CN111666783A

CN111666783A - Substrate structure, sensor module, electronic device and mounting method

Info

Publication number: CN111666783A
Application number: CN201910164840.4A
Authority: CN
Inventors: 王曙光; 刘清文
Original assignee: Vkansee Beijing Technology Co ltd
Current assignee: Vkansee Beijing Technology Co ltd
Priority date: 2019-03-05
Filing date: 2019-03-05
Publication date: 2020-09-15

Abstract

The embodiment of the application discloses a substrate structure, a sensor module, electronic equipment and a mounting method of the sensor module. The substrate structure comprises at least one wire arranged in a substrate, wherein one end of the wire is used for being connected with a photoelectric conversion element, the other end of the wire is used for being connected with a printed circuit board, and one end connected with the photoelectric conversion element and the other end connected with the printed circuit board are arranged on the same side surface of the substrate. In the substrate structure, the lead enters and exits from the same surface of the substrate, so that the photoelectric conversion component and the printed circuit board can be arranged on the same side of the substrate when the substrate structure is applied, and the overall height of the assembly obtained by assembly is reduced. The substrate structure is applied to electronic equipment, so that the thickness of the electronic equipment can be reduced, and the realization of ultra-thin electronic equipment becomes possible.

Description

Substrate structure, sensor module, electronic device and mounting method

Technical Field

The application relates to the technical field of sensor modules, in particular to a substrate structure, a sensor module, electronic equipment and a mounting method of the sensor module.

Background

At present, electronic devices, such as mobile phones and tablet computers, are often equipped with a sensor module, such as a fingerprint module, for capturing and recognizing biometric images of a user, such as a fingerprint.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a general fingerprint module and its associated components. The fingerprint module 91 for collecting the fingerprint image of the user includes a substrate 911, a fingerprint sensor 912, an infrared filter 913, and a molding compound 914. Fingerprint sensor 912 sets up on substrate 911, and infrared filter 913 sets up on fingerprint sensor 912, and mould material 914 encapsulates the three into a whole, namely obtains fingerprint module 91. The lower surface of the mold 914 is connected to the printed circuit board 93 through the bonding pad 92, so that the electrical signal of the fingerprint sensor 912 can be transmitted to the printed circuit board 93 through the conducting wire penetrating from the upper surface of the substrate 911 to the lower surface of the substrate 911, and the printed circuit board 93 can process the electrical signals to identify the fingerprint image.

The whole of the mounted sensor module and the printed circuit board can be called an assembly, and the thickness of the assembly is large. If the thin-type electronic device is applied to an electronic device with a high requirement on thickness, such as an ultra-thin mobile phone, the thickness of the assembly can hinder the implementation of the thin-type electronic device. That is, the thickness of the assembly determines the overall thickness or the local thickness of the electronic device. Therefore, it is a problem to be solved by those skilled in the art if an assembly with a smaller thickness is developed.

Disclosure of Invention

In order to solve the problems, the application provides a substrate structure, which is applied to a sensor module, and when the sensor module is mounted with a printed circuit board, the thickness of an assembly part can be reduced, so that a foundation is laid for realizing ultra-thin electronic equipment.

In a first aspect, the application provides a substrate structure, including setting up an at least wire in the substrate, the one end of wire is used for being connected with photoelectric conversion components and parts, the other end of wire is used for being connected with printed circuit board, the one end of being connected with photoelectric conversion components and parts with the other end of being connected with printed circuit board set up in the same side surface of substrate.

With reference to the first aspect, in a first possible implementation manner of the first aspect, at least two conducting wires are arranged in the base material; wherein the content of the first and second substances,

at least one wire is a first wire, and one end of the first wire is connected with the first side of the photoelectric conversion component;

the second side of the photoelectric conversion component is opposite to the first side, at least one wire is a second wire, and one end of the second wire is connected with the second side.

With reference to the first aspect and the foregoing possible implementation manners, in a second possible implementation manner of the first aspect, at least one second conductive line is disposed above the first conductive line.

With reference to the first aspect and the foregoing possible implementation manners, in a third possible implementation manner of the first aspect, a connection line between one end and the other end of at least one first conducting wire is parallel to a connection line between one end and the other end of a second conducting wire.

