CN206743376U - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN206743376U CN206743376U CN201720477084.7U CN201720477084U CN206743376U CN 206743376 U CN206743376 U CN 206743376U CN 201720477084 U CN201720477084 U CN 201720477084U CN 206743376 U CN206743376 U CN 206743376U
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- sensitive cell
- packaging body
- conductive connecting
- photosensory assembly
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Abstract
It the utility model is related to a kind of camera module and its photosensory assembly, photosensory assembly includes substrate, photo-sensitive cell, packaging body and conductive connecting, substrate includes the first surface and second surface being oppositely arranged, photo-sensitive cell is arranged at first surface, packaging body winding photo-sensitive cell encapsulated moulding is in the first surface of substrate, substrate is electrically connected by conductive connecting with photo-sensitive cell, in the partly or completely embedded packaging body of conductive connecting, it will not be directly exposed to completely in space, more specifically, it is not exposed in the environment that is communicated with photo-sensitive cell, can effectively anti-oxidation and vapour corrosion.
Description
Technical field
Camera technology field is the utility model is related to, more particularly to a kind of camera module and its photosensory assembly.
Background technology
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Car field, medical domain etc., such as camera module have become the portable electric appts such as smart mobile phone, tablet personal computer
One of standard fitting.Image can not only be obtained by being applied to the camera module of portable electric appts, but also can be helped
Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts and
User requires more and more higher, the imaging to the overall dimensions and camera module of camera module for the image quality of camera module
Ability is proposed harsher requirement.That is, the development trend of portable electric appts requires that camera module is subtracting
Further improved on the basis of few size and strengthen imaging capability.
In the camera module that conventionally employed COB (Chip On Board) packaging technology is formed, gold thread exposes to space completely
In, more specifically, gold thread is completely exposed in the environment that is communicated with photo-sensitive cell, and gold thread is easily aoxidized and steam is rotten
Erosion.
Utility model content
Based on this, it is necessary to for above-mentioned technical problem, there is provided it is a kind of can effectively anti-oxidation and vapour corrosion take the photograph
As module and its photosensory assembly.
A kind of photosensory assembly, including：
Substrate, including the first surface and second surface being oppositely arranged；
Photo-sensitive cell, the first surface is arranged at, and is electrically connected with the substrate；
Packaging body, in the first surface of the substrate, the packaging body includes leaning on photo-sensitive cell encapsulated moulding described in winding
The inwall of the nearly photo-sensitive cell and the outer wall away from the photo-sensitive cell；And
Conductive connecting, is embedded at the inwall of the packaging body, and the photo-sensitive cell passes through the conductive connecting and institute
State substrate electrical connection.
In one of the embodiments, the packaging body coats the conductive connecting completely；Or
The encapsulation body portion coats the conductive connecting.
In one of the embodiments, the photo-sensitive cell includes photosurface and the non-sense set back on the photosurface
Smooth surface, the photosurface have photosensitive area and are set around the non-photo-sensing area that the photosensitive area is set, the non-sense of the photo-sensitive cell
Light area is embedded at the inwall of the packaging body；Or have between the non-photo-sensing area of the photo-sensitive cell and the inwall of the packaging body
There is spacing.
In one of the embodiments, the material of the conductive connecting is conductive material.
In one of the embodiments, the conductive material is any in gold, silver, copper, alloy, graphite or carbon fiber
Kind.
In one of the embodiments, the conductive connecting is gold thread, and the purity of the gold thread is more than 90%.
In one of the embodiments, the diameter of the conductive connecting is less than 0.9mil.
In one of the embodiments, a diameter of 0.8mil of the conductive connecting.
In one of the embodiments, the conductive connecting bending is curved, and the camber of the conductive connecting is 50 μ
M~80 μm.
A kind of camera module, including：
Photosensory assembly as described in any of the above one；
Optical filter, it is arranged on the photosensory assembly；And
Optical section, it is arranged on the packaging body, the optical section includes lens barrel and camera lens, and the lens assembling is in described
In lens barrel.
Above-mentioned camera module and its photosensory assembly at least have advantages below：
Substrate includes the first surface and second surface that are oppositely arranged, and photo-sensitive cell is arranged at first surface, packaging body around
If photo-sensitive cell encapsulated moulding, in the first surface of substrate, packaging body is included close to the inwall of photo-sensitive cell and away from photo-sensitive cell
Outer wall, the non-photo-sensing area of photo-sensitive cell is embedded at the inwall of packaging body, and conductive connecting is embedded at the inwall of packaging body, will not
It is directly exposed to completely in space, more specifically, is not exposed in the environment that is communicated with photo-sensitive cell, can effectively prevent
Oxidation and vapour corrosion.
