CN206922890U - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN206922890U CN206922890U CN201720472893.9U CN201720472893U CN206922890U CN 206922890 U CN206922890 U CN 206922890U CN 201720472893 U CN201720472893 U CN 201720472893U CN 206922890 U CN206922890 U CN 206922890U
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- flexible pcb
- sensitive cell
- packaging body
- stiffening plate
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Abstract
It the utility model is related to a kind of camera module and its photosensory assembly,Photosensory assembly includes flexible PCB,Photo-sensitive cell,Stiffening plate and packaging body,Flexible PCB includes the first surface and second surface being oppositely arranged,Photo-sensitive cell is arranged at first surface and electrically connected with flexible PCB,Packaging body winding photo-sensitive cell encapsulated moulding is in the first surface of flexible PCB,Therefore the packaging body after being molded firmly is connected with flexible PCB,It can not almost be dismantled from flexible PCB,Packaging body after encapsulated moulding has certain intensity in itself,Therefore stiffening plate can be sized to the size more than photo-sensitive cell,Less than the size of flexible PCB,Orthographic projection of the photo-sensitive cell in the plane where stiffening plate is located in the range of stiffening plate,The intensity sum of packaging body and stiffening plate can reach the requirement of carrying optical section,And the size of whole camera module is reduced compared to the camera module that traditional COB modes are formed.
Description
Technical field
Camera technology field is the utility model is related to, more particularly to a kind of camera module and its photosensory assembly.
Background technology
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Car field, medical domain etc., such as camera module have become the portable electric appts such as smart mobile phone, tablet personal computer
One of standard fitting.Image can not only be obtained by being applied to the camera module of portable electric appts, but also can be helped
Portable electric appts realize the functions such as instant video call.With the increasingly lightening development trend of portable electric appts and
User requires more and more higher, the imaging to the overall dimensions and camera module of camera module for the image quality of camera module
Ability is proposed harsher requirement.That is, the development trend of portable electric appts requires that camera module is subtracting
Further improved on the basis of few size and strengthen imaging capability.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, i.e. shooting mould
Wiring board, photo-sensitive cell, the support etc. of group are made into respectively, then successively by passive electronic component, photo-sensitive cell and support
Encapsulation is in the circuit board.But the camera module size that this packaged type is formed is larger, can not meet what size increasingly reduced
Trend.
Utility model content
Based on this, it is necessary to for above-mentioned technical problem, there is provided a kind of camera module that can effectively reduce size and its
Photosensory assembly.
A kind of photosensory assembly, including：
Flexible PCB, including the first surface and second surface being oppositely arranged；
Photo-sensitive cell, the first surface of the flexible PCB is arranged at, and is electrically connected with the flexible PCB；
Stiffening plate, is arranged at the second surface of the flexible PCB, and the size of the stiffening plate is more than the photosensitive member
The size of part, and less than the flexible PCB size, the photo-sensitive cell in the plane where the stiffening plate just
Projection is located in the range of the stiffening plate；And
Packaging body, photo-sensitive cell encapsulated moulding is in the first surface of the flexible PCB described in winding.
In one of the embodiments, the center line of the stiffening plate overlaps with the center line of the photo-sensitive cell.
In one of the embodiments, the photo-sensitive cell includes photosurface and the non-sense set back on the photosurface
Smooth surface, the photosurface have photosensitive area and are set around the non-photo-sensing area of the photosensitive area, and the non-photo-sensing area is embedded at completely
In the packaging body.
In one of the embodiments, the photo-sensitive cell includes photosurface and the non-sense set back on the photosurface
Smooth surface, the photosurface have photosensitive area and are set around the non-photo-sensing area of the photosensitive area, and non-photo-sensing area part is embedded at
In the packaging body.
In one of the embodiments, the photo-sensitive cell is electrically connected to the flexible PCB by conductive connecting.
In one of the embodiments, the conductive connecting is embedded in the packaging body completely.
In one of the embodiments, the photo-sensitive cell is electrically connected to the flexible PCB by conductive connecting,
The conductive connecting part is embedded in the packaging body.
