CN111083315B - No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method - Google Patents

No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method Download PDF

Info

Publication number
CN111083315B
CN111083315B CN201811218348.2A CN201811218348A CN111083315B CN 111083315 B CN111083315 B CN 111083315B CN 201811218348 A CN201811218348 A CN 201811218348A CN 111083315 B CN111083315 B CN 111083315B
Authority
CN
China
Prior art keywords
photosensitive
circuit board
base
layer
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811218348.2A
Other languages
Chinese (zh)
Other versions
CN111083315A (en
Inventor
赵波杰
黄桢
戴茜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201811218348.2A priority Critical patent/CN111083315B/en
Publication of CN111083315A publication Critical patent/CN111083315A/en
Application granted granted Critical
Publication of CN111083315B publication Critical patent/CN111083315B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

An air-vent-free type photosensitive assembly, a camera module and a manufacturing method. The no-air-vent type photosensitive assembly comprises a photosensitive unit, a circuit board, a base, a light filtering element and at least one bonding layer, wherein the bonding layer comprises at least one bonding material and at least one absorbing material, the base, the circuit board and the light filtering element form a closed space through the bonding layer, and when the no-air-vent type photosensitive assembly is baked, the absorbing material of the bonding layer absorbs the internal gas of the closed space, so that the internal and external air pressure difference is in a safe range, and the working procedures are reduced.