Brief description of the drawings
Fig. 1 is the sectional view of camera module in first embodiment；
Fig. 2 is the sectional view of camera module in second embodiment.
Embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this
The embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be to be much different from other manner described here to implement, this area
Technical staff can do similar improvement in the case of without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Each technical characteristic of embodiment described above
Can arbitrarily it be combined, to make description succinct, not to all possible combination of each technical characteristic in above-described embodiment
All it is described, as long as however, contradiction is not present in the combination of these technical characteristics, is all considered to be the model of this specification record
Enclose.
Referring to Fig. 1, being the camera module 100 in first embodiment, the camera module 100 includes photosensory assembly 110
And optical section 120.Photosensory assembly 110 includes substrate 111, photo-sensitive cell 112, packaging body 113 and conductive connecting 114.Optics
Portion 120 includes lens barrel 121 and camera lens 122, and specific in first embodiment, optical section 120 also includes voice coil motor 123, sound
Coil motor 123 is arranged on packaging body 113, and lens barrel 121 is arranged in voice coil motor 123, and camera lens 122 is arranged in lens barrel 121,
Camera lens 122 includes multi-disc eyeglass.Camera module 100 also includes optical filter 130, and optical filter 130 is located at camera lens 122 and photo-sensitive cell
Between 112.I.e., in the first embodiment, camera module 100 is varifocal camera module.
Certainly, in other embodiments, optical section 120 can include microscope base, and voice coil motor is substituted using microscope base
123, microscope base is arranged on packaging body 113, and lens barrel 121 is arranged on microscope base, and camera lens 122 is arranged on lens barrel 121.That is, at it
In its embodiment, camera module 100 can also be to focus camera module.
Substrate 111 includes the first surface 1111 and second surface 1112 being oppositely arranged.Substrate 111 is wiring board, such as
Can be hard circuit board, ceramic substrate 111 (without soft board), or Rigid Flex, or be soft board, work as substrate
111 when being soft board, stiffening plate (not shown) can be set in the second surface 1112 of substrate 111, to strengthen the strong of substrate 111
Degree.
Photo-sensitive cell 112 is arranged at the first surface 1111 of substrate 111, and is electrically connected with substrate 111.Photo-sensitive cell 112
Can be CCD (Charge-coupled Device, charge coupled cell) or CMOS (Complementary Metal
Oxide Semiconductor, metal oxide semiconductor device).Photo-sensitive cell 112 be generally rectangle, square or
It is circular.For example, specific in first embodiment, photo-sensitive cell 112 is rectangle.
Photo-sensitive cell 112 includes the photosurface 112a and non-photo-sensing face 112b set back on photosurface 112a, non-photo-sensing
Face 112b is arranged on the first surface 1111 of substrate 111 by glue-line.Photosurface 112a includes photosensitive area 1121 and non-photo-sensing
Area 1122, photosensitive area 1121 are located at middle part, and non-photo-sensing area 1122 is set around photosensitive area 1121.Certainly, in other embodiment party
In formula, non-photo-sensing area 1122 can also be only located at the side of photosensitive area 1121.Light is incident from camera lens 122 and reaches photosurface
112a, photosurface 112a convert optical signals into electric signal, and are transferred to by substrate 111 on connector.
The encapsulated moulding of 113 winding photo-sensitive cell of packaging body 112 is in the first surface 1111 of substrate 111.It is real specific to first
Apply in mode, packaging body 113 is substantially in four frame shapes, including the end to end encapsulation side arm in four sides.Certainly, implement in others
In mode, packaging body 113 can also be in closed circular structure.
Packaging body 113 can be formed at the first surface 1111 of substrate 111 by molded mode.Packaging body 113
Including the inwall 113a close to the photo-sensitive cell 112 and outer wall 113b away from photo-sensitive cell 112.For example, using injection machine, pass through
Insert molding technique enters the wiring board after carrying out SMT (Surface Mount Technology, surface mounting technology) technique
Row molding forms packaging body 113, or forms packaging body 113 with the mould pressing process commonly used in semiconductor packages.The shape of packaging body 113
Into mode can select Shooting Technique or mould pressing process etc..Packaging body 113 after shaping is firmly connected with substrate 111,
Compared with conventional stent is bonded by glue-line, the bonding force between packaging body 113 and substrate 111 is much greater.