With reference to the first aspect and the foregoing possible implementation manners, in a fourth possible implementation manner of the first aspect, connecting lines of one end and the other end of each of the first conductive lines are parallel to each other; and/or the presence of a gas in the gas,

and connecting lines of one end and the other end of each second lead are parallel to each other.

With reference to the first aspect and the foregoing possible implementation manners, in a fifth possible implementation manner of the first aspect, a connection line between one end and the other end of each of the first conductive lines and a connection line between one end and the other end of each of the second conductive lines are parallel to each other.

In a second aspect, the present application provides a sensor module, including a photoelectric conversion device, a light path structure component, a mold material, and any one of the substrate structures of the first aspect; wherein the content of the first and second substances,

the photoelectric conversion component is arranged on the base material structure and is connected with one end of a lead in the base material structure;

the light path structural component is arranged on the photoelectric conversion component;

the base material structure, the photoelectric conversion component and the light path structure assembly are packaged into a whole by the mold material.

With reference to the second aspect, in a first possible implementation manner of the second aspect, when the sensor module is mounted on a printed circuit board, the printed circuit board and the photoelectric conversion component are located on the same side of the substrate, and are connected to the other end of the wire.

With reference to the second aspect and the foregoing possible implementation manners, in a second possible implementation manner of the second aspect, the printed circuit board is a flexible printed circuit board.

With reference to the second aspect and the possible implementations described above, in a third possible implementation of the second aspect, the printed circuit board is connected to the other end of the wire through a pad; the sum of the heights of the bonding pad and the printed circuit board is less than or equal to the sum of the heights of the photoelectric conversion component and the optical path structural component.

With reference to the second aspect and the foregoing possible implementation manners, in a fourth possible implementation manner of the second aspect, the sensor module is applied to an electronic device having a display screen, a small hole layer is disposed in the display screen, at least one small hole for small hole imaging is disposed in the small hole layer, and the sensor module is disposed below the at least one small hole.

With reference to the second aspect and the foregoing possible implementation manners, in a fifth possible implementation manner of the second aspect, an air layer is spaced between the aperture layer and the optical path structure component of the sensor module.

With reference to the second aspect and the foregoing possible implementation manners, in a sixth possible implementation manner of the second aspect, a circle of glue is coated on the upper surface of the mold material, and the pore layer is disposed on the glue, so that an air layer is formed between the pore layer and the optical path structure component.

In a third aspect, the present application provides an electronic device including any one of the sensor modules of the second aspect.

In a fourth aspect, the present application provides a method for mounting a sensor module for mounting on a printed circuit board, comprising any one of the substrate structures of the first aspect; the installation method comprises the following steps:

and connecting a printed circuit board with the other end of the lead in the base material, wherein the printed circuit board and the other end of the lead are positioned on the same side of the base material.

With reference to the fourth aspect, in a first possible implementation manner of the fourth aspect, the sensor module further includes a photoelectric conversion device, a light path structure component, and a mold material; wherein the content of the first and second substances,

In the above substrate structure, the wire no longer penetrates through the upper and lower surfaces of the substrate, and the two ends of the wire are no longer respectively located on the upper and lower surfaces of the substrate, but are located on the same side surface of the substrate. When the substrate structure is used, the photoelectric conversion element and the printed circuit board can be arranged on the same side of the substrate, one end of the lead is connected with the photoelectric conversion element, and the other end of the lead is used for being connected with the printed circuit board. Therefore, the electric signals output by the photoelectric conversion element can be transmitted to the printed circuit board through the lead, so that the printed circuit board can process the electric signals. Simultaneously, with the substrate structure of this application and photoelectric conversion components and parts and printed circuit board assembly together, reduced the whole height of the subassembly that the assembly obtained. The substrate structure in the embodiment is applied to electronic equipment, so that the realization of ultra-thin electronic equipment becomes possible.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings in the embodiments will be briefly described below.

FIG. 1 is a schematic diagram of a fingerprint module and its associated components in the prior art;

FIG. 2 is a side view of one embodiment of a sensor module and printed circuit board of the present application;

FIG. 3 is a perspective view of one embodiment of a sensor module of the present application;

FIG. 4 is a perspective view of one of the embodiments of the substrate structure of the present application;

fig. 5 is a perspective view of a second embodiment of a sensor module according to the present application;

FIG. 6 is a perspective view of a second embodiment of a substrate structure of the present application;

FIG. 7 is a perspective view of a third embodiment of a substrate structure according to the present application;

fig. 8 is a side view of one of the embodiments of the electronic device of the present application.

