CN210224034U - Packaging structure, image acquisition module and smart phone terminal - Google Patents
Packaging structure, image acquisition module and smart phone terminal Download PDFInfo
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- CN210224034U CN210224034U CN201921421942.1U CN201921421942U CN210224034U CN 210224034 U CN210224034 U CN 210224034U CN 201921421942 U CN201921421942 U CN 201921421942U CN 210224034 U CN210224034 U CN 210224034U
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Abstract
The embodiment of the utility model discloses packaging structure, image acquisition module and smart mobile phone terminal, this packaging structure includes: a functional chip, a first surface of the functional chip comprising at least one first pad; a first bonding layer formed on the first surface of the functional chip, the first bonding layer exposing the first bonding pad; a cover plate formed on the first adhesive layer; the printed circuit board is formed above the functional chip, the second surface of the printed circuit board comprises at least one second bonding pad, the first bonding pad on the first surface of the functional chip is electrically connected with the at least one second bonding pad on the first surface of the printed circuit board, and the number of the second bonding pads is the same as that of the first bonding pads and corresponds to that of the first bonding pads one to one. The embodiment of the utility model provides an in technical scheme reduced packaging structure at the thickness of perpendicular to function chip first surface direction, reduced packaging structure's whole thickness promptly, solved mobile terminal inner space technical problem that mobile terminals such as smart mobile phone are nervous day by day among the prior art.
Description
Technical Field
The embodiment of the utility model provides a relate to the semiconductor technology field, especially relate to an encapsulation construction, image acquisition module and smart mobile phone terminal.
Background
With the development of science and technology, various applications in the mobile phone are more and more, and the integration level in mobile terminals such as smart phones is higher and higher.
At present, the internal space of mobile terminals such as smart phones is increasingly tense, and the improvement of the integration level of the mobile terminals is influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiment of the utility model provides an encapsulation structure, image acquisition module and smart mobile phone terminal solve the technical problem that mobile terminal inner space such as smart mobile phone is nervous day by day among the prior art.
In a first aspect, an embodiment of the present invention provides a package structure, which is characterized in that, including:
a functional chip, a first surface of the functional chip comprising at least one first pad;
a first adhesive layer formed on a first surface of the functional chip, the first adhesive layer exposing the first pad;
a cover plate formed on the first adhesive layer;
the printed circuit board is formed above the functional chip, the second surface of the printed circuit board comprises at least one second bonding pad, the first bonding pad on the first surface of the functional chip is electrically connected with the at least one second bonding pad on the first surface of the printed circuit board, and the number of the second bonding pads is the same as that of the first bonding pads and corresponds to that of the first bonding pads one by one.
Optionally, a second adhesive layer is formed on the first pad;
the second pad is in direct contact with the second bonding layer, and the second bonding layer is a conductive bonding layer.
Optionally, the cover plate includes a third surface far away from the first adhesive layer, a fourth surface adjacent to the first adhesive layer, and at least one side surface connected to the third surface and the fourth surface, the third surface and the fourth surface are arranged in parallel, an included angle between the side surface of the cover plate close to the printed circuit board and the fourth surface is an acute angle, and the fourth surface exposes the first pad.
Optionally, the second adhesive layer is an anisotropic conductive film.
Optionally, the sum of the thicknesses of the first adhesive layer and the cover plate is greater than the thickness of the printed circuit board.
Optionally, the first adhesive layer is an insulating adhesive layer.
Optionally, the printed circuit board is a flexible printed circuit board.
In a second aspect, the embodiment of the present invention provides an image capturing module, including:
an image sensing chip, wherein the image sensing chip comprises the functional chip of any one of the first aspect, and is formed in the packaging structure of any one of the first aspect; and the lens is formed above the cover plate included by the packaging structure.
The embodiment of the utility model provides a third aspect, the embodiment of the utility model provides a smart mobile phone terminal, including the second aspect arbitrary the image acquisition module.
