CN206865596U - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN206865596U CN206865596U CN201720720872.4U CN201720720872U CN206865596U CN 206865596 U CN206865596 U CN 206865596U CN 201720720872 U CN201720720872 U CN 201720720872U CN 206865596 U CN206865596 U CN 206865596U
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Abstract
It the utility model is related to a kind of camera module and its photosensory assembly, photosensory assembly includes substrate, photo-sensitive cell and packaging body, during encapsulation, photo-sensitive cell is first arranged to the first surface of substrate, photo-sensitive cell is set to be electrically connected with substrate, then packaging body around photo-sensitive cell is formed by way of encapsulated moulding in the first surface of substrate, the packaging body after shaping is very firm, can not be dismantled easily from substrate.The top surface of packaging body is recessed formed with accepting groove to close to the direction of substrate, and optical section is assembled to the top surface of packaging body, and is contained in accepting groove, forms the structure for the top surface for being partially submerged into packaging body, advantageously reduces the height of Z-direction.
Description
Technical field
Camera technology field is the utility model is related to, more particularly to a kind of camera module and its photosensory assembly.
Background technology
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Car field, medical domain etc., such as camera module have become the portable electric appts such as smart mobile phone, tablet personal computer
One of standard fitting.Image can not only be obtained by being applied to the camera module of portable electric appts, but also can be helped
Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts and
User requires more and more higher, the imaging to the overall dimensions and camera module of camera module for the image quality of camera module
Ability is proposed harsher requirement.That is, the development trend of portable electric appts requires that camera module is subtracting
Further improved on the basis of few size and strengthen imaging capability.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, i.e. shooting mould
Wiring board, photo-sensitive cell, the support etc. of group are made into respectively, then successively by passive electronic component, photo-sensitive cell and support
Encapsulation is in the circuit board.But the camera module size that this packaged type is formed is larger, can not meet what size increasingly reduced
Trend.
In order to solve this problem, moulding technology is introduced into camera module field, and moulding technology allows camera module in quilt
Make support integrally formed in the circuit board during making.Voice coil motor or microscope base are arranged at the top of packaging body by glue-line
Face, but this setup is unfavorable for reducing height of the camera module in Z-direction.
Utility model content
Based on this, it is necessary to for above-mentioned technical problem, there is provided a kind of shooting mould for the height for advantageously reducing Z-direction
Group and its photosensory assembly.
A kind of photosensory assembly, including：
Substrate, including the first surface and second surface being oppositely arranged；
Photo-sensitive cell, the first surface of the substrate is arranged at, and is electrically connected with the substrate；And
Packaging body, around the photo-sensitive cell encapsulated moulding in the first surface of the substrate, the top surface of the packaging body
To close to the direction of substrate depression, formed with accepting groove, the accepting groove is used to accommodate optical section.
Above-mentioned photosensory assembly at least has advantages below：
During encapsulation, photo-sensitive cell is first arranged to the first surface of substrate, photo-sensitive cell is electrically connected with substrate
Connect, packaging body around photo-sensitive cell is then formed by way of encapsulated moulding in the first surface of substrate, after shaping
Packaging body is very firm, can not be dismantled easily from substrate.The top surface of packaging body is recessed formed with collecting to close to the direction of substrate
Groove, accepting groove are used to house optical section, advantageously reduce the height of Z-direction.
In one of the embodiments, the accepting groove is annular accepting groove, the bottom protrusion of the optical section formed with
Projection, the projection is annular protrusion, and the projection is contained in the accepting groove.The height of Z-direction can be not only reduced,
Position-limiting action can also be played after in the embedded accepting groove of projection, prevents from producing between optical section and packaging body and rocks, be advantageous to protect
The optical axis of card optical section overlaps with the center line of photosensory assembly.
In one of the embodiments, the packaging body is included close to the inwall of the photo-sensitive cell and away from described photosensitive
The outer wall of element, the packaging body top surface close to the edge of the inwall to close to the substrate direction be recessed to be formed it is spacing
Groove, the stopper slot are arranged at intervals with the accepting groove, and the stopper slot is used to place optical filter.Stopper slot, which is used to place, to filter
Piece, be advantageous to optical filter positioning, and effectively prevent optical filter from producing to rock.
