CN103633033A - Image sensor module and image capture module - Google Patents
Image sensor module and image capture module Download PDFInfo
- Publication number
- CN103633033A CN103633033A CN201210302138.8A CN201210302138A CN103633033A CN 103633033 A CN103633033 A CN 103633033A CN 201210302138 A CN201210302138 A CN 201210302138A CN 103633033 A CN103633033 A CN 103633033A
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- China
- Prior art keywords
- image sensor
- ceramic substrate
- circuit board
- electrically connected
- module
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Links
- 239000000919 ceramic Substances 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000003351 stiffener Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract 4
- 230000004308 accommodation Effects 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 239000003292 glue Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
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- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
The invention provides an image sensor module. The image sensor module comprises a ceramic substrate, an image sensor, a conductive adhesive, a soft circuit board and a reinforcing plate, wherein the ceramic substrate comprises an upper surface and a lower surface opposite to the upper surface, the lower surface is provided with an accommodating groove, the upper surface is provided with a light penetrating hole communicating with the accommodation groove, the image sensor is accommodated in the accommodation groove and is electrically connected with the ceramic substrate through a flip chip packaging mode, the lower surface of the ceramic substrate is electrically connected with the soft circuit board through the conductive adhesive, and the reinforcing plate is fixed to the other side, opposite to the ceramic substrate, of the soft circuit board. According to the invention, the reinforcing plate is fixed one side of the soft circuit board, and the reinforcing plate effective improves the strength and flatness of the soft circuit board so that the ceramic substrate can be stably connected with the soft circuit board. The invention also provides an image capture module.
Description
Technical field
The present invention relates to a kind of image sensor module and use the taken module of this image sensor module.
Background technology
Traditional image sensor module comprises a ceramic substrate, an image sensor and a flexible circuit board, described image sensor is electrically connected to described ceramic substrate in the mode of chip package, and described ceramic substrate is electrically connected on described flexible circuit board by conducting resinl.Yet because mechanical strength and the evenness of described flexible circuit board are lower, what this just may cause that described ceramic substrate cannot be stable is connected on described flexible circuit board, thereby makes the reliability of described image sensor module lower.
Summary of the invention
In view of this, be necessary to provide a kind of taken module that can improve the image sensor module of package reliability and use this image sensor module.
An image sensor module, it comprises a ceramic substrate, an image sensor, a conducting resinl, a flexible circuit board and a stiffener.Described ceramic substrate comprises a upper surface and one and the opposing lower surface of described upper surface.On described lower surface, offer an accepting groove, on described upper surface, offer a loophole being connected with described accepting groove.Described image sensor is housed in described accepting groove, and is electrically connected by chip package mode and described ceramic substrate.The lower surface of described ceramic substrate is electrically connected by described conducting resinl and described flexible circuit board.Described stiffener is fixed on the relatively described ceramic substrate of described flexible circuit board place opposite side.
A taken module, it comprises an image sensor module and a camera lens module.Described image sensor module comprises a ceramic substrate, an image sensor, a conducting resinl, a flexible circuit board and a stiffener.Described ceramic substrate comprises a upper surface and one and the opposing lower surface of described upper surface.On described lower surface, offer an accepting groove, on described upper surface, offer a loophole being connected with described accepting groove.Described image sensor is housed in described accepting groove, and is electrically connected by chip package mode and described ceramic substrate.The lower surface of described ceramic substrate is electrically connected by described conducting resinl and described flexible circuit board.Described stiffener is fixed on the relatively described ceramic substrate of described flexible circuit board place opposite side.Described camera lens module comprises a camera lens and a microscope base.Described camera lens is housed in described microscope base, and described microscope base is fixed on the upper surface of described ceramic substrate.
In image sensor module provided by the invention and taken module, by relatively described ceramic substrate place opposite side on described flexible circuit board, fix a stiffener, described stiffener effectively raises intensity and the evenness of described flexible circuit board, thereby makes stable being connected on described flexible circuit board of described ceramic substrate energy.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the taken module that provides of embodiment of the present invention.
Fig. 2 is the decomposing schematic representation of the taken module that provides in Fig. 1.
Fig. 3 is that taken module in Fig. 1 is along the decomposing schematic representation of another angle.
Fig. 4 is the cutaway view along IV-IV line of the taken module in Fig. 1.
