracket, wherein a mainboard heat radiation region and a camera shooting heat radiation region are arranged on the installation bracket in parallel, the mainboard heat radiation region is used for controlling temperature rise of a mainboard module, the camera shooting heat radiation region is used for controlling temperature rise of a camera module, the mainboard heat radiation region adjoins to one side of the mainboard module, the camera shooting heat radiation region is arranged on one side, away from the camera module, of the mainboard heat radiation region. According to the mobile terminal and the heat radiation structure thereof, the camera shooting heat radiation region used for controlling temperature rise of the camera module is arranged in a region outside the mainboard module and the camera module, so that the heat of the camera module is isolated from that of the mainboard module, and the heat of the mainboard module and the camera module is prevented from interactively affecting the heat radiation efficiency of the two modules even normal operation of the two modules, thereby ensuring heat radiation efficiency and stable operation of the mainboard module and the camera module simultaneously.

Description

A heat dissipation structure of a mobile terminal and the mobile terminal

technical field

The present invention relates to the technical field of terminal heat dissipation, in particular to a heat dissipation structure of a mobile terminal and the mobile terminal, and further, to a heat dissipation structure of a mobile phone and the mobile phone.

Background technique

In modern society, the pace of life of people is getting faster and faster, and the communication between people is getting closer and more frequent. People rely heavily on communication equipment. Among them, the mobile phone is one of the most widely used communication terminals. The mobile phone is favored and popularized by people because of its portability, simple operation and comprehensive functions. The mobile phone is a mobile terminal with a small size, but people have a high demand for the functions and processing capabilities of the mobile phone. Therefore, the integration of mobile phones is getting higher and higher, and the CPU cores of mobile phones are also increasing. At the same time, the frequency of the CPU is also increasing. Higher and higher. With such a high frequency and performance, the operating temperature of the CPU is getting higher and higher, and the temperature rise of the CPU will seriously affect its working performance. Therefore, effective heat dissipation of the CPU is very important. In addition, shooting is also a function that people generally need. At present, most mobile phones are equipped with cameras. The cameras will generate a lot of heat during work. If the heat dissipation of the cameras is not timely, it will affect the reliability and service life of the cameras, and even Heat will affect the normal work of the CPU and other components, therefore, the effective heat dissipation of the camera is also very important.

In addition to mobile phone terminals, most electronic product terminals are currently equipped with highly integrated and high-performance CPUs and cameras. The CPU and cameras on these electronic product terminals also need to solve the problem of heat dissipation during use.

At present, the camera part is generally wrapped with a layer of copper foil or a layer of graphite is pasted on the back to solve the heat dissipation problem. However, with the compression of the structural space and the limitation of the thickness of the whole machine, the structural design of the camera part is becoming more and more complicated. For example, in order to solve the problem of the thickness of the whole machine, the motherboard module will be placed in the middle frame. At this time, due to the thickness of the camera, the metal area on the back of the camera is at the same height as the motherboard module. Graphite or copper foil can solve the heat dissipation problem.

In addition, since the camera part is generally located in the area close to the main board module, and the main board module area and the camera part are both high-temperature areas, even if the camera part is effectively connected to the middle frame, there will also be the disadvantage that the high-temperature area will affect the heat dissipation efficiency. .

Based on the above situation, it is necessary for us to design a heat dissipation structure that can simultaneously improve the heat dissipation efficiency of the motherboard module and the camera module.

Contents of the invention

An object of the present invention is to provide a heat dissipation structure for a mobile terminal, which can improve the heat dissipation efficiency of the camera module by setting a special camera heat dissipation area to effectively ensure the working stability and service life of the camera module .

An object of the present invention is to provide a heat dissipation structure for a mobile terminal, by setting a camera heat dissipation area for controlling the temperature rise of the camera module in an area other than the motherboard module and the camera module, so that the heat of the camera module It is isolated from the heat of the motherboard module to prevent the heat of the two from affecting each other's heat dissipation efficiency, or even affect the normal operation of the other, so as to ensure the stable operation of the motherboard module and the camera module at the same time.

