CN210109841U - Optical fingerprint identification module and electronic equipment - Google Patents

Abstract

The application provides an optics fingerprint identification module and electronic equipment, the module includes: a photosensor having opposing first and second surfaces, the first surface comprising: the fingerprint identification device comprises a photosensitive area for acquiring fingerprint information and at least one first bonding pad electrically connected with the photosensitive area; the cover plate is provided with a third surface and a fourth surface which are opposite, the third surface is positioned above the first surface, and the third surface is provided with a photosensitive hole corresponding to the photosensitive area; a groove for accommodating the photoelectric sensor is formed in the fourth surface, the groove at least covers the photosensitive area and the first bonding pad, and a conductive mechanism is arranged in the groove; the circuit board is arranged in parallel with the photoelectric sensor and can be electrically connected with the at least one first bonding pad through the conductive mechanism. The application provides an optics fingerprint identification module simple structure when guaranteeing module structure bulk strength, can satisfy terminal equipment to the miniaturized demand of module.

Description

Optical fingerprint identification module and electronic equipment

Technical Field

The utility model relates to a fingerprint identification technical field, concretely relates to optics fingerprint identification module and electronic equipment.

Background

The technology of optical fingerprint recognition under screen is rapidly developed and applied because it does not occupy the surface space of electronic devices (e.g., smart phones). The optical fingerprint identification technology is adopted, light reflected by human fingerprints needs to be collected, and optical signals are converted into electric signals to generate fingerprint images.

In view of this, the prior art generally adopts an optical fingerprint identification module as shown in fig. 1 to collect fingerprint information. As shown in fig. 1, the photosensor 1 is generally disposed on the circuit board 2 through a connection portion 3, and the connection manner of wire bonding is adopted to realize the electrical signal communication between the photosensor 1 and the circuit board 2. Above the circuit board 2 is also arranged a holder 4 for carrying an optical lens 5. During working, an optical signal carrying fingerprint information after being reflected by an identified object is incident to the photosensitive area 11 on the photoelectric sensor 1 through the optical lens 5 on the bracket 4, so that the fingerprint information is acquired.

However, in the above fingerprint identification module structure, the photoelectric sensor 1 is disposed above the circuit board 2, and belongs to a cob (chip board) structure, and the circuit board 2 is further provided with the bracket 4 and the optical lens 5, which further results in a thicker and larger overall structure of the module. Because the space is limited under the screen, if the fingerprint identification module is thicker and larger in structure, the space of the battery is extruded, and the cruising ability of the electronic equipment is influenced.

SUMMERY OF THE UTILITY MODEL

For realizing above-mentioned purpose, this application provides an optics fingerprint identification module and electronic equipment, when guaranteeing module structure bulk strength, can satisfy terminal equipment to the miniaturized demand of module, the technical scheme who provides as follows:

an optical fingerprint identification module, comprising:

a photosensor having opposing first and second surfaces, the first surface comprising: the fingerprint identification device comprises a photosensitive area for acquiring fingerprint information and at least one first bonding pad electrically connected with the photosensitive area;

the cover plate is provided with a third surface and a fourth surface which are opposite, the third surface is positioned above the first surface, and the third surface is provided with a light sensing hole corresponding to the light sensing area; a groove for accommodating the photoelectric sensor is formed in the fourth surface, the groove at least covers the photosensitive area of the first surface and the first bonding pad, and a conductive mechanism is arranged in the groove;

the circuit board is arranged in parallel with the photoelectric sensor and can be electrically connected with at least one first welding disc through the conductive mechanism.

As a preferred embodiment, the circuit board has a fifth surface and a sixth surface opposite to each other, the fifth surface is close to the first surface, and the fifth surface includes: and the groove covers the photosensitive area, the first bonding pad and the second bonding pad.

In a preferred embodiment, the groove covers the first surface of the photosensor, and an outer contour length of the groove is smaller than an outer contour length of the fourth surface and larger than the outer contour length of the first surface.

As a preferred embodiment, the first surface of the photosensor further includes a peripheral region surrounding the photosensitive region, the peripheral region being provided with a plurality of the first pads, the plurality of the first pads being arranged around a circumference of the peripheral region.