The embodiment of the utility model provides a packaging structure, the printed circuit board that will be connected with the first pad electricity of function chip first surface forms around the function chip, and the second pad and the first pad electricity on printed circuit board second surface are connected, and not like among the prior art, printed circuit board forms in the below of function chip or with function chip with the layer establish, still needs the backup pad to support, compares the packaging structure among the prior art, technical scheme in the embodiment of the utility model provides a need not the backup pad and supports printed circuit board, has reduced packaging structure at the thickness of the first surface direction of perpendicular to function chip, has reduced packaging structure's whole thickness promptly, has solved mobile terminal inner space tense technical problem day by day such as smart mobile phone among the prior art, has improved the integrated level of inside device.
Drawings
Fig. 1 is a schematic structural diagram of a packaging structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a package structure provided in the prior art;
FIG. 3 is a schematic diagram of another package structure provided by the prior art;
fig. 4 is a schematic structural diagram of a smartphone terminal according to a third embodiment of the present invention;
fig. 5 is a sectional view of the smart phone terminal a-a' provided by the third embodiment of the present invention.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Example one
The embodiment of the present invention provides a schematic structural diagram of a package structure, referring to fig. 1, the package structure includes a functional chip 10, and a first surface 100 of the functional chip 10 includes at least one first pad 11; a first adhesive layer 20 formed on the first surface 100 of the functional chip 10, the first adhesive layer 20 exposing the first pad 11; a cover plate 30 formed on the first adhesive layer 20; and a printed circuit board 40 formed over the functional chip 10, the second surface 400 of the printed circuit board 40 including at least one second pad 41, the first pads 11 on the first surface 100 of the functional chip 10 being electrically connected to the at least one second pad 41 on the second surface 400 of the printed circuit board 40, the number of the second pads 41 being the same as the number of the first pads and corresponding to one.
In the present embodiment, the first adhesive layer 20 may be an insulating adhesive layer, for example. The cover plate 30 is used for protecting the functional chip 10, and can play a role in preventing water and collision, and when the cover plate 30 is a glass cover plate, the cover plate also has good light transmission. The functional chip 10 may be a CMOS image sensing chip, a CCD image sensing chip, or other functional chips.
In this embodiment, the first pad 11 and the second pad 41 may be electrically connected by disposing some conductive material, such as a conductive wire or a conductive adhesive.
A package structure in the prior art, see fig. 2, includes a functional chip 10, a first surface 100 of the functional chip 10 includes at least one first pad 11; a first adhesive layer 20 formed on the first surface 100 of the functional chip 10, the first adhesive layer 20 exposing the first pad 11; a cover plate 30 formed on the first adhesive layer 20; and a printed circuit board 40 formed under the functional chip 10, wherein the second surface 400 of the printed circuit board 40 includes at least one second pad 41, the first pads 11 on the first surface 100 of the functional chip 10 are electrically connected with the at least one second pad 41 on the second surface 400 of the printed circuit board 40 through wires 70, and the number of the second pads 41 is the same as that of the first pads and corresponds to one another. And a support plate 50 formed under the printed circuit board 40. Wherein the support plate 50 may be a steel plate. The thickness of the package structure in the direction perpendicular to the first surface 100 of the functional chip 10 includes the thickness of the functional chip 10, the thickness of the first adhesive layer 20, the thickness of the cover plate 30, the thickness of the printed circuit board 40, and the thickness of the support plate 50. Illustratively, the thickness of the functional chip 10 may be about 80 μm, the thickness of the first adhesive layer 20 may be about 20 μm, the thickness of the cover plate 30 may be about 150 μm, the thickness of the printed circuit board 40 may be about 100 μm, and the thickness of the support plate 50 may be about 100 μm, so that the thickness of the entire package structure may be about 450 μm.