Main element symbol description
| |
100 |
| |
200 |
| |
10 |
| |
20 |
| First surface | 21 |
| |
211 |
| Second surface | 22 |
| Earth point | 221 |
| Conducting |
30 |
| |
40 |
| |
41 |
| |
411 |
| Lower surface | 42 |
| Accepting groove | 421 |
| Joint face | 422 |
| The first tie point | 423 |
| The second tie point | 424 |
| |
50 |
| |
51 |
| |
52 |
| |
60 |
| |
70 |
| |
300 |
| |
80 |
| |
81 |
| |
82 |
| |
821 |
| |
90 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1-2, be a kind of taken module 100 that embodiment of the present invention provides, it comprises that an image sensor module 200 and is fixed on the camera lens module 300 on described image sensor module 200.Described image sensor module 200 comprises a stiffener 10, a flexible circuit board 20, a conducting resinl 30, a ceramic substrate 40, an image sensor 50, an obturator 60 and a filter 70.Described camera lens module 300 comprises a microscope base 80 and a camera lens 90.
Described stiffener 10 adopts electric conducting material to make, and in present embodiment, described electric conducting material is copper.Described stiffener 10 in the form of sheets, and has preferably mechanical strength and evenness.
Described flexible circuit board 20 comprises the relative second surface 22 of first surface 21 described in a first surface 21 and.On described first surface 21, be provided with a plurality of weld pads 211.On described second surface 22, be provided with an earth point 221, in present embodiment, described earth point 221 is exposed copper sheet in described flexible circuit board 20.Described stiffener 10 is fixed on the second surface 22 of described flexible circuit board 20, and described stiffener 10 is electrically connected with described earth point 221.
Described conducting resinl 30 is anisotropic conductive, and it is attached on described flexible circuit board 20.The conducting in the direction perpendicular to described flexible circuit board 20 of described conducting resinl 30, not conducting in the direction that is parallel to described flexible circuit board 20.
Described ceramic substrate 40 comprises a upper surface 41 and a lower surface 42 relative with described upper surface 41.On described lower surface 42, offer an accepting groove 421, on described upper surface 41, offer a loophole 411 being connected with described accepting groove 421.Described accepting groove 421 comprises that one is parallel to the joint face 422 of described upper surface 41, on described joint face 422, be provided with a plurality of the first tie points 423, on described lower surface 42, submarginal position is provided with a plurality of the second tie points 424, and described the first tie point 423 is electrically connected by the wire being embedded in described ceramic substrate 40 with described the second tie point 424.
Described image sensor 50 comprises a sensing face 51 and a plurality of pins 52 that arrange around described sensing face 51.Described image sensor 50 is for the light that is projected to described sensing face 51 is converted into the signal of telecommunication, and from described pin 52 outputs.In present embodiment, described image sensor 50 can be CMOS type or CCD type.
Described obturator 60 is the frame structure of hollow form, and it is by black glue being expelled to the container that is arranged in solid shape, then adopts the mode of baking by black adhesive curing.
Described filter 70 is rectangular-shaped, and it adopts transparent material to make.Described filter 70 is projected to the Infrared of the light of this filter 70 for filtering.
As shown in Figure 3-4, in the assembling process of described image sensor module 200, described image sensor 50 is housed in described accepting groove 421, and described sensing face 51 is toward described loophole 411, and described pin 52 is electrically connected with described the first tie point 423.Described obturator 60 is contained in described accepting groove 421, and is looped around described image sensor 50 around.In present embodiment, described obturator 60 be by black glue is expelled to be arranged in described accepting groove 421 described image sensor 50 around, then black glue baking-curing is formed.The lower surface 42 of described ceramic substrate 40 is fixed on by described conducting resinl 30 on the described first surface 21 of described flexible circuit board 20, and described the second tie point 424 is electrically connected by described conducting resinl 30 with described weld pad 211.Described filter 70 is fixed on the upper surface 41 of described ceramic substrate 40, and by described loophole 411 sealings.
Described microscope base 80 comprises that a pedestal 81 and is fixed on the resettlement section 82 of one end of described pedestal 81.Described pedestal 81 is the rectangular-shaped of hollow, offers a camera aperture 821 on described resettlement section 82, and described camera aperture 821 is connected with described pedestal 81.Described camera lens 90 is fixed in described camera aperture 821, in described camera lens 90, at least contains an eyeglass.
In the assembling process of described taken module 100, the microscope base 80 that contains described camera lens 90 is fixed on the upper surface 41 of described ceramic substrate 40, described pedestal 81 is around being arranged on described loophole 411 edges, and described filter 70 is housed in described pedestal 81.The optical axis of the optical axis of described camera lens 90 and described image sensor 50 is on same straight line.