In one of the embodiments, the photo-sensitive cell is by being arranged at the conduction in the non-photo-sensing face of the photo-sensitive cell
Projection is electrically connected to the flexible PCB.
In one of the embodiments, one end of the flexible PCB is electrically connected with substrate, and the electronic component is set
In on the substrate.
A kind of camera module, including：
Photosensory assembly as described in any of the above one.
Above-mentioned camera module and its photosensory assembly at least have advantages below：
Flexible PCB includes the first surface and second surface that are oppositely arranged, photo-sensitive cell be arranged at first surface and with
Flexible PCB electrically connects, and packaging body winding photo-sensitive cell encapsulated moulding is in the first surface of flexible PCB, therefore after being molded
Packaging body be firmly connected with flexible PCB, it is virtually impossible to dismantled from flexible PCB, the packaging body sheet after encapsulated moulding
Body has certain intensity, therefore stiffening plate can be sized to the size more than photo-sensitive cell, less than flexible circuit
The size of plate, orthographic projection of the photo-sensitive cell in the plane where stiffening plate are located in the range of stiffening plate, packaging body and reinforcement
The intensity sum of plate can reach the requirement of carrying optical section, and be reduced compared to the camera module that traditional COB modes are formed
The size of whole camera module.
Brief description of the drawings
Fig. 1 is the sectional view of camera module in first embodiment；
Fig. 2 is the sectional view of camera module in second embodiment；
Fig. 3 is the sectional view of camera module in the 3rd embodiment.
Embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this
The embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be to be much different from other manner described here to implement, this area
Technical staff can do similar improvement in the case of without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Each technical characteristic of embodiment described above
Can arbitrarily it be combined, to make description succinct, not to all possible combination of each technical characteristic in above-described embodiment
All it is described, as long as however, contradiction is not present in the combination of these technical characteristics, is all considered to be the model of this specification record
Enclose.
Referring to Fig. 1, it is the camera module 100 in first embodiment.The camera module 100 includes photosensory assembly 110
And optical section 120.Specifically, photosensory assembly 110 includes flexible PCB 111, photo-sensitive cell 112, stiffening plate 113 and packaging body
114.Optical section 120 includes lens barrel 121 and camera lens 122.
Specific in first embodiment, optical section 120 also includes voice coil motor 123, and voice coil motor 123 is arranged at encapsulation
On body 114, lens barrel 121 is arranged in voice coil motor 123, and camera lens 122 is arranged in lens barrel 121, and camera lens 122 includes multiple mirrors
Piece.Camera module 100 also includes optical filter 130, and optical filter 130 is located at the top of photo-sensitive cell 112.That is, in the first embodiment party
In formula, camera module 100 is varifocal camera module.
Certainly, in other embodiments, optical section 120 includes microscope base, and voice coil motor 123 is replaced using microscope base.Mirror
Seat is arranged on packaging body 114, and lens barrel 121 is arranged on microscope base, and camera lens 122 is arranged in lens barrel 121, and camera lens 122 includes more
Individual eyeglass.I.e., in other embodiments, camera module 100 is to focus camera module.
Specific in first embodiment, flexible PCB 111 includes the table of first surface 1111 and second being oppositely arranged
Face 1112.Photo-sensitive cell 112 is arranged at the first surface 1111 of flexible PCB 111, and is electrically connected with flexible PCB 111.
Specifically, photo-sensitive cell 112 can be CCD (Charge-coupled Device, charge coupled cell) or CMOS
(Complementary Metal Oxide Semiconductor, metal oxide semiconductor device).Photo-sensitive cell 112 1
As be rectangle, square or circle.For example, specific in first embodiment, photo-sensitive cell 112 is rectangle.
