CN103839895A - Image sensor module and image capturing module - Google Patents
Image sensor module and image capturing module Download PDFInfo
- Publication number
- CN103839895A CN103839895A CN201210474674.6A CN201210474674A CN103839895A CN 103839895 A CN103839895 A CN 103839895A CN 201210474674 A CN201210474674 A CN 201210474674A CN 103839895 A CN103839895 A CN 103839895A
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- China
- Prior art keywords
- image sensor
- supporting part
- sensor module
- extension
- face
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Abstract
The invention provides an image sensor module which comprises a substrate, an image sensor and a switching board. The substrate comprises a bearing part and an extension part which extends from the side of the bearing part. The bearing part comprises an upper surface and a lower surface corresponding to the upper surface. The bearing part is provided with a light transmitting hole which runs through the upper surface and the lower surface. The lower surface is provided with an accommodation hole which is connected with the light transmitting hole. The image sensor is accommodated in the accommodation hole and is electrically connected with the substrate. The extension part comprises a top face and a bottom face corresponding to the top face. The thickness of the extension part is less than the thickness of the bearing part, and the top face is flush with the upper surface. The switching board is electrically connected with the bottom face of the extension part. According to the invention, the thickness of the extension part is less than the thickness of the bearing part, and the top face of the extension part is flush with the upper surface of the bearing part; the switching board is electrically connected with the bottom face of the extension part; and the height of the image sensor module is effectively reduced. The invention further provides an image capturing module which uses the image sensor module.
Description
Technical field
The present invention relates to a kind of image sensor module and use the taken module of this image sensor module.
Background technology
Traditional image sensor module generally comprises an image sensor, a substrate, a keyset and an anisotropic conductive film.Described image sensor bearing is on described substrate.Described substrate is electrically connected by described anisotropic conductive film and described keyset.But, because described substrate and described anisotropic conductive film stack gradually on described keyset, thereby increase the height of described image sensor module, be unfavorable for the miniaturization of taken module.
Summary of the invention
In view of this, be necessary to provide a kind of taken module that can reduce the image sensor module of height and use this image sensor module.
A kind of image sensor module, it comprises a substrate, an image sensor and a keyset.Described substrate comprises the extended extension of a supporting part and a side from described supporting part.Described supporting part comprises a upper surface and a lower surface relative with described upper surface.On described supporting part, offer a loophole that runs through described upper surface and described lower surface, on described lower surface, offer an accepting hole being connected with described loophole.Described image sensor is housed in described accepting hole and with described electrical property of substrate and is connected.Described extension comprises an end face and a bottom surface relative with described end face.The thickness of described extension is less than described supporting part, and described end face is mutually concordant with described upper surface.Described keyset is electrically connected at the bottom surface of described extension.
A kind of taken module, it comprises an image sensor module and a camera lens module.Described image sensor module comprises a substrate, an image sensor and a keyset.Described substrate comprises the extended extension of a supporting part and a side from described supporting part.Described supporting part comprises a upper surface and a lower surface relative with described upper surface.On described supporting part, offer a loophole that runs through described upper surface and described lower surface, on described lower surface, offer an accepting hole being connected with described loophole.Described image sensor is housed in described accepting hole and with described electrical property of substrate and is connected.Described extension comprises an end face and a bottom surface relative with described end face.The thickness of described extension is less than described supporting part, and described end face is mutually concordant with described upper surface.Described keyset is electrically connected at the bottom surface of described extension.Described camera lens module comprises that a microscope base and is housed in the camera lens in described microscope base, and described microscope base is fixed on the upper surface of described supporting part.
Described in image sensor module provided by the invention and taken module, the thickness of extension is less than described supporting part, and the end face of described extension is mutually concordant with the upper surface of described supporting part, by described keyset being electrically connected to the bottom surface of described extension, thereby effectively reduce the height of image sensor module.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the taken module that provides of embodiment of the present invention.
Fig. 2 is the decomposing schematic representation of the taken module that provides in Fig. 1.
Fig. 3 is the taken module that provides in Fig. 1 decomposing schematic representation along another angle.
Fig. 4 is the taken module that provides in Fig. 1 cutaway view along V-V line.
Main element symbol description
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100 |
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200 |
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10 |
| Supporting |
11 |
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111 |
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112 |
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113 |
| Accepting |
114 |
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115 |
| Be electrically connected |
1151 |
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12 |
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121 |
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122 |
| The |
1221 |
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20 |
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21 |
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22 |
| Conducting |
30 |
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40 |
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41 |
| The |
411 |
| Second surface | 42 |
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50 |
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60 |
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70 |
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300 |
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80 |
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81 |
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82 |
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821 |
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90 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
As shown in Figures 1 to 3, a kind of taken module 100 that embodiment of the present invention provides, it comprises that an image sensor module 200 and is fixed on the camera lens module 300 on described image sensor module 200.Described image sensor module comprises a substrate 10, an image sensor 20, a conducting film 30, a keyset 40, a filter 50, an obturator 60 and a base plate 70.Described camera lens module 300 comprises a microscope base 80 and a camera lens 90.
