CN206743374U - Camera module and its antisitic defect photosensory assembly - Google Patents
Camera module and its antisitic defect photosensory assembly Download PDFInfo
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- CN206743374U CN206743374U CN201720472914.7U CN201720472914U CN206743374U CN 206743374 U CN206743374 U CN 206743374U CN 201720472914 U CN201720472914 U CN 201720472914U CN 206743374 U CN206743374 U CN 206743374U
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- substrate
- accommodating chamber
- photosensory assembly
- antisitic defect
- photo
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Abstract
A kind of camera module and its antisitic defect photosensory assembly is the utility model is related to, antisitic defect photosensory assembly includes：Substrate；Photo-sensitive cell, on substrate；Packaging body, on substrate, packaging body includes the accommodating chamber of both ends open, and accommodating chamber extends to the side surface away from substrate from packaging body close to a side surface of the substrate, and photo-sensitive cell is contained in accommodating chamber；Packaging body is provided with loading end and anti-overflow face away from substrate one end, and the distance of loading end opposing substrate is more than the distance of anti-overflow face opposing substrate and forms step structure, and anti-overflow face is located at loading end close to accommodating chamber side；Optical filter, on loading end and cover accommodating chamber.Above-mentioned antisitic defect photosensory assembly, when photo-sensitive cell is fitted on the loading end of packaging body by glue, the glue overflowed between optical filter and loading end rear on anti-overflow face is flow to can stop flowing, without being flowed directly on photo-sensitive cell, the photosensitive effect of the antisitic defect photosensory assembly is influenceed so as to avoid damage to photo-sensitive cell.
Description
Technical field
Camera module field is the utility model is related to, more particularly to a kind of camera module and its antisitic defect photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences the also constantly increase, therefore cause camera module of the area of the photo-sensitive cell of image quality
Assembling difficulty constantly increase, its overall dimensions also constantly increases, therefore the lightening of camera module receives very big limitation, enters
And limit the volume of the smart machine provided with the camera module.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, i.e. shooting mould
Wiring board, photo-sensitive cell, the support etc. of group are made into respectively, then successively by passive electronic component, photo-sensitive cell and support
Encapsulation is in the circuit board.But the camera module size that this packaged type is formed is larger, can not meet what size increasingly reduced
Trend.
Therefore it is lightening in order to solve the problems, such as, start to use the encapsulating structure collecting by molded formation in industry
Photo-sensitive cell and fixed other components.Specifically, after photo-sensitive cell and other components are connected into wiring board, pass through into
Type instrument is molded to form encapsulating structure to house photo-sensitive cell and the optical module of installation kit containing optical lens etc. in the circuit board
Other components.It using the above method, can combine the structural integrities such as photo-sensitive cell, wiring board, various electronic components, so as to
Reduce the overall dimensions of camera module.
But above-mentioned encapsulating structure is used, the anti-dazzling screen of camera module is pasted onto support by glue or encapsulation is tied
On structure, and in taping process, by optical filter extruding surplus glue easily between anti-dazzling screen and support or encapsulating structure
Overflow and flow on photo-sensitive cell.And array is provided with multiple pixels in the photosensitive area of photo-sensitive cell, each pixel is corresponding
Provided with an extremely flimsy micron-sized lenticule, therefore the glue for flowing into photosensitive area easily damages lenticule, and any one
Individual lenticule is damaged, then necessarily causes the damage of photosensitive area and influence the image quality of camera module.
At present, can also use gel quantity of the dispensing mouth within the unit interval of control point gum machine to avoid glue excessive and from
Overflowed between optical filter and support or encapsulating structure, but the dispensing time can be extended using which, so as to influence the peace of optical filter
Fill efficiency.
Utility model content
Based on this, it is necessary to for damaging photo-sensitive cell for fixing the glue of anti-dazzling screen easily to flow to photo-sensitive cell
Problem, there is provided it is a kind of avoid for fix the glue of anti-dazzling screen to flow to photo-sensitive cell and damage photo-sensitive cell camera module and
Its antisitic defect photosensory assembly.