As a preferred embodiment, the number of the conductive mechanisms is the same as the number of the first pads, and each of the conductive mechanisms includes: a conductive routing layer provided with a first bump for bonding with the first pad.

As a preferred embodiment, at least one of the conductive mechanisms includes: and the second bump is electrically connected with the conductive wiring layer, the second bump is used for electrically connecting the second bonding pads, and at least one first bonding pad can be electrically connected with the second bonding pad sequentially through the first bump, the conductive wiring layer and the second bump.

As a preferred embodiment, the groove is provided with a protruding portion, the protruding portion faces a fifth surface of the circuit board, the second bump is provided on the protruding portion, and the second bump is located between the second pad and the protruding portion.

In a preferred embodiment, the protruding portion has a first predetermined thickness, the circuit board has a second predetermined thickness, and the photosensor has a third predetermined thickness, which is the sum of the first predetermined thickness and the second predetermined thickness.

In a preferred embodiment, the photosensitive holes are provided in plurality, and the photosensitive holes are in a straight-through straight pipe structure.

As a preferred embodiment, the third surface of the cover plate is provided with a filter, and the filter covers the light sensing hole.

As a preferred embodiment, the module further comprises: the filling part can transmit light, and at least covers the groove and the photosensitive area.

An electronic device, comprising: a display screen; the optical fingerprint identification module set up the below of display screen.

Has the advantages that:

the application provides an optics fingerprint identification module is provided with the apron in photoelectric sensor's top, and the surface of apron is seted up with the corresponding sensitization hole in photoelectric sensor's sensitization region, and the light after being discerned the thing reflection can be through this sensitization hole incident to in the sensitization region. The cover plate is provided with a groove for accommodating the photoelectric sensor, the groove at least covers the photosensitive area and the first bonding pad of the first surface, and the cover plate can protect and prevent dust for the photosensitive area of the first surface.

Further, the circuit board with photoelectric sensor sets up side by side, is provided with electrically conductive mechanism in the recess, and the circuit board passes through electrically conductive mechanism to realize the electric connection with photoelectric sensor to can realize the ultra-thin of whole fingerprint identification module structure, satisfy terminal equipment to the miniaturized demand of module.

Specific embodiments of the present application are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the application may be employed. It should be understood that the embodiments of the present application are not so limited in scope.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive labor.

FIG. 1 is a schematic diagram of an optical fingerprint recognition module in the prior art;

fig. 2 is a schematic diagram of an optical fingerprint identification module according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a cover plate according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of another cover plate according to an embodiment of the present application.

Description of reference numerals:

1. a photosensor; 11. a light-sensitive region; 12. a first pad; 2. a circuit board; 21. a second pad; 3. a connecting portion; 4. a support; 5. an optical lens; 6. a cover plate; 61. an optical filter; 62. a photosensitive hole; 63. a boss portion; 7. a conductive mechanism; 71. a first bump; 72. and a second bump.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the accompanying drawings and specific embodiments, it should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope, and after reading the present invention, the modifications of the various equivalent forms of the present invention by those skilled in the art will fall within the scope defined by the present application.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

It should be noted that the fingerprint recognition described above is only a common example of using the user's biometric features. In the embodiments envisioned, those skilled in the art can extend the technical solutions of the embodiments provided in the present application to any suitable biometric authentication scenario. For example, a scene for verifying by acquiring biometric information of the iris of the user is not limited in the embodiments of the present invention.

The following is set forth in a scenario in which user fingerprint information is obtained as a main description. However, as can be seen from the above description, the scope of the embodiments of the present invention is not limited thereto. In this specification, the direction of the optical fingerprint recognition module of the embodiment of the present invention, which is directed or facing to the user in the normal use state, is defined as "up", and the opposite direction, or the direction away from the user is defined as "down".

The optical fingerprint recognition module according to an embodiment of the present invention will be explained and explained with reference to fig. 1 to 4. It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present invention. And for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments, and the descriptions of the same components may be mutually referred to and cited.

Specifically, an upward direction illustrated in fig. 1 to 4 is defined as "up", and a downward direction illustrated in fig. 1 to 4 is defined as "down". It should be noted that the definitions of the directions in the present specification are only for convenience of describing the technical solution of the present invention, and do not limit the directions of the optical fingerprint identification module according to the embodiments of the present invention in other scenarios, including but not limited to use, test, transportation, and manufacture, which may cause the orientation of the device to be reversed or the position of the device to be changed.