Description of reference numerals:

FIG. 1: a fingerprint module 91; a substrate 911; a fingerprint sensor 912; an infrared filter 913; a mold material 914; a pad 92; a printed circuit board 93.

Fig. 2 to 8: a substrate 1; a wire 2; a first conductive line 21; one end 211 of the first conductive line; the other end 212 of the first wire; a second conductive line 22; one end 221 of the second wire; the other end 222 of the second wire; a photoelectric conversion element 3; a first side 31; a second side 32; an optical path structure component 4; a mould material 5; a pad 6; a printed circuit board 7; a connecting line 8; a display screen 100; a small pore layer 101; an aperture 1011; a light-transmitting portion 1021; a capacitor 11; a stress balance member 12.

Detailed Description

The following provides a detailed description of the embodiments of the present application.

Referring to fig. 2 to 4, in a first embodiment of the present application, a substrate structure is provided, where the substrate structure includes at least one conducting wire 2 disposed in a substrate 1, one end of the conducting wire 2 is used for connecting with a photoelectric conversion device 3, the other end of the conducting wire 2 is used for connecting with a printed circuit board 7, and one end connected with the photoelectric conversion device 3 and the other end connected with the printed circuit board 7 are disposed on the same side surface of the substrate 1.

The photoelectric conversion component is a component for converting an optical signal into an electrical signal. In the present application, an Image sensor such as a CMOS (Complementary Metal-Oxide-Semiconductor), cis (CMOS Image sensor), or CCD (Charge-coupled Device) may be used.

The lead 2 may be provided inside the base material 1, and only both ends of the lead may be exposed on the surface of the base material 1, or the entire lead may be provided on the upper surface or the lower surface of the base material 1. The wire 2 provided in the substrate 1 in the present application may include any of the above-described implementations. It should be noted that the wires 2 disposed in the substrate 1 may be arranged in a straight line or may be disposed in a bent manner, and this is not limited herein.

In the above substrate structure, the wires 2 no longer penetrate through the upper and lower surfaces of the substrate 1, and the two ends of the wires 2 are no longer respectively located on the upper and lower surfaces of the substrate 1, but located on the same side surface of the substrate 1. When the substrate structure is used, the photoelectric conversion element 3 and the printed circuit board 7 can be arranged on the same side of the substrate 1, one end of the lead 2 is connected with the photoelectric conversion element 3, and the other end of the lead 2 is used for being connected with the printed circuit board 7. Alternatively, one end of the lead 2 may be connected to the photoelectric conversion element 3 through a connection line 8. Thus, the electrical signals output from the photoelectric conversion device 3 can be transmitted to the printed circuit board 7 through the wires 2, so that the printed circuit board 7 can process the electrical signals.

The height of the photoelectric conversion element 3 is h2, the height of the base material 1 is h3, and the height of the printed circuit board 7 is h 4. According to the original assembly method, the height after the three parts are assembled together is (h2+ h3+ h4), and the height after the three parts are assembled together is [ h3+ max (h2, h4) ] when the base material structure is adopted for assembly, so that the overall height is reduced. The substrate structure in the embodiment is applied to electronic equipment, so that the realization of ultra-thin electronic equipment becomes possible.

In actual assembly, an adhesive layer (not shown) may be present between the photoelectric conversion element 3 and the substrate 1. No matter adopt the substrate structure among the prior art, still adopt the substrate structure in this embodiment, the height of bonding layer is all unchangeable after the assembly is accomplished to do not influence the realization of the beneficial effect of this application scheme, so also can regard as h2 with bonding layer and the holistic height of photoelectric conversion components and parts 3.

It should be noted that, in actual assembly, the printed circuit board 7 and the other end of the lead 2 may be connected via a PAD 6 (PAD). The pads 6 may be implemented using conventional technology, for example, a land grid array package pad (LGAPAD) or the like may be used. As shown in the schematic diagram of fig. 2, the height of the bonding pad 6 is represented by h5, and the height of the assembly assembled by using the substrate structure in the present embodiment is reduced compared to the conventional assembly (h4+ h 5).

