CN109451215A - A kind of camera module and terminal - Google Patents
A kind of camera module and terminal Download PDFInfo
- Publication number
- CN109451215A CN109451215A CN201811358415.0A CN201811358415A CN109451215A CN 109451215 A CN109451215 A CN 109451215A CN 201811358415 A CN201811358415 A CN 201811358415A CN 109451215 A CN109451215 A CN 109451215A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- camera module
- optical filter
- face
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The present invention provides a kind of camera module and terminal.The camera module, comprising: first circuit board；Imaging sensor is set to the first face of the first circuit board；Optical filter is set in described image sensor, or with described image sensor interval pre-determined distance；Fixed bracket around the optical filter and is set to the second face of the first circuit board, and first face and second face are opposite two faces of the first circuit board；It is fixed on the support bracket fastened camera lens；Wherein, the middle part of the first circuit board is equipped with opening；Light passes sequentially through the camera lens, the optical filter and the opening to reaching described image sensor.The present invention realizes that the miniaturization of camera module so that terminal is more lightening, while improving the screen accounting of terminal to reduce space occupancy rate of the camera module in terminal.
Description
Technical field
The present invention relates to field of terminal technology more particularly to a kind of camera modules and terminal.
Background technique
With the development of science and technology, requirement of the consumer to mobile phone is also more and more harsh, take pictures clear, intelligence, Gao Ping
Accounting, ultra-thin fuselage etc. are all the ultimate attainment experience that consumer pursues.
The design of camera module ontology at present generally uses wafer-level package (Chip Scale Package, abbreviation
CSP) and chip on board encapsulation (Chip On Board, abbreviation COB) scheme.
As shown in Figure 1, being CSP package structure diagram.Specifically, CSP technique is by electronic component 101 and image sensing
Device 102 is welded to printed circuit board 103 by surface mounting technology (Surface Mount Technology, abbreviation SMT)
On (Printed Circuit Board, abbreviation PCB), use glue 104 by assembled camera lens 105 and optical filter 106 later
Bracket 107 be fitted on pcb board 103.As shown in Figure 1, the height of camera module in z-direction are as follows: camera lens overall length
(Total Track Length, abbreviation TTL), i.e. the distance A+ imaging sensor from lens barrel front end face to imaging sensor image planes
Thickness B+ tin ball thickness C+PCB plate thickness D.Since the lens design TTL of such structure needs to consider 101 heights of electronic component
Degree and the distance apart from optical filter 106, general TTL are larger.Size of the camera module in the direction X/Y are as follows: imaging sensor ruler
The distance F+ electronic component dimensions G+ electronic component of very little E+ imaging sensor edge to electronic component is thick to bracket distance H+ bracket
Spend J.Size of the camera module in the direction X/Y is also bigger than normal.
As shown in Fig. 2, being COB package structure diagram.Specifically, COB technique is that imaging sensor 202 is first passed through glue
Water 204 is bonded together with the pcb board 203 for posting electronic component 201, then is passed image by routing Wire bonding technology
Sensor 202 realizes that electric property is connect with pcb board 203, uses glue 204 by assembled camera lens 205 and optical filter 206 later
Bracket 207 be bonded on pcb board 203.As shown in Fig. 2, the height of camera module in z-direction are as follows: camera lens TTL A1+ figure
As sensor thickness B1+ glue thickness C1+PCB plate thickness D1.Since the lens design TTL of such structure needs to consider electronics member
Part 201 height itself and the distance apart from optical filter 206, general TTL are larger.Size of the camera module in the direction X/Y are as follows: figure
As the distance G1+ electronic component of size sensor E1+ routing connection space F1+ electronic component is to bracket distance H1+ backing thickness
J1.Size of the camera module in the direction X/Y is bigger relative to size of the camera module in the direction X/Y of CSP scheme.
To sum up, CSP the and COB camera module of current main-stream encapsulates design scheme, and camera module size is big, unfavorable
In mould group Miniaturization Design.
Summary of the invention
The embodiment of the present invention provides a kind of camera module and terminal, big to solve existing camera module size, at end
The high problem of space occupancy rate in end.