Referring to fig. 2 to 4, an optical fingerprint identification module according to an embodiment of the present application includes: a photosensor 1, the photosensor 1 having opposing first and second surfaces, the first surface comprising: the fingerprint identification device comprises a photosensitive area 11 for acquiring fingerprint information and at least one first bonding pad 12 electrically connected with the photosensitive area 11; the cover plate 6 is provided with a third surface and a fourth surface which are opposite, the third surface is positioned above the first surface, and the third surface is provided with a light sensing hole 62 corresponding to the light sensing area 11; a groove for accommodating the photoelectric sensor 1 is formed in the fourth surface, the groove at least covers the photosensitive area 11 of the first surface and the first bonding pad 12, and a conductive mechanism 7 is arranged in the groove; the circuit board 2 is arranged in parallel with the photoelectric sensor 1, and the circuit board 2 can be electrically connected with at least one first bonding pad 12 through the conductive mechanism 7.

The application provides an optics fingerprint identification module is provided with apron 6 in photoelectric sensor 1's top, and the surface of apron 6 is seted up the sensitization hole 62 corresponding with photoelectric sensor 1's sensitization region 11, and the light after being discerned the thing reflection can be incited to in the sensitization region 11 through this sensitization hole 62. Be provided with the recess that is used for holding photoelectric sensor 1 on the apron 6, the recess covers the photosensitive area 11 and the first pad 12 of first surface at least to fingerprint identification module's whole volume has been reduced.

Further, circuit board 2 with photoelectric sensor 1 sets up side by side, is provided with electrically conductive mechanism 7 in the recess, and circuit board 2 realizes through electrically conductive mechanism 7 with photoelectric sensor 1's electric connection to can realize the ultra-thin of whole fingerprint identification module structure, satisfy the demand of terminal equipment to the module miniaturization.

Specifically, the photoelectric sensor 1 may be one of a silicon-based chip, a glass-based chip, or a plastic-based chip, and the present embodiment is not limited to the above, and includes a photosensitive area 11 for acquiring fingerprint information and a circuit portion for processing information acquired by the photosensitive area 11. The photosensitive region 11 may convert an optical signal into an electrical signal to generate a fingerprint image. The photoelectric sensor 1 can further send the fingerprint image to an image processor connected with the signal, the image processor carries out image processing to obtain a fingerprint signal, and fingerprint identification is carried out on the fingerprint signal through an algorithm.

The photosensor 1 has first and second opposite surfaces, the first surface comprising: the fingerprint sensing device comprises a photosensitive area 11 for acquiring fingerprint information and a first bonding pad 12 electrically connected with the photosensitive area 11, wherein the number of the first bonding pads 12 is at least one, and at least one first bonding pad 12 can be electrically connected with the circuit part and the photosensitive area 11.

A cover plate 6 is disposed over the first surface of the photosensor 1. The cover plate 6 may be a silicon cover plate. The cover plate 6 has a thickness and has third and fourth opposing surfaces that are two planes that are parallel or substantially parallel to each other. The third surface is located the top of first surface, light sensing hole 62 can be seted up through the sculpture technology to the third surface, light sensing hole 62 is the perforating hole, light sensing hole 62 can with photoelectric sensor 1's light sensing region 11 corresponds to light can pass through light sensing hole 62 incides to photoelectric sensor 1 in the light sensing region 11.

A filter 61 is disposed on a third surface of the cover plate 6, and the filter 61 covers the light sensing hole 62. Specifically, the optical filter 61 may be adhered to the third surface of the cover plate 6 by means of adhesive. The optical filter 61 is used for at least partially filtering out noise light mixed in the target signal light, so as to improve the sensing of the photoelectric sensor 1 on the received light and improve the imaging quality.

The reflected light filtered by the filter 61 is incident on the photosensitive area 11 on the first surface of the photoelectric sensor 1 through the photosensitive hole 62. The photosensitive holes 62 are provided in plurality, and the photosensitive holes 62 are straight-through straight-tube structures. The area of the light sensing hole 62 is smaller than that of the first surface, the area of the first surface corresponding to the light sensing hole 62 forms a light sensing area 11, the other part of the first surface is a peripheral area surrounding the light sensing area 11, the peripheral area can be used for forming the circuit part, and the circuit part is provided with a first bonding pad 12.

