CN110416241A - Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal - Google Patents
Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal Download PDFInfo
- Publication number
- CN110416241A CN110416241A CN201910809093.5A CN201910809093A CN110416241A CN 110416241 A CN110416241 A CN 110416241A CN 201910809093 A CN201910809093 A CN 201910809093A CN 110416241 A CN110416241 A CN 110416241A
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- Prior art keywords
- pad
- adhesive layer
- encapsulating structure
- printed circuit
- functional chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 49
- 239000010410 layer Substances 0.000 claims description 9
- 230000001154 acute effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
Abstract
The embodiment of the invention discloses a kind of encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal, which includes: functional chip, and the first surface of functional chip includes at least one first pad；The first adhesive layer being formed on functional chip first surface, the first adhesive layer expose the first pad；The cover board being formed on the first adhesive layer；The printed circuit board being formed in above functional chip, the second surface of printed circuit board includes at least one second pad, the first pad on functional chip first surface is electrically connected at least one second pad on printed circuit board first surface, the quantity of second pad is identical as the quantity of the first pad, and corresponds.Technical solution in the embodiment of the present invention reduces encapsulating structure in the thickness perpendicular to functional chip first surface direction, the integral thickness for reducing encapsulating structure solves the technical issues of mobile terminals such as smart phone inner space growing tension in the prior art.
Description
Technical field
The present embodiments relate to technical field of semiconductors more particularly to a kind of encapsulating structure, Image Acquisition mould group and
Intelligent mobile phone terminal.
Background technique
With the development of science and technology, various applications are more and more inside mobile phone, inside the mobile terminals such as smart phone
Integrated level is higher and higher.
Currently, the mobile terminals such as smart phone inner space growing tension, affects the raising of its integrated level.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal,
Come the technical issues of solving the mobile terminals such as smart phone inner space growing tension in the prior art.
In a first aspect, feature is being the embodiment of the invention provides a kind of encapsulating structure, comprising:
Functional chip, the first surface of the functional chip include at least one first pad；
The first adhesive layer being formed on the functional chip first surface, first adhesive layer expose first weldering
Disk；
The cover board being formed on first adhesive layer；
The printed circuit board being formed in above the functional chip, the second surface of the printed circuit board include at least one
A second pad, at least one on the first pad and the printed circuit board first surface on the functional chip first surface
A second pad electrical connection, the quantity of second pad is identical as the quantity of first pad, and corresponds.
It optionally, further include the second adhesive layer to be formed on first pad；
Second pad is directly contacted with second adhesive layer, and second adhesive layer is conductive adhesion layer.
Optionally, the cover board includes the third surface far from first adhesive layer, neighbouring first adhesive layer
4th surface, and at least one side on connection the third surface and the 4th surface, the third surface with it is described
4th surface is arranged in parallel, the cover board close to the angle between the side and the 4th surface of the printed circuit board be sharp
First pad is exposed on angle, the 4th surface.
Optionally, second adhesive layer is anisotropic conductive film.
Optionally, the sum of thickness of first adhesive layer and the cover board is greater than the thickness of the printed circuit board.
Optionally, first adhesive layer is insulating bond.
Optionally, the printed circuit board is flexible printed circuit board.
Second aspect, the embodiment of the invention provides a kind of Image Acquisition mould groups, comprising:
Image sensor chip, described image sensing include the first aspect functional chip, are formed in including the
On the one hand in any encapsulating structure；Camera lens is formed in the top for the cover board that the encapsulating structure includes.
The third aspect, the embodiment of the invention provides a kind of intelligent mobile phone terminals, including any figure of second aspect
As acquisition mould group.
The embodiment of the invention provides a kind of encapsulating structures, and the first pad with functional chip first surface is electrically connected
Printed circuit board is formed in around functional chip, and the second pad of printed circuit board second surface is electrically connected with the first pad,
Rather than as in the prior art, printed circuit board is formed in the lower section of functional chip or sets with functional chip same layer, it is also necessary to
Support plate supports, encapsulating structure compared to the prior art, and the technical solution in the embodiment of the present invention is propped up without support plate
Printed circuit board is supportted, reduces encapsulating structure in the thickness perpendicular to functional chip first surface direction, that is, reduces encapsulation knot
The integral thickness of structure solves the technical issues of mobile terminals such as smart phone inner space growing tension in the prior art, mentions
The high integrated level of internal components.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the structural schematic diagram for encapsulating structure that the embodiment of the present invention one provides；
Fig. 2 is a kind of structural schematic diagram of the structural schematic diagram for encapsulating structure that the prior art provides；
Fig. 3 is the structural schematic diagram of the structural schematic diagram for another encapsulating structure that the prior art provides；
Fig. 4 is a kind of structural schematic diagram for intelligent mobile phone terminal that the embodiment of the present invention three provides；
Fig. 5 is a kind of sectional view in the direction intelligent mobile phone terminal A-A ' that the embodiment of the present invention three provides.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.It is understood that
It is that specific embodiment described herein is used only for explaining the present invention rather than limiting the invention.It further needs exist for illustrating
, only the parts related to the present invention are shown for ease of description, in attached drawing rather than entire infrastructure.