Description

No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method
Technical Field
The invention relates to the field of camera modules, in particular to a non-air-escape type photosensitive assembly, a camera module and a manufacturing method, wherein an air escape hole is not required to be arranged on a base of the photosensitive assembly, the process of sealing the air escape hole is reduced, and the manufacturing process is simplified. Background
With the gradual development of technologies in the field of camera modules, the requirements of consumers on cost performance are gradually improved, and market competition is more and more intense. How to simplify the assembly process of the camera module and save the cost is an urgent problem to be solved by enterprises related to the camera module.
The existing camera module comprises a photosensitive component and an optical component, wherein the optical component is arranged on the photosensitive component to form the camera module. The photosensitive assembly comprises a photosensitive unit, a circuit board, a base and a color filter element. The light sensing unit is electrically connected to the circuit board, the base is fixed to the circuit board by means of adhesion or the like, and the color filter element is fixed to the base and located on the light sensing path of the light sensing unit.
However, in the actual existing assembly process, the base must have at least one vent. Specifically, the photosensitive unit is arranged on the circuit board, and the light filtering component of the base and the light filtering element which are fixed into a whole is arranged on the circuit board through an adhesive. The circuit board, the base and the optical filter element form a space, and the photosensitive assembly is baked by reheating to cure the adhesive. The internal air pressure of the space is increased due to heating, and the internal air pressure needs to be released through the air escape hole, so that the internal air pressure and the external air pressure are kept balanced. However, in order to prevent dust or the like from entering the space through the escape hole, the photosensitive unit is affected, and the escape hole is then sealed.
In summary, the existence of the air vent makes the existing assembly process complicated, increases the cost, and also increases the process fineness requirement.
Disclosure of Invention
An object of the present invention is to provide a photosensitive assembly without air holes, an image capturing module and a manufacturing method, wherein the base of the photosensitive assembly does not need to be provided with air holes, so that the process of sealing the air holes can be omitted during assembly, the process of sealing the air holes can be reduced, and the manufacturing process can be simplified.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an image capturing module, and a manufacturing method thereof, wherein an adhesive used for the photosensitive assembly has a function of absorbing air, so that the air is triggered to be absorbed, the air pressure is reduced, and the air pressure inside and outside the assembly process is kept balanced, so that the module does not need to be provided with air vents.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an image capturing module and a manufacturing method thereof, wherein an absorbing layer is disposed in a sealed space of the photosensitive assembly, and the absorbing layer absorbs air after being triggered, thereby reducing air pressure, and maintaining the balance of internal and external air pressures during the assembly process, so that the module does not need to be provided with air vents.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an image capturing module, and a method for manufacturing the same, wherein the absorbing layer or the adhesive reduces the air pressure by absorbing oxygen in the enclosed space, and the reduction of the internal air pressure is suitable for increasing the air pressure generated in the enclosed space during baking.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, a camera module, and a method for manufacturing the same, in which the photosensitive assembly adopts an absorbing layer or an adhesive to absorb air to reduce internal air pressure, which has less influence on the structures of the photosensitive assembly and the camera module, and can be based on the structural improvement of the existing product, thereby reducing the improvement cost.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an imaging module and a manufacturing method thereof, wherein the method adopted by the present invention is suitable for the imaging module with various structures such as COB, MOC, MOB, and has strong universality.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an image capturing module, and a manufacturing method thereof, wherein the absorbing layer is wrapped by a spacer, so as to prevent the absorbing layer from absorbing air before the heat curing process, thereby causing deformation of the base, and the like.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an image capturing module, and a manufacturing method thereof, wherein the isolation device is heated to melt, so that the absorbing layer is exposed to the air in the closed space, thereby triggering to absorb the internal gas.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an image capturing module and a manufacturing method thereof, wherein the gas absorbed by the absorbing layer or the adhesive can be oxygen, nitrogen, etc. without limitation, so that the manufacturer can select a proper material according to the cost or the process difficulty.
Another object of the present invention is to provide an air-vent-free photosensitive assembly, an image capturing module, and a method of manufacturing the same, which can control the amount of air absorbed into the closed space by controlling the amount of the absorbing layer or the adhesive, thereby facilitating the control of the balance of the internal and external air pressures.
According to one aspect of the present invention, there is further provided an air-vent-free photosensitive assembly, comprising:
a photosensitive unit;
the photosensitive unit is attached to the circuit board in an electric communication manner;
the base is fixed on the circuit board so as to encapsulate the photosensitive unit;
A filter element, wherein the filter element is fixed on the top side of the base and corresponds to the photosensitive path of the photosensitive unit; and
the base, the circuit board and the optical filter element form a closed space through the adhesive layer, wherein when the air-escape-free type photosensitive assembly is baked, the absorbent material of the adhesive layer absorbs the internal air in the closed space, so that the internal and external air pressure difference is within a safe range.
According to one embodiment of the present invention, another adhesive layer is located between the optical filter element and the base, and fixes the optical filter element, wherein when the non-air-hole type photosensitive assembly is baked, the absorbing material of the other adhesive layer absorbs the air inside the non-air-hole type photosensitive assembly, so that the difference between the internal pressure and the external pressure is within a safe range.
According to one embodiment of the present invention, the adhesive layer is located between the circuit board and the base, and fixes the circuit board, wherein when the non-air-hole type photosensitive assembly is baked, the absorbing material of the adhesive layer absorbs the air inside the non-air-hole type photosensitive assembly, so that the difference between the internal pressure and the external pressure is within a safe range.
According to one embodiment of the invention, the absorbing material is implemented as an oxygen absorbing material.
According to one embodiment of the invention, the absorbing material is implemented as a material that triggers the absorption of gas at a preset temperature, current or gas pressure.