In this embodiment, the inner wall of the light sensing hole 62 is a straight-through tube structure, which is used to collect light so as to facilitate the fingerprint recognition of the photoelectric sensor 1. For example, two adjacent rays in the reflected light are initially divergent, and the reflected light becomes parallel light when the hand reflected light passes through the plurality of light sensing holes 62. That is, after the reflected light passes through the light sensing hole 62, the distance between two adjacent light rays therein is kept constant while propagating. Therefore, more reflected light can enter the photosensitive area 11 on the photoelectric sensor 1 through the photosensitive hole 62, and the fingerprint information collected by the photosensitive area 11 is more complete, so that the fingerprint can be identified conveniently.

Further, a groove for accommodating the photoelectric sensor 1 is formed in the fourth surface of the cover plate 6, and the photoelectric sensor 1 can be embedded into the groove. The groove at least can cover the photosensitive area 11 and the first bonding pad 12, a conductive mechanism 7 is further arranged in the groove, and at least one first bonding pad 12 can be electrically connected with the circuit board 2 through the conductive mechanism 7.

In the present embodiment, the groove covers the first surface of the photosensor 1, and the outer contour length of the groove is smaller than the outer contour length of the fourth surface and larger than the outer contour length of the first surface.

As shown in fig. 3 and 4, the outer contour length of the groove is smaller than the length of the fourth surface of the cover plate 6 and larger than the outer contour length of the first surface of the photoelectric sensor 1, and the groove covers the first surface. Photoelectric sensor 1's first surface can imbed completely to the recess in to apron 6 can play the guard action for photoelectric sensor 1's surface, is located the outside other regions of recess and can provides the holding power for whole photoelectric sensor 1, thereby can guarantee the mechanical strength of this fingerprint identification module. Furthermore, the length of the outline of the groove is larger than that of the outline of the first surface, so that at least part of the circuit board 2 can be embedded into the groove, the circuit board 2 and the photoelectric sensor 1 are arranged in parallel, and the overall thickness of the fingerprint identification module is reduced.

As shown in fig. 3 and 4, the embodiment of the present application provides two structures of the cover plate 6, and the shape and size of the groove on the fourth surface of the cover plate 6 need to be adjusted adaptively according to the sizes of the photosensor 1 and the circuit board 2, and the present application is not limited in particular. During packaging, the circuit board 2 and the photoelectric sensor 1 are embedded into the groove and electrically connected through the conductive mechanism 7 in the groove.

The Circuit board 2 may be specifically an FPC (Flexible Printed Circuit board). Circuit board 2 sets up in the below of apron 6 with photoelectric sensor 1 side by side to can reduce the whole thickness of fingerprint identification module. The circuit board 2 has a fifth surface and a sixth surface opposite to each other, the fifth surface is close to the first surface, and the fifth surface comprises: a second pad 21 electrically connectable to the conductive means 7. At least one first pad 12 is thus in electrical signal communication with the circuit board 2 by said conductive means 7. The circuit board 2 is at least partially located in the groove, the groove covers the photosensitive area 11, the first bonding pad 12 and the second bonding pad 21, and a part of the circuit board 2 located outside the groove can be connected with an external circuit. In particular, the fifth surface of the circuit board 2 is used for connecting with an external circuit, so that the external circuit is arranged together with the cover plate 6, further reducing the thickness of the terminal device.

In the present embodiment, the peripheral region is provided with a plurality of the first pads 12, and the plurality of the first pads 12 are provided around the circumferential direction of the peripheral region. The number of the first pads 12 is not particularly limited, and at least one first pad 12 is used for electrically connecting with the second pad 21 of the circuit board 2.

Specifically, the number of the conductive mechanisms 7 may be the same as that of the first pads 12, and the conductive mechanisms 7 may be disposed corresponding to the first pads 12. In the present embodiment, a plurality of the first pads 12 are provided around the circumferential direction of the peripheral region, and the conductive mechanism 7 is provided at a position corresponding to the position of the first pad 12.