Photo-sensitive cell 112 includes the photosurface 112a and non-photo-sensing face 112b set back on photosurface 112a, non-photo-sensing
Face 112b is arranged on the first surface 1111 of flexible PCB 111 by glue-line.Photosurface 112a include photosensitive area 1121 and
Non-photo-sensing area 1122, photosensitive area 1121 are located at middle part, and non-photo-sensing area 1122 is set around photosensitive area 1121.Certainly, in others
In embodiment, non-photo-sensing area 1122 can also be only located at the side of photosensitive area 1121.Light is incident from camera lens 122 and reaches sense
Smooth surface 112a, photosurface 112a convert optical signals into electric signal, and are transferred to by flexible PCB 111 on connector.
Specific in first embodiment, photo-sensitive cell 112 is electrically connected by conductive connecting 115 and flexible PCB 111
Connect.Conductive connecting 115 can be gold thread, copper cash, aluminum steel or silver wire etc..The both ends of conductive connecting 115 respectively with sense
Optical element 112 and flexible PCB 111 are electrically connected, and conductive connecting 115 can be formed by way of just beating：Use routing work
Has the direction routing from flexible PCB 111 to photo-sensitive cell 112.Conductive connecting 115 can also by way of counter beat shape
Into：Use direction routing of the wiring tool from photo-sensitive cell 112 to flexible PCB 111.What is formed by the way of counter beat is led
The camber of electric connection line 115 is less than the conductive connecting 115 that just mode of beating is formed.
Certainly, referring to Fig. 2, being the camera module 200 in second embodiment.In this second embodiment, can also
Conductive bumps 116 are set by the non-photo-sensing face 112b in photo-sensitive cell 112, photo-sensitive cell is electrically connected by conductive bumps 116
112 with flexible PCB 111.When electrically connecting photo-sensitive cell 112 with flexible PCB 111 by setting conductive bumps 116, without
Safe spacing is set around photo-sensitive cell 112, can further reduce the chi of the XY direction of principal axis of whole camera module 100
It is very little.And conductive bumps 116 are shorter compared to the camber of conductive connecting 115, the Z axis of whole camera module 100 can be reduced
Direction size.
Specific in first embodiment, the encapsulated moulding of 114 winding photo-sensitive cell of packaging body 112 is in flexible PCB 111
First surface 1111.Packaging body 114 includes the inwall close to photo-sensitive cell 112 and the outer wall away from photo-sensitive cell 112, encapsulation
Body 114 is substantially in four frame shape structures.
Packaging body 114 can be formed at the first surface 1111 of flexible PCB 111 by molded mode.Example
Such as, using injection machine, SMT (Surface Mount Technology, surface mount skill will be carried out by insert molding technique
Art) wiring board after technique carries out molding and forms packaging body 114, or forms envelope with the mould pressing process commonly used in semiconductor packages
Fill body 114.The mode that packaging body 114 is formed can select Shooting Technique or mould pressing process etc..Packaging body 114 after shaping
Firmly be connected with flexible PCB 111, compared with traditional microscope base is bonded by glue-line, packaging body 114 and flexible PCB 111 it
Between bonding force it is much greater.
It can be nylon to use Shooting Technique to form the material of packaging body 114, LCP (Liquid Crystal Polymer,
Polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., the material of packaging body 114 is formed using mould pressing process
Can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and can select
Material, be illustrative only the mode of the present utility model that can implement, be not limitation of the present utility model.
Stiffening plate 113 is arranged at the second surface 1112 of flexible PCB 111, and the size of stiffening plate 113 is more than photosensitive member
The size of part 112, and the size of stiffening plate 113 is less than the size of flexible PCB 111, photo-sensitive cell 112 is in the institute of stiffening plate 113
Plane on orthographic projection be located at stiffening plate 113 in the range of.I.e., in the first embodiment, not in flexible PCB
111 whole face all sets stiffening plate 113, but sets stiffening plate 113 in the region corresponding to photo-sensitive cell 112, to strengthen sense
The intensity of the flexible PCB 111 in the region of optical element 112.Therefore, the material of stiffening plate 113, and reinforcement can not only be saved
The intensity of plate 113 is combined with the intensity of of packaging body 114 itself, is born optical section 120 enough and is prevented flexible PCB 111
It is deformed.
