CN207116428U - Camera module and its combined type photosensory assembly - Google Patents
Camera module and its combined type photosensory assembly Download PDFInfo
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- CN207116428U CN207116428U CN201720472877.XU CN201720472877U CN207116428U CN 207116428 U CN207116428 U CN 207116428U CN 201720472877 U CN201720472877 U CN 201720472877U CN 207116428 U CN207116428 U CN 207116428U
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Abstract
A kind of camera module and its combined type photosensory assembly are the utility model is related to, including：Substrate, including first surface and second surface；Photo-sensitive cell, located at first surface and substrate is electrically connected to, photo-sensitive cell includes photosensitive area and non-photo-sensing area；Packaging body, packaging body are provided with accommodating chamber, and photo-sensitive cell is located in accommodating chamber；Wherein, packaging body includes at least one first encapsulation part and at least one second encapsulation part, and non-photo-sensing area is at least partly embedded at the first encapsulation part portion, is arranged at intervals between non-photo-sensing area and the second encapsulation part portion.Above-mentioned combined type photosensory assembly, when the wider width in the non-photo-sensing area of photo-sensitive cell side, settable the first encapsulation part for being embedded with non-photo-sensing area, so that when setting conductive connecting on substrate corresponding with first encapsulation part and photo-sensitive cell without reserved routing distance.When the narrower width in the non-photo-sensing area of photo-sensitive cell side and inconvenience the encapsulation part of space set second, is reduced to the size of photo-sensitive cell and model requirement when setting the first encapsulation part.
Description
Technical field
Camera module field is the utility model is related to, more particularly to a kind of camera module and its combined type photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences the also constantly increase, therefore cause camera module of the area of the photo-sensitive cell of image quality
Assembling difficulty constantly increase, its overall dimensions also constantly increases, therefore the lightening of camera module receives very big limitation, enters
And limit the volume of the smart machine provided with the camera module.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, i.e. shooting mould
Wiring board, photo-sensitive cell, the support etc. of group are made into respectively, then successively by passive electronic component, photo-sensitive cell and support
Encapsulation is in the circuit board.
But above-mentioned encapsulating structure is used, because photo-sensitive cell is by conductive connecting connection line plate, therefore installing
The routing safe distance of reserved conductive connecting is needed during support, brings inconvenience for the processing of the camera module, and be unfavorable for
The lightening development of the size of camera module.
Utility model content
Based on this, it is necessary to for needing reserved safe distance in the process of camera module and larger-size problem,
There is provided a kind of without reserved safe distance and the less camera module of size and its combined type photosensory assembly.
A kind of combined type photosensory assembly, including：
Substrate, including the first surface and second surface being oppositely arranged；
Photo-sensitive cell, located at the substrate the first surface and be electrically connected to the substrate, the photo-sensitive cell bag
Photosensitive area and non-photo-sensing area are included, the non-photo-sensing area is surrounded on outside the photosensitive area；
Packaging body, located at the first surface of the substrate, the packaging body is provided with accommodating chamber, the photo-sensitive cell position
In in the accommodating chamber；
Wherein, the packaging body includes at least one first encapsulation part and at least one second encapsulation part, the non-photo-sensing
Area is at least partly embedded at first encapsulation part, is arranged at intervals between the non-photo-sensing area and second encapsulation part.
Above-mentioned combined type photosensory assembly, including be embedded with first encapsulation part in non-photo-sensing area and be arranged at intervals with non-photo-sensing area
The second encapsulation part, therefore the first packing portion and second can optionally be set according to the width in the non-photo-sensing region of photo-sensitive cell
Encapsulation part.When the wider width in the non-photo-sensing area of photo-sensitive cell side, settable the first encapsulation part for being embedded with non-photo-sensing area,
So as to, without reserved routing distance, subtract when setting conductive connecting on substrate corresponding with first encapsulation part and photo-sensitive cell
The overall dimensions of the small combined type photosensory assembly.When the narrower width in the non-photo-sensing area of photo-sensitive cell side and inconvenience sets the
During one encapsulation part, the encapsulation part of space set second.In this way, the size to photo-sensitive cell and model requirement are reduced, can basis
Need to select the photo-sensitive cell of different sizes and model to be installed.
In one of the embodiments, the packaging body includes three the first encapsulation parts and second encapsulation part, three
First encapsulation part encloses the packaging body jointly with second encapsulation part.
In one of the embodiments, the non-photo-sensing area corresponding to first encapsulation part is provided with conductive connecting, institute
State conductive connecting and connect the non-photo-sensing area and the substrate.
In one of the embodiments, the conductive connecting is completely embedded into first encapsulation part.