In one of the embodiments, the spacing groove bottom close to the edge of the inwall to close to the substrate side
Anti-overflow groove is formed to depression.When optical filter is affixed in stopper slot by glue-line, unnecessary glue is flowed in anti-overflow groove, prevents glue
Water overflows to influenceing image quality on photo-sensitive cell.
In one of the embodiments, the packaging body is included close to the inwall of the photo-sensitive cell and away from described photosensitive
The outer wall of element, a wherein side wall for the accepting groove run through the inwall of the packaging body, and the bottom of the optical section is contained in
In the accepting groove, another side wall of the accepting groove forms barrier wall.In the bottom insertion accepting groove of optical section, it can reduce
The height of Z-direction；Barrier wall can limit optical section double swerve, be advantageous to keep light around the outer peripheral edge of optical section
The optical axis of the department of the Chinese Academy of Sciences overlaps with the center line of photosensory assembly.
In one of the embodiments, it is described to house groove bottom close to the edge of the inwall to close to the side of the substrate
Stopper slot is formed to depression, the stopper slot is used to place optical filter.Stopper slot is used to place optical filter, is advantageous to optical filter and determines
Position, and effectively prevent optical filter from producing to rock.
In one of the embodiments, the spacing groove bottom close to the edge of the inwall to close to the substrate side
Anti-overflow groove is formed to depression.When optical filter is affixed in stopper slot by glue-line, unnecessary glue is flowed in anti-overflow groove, prevents glue
Water overflows to influenceing image quality on photo-sensitive cell.
In one of the embodiments, in addition to electronic component, the electronic component are embedded in the packaging body.Prevent
Electronic component is directly exposed in space, and electronic component will not be infected with the pollutants such as dust, also not interfere with photo-sensitive cell, avoid
Pollute photo-sensitive cell and cause camera module the bad phenomenons such as dirty stain occur.
A kind of camera module, including：
Photosensory assembly as described in any of the above one；And
Optical section, it is contained in the accepting groove.
In one of the embodiments, the optical section includes microscope base, lens barrel and camera lens, and the bottom of the microscope base is contained in
In the accepting groove, the lens barrel is arranged on the microscope base, and the camera lens is arranged in the lens barrel；Or
The optical section includes voice coil motor, lens barrel and camera lens, and the bottom of the voice coil motor is contained in the accepting groove
Interior, the lens barrel is arranged in the voice coil motor, and the camera lens is arranged in the lens barrel.
Above-mentioned camera module at least has advantages below：
During encapsulation, photo-sensitive cell is first arranged to the first surface of substrate, photo-sensitive cell is electrically connected with substrate
Connect, packaging body around photo-sensitive cell is then formed by way of encapsulated moulding in the first surface of substrate, after shaping
Packaging body is very firm, can not be dismantled easily from substrate.The top surface of packaging body is recessed formed with collecting to close to the direction of substrate
Groove, optical section are assembled to the top surface of packaging body, and are contained in accepting groove, form the structure for the top surface for being partially submerged into packaging body,
Advantageously reduce the height of Z-direction.
Brief description of the drawings
Fig. 1 is the sectional view of the camera module in first embodiment；
Fig. 2 is the sectional view of the camera module in second embodiment.
Embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this
The embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be to be much different from other manner described here to implement, this area
Technical staff can do similar improvement in the case of without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Each technical characteristic of embodiment described above
Can arbitrarily it be combined, to make description succinct, not to all possible combination of each technical characteristic in above-described embodiment
All it is described, as long as however, contradiction is not present in the combination of these technical characteristics, is all considered to be the model of this specification record
Enclose.
Camera module in one embodiment, including photosensory assembly, optical section and optical filter.Specifically, photosensory assembly bag
Include substrate, photo-sensitive cell and packaging body.Optical section includes lens barrel and camera lens.