Further, each of the conductive mechanisms 7 may specifically include: a conductive wiring layer provided with a first bump 71 for bonding with the first pad 12. The conductive wiring layer may be formed on or in the groove by an rdl (redistribution layer) process, the conductive wiring layer being adjacent to the first surface. The conductive wiring layer is provided with a first bump 71, and the first bump 71 is a metal bump with conductive performance, preferably made of copper.

Preferably, the first bump 71 is soldered to the first pad 12, thereby ensuring stability when the photosensor 1 is connected to the cover plate 6. Stability and symmetry when the photosensor 1 is connected to the cover plate 6 can be ensured by providing the plurality of first pads 12 on the first surface of the photosensor 1. By ensuring the connection stability of the photoelectric sensor 1 and the cover plate 6, the alignment accuracy of the photosensitive hole 62 region and the photosensitive region 11 on the third surface of the cover plate 6 can be ensured. In addition, the cover plate 6 is provided with the photosensitive hole with the through structure, the optical lens 5 for converging light rays and the support 4 for fixing the optical lens 5 do not need to be arranged, the alignment process is simple, and the manufacturing cost is reduced.

In the present embodiment, at least one of the conductive mechanisms 7 includes: and a second bump 72 electrically connected to the conductive wiring layer, wherein the second bump 72 is used for electrically connecting to the second pad 21, and at least one of the first pads 12 can be electrically connected to the second pad 21 sequentially through the first bump 71, the conductive wiring layer, and the second bump 72.

The second bump 72 is a metal bump with conductive property, and the preferred material is copper. Preferably, the second bump 72 and the second pad 21 are electrically connected through a conductive adhesive film. The Conductive adhesive Film may be an Anisotropic Conductive Film (ACF), and the Conductive adhesive Film may perform a connection function while being Conductive. Specifically, the conductive adhesive film may be coated on the second pad 21 of the circuit board 2, and the second pad 21 and the second bump 72 are pressed together to achieve electrical conduction.

In one embodiment, as shown in fig. 4, the groove is provided with a protruding portion 63, the protruding portion 63 faces the fifth surface of the circuit board 2, the second bump 72 is provided on the protruding portion 63, and the second bump 72 is located between the second pad 21 and the protruding portion 63.

Specifically, a protruding portion 63 may be provided in the groove so that at least one conductive wiring layer extends from the vicinity of the first pad 12 onto the protruding portion 63, and a second bump 72 is provided on the protruding portion 63. The protruding direction of the protruding portion 63 is directed to the fifth surface of the circuit board 2, and the second bump 72 is located between the second pad 21 and the protruding portion 63. In order to ensure the stability of the convex portion 63 when engaging with the second land 21 of the circuit board 3, the surface of the convex portion 63 facing the fifth surface is a plane. The thickness of the protruding portion 63 is not limited in this application, and may be adjusted according to the thickness of the circuit board 2, and by arranging the protruding portion 63 to be engaged with the second land 21 of the circuit board 2, circuit boards 2 with different thickness sizes may be inserted.

In this embodiment, the module further comprises: the filling part is transparent and at least covers the groove and the photosensitive area 11. Filling portion 5 specifically is a can printing opacity glue, fills hole and sensitization region 11 between 1 and the recess of photoelectric sensor, and it can utilize the solidification form of heating to cover to can play reinforcement and guard action, reinforcing packaging structure's anti falling performance. In addition, by providing the filling portion, dust can be prevented from entering the first surface of the photosensor 1 from the gap between the groove and the photosensor 1, thereby affecting the imaging quality. The filling part can further fill the photosensitive hole 62, so that the dust prevention and protection capability of the whole module is enhanced.

The present application further provides an electronic device, including: a display screen; the optical fingerprint identification module set up the below of display screen. The display screen may be a self-luminous display screen using self-luminous units as display pixels, for example, an OLED display screen or an LED display screen. Thus, the display screen may act as an excitation light source, emitting excitation light towards a target organism (e.g., a user's finger).

Of course, the display screen may also be an LCD display screen or other passive light emitting display screens, and the embodiment of the present invention does not limit this. When the display screen is a passive light emitting display screen, the electronic device may be provided with an additional light source located below the display screen, the additional light source serving as an excitation light source for emitting excitation light to the target organism.