An object of the present invention is to provide a mobile terminal. By setting the heat dissipation areas of the motherboard module and the camera module in the mobile terminal, the mutual influence of the heat of the two is avoided, and at the same time, the heat dissipation of the motherboard module and the camera module is effectively improved. The heat dissipation efficiency ensures the working reliability and service life of the motherboard module and camera module.

For reaching this purpose, the present invention adopts following technical scheme:

On the one hand, a heat dissipation structure of a mobile terminal is provided, which includes a mounting bracket, and a mainboard heat dissipation area for controlling the temperature rise of the mainboard module and a camera heat dissipation area for controlling the temperature rise of the camera module are arranged side by side on the mounting bracket , the heat dissipation area of the main board is arranged close to one side of the main board module, and the heat dissipation area of the camera is located on the side of the heat dissipation area of the main board away from the camera module.

In another aspect, a mobile terminal is provided, including the above-mentioned heat dissipation structure for the mobile terminal.

The beneficial effects of the present invention are:

(1) Provide a heat dissipation structure of a mobile terminal, by setting a special camera heat dissipation area to dissipate heat from the camera module, improve the heat dissipation efficiency of the camera module, and effectively ensure the working stability and service life of the camera module.

(2) Provide a heat dissipation structure of a mobile terminal, by setting a camera heat dissipation area for controlling the temperature rise of the camera module in an area other than the main board module and the camera module, so that the heat of the camera module and the main board module The heat isolation of the two can avoid the mutual influence of the heat of the two on the heat dissipation efficiency of the other, and even affect the normal work of the other.

(3) Provide a kind of mobile terminal, by setting the cooling area of motherboard module and camera module respectively in mobile terminal, avoid the mutual influence of both heat, improve the heat dissipation efficiency of motherboard module and camera module effectively simultaneously, guarantee The working reliability and service life of the motherboard module and camera module.

Description of drawings

The present invention will be described in further detail below according to the drawings and embodiments.

FIG. 1 is a schematic diagram of the heat dissipation structure of the mobile terminal described in the embodiment;

Fig. 2 is the schematic diagram of the heat conduction strip described in the embodiment;

Fig. 3 is a schematic diagram of the assembled heat-conducting strip and heat-insulating connector described in the embodiment;

Fig. 4 is a schematic diagram of cooperation between the heat conducting strip, the heat sink of the motherboard and the heat sink of the camera according to the embodiment.

In Figures 1 to 4:

1. Middle frame; 2. Metal plate; 3. Camera module; 4. Thermal strip; 5. Insulation connector; 6. Motherboard heat sink; 7. Camera heat sink;

detailed description

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

As shown in Figures 1 to 4, in this embodiment, a heat dissipation structure of a mobile terminal includes a mounting bracket, and a motherboard cooling area for controlling the temperature rise of the motherboard module and a motherboard cooling area for controlling The camera heat dissipation area of the camera module 3 temperature rise, the main board heat dissipation area is arranged close to one side of the main board module, and the camera heat dissipation area is located at a side of the main board heat dissipation area away from the camera module 3 side.

In this embodiment, the camera module 3 is dissipated by setting a special camera heat dissipation area, so as to improve the heat dissipation efficiency of the camera module 3 and effectively ensure the working stability and service life of the camera module 3 . In addition, in this embodiment, a camera heat dissipation area for controlling the temperature rise of the camera module 3 is set in an area other than the main board module and the camera module 3, so that the heat of the camera module 3 is isolated from the heat of the main board module, Avoid the mutual influence of the heat of the two on the heat dissipation efficiency of the other, and even affect the normal operation of the other, so as to ensure the stable operation of the motherboard module and the camera module 3 at the same time.

The camera cooling area is provided with a camera cooling fin 7 whose end surface is attached to the mounting bracket, and the imaging cooling fin 7 is connected to the camera module 3 through a heat conduction strip 4 .

The heat conduction strip 4 has high thermal conductivity, and can quickly and effectively transfer heat from the camera module 3 to the camera cooling area, thereby realizing efficient heat dissipation of the camera module 3 and controlling the camera module 3 At a lower working temperature, the working stability of the camera module 3 is ensured.