Substrate includes the first surface and second surface being oppositely arranged, and photo-sensitive cell is arranged at the first surface of substrate, and
Electrically connected with substrate.Packaging body is around photo-sensitive cell encapsulated moulding in the first surface of substrate, and the top surface of packaging body is to close to base
Formed with accepting groove, accepting groove is used to accommodate optical section the direction depression of plate.
During encapsulation, photo-sensitive cell is first arranged to the first surface of substrate, photo-sensitive cell is electrically connected with substrate
Connect, packaging body around photo-sensitive cell is then formed by way of encapsulated moulding in the first surface of substrate, after shaping
Packaging body is very firm, can not be dismantled easily from substrate.The top surface of packaging body is recessed formed with collecting to close to the direction of substrate
Groove, optical section are assembled to the top surface of packaging body, and are contained in accepting groove, form the structure for the top surface for being partially submerged into packaging body,
Advantageously reduce the height of Z-direction.
Referring to Fig. 1, it is the camera module 100 in first embodiment.The camera module 100 include photosensory assembly 110,
Optical section 120 and optical filter 130.Photosensory assembly 110 includes substrate 111, photo-sensitive cell 112 and packaging body 113.Optical section 120
Including lens barrel 121, camera lens 122 and voice coil motor 123.
Substrate 111 includes the first surface 1111 and second surface 1112 being oppositely arranged.Substrate 111 is wiring board, such as
Can be hard circuit board, ceramic substrate (without soft board), or Rigid Flex or be soft board, when substrate 111 is
During soft board, stiffening plate can be set in the second surface 1112 of substrate 111, to strengthen the intensity of substrate 111.
Photo-sensitive cell 112 is arranged at the first surface 1111 of substrate 111, and is electrically connected with substrate 111.Photo-sensitive cell 112
Can be CCD (Charge-coupled Device, charge coupled cell) or CMOS (Complementary Metal
Oxide Semiconductor, metal oxide semiconductor device).
Photo-sensitive cell 112 includes photosurface and the non-photo-sensing face set back on photosurface, and non-photo-sensing face is set by glue-line
It is placed on the first surface 1111 of substrate 111.Photosurface includes photosensitive area and non-photo-sensing area, and photosensitive area is located at middle part, non-photo-sensing
Area is set around photosensitive area.Certainly, in other implementations, non-photo-sensing area can also be only located at the side of photosensitive area.Light
Line is incident from camera lens 122 and reaches photosurface, and photosurface converts optical signals into electric signal, and passes through the company of being transferred to of substrate 111
Connect on device.
Specific in first embodiment, photo-sensitive cell 112 is electrically connected by conductive connecting 114 with substrate 111.It is conductive
Connecting line 114 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends of conductive connecting 114 respectively with photo-sensitive cell
112 and substrate 111 electrically connect, conductive connecting 114 can be formed by way of just beating：Using wiring tool from substrate 111
To the direction routing of photo-sensitive cell 112.Conductive connecting 114 can also be formed by way of counter beat：Using wiring tool from
Direction routing of the photo-sensitive cell 112 to substrate 111.The camber of the conductive connecting 114 formed by the way of counter beat is less than just
The conductive connecting 114 that the mode of beating is formed.
Certainly, in other embodiments, can also by the non-photo-sensing face of photo-sensitive cell 112 and substrate 111 it
Between conductive bumps are set, such as conductive bumps can be soldered ball, and photo-sensitive cell 112 is electrically connected by soldered ball with substrate 111.
Specific in first embodiment, photosensory assembly 110 also includes electronic component 115, and electronic component 115 is arranged at base
The first surface 1111 of plate 111, and electronic component 115 electrically connects with substrate 111.Specifically, electronic component 115 can be electricity
Resistance, electric capacity, diode, triode, potentiometer, relay or driver.
Packaging body 113 is around the encapsulated moulding of photo-sensitive cell 112 in the first surface 1111 of substrate 111, the top of packaging body 113
Face 1131 is to close to the direction of substrate 111 depression, formed with accepting groove 1132, accepting groove 1132 is used to accommodate optical section 120.Envelope
Filling body 113 includes the inwall 113a close to the photo-sensitive cell 112 and outer wall 113b away from photo-sensitive cell 112.