It can be nylon to use Shooting Technique to form the material of packaging body 113, LCP (Liquid Crystal Polymer,
Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 113 is formed using mould pressing process
Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select
Material, be illustrative only the mode of the present utility model that can implement, be not limitation of the present utility model.
Specific in first embodiment, in addition to electronic component 115.Electronic component 115 is arranged at the first of substrate 111
Surface 1111, and be embedded in packaging body 113.Therefore, electronic component 115 is covered by packaging body 133, will not directly be exposed
In in space, more specifically, it is not exposed in the environment that is communicated with photo-sensitive cell 112, so as to when being assembled into camera module
When 100, the pollutants such as dust will not be infected with electronic component 115, also do not interfere with photo-sensitive cell 112, avoid polluting photosensitive core
Piece and cause camera module 100 there are the bad phenomenons such as dirty stain.
Certainly, in other embodiments, electronic component 115 is arranged at the first surface 1111 of substrate 111, and is located at
Outside packaging body 113.That is, electronic component 115 is not wrapped by packaging body 113, thus the heat dispersion of electronic component 115 compared with
It is good.Electronic component 115 be located at packaging body 113 it is outer when in two kinds of situation：Electronic component 115 is located at the inwall side of packaging body 113,
The good heat dispersion performance of electronic component 115；Electronic component 115 is located at the outer wall side of packaging body 113, can reduce and be conductively connected
Safe distance between the inwall of line 114 and packaging body 113, further reduce the size of whole photosensory assembly 110.
Specific in first embodiment, photo-sensitive cell 112 is electrically connected by conductive connecting 114 with substrate 111.It is conductive
The both ends of connecting line 114 are connected to the first surface 1111 of photo-sensitive cell 112 and substrate 111.The non-sense of photo-sensitive cell 112
Light area 1122 is embedded at the inwall 113a of packaging body 113, and the complete coated with conductive connecting line 114 of packaging body 113.Therefore, it is conductive
Connecting line 114 will not be directly exposed to exterior space, so as to when assembling camera module 100 so that conductive connecting 114 will not
Damage is touched by any, while reduces influence of the environmental factor to conductive connecting 114, such as temperature so that photo-sensitive cell
Electric connection between 112 and substrate 111 is more stable.And conductive connecting 114 is coated in packaging body 113, it is not easy to
Oxidized and vapour corrosion.
Certainly, in other embodiments, the non-photo-sensing area 1122 of photo-sensitive cell 112 can also be with packaging body 113
Have between inwall 113a at regular intervals.
Referring to Fig. 2, it is the camera module 200 in second embodiment.In this second embodiment, photo-sensitive cell 112
Non-photo-sensing area 1122 be embedded at the inwall 113a of packaging body 113, and the part coated with conductive connecting line 114 of packaging body 113.That is,
Conductive connecting 114 is only partly directly exposed to exterior space.It is completely exposed to compared to traditional conductive connecting 114 outer
In portion space, in the camera module 100 in second embodiment, conductive connecting 114 is not easy to be oxidized and vapour corrosion.
Specific in first or second embodiment, conductive connecting 114 can be gold thread, and the purity of gold thread is more than
90%.Because packaging body 113 is formed at first substrate 111 by way of encapsulated moulding, conductive connecting 114 is coated on envelope
Fill in body 113, therefore the purity of gold thread can be reduced to the intensity that can also ensure conductive connecting 114 more than 90%,
Cost can effectively be reduced.
Specific in first or second embodiment, the diameter of conductive connecting 114 is less than 0.9mil.Because packaging body
113 are formed at first substrate 111 by way of encapsulated moulding, and conductive connecting 114 is coated in packaging body 113, therefore
The diameter of conductive connecting 114 can be accomplished smaller.For example, a diameter of 0.8mil of conductive connecting 114.Compared to traditional
Conductive connecting 114, the selectable diameter range of the conductive connecting 114 in present embodiment are bigger.
Specific in first or second embodiment, conductive connecting 114 can be formed by way of just beating：Using beating
Direction routing of the Line tool from substrate 111 to photo-sensitive cell 112.Certainly, in other embodiments, conductive connecting 114
It can also be formed by way of counter beat：Use direction routing of the wiring tool from photo-sensitive cell 112 to substrate 111.Using anti-
The camber for the conductive connecting 114 that the mode beaten is formed is less than the conductive connecting 114 that just mode of beating is formed.Conductive connecting
114 bendings are curved, and the camber of conductive connecting 114 is 50 μm~80 μm.