In one of the embodiments, the conductive connecting is partially submerged into first encapsulation part.
In one of the embodiments, the combined type photosensory assembly also includes electronic component, and the electronic component is embedded
In in first encapsulation part.
In one of the embodiments, the distance between the outer ledge in the non-photo-sensing area and described electronic component are more than
100μm。
In one of the embodiments, the distance between the electronic component and the madial wall of first encapsulation part
More than 150 μm.
In one of the embodiments, the combined type photosensory assembly also includes electronic component, and the electronic component is embedded
In in second encapsulation part.
A kind of camera module, including above-mentioned combined type photosensory assembly.
Brief description of the drawings
Fig. 1 is the structural representation of the photosensory assembly of an embodiment；
Fig. 2 is the front view of the photosensory assembly shown in Fig. 1；
Fig. 3 is the side view of the photosensory assembly shown in Fig. 1；
Fig. 4 is the sectional view of the camera module of an embodiment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But the utility model can come in many different forms
Realize, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to of the present utility model
The understanding of disclosure more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is simply in term used in the description of the present utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more related Listed Items.
As shown in Figure 1 to 4, a kind of combined type photosensory assembly 20 of this preferred embodiment, including substrate 21, photo-sensitive cell
23 and packaging body 25.
Substrate 21 includes the first surface 212 that is oppositely arranged and second surface 214, photo-sensitive cell 23 located at substrate 21 the
One surface 212 is simultaneously electrically connected to substrate 21, and photo-sensitive cell 23 includes photosensitive area and non-photo-sensing area, and non-photo-sensing area is surrounded on photosensitive area
Outside.Packaging body 25 is located at the first surface 212 of substrate 21, and packaging body 25 is provided with accommodating chamber 252, and photo-sensitive cell 23 is located at accommodating chamber
In 252.Wherein, packaging body 25 includes at least one first encapsulation part 254 and at least one second encapsulation part 256, non-photo-sensing area
The first encapsulation part 254 at least partly is embedded at, is arranged at intervals between non-photo-sensing area and the second encapsulation part 256.
Above-mentioned combined type photosensory assembly 20, including be embedded with non-photo-sensing area the first encapsulation part 254 and with non-photo-sensing section
Every the second encapsulation part 256 of setting, therefore it can optionally set first according to the width in the non-photo-sensing region of photo-sensitive cell 23
The encapsulation part 256 of packing portion 254 and second.
When the wider width in the non-photo-sensing area of the side of photo-sensitive cell 23, settable the first encapsulation for being embedded with non-photo-sensing area
Portion 254, so that need not when setting conductive connecting 27 on substrate 21 corresponding with first encapsulation part 254 and photo-sensitive cell 23
Reserved routing distance, reduce the overall dimensions of the combined type photosensory assembly 20.When the width in the non-photo-sensing area of the side of photo-sensitive cell 23
Degree it is narrower when and inconvenience set the first encapsulation part 256 when, the second encapsulation part of space set 256.In this way, reduce to photosensitive member
The size of part 23 and model requirement, can select the photo-sensitive cell 23 of different sizes and model to be installed as needed.
Please continue to refer to Fig. 1~Fig. 4, photo-sensitive cell 23 is generally rectangle, square or circle, can be as needed
It is arranged to CCD (Charge-coupled Device, charge coupled cell) or CMOS (Complementary Metal Oxide
Semiconductor, metal oxide semiconductor device).Specific in first embodiment, photo-sensitive cell 23 is rectangle,
It is pasted on including the photosurface being oppositely arranged and non-photo-sensing face, the photo-sensitive cell 23 by non-photo-sensing face on substrate 21, photosurface
Including photosensitive area with receiving light around the non-photo-sensing area of photosensitive area and being electrically connected with substrate 21.
In the present embodiment, packaging body 25 includes three the first encapsulation parts 254 and second encapsulation part 256, and above-mentioned three
Individual first encapsulation part 254 and second encapsulation part 256 enclose the packaging body 25 to surround photo-sensitive cell 23 jointly.In this way,
In four sides of rectangular photo-sensitive cell 23, wherein three sides are embedded at the first encapsulation part 254, another side is then
It is arranged at intervals with the second encapsulation part 256.
It is appreciated that the quantity not limited to this of the first encapsulation part 254 and the second encapsulation part 256, in other embodiments, envelope
Dress body 25 may also comprise two the first encapsulation parts 254 and two the second encapsulation parts 256, this two the first encapsulation parts 254 and two
Second encapsulation part 256 encloses in packaging body 25 jointly.Specifically, the first encapsulation part 254 can replace with the second encapsulation part 256 and set
Put, also can two the first encapsulation parts 254 it is adjacent, two the second encapsulation parts 256 are disposed adjacent.