Referring to fig. 3 and 4, at least two wires 2 may be optionally disposed in the substrate 1. At least one of the conductive wires 2 is a first conductive wire 21, and one end 211 of the first conductive wire is connected to the first side 31 of the photoelectric conversion device 3. The second side 32 of the photoelectric conversion element 3 is disposed opposite to the first side 31. At least one of the wires 2 is a second wire 22, one end 221 of which is connected to the second side 32.

When being provided with many wires 2 in the substrate 1, through setting up the one end (211 and 221) of many wires 2 in the both sides of photoelectric conversion components and parts 3 to make arranging of many wires 2 more reasonable, be convenient for the production and the follow-up assembly of substrate structure.

Alternatively, referring to fig. 3 and 4, when the wires 2 are disposed inside the substrate 1, at least one second wire 22 is disposed above the first wire 21 in the substrate 1, so as to make the arrangement of the wires 2 more reasonable.

It should be noted that, when the wires 2 are disposed inside the substrate 1, in order to make both ends of the first wire 21 and both ends of the second wire 22 on the same surface of the substrate 1, there may be a local curved line section near the surface of the substrate 1 where the first wire 21 and the second wire 22 are close to each other. The second conductive line 22 is disposed above the first conductive line 21 in this embodiment, which mainly means that the horizontal segment of the second conductive line 22 is disposed above the horizontal segment of the first conductive line 21.

It should also be noted that the first feature "on," "above," and "above" the second feature in this application includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

Alternatively, referring to fig. 4, when the wires 2 are disposed inside the substrate 1 and only two ends thereof are exposed on the surface of the substrate 1, a connection line L1 between one end 211 and the other end 212 of at least one first wire is parallel to or overlaps with a connection line L2 between one end 221 and the other end 222 of at least one second wire. When at least one L1 and at least one L2 overlap, it indicates that at least one second conductive line 22 is directly above the first conductive line 21.

In fig. 3 to 6, in order to avoid the situation that the plurality of first wires 21 and the plurality of second wires 22 are all drawn in the figures to cause excessively messy structures, only one first wire 21 and one second wire 22 are schematically drawn. In practice, a first wire exists between one end 211 of each pair of first wires and the other end 212 of the first wires; a second wire is present between one end 221 of each pair of second wires and the other end 222 of the second wire.

Alternatively, referring to fig. 7, when the wires 2 are entirely disposed on the surface of the substrate 1, a connection line L1 between the one end 211 and the other end 212 of at least one first wire is parallel to a connection line L2 between the one end 221 and the other end 222 of at least one second wire.

Referring to fig. 3, 4 and 7, optionally, when a plurality of first conductive lines 21 are disposed in the substrate 1, a connecting line L1 between one end 211 of each first conductive line and the other end 212 of each first conductive line is parallel to each other. In this case, the heights of the plurality of first wires 21 in the substrate 1 may be the same or different, and the present application does not limit this.

Alternatively, when a plurality of second conductive lines 22 are provided in the substrate 1, the connecting line L2 of one end 221 of each second conductive line and the other end 222 of the second conductive line is parallel to each other. In this case, the heights of the plurality of second wires 22 in the substrate 1 may be the same or different, and the present application does not limit this.

The above-described conductor arrangements may also be combined with each other. In different application scenes, different lead arrangement modes can be set for the substrate structure so as to facilitate the production and subsequent assembly of the substrate structure.

Alternatively, referring to fig. 5 to 7, when the substrate 1 is provided with a plurality of first conductive lines 21 and a plurality of second conductive lines 22, each L1 and each L2 may also be parallel to each other, that is, all L1 and all L2 are parallel to each other. At this time, since the first wires 21 and the second wires 22 are staggered in the horizontal position in the substrate 1, the heights of the first wires 21 and the second wires 22 in the substrate 1 may be the same or different, and the arrangement of the wires may be specifically set according to different practical application scenarios or the convenience requirement of substrate structure processing.

Alternatively, when a plurality of first conductive lines 21 and a plurality of second conductive lines 22 are provided in the substrate 1, the first conductive lines 21 and the second conductive lines 22 may be staggered in a horizontal position, as shown in fig. 5 to 7.