Packaging body 113 can be formed at the first surface 1111 of substrate 111 by molded mode.For example, using
Injection machine, the wiring board after carrying out SMT techniques is carried out by molding by insert molding technique and forms packaging body 113, or with partly
The mould pressing process commonly used in conductor encapsulation forms packaging body 113.Packaging body 113 formed mode can select Shooting Technique or
Mould pressing process etc..Packaging body 113 after shaping is firmly connected with substrate 111, compared with traditional microscope base is bonded by glue-line, envelope
The bonding force filled between body 113 and substrate 111 is much greater.
It can be nylon to use Shooting Technique to form the material of packaging body 113, LCP (Liquid Crystal Polymer,
Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 113 is formed using mould pressing process
Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select
Material, the mode that can implement of the invention as an example, be not the present invention limitation.
Specific in first embodiment, electronic component 115 is arranged at the first surface 1111 of substrate 111, and is embedded at
In packaging body 113.Therefore, electronic component 115 is covered by packaging body 113, will not be directly exposed in space, more specifically
Say, be not exposed in the environment that is communicated with photo-sensitive cell 112, so as to when being assembled into camera module 100, electronic component 115
The pollutants such as dust will not be infected with, also do not interfere with photo-sensitive cell 112, avoid polluting photo-sensitive cell 112 and causing camera module
100 there are the bad phenomenons such as dirty stain.
Certainly, in other embodiments, electronic component 115 is arranged at the first surface 1111 of substrate 111, and is located at
Outside packaging body 113.That is, electronic component 115 is not wrapped by packaging body 113, thus the heat dispersion of electronic component 115 compared with
It is good.Electronic component 115 be located at packaging body 113 it is outer when in two kinds of situation：Electronic component 115 is located at the inwall 113a of packaging body 113
Side, the good heat dispersion performance of electronic component 115；Electronic component 115 is located at the outer wall 113b sides of packaging body 113, can subtract
Safe distance between the inwall 113a of small conductive connecting 114 and packaging body 113, further reduces whole photosensory assembly 110
Size.
Specific in first embodiment, the non-photo-sensing area of photo-sensitive cell 112 is embedded at packaging body 113, conductive connecting
114 are embedded in packaging body 113 completely.Therefore, conductive connecting 114 will not be directly exposed to exterior space, so as to assemble
During camera module 100 so that conductive connecting 114 will not be touched damage by any, while reduce environmental factor to conduction
The influence of connecting line 114, such as temperature so that the electric connection between photo-sensitive cell 112 and substrate 111 is stable.
Certainly, in other embodiments, conductive connecting 114 can also be partly embedded in packaging body 113, part
Packaging body 113 is exposed to, simplifies processing step.Certainly, in other embodiments, the non-photo-sensing area of photo-sensitive cell 112
Can have safe spacing, the end that conductive connecting 114 is connected with substrate 111 between the inwall 113a of packaging body 113
There is safe spacing between the inwall 113a of packaging body 113.That is, photo-sensitive cell 112 is directly exposed to conductive connecting 114
Outside packaging body 113, technical maturity, cost is relatively low.
Specific in first embodiment, accepting groove 1132 is annular accepting groove, and the bottom of voice coil motor 123 protrudes to be formed
There is projection 1231, projection 1231 is annular protrusion, and projection 1231 is adapted with accepting groove 1132, and projection 1231 is contained in accepting groove
In 1132.The height of Z-direction can be not only reduced, projection 1231 can also play spacing work after being embedded in accepting groove 1132
With, prevent between optical section 120 and packaging body 113 produce rock, advantageously ensure that the optical axis and photosensory assembly of optical section 120
110 center line overlaps.