According to one embodiment of the present invention, the gas-vent-free photosensitive member further includes an absorbing layer, wherein the absorbing layer is made of an absorbing material, and is disposed in the closed space.
According to one embodiment of the invention, the absorption layer is made of an absorption material and is placed on the circuit board.
According to one embodiment of the invention, the absorbing layer is made of a transparent absorbing material and is placed on the bottom surface of the filter element.
According to one embodiment of the present invention, the adhesive layer is disposed between the circuit board and the photosensitive unit, wherein when the evacuable hole-free photosensitive assembly is baked, the absorbing material of the adhesive layer absorbs the gas inside the evacuable hole-free photosensitive assembly, so that the difference between the internal and external gas pressures is within a safe range.
According to one embodiment of the present invention, the gas-vent-free photosensitive assembly further comprises an isolating device, wherein the isolating device is coated on the outer surface of the absorbing layer to isolate gas, and when the gas-vent-free photosensitive assembly is baked, the isolating device is heated to melt and expose the absorbing layer.
In accordance with another aspect of the present invention, there is further provided an air-vent-free photosensitive assembly, comprising:
a photosensitive unit;
the photosensitive unit is attached to the circuit board in an electric communication manner;
the base is fixed on the circuit board so as to encapsulate the photosensitive unit;
a filter element, wherein the filter element is fixed on the top surface of the base, and the circuit board, the base and the filter element form a closed space; and
and the absorption layer is made of at least one absorption material and is arranged in the closed space, and when the non-air hole type photosensitive component is baked, the absorption layer absorbs the gas in the closed space so that the difference of internal and external air pressure is in a safe range.
According to another aspect of the present invention, the present invention further provides an image capturing module, including:
a gas-escape-free photosensitive assembly as described above; and
an optical component, wherein the optical component is supported by the evacuable hole type photosensitive component and corresponds to the photosensitive path of the photosensitive unit.
According to another aspect of the present invention, the present invention further provides a method for manufacturing an air-vent-free photosensitive device, comprising:
(a) Attaching a photosensitive unit to a circuit board in an electrically conductive manner;
(b) Fixing a base on the circuit board through an adhesive layer to encapsulate the photosensitive unit, wherein the adhesive layer comprises at least one adhesive material and at least one absorbing material;
(c) Fixing a light filtering element on the base corresponding to the photosensitive path of the photosensitive unit;
(d) The circuit board, the base and the optical filter element form a closed space to form an air-escape-free photosensitive assembly; and
(e) And baking the non-air-escape type photosensitive component, wherein the bonding layer absorbs the air in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
According to one embodiment of the present invention, the step (c) further fixes the light filtering element to the base through another adhesive layer having a function of absorbing gas.
According to an embodiment of the present invention, the method for manufacturing an air-vent-free photosensitive member further includes, before step (d):
(f) At least one absorption layer is arranged on the peripheral wall of the closed space.
In accordance with another aspect of the present invention, there is further provided a method for manufacturing an air-vent-free photosensitive device, comprising:
(1) Attaching a photosensitive unit to a circuit board in an electrically conductive manner;
(2) Fixing a base on the circuit board to encapsulate the photosensitive unit, wherein the adhesive layer has a gas absorbing function;
(3) Fixing a light filtering element on the base corresponding to the photosensitive path of the photosensitive unit;
(4) At least one absorption layer is arranged on the inner surface of the base, the circuit board or the bottom surface of the light filtering element;
(5) The circuit board, the base and the optical filter element form a closed space to form an air-escape-free photosensitive assembly; and
(6) And baking the non-air-escape type photosensitive component, and absorbing the gas in the closed space to ensure that the difference between the internal pressure and the external pressure is kept within a safe range.
According to another aspect of the present invention, the present invention further provides a method for manufacturing an air-vent-free photosensitive device, comprising:
(A) Attaching a photosensitive unit to a circuit board in an electrically conductive manner;
(B) Fixing a light filtering component on the circuit board through an adhesive layer to form the vent-free photosensitive component, wherein a light filtering path of the light filtering component corresponds to a photosensitive path of the photosensitive unit, the circuit board and the light filtering component form a closed space, and the photosensitive unit is positioned in the closed space, and the adhesive layer comprises at least one adhesive material and at least one absorbing material; and
(C) And baking the non-air-escape type photosensitive component, wherein the bonding layer absorbs the air in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
Drawings
Fig. 1 is a schematic view of a camera module according to a preferred embodiment of the invention.
Fig. 2 is a schematic structural view of another camera module according to the above preferred embodiment of the present invention.
FIG. 3 is a schematic view of a photosensitive assembly according to another embodiment of the present invention.
FIG. 4 is a schematic view of a photosensitive assembly according to another embodiment of the present invention.
Fig. 5 is a flowchart of a first manufacturing method of the photosensitive member according to the present invention.
FIG. 6 is a flow chart of a second method of manufacturing a photosensitive assembly according to the present invention.
Fig. 7 is a flowchart of a third manufacturing method of the photosensitive member according to the present invention.
Fig. 8 is a schematic structural diagram of an image capturing module according to a second embodiment of the present invention.
Fig. 9 is a schematic structural view of another photosensitive assembly according to the above second embodiment of the present invention.
Fig. 10 is a schematic structural view of another photosensitive assembly according to the above second embodiment of the present invention.
Fig. 11 is a schematic structural view of another photosensitive assembly according to the above second embodiment of the present invention.
FIG. 12 is a flow chart of a fourth method of manufacturing a photosensitive assembly according to the present invention.
Fig. 13 is a flowchart of a fifth manufacturing method of the photosensitive member according to the present invention.
Fig. 14 is a flowchart of a sixth manufacturing method of the photosensitive member according to the present invention.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.
It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.
As shown in fig. 1 to 14, the present invention provides an air-vent-free photosensitive assembly, an image capturing module and a manufacturing method, wherein the base of the air-vent-free photosensitive assembly does not need to be provided with an air vent, so that the air vent sealing process can be omitted in the manufacturing and assembling process, the air vent sealing process is reduced, and the manufacturing process is simplified. Meanwhile, an air escape hole is not required to be arranged when the base is manufactured, so that the manufacturing difficulty of the base is further simplified, and the manufacturing cost of the base is reduced.