A kind of antisitic defect photosensory assembly, including：
Substrate；
Photo-sensitive cell, on the substrate；
Packaging body, on the substrate, the packaging body includes the accommodating chamber of both ends open, and the accommodating chamber is described in
Packaging body extends to the side surface away from the substrate close to a side surface of the substrate, and the photo-sensitive cell is contained in institute
State in accommodating chamber；The packaging body is provided with loading end and anti-overflow face, the relatively described base of the loading end away from described substrate one end
The distance of plate is more than the distance of the relatively described substrate in the anti-overflow face and forms step structure, and the anti-overflow face is positioned at described
Loading end is close to the accommodating chamber side；And
Optical filter, on the loading end and cover the accommodating chamber.
Above-mentioned antisitic defect photosensory assembly, when photo-sensitive cell is fitted on the loading end of packaging body by glue, from optical filtering
The glue overflowed between piece and loading end rear on anti-overflow face is flow to can stop flowing, without being flowed directly on photo-sensitive cell,
The photosensitive effect of the antisitic defect photosensory assembly is influenceed so as to avoid damage to photo-sensitive cell, without being controlled because avoiding glue from overflowing
Dispensing speed processed and reduce the installation effectiveness of optical filter.
In one of the embodiments, the anti-overflow face is laterally away from institute from the packaging body close to the one of the accommodating chamber
The direction extension of accommodating chamber is stated, and the anti-overflow face is set with the substrate-parallel.
In one of the embodiments, the anti-overflow face is laterally away from institute from the packaging body close to the one of the accommodating chamber
The direction for stating accommodating chamber tilts extension, and the distance of the relatively described substrate in the anti-overflow face is laterally remote from the close accommodating chamber one
It is gradually reduced from the accommodating chamber side.
In one of the embodiments, the anti-overflow face offers the first accepting groove.
In one of the embodiments, the anti-overflow face is provided with two or more first accepting grooves, two
Or more than two first accepting grooves are arranged at intervals.
In one of the embodiments, the anti-overflow face is provided with stopper close to a lateral edges of the accommodating chamber.
In one of the embodiments, the height of the stopper is less than or equal to the height of the loading end.
In one of the embodiments, the carrying is recessed towards the orientation substrate.
In one of the embodiments, the loading end is provided with the second accepting groove.
A kind of camera module, including above-mentioned antisitic defect photosensory assembly.
Brief description of the drawings
Fig. 1 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 2 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 3 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 4 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 5 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 6 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 7 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 8 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Fig. 9 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Figure 10 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Figure 11 is the sectional view of the antisitic defect photosensory assembly of an embodiment；
Figure 12 is the sectional view of the camera module of an embodiment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in many different forms
Realize, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to of the present utility model
The understanding of disclosure more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more related Listed Items.
As shown in figure 1, a kind of antisitic defect photosensory assembly 100 of this better embodiment, including substrate 20, photo-sensitive cell
40th, packaging body 60 and optical filter 80.
Wherein, photo-sensitive cell 40 is on substrate 20, and for packaging body 60 on substrate 20, packaging body 60 includes both ends open
Accommodating chamber 62, the accommodating chamber 62 extends to packaging body 60 away from substrate 20 from packaging body 60 close to a side surface of substrate 20
One side surface, photo-sensitive cell 40 are contained in accommodating chamber 62.Packaging body 60 away from the one end of substrate 20 be provided with loading end 64 with it is anti-overflow
Face 66, the distance of the opposing substrate 20 of loading end 64 are more than the distance of the anti-overflow opposing substrate 20 of face 66 and are collectively forming stepped knot
Structure, and anti-overflow face 66 is located at loading end 64 close to the side of accommodating chamber 62.Optical filter 80 is located on loading end 64 and covers accommodating chamber
62。
Above-mentioned antisitic defect photosensory assembly 100, when photo-sensitive cell 40 is fitted on the loading end 64 of packaging body 60 by glue
When, the glue overflowed between optical filter 80 and loading end 64 rear on anti-overflow face 66 is flow to can stop flowing, without direct
It flow on photo-sensitive cell 40, influences the photosensitive effect of the antisitic defect photosensory assembly 100 so as to avoid damage to photo-sensitive cell 40, and
The installation effectiveness of optical filter 80 is reduced without controlling dispensing speed because avoiding glue from overflowing.