Embodiment one
The embodiment of the invention provides a kind of structural schematic diagrams of encapsulating structure, and referring to Fig. 1, which includes function
Chip 10, the first surface 100 of functional chip 10 include at least one first pad 11；It is formed in 10 first surface of functional chip
The first adhesive layer 20 on 100, the first adhesive layer 20 expose the first pad 11；The cover board 30 being formed on the first adhesive layer 20；
Be formed in the printed circuit board 40 of the top of functional chip 10, the second surface 400 of printed circuit board 40 include at least one second
Pad 41, the first pad 11 on 10 first surface 100 of functional chip and at least one on 40 second surface 400 of printed circuit board
A second pad 41 is electrically connected, and the quantity of the second pad 41 is identical as the quantity of the first pad, and is corresponded.
In the present embodiment, the first adhesive layer 20 illustratively can be insulating bond.Cover board 30 is used for defencive function
Chip 10 can play the role of waterproof anticollision, when cover board 30 is glass cover-plate, also have good translucency.Function
Chip 10 can be cmos image sensing chip, ccd image sensing chip or other function chip.
In the present embodiment, electricity can be realized by setting some electrically conductive materials between the first pad 11 and the second pad 41
Connection, such as conductive lead wire or conducting resinl.
Encapsulating structure in the prior art, referring to fig. 2, including functional chip 10, the first surface 100 of functional chip 10 wrap
Include at least one first pad 11；The first adhesive layer 20 being formed on 10 first surface 100 of functional chip, the first adhesive layer 20
Expose the first pad 11；The cover board 30 being formed on the first adhesive layer 20；It is formed in the printed circuit board of 10 lower section of functional chip
40, the second surface 400 of printed circuit board 40 includes at least one second pad 41, on 10 first surface 100 of functional chip
First pad 11 is electrically connected at least one second pad 41 on 40 second surface 400 of printed circuit board by lead 70, the
The quantity of two pads 41 is identical as the quantity of the first pad, and corresponds.It further include being formed under printed circuit board 40 to support
Plate 50.Wherein support plate 50 can be steel plate.Encapsulating structure in the thickness perpendicular to 10 first surface of functional chip, 100 direction,
The thickness and branch of thickness, the thickness of the first adhesive layer 20, the thickness of cover board 30, printed circuit board 40 including functional chip 10
The thickness of fagging 50.Illustratively, the thickness of functional chip 10 may be about 80 μm, and the thickness of the first adhesive layer 20 is about 20 μ
M, the thickness of cover board 30 are about 150 μm, and the thickness of printed circuit board 40 is about 100 μm, and the thickness of support plate 50 is about 100 μm,
Therefore, the thickness of entire encapsulating structure is about 450 μm.
Encapsulating structure in the prior art, referring to Fig. 3, including functional chip 10, the first surface 100 of functional chip 10 is wrapped
Include at least one first pad 11；The first adhesive layer 20 being formed on 10 first surface 100 of functional chip, the first adhesive layer 20
Expose the first pad 11；The cover board 30 being formed on the first adhesive layer 20；With the printed circuit board of 10 same layer of functional chip setting
40, the second surface 400 of printed circuit board 40 includes at least one second pad 41, on 10 first surface 100 of functional chip
First pad 11 is electrically connected at least one second pad 41 on 40 second surface 400 of printed circuit board by lead 70, the
The quantity of two pads 41 is identical as the quantity of the first pad, and corresponds.It further include being formed under printed circuit board 40 to support
Plate 50.For support function chip 10 and printed circuit board 40.Entire encapsulating structure is perpendicular to functional chip first surface side
To thickness include: the thickness of functional chip 10, the thickness of the first adhesive layer 20, the thickness of cover board 30 and support plate 50 thickness
The sum of degree.Illustratively, the thickness of functional chip 10 may be about 80 μm, and the thickness of the first adhesive layer 20 is about 20 μm, cover board
30 thickness is about 150 μm, and the thickness of support plate 50 is about 100 μm, and therefore, the thickness of entire encapsulating structure is about 350 μm.Branch
Fagging 50 is illustratively steel plate.