Specific in first embodiment, the top surface 1131 of packaging body 113 is close to inwall 113a edge to close to substrate 111
Direction be recessed to form stopper slot 1133, stopper slot 1133 is arranged at intervals with accepting groove 1132, stopper slot 1133 be used for prevent from filtering
Mating plate 130, be advantageous to the positioning of optical filter 130, and effectively prevent optical filter 130 from producing to rock.
Specific in first embodiment, the bottom surface of stopper slot 1133 is close to inwall 113a edge to close to substrate 111
Direction is recessed to form anti-overflow groove 1134.That is, anti-overflow groove 1134 forms ladder slot structure with stopper slot 1133, and anti-overflow groove 1134 is less than
Stopper slot 1133 is set.When optical filter 130 is affixed in stopper slot 1133 by glue-line, unnecessary glue flows to anti-overflow groove 1134
It is interior, prevent glue from overflowing to influenceing image quality on photo-sensitive cell 112.
The bottom of voice coil motor 123 is contained in accepting groove 1132, and camera lens 122 is arranged in voice coil motor 123, camera lens
122 are arranged in lens barrel 121.Camera lens 122 includes multi-disc eyeglass, and optical filter 130 is between camera lens 122 and photo-sensitive cell 112.
I.e., in the first embodiment, camera module 100 is varifocal camera module.
Certainly, in other embodiments, microscope base can also be used to substitute voice coil motor 123.The bottom of microscope base houses
In in accepting groove 1132, lens barrel 121 is arranged on microscope base, and camera lens 122 is set in lens barrel 121.
Camera module 100 in first embodiment at least has advantages below：
During encapsulation, photo-sensitive cell 112 is first arranged to the first surface 1111 of substrate 111, makes photo-sensitive cell
112 electrically connect with substrate 111, are then formed in the first surface 1111 of substrate 111 by way of encapsulated moulding around sense
The packaging body 113 of optical element 112, the packaging body 113 after shaping can not very firmly be dismantled from substrate 111 easily.Packaging body
113 top surface 1131 is assembled to packaging body 113 to being recessed close to the direction of substrate 111 formed with accepting groove 1132, optical section 120
Top surface 1131, and be contained in accepting groove 1132, form the structure for the top surface 1131 for being partially submerged into packaging body 113, be advantageous to
Reduce the height of Z-direction.
Referring to Fig. 2, it is the camera module 200 in second embodiment.The camera module 200 include photosensory assembly 210,
Optical section 220 and optical filter 230.Photosensory assembly 210 includes substrate 211, photo-sensitive cell 212 and packaging body 213.Optical section 220
Including lens barrel 221, camera lens 222 and voice coil motor 223.
Substrate 211 includes the first surface 2111 and second surface 2112 being oppositely arranged.Substrate 211 is wiring board, such as
Can be hard circuit board, ceramic substrate (without soft board), or Rigid Flex or be soft board, when substrate 211 is
During soft board, stiffening plate can be set in the second surface 2112 of substrate 211, to strengthen the intensity of substrate 211.
Photo-sensitive cell 212 is arranged at the first surface 2111 of substrate 211, and is electrically connected with substrate 211.Photo-sensitive cell 212
Can be CCD (Charge-coupled Device, charge coupled cell) or CMOS (Complementary Metal
Oxide Semiconductor, metal oxide semiconductor device).
Photo-sensitive cell 212 includes photosurface and the non-photo-sensing face set back on photosurface, and non-photo-sensing face is set by glue-line
It is placed on the first surface 2111 of substrate 211.Photosurface includes photosensitive area and non-photo-sensing area, and photosensitive area is located at middle part, non-photo-sensing
Area is set around photosensitive area.Certainly, in other implementations, non-photo-sensing area can also be only located at the side of photosensitive area.Light
Line is incident from camera lens 222 and reaches photosurface, and photosurface converts optical signals into electric signal, and passes through the company of being transferred to of substrate 211
Connect on device.
