CN207560135U - Camera module and its sunk type photosensory assembly - Google Patents
Camera module and its sunk type photosensory assembly Download PDFInfo
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- CN207560135U CN207560135U CN201720469696.1U CN201720469696U CN207560135U CN 207560135 U CN207560135 U CN 207560135U CN 201720469696 U CN201720469696 U CN 201720469696U CN 207560135 U CN207560135 U CN 207560135U
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Abstract
The utility model is related to a kind of camera module and its sunk type photosensory assembly, sunk type photosensory assembly includes：Substrate, including the first surface and second surface being oppositely arranged, the first surface opens up fluted；Photosensitive element is electrically connected in the groove of the substrate and with the substrate；Packaging body, the packaging body surround the photosensitive element and are molded to the first surface of the substrate.Above-mentioned sunk type photosensory assembly, the groove for setting photosensitive element is offered on the first surface of substrate, photosensitive element can be mounted on by glue-line in groove, therefore the glue overflowed in the process is mounted to can be filled in the groove, so as to prevent the solder joint of the glue overflowed covering photosensitive element and substrate, the phenomenon that avoiding generating substrate circuit loose contact.Meanwhile it groove is opened up on substrate reduces the thickness of the sunk type photosensory assembly to accommodate the setting of photosensitive element.
Description
Technical field
The utility model is related to camera module field, more particularly to a kind of camera module and its sunk type photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences the also constantly increase, therefore cause camera module of the area of the photosensitive element of image quality
Assembling difficulty constantly increase, overall dimensions also constantly increase, therefore the lightening of camera module receives very big limitation, into
And limit the volume of the smart machine equipped with the camera module.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, stent of group etc. are made into respectively, then successively by passive electronic component, photosensitive element and stent
Encapsulation is in the circuit board.However the camera module size that this packaged type is formed is larger, can not meet what size increasingly reduced
Trend.Moreover, when photosensitive element is affixed on wiring board, the glue of spilling easily covers the solder joint of photosensitive element and substrate,
So as to cause wiring board electrical contact it is bad the phenomenon that, finally influence the normal work of the camera module.
Utility model content
On the one hand, the sinking that size is smaller and can prevent the solder joint of photosensitive element and wiring board from easily being covered by glue is provided
Formula photosensory assembly.
On the other hand, a kind of camera module equipped with sunk type photosensory assembly is also provided.
A kind of sunk type photosensory assembly, including：
Substrate, including the first surface and second surface being oppositely arranged, the first surface opens up fluted；
Photosensitive element is electrically connected in the groove of the substrate and with the substrate；And
Packaging body, the packaging body surround the photosensitive element and are molded to the first surface of the substrate.
Above-mentioned sunk type photosensory assembly offers the groove for setting photosensitive element on the first surface of substrate, photosensitive
Element can be mounted on by glue-line in groove, therefore the glue that attachment is overflowed in the process can be filled in the groove, so as to prevent
The glue covering photosensitive element of spilling and the solder joint of substrate, the phenomenon that avoiding generating substrate circuit loose contact.Meanwhile on substrate
Open up groove reduces the thickness of the sunk type photosensory assembly to accommodate the setting of photosensitive element, so as to be conducive to be equipped under this
The lightening development of the setting of heavy formula photosensory assembly.
The groove is blind slot in one of the embodiments,.
The sunk type photosensory assembly further includes stiffening plate in one of the embodiments, and the groove is through described the
One surface and the second surface, the stiffening plate cover the groove towards the openend of the second surface.
The photosensitive element is electrically connected to the substrate by conductive connecting in one of the embodiments, described to lead
There are spacing between the madial wall of the junction and the packaging body of electric connection line and the substrate.
One side surface of photosensitive element is equipped with conductive prominence in one of the embodiments, and the photosensitive element passes through
Conductive prominence is electrically connected to the substrate.
The substrate is Rigid Flex in one of the embodiments,.
The photosensitive element is pasted on by glue-line on the first surface of the substrate in one of the embodiments,
The groove in.
A kind of camera module, including above-mentioned sunk type photosensory assembly.
The camera module further includes voice coil motor in one of the embodiments, and the packaging body is far from the substrate
One end is equipped with loading end, and the voice coil motor is set on the loading end.