In particular, as shown in fig. 1 to 4, a preferred embodiment of the present invention is illustrated. In the preferred embodiment, the adhesive layer 110 of the gas-vent-free photosensitive element 100 includes at least one adhesive material and at least one absorbent material. The adhesive material is implemented as a material having an adhesive function such as glue, for example. The adsorption material can be implemented as metal or metal alloy particles or powder of Zr, ti, V, titanium, zirconium, tantalum, thorium and the like; hf. Nb, ta, W, mo or other high field strength metals or rare earth metals or metal alloy particles or powders; or transition metal such as Fe, cu, or metal alloy particles or powder.
The no-air-vent type photosensitive assembly 100 includes a photosensitive unit 120, a circuit board 130, a base 140 and a filter element 150. Specifically, the photosensitive unit 120 is configured to receive image information, and the filter element 150 is configured to filter out infrared light that affects the imaging quality of the photosensitive unit 120. The photosensitive unit 120 has a photosensitive area and a non-photosensitive area, and the photosensitive area is used for receiving the optical signal and generating a corresponding electrical signal. The photosensitive unit 120 has at least one electrical connector in the non-photosensitive area, and the electrical connector is electrically connected to the circuit board.
The photosensitive unit 120 is electrically connected to the circuit board 130, and the base 140 is disposed on the circuit board 130 and has a light window corresponding to the photosensitive path of the photosensitive unit 120. The filter element 150 is disposed on the base 140 and located on the photosensitive path of the photosensitive unit 120, and covers the optical window. The circuit board 130, the base 140 and the filter element 150 form a closed space 160, and the photosensitive unit 120 is disposed in the closed space 160.
The adhesive layer 110 is located between the circuit board 130 and the base 140, and fixes the base 140 to the circuit board 130. Further, another adhesive layer 110 is disposed between the base 140 and the filter element 150, so that the filter element 150 is fixed to the base 140.
It will be appreciated by those skilled in the art that the gas-vent-free photosensitive member 100 can be implemented in the structures COB (chip on board), MOB (molding on board), MOC (molding on chip), etc., and the present invention is not limited thereto. That is, the adhesive layer 110 having the function of absorbing gas according to the present invention can be used in the conventional camera module structure, as shown in fig. 1 to 4.
In the COB structure, the base 140 is fixed to the wiring board 130 by adhesion or the like. The base 140 surrounds the photosensitive unit 120 and the electronic component for packaging. The base 140 has the light window provided to the light sensing path of the light sensing unit 120. The filter element 150 covers the optical window and corresponds to the photosensitive path of the photosensitive unit 120. At this time, the adhesive layer 110 may be disposed between the circuit board 130 and the base 140, and between the base 140 and the filter element 150. Further, the adhesive layer 110 may be disposed between the photosensitive unit 120 and the circuit board 130, and it is worth mentioning that when the adhesive layer 110 is disposed between the photosensitive unit 120 and the circuit board 130, the flatness of the photosensitive unit 120 is ensured to meet the requirement.
In the MOC structure, the base 140 is integrally formed to the circuit board 130 through a molding process. Specifically, the base 140 encapsulates the non-photosensitive area of the photosensitive unit 120, and integrally encapsulates the photosensitive unit 120 and the electronic components on the circuit board 32. The base 140 has the light window provided to the light sensing path of the light sensing unit 120. The filter element 150 covers the optical window and corresponds to the photosensitive path of the photosensitive unit 120. And the adhesive layer 110 may be disposed between the base 140 and the filter element 150.
Or in the MOB structure, the base 140 is integrally formed with the circuit board 130 through a molding process. However, the base 140 does not encapsulate the photosensitive unit 120, but only encapsulates the electronic components and the circuit board 130. In other words, the base 140 may encapsulate the photosensitive unit 120 in a manner of encapsulating the non-photosensitive area of the photosensitive unit 120, or may encapsulate the electronic components around the periphery of the photosensitive unit 120. At this time, the adhesive layer 110 may be disposed between the base 140 and the filter element 150.
In other embodiments of the present invention, the adhesive layer 110 is disposed between the photosensitive unit 120 and the circuit board 130 such that the photosensitive unit 120 is fixedly attached to the circuit board 130. At this time, the adhesive layer 110 between the photosensitive unit 120 and the circuit board 130 may also perform the function of absorbing gas and reducing the gas pressure. At this time, in order to prevent the adsorption material having a metallic property from affecting the operation of the photosensitive unit 120, the adsorption material may be a non-metallic material.
When the non-air-vent type photosensitive assembly 100 is baked, the adhesive layer 110 can absorb air in the enclosed space 160, so that the air pressure of the enclosed space 160 is prevented from being too high due to temperature rise, the non-air-vent type photosensitive assembly 100 is deformed, and the precision of the camera module is affected.
It should be noted that, since the baking temperature is typically controlled at 80 ℃, the air pressure generated in the enclosed space 160 is increased by at least 20%. In this regard, the present invention further maintains the balance of the internal and external air pressures by controlling the amount of the adhesive layer 110 to control the amount of the absorbed gas. In the present invention, the air is absorbed by not less than 10%, preferably not less than 20%. It should be noted that the baking temperature of the present invention is not limited to the present invention, and those skilled in the art should know that the temperatures set in the assembly process are different in different assembly processes. The baking temperature of the different types of modules may also be different during the assembly process, for example, the modules need reflow soldering and baking during the assembly process, and the temperature is as high as 50-200 ℃, for example, 100 ℃,150 ℃.
Since the oxygen content in the air is about 21%, the oxygen in the enclosed space 160 is preferably absorbed, for example, the absorbing material of the adhesive layer 110 reacts with the oxygen in the air to form an oxide. Or the absorbing material may be implemented as other non-metallic materials, and may absorb gases in the air, such as oxygen, carbon dioxide, or nitrogen, etc., without limitation.
In some embodiments of the present invention, the absorbing material of the adhesive layer 110 is triggered to absorb the gas in the enclosed space 160 under the condition of heating, energizing, or preset air pressure. For example, a material that requires heating or energization to react with oxygen is selected as the absorbing material. This prevents the absorbing material of the adhesive layer 110 from absorbing gas before heat curing, which would lead to deformation of the gas-tight photosensitive element 100. Preferably, the adhesive layer 110 is cured while being absorbed during heating.