Specifically, stiffening plate 113 can be made up of the larger material of intensity, with to photo-sensitive cell 112 and flexible PCB
111 provide sufficiently large supporting force, prevent flexible PCB 111 from deforming.In the present embodiment, stiffening plate 113 can be with
For metallic plate.Certainly, in other embodiments, stiffening plate 113 can be intensity larger ceramic wafer or plastic plate.
Specific in first embodiment, the center line of stiffening plate 113 overlaps with the center line of photo-sensitive cell 112.It is more excellent
In the case of choosing, the center line of photo-sensitive cell 112 can be with the optical axis coincidence of camera lens 122, therefore the center line of stiffening plate 113, sense
The center line of optical element 112, the optical axis three of camera lens 122 overlap (the dotted line A in such as Fig. 1), can ensure optical section 120, sense
The distribution of forces of optical element 112 and packaging body 114 on stiffening plate 113 is uniform.
Certainly, in other embodiments, the center line of stiffening plate 113 can also with the center line of photo-sensitive cell 112
Misaligned setting, as long as ensureing that orthographic projection of the photo-sensitive cell 112 in the plane where stiffening plate 113 is located at stiffening plate 113
In the range of, task difficulty is advantageously reduced, improves operating efficiency.
Referring to Fig. 1, the non-photo-sensing area 1122 of photo-sensitive cell 112 is embedded in packaging body 114, and therefore, photo-sensitive cell 112
Periphery can all be embedded in packaging body 114, the intensity of of photo-sensitive cell 112 itself, the intensity of of packaging body 114 itself, photo-sensitive cell
112 are embedded at the intensity collective effect for the structure being collectively forming in packaging body 114 with packaging body 114, can be further ensured that soft
The intensity of property circuit board and whole camera module.
Conductive connecting 115 is also embedded in packaging body 114 completely.Therefore, conductive connecting 115 will not be directly exposed to
Exterior space, so as to when assembling camera module 100 so that conductive connecting 115 will not be touched damage by any, simultaneously
Reduce influence of the environmental factor to conductive connecting 115, such as temperature so that between photo-sensitive cell 112 and flexible PCB 111
It is electrically connected with more stable.And be advantageous to further reduce the size of whole camera module 100.
Certainly, in other embodiments or the part of non-photo-sensing area 1122 of photo-sensitive cell 112 is embedded at envelope
Fill in body 114, conductive connecting 115 is embedded in packaging body 114 completely.This embodiment compared to shown in Fig. 1, processing essence
Degree requires to reduce, and can reduce task difficulty, improves operating efficiency.
Certainly, referring to Fig. 3, being the camera module 300 in the 3rd embodiment.In the third embodiment, it is photosensitive
Element 112 is electrically connected to flexible PCB 111 by conductive connecting 115, and the part of conductive connecting 115 is embedded at packaging body
In 114, packaging body 114 is partly exposed to, simplifies processing step.
Fig. 1, Fig. 2 and Fig. 3 are referred to, in first, second, and third embodiment, camera module 100 also includes electronics
Element 116, electronic component 116 electrically connect with flexible PCB 111 and outside packaging bodies 114, therefore electronic component 116 is scattered
Hot property is preferable.Specifically, electronic component 116 can be resistance, electric capacity, diode, triode, potentiometer, relay or drive
Dynamic device.
One end of flexible PCB 111 is provided with substrate 117.Electronic component 116 is arranged on substrate 117, therefore, Ke Yijin
One step reduces the size of packaging body 114, and then reduces the size of whole camera module 100.