In this embodiment, the heat conduction strip 4 runs through the area of the motherboard module, one end of the heat conduction strip 4 is connected to the camera module 3, and the other end of the heat conduction strip 4 is connected to the camera heat sink 7 connections. The heat-conducting strip 4 and the camera module 3 are fixedly connected by heat-conducting glue. The heat-conducting glue has excellent heat-conducting performance and can provide components with a high guaranteed heat dissipation coefficient, which is suitable for components with high heat generation. The stability in the process plays a guarantee role, improving the performance and life of the components; the thermally conductive adhesive also has superior electrical properties, aging resistance, and anti-cold and heat alternation performance, which increases the safety of the mobile terminal during use. coefficient. The thermally conductive adhesive is any one of silicone thermally conductive adhesive, epoxy resin AB adhesive, polyurethane adhesive, and polyurethane thermally conductive adhesive. In this embodiment, the thermal conductive glue is polyurethane glue.

The heat dissipation area of the motherboard is provided with a heat sink 6 of the motherboard whose end surface is attached to the mounting bracket. The heat dissipation area of the main board is located on the side of the camera heat dissipation area close to the camera module 3 .

The middle part of the heat-conducting strip 4 is wrapped or covered with a heat-insulating connecting piece 5 for isolating heat conduction, and the heat sink 6 of the motherboard is connected to the heat-conducting strip 4 through the heat-insulating connecting piece 5 . Since the camera heat dissipation area is located on the side of the motherboard heat dissipation area away from the camera module 3, and the camera module 3 and the camera heat dissipation area are connected through the heat conduction strip 4, the heat conduction strip 4 needs to pass through the heat dissipation area of the main board, that is, the middle part of the heat conducting strip 4 needs to be in contact with the heat sink 6 of the main board. If the heat-conducting strip 4 is in direct contact with the mainboard cooling fin 6, the heat generated by the camera module 3 will be directly transferred to the mainboard cooling fin 6 to increase the temperature of the mainboard cooling fin 6, thereby It affects the heat dissipation efficiency of the motherboard heat sink 6 to the motherboard module, and even affects the normal operation of the motherboard module. Based on the above situation, in this embodiment, the heat-insulating connecting piece 5 that can cut off heat conduction is provided in the middle of the heat-conducting strip 4, and the heat-insulating connecting piece 5 has better performance of blocking heat transfer, so that the heat-conducting strip 4 The heat on the surface cannot be transferred to the motherboard heat sink 6, thereby ensuring that the heat of the camera module 3 is directly transferred to the camera heat dissipation area, and avoiding that the camera heat dissipation area and the motherboard heat dissipation area affect the heat dissipation efficiency mutually.

The heat conducting strip 4 is made of any one or at least two of aluminum, copper foil, and graphite; the heat insulating connector 5 is made of perlite or glass fiber; The sheets 7 all adopt any one of natural graphite heat dissipation film, artificial graphite heat dissipation film, and nano-carbon heat dissipation film.

In this embodiment, the heat conducting strip 4 is copper foil, the heat insulating connector 5 is made of glass fiber, and the main board heat sink 6 and the camera heat sink 7 are both made of artificial graphite heat dissipation film.

On the mounting bracket and on the side of the camera module 3 close to the motherboard module, there are heat insulating ribs 8 for blocking heat conduction. The heat insulating ribs 8 can effectively prevent the mutual heat transfer and mutual influence between the camera module 3 and the motherboard module.

The installation bracket includes a middle frame 1 and a metal plate 2 arranged inside the middle frame 1, the camera module 3 is fixedly installed at one end of the middle frame 1, and the main board module is fixedly installed on the metal plate 2. The plate 2 is close to one end of the camera module 3, and the heat insulating rib 8 is fixedly arranged on the middle frame 1 and located between the camera module 3 and the main board module.