Specific in second embodiment, photo-sensitive cell 212 is electrically connected by conductive connecting 214 with substrate 211.It is conductive
Connecting line 214 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends of conductive connecting 214 respectively with photo-sensitive cell
212 and substrate 211 electrically connect, conductive connecting 214 can be formed by way of just beating：Using wiring tool from substrate 211
To the direction routing of photo-sensitive cell 212.Conductive connecting 214 can also be formed by way of counter beat：Using wiring tool from
Direction routing of the photo-sensitive cell 212 to substrate 211.The camber of the conductive connecting 214 formed by the way of counter beat is less than just
The conductive connecting 214 that the mode of beating is formed.
Certainly, in other embodiments, can also by the non-photo-sensing face of photo-sensitive cell 212 and substrate 211 it
Between conductive bumps are set, such as conductive bumps can be soldered ball, and photo-sensitive cell 212 is electrically connected by soldered ball with substrate 211.
Specific in second embodiment, photosensory assembly 210 also includes electronic component 215, and electronic component 215 is arranged at base
The first surface 2111 of plate 211, and electronic component 215 electrically connects with substrate 211.Specifically, electronic component 215 can be electricity
Resistance, electric capacity, diode, triode, potentiometer, relay or driver.
Packaging body 213 is around the encapsulated moulding of photo-sensitive cell 212 in the first surface 2111 of substrate 211, the top of packaging body 213
Face 2131 is to close to the direction of substrate 211 depression, formed with accepting groove 2132, accepting groove 2132 is used to accommodate optical section 220.Envelope
Filling body 213 includes the inwall 213a close to the photo-sensitive cell 212 and outer wall 213b away from photo-sensitive cell 212.
Packaging body 213 can be formed at the first surface 2111 of substrate 211 by molded mode.For example, using
Injection machine, the wiring board after carrying out SMT techniques is carried out by molding by insert molding technique and forms packaging body 213, or with partly
The mould pressing process commonly used in conductor encapsulation forms packaging body 213.Packaging body 213 formed mode can select Shooting Technique or
Mould pressing process etc..Packaging body 213 after shaping is firmly connected with substrate 211, compared with traditional microscope base is bonded by glue-line, envelope
The bonding force filled between body 213 and substrate 211 is much greater.
It can be nylon to use Shooting Technique to form the material of packaging body 213, LCP (Liquid Crystal Polymer,
Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 213 is formed using mould pressing process
Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select
Material, the mode that can implement of the invention as an example, be not the present invention limitation.
Specific in second embodiment, electronic component 215 is arranged at the first surface 2111 of substrate 211, and is embedded at
In packaging body 213.Therefore, electronic component 215 is covered by packaging body 213, will not be directly exposed in space, more specifically
Say, be not exposed in the environment that is communicated with photo-sensitive cell 212, so as to when being assembled into camera module 200, electronic component 215
The pollutants such as dust will not be infected with, also do not interfere with photo-sensitive cell 212, avoid polluting photo-sensitive cell 212 and causing camera module
200 there are the bad phenomenons such as dirty stain.
Certainly, in other embodiments, electronic component 215 is arranged at the first surface 2111 of substrate 211, and is located at
Outside packaging body 213.That is, electronic component 215 is not wrapped by packaging body 213, thus the heat dispersion of electronic component 215 compared with
It is good.Electronic component 215 be located at packaging body 213 it is outer when in two kinds of situation：Electronic component 215 is located at the inwall 213a of packaging body 213
Side, the good heat dispersion performance of electronic component 215；Electronic component 215 is located at the outer wall 213b sides of packaging body 213, can subtract
Safe distance between the inwall 213a of small conductive connecting 214 and packaging body 213, further reduces whole photosensory assembly 210
Size.
Specific in second embodiment, the non-photo-sensing area of photo-sensitive cell 212 is embedded at packaging body 213, conductive connecting
214 are embedded in packaging body 213 completely.Therefore, conductive connecting 214 will not be directly exposed to exterior space, so as to assemble
During camera module 200 so that conductive connecting 214 will not be touched damage by any, while reduce environmental factor to conduction
The influence of connecting line 214, such as temperature so that the electric connection between photo-sensitive cell 212 and substrate 211 is stable.