It should be noted that, the adhesion layer 110 has low viscosity before baking, and when the internal air pressure is too high, the base 140 and the circuit board 130 bonded by the adhesion layer 110 move relatively, which affects the module accuracy, so that the problem of excessive air pressure needs to be solved. In the prior art, an air vent is provided in the base, and during baking, air between the base, the circuit board 130 and the filter element 150 overflows through the air vent, so that the difference between the internal pressure and the external pressure is controlled. However, since the existence of the air vent can cause the photosensitive chip 120 disposed on the circuit board to be easily polluted by dust, the air vent needs to be filled after baking is completed, thereby realizing the closed space. The invention adopts the adhesive layer 110 to fix, so that the absorbing material of the adhesive layer 110 absorbs part of the gas in the closed space 160 during baking, and the difference between internal and external air pressure is kept in a reasonable range; when the adhesive 110 is cured, the temperature is again lowered to normal temperature, and at this time, since the adhesive 110 is already cured, the adhesive strength of the adhesive 110 can ensure the relative movement of the base 140 and the circuit board 130.
In other embodiments of the present invention, the adhesive layer 110 gradually absorbs the gas inside the enclosed space 160 after the enclosed space 160 is formed. At this time, the adhesive layer 110 preferably absorbs at a slow rate, preventing the internal air pressure from being too low, which may cause the glue to be sucked into the enclosed space 160 to deform. That is, in these embodiments, the absorbent material used for the adhesive layer 110 may be a material that reacts slower than others.
The photosensitive assembly 100 further includes at least one electronic component. The electronic component can be one or a combination of a plurality of capacitors, resistors, inductors, diodes and triodes. The electronic component is attached to the circuit board 130 and electrically connected to the circuit board 130. When the base 23 is formed by a molding process, the electronic components are packaged in the base 140 together with the light sensing unit 120 and the circuit layer 130.
The camera module further comprises an optical component 200, wherein the optical component 200 is fixedly supported on the non-air-hole type photosensitive component 100, and corresponds to the photosensitive path of the photosensitive unit 120 of the non-air-hole type photosensitive component 100 to form the camera module. In some embodiments of the present invention, the image capturing module is an AF module (auto focus image capturing module), and correspondingly, the optical assembly 200 includes a driving member 220 and an optical lens 210. The optical lens 210 is disposed on the driving member 220 and is located on the photosensitive path of the photosensitive unit 120. When the optical assembly 200 is disposed on the evacuable hole type photosensitive assembly 100, the driving member 220 drives the optical lens 210 to achieve focusing. Alternatively, in other embodiments of the present invention, the image capturing module is an FF module (fixed focus image capturing module), and correspondingly, the optical assembly 200 includes the optical lens 210, and the optical lens 210 is located on the photosensitive path of the photosensitive unit 120.
Correspondingly, the invention further provides a manufacturing method of the air-vent-free type photosensitive element, which is suitable for the air-vent-free type photosensitive element 100, and achieves the purposes and advantages of the invention.
As shown in FIG. 5, a first method of fabricating an air-vent-free photosensitive device according to the present invention is illustrated.
Step 310: a photosensitive unit 120 is electrically connected to a circuit board 130.
Step 312: a base 140 is fixed on the circuit board 130 through an adhesive layer 110 to encapsulate the photosensitive unit 120.
Step 314: a filter element 150 is fixed on the base 140 by the adhesive layer 110, and an air-free photosensitive assembly is formed corresponding to the photosensitive path of the photosensitive unit 120, wherein the circuit board 130, the base 140 and the filter element 150 form a closed space.
Step 316: baking the gas-escape-free photosensitive assembly, wherein at least one of the adhesive layers 110 comprises at least one adhesive material and at least one gas absorbing material to absorb the gas in the closed space, so that the difference between the internal and external gas pressures is kept within a safe range.
The circuit board 130 may be a common PCB board, and the photosensitive unit 120 may be electrically connected to the circuit board 130 through conductive members such as a lead. One end of a lead wire is electrically connected to the electrical connector of the photosensitive unit 120 through a wire bonding process, and the other end of the lead wire is electrically connected to the circuit board 130, so as to electrically connect the photosensitive unit 120 and the circuit board 130. Specifically, the circuit board 130 is disposed at the bottom side of the photosensitive unit 120, that is, the photosensitive unit 120 is attached to the circuit board 130.
The adhesive layer 110 includes at least one adhesive material and at least one gas absorbing material. I.e. the adhesive layer 110 may be made of a mixture of at least one adhesive material and at least one gas absorbing material. At this time, the adhesive layer has both functions of adhesive fixation and gas absorption.
When the non-air-escape type photosensitive component is heated and baked, the bonding layer is heated and solidified, and the gas absorbing material absorbs the gas in the closed space. In particular, when the gas absorbing material is activated to absorb gas at a predetermined temperature, pressure or power, a preset condition may be performed in step 316 to activate the adhesive layer to absorb gas, and maintain the difference between the internal and external air pressures within a safe range.
As shown in FIG. 6, a second method for manufacturing an air-vent-free photosensitive member according to the present invention is illustrated.
Step 320: a photosensitive unit 120 is electrically connected to a circuit board 130.
Step 322: a filter element 150 is fixed to the top surface of a base 140 by an adhesive layer 110, so as to form a filter assembly, wherein the adhesive layer 110 has a function of absorbing gas.
Step 324: the filter assembly is fixed on the circuit board 130 by the other adhesive layer 110 to form an air-free hole type photosensitive assembly, wherein the filter element 150 corresponds to the photosensitive path of the photosensitive unit 120, and the circuit board 130, the base 140 and the filter element 150 form a closed space.
Step 326: baking the evacuable pore-free photosensitive assembly, the adhesive layer 110 absorbs the gas in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
As shown in FIG. 7, a third method for manufacturing an air-vent-free photosensitive member according to the present invention is illustrated.
Step 330: a photosensitive unit 120 is electrically connected to a circuit board 130.
Step 332: a base 140 is molded on the circuit board 130 by a molding process to encapsulate the photosensitive unit 120.
Step 334: a filter element 150 is fixed on the top surface of the base 140 through an adhesive layer 110 to form an air-free hole type photosensitive assembly, wherein the circuit board 130, the base 140 and the filter element 150 form a closed space, and the adhesive layer 110 has a gas absorption function.
Step 336: baking the evacuable pore-free photosensitive assembly, the adhesive layer 110 absorbs the gas in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