Specifically, packaging body 25 is process on the first surface 212 of substrate 21 by packing colloid by shaping jig.
For example, using injection machine, substrate 21 is carried out by molding by insert molding technique and forms packaging body 25, or uses semiconductor packages
In commonly use mould pressing process formed packaging body 25, packaging body 25 formed mode can select Shooting Technique or mould pressing process
Deng, and the packaging body 25 is firmly connected with substrate 21, the bonding force between packaging body 25 and substrate 21 is more than conventional stent and base
Bonding force between plate 21, so as to improve the overall construction intensity of the combined type photosensory assembly 20 and stability in use.
Further, the material for using Shooting Technique formation packaging body 25 can be nylon, LCP (Liquid Crystal
Polymer, polymeric liquid crystal copolymer) or PP (Polypropylene, polypropylene) etc., packaging body is formed using mould pressing process
25 material can be epoxy resin.It will be apparent to a skilled person that the foregoing manufacture that can be selected and
The material that can be selected, the mode of the present utility model that can implement is illustrative only, is not limit of the present utility model
System.
Further, non-photo-sensing area corresponding to the first encapsulation part 254 is provided with conductive connecting 27, and the two of conductive connecting 27
End connects non-photo-sensing area and substrate 21 respectively.When assembling the combined type photosensory assembly 20, photo-sensitive cell 23 is installed on the base plate (21,
And after by conductive connecting 27, both are electrically connected, just molded first encapsulation part 254, therefore be different from existing skill
Need to reserve routing distance on the base plate (21 in art, so as to reduce the volume of the compound encapsulant body 25.
In the present embodiment, conductive connecting 27 is completely embedded into the first encapsulation part 254, and the first encapsulation part 254 can be protected
Conductive connecting 27 is during following process not by foreign object damage.In another embodiment, conductive connecting 27 also may be used
It is partially submerged into the first encapsulation part 254.
Wherein, conductive connecting 27 can be gold thread, copper cash, aluminum steel or silver wire etc., can by way of just beating shape
Into：Use direction routing of the wiring tool from substrate 21 to photo-sensitive cell 23.Conductive connecting 27 can also pass through the anti-side beaten
Formula is formed：Use direction routing of the wiring tool from photo-sensitive cell 23 to substrate 21.The conduction formed by the way of counter beat is even
The camber of wiring 27 is less than the conductive connecting 27 that just mode of beating is formed, so as to further reduce the combined type photosensory assembly 20
Volume.
In one embodiment, combined type photosensory assembly 20 also includes electronic component 29, and electronic component 29 is embedded at the first envelope
In the encapsulation part 256 of dress portion 254 and/or second.
Specifically, electronic component 29 can be resistance, electric capacity, diode, triode, potentiometer, relay or driver
In one or more.It is appreciated that the installation site of electronic component 29, quantity and species are unlimited, can be arranged as required to.
In this way, electronic component 29 is embedded in the first encapsulation part and/or the second encapsulation part 256, it is multiple can further to reduce this
The overall volume of box-like photosensory assembly 20.Moreover, electronic component 29 is covered by packaging body 25, space will not be directly exposed to
It is interior, more specifically, it is not exposed in the environment that is communicated with photo-sensitive cell 23, so as to when the combined type photosensory assembly 20 is by group
Fill for camera module 100 when, the pollutants such as dust will not be infected with electronic component 29, photo-sensitive cell 23 is not interfered with yet, avoid
Pollute photo-sensitive cell 23 and cause camera module 100 bad phenomenons such as dirty stain occur.
Specifically in the present embodiment, the distance between the outer ledge and electronic component 29 in non-photo-sensing area are more than 100 μm, electricity
The distance between madial wall of the encapsulation part 254 of subcomponent 29 and first is more than 150 μm, so as to ensure to reduce the same of overall volume
When reserve abundance safe spacing, avoid by the elements such as electronic component 29, photo-sensitive cell 23 installation accuracy and manufacture miss
Difference etc. influences.Wherein, the madial wall of the first encapsulation part 254 is side wall of first encapsulation part 254 close to the one end of photo-sensitive cell 23.
Above-mentioned combined type photosensory assembly 20, including the packaging body enclosed by the first encapsulation part 254 and the second encapsulation part 256
25, the conductive connecting 27 between photo-sensitive cell 23 and substrate 21 is located at 254 corresponding side of the first encapsulation part.Due to the first envelope
Dress portion 254 can be connected to photo-sensitive cell 23 with being molded to substrate 21 again after substrate 21 in conductive connecting 27, therefore need not
Reserved routing safe distance, so as to reduce the volume of the combined type photosensory assembly 20.Further, since the second encapsulation part 256 and sense
Optical element 23 is arranged at intervals without coating photo-sensitive cell 23, therefore is reduced to the size requirement of photo-sensitive cell 23 and can be installed
The different photo-sensitive cell of non-photo-sensing sector width.