A package structure in the prior art, see fig. 3, includes a functional chip 10, a first surface 100 of the functional chip 10 includes at least one first pad 11; a first adhesive layer 20 formed on the first surface 100 of the functional chip 10, the first adhesive layer 20 exposing the first pad 11; a cover plate 30 formed on the first adhesive layer 20; and the printed circuit board 40 is arranged on the same layer as the functional chip 10, the second surface 400 of the printed circuit board 40 comprises at least one second bonding pad 41, the first bonding pad 11 on the first surface 100 of the functional chip 10 is electrically connected with the at least one second bonding pad 41 on the second surface 400 of the printed circuit board 40 through a lead 70, and the number of the second bonding pads 41 is the same as that of the first bonding pads and corresponds to that of the first bonding pads one to one. And a support plate 50 formed under the printed circuit board 40. For supporting the functional chip 10 and the printed circuit board 40. The thickness of the whole packaging structure in the direction vertical to the first surface of the functional chip comprises: the sum of the thickness of the functional chip 10, the thickness of the first adhesive layer 20, the thickness of the cover plate 30, and the thickness of the support plate 50. Illustratively, the thickness of the functional chip 10 may be about 80 μm, the thickness of the first adhesive layer 20 may be about 20 μm, the thickness of the cover plate 30 may be about 150 μm, and the thickness of the support plate 50 may be about 100 μm, so that the thickness of the entire package structure may be about 350 μm. The support plate 50 is illustratively a steel plate.
The embodiment of the utility model provides a packaging structure, the printed circuit board that will be connected with the first pad electricity of function chip first surface forms in the top of function chip, and the second pad and the first pad electricity on printed circuit board second surface are connected, and not like among the prior art, printed circuit board forms in the below of function chip or with function chip with the layer setting, still needs the backup pad to support, compares packaging structure among the prior art, technical scheme in the embodiment of the utility model provides a need not the backup pad and supports printed circuit board, has reduced packaging structure at the thickness of the first surface direction of perpendicular to function chip, has reduced packaging structure's whole thickness promptly, has solved mobile terminal inner space tense technical problem day by day such as smart mobile phone among the prior art, has improved the integrated level of inside device.
Optionally, on the basis of the above technical solution, the printed circuit board 40 is a flexible printed circuit board. The flexible circuit board has good bending performance, and the bending performance of the packaging structure is improved.
The package structure shown in fig. 1 will be described in detail below. Referring to fig. 1, a printed circuit board 40 is positioned above the functional chip 10.
It should be noted that the printed circuit board 40 may be located on one side, two sides, three sides of the functional chip 10, or may surround the functional chip 10 for a circle.
The thickness of the packaging structure in the direction vertical to the first surface of the functional chip comprises: the thickness of the functional chip 10, the thickness of the first adhesive layer 20, and the thickness of the cover plate 30, excluding the thickness of the printed circuit board 40, and the thickness of the support plate 50 are reduced compared to the package structure of the prior art, by the thickness of the printed circuit board 40 and the thickness of the support plate 50.
Optionally, on the basis of the above technical solution, the package structure further includes a second adhesive layer 60 formed on the first pad 11; the second pad 41 is in direct contact with the second adhesive layer 60, and the second adhesive layer 60 is a conductive adhesive layer.
In the present embodiment, the second adhesive layer 60 is a conductive adhesive layer, is formed on the first pad 11, electrically connects the first pad 11 and the second pad 41, and realizes electrical connection between the functional chip 10 and the printed circuit board 40. The Conductive adhesive layer is exemplified by an Anisotropic Conductive Film (ACF).
Optionally, on the basis of the above technical solution, the cover plate 30 includes a third surface 300 far away from the first adhesive layer 20, a fourth surface 301 close to the first adhesive layer 20, and at least one side surface 302 connecting the third surface 300 and the fourth surface 301, the third surface 300 and the fourth surface 301 are arranged in parallel, an included angle ∠ 1 between the side surface 302 of the cover plate 30 close to the printed circuit board 40 and the fourth surface 301 is an acute angle, and the fourth surface 301 exposes the first pad 11, so that the printed circuit board 40 cannot be formed above the functional chip 10 when the cover plate 30 covers the first pad 11.
Optionally, on the basis of the above technical solution, the sum of the thicknesses of the first adhesive layer 20 and the cover plate 30 is greater than the thickness of the printed circuit board 40, so as to ensure that the thickness of the whole package structure in the direction perpendicular to the first surface of the functional chip includes: the sum of the thickness of the functional chip 10, the thickness of the first adhesive layer 20, and the thickness of the cover plate 30. Illustratively, the thickness of the functional chip 10 may be about 80 μm, the thickness of the first adhesive layer 20 may be about 20 μm, and the thickness of the cover plate 30 may be about 150 μm, so that the thickness of the entire package structure may be about 250 μm. The functional chip 10 functions to support the first adhesive layer 20, the cover plate 30, and the printed circuit board 40.