In order to realize the basic functions of the electronic device, the electronic device in the embodiments of the present invention may further include other necessary modules or components. Taking a mobile smartphone as an example, it may also include external circuitry, a communication module, a battery, and the like.

It should be noted that any other necessary modules or components included in the electronic device may be used in any suitable existing configuration. In order to clearly and briefly explain the technical solutions provided by the present invention, the above parts will not be described again, and the drawings in the specification are also simplified correspondingly. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended.

Specifically, when the utility model discloses optical fingerprint identification module is disposed in electronic equipment when, electronic equipment can acquire user's fingerprint characteristic information based on this optical fingerprint identification module for match with the fingerprint information of storage, with the realization to current user's authentication, thereby confirm whether it has corresponding authority to carry out relevant operation to electronic equipment.

The utility model discloses optical fingerprint identification module can be used in including but not limited to electronic equipment such as mobile smart mobile phone, dull and stereotyped electronic equipment, computer, GPS navigator, personal digital assistant, the wearable equipment of intelligence.

It should be noted that, in the description of the present application, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no precedence between the two is intended or should be construed to indicate or imply relative importance. In addition, in the description of the present application, "a plurality" means two or more unless otherwise specified.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes.

Claims (12)

1. An optical fingerprint identification module, its characterized in that includes:

a photosensor having opposing first and second surfaces, the first surface comprising: the fingerprint identification device comprises a photosensitive area for acquiring fingerprint information and at least one first bonding pad electrically connected with the photosensitive area;

the cover plate is provided with a third surface and a fourth surface which are opposite, the third surface is positioned above the first surface, and the third surface is provided with a light sensing hole corresponding to the light sensing area; a groove for accommodating the photoelectric sensor is formed in the fourth surface, the groove at least covers the photosensitive area of the first surface and the first bonding pad, and a conductive mechanism is arranged in the groove;

the circuit board is arranged in parallel with the photoelectric sensor and can be electrically connected with at least one first welding disc through the conductive mechanism.

2. The optical fingerprint identification module of claim 1 wherein the circuit board has fifth and sixth opposing surfaces, the fifth surface being proximate to the first surface, the fifth surface comprising: and the groove covers the photosensitive area, the first bonding pad and the second bonding pad.

3. The optical fingerprint identification module of claim 2 wherein the groove covers the first surface of the photo sensor, and the outer contour length of the groove is smaller than the outer contour length of the fourth surface and larger than the outer contour length of the first surface.

4. The optical fingerprint recognition module of claim 2 wherein said first surface of said photosensor further comprises a peripheral region surrounding said photosensitive region, said peripheral region being provided with a plurality of said first pads, said plurality of said first pads being disposed around a circumference of said peripheral region.

5. The optical fingerprint identification module of claim 4 wherein said conductive means are the same number as said first pads, each said conductive means comprising: a conductive routing layer provided with a first bump for bonding with the first pad.

6. The optical fingerprint identification module of claim 5 wherein at least one of said conductive means comprises: and the second bump is electrically connected with the conductive wiring layer, the second bump is used for electrically connecting the second bonding pads, and at least one first bonding pad can be electrically connected with the second bonding pad sequentially through the first bump, the conductive wiring layer and the second bump.

7. The optical fingerprint recognition module of claim 6 wherein the recess is provided with a raised portion facing the fifth surface of the circuit board, and wherein the second bump is provided on the raised portion, the second bump being located between the second pad and the raised portion.

8. The optical fingerprint identification module of claim 7 wherein said raised portion has a first predetermined thickness, said circuit board has a second predetermined thickness, and said photosensor has a third predetermined thickness, said third predetermined thickness being the sum of said first predetermined thickness and said second predetermined thickness.

9. The optical fingerprint identification module of claim 1 wherein said plurality of photosensitive apertures are arranged, said photosensitive apertures being straight through tube structures.

10. The optical fingerprint identification module of claim 9 wherein a third surface of the cover plate is provided with a filter, and the filter covers the photosensitive hole.

11. The optical fingerprint recognition module of claim 1 further comprising: the filling part can transmit light, and at least covers the groove and the photosensitive area.

12. An electronic device, comprising: a display screen; the optical fingerprint recognition module of any one of claims 1-11 disposed below said display screen.

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