In image sensor module provided by the invention and taken module, by relatively described ceramic substrate place opposite side on described flexible circuit board, fix a stiffener, described stiffener effectively raises intensity and the evenness of described flexible circuit board, thereby makes stable being connected on described flexible circuit board of described ceramic substrate energy.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (10)
1. an image sensor module, it comprises a ceramic substrate, an image sensor, a conducting resinl, a flexible circuit board and a stiffener; Described ceramic substrate comprises a upper surface and one and the opposing lower surface of described upper surface; On described lower surface, offer an accepting groove, on described upper surface, offer a loophole being connected with described accepting groove; Described image sensor is housed in described accepting groove, and is electrically connected by chip package mode and described ceramic substrate; The lower surface of described ceramic substrate is electrically connected by described conducting resinl and described flexible circuit board; Described stiffener is fixed on the relatively described ceramic substrate of described flexible circuit board place opposite side.
2. image sensor module as claimed in claim 1, it is characterized in that: described accepting groove comprises a joint face, on described joint face, be provided with a plurality of the first tie points, be provided with a plurality of the second tie points on described lower surface, described the first tie point and described the second tie point are electrically connected.
3. image sensor module as claimed in claim 2, is characterized in that: described image sensor comprises a sensing face and a plurality of pins that arrange around described sensing face, and described pin and described the first tie point are electrically connected.
4. image sensor module as claimed in claim 2, is characterized in that: described flexible circuit board comprises the relative second surface of first surface described in a first surface and; On described first surface, be provided with a plurality of weld pads, on described second surface, be provided with an earth point; Described weld pad and described the second tie point are electrically connected.
5. image sensor module as claimed in claim 4, is characterized in that: described stiffener adopts electric conducting material to make, and itself and described earth point are electrically connected.
6. a taken module, it comprises an image sensor module and a camera lens module; Described image sensor module comprises a ceramic substrate, an image sensor, a conducting resinl, a flexible circuit board and a stiffener; Described ceramic substrate comprises a upper surface and one and the opposing lower surface of described upper surface; On described lower surface, offer an accepting groove, on described upper surface, offer a loophole being connected with described accepting groove; Described image sensor is housed in described accepting groove, and is electrically connected by chip package mode and described ceramic substrate; The lower surface of described ceramic substrate is electrically connected by described conducting resinl and described flexible circuit board; Described stiffener is fixed on the relatively described ceramic substrate of described flexible circuit board place opposite side; Described camera lens module comprises a camera lens and a microscope base; Described camera lens is housed in described microscope base, and described microscope base is fixed on the upper surface of described ceramic substrate.
7. taken module as claimed in claim 6, it is characterized in that: described accepting groove comprises a joint face, on described joint face, be provided with a plurality of the first tie points, be provided with a plurality of the second tie points on described lower surface, described the first tie point and described the second tie point are electrically connected.
8. taken module as claimed in claim 7, is characterized in that: described image sensor comprises a sensing face and a plurality of pins that arrange around described sensing face, and described pin and described the first tie point are electrically connected.
9. taken module as claimed in claim 6, is characterized in that: described flexible circuit board comprises the relative second surface of first surface described in a first surface and; On described first surface, be provided with a plurality of weld pads, on described second surface, be provided with an earth point; Described weld pad and described the second tie point are electrically connected.
10. taken module as claimed in claim 9, is characterized in that: described stiffener adopts electric conducting material to make, and itself and described earth point are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210302138.8A CN103633033B (en) | 2012-08-23 | 2012-08-23 | Image Sensor module and taken module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210302138.8A CN103633033B (en) | 2012-08-23 | 2012-08-23 | Image Sensor module and taken module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103633033A true CN103633033A (en) | 2014-03-12 |
| CN103633033B CN103633033B (en) | 2018-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210302138.8A Expired - Fee Related CN103633033B (en) | 2012-08-23 | 2012-08-23 | Image Sensor module and taken module |
Country Status (1)
| Country | Link |
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| CN (1) | CN103633033B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104580856A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module and camera equipment provided with same |
| CN104580855A (en) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | Camera module |
| CN104717434A (en) * | 2015-03-27 | 2015-06-17 | 有医科技股份有限公司 | Image sensor system chip with image stabilizing function and manufacturing method thereof |
| WO2021078138A1 (en) * | 2019-10-21 | 2021-04-29 | 宁波舜宇光电信息有限公司 | Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly |
| CN112770019A (en) * | 2019-10-21 | 2021-05-07 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, preparation method thereof and camera module |
| CN113141441A (en) * | 2020-01-17 | 2021-07-20 | 晋城三赢精密电子有限公司 | Camera module and electronic device thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103633033B (en) | 2018-04-20 |
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