Described substrate 10 is rectangular-shaped, and it adopts plastic material injection mo(u)lding.Described substrate 10 comprises the extended extension 12 of a supporting part 11 and a side from described supporting part 11.Described supporting part 11 comprises a upper surface 111 and a lower surface 112 relative with described upper surface 111.On described supporting part 11, offer a loophole 113 that runs through described upper surface 111 and described lower surface 112, on described lower surface 112, offer an accepting hole 114 being connected with described loophole 113.The aperture of described accepting hole 114 is greater than the aperture of described loophole 113, forms a cascaded surface 115 between described accepting hole 114 and described loophole 113.On described cascaded surface 115, be provided with multiple electric connection points 1151.
Described extension 12 comprises an end face 121 and a bottom surface 122 relative with described end face 121.The thickness of described extension 12 is less than described supporting part 11, and described end face 121 is mutually concordant with described upper surface 112.On described bottom surface 122, be provided with multiple the first weld pads 1221, described the first weld pad 1221 is electrically connected by the internal wiring of described substrate 10 mutually with described electric connection point 1151.
Described conducting film 30 is anisotropy conductive film, and it adopts the resin of high-quality and conducting particles is synthetic forms.The shape of described conducting film 30 is corresponding with the shape of described extension 12.Described conducting film 30 electrically conducts on perpendicular to its bearing of trend, is being parallel to electrically not conducting on its bearing of trend.
Described keyset 40 is printed circuit board (PCB) or flexible PCB, and it comprises the relative second surface 42 of first surface 41 described in a first surface 41 and.On described first surface 41, be provided with multiple the second weld pads 411, described the second weld pad 411 arranges near one end of described keyset 40.The arrangement mode of described the second weld pad 411 is corresponding with described the first weld pad 1221.The gross thickness of described keyset 40 and described conducting film 30 is less than or equal to the thickness difference of described extension 12 and described supporting part 11.
Described filter 50 is rectangular-shaped, and it adopts transparent material to make.Described filter 50 is projected to the Infrared of the light of this filter 50 for filtering.
Described obturator 60 adopts black glue to make, and it is frame structure.Described obturator 60 is to fill and be shaped in the assembling process of described image sensor module 200.
Described base plate 70 adopts electric conducting material to make, and its shape is corresponding with the shape of described supporting part 11.Described base plate 70 is for the earth point as described image sensor module 200.
As shown in Figure 4, in the encapsulation process of described image sensor module 200, first image sensor 20 is housed in the accepting hole 114 of described supporting part 11, and described sensing face 21 is exposed from described loophole 113.Mode by chip package is electrically connected at described image sensor module 200 on described cascaded surface 115, and described pin 22 is electrically connected mutually with described electric connection point 1151.Then, assembler is overturn semi-finished product, makes the lower surface 112 of described supporting part 11 upward, in described accepting hole 114, fills black glue, and described black glue is looped around described image sensor 20 around, after solidifying, forms described obturator 60.Again described base plate 70 is fixed on the lower surface 112 of described supporting part 11, so that described image sensor 20 is enclosed between described base plate 70 and supporting part 11.Described base plate 70 is electrically connected with described supporting part 11, to form described earth point.Filter 50 is encapsulated in to the upper surface 111 of described supporting part 11 and described loophole 113 is sealed.
Finally, described conducting film 30 is attached to the bottom surface 122 of described extension 12, the one end that is provided with described the second weld pad 411 on described keyset 40 is placed on described conducting film 30, and ensure that described the first weld pad 1221 is corresponding with described the second weld pad 411.Then, use press fit device (not shown) to carry out pressing to described keyset 40, described the first weld pad 1221 is electrically conducted on the bearing of trend perpendicular to described conducting film 30 with described the second weld pad 411.In present embodiment, after described image sensor module 200 has encapsulated, the second surface 42 of described keyset 40 is mutually concordant with the lower surface 112 of described supporting part 11.
Described microscope base 80 comprises that a pedestal 81 and is fixed on the resettlement section 82 of one end of described pedestal 81.Described pedestal 81 is the rectangular-shaped of hollow, offers a camera aperture 821 on described resettlement section 82, and described camera aperture 821 is connected with described pedestal 81.Described camera lens 90 is fixed in described camera aperture 821, in described camera lens 90, at least contains an eyeglass.