Certainly, in other embodiments, conductive connecting 214 can also be partly embedded in packaging body 213, part
Packaging body 213 is exposed to, simplifies processing step.Certainly, in other embodiments, the non-photo-sensing area of photo-sensitive cell 212
Can have safe spacing, the end that conductive connecting 214 is connected with substrate 211 between the inwall 213a of packaging body 213
There is safe spacing between the inwall 213a of packaging body 213.That is, photo-sensitive cell 212 is directly exposed to conductive connecting 214
Outside packaging body 213, technical maturity, cost is relatively low.
Specific in second embodiment, a wherein side wall for accepting groove 2132 runs through the inwall 213a of packaging body 213, light
The bottom of the department of the Chinese Academy of Sciences 220 is contained in accepting groove 2132, and another side wall of accepting groove 2132 forms barrier wall A.That is, implement second
In mode, accepting groove 2132 extends to the inwall 213a of packaging body 213., can in the bottom insertion accepting groove 2132 of optical section 220
To reduce the height of Z-direction；Barrier wall A can limit the double swerve of optical section 220 around the outer peripheral edge of optical section 220,
Be advantageous to keep the optical axis of optical section 220 to overlap with the center line of photosensory assembly 210.
Specific in second embodiment, the bottom surface of accepting groove 2132 is close to inwall 213a edge to close to substrate 211
Direction is recessed to form stopper slot 2133, and stopper slot 2133 is used to place optical filter 230, is advantageous to the positioning of optical filter 230, and have
Effect prevents optical filter 230 produces from rocking.
Specific in second embodiment, the bottom surface of stopper slot 2133 is close to inwall 213a edge to close to substrate 211
Direction is recessed to form anti-overflow groove 2134.When optical filter 230 is affixed in stopper slot 2133 by glue-line, unnecessary glue flows to anti-
Overflow in groove 2134, prevent glue from overflowing to influenceing image quality on photo-sensitive cell 212.That is, accepting groove 2132, stopper slot 2133 and anti-
The three of groove 2134 of overflowing forms three hierarchic structures.
Optical section 220 includes lens barrel 221, camera lens 222 and voice coil motor 223, and the bottom of voice coil motor 223 is contained in collecting
In groove 2132, camera lens 222 is arranged in voice coil motor 223, and camera lens 222 is arranged in lens barrel 221.Camera lens 222 includes multi-disc mirror
Piece, optical filter 230 is between camera lens 222 and photo-sensitive cell 212.I.e., in this second embodiment, camera module 200 is can
Zoom camera module.
Certainly, in other embodiments, optical section 220 includes lens barrel 221, camera lens 222 and microscope base.Replaced using microscope base
For voice coil motor 223.The bottom of microscope base is contained in accepting groove 2132, and lens barrel 221 is arranged on microscope base, and camera lens 222 sets mirror
In cylinder 221.
Camera module 200 in second embodiment at least has advantages below：
During encapsulation, photo-sensitive cell 212 is first arranged to the first surface 2111 of substrate 211, makes photo-sensitive cell
212 electrically connect with substrate 211, are then formed in the first surface 2111 of substrate 211 by way of encapsulated moulding around sense
The packaging body 213 of optical element 212, the packaging body 213 after shaping can not very firmly be dismantled from substrate 211 easily.Packaging body
213 top surface 2131 is assembled to packaging body 213 to being recessed close to the direction of substrate 211 formed with accepting groove 2132, optical section 220
Top surface 2131, and be contained in accepting groove 2132, form the structure for the top surface 2131 for being partially submerged into packaging body 213, be advantageous to
Reduce the height of Z-direction.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. photosensory assembly, it is characterised in that including：Substrate, including the first surface and second surface being oppositely arranged；Photo-sensitive cell, the first surface of the substrate is arranged at, and is electrically connected with the substrate；AndPackaging body, around the photo-sensitive cell encapsulated moulding in the first surface of the substrate, the top surface of the packaging body to by Formed with accepting groove, the accepting groove is used to accommodate optical section the direction depression of the nearly substrate.