One end of the middle frame 1 is provided with a camera installation groove for installing the camera module 3 , and the camera module 3 is fixed in the camera installation groove by clamping or screwing. In this embodiment, the heat insulating ribs 8 are integrally formed with the middle frame 1 . In other embodiments, the heat insulating ribs 8 can also be clamped on the middle frame 1 .

In this embodiment, the heat conduction strip 4 is in the shape of a flat cuboid, and the heat conduction strip 4 is installed on the edge of the installation bracket.

In this embodiment, the camera module 3 includes a lens and a base, and the heat conducting strip 4 is thermally connected to the base. The base is made of metal, and the end face of the heat conduction strip 4 is bonded to the base, effectively increasing the heat conduction area between the heat conduction strip 4 and the camera module 3, and improving the heat dissipation of the camera module 3 efficiency.

This embodiment also provides a mobile terminal, including the above-mentioned heat dissipation structure for the mobile terminal. The mobile terminal also includes a front frame and a rear frame respectively arranged on both sides of the middle frame 1, and the front frame, the middle frame 1 and the rear frame enclose an installation space for installing internal components. The heat dissipation areas of the motherboard module and the camera module 3 are respectively set in the mobile terminal, which can avoid the mutual influence of the heat of the two, and effectively improve the heat dissipation efficiency of the motherboard module and the camera module 3, and ensure that the motherboard module and the camera module 3 work reliability and service life.

It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the applied technical principles. Within the technical scope disclosed in the present invention, any changes or substitutions that are easily conceivable by those skilled in the art, All should be covered within the protection scope of the present invention.

Claims (10)

1. the radiator structure of a mobile terminal, it is characterized in that, comprise mounting bracket, described mounting bracket is set side by side with the mainboard radiating area for controlling the temperature rise of mainboard module and the shooting radiating area for controlling the temperature rise of described camera module, described mainboard radiating area is near the side being arranged on described mainboard module, and described shooting radiating area is positioned at the side of described mainboard radiating area away from described camera module.

2. the radiator structure of a kind of mobile terminal according to claim 1, it is characterized in that, described shooting radiating area is provided with the shooting fin that an end face and described mounting bracket are fitted, and described shooting fin is connected by the heat conduction of heat conduction bar with described camera module.

3. the radiator structure of a kind of mobile terminal according to claim 2, is characterized in that, described mainboard radiating area is provided with the mainboard fin that an end face and described mounting bracket are fitted.

4. the radiator structure of a kind of mobile terminal according to claim 3, it is characterized in that, the middle part of described heat conduction bar is wrapped up or is coated with for cutting off heat conducting insulating connector, and described mainboard fin is connected with described heat conduction bar by described insulating connector.

5. the radiator structure of a kind of mobile terminal according to claim 4, is characterized in that, any one or at least two kinds in described heat conduction strip adoption aluminium, Copper Foil, graphite are made;

Described insulating connector adopts perlite or glass fibre to make;

Described mainboard fin and described shooting fin all adopt native graphite heat dissipation film, electrographite heat dissipation film, any one in nano-sized carbon heat dissipation film.

6. the radiator structure of a kind of mobile terminal according to any one of claim 1 to 5, is characterized in that, described mounting bracket is positioned at described camera module and is provided with heat insulation muscle for cutting off heat conduction near the side of described mainboard module.

7. the radiator structure of a kind of mobile terminal according to claim 6, it is characterized in that, described mounting bracket comprises center and is arranged on the metallic plate inside described center, described camera module is fixedly mounted on one end of described center, described mainboard module is fixedly mounted on described metallic plate one end near described camera module, and described heat insulation muscle to be fixedly installed on described center and between described camera module and described mainboard module.

8. the radiator structure of a kind of mobile terminal according to any one of claim 2 to 5, is characterized in that, described heat conduction bar is flat rectangular body shape, and described heat conduction bar is arranged on the edge of described mounting bracket.

9. the radiator structure of a kind of mobile terminal according to any one of claim 2 to 5, is characterized in that, described camera module comprises camera lens and base, and described heat conduction bar is connected with described base heat conduction.

10. a mobile terminal, is characterized in that, comprises the mobile terminal radiator structure described in any one of claim 1 to 9.