In the assembling process of described taken module 100, the microscope base 80 that contains described camera lens 90 is fixed on the upper surface 111 of described supporting part 11, described pedestal 81 is around being arranged on described loophole 113 edges, described filter 50 is housed in described pedestal 81, and the optical axis of the optical axis of described camera lens 90 and described image sensor 20 is on same straight line.
Described in image sensor module provided by the invention and taken module, the thickness of extension is less than described supporting part, and the end face of described extension is mutually concordant with the upper surface of described supporting part, by described keyset being electrically connected to the bottom surface of described extension, thereby effectively reduce the height of image sensor module.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (8)
1. an image sensor module, it comprises a substrate, an image sensor and a keyset; Described substrate comprises the extended extension of a supporting part and a side from described supporting part; Described supporting part comprises a upper surface and a lower surface relative with described upper surface; On described supporting part, offer a loophole that runs through described upper surface and described lower surface, on described lower surface, offer an accepting hole being connected with described loophole; Described image sensor is housed in described accepting hole and with described electrical property of substrate and is connected; Described extension comprises an end face and a bottom surface relative with described end face; The thickness of described extension is less than described supporting part, and described end face is mutually concordant with described upper surface; Described keyset is electrically connected at the bottom surface of described extension.
2. image sensor module as claimed in claim 1, is characterized in that: described image sensor module also comprises a conducting film, and described conducting film is bonded between described extension and described keyset.
3. image sensor module as claimed in claim 2, is characterized in that: the gross thickness of described keyset and described conducting film is less than or equal to the thickness difference of described extension and described supporting part.
4. image sensor module as claimed in claim 1, is characterized in that: the aperture of described accepting hole is greater than the aperture of described loophole, between described accepting hole and described loophole, forms a cascaded surface, is provided with multiple electric connection points on described cascaded surface.
5. image sensor module as claimed in claim 4, it is characterized in that: multiple pins that described image sensor comprises a sensing face and arranges near described sensing face, described sensing face is exposed from described loophole, and described pin and described electric connection point are electrically connected.
6. image sensor module as claimed in claim 4, is characterized in that: on described bottom surface, be provided with multiple the first weld pads, described the first weld pad and described electric connection point are electrically connected.
7. image sensor module as claimed in claim 6, it is characterized in that: a side of described keyset is provided with the second weld pad of multiple and described the first weld pad, described the first weld pad and described the second weld pad electrically conduct on the bearing of trend perpendicular to described conducting film.
8. a taken module, it comprises an image sensor module and a camera lens module; Described image sensor module comprises a substrate, an image sensor and a keyset; Described substrate comprises the extended extension of a supporting part and a side from described supporting part; Described supporting part comprises a upper surface and a lower surface relative with described upper surface; On described supporting part, offer a loophole that runs through described upper surface and described lower surface, on described lower surface, offer an accepting hole being connected with described loophole; Described image sensor is housed in described accepting hole and with described electrical property of substrate and is connected; Described extension comprises an end face and a bottom surface relative with described end face; The thickness of described extension is less than described supporting part, and described end face is mutually concordant with described upper surface; Described keyset is electrically connected at the bottom surface of described extension; Described camera lens module comprises that a microscope base and is housed in the camera lens in described microscope base, and described microscope base is fixed on the upper surface of described supporting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210474674.6A CN103839895A (en) | 2012-11-21 | 2012-11-21 | Image sensor module and image capturing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210474674.6A CN103839895A (en) | 2012-11-21 | 2012-11-21 | Image sensor module and image capturing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103839895A true CN103839895A (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210474674.6A Pending CN103839895A (en) | 2012-11-21 | 2012-11-21 | Image sensor module and image capturing module |
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|---|---|
| CN (1) | CN103839895A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021000130A1 (en) * | 2019-06-29 | 2021-01-07 | 瑞声光学解决方案私人有限公司 | Lens module |
| CN113660405A (en) * | 2021-09-26 | 2021-11-16 | 联想(北京)有限公司 | Camera shooting mechanism and electronic equipment |
-
2012
- 2012-11-21 CN CN201210474674.6A patent/CN103839895A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021000130A1 (en) * | 2019-06-29 | 2021-01-07 | 瑞声光学解决方案私人有限公司 | Lens module |
| CN113660405A (en) * | 2021-09-26 | 2021-11-16 | 联想(北京)有限公司 | Camera shooting mechanism and electronic equipment |
| CN113660405B (en) * | 2021-09-26 | 2022-11-22 | 联想(北京)有限公司 | Camera shooting mechanism and electronic equipment |
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Application publication date: 20140604 |