That is, the assembly order of the circuit board 130, the base 140 and the filter element 150 does not affect the absorption function of the adhesive layer 110 of the present invention, and an appropriate assembly order and method may be adopted according to the existing equipment or cost thereof. It is to be understood that the adhesive layer 110 having the function of absorbing gas may be disposed only between the filter element 150 and the base 140, or only between the base 140 and the circuit board 130, and other portions to be bonded may be a common adhesive.
As shown in fig. 8 to 14, a second embodiment of the present invention is illustrated. In the second embodiment, the gas-vent-free photosensitive member 100A includes an absorbing layer 170A. The absorbing layer 170A is made of an absorbing material, which may be a metallic material or a nonmetallic material. That is, as in the preferred embodiment, the adsorbent material may be implemented as Zr, ti, V, titanium, zirconium, tantalum, thorium, etc. metal or metal alloy particles or powders; hf. Nb, ta, W, mo or other high field strength metals or rare earth metals or metal alloy particles or powders; or transition metal such as Fe, cu, or metal alloy particles or powders, etc., are not limited.
Unlike the preferred embodiment described above, the adhesive layer 110A may be made of only an adhesive material, and its function of absorbing gas is performed by the absorbent layer 170A. The absorbing layer 170A is provided on the peripheral wall of the closed space 160A. Specifically, the absorbing layer 170A may be disposed on the inner surface of the base 140A, or may be disposed on the bottom surface of the color filter 150A (in this case, the absorbing layer 170A is made of a transparent material, so that light can pass through), or the circuit board 130A.
Similarly, when the non-air-vent type photosensitive assembly 100A is baked, the absorbing layer 170A can absorb the air in the enclosed space 160A, so as to prevent the air pressure of the enclosed space 160A from being too high due to the temperature rise, so that the non-air-vent type photosensitive assembly 100A is deformed, and the accuracy of the camera module is affected. Preferably, the absorbing layer 170A reacts with oxygen in the air to form an oxide. Of course, the absorbing layer 170A may be triggered under the condition of heating, energizing, or preset air pressure, to absorb the air in the enclosed space 160, or gradually absorb the air after the enclosed space 160 is formed.
Further, the absorbent layer 170A is covered with a spacer 171A, as shown in fig. 11. The isolating device 171A is wrapped on the outer surface of the absorbing layer 170A, and can be melted when heated, so as to expose the absorbing layer 170A, so that the absorbing layer 170A absorbs the gas in the enclosed space 160A during the heating process. In this case, the absorbing layer 170A may be a material that absorbs gas at normal temperature, for example, a material that reacts with oxygen at normal temperature, and the isolating device 171A may protect the isolating gas. At this time, the absorbing layer 170A is preferably mounted on the circuit board 130A, and the isolating device 171A is correspondingly disposed on the circuit board 130A, so as to prevent the photosensitive unit 120A from being contaminated when the isolating device 171A melts.
Correspondingly, the invention further provides a manufacturing method of the air-vent-free type photosensitive element, which is suitable for the air-vent-free type photosensitive element 100A, and achieves the purposes and advantages of the invention. The adhesive layer 110 used in the manufacturing process may be made of a general adhesive material, corresponding to the structural features of the evacuable hole-free photosensitive assembly 100A.
As shown in fig. 12, a fourth method for manufacturing the evacuable pore-free photosensitive member of the present invention is illustrated.
Step 340: a photosensitive unit 120A is electrically connected to a circuit board 130A.
Step 342: a base 140A is fixed on the circuit board 130A to encapsulate the photosensitive unit 120A.
Step 344: an absorption layer is disposed on the inner surface of the base 140A, the circuit board 130A or the bottom surface of a filter element 150A.
Step 346: the filter element 150A is fixed on the base 140A, and a gas-free hole-type photosensitive assembly is formed corresponding to the photosensitive path of the photosensitive unit 120A, wherein the circuit board 130A, the base 140A and the filter element 150A form a closed space.
Step 348: and baking the non-air-escape type photosensitive component, wherein the absorption layer absorbs the gas in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
As shown in fig. 13, a fifth method for manufacturing an evacuable hole-free photosensitive member according to the present invention is illustrated.
Step 350: a photosensitive unit 120A is electrically connected to a circuit board 130A.
Step 352: an absorption layer is disposed on an inner surface of a base 140A, the circuit board 130A or a bottom surface of a filter element 150A.
Step 354: a filter element 150A is secured to the top surface of a base 140A to form a filter assembly.
Step 356: the filter assembly is fixed on the circuit board 130A to form an air-vent-free photosensitive assembly, wherein the filter element 150A corresponds to the photosensitive path of the photosensitive unit 120A, and the circuit board 130A, the base 140A and the filter element 150A form a closed space.
Step 358: and baking the non-air-escape type photosensitive component, wherein the absorption layer absorbs the gas in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
As shown in fig. 14, a sixth method for manufacturing an evacuable hole-free photosensitive member according to the present invention is illustrated.
Step 360: a photosensitive unit 120A is electrically connected to a circuit board 130A.
Step 362: a base 140A is molded on the circuit board 130A by a molding process to encapsulate the photosensitive unit 120.
Step 364: an absorbing layer is disposed on an inner surface of a base 140A, the circuit board 130A or a bottom surface of a filter element 150.
Step 366: a filter element 150A is fixed on the top surface of the base 140A to form an air-free hole type photosensitive assembly, wherein the circuit board 130A, the base 140A and the filter element 150A form a closed space.
Step 368: and baking the non-air-escape type photosensitive component, wherein the absorption layer absorbs the gas in the closed space, so that the difference between the internal pressure and the external pressure is kept within a safe range.
It should be noted that when the absorbing layer is fixed on the bottom surface of the filter element 150A, it is made of transparent material for light to pass through. Likewise, for the evacuable hole-free photosensitive assembly 100A of the second embodiment, the assembly sequence of the circuit board 130A, the base 140A and the filter element 150A does not affect the absorption function of the absorption layer of the present invention, and suitable assembly sequence and method can be adopted according to the existing equipment or cost thereof.
According to the manufacturing method of the photosensitive assembly without the air vent, the air vent is not required to be arranged, and the baking can be achieved without a process of packaging the air vent, so that the pressure difference between the inside and the outside is within a safe range.
It will be appreciated by those skilled in the art that the getter material used for the adhesive layer 110 or the getter layer may be a material that directly reacts with other air, such as a metal material, or a material that has a getter function after synthesis, such as a nano getter, etc. The present invention is not limited to the kind of absorbent material, and a manufacturer may use different suitable materials according to cost or equipment, etc.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims (22)