In order to solve the above-mentioned technical problem, the embodiment of the present invention adopts the following technical scheme that, a kind of camera module, packet
It includes:
First circuit board；
Imaging sensor is set to the first face of the first circuit board；
Optical filter is set in described image sensor, or with described image sensor interval pre-determined distance；
Fixed bracket around the optical filter and is set to the second face of the first circuit board, first face with
Second face is two opposite faces of the first circuit board；
It is fixed on the support bracket fastened camera lens；
Wherein, the middle part of the first circuit board is equipped with opening；Light pass sequentially through the camera lens, the optical filter and
The opening is to reaching described image sensor.
The embodiment of the invention also provides a kind of terminals, comprising: camera module and second circuit as described above
Plate, the second circuit board are connect with first circuit board.
In the embodiment of the present invention, by the first circuit board being set between optical filter and imaging sensor, make full use of
Existing distance itself is between optical filter and imaging sensor to accommodate first circuit board, in this way, realizing the small of camera module
Type so that terminal is more lightening, while improving end to reduce space occupancy rate of the camera module in terminal
The screen accounting at end.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that camera module uses CSP encapsulation in the prior art；
Fig. 2 is the structural schematic diagram that camera module uses COB encapsulation in the prior art；
Fig. 3 is the structural schematic diagram of the camera module of the embodiment of the present invention；
Fig. 4 is that the positional relationship in the camera module of the embodiment of the present invention between first circuit board and imaging sensor is shown
It is intended to.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example belongs to the range of invention protection.
The embodiment of the invention discloses a kind of camera modules, as shown in Figure 3, comprising: first circuit board 1；Image sensing
Device 2 is set to the first face of first circuit board 1；Optical filter 3 is set on imaging sensor 2, or and image sensing
Device 2 is spaced pre-determined distance；Fixed bracket 4 around optical filter 3 and is set to the second face of first circuit board 1, the first face and the
Two faces are two opposite faces of first circuit board 1；It is fixed on the camera lens 5 of fixed bracket 4.
Wherein, the middle part of first circuit board 1 is equipped with opening 6；Light passes sequentially through camera lens 5, optical filter 3 and opening 6 and arrives
Up to imaging sensor 2.
It should be noted that first circuit board 1 is used for the electric signal transmission of imaging sensor 2 to rear end.Wherein, first
Circuit board 1 is hardboard, soft board or Rigid Flex.
Optical filter 3 enables imaging sensor 2 to shoot reality seen by human eye for that will filter out extra optical band
Scenery.
Here, optical filter 3 can be attached in one side of the imaging sensor 2 far from the first face of first circuit board 1.
Imaging sensor 2 receives the extraneous light by camera lens 5, optical filter 3 and opening 6, and converts light into electricity
Signal, then digital signal is converted to by internal A/D.Here, which handles chip.
Fixed bracket 4 is used for fixed lens 5.
Here, camera lens 5 is the device that photographed is imaged on imaging sensor 2, including lens.
It should be noted that first circuit board 1 is arranged between optical filter 3 and imaging sensor 2, optical filter is made full use of
Existing distance itself is between 3 and imaging sensor 2 to accommodate first circuit board 1, in this way, reducing camera module in the side Z
Upward size.Moreover, being equipped with opening 6 at the middle part of first circuit board 1, its purpose is to so that extraneous light is successively led to
It crosses camera lens 5, optical filter 3 and opening 6 to be irradiated on imaging sensor 2, scenery is enabled to pass through the optical imagery that camera lens 5 generates
Enough surfaces for unobstructedly projecting imaging sensor 2, finally guarantee on terminal (such as mobile phone) screen it can be seen that scheming
Picture.
Optionally, camera module further include: electronic component 7, electronic component 7 are set to the inside of first circuit board 1.
It should be noted that electronic component 7 is packaged in the inside of first circuit board 1.That is, the thickness of electronic component 7
Degree is less than or equal to the thickness of first circuit board 1.