The optical axis coincidence of the central axis of the voice coil motor and the photosensitive element in one of the embodiments,.
Description of the drawings
Fig. 1 is the sectional view of the camera module of first embodiment；
Fig. 2 is the substrate of camera module of an embodiment shown in FIG. 1 and the connection diagram of photosensitive element；
Fig. 3 is the substrate of camera module of another embodiment shown in FIG. 1 and the connection diagram of photosensitive element；
Fig. 4 is the substrate of camera module of another embodiment shown in FIG. 1 and the connection diagram of photosensitive element；
Fig. 5 is the substrate of camera module of another embodiment shown in FIG. 1 and the connection diagram of photosensitive element；
Fig. 6 is the sectional view of the camera module of second embodiment；
Fig. 7 is the sectional view of the camera module of third embodiment.
Specific embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments makes to the utility model
The understanding of disclosure more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood meaning of technical staff in domain is identical.It is only in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more relevant Listed Items.
As shown in Figure 1, a kind of sunk type photosensory assembly 120 of first embodiment, including substrate 122, photosensitive element 124
And packaging body 126.
Wherein, substrate 122 includes the first surface 122a being oppositely arranged and second surface 122b, and first surface 122a is opened up
Fluted 1224, photosensitive element 124 is set in groove 1224 and is electrically connected with substrate 122.Packaging body 126 is around photosensitive element
It 124 and is molded on the first surface 122a of substrate 122.
Above-mentioned sunk type photosensory assembly 120 offers to set photosensitive element on the first surface 122a of substrate 122
124 groove 1224, photosensitive element 124 can be mounted on by glue-line 123 in groove 1224, therefore the glue that attachment is overflowed in the process
Water can be filled in the groove 1224, so as to prevent the glue overflowed covering photosensitive element 124 and the solder joint of substrate 122, avoid
Generate the phenomenon that 122 electrical contact of substrate is bad.Meanwhile groove 1224 is opened up on substrate 122 to accommodate setting for photosensitive element 124
Putting reduces the thickness of the sunk type photosensory assembly 120, so as to be conducive to be equipped with the setting of the sunk type photosensory assembly 120
Lightening development.
Please continue to refer to Fig. 1, in the present first embodiment, the groove 1224 on substrate 122 is is opened in substrate 122
The blind slot in portion, therefore photosensitive element 124 is located at the region of the thinner thickness at the middle part of substrate 122, around the other of groove 1224
Partial thickness is thicker to limit photosensitive element 124.
Further, substrate 122 is hard circuit board, ceramic substrate (without soft board) or Rigid Flex, so as to drop
With higher intensity while the thickness of the low sunk type photosensory assembly 120, to install and support photosensitive element 124.
Photosensitive element 124 can be arranged as required to as CCD (Charge-coupled Device, charge coupled cell)
Or CMOS (Complementary Metal Oxide Semiconductor, metal oxide semiconductor device).Photosensitive element
124 is generally rectangular cross-section or round.In the first embodiment, photosensitive element 124 is rectangle, and groove 1224 is and photosensitive member
The matched rectangle of shape of part 124, and the area of groove 1224 is more than the area of photosensitive element 124, in order to accommodate spilling
Glue and prevent glue from flowing to the part that substrate 122 does not open up fluted 1224.
Further, photosensitive element 124 includes photosurface 1242 and the non-photo-sensing face set back on photosurface 1242.Sense
Smooth surface 1242 includes photosensitive area and non-photo-sensing area, and photosensitive area is located at middle part, and non-photo-sensing area is set around photosensitive area.Certainly, at it
In its embodiment, non-photo-sensing area can also be only located at the side of photosensitive area.Light is incident from camera lens 144 and reaches photosurface
1242, photosurface 1242 converts optical signals into electric signal.
Please continue to refer to Fig. 1, in the first embodiment, photosensitive element 124 is electrically connected to by conductive connecting 125
Substrate 122, conductive connecting 125 can be gold thread, copper wire, aluminum steel or silver wire etc..