Above-mentioned camera module 100 and its photosensory assembly 110 with flexible PCB 111 are at least with advantages below：
Flexible PCB 111 includes the first surface 1111 and second surface 1112 being oppositely arranged, and photo-sensitive cell 112 is set
Electrically connected in first surface 1111 and with flexible PCB 111, the encapsulated moulding of 114 winding photo-sensitive cell of packaging body 112 is in flexibility
The first surface 1111 of circuit board 111, therefore the packaging body 114 after shaping is firmly connected with flexible PCB 111, it is virtually impossible to
Dismantled from flexible PCB 111, the packaging body 114 after encapsulated moulding itself has certain intensity, therefore can be by reinforcement
Plate 113 is sized to the size more than photo-sensitive cell 112, and less than the size of flexible PCB 111, photo-sensitive cell 112 exists
The orthographic projection in plane where stiffening plate 113 is located in the range of stiffening plate 113, the intensity of packaging body 114 and stiffening plate 113
Sum can reach the requirement of carrying optical section 120, and reduce compared to the camera module 100 that traditional COB modes are formed whole
The size of individual camera module 100.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. photosensory assembly, it is characterised in that including：Flexible PCB, including the first surface and second surface being oppositely arranged；Photo-sensitive cell, the first surface of the flexible PCB is arranged at, and is electrically connected with the flexible PCB；Stiffening plate, is arranged at the second surface of the flexible PCB, and the size of the stiffening plate is more than the photo-sensitive cell Size, and less than the size of the flexible PCB, orthographic projection of the photo-sensitive cell in the plane where the stiffening plate In the range of the stiffening plate；AndPackaging body, photo-sensitive cell encapsulated moulding is in the first surface of the flexible PCB described in winding.
- 2. photosensory assembly according to claim 1, it is characterised in that the center line of the stiffening plate and the photo-sensitive cell Center line overlap.
- 3. photosensory assembly according to claim 1, it is characterised in that the photo-sensitive cell includes photosurface and back on institute The non-photo-sensing face of photosurface setting is stated, the photosurface has photosensitive area and is set around the non-photo-sensing area of the photosensitive area, described Non-photo-sensing area is embedded in the packaging body completely.
- 4. photosensory assembly according to claim 1, it is characterised in that the photo-sensitive cell includes photosurface and back on institute The non-photo-sensing face of photosurface setting is stated, the photosurface has photosensitive area and is set around the non-photo-sensing area of the photosensitive area, described Non-photo-sensing area part is embedded in the packaging body.
- 5. the photosensory assembly according to claim 3 or 4, it is characterised in that the photo-sensitive cell passes through conductive connecting electricity It is connected to the flexible PCB.
- 6. photosensory assembly according to claim 5, it is characterised in that the conductive connecting is embedded at the encapsulation completely In vivo.
- 7. photosensory assembly according to claim 1, it is characterised in that the photo-sensitive cell is electrically connected by conductive connecting In the flexible PCB, the conductive connecting part is embedded in the packaging body.
- 8. the photosensory assembly according to claim 3 or 4, it is characterised in that the photo-sensitive cell is by being arranged at the sense The conductive bumps in the non-photo-sensing face of optical element are electrically connected to the flexible PCB.
- 9. photosensory assembly according to claim 1, it is characterised in that one end of the flexible PCB is electrically connected with base Plate, electronic component is provided with the substrate.
- A kind of 10. camera module, it is characterised in that including：Photosensory assembly as described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720472893.9U CN206922890U (en) | 2017-04-28 | 2017-04-28 | Camera module and its photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720472893.9U CN206922890U (en) | 2017-04-28 | 2017-04-28 | Camera module and its photosensory assembly |
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| Publication Number | Publication Date |
|---|---|
| CN206922890U true CN206922890U (en) | 2018-01-23 |
Family
ID=61306652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720472893.9U Active CN206922890U (en) | 2017-04-28 | 2017-04-28 | Camera module and its photosensory assembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108810328A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN110858868A (en) * | 2018-08-23 | 2020-03-03 | 南昌欧菲华光科技有限公司 | Camera module and photosensitive assembly thereof |
-
2017
- 2017-04-28 CN CN201720472893.9U patent/CN206922890U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108810328A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN110858868A (en) * | 2018-08-23 | 2020-03-03 | 南昌欧菲华光科技有限公司 | Camera module and photosensitive assembly thereof |
| CN110858868B (en) * | 2018-08-23 | 2022-01-14 | 江西晶浩光学有限公司 | Camera module and photosensitive assembly thereof |
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