Furthermore, the first lines 21 and the second lines 22 may also be arranged in sections, i.e. all first lines 21 are arranged in one horizontal section and all second lines 22 are arranged in another horizontal section.

In a second embodiment of the present application, a sensor module is also provided. Referring to fig. 2 to 6, the sensor module may include a photoelectric conversion device 3, a light path structure component 4, a mold material 5, and any one of the substrate structures in the first embodiment; the photoelectric conversion component 3 is arranged on the base material structure, and the photoelectric conversion component 3 is connected with one end of the lead 2 in the base material structure; the light path structural component 4 is arranged on the photoelectric conversion component 3; the base material structure, the photoelectric conversion component 3 and the light path structure component 4 are packaged into a whole by the mold material 5. When the sensor module is mounted on the printed circuit board 7, the printed circuit board 7 and the photoelectric conversion element 3 are located on the same side of the substrate 1, and are connected to the other end of the lead 2.

The light path structure component is a component through which light can pass, and can be an infrared filter, infrared glass and the like. The optical path structure components may be used to provide image distance for pinhole imaging, and/or to control field angle by refractive index changes, etc.

The mold material in the present application may be an existing rigid mold material, such as a PCB mold material. The main effect of mould material is the relative position of fixed photoelectric conversion components and parts 3, light path structure subassembly 4 and substrate 1, keeps apart photoelectric conversion components and parts 3 and light path structure subassembly 4 with the external world simultaneously to play the effect of physical protection to photoelectric conversion components and parts 3 and light path structure subassembly 4. Generally, the height of the mold material after packaging is kept flush with the height of the photoelectric conversion component 3 and the optical path structure component 4, and the height of the whole sensor module is not increased additionally, as shown in fig. 2, 3 and 5.

When the sensor module is used, light rays pass through the light path structure component 4 and are subjected to photoelectric conversion on the photoelectric conversion component 3. Then, the electrical signals output from the photoelectric conversion element 3 can be transmitted to the printed circuit board 7 through the lead 2, so that the printed circuit board 7 can process the electrical signals.

The height of the light path structure component 4 is h1, the height of the photoelectric conversion component 3 is h2, the height of the base material 1 is h3, and the height of the printed circuit board 7 is h 4. According to the original assembly method, the height of the assembly after the four assemblies are assembled together is (h1+ h2+ h3+ h4), and the height of the assembly after the four assemblies are assembled together is { h3+ max [ (h1+ h2), h4] }, so that the overall height of the assembly is reduced. The assembly is applied to the electronic device, so that the realization of an ultra-thin electronic device is possible.

Note that, as described in the first embodiment, the printed circuit board 7 and the other end of the lead 2 may be connected through the pad 6 at the time of actual assembly. As shown in fig. 2, the height of the pad 6 is indicated by h 5. Alternatively, the sum of the heights of the lands 6 and the printed circuit board 7 (h4+ h5) is smaller than or equal to the sum of the heights of the photoelectric conversion element 3 and the optical path structure component 4 (h1+ h 2). In this case, the height of the assembly in the present embodiment is reduced (h4+ h5) as compared with the existing assembly. When (h4+ h5) > (h1+ h2), the overall height of the assembly is (h3+ h4+ h5), which is reduced compared to the conventional assembly (h1+ h 2).

In one example, the height h3 of the base material 1 is 170 μm, the height h2 of the photoelectric conversion element 3 is 150 μm, the height h1 of the optical path structure component 4 is 130 μm, the height of the printed circuit board 7 is 250 μm, and the height of the land 6 is 30 to 50 μm. If the substrate and the corresponding assembly method in the prior art are adopted, the height of the assembly after the sensor module and the printed circuit board are assembled is 780-800 μm. If the substrate structure and the corresponding assembly method in the present application are adopted, the height of the assembly is 450 μm, which reduces 330 and 350 μm.

Alternatively, the Printed Circuit board 7 is a Flexible Printed Circuit (FPC). The flexible printed circuit board is flexible and thin, so that the sum of the heights of the printed circuit board and the soldering pad is kept at the height of and below the photoelectric conversion component and the optical path structure component.