Specifically, the both ends of conductive connecting 125 are electrically connected respectively with photosensitive element 124 and substrate 122, this is conductively connected
Line 125 can be formed by way of just beating：Use direction routing of the wiring tool from substrate 122 to photosensitive element 124.It is conductive
Connecting line 125 can also be formed by way of counter beat：It is beaten using wiring tool from photosensitive element 124 to the direction of substrate 122
Line.Since the camber of conductive connecting 125 formed by the way of counter beat is less than the conductive connecting that just mode of beating is formed
125, therefore the slimming design of the sunk type photosensory assembly 120 can be further realized to a certain extent.
Further, since the connection of 125 one end of conductive connecting is located at photosensitive element 124, the other end is connected to substrate 122
On, therefore the junction and packaging body 126 of conductive connecting 125 and substrate 122 is deposited between the madial wall of photosensitive element 124
The safe distance of routing is formed in spacing, consequently facilitating carrying out routing operation.It is appreciated that conductive connecting 125 and substrate
The distance between 122 junction and the madial wall of packaging body 126 size can be decided according to the actual requirements.
Simultaneously in the first surface 122a of substrate 122, packaging body 126 wraps encapsulated moulding 126 winding photosensitive element 124 of packaging body
It includes the inner wall for the close photosensitive element 124 being oppositely arranged and the outer wall far from photosensitive element 124, packaging body 126 is equipped with opening, opens
The inner wall and outer wall of mouth perforation packaging body 126.
Further, packaging body 126 can be formed in the first surface 122a of substrate 122 by molded mode.
For example, using injection molding machine, substrate 122 is carried out by molding by insert molding technique and forms packaging body 126 or uses semiconductor package
Common mould pressing process forms packaging body 126 in dress.The mode that packaging body 126 is formed can select Shooting Technique or stamper
Skill etc..Packaging body 126 after molding is securely connected with substrate 122, compared with conventional stent is bonded by glue-line, packaging body
Bonding force between 126 and substrate 122 is much greater.
Further, the flatness of the loading end 1262 of packaging body 126 after molding is less than or equal to 10 μm, optical module
Voice coil motor 142 in 140 can be set on the loading end 1262, so as to improve the installation accuracy of voice coil motor 142.
It can be nylon that Shooting Technique is used, which to form the material of packaging body 126, LCP (Liquid CrystalPolymer,
Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 126 is formed using mould pressing process
Can be epoxy resin.It will be apparent to a skilled person that the aforementioned manufacture that can be selected and can select
Material, be illustrative only the mode that can implement of the utility model, be not the limitation of the utility model.
Fig. 2~Fig. 5 is please referred to, for substrate 122 because of reasons such as setting angle or deformations, place plane and packaging body 126 are remote
Predetermined angle is formed from the 1262 place plane of loading end that 122 one end of substrate is equipped with, photosensitive element 124 is viscous by glue-line 123
It is affixed in the groove 1224 on the first surface 122a of substrate 122, surface and loading end of the glue-line 123 far from first surface 122a
1262 is parallel.In this way, although substrate 122 forms predetermined angle with respect to loading end 1262 and is not parallel to loading end 1262, lead to
Opposite hold can still be adjusted by the limiting fixed function of glue-line 123 by crossing glue-line 123 and being pasted on the photosensitive element 124 of substrate 122
The angle of section 1262 and it is parallel with loading end 1262, and then make the optical axis of photosensitive element 124 on loading end 1262
The central axis of voice coil motor 142 overlaps, and finally makes to be equipped with the camera shooting mould of the sunk type photosensory assembly 120 and voice coil motor 142
Group 100 has higher optical axis alignment precision.
As shown in Figures 1 and 2, in one embodiment, the bottom surface of the groove 1224 on the first surface 122a of substrate 122 is
Plane and loading end 1262 is parallel to, therefore the thickness of glue-line 123 is equal everywhere, table of the glue-line 123 far from first surface 122a
Face is also parallel with loading end 1262.
In this way, the photosurface of the photosensitive element 124 of the bottom surface for the groove 1224 being pasted on by glue-line 123 on substrate 122
1242 is also parallel with the first surface 122a of substrate 122 and loading end 1262, so as to make the voice coil being placed on loading end 1262
The central shaft of motor 142 and the optical axis coincidence of photosensitive element 124.
As shown in Figures 1 and 3, in one embodiment, the bottom surface of the groove 1224 on the first surface 122a of substrate 122 is
Plane and opposite loading end 1262 tilts, the thickness of glue-line 123 with substrate 122 first surface 122a and loading end 1262 away from
From increase and increase.