Please continue to refer to Fig. 1, substrate 20 is wiring board, such as can be hard circuit board, and ceramic substrate 20 is (without soft
Plate), or Rigid Flex or soft board, can be in one of substrate 20 away from photo-sensitive cell 40 when substrate 20 is soft board
Side sets stiffening plate (not shown), to strengthen the intensity of substrate 20.
Photo-sensitive cell 40 includes the photosurface being oppositely arranged and non-photo-sensing face, and photosurface is used to include photosensitive area and non-photo-sensing
Area, photo-sensitive cell 40 are attached at substrate 20 by non-photo-sensing face, the non-photo-sensing area of photo-sensitive cell 40 by conductive connecting 50 with
Substrate 20 electrically connects.
Specifically, photo-sensitive cell 40 can be arranged as required to as CCD (Charge-coupled Device, Charged Couple
Element) or CMOS (Complementary Metal Oxide Semiconductor, metal oxide semiconductor device).
In the present embodiment, the photosensitive area for being used to receive light on photosurface is located at the middle part of photosurface, and non-photo-sensing area surrounds photosensitive area
Set.The shape of photo-sensitive cell 40 is mostly rectangle, square or circle, specifically in the present embodiment, photo-sensitive cell 40
It is shaped as rectangle.
Packaging body 60 is process on the base plate 20 by packing colloid by shaping jig.For example, using injection machine, pass through
Insert molding technique will carry out substrate 20 and carry out molding forming packaging body 60, or with mould pressing process conventional in semiconductor packages
Packaging body 60 is formed, the mode that packaging body 60 is formed can select Shooting Technique or mould pressing process etc..Packaging body after shaping
60 are firmly connected with substrate 20, and the bonding force between packaging body 60 and substrate 20 is more than gluing between conventional stent and substrate 20
Relay, so as to improve the overall construction intensity and stability in use of the photosensitive packaging body of the antisitic defect.
Further, the material for using Shooting Technique formation packaging body 60 can be nylon, LCP (Liquid Crystal
Polymer, polymeric liquid crystal copolymer) or PP (Polypropylene, polypropylene) etc., packaging body is formed using mould pressing process
60 material can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and
The material that can be selected, the mode that can implement of the present invention is illustrative only, is not the limitation of the present invention.
Antisitic defect photosensory assembly 100 also includes electronic component 30, and the electronic component 30 is arranged at substrate 20 and is provided with photosensitive member
The side of part simultaneously electrically connects with substrate 20.Specifically, the specific species of electronic component 30 can be arranged as required to, and can be electricity
One or more in the electronic components such as resistance, electric capacity, diode, triode, potentiometer, relay or driver are with according to need
Realize difference in functionality.
Further, electronic component 30 is embedded in packaging body 60, thus will not be directly exposed in space.Should so as to work as
When antisitic defect photosensory assembly 100 carries out following process, the packaging body 60 can play a protective role to electronic component 30, prevent electronics
The pollutants such as dust are infected with element 30.
As shown in figure 1, in one embodiment, surface of the packaging body 60 away from the one end of substrate 20 be arranged in parallel with substrate 20,
The surface forms the loading end 64 for carrying optical filter 80 close to the side of accommodating chamber 62.As shown in Fig. 2 in another embodiment
In, loading end 64 is recessed to the direction of substrate 20, and so as to have positioning action to optical filter 80, optical filter 80 can holding by depression
The positioning action of section 64 is rapidly and accurately arranged on packaging body 60, and avoids moving relative to packaging body 60 in installation process
And misplaced with loading end 64.
Please continue to refer to Fig. 1 and Fig. 2, anti-overflow face 66 is laterally away from accommodating chamber 62 from packaging body 60 close to the one of accommodating chamber 62
Direction extension, and anti-overflow face 66 be arranged in parallel with substrate 20.In this way, the glue overflowed between optical filter 80 and loading end 64
It can be flowed along anti-overflow face 66 and flowing velocity gradually slows down until stopping, without flowing on photo-sensitive cell 40.