Here, since electronic component 7 is set to the inside of first circuit board 1, one, it is no longer necessary to consider electronic component sheet
The height of body reduces camera lens TTL, and then reduces the size of camera module in z-direction；The two, it is no longer necessary to consider electronics
Component placement and routing space reduce size of the camera module on the direction X/Y.Camera shooting is further decreased in this way, having reached
The purpose of the size of head mould group, realizes the miniaturization of camera module, when the camera module is applied to terminal, additionally it is possible to drop
Space occupancy rate of the low camera module in terminal so that terminal is more lightening, while improving the screen accounting of terminal.
Optionally, optical filter 3 is set to the second face of first circuit board 1.
Optionally, optical filter 3 is attached at the second face of first circuit board 1 by bonding agent 8.Preferably, bonding agent 8 is glue
Water.
Optionally, optical filter 3 is set in the opening 6 of first circuit board 1.
Here, specifically, optical filter 3 can be set in the opening 6 of first circuit board 1 by bonding method.
Optionally, optical filter 3 is set on fixed bracket 4.
Here, specifically, optical filter 3 can be set on fixed bracket 4 by bonding method.For example, will by glue
Optical filter 3 is pasted on fixed bracket 4.
Here, the set-up mode of above-mentioned three kinds of optical filters, can be realized makes first circuit board 1 be located at optical filter 3 and figure
As between sensor 2.
It should be noted that the Z-direction height on optical filter 3 to 2 surface of imaging sensor can pass through the thickness of first circuit board 1
Adjustment.
Optionally, imaging sensor 2 is electrically connected by welding manner with first circuit board 1.Here, pass through welding manner energy
Enough realize that the reliable electric between imaging sensor 2 and first circuit board 1 connects.
Preferably, imaging sensor 2 is connected on the first face of first circuit board 1 by planting tin ball bonding.
Optionally, imaging sensor 2 is set in the opening 6 of first circuit board 1.
Preferably, when imaging sensor 2 is set in the opening 6 of first circuit board 1, metal wire and the first circuit can be passed through
Plate 1 is electrically connected.It so, it is possible to realize that the reliable electric between imaging sensor 2 and first circuit board 1 connects.
Optionally, fixed bracket 4 is connect by bonding agent 8 with the second face of first circuit board 1.Preferably, bonding agent 8 is
Glue.
As shown in figure 4,2 occupied area of imaging sensor is less than 1 occupied area of first circuit board, and imaging sensor 2
In the underface of the opening 6 of first circuit board 1.The area of the opening of first circuit board 1 is less than the area of imaging sensor 3,
Purpose is to reserve the welding space between first circuit board 1 and imaging sensor 2.
In order to protect imaging sensor 2, optionally, the periphery of imaging sensor 2 is filled with packing material.
Here, specifically, as shown in figure 3, in the present embodiment, the size of camera module in z-direction are as follows: camera lens TTL
A2+ imaging sensor thickness B2.
Size of the camera module on the direction X/Y are as follows: image sensor size C2+ packing material width D.
It should be noted that the Z-direction of camera module is the optical axis direction with camera module in the embodiment of the present invention
Parallel direction.The direction X/Y of camera module is the direction vertical with Z-direction.
The embodiment of the invention also provides a kind of terminals, including the camera module as described in above-described embodiment；And the
Two circuit boards, second circuit board are electrically connected with the first circuit board in camera module.
The terminal of the embodiment of the present invention is filtered due to using the camera module in above-described embodiment by being set to
First circuit board between piece and imaging sensor, make full use of between optical filter and imaging sensor existing distance itself with
First circuit board is accommodated, in this way, realizing the miniaturization of camera module, reduces space hold of the camera module in terminal
Rate so that terminal is more lightening, while improving the screen accounting of terminal.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (11)
1. a kind of camera module characterized by comprising
First circuit board；
Imaging sensor is set to the first face of the first circuit board；
Optical filter is set in described image sensor, or with described image sensor interval pre-determined distance；
Fixed bracket around the optical filter and is set to the second face of the first circuit board, first face with it is described
Second face is two opposite faces of the first circuit board；
It is fixed on the support bracket fastened camera lens；
Wherein, the middle part of the first circuit board is equipped with opening；Light passes sequentially through the camera lens, the optical filter and described
It is open to reaching described image sensor.
2. camera module according to claim 1, which is characterized in that further include:
Electronic component, the electronic component are set to the inside of the first circuit board.