In this way, although the bottom surface of the groove 1224 on the first surface 122a of substrate 122 is tilted with respect to loading end 1262,
Since the thickness of glue-line 123 changes with the distance between substrate 122 and loading end 1262 and makes glue-line 123 far from substrate
The surface of 122 sides is parallel always with loading end 1262, therefore the photosurface 1242 of the photosensitive element 124 on glue-line 123
It is still parallel with loading end 1262, so as to make the central shaft of the voice coil motor being placed on loading end 1,262 142 and photosensitive element
124 optical axis coincidence.
As shown in Fig. 1 and Fig. 4, in one embodiment, the bottom surface of the groove 1224 on the first surface 122a of substrate 122 is
Cambered surface, and the cambered surface is raised to the direction close to loading end 1262.In the present embodiment, the thickness of glue-line 123 is then with substrate
The increase of 122 first surface 122a and 1262 distance of loading end and increase, glue-line 123 contacts a side surface of substrate 122
It is arc-shaped, and the side surface that glue-line 123 contacts photosensitive element 124 is in still the plane parallel with loading end 1262.
In this way, although the bottom surface of the groove 1224 of substrate 122 is cambered surface, since the thickness of glue-line 123 is with substrate 122
The distance between loading end 1262 and change and make surface of the glue-line 123 far from 122 side of substrate always with loading end 1262
It is parallel, therefore the photosensitive element 124 on glue-line 123 is still parallel with loading end 1262, so as to make to be placed on loading end
The central shaft of voice coil motor 142 on 1262 and the optical axis coincidence of photosensitive element 124.
As shown in Figures 1 and 5, in one embodiment, the bottom surface of the groove 1224 on the first surface 122a of substrate 122 is
Cambered surface, the arc is away from the direction protrusion of loading end 1262.In the present embodiment, the thickness of glue-line 123 is also with substrate 122
First surface 122a and 1262 distance of loading end increase and increase, the side surface that glue-line 123 contacts substrate 122 is also in arc
Shape, and the side surface that glue-line 123 contacts photosensitive element 124 is in still the plane parallel with loading end 1262.
In this way, although the bottom surface of the groove 1224 of substrate 122 is cambered surface, since the thickness of glue-line 123 is with substrate 122
The distance between loading end 1262 and change and make surface of the glue-line 123 far from 122 side of substrate always with loading end 1262
It is parallel, therefore the photosensitive element 124 on glue-line 123 is still parallel with loading end 1262, so as to make to be placed on loading end
The central shaft of voice coil motor 142 on 1262 and the optical axis coincidence of photosensitive element 124.
It is appreciated that the shape that substrate 122 occurs due to deformation changes and the angle of inclination of installation is without being limited thereto, regardless of
How are the shape of substrate 122 and angle of inclination, the thickness of changeable glue-line 123 and the photosurface 1242 for making photosensitive element 124
Always it is parallel with loading end 1262, so as to make the central shaft of the voice coil motor being placed on loading end 1,262 142 and photosensitive element
124 optical axis overlaps always, has the camera module 100 for being equipped with the sunk type photosensory assembly 120 and voice coil motor 142 higher
Optical axis alignment precision, so as to preferable image quality.
Above-mentioned sunk type photosensory assembly 120, open up on the first surface 122a of substrate 122 for setting photosensitive element
124 groove 1224 mounts the glue overflowed in the process available for being housed in photosensitive element 124, prevents the glue overflowed covering sense
The solder joint of optical element 124 and substrate 122 and generate the phenomenon that 122 electrical contact of substrate is bad, and it is photosensitive to reduce the sunk type
The thickness of component 120.In addition, photosensitive element 124 is parallel always with loading end 1262 by glue-line 123, so as to avoid because inciting somebody to action
Substrate 122 generates larger gradient tolerance as machining benchmark.
As shown in fig. 6, a kind of sunk type photosensory assembly 220 of second embodiment, with the sinking in first embodiment
Formula photosensory assembly 120 is similar, which also includes substrate 222, photosensitive element 224 and packaging body 226.Its
In, substrate 222 includes the first surface 222a being oppositely arranged and second surface 222b, and first surface 222a opens up fluted
2224, photosensitive element 224 is set in the groove 2224 of substrate 222 and is electrically connected with substrate 222.Packaging body 226 is around photosensitive member
It part 224 and is molded on the first surface 222a of substrate 222.