The material of conductive connecting 114 can be conductive material.For example, conductive material can be silver, copper, alloy, graphite
Or carbon fiber, therefore, the selectable range of the material of conductive connecting 114 also increases.
Above-mentioned camera module 100 and its photosensory assembly 110 at least have advantages below：
Substrate 111 includes the first surface 1111 and second surface 1112 being oppositely arranged, and photo-sensitive cell 112 is arranged at first
Surface 1111, photo-sensitive cell 112 include the photosurface 112a and non-photo-sensing face 112b set back on photosurface 112a, photosurface
112a has photosensitive area 1121 and non-photo-sensing area 1122, and the encapsulated moulding of 113 winding photo-sensitive cell of packaging body 112 is in substrate 111
First surface 1111, the non-photo-sensing area 1122 of photo-sensitive cell 112 are embedded in packaging body 113, and substrate 111 passes through conductive connecting
114 electrically connect with photo-sensitive cell 112, the inwall 113a of the partly or completely embedded packaging body 113 of conductive connecting 114, will not
It is directly exposed in space, more specifically, is not exposed in the environment that is communicated with photo-sensitive cell 112 completely, can be effective
Anti- oxidation and vapour corrosion.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. photosensory assembly, it is characterised in that including：Substrate, including the first surface and second surface being oppositely arranged；Photo-sensitive cell, the first surface is arranged at, and is electrically connected with the substrate；Packaging body, photo-sensitive cell encapsulated moulding described in winding include close to institute in the first surface of the substrate, the packaging body State the inwall of photo-sensitive cell and the outer wall away from the photo-sensitive cell；AndConductive connecting, is embedded at the inwall of the packaging body, and the photo-sensitive cell passes through the conductive connecting and the base Plate electrically connects.
- 2. photosensory assembly according to claim 1, it is characterised in that be conductively connected described in packaging body cladding completely Line；OrThe encapsulation body portion coats the conductive connecting.
- 3. photosensory assembly according to claim 1, it is characterised in that the photo-sensitive cell includes photosurface and back on institute The non-photo-sensing face of photosurface setting is stated, the photosurface has photosensitive area and is set around the non-photo-sensing area that the photosensitive area is set, The non-photo-sensing area of the photo-sensitive cell is embedded at the inwall of the packaging body；Or the non-photo-sensing area of the photo-sensitive cell with it is described There is spacing between the inwall of packaging body.
- 4. photosensory assembly according to claim 1, it is characterised in that the material of the conductive connecting is conductive material.
- 5. photosensory assembly according to claim 4, it is characterised in that the conductive material is gold, silver, copper, alloy, graphite Or any of carbon fiber.
- 6. the photosensory assembly according to claim 4 or 5, it is characterised in that the conductive connecting is gold thread, the gold thread Purity be more than 90%.
- 7. photosensory assembly according to claim 4, it is characterised in that the diameter of the conductive connecting is less than 0.9mil.
- 8. photosensory assembly according to claim 7, it is characterised in that a diameter of 0.8mil of the conductive connecting.
- 9. photosensory assembly according to claim 1, it is characterised in that the conductive connecting bending is curved, described to lead The camber of electric connection line is 50 μm~80 μm.
- A kind of 10. camera module, it is characterised in that including：Photosensory assembly as in one of claimed in any of claims 1 to 9；Optical filter, it is arranged on the photosensory assembly；AndOptical section, it is arranged on the packaging body, the optical section includes lens barrel and camera lens, and the lens assembling is in the lens barrel It is interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720477084.7U CN206743376U (en) | 2017-04-28 | 2017-04-28 | Camera module and its photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720477084.7U CN206743376U (en) | 2017-04-28 | 2017-04-28 | Camera module and its photosensory assembly |
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| Publication Number | Publication Date |
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| CN206743376U true CN206743376U (en) | 2017-12-12 |
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| CN201720477084.7U Active CN206743376U (en) | 2017-04-28 | 2017-04-28 | Camera module and its photosensory assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112447614A (en) * | 2019-08-30 | 2021-03-05 | 朋程科技股份有限公司 | Power device packaging structure |
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2017
- 2017-04-28 CN CN201720477084.7U patent/CN206743376U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112447614A (en) * | 2019-08-30 | 2021-03-05 | 朋程科技股份有限公司 | Power device packaging structure |
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