1. An evacuable pore-free photosensitive assembly, comprising:
a photosensitive unit;
the photosensitive unit is attached to the circuit board in an electric communication manner;
the base is fixed on the circuit board so as to encapsulate the photosensitive unit;
a filter element, wherein the filter element is fixed on the top side of the base and corresponds to the photosensitive path of the photosensitive unit; and
at least one adhesive layer, wherein the adhesive layer comprises at least one adhesive material and at least one absorbing material, wherein the base, the circuit board and the optical filter element form a closed space through the adhesive layer, wherein the absorbing material of the adhesive layer is implemented as a material absorbing oxygen, wherein when the non-air hole type photosensitive component is baked, the absorbing material absorbs the oxygen in the closed space, so that the difference of internal and external air pressure is in a safe range, and the absorbing layer is made of the absorbing material and is arranged in the closed space;
and the isolating device is coated on the outer surface of the absorption layer and is used for isolating gas, and when the non-air hole type photosensitive assembly is baked, the isolating device is heated and melted to expose the absorption layer.
2. The gas-escape-free photosensitive assembly according to claim 1, wherein the adhesive layer is located between the filter element and the base, and fixes the filter element, wherein when the gas-escape-free photosensitive assembly is baked, an absorbing material of the adhesive layer absorbs oxygen inside the gas-escape-free photosensitive assembly, so that an internal-external pressure difference is within a safe range.
3. The gas-escape-free type photosensitive assembly according to claim 1, wherein the adhesive layer is located between the circuit board and the base to fix the circuit board, wherein when the gas-escape-free type photosensitive assembly is baked, an absorbing material of the adhesive layer absorbs oxygen inside the gas-escape-free type photosensitive assembly to bring an internal and external air pressure difference within a safe range.
4. A gas-escape-free photosensitive assembly according to any one of claims 1 to 3, wherein said absorbing material triggers the absorption of oxygen at a preset temperature, power-on or gas pressure.
5. A gas-escape-free photosensitive assembly according to any one of claims 1 to 3, wherein the adhesive layer is disposed between the wiring board and the photosensitive unit, wherein an absorbing material of the adhesive layer absorbs oxygen inside the gas-escape-free photosensitive assembly when the gas-escape-free photosensitive assembly is baked, so that an internal and external air pressure difference is within a safe range.
6. An evacuable pore-free photosensitive assembly, comprising:
a photosensitive unit;
the photosensitive unit is attached to the circuit board in an electric communication manner;
the base is fixed on the circuit board so as to encapsulate the photosensitive unit;
a filter element, wherein the filter element is fixed on the top surface of the base, and the circuit board, the base and the filter element form a closed space; and
at least one absorbing layer, wherein the absorbing layer is made of at least one absorbing material and is arranged in the closed space, wherein the absorbing material is a material for absorbing oxygen, and when the non-air-hole type photosensitive component is baked, the absorbing layer absorbs the oxygen in the closed space, so that the internal and external air pressure difference is in a safe range;
and the isolating device is coated on the outer surface of the absorption layer and is used for isolating gas, and when the non-air hole type photosensitive assembly is baked, the isolating device is heated and melted to expose the absorption layer.
7. The evacuable hole-free photosensitive assembly of claim 6, wherein the absorber layer is disposed on the base inner wall.
8. The evacuable hole-free photosensitive assembly of claim 6, wherein the absorber layer is disposed on the circuit board.
9. The evacuable hole-free photosensitive assembly of claim 6, wherein the absorbing layer is disposed on a bottom surface of the filter element and is made of a transparent material.
10. The evacuable hole-free photosensitive assembly according to any of claims 6 to 9, wherein the absorbing layer is implemented to trigger absorption of oxygen at a preset temperature, power-on or air pressure.
11. A camera module, its characterized in that includes:
an evacuable hole-free photosensitive assembly according to claims 1 to 10; and
an optical component, wherein the optical component is supported by the evacuable hole type photosensitive component and corresponds to the photosensitive path of the photosensitive unit.
12. The manufacturing method of the bubble-free photosensitive component is characterized by comprising the following steps:
(a) Attaching a photosensitive unit to a circuit board in an electrically conductive manner;
(b) Fixing a base on the circuit board through an adhesive layer to encapsulate the photosensitive unit, wherein the adhesive layer comprises at least one adhesive material and at least one absorbing material;
(c) Fixing a light filtering element on the base corresponding to the photosensitive path of the photosensitive unit;
(d) Arranging at least one absorption layer on the peripheral wall of the closed space, wherein the absorption layer is made of an absorption material;
(e) The isolating device is coated on the outer surface of the absorption layer and is used for isolating gas, and when the non-air hole type photosensitive assembly is baked, the isolating device is heated and melted to expose the absorption layer;
(f) The circuit board, the base and the optical filter element form a closed space to form a photosensitive assembly; and
(g) And baking the non-air-escape type photosensitive component, wherein the bonding layer absorbs oxygen in the closed space, so that the difference between internal and external air pressure is kept within a safe range.
13. The method of claim 12, wherein the step (c) further fixes the filter element to the base through another adhesive layer having an oxygen absorbing function.
14. The manufacturing method of the bubble-free photosensitive component is characterized by comprising the following steps:
(1) Attaching a photosensitive unit to a circuit board in an electrically conductive manner;
(2) Fixing a base on the circuit board through an adhesive layer to encapsulate the photosensitive unit, wherein the adhesive layer has an oxygen absorption function;
(3) Fixing a light filtering element on the base corresponding to the photosensitive path of the photosensitive unit;
(4) At least one absorption layer is arranged on the inner surface of the base, the circuit board or the bottom surface of the light filtering element;
(5) The isolating device is coated on the outer surface of the absorption layer and is used for isolating gas, and when the non-air hole type photosensitive assembly is baked, the isolating device is heated and melted to expose the absorption layer;
(6) The circuit board, the base and the optical filter element form a closed space to form a photosensitive assembly; and
(7) And baking the non-air-escape type photosensitive component, wherein the absorption layer absorbs oxygen in the closed space, so that the difference between internal and external air pressure is kept within a safe range.
15. The manufacturing method of the bubble-free photosensitive component is characterized by comprising the following steps:
(A) Attaching a photosensitive unit to a circuit board in an electrically conductive manner;
(B) Fixing a light filtering component on the circuit board through an adhesive layer to form the vent-free photosensitive component, wherein a light filtering path of the light filtering component corresponds to a photosensitive path of the photosensitive unit, the circuit board and the light filtering component form a closed space, and the photosensitive unit is positioned in the closed space, and the adhesive layer comprises at least one adhesive material and at least one absorbing material; and
(C) Providing an absorbent layer, wherein the absorbent layer is made of absorbent material and is arranged in the closed space;
(D) An isolating device is arranged, wherein the isolating device is coated on the outer surface of the absorption layer and is used for isolating gas, and when the non-escape hole type photosensitive assembly is baked, the isolating device is heated and melted to expose the absorption layer;
(E) And baking the non-air-escape type photosensitive component, wherein the bonding layer absorbs oxygen in the closed space, so that the difference between internal and external air pressure is kept within a safe range.
16. The method of claim 15, wherein the step (B) further comprises the steps of:
the filter component is formed by fixing a filter element on the top surface of a base through another adhesive layer, wherein the adhesive layer has the function of absorbing oxygen.
17. An evacuable pore-free photosensitive assembly, comprising:
a photosensitive unit;
the photosensitive unit is attached to the circuit board in an electric communication manner;
the base is fixed on the circuit board so as to encapsulate the photosensitive unit;
a filter element, wherein the filter element is fixed on the top surface of the base, and the circuit board, the base and the filter element form a closed space;
At least one absorption layer, wherein the absorption layer is made of at least one absorption material and is arranged in the closed space; and
the isolating device is coated on the outer surface of the absorbing layer to isolate gas, wherein when the non-air-hole type photosensitive assembly is baked, the isolating device is heated and melted to expose the absorbing layer, and the absorbing layer absorbs the gas in the airtight space to enable the pressure difference between the inside and the outside to be within a safe range.
18. The evacuable hole-free photosensitive assembly of claim 17, wherein the absorber layer is disposed on the base inner wall.
19. The gas-escape-free photosensitive assembly according to claim 17, wherein the absorbing layer is disposed on the wiring board.
20. The evacuable hole-free photosensitive assembly of claim 17, wherein the absorbing layer is disposed on a bottom surface of the filter element and is made of a transparent material.
21. The gas-escape-free photosensitive assembly according to any one of claims 17 to 20, wherein said absorbing layer is implemented as a material that triggers absorption of gas at a preset temperature, power-on or gas pressure.
22. A camera module, its characterized in that includes:
An evacuable hole-free photosensitive assembly according to any one of claims 17 to 21; and
an optical component, wherein the optical component is supported by the evacuable hole type photosensitive component and corresponds to the photosensitive path of the photosensitive unit.
CN201811218348.2A 2018-10-19 2018-10-19 No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method Active CN111083315B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811218348.2A CN111083315B (en) 2018-10-19 2018-10-19 No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811218348.2A CN111083315B (en) 2018-10-19 2018-10-19 No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method