A kind of camera module 100 as shown in Figure 4, including above-mentioned combined type photosensory assembly 20, in addition to optical module
40。
Wherein, optical module 40 includes the voice coil motor 42 of lens barrel, camera lens 44 and the focal length for adjusting camera lens.Specifically
Ground, voice coil motor 42 is on packaging body 25, and lens barrel is arranged in voice coil motor 42, and camera lens 44 is arranged in lens barrel, camera lens 44
Including the multiple eyeglasses being stacked.Light is incident from camera lens 44 and reaches the photosurface of photo-sensitive cell 23, and photosurface believes light
Number it is converted into electric signal.
Above-mentioned camera module 100, because the size of its combined type photosensory assembly 20 being provided with is smaller, therefore the camera module
100 have less size, are advantageous to the lightening development of the smart machine provided with the camera module 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses several embodiments of the present utility model, and its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
- A kind of 1. combined type photosensory assembly, it is characterised in that including：Substrate, including the first surface and second surface being oppositely arranged；Photo-sensitive cell, located at the substrate the first surface and be electrically connected to the substrate, the photo-sensitive cell include sense Light area and non-photo-sensing area, the non-photo-sensing area is surrounded on outside the photosensitive area；Packaging body, located at the first surface of the substrate, the packaging body is provided with accommodating chamber, and the photo-sensitive cell is located at institute State in accommodating chamber；Wherein, the packaging body includes at least one first encapsulation part and at least one second encapsulation part, and the non-photo-sensing area is extremely Small part is embedded at first encapsulation part, is arranged at intervals between the non-photo-sensing area and second encapsulation part.
- 2. combined type photosensory assembly according to claim 1, it is characterised in that the packaging body includes three first encapsulation Portion and second encapsulation part, three first encapsulation parts enclose the encapsulation jointly with second encapsulation part Body.
- 3. combined type photosensory assembly according to claim 1 or 2, it is characterised in that institute corresponding to first encapsulation part State non-photo-sensing area and be provided with conductive connecting, the conductive connecting connects the non-photo-sensing area and the substrate.
- 4. combined type photosensory assembly according to claim 3, it is characterised in that the conductive connecting is completely embedded into described In first encapsulation part.
- 5. combined type photosensory assembly according to claim 3, it is characterised in that the conductive connecting is partially submerged into described In first encapsulation part.
- 6. combined type photosensory assembly according to claim 3, it is characterised in that the combined type photosensory assembly also includes electricity Subcomponent, the electronic component are embedded in first encapsulation part.
- 7. combined type photosensory assembly according to claim 6, it is characterised in that the outer ledge in the non-photo-sensing area and institute The distance between electronic component is stated more than 100 μm.
- 8. combined type photosensory assembly according to claim 6, it is characterised in that the electronic component and the described first encapsulation The distance between the madial wall in portion is more than 150 μm.
- 9. combined type photosensory assembly according to claim 1, it is characterised in that the combined type photosensory assembly also includes electricity Subcomponent, the electronic component are embedded in second encapsulation part.
- 10. a kind of camera module, it is characterised in that including photosensitive group of combined type as claimed in any one of claims 1 to 9 wherein Part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720472877.XU CN207116428U (en) | 2017-04-28 | 2017-04-28 | Camera module and its combined type photosensory assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720472877.XU CN207116428U (en) | 2017-04-28 | 2017-04-28 | Camera module and its combined type photosensory assembly |
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| CN207116428U true CN207116428U (en) | 2018-03-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807430A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its combined type photosensory assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807430A (en) * | 2017-04-28 | 2018-11-13 | 南昌欧菲光电技术有限公司 | Camera module and its combined type photosensory assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200422 Address after: 330000 Nanchang High-tech Industrial Development Zone, Nanchang City, Jiangxi Province, South of Tianxiang Avenue and East of Aviation Road, High-tech Future Science Park Patentee after: Nanchang Oufei Huaguang Technology Co., Ltd. Address before: 330013, east of Dingxiang Road, north of Longtan Road, Nanchang economic and Technological Development Zone, Nanchang, Jiangxi Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330000 Nanchang High-tech Industrial Development Zone, Nanchang City, Jiangxi Province, South of Tianxiang Avenue and East of Aviation Road, High-tech Future Science Park Patentee before: Nanchang Oufei Huaguang Technology Co.,Ltd. |
|
| CP03 | Change of name, title or address |