Unlike first embodiment, in this second embodiment, which further includes benefit
Strong plate 228, groove 2224 run through the first surface 222a and second surface 222b of substrate 222, and stiffening plate 228 covers groove 2224
Towards the openend of second surface 222b.In this way, photosensitive element 224 passes completely through the groove 2224 of substrate 222 and is set on reinforcement
On plate 228.The glue overflowed in the process is mounted to can be filled in the glue covering photosensitive element in the groove 2224, preventing from overflowing
224 with the solder joint of substrate 222, so as to generate the phenomenon that 222 electrical contact of substrate is bad.Meanwhile groove 2224 opens up reduction
The thickness of the sunk type photosensory assembly 220, so as to being conducive to be equipped with the lightening of the setting of the sunk type photosensory assembly 220
Development.
Further, photosensitive element 224 is rectangle, therefore groove 2224 is also matched with the shape of photosensitive element 224
Rectangle, and the area of groove 2224 is more than the area of photosensitive element 224, prevents glue from flowing into order to accommodate the glue of spilling
Substrate 222 does not open up fluted 2224 part.
Please continue to refer to Fig. 6, in this second embodiment, after substrate 222 is convenient for slot treatment for Rigid Flex
Wires design.The stiffening plate 228 of 222 side of substrate is covered in while support photosensitive element 224 are played, can also improve this
The intensity of substrate 222, so as to improve the overall construction intensity of the sunk type photosensory assembly 220.
Further, photosensitive element 224 is electrically connected to substrate 222 by conductive connecting 225, and conductive connecting 2244 can
Think gold thread, copper wire, aluminum steel or silver wire etc..
Specifically, the both ends of conductive connecting 225 are electrically connected respectively with photosensitive element 224 and substrate 222, conductive connecting
225 can be formed by way of just beating：Use direction routing of the wiring tool from substrate 222 to photosensitive element 224.Conduction is even
Wiring 225 can also be formed by way of counter beat：Use direction routing of the wiring tool from photosensitive element 224 to substrate 222.
The camber of conductive connecting 225 formed by the way of counter beat is less than conductive connecting 225 that just mode of beating is formed, therefore
The slimming design of the sunk type photosensory assembly 120 can be further realized to a certain extent.
As shown in fig. 7, a kind of sunk type photosensory assembly 320 of third embodiment, including substrate 322, photosensitive element 324
And packaging body 326.Wherein, substrate 322 includes the first surface 322a being oppositely arranged and second surface 322b, first surface 322a
Fluted 3224 are opened up, photosensitive element 324 is set in the groove 3224 of substrate 322 and is electrically connected with substrate 322.Packaging body 326
Around photosensitive element 324 and it is molded on the first surface 322a of substrate 322.
The difference lies in this third embodiment, 324 1 side surface of photosensitive element is set with first embodiment
There is conductive prominence 3246, photosensitive element 324 is electrically connected to substrate 322 by conductive prominence 3246.Specifically in the present embodiment, it leads
Electric protrusion 3246 is soldered ball, and photosensitive element 324 is electrically connected by soldered ball with substrate 322, without setting conductive connecting, so as to
The distance between packaging body 326 and photosensitive element 324 can be reduced, so as to reduce the volume of the sunk type photosensory assembly 320.
Further, photosensitive element 324 is rectangle, therefore groove 3224 is also matched with the shape of photosensitive element 324
Rectangle, and the area of groove 3224 is more than the area of photosensitive element 324, prevents glue from flowing into order to accommodate the glue of spilling
Substrate 322 does not open up fluted 3224 part.
Please continue to refer to Fig. 7, in this third embodiment, substrate 322 is hard circuit board, ceramic substrate is (without soft
Plate) or Rigid Flex, so as to install and support photosensitive element 324 with higher intensity.
As shown in Figure 1, a kind of camera module 100 of this preferred embodiment mode, including above-mentioned sunk type photosensory assembly
120, further include optical module 140.