As shown in figure 3, in another embodiment, anti-overflow face 66 is laterally away from appearance from packaging body 60 close to the one of accommodating chamber 62
Receiving the direction of chamber 62 tilts extension, and the distance of the anti-overflow opposing substrate 20 of face 66 is laterally away from accommodating chamber 62 from close to accommodating chamber 62 1
Side is gradually reduced.In this way, glue has the trend flowed to anti-overflow face 66 away from the side of accommodating chamber 62 under gravity,
So as to further increase the anti-overflow effect in anti-overflow face 66.
Refer to Fig. 4 and Fig. 5, anti-overflow face 66 offers the first accepting groove 662, and the first accepting groove 662 is along anti-overflow face 66
Bearing of trend extends and formed around the ring-type storage area of accommodating chamber 62.In this way, overflow between optical filter 80 and loading end 64
The glue gone out can flow in the first accepting groove 662 along anti-overflow face 66 and store under gravity, edge during so as to avoid glue excessive
Anti-overflow face 66 and flow to photo-sensitive cell 40.
Further, the first accepting groove 662 is rectangular in the cross section in the direction of vertical substrate 20.It is appreciated that first receives
The shape not limited to this of tank 662, the shape of the first accepting groove 662 can be arranged as required to.In the present embodiment, first house
Groove 662 is one, it will be understood that the quantity of the first accepting groove 662 is alternatively two or more, and more than two first receive
More preferable anti-overflow effect is played on anti-overflow face 66, so as to increase the volume of collecting glue in the interval of tank 662.
Fig. 6~Fig. 9 is referred to, in one embodiment, anti-overflow face 66 is provided with close to a lateral edges of accommodating chamber 62 to stop
Block 664, bearing of trend of the stopper 664 along anti-overflow face 66 extends and forms the cyclic structure around accommodating chamber 62, with further
Glue is prevented to flow, the glue for avoiding exceeding the anti-overflow occupancy load of 66 and first accepting groove of face 662 overflows and flow to photo-sensitive cell
On 40, the effect that the antisitic defect photosensory assembly 100 prevents photo-sensitive cell 40 from damaging further is improved.
Further, stopper 664 is rectangular perpendicular to the cross section in the direction of substrate 20, and the height of the stopper 664
Degree, so that while can play a part of stopping glue flowing, avoids having influence on filter less than or equal to the height of loading end 64
The installation of mating plate 80.Specifically in the present embodiment, the height of stopper 664 is less than the height of loading end 64, is avoiding influenceing to filter
The installation of mating plate 80 also has higher-strength and avoids it from being broken in process simultaneously.
As shown in Figures 10 and 11, in one embodiment, loading end 64 is provided with the second accepting groove 642 to house loading end
Glue on 64, so as to further improve protecting effect of the antisitic defect photosensory assembly 100 to photo-sensitive cell 40.
Further, the second accepting groove 642 can be multiple that multiple second accepting grooves 642 are arranged at intervals on loading end 64,
So as to increase the volume for housing glue.
Above-mentioned antisitic defect photosensory assembly 100, including for carrying the loading end 64 of optical filter 80 and positioned at loading end 64 1
The anti-overflow face 66 of side, the anti-overflow face 66 can house the glue overflowed between optical filter 80 and loading end 64 and avoid glue from flowing to
Photo-sensitive cell 40 causes photo-sensitive cell 40 to damage, and so as to improve the yields of the antisitic defect photosensory assembly 100, improves and is provided with
The image quality of the equipment of the antisitic defect photosensory assembly 100.
As shown in figure 1, a kind of camera module 200, including above-mentioned antisitic defect photosensory assembly 100 and sentimental located at the loss prevention
Optical module 300 on optical assembly 100.
Wherein, optical module 300 includes the voice coil motor of lens barrel, camera lens and the focal length for adjusting camera lens.Specifically, sound
Coil motor is on the loading end 64 of packaging body 60.Lens barrel is arranged in voice coil motor, and camera lens is arranged in lens barrel, and camera lens includes
The multiple eyeglasses being stacked.Light is incident from camera lens and reaches the surface of photo-sensitive cell 40, and photo-sensitive cell 40 can turn optical signal
Change electric signal into.