Example two
On the basis of the above embodiment, the embodiment of the utility model provides an image acquisition module is provided, this image acquisition module includes: an image sensing chip, wherein the image sensing chip comprises the functional chip of any of the above embodiments, and is formed in the packaging structure comprising any of the above embodiments; and the lens is formed above the cover plate included by the packaging structure. The image acquisition module that this embodiment provided compares the packaging structure among the prior art owing to adopt above-mentioned packaging structure, has reduced packaging structure in the thickness of perpendicular to function chip first surface direction, has reduced packaging structure's whole thickness promptly, has reduced the whole thickness of image acquisition module promptly, has solved mobile terminal inner space tense technical problem day by day such as smart mobile phone among the prior art.
EXAMPLE III
On the basis of above-mentioned technical scheme, see fig. 4, the embodiment of the utility model provides a smart mobile phone terminal is provided, this smart mobile phone terminal includes that above-mentioned embodiment is arbitrary the image acquisition module.
It should be noted that, referring to fig. 5, the image capturing module 1 in this embodiment is disposed below the display screen 2 of the smartphone terminal. The image acquisition module 1 can realize an image acquisition function through a light transmission part of a pixel array in the display screen 2.
The smart phone terminal that this embodiment provided compares the packaging structure among the prior art owing to adopt above-mentioned image acquisition module and above-mentioned packaging structure, and the packaging structure that this embodiment provided has reduced the thickness of packaging structure in the direction of perpendicular to function chip first surface, has reduced packaging structure's whole thickness, has reduced the whole thickness of image acquisition module promptly, has solved the mobile terminal inner space technical problem that smart mobile phone etc. are nervous day by day among the prior art.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (9)
1. A package structure, comprising:
a functional chip, a first surface of the functional chip comprising at least one first pad;
a first adhesive layer formed on a first surface of the functional chip, the first adhesive layer exposing the first pad;
a cover plate formed on the first adhesive layer;
the printed circuit board is formed above the functional chip, the second surface of the printed circuit board comprises at least one second bonding pad, the first bonding pad on the first surface of the functional chip is electrically connected with the at least one second bonding pad on the first surface of the printed circuit board, and the number of the second bonding pads is the same as that of the first bonding pads and corresponds to that of the first bonding pads one by one.
2. The package structure of claim 1, further comprising a second adhesive layer formed on the first pad;
the second pad is in direct contact with the second bonding layer, and the second bonding layer is a conductive bonding layer.
3. The package structure of claim 2, wherein the second adhesive layer is an anisotropic conductive film.
4. The package structure according to claim 1, wherein the cover plate comprises a third surface far from the first adhesive layer, a fourth surface adjacent to the first adhesive layer, and at least one side surface connecting the third surface and the fourth surface, the third surface is arranged in parallel with the fourth surface, an included angle between the side surface of the cover plate close to the printed circuit board and the fourth surface is an acute angle, and the fourth surface exposes the first pad.
5. The package structure of claim 4, wherein a sum of the thickness of the first adhesive layer and the cover plate is greater than a thickness of the printed circuit board.
6. The package structure of claim 1, wherein the first adhesive layer is an insulating adhesive layer.
7. The package structure of claim 1,
the printed circuit board is a flexible printed circuit board.
8. An image capture module, comprising:
an image sensing chip comprising the functional chip of any one of claims 1 to 7, formed in a package structure comprising the functional chip of any one of claims 1 to 7;
and the lens is formed above the cover plate included by the packaging structure.
9. A smartphone terminal, characterized in that it comprises the image acquisition module of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921421942.1U CN210224034U (en) | 2019-08-29 | 2019-08-29 | Packaging structure, image acquisition module and smart phone terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921421942.1U CN210224034U (en) | 2019-08-29 | 2019-08-29 | Packaging structure, image acquisition module and smart phone terminal |
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| CN210224034U true CN210224034U (en) | 2020-03-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416241A (en) * | 2019-08-29 | 2019-11-05 | 苏州多感科技有限公司 | Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416241A (en) * | 2019-08-29 | 2019-11-05 | 苏州多感科技有限公司 | Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal |
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