Optionally, referring to fig. 8, the sensor module may be applied to an electronic device having a display screen 100, the display screen 100 is provided with a small hole layer 101, the small hole layer 101 is provided with at least one small hole 1011 for small hole imaging, and the sensor module is disposed below the at least one small hole 1011. Thus, light rays above the display screen 100 pass through the small holes 1011 and pass through the optical path structure component 4, and form image spots on the photoelectric conversion component 3 according to the principle of small hole imaging. The photoelectric conversion component 3 outputs the image spots in the form of electric signals so as to process the electric signals subsequently to form an image, thereby completing the image acquisition process. The sensor module is applied to electronic equipment and can be used for collecting biological characteristic images such as fingerprints, palm prints and human faces.

Optionally, a light-transmitting portion 1021 is correspondingly disposed above the small hole 1011 in the small hole layer 101, so that light can pass through other structures above the small hole layer 101, such as a liquid crystal layer, an optical film, etc., and then pass through the small hole 1011 to reach the sensor module. The light-transmitting portion 1021 and the small hole 1011 may have the same or different sizes, and the present application does not limit the same.

The aperture layer 101 and the optical path structure component 4 may be closely attached to each other, or may be separated by a thin air layer, which is not limited in the present application. When the sensor module and the display screen with the structure are installed, a circle of glue (not shown in the figure) can be coated on the upper surface of the die material 5, and air is reserved in the glue ring. The small hole layer is provided on the glue, so that an air layer is formed between the small hole layer 101 and the optical path structural member 4, thereby spacing the small hole layer 101 from the optical path structural member 4. When an air layer is arranged between the small hole layer 101 and the optical path structure component 4, due to the change of the refractive index, part of stray light in the light passing through the small hole 1011 can disappear, and the influence of the stray light on image acquisition is avoided.

Alternatively, in the sensor module, other common components may be disposed on the substrate 1. For example, referring to fig. 8, a capacitor 11 is further disposed on the substrate 1. For another example, a stress balance member 12 is further provided on the base material 1, and the material of the stress balance member 12 may be the same as or similar to that of the photoelectric conversion element 3. The sensor module may be cut or cooled during the process of processing and mounting, at this time, the interconnected photoelectric conversion device 3 and the substrate 1 are easily deformed to generate stress, and the stress balancing member 12 may balance the stress between the photoelectric conversion device 3 and the substrate 1. The two components are packaged into a whole by a mould material 5 together with the base material structure, the photoelectric conversion component 3 and the light path structure component 4.

Referring to fig. 8, in the present embodiment, an electronic device is further provided, where the electronic device includes any one of the sensor modules. Optionally, the electronic device may further include a display screen 100, wherein a small hole layer 101 is disposed in the display screen 100, one or more small holes 1011 for small hole imaging are disposed in the small hole layer 101, and the sensor module is disposed below the one or more small holes 1011. Thus, light can pass through the aperture 1011 to reach the sensor module and be converted into an electrical signal by the sensor module.

The electronic device may further comprise a printed circuit board 7, the printed circuit board 7 being connected to the other ends 212 and 222 of the wires in the substrate 1, and the printed circuit board 7 being on the same side of the substrate 1 as the other ends 212 and 222 of the wires. That is, the printed circuit board 7 is on the same side of the substrate 1 as the photoelectric conversion element 3 and the optical path structure component 4.

Since the electronic device includes any one of the sensor modules, the electronic device has the beneficial effects of the sensor module, and the description thereof is omitted.

In a third embodiment of the present application, a method of mounting a sensor module for mounting on a printed circuit board is provided. The sensor module includes any of the substrate structures of the first embodiment. The installation method comprises the following steps:

s100: and connecting a printed circuit board with the other end of the lead in the base material, wherein the printed circuit board and the other end of the lead are positioned on the same side of the base material.

The substrate structure and the printed circuit board can refer to the description related to the first embodiment, and the sensor module can refer to the description related to the second embodiment, which is not repeated herein.

By adopting the sensor module mounting method, the sensor module and the printed circuit board can be conveniently mounted together, and industrial mounting is convenient to realize. The mounted sensor module and the printed circuit board can be regarded as a whole, i.e. an assembly. When the assembly is applied to electronic equipment, the assembly is integrally installed in the electronic equipment, and the installation process is very convenient. Compared with the prior art, the overall height of the assembled part after being installed is greatly reduced, so that a foundation is laid for realizing the ultrathin electronic equipment.