The embodiment of the invention provides a kind of encapsulating structures, and the first pad with functional chip first surface is electrically connected
Printed circuit board is formed in the top of functional chip, and the second pad of printed circuit board second surface is electrically connected with the first pad,
Rather than picture is in the prior art, printed circuit board is formed in the lower section of functional chip or is arranged with functional chip same layer, also needs
Support plate is wanted to support, encapsulating structure compared to the prior art, the technical solution in the embodiment of the present invention is come without support plate
Supporting printing board reduces encapsulating structure in the thickness perpendicular to functional chip first surface direction, that is, reduces encapsulation
The integral thickness of structure solves the technical issues of mobile terminals such as smart phone inner space growing tension in the prior art,
Improve the integrated level of internal components.
Optionally, based on the above technical solution, printed circuit board 40 is flexible printed circuit board.Flexible circuit board
Bending performance is good, increases the bending performance of encapsulating structure.
Encapsulating structure shown in fig. 1 is specifically introduced below.Referring to Fig. 1, printed circuit board 40 is located at functional chip
10 top.
It should be noted that printed circuit board 40 can be located at side, two sides, three sides of functional chip 10, can also enclose
Around functional chip 10 1 weeks.
Encapsulating structure includes: the thickness of functional chip 10, first in the thickness perpendicular to functional chip first surface direction
The thickness of adhesive layer 20 and the thickness of cover board 30 do not include the thickness of printed circuit board 40 and the thickness of support plate 50, phase
To encapsulating structure in the prior art, reduce printed circuit board 40 and support plate 50 thickness.
Optionally, based on the above technical solution, which further includes to be formed on the first pad 11 second
Adhesive layer 60；Second pad 41 is directly contacted with the second adhesive layer 60, and the second adhesive layer 60 is conductive adhesion layer.
In the present embodiment, the second adhesive layer 60 is conductive adhesion layer, is formed on the first pad 11, by the first pad 11
It is electrically connected with the second pad 41, realizes the electrical connection between functional chip 10 and printed circuit board 40.Conductive adhesion layer example
Property, can be anisotropic conductive film (Anisotropic Conductive Film, ACF).
Optionally, based on the above technical solution, cover board 30 includes the third surface far from the first adhesive layer 20
300, the 4th surface 301 of neighbouring first adhesive layer 20, and connect at least one of third surface 300 and the 4th surface 301
Side 302, third surface 300 are arranged in parallel with the 4th surface 301, and cover board 30 is close to the side of printed circuit board 40 302 and
Angle ∠ 1 between four surfaces 301 is acute angle, and the first pad 11 is exposed on the 4th surface 301, and cover board 30 is avoided to cover the first pad
When 11, printed circuit board 40 can not be formed in the top of functional chip 10.
Optionally, based on the above technical solution, the sum of thickness of the first adhesive layer 20 and cover board 30 is greater than printing
The thickness of circuit board 40 guarantees that entire encapsulating structure in the thickness perpendicular to functional chip first surface direction includes: function core
The sum of the thickness of piece 10, the thickness of the first adhesive layer 20 and thickness of cover board 30.Illustratively, the thickness of functional chip 10 can
To be about 80 μm, the thickness of the first adhesive layer 20 is about 20 μm, and the thickness of cover board 30 is about 150 μm, therefore, entire encapsulating structure
Thickness be about 250 μm.Functional chip 10 plays the role of supporting the first adhesive layer 20, cover board 30 and printed circuit board 40.
Embodiment two
On the basis of the above embodiments, the embodiment of the invention provides a kind of Image Acquisition mould group, the Image Acquisition moulds
Group includes: image sensor chip, and described image sensing includes any functional chip of above-described embodiment, is formed in including upper
It states in any encapsulating structure of embodiment；Camera lens is formed in the top for the cover board that the encapsulating structure includes.The present embodiment
For the Image Acquisition mould group of offer due to using above-mentioned encapsulating structure, encapsulating structure compared to the prior art reduces encapsulation knot
Structure reduces the integral thickness of encapsulating structure, that is, reduces image in the thickness perpendicular to functional chip first surface direction
The integral thickness of mould group is acquired, the technology for solving the mobile terminals such as smart phone inner space growing tension in the prior art is asked
Topic.
Embodiment three
Based on the above technical solution, referring to fig. 4, the embodiment of the invention provides a kind of intelligent mobile phone terminals, should
Intelligent mobile phone terminal includes any Image Acquisition mould group of above-described embodiment.
It should be noted that 1 group of Image Acquisition mould in the present embodiment is arranged in the intelligent mobile phone terminal referring to Fig. 5
2 lower section of display screen.Image Acquisition mould group 1 can realize Image Acquisition function by the light transmission part of pixel array in display screen 2
Energy.