Above-mentioned camera module 200, provided with antisitic defect photosensory assembly 100, the antisitic defect photosensory assembly 100 can prevent optical filter
Spilling glue between 80 and loading end 64 flow to damage photo-sensitive cell 40 on photo-sensitive cell 40, so as to have higher imaging matter
Amount.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. antisitic defect photosensory assembly, it is characterised in that including：Substrate；Photo-sensitive cell, on the substrate；Packaging body, on the substrate, the packaging body includes the accommodating chamber of both ends open, and the accommodating chamber is from the encapsulation Body extends to the side surface away from the substrate close to a side surface of the substrate, and the photo-sensitive cell is contained in the appearance Receive intracavitary；The packaging body is provided with loading end and anti-overflow face away from described substrate one end, the relatively described substrate of the loading end Distance is more than the distance of the relatively described substrate in the anti-overflow face and forms step structure, and the anti-overflow face is located at the carrying Face is close to the accommodating chamber side；AndOptical filter, on the loading end and cover the accommodating chamber.
- 2. antisitic defect photosensory assembly according to claim 1, it is characterised in that the anti-overflow face is close from the packaging body The one of the accommodating chamber is laterally away from the direction extension of the accommodating chamber, and the anti-overflow face is set with the substrate-parallel.
- 3. antisitic defect photosensory assembly according to claim 1, it is characterised in that the anti-overflow face is close from the packaging body The direction that the one of the accommodating chamber is laterally away from the accommodating chamber tilts extension, and the distance of the relatively described substrate in the anti-overflow face It is gradually reduced from the accommodating chamber side is laterally away from close to the accommodating chamber one.
- 4. antisitic defect photosensory assembly according to claim 1, it is characterised in that the anti-overflow face offers the first collecting Groove.
- 5. antisitic defect photosensory assembly according to claim 4, it is characterised in that the anti-overflow face be provided with two or two with On first accepting groove, two or more first accepting grooves are arranged at intervals.
- 6. antisitic defect photosensory assembly according to claim 1, it is characterised in that the anti-overflow face is close to the accommodating chamber One lateral edges are provided with stopper.
- 7. antisitic defect photosensory assembly according to claim 6, it is characterised in that the height of the stopper is less than or equal to The height of the loading end.
- 8. antisitic defect photosensory assembly according to claim 1, it is characterised in that the carrying is recessed towards the orientation substrate Fall into.
- 9. antisitic defect photosensory assembly according to claim 1, it is characterised in that the loading end is provided with second and housed Groove.
- 10. a kind of camera module, including antisitic defect photosensory assembly as claimed in any one of claims 1 to 9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720472914.7U CN206743374U (en) | 2017-04-28 | 2017-04-28 | Camera module and its antisitic defect photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720472914.7U CN206743374U (en) | 2017-04-28 | 2017-04-28 | Camera module and its antisitic defect photosensory assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206743374U true CN206743374U (en) | 2017-12-12 |
Family
ID=60563247
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720472914.7U Expired - Fee Related CN206743374U (en) | 2017-04-28 | 2017-04-28 | Camera module and its antisitic defect photosensory assembly |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111083315A (en) * | 2018-10-19 | 2020-04-28 | 宁波舜宇光电信息有限公司 | Air-escape-free photosensitive assembly, camera module and manufacturing method |
| CN111866324A (en) * | 2019-04-30 | 2020-10-30 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and preparation method |
| CN113552682A (en) * | 2020-04-21 | 2021-10-26 | 三赢科技（深圳）有限公司 | Lens packaging module and manufacturing method thereof |
-
2017
- 2017-04-28 CN CN201720472914.7U patent/CN206743374U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111083315A (en) * | 2018-10-19 | 2020-04-28 | 宁波舜宇光电信息有限公司 | Air-escape-free photosensitive assembly, camera module and manufacturing method |
| CN111083315B (en) * | 2018-10-19 | 2023-10-27 | 宁波舜宇光电信息有限公司 | No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method |
| CN111866324A (en) * | 2019-04-30 | 2020-10-30 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and preparation method |
| CN111866324B (en) * | 2019-04-30 | 2022-03-29 | 宁波舜宇光电信息有限公司 | Camera module, photosensitive assembly thereof, electronic equipment and preparation method |
| CN113552682A (en) * | 2020-04-21 | 2021-10-26 | 三赢科技（深圳）有限公司 | Lens packaging module and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210622 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171212 |