3. camera module according to claim 1, which is characterized in that the optical filter is set to the first circuit board
The second face.
4. camera module according to claim 3, which is characterized in that the optical filter is attached at described by bonding agent
Second face of first circuit board.
5. camera module according to claim 1, which is characterized in that the optical filter is set to the first circuit board
The opening in.
6. camera module according to claim 1, which is characterized in that the optical filter is set to the fixed bracket
On.
7. camera module according to claim 1, which is characterized in that described image sensor passes through welding manner and institute
State first circuit board electrical connection.
8. camera module according to claim 1, which is characterized in that described image sensor is set to first electricity
In the opening of road plate.
9. camera module according to claim 1, which is characterized in that the fixed bracket passes through bonding agent and described the
Second face of one circuit board connects.
10. camera module according to claim 1, which is characterized in that the periphery of described image sensor is filled out
Fill material.
11. a kind of terminal characterized by comprising
Such as the described in any item camera modules of claim 1~10；And
Second circuit board, the second circuit board are electrically connected with first circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811358415.0A CN109451215A (en) | 2018-11-15 | 2018-11-15 | A kind of camera module and terminal |
| PCT/CN2019/112681 WO2020098459A1 (en) | 2018-11-15 | 2019-10-23 | Camera module and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811358415.0A CN109451215A (en) | 2018-11-15 | 2018-11-15 | A kind of camera module and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109451215A true CN109451215A (en) | 2019-03-08 |
Family
ID=65554359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811358415.0A Pending CN109451215A (en) | 2018-11-15 | 2018-11-15 | A kind of camera module and terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109451215A (en) |
| WO (1) | WO2020098459A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248006A (en) * | 2019-06-28 | 2019-09-17 | 李峥炜 | The frivolous 3D camera of mobile phone |
| CN110913097A (en) * | 2019-10-17 | 2020-03-24 | 华为技术有限公司 | Camera module and electronic equipment |
| WO2020098459A1 (en) * | 2018-11-15 | 2020-05-22 | 维沃移动通信（杭州）有限公司 | Camera module and terminal |
| CN112584005A (en) * | 2019-09-30 | 2021-03-30 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040150740A1 (en) * | 2003-01-30 | 2004-08-05 | Hsin Chung Hsien | Miniaturized image sensor module |
| CN106506929A (en) * | 2016-12-23 | 2017-03-15 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
| CN206136071U (en) * | 2016-07-03 | 2017-04-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101436603B (en) * | 2007-11-14 | 2010-11-10 | 鸿富锦精密工业（深圳）有限公司 | Imaging die set |
| CN103700634B (en) * | 2013-11-06 | 2016-06-22 | 南昌欧菲光电技术有限公司 | Camera module and encapsulating structure thereof and method for packing |
| CN104506759B (en) * | 2014-12-10 | 2018-08-07 | 广州大凌实业股份有限公司 | A kind of the camera module device and its assemble method of not circuit board |
| CN109451215A (en) * | 2018-11-15 | 2019-03-08 | 维沃移动通信（杭州）有限公司 | A kind of camera module and terminal |
-
2018
- 2018-11-15 CN CN201811358415.0A patent/CN109451215A/en active Pending
-
2019
- 2019-10-23 WO PCT/CN2019/112681 patent/WO2020098459A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040150740A1 (en) * | 2003-01-30 | 2004-08-05 | Hsin Chung Hsien | Miniaturized image sensor module |
| CN206136071U (en) * | 2016-07-03 | 2017-04-26 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and module of making a video recording |
| CN106506929A (en) * | 2016-12-23 | 2017-03-15 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020098459A1 (en) * | 2018-11-15 | 2020-05-22 | 维沃移动通信（杭州）有限公司 | Camera module and terminal |
| CN110248006A (en) * | 2019-06-28 | 2019-09-17 | 李峥炜 | The frivolous 3D camera of mobile phone |
| CN112584005A (en) * | 2019-09-30 | 2021-03-30 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
| CN110913097A (en) * | 2019-10-17 | 2020-03-24 | 华为技术有限公司 | Camera module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020098459A1 (en) | 2020-05-22 |
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Application publication date: 20190308 |