Intelligent mobile phone terminal provided in this embodiment is due to using above-mentioned Image Acquisition mould group and above-mentioned encapsulating structure, this reality
The encapsulating structure of the encapsulating structure of example offer compared to the prior art is provided, reduces encapsulating structure perpendicular to functional chip first
The thickness of surface direction reduces the integral thickness of encapsulating structure, that is, reduces the integral thickness of Image Acquisition mould group, solve
In the prior art the technical issues of the mobile terminals such as smart phone inner space growing tension.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiments here, be able to carry out for a person skilled in the art it is various it is apparent variation, again
It adjusts, be combined with each other and substitutes without departing from protection scope of the present invention.Therefore, although by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, the case where not departing from present inventive concept
Under, it can also include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (9)
1. a kind of encapsulating structure, feature is being, comprising:
Functional chip, the first surface of the functional chip include at least one first pad；
The first adhesive layer being formed on the functional chip first surface, first adhesive layer expose first pad；
The cover board being formed on first adhesive layer；
The printed circuit board being formed in above the functional chip, the second surface of the printed circuit board include at least one
Two pads, on the first pad and the printed circuit board first surface on the functional chip first surface at least one the
The electrical connection of two pads, the quantity of second pad is identical as the quantity of first pad, and corresponds.
2. encapsulating structure according to claim 1, which is characterized in that further include that be formed on first pad second is glued
Tie layer；
Second pad is directly contacted with second adhesive layer, and second adhesive layer is conductive adhesion layer.
3. encapsulating structure according to claim 2, which is characterized in that second adhesive layer is anisotropic conductive film.
4. encapsulating structure according to claim 1, which is characterized in that the cover board includes far from first adhesive layer
Third surface, the 4th surface of neighbouring first adhesive layer, and connect the third surface and the 4th surface extremely
A few side, the third surface are arranged in parallel with the 4th surface, and the cover board is close to the side of the printed circuit board
Angle between face and the 4th surface is acute angle, and first pad is exposed on the 4th surface.
5. encapsulating structure according to claim 4, which is characterized in that the thickness of first adhesive layer and the cover board it
With the thickness for being greater than the printed circuit board.
6. encapsulating structure according to claim 1, which is characterized in that first adhesive layer is insulating bond.
7. encapsulating structure according to claim 1, which is characterized in that
The printed circuit board is flexible printed circuit board.
8. a kind of Image Acquisition mould group characterized by comprising
Image sensor chip, described image sensing includes functional chip as claimed in claim 1 to 7, is formed in including right
It is required that in any encapsulating structure of 1-7；
Camera lens is formed in the top for the cover board that the encapsulating structure includes.
9. a kind of intelligent mobile phone terminal, which is characterized in that including Image Acquisition mould group according to any one of claims 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910809093.5A CN110416241A (en) | 2019-08-29 | 2019-08-29 | Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910809093.5A CN110416241A (en) | 2019-08-29 | 2019-08-29 | Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110416241A true CN110416241A (en) | 2019-11-05 |
Family
ID=68369617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910809093.5A Pending CN110416241A (en) | 2019-08-29 | 2019-08-29 | Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111583883A (en) * | 2020-05-29 | 2020-08-25 | 上海中航光电子有限公司 | Integrated drive board, display device and manufacturing method |
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| TWI232567B (en) * | 2004-05-31 | 2005-05-11 | Chipmos Technologies Inc | Image sensor package with a FPC surrounding a window |
| KR20050116760A (en) * | 2004-06-08 | 2005-12-13 | (주) 윈팩 | Package for image sensor |
| CN101937923A (en) * | 2009-06-30 | 2011-01-05 | 三星泰科威株式会社 | Camera module |
| CN105990379A (en) * | 2015-02-25 | 2016-10-05 | 联想(北京)有限公司 | Photosensitive module group and manufacturing method thereof |
| CN108933151A (en) * | 2018-07-26 | 2018-12-04 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and packaging method of image sensing chip |
| CN210224034U (en) * | 2019-08-29 | 2020-03-31 | 苏州多感科技有限公司 | Packaging structure, image acquisition module and smart phone terminal |
-
2019
- 2019-08-29 CN CN201910809093.5A patent/CN110416241A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI232567B (en) * | 2004-05-31 | 2005-05-11 | Chipmos Technologies Inc | Image sensor package with a FPC surrounding a window |
| KR20050116760A (en) * | 2004-06-08 | 2005-12-13 | (주) 윈팩 | Package for image sensor |
| CN101937923A (en) * | 2009-06-30 | 2011-01-05 | 三星泰科威株式会社 | Camera module |
| CN105990379A (en) * | 2015-02-25 | 2016-10-05 | 联想(北京)有限公司 | Photosensitive module group and manufacturing method thereof |
| CN108933151A (en) * | 2018-07-26 | 2018-12-04 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and packaging method of image sensing chip |
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| CN111583883A (en) * | 2020-05-29 | 2020-08-25 | 上海中航光电子有限公司 | Integrated drive board, display device and manufacturing method |
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