Wherein, the packaging body 126 of sunk type photosensory assembly 120 is equipped with loading end 1262, optics group far from 122 one end of substrate
Part 140 includes lens barrel, camera lens 144 and the voice coil motor 142 for adjusting the focal length of camera lens 144.Specifically, voice coil motor 142
On the loading end 1262 of packaging body 126.Lens barrel is set in voice coil motor 142, and camera lens 144 is set in lens barrel, camera lens
144 include the multiple eyeglasses being stacked.Light is incident from camera lens 144 and reaches photosensitive element 124, and photosensitive element 124 is by light
Signal is converted into electric signal.
Above-mentioned camera module 100, the voice coil motor 142 in optical module 140 are set on the loading end 1262 of packaging body 126
And with loading end 1262 for reference for installation, therefore the central axis and photosensitive element of the voice coil motor 142 of the camera module 100
The registration of 124 optical axis is higher, so as to higher optical axis coincidence accuracy, finally have higher image quality.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that the common skill for this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of sunk type photosensory assembly, which is characterized in that including：
Substrate, including the first surface and second surface being oppositely arranged, the first surface opens up fluted；
Photosensitive element is electrically connected in the groove of the substrate and with the substrate；And
Packaging body, the packaging body surround the photosensitive element and are molded to the first surface of the substrate.
2. sunk type photosensory assembly according to claim 1, which is characterized in that the groove is blind slot.
3. sunk type photosensory assembly according to claim 2, which is characterized in that the sunk type photosensory assembly further includes benefit
Strong plate, for the groove through the first surface and the second surface, the stiffening plate covers the groove towards described the
The openend on two surfaces.
4. sunk type photosensory assembly according to claim 1, which is characterized in that the photosensitive element passes through conductive connecting
The substrate is electrically connected to, is existed between the madial wall of the junction and the packaging body of the conductive connecting and the substrate
Spacing.
5. sunk type photosensory assembly according to claim 1, which is characterized in that one side surface of photosensitive element is equipped with and leads
Electric protrusion, the photosensitive element are electrically connected to the substrate by conductive prominence.
6. sunk type photosensory assembly according to claim 1, which is characterized in that the substrate is Rigid Flex.
7. sunk type photosensory assembly according to claim 1, which is characterized in that the photosensitive element is pasted on by glue-line
In the groove on the first surface of the substrate.
8. a kind of camera module, which is characterized in that including the sunk type photosensory assembly as described in claim 1~7 any one.
9. camera module according to claim 8, which is characterized in that the camera module further includes voice coil motor, described
Packaging body is equipped with loading end far from described substrate one end, and the voice coil motor is set on the loading end.
10. camera module according to claim 9, which is characterized in that the central axis of the voice coil motor and the sense
The optical axis coincidence of optical element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720469696.1U CN207560135U (en) | 2017-04-28 | 2017-04-28 | Camera module and its sunk type photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720469696.1U CN207560135U (en) | 2017-04-28 | 2017-04-28 | Camera module and its sunk type photosensory assembly |
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| CN207560135U true CN207560135U (en) | 2018-06-29 |
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| CN201720469696.1U Active CN207560135U (en) | 2017-04-28 | 2017-04-28 | Camera module and its sunk type photosensory assembly |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108810333A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its assemble method, sunk type photosensory assembly |
| CN110858868A (en) * | 2018-08-23 | 2020-03-03 | 南昌欧菲华光科技有限公司 | Camera module and photosensitive assembly thereof |
| CN110941072A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| WO2021027906A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module and electronic device |
| WO2021027905A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module, and electronic device |
-
2017
- 2017-04-28 CN CN201720469696.1U patent/CN207560135U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108810333A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its assemble method, sunk type photosensory assembly |
| CN110858868A (en) * | 2018-08-23 | 2020-03-03 | 南昌欧菲华光科技有限公司 | Camera module and photosensitive assembly thereof |
| CN110858868B (en) * | 2018-08-23 | 2022-01-14 | 江西晶浩光学有限公司 | Camera module and photosensitive assembly thereof |
| CN110941072A (en) * | 2018-09-21 | 2020-03-31 | 先进光电科技股份有限公司 | Optical imaging module |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
| WO2021027906A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module and electronic device |
| WO2021027905A1 (en) * | 2019-08-14 | 2021-02-18 | 欧菲光集团股份有限公司 | Base, camera module, and electronic device |
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