- 2. photosensory assembly according to claim 1, it is characterised in that the accepting groove is annular accepting groove, the optics The bottom protrusion in portion is formed with projection, and the projection is annular protrusion, and the projection is contained in the accepting groove.
- 3. photosensory assembly according to claim 2, it is characterised in that the packaging body is included close to the photo-sensitive cell Inwall and the outer wall away from the photo-sensitive cell, the packaging body top surface is close to the edge of the inwall to close to the substrate Direction is recessed to form stopper slot, and the stopper slot is arranged at intervals with the accepting groove, and the stopper slot is used to place optical filter.
- 4. photosensory assembly according to claim 3, it is characterised in that the spacing groove bottom is close to the edge of the inwall It is recessed to form anti-overflow groove to the direction close to the substrate.
- 5. photosensory assembly according to claim 1, it is characterised in that the packaging body is included close to the photo-sensitive cell Inwall and the outer wall away from the photo-sensitive cell, a wherein side wall for the accepting groove runs through the inwall of the packaging body, described The bottom of optical section is contained in the accepting groove, and another side wall of the accepting groove forms barrier wall.
- 6. photosensory assembly according to claim 5, it is characterised in that the collecting groove bottom is close to the edge of the inwall It is recessed to form stopper slot to the direction close to the substrate.
- 7. photosensory assembly according to claim 6, it is characterised in that the spacing groove bottom is close to the edge of the inwall It is recessed to form anti-overflow groove to the direction close to the substrate.
- 8. photosensory assembly according to claim 1, it is characterised in that be also embedded including electronic component, the electronic component In in the packaging body.
- A kind of 9. camera module, it is characterised in that including：Photosensory assembly as claimed in any of claims 1 to 8 in one of claims；AndOptical section, it is contained in the accepting groove.
- 10. camera module according to claim 9, it is characterised in that the optical section includes microscope base, lens barrel and camera lens, The bottom of the microscope base is contained in the accepting groove, and the lens barrel is arranged on the microscope base, and the camera lens is arranged at described In lens barrel；OrThe optical section includes voice coil motor, lens barrel and camera lens, and the bottom of the voice coil motor is contained in the accepting groove, institute State lens barrel to be arranged in the voice coil motor, the camera lens is arranged in the lens barrel.
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| CN201720720872.4U CN206865596U (en) | 2017-06-20 | 2017-06-20 | Camera module and its photosensory assembly |
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| CN201720720872.4U CN206865596U (en) | 2017-06-20 | 2017-06-20 | Camera module and its photosensory assembly |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611754A (en) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | Camera module |
| CN110611753A (en) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| CN110650267A (en) * | 2018-06-26 | 2020-01-03 | 三赢科技（深圳）有限公司 | Photosensitive chip packaging module and forming method thereof |
| CN110839124A (en) * | 2018-08-16 | 2020-02-25 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| CN110858868A (en) * | 2018-08-23 | 2020-03-03 | 南昌欧菲华光科技有限公司 | Camera module and photosensitive assembly thereof |
| CN110868516A (en) * | 2018-08-28 | 2020-03-06 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, manufacturing method thereof, camera module and mobile terminal |
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2017
- 2017-06-20 CN CN201720720872.4U patent/CN206865596U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110611754A (en) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | Camera module |
| CN110611753A (en) * | 2018-06-15 | 2019-12-24 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| CN110650267A (en) * | 2018-06-26 | 2020-01-03 | 三赢科技（深圳）有限公司 | Photosensitive chip packaging module and forming method thereof |
| CN110839124A (en) * | 2018-08-16 | 2020-02-25 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| CN110858868A (en) * | 2018-08-23 | 2020-03-03 | 南昌欧菲华光科技有限公司 | Camera module and photosensitive assembly thereof |
| CN110858868B (en) * | 2018-08-23 | 2022-01-14 | 江西晶浩光学有限公司 | Camera module and photosensitive assembly thereof |
| CN110868516A (en) * | 2018-08-28 | 2020-03-06 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, manufacturing method thereof, camera module and mobile terminal |
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Effective date of registration: 20210622 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
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