Optionally, referring to fig. 2, fig. 3 and fig. 5, the sensor module further includes a photoelectric conversion device 3, a light path structure component 4 and a mold 5. The photoelectric conversion component 3 is arranged on the base material structure, and the photoelectric conversion component 3 is connected with one end of the lead 2 in the base material structure; the light path structural component 4 is arranged on the photoelectric conversion component 3; the base material structure, the photoelectric conversion component 3 and the light path structure component 4 are packaged into a whole by the mold material 5.

Before the other end of the lead is connected with the printed circuit board, the substrate 1, the photoelectric conversion component 3, the optical path structure component 4 and the mold material 5 of the sensor module can be assembled into a whole, and then the sensor module and the printed circuit board are installed together, so that industrial installation is realized.

The term "plurality" in this specification means two or more unless otherwise specified. In the embodiments of the present application, the words "first", "second", and the like are used to distinguish the same items or similar items having substantially the same functions and actions. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.

It should be understood that in the description of the present application, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present application.

It should be understood that like parts are referred to each other in this specification for the same or similar parts between the various embodiments. In particular, for embodiments of the electronic device, since it is substantially similar to the embodiments of the substrate structure and the sensor module, the description is relatively simple, and the relevant points can be referred to the description of the method embodiments. The above-described embodiments of the present invention should not be construed as limiting the scope of the present invention.

Claims

1. The utility model provides a substrate structure, is including setting up at least a wire in the substrate, its characterized in that, the one end of wire is used for being connected with photoelectric conversion components and parts, the other end of wire is used for being connected with printed circuit board, the one end of being connected with photoelectric conversion components and parts with the other end of being connected with printed circuit board set up in the same side surface of substrate.

2. The substrate structure according to claim 1, wherein at least two wires are provided in the substrate; wherein the content of the first and second substances,

3. The substrate structure of claim 2, wherein at least one of the second conductive lines is disposed over the first conductive line.

4. The substrate structure according to claim 2, wherein at least one line connecting one end and the other end of the first wire is parallel to a line connecting one end and the other end of the second wire.

5. A substrate structure according to any one of claims 2 to 4, wherein the line connecting one end and the other end of each of the first wires is parallel to each other; and/or the presence of a gas in the gas,

6. The substrate structure according to any one of claims 2 to 4, wherein a line connecting one end and the other end of each of the first conductive lines and a line connecting one end and the other end of each of the second conductive lines are parallel to each other.

7. A sensor module comprising a photoelectric conversion element, a light path structure component, a mold material, and the substrate structure according to any one of claims 1 to 6; wherein the content of the first and second substances,

8. The sensor module according to claim 7, wherein the printed circuit board is located on the same side of the substrate as the photoelectric conversion element and is connected to the other end of the lead when the sensor module is mounted on the printed circuit board.

9. The sensor module of claim 8, wherein the printed circuit board is a flexible printed circuit board.

10. The sensor module of claim 8, wherein the printed circuit board is connected to the other end of the wire by a pad; the sum of the heights of the bonding pad and the printed circuit board is less than or equal to the sum of the heights of the photoelectric conversion component and the optical path structural component.

11. The sensor module according to any one of claims 7-10, wherein the sensor module is applied to an electronic device having a display screen, wherein a small hole layer is disposed in the display screen, at least one small hole for small hole imaging is disposed in the small hole layer, and the sensor module is disposed below the at least one small hole.

12. A sensor module according to claim 11, wherein the aperture layer is spaced from the optical path structure components of the sensor module by an air layer.

13. The sensor module of claim 12, wherein the upper surface of the mold material is coated with a ring of glue, and the orifice layer is disposed on the glue to form an air layer between the orifice layer and the optical path structure component.

14. An electronic device, characterized in that it comprises a sensor module according to any one of claims 7 to 13.

15. A method of mounting a sensor module for mounting on a printed circuit board, comprising the substrate structure of any one of claims 1-6; the installation method comprises the following steps:

16. The method of claim 15, wherein the sensor module further comprises a photoelectric conversion component, a light path structure component and a mold material; wherein the content of the first and second substances,