Publications (2)

Publication Number Publication Date
CN111083315A CN111083315A (en) 2020-04-28
CN111083315B true CN111083315B (en) 2023-10-27

Family

ID=70308120

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811218348.2A Active CN111083315B (en) 2018-10-19 2018-10-19 No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method

Country Status (1)

Country Link
CN (1) CN111083315B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113067968A (en) * 2021-03-10 2021-07-02 Oppo广东移动通信有限公司 Shooting assembly and mobile terminal

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1773358A (en) * 2004-09-27 2006-05-17 Idc公司 Method and system for packaging MEMS devices with incorporated getter
JP2008172743A (en) * 2006-12-15 2008-07-24 Konica Minolta Opto Inc Imaging apparatus and mobile terminal
JP2012124633A (en) * 2010-12-07 2012-06-28 Konica Minolta Advanced Layers Inc Imaging apparatus and portable terminal
CN204810387U (en) * 2015-06-17 2015-11-25 南昌欧菲光电技术有限公司 Make a video recording module and electronic product
CN105898120A (en) * 2016-04-21 2016-08-24 宁波舜宇光电信息有限公司 Shooting module based on molding technology
CN206743374U (en) * 2017-04-28 2017-12-12 南昌欧菲光电技术有限公司 Camera module and its antisitic defect photosensory assembly

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007120885A2 (en) * 2006-04-13 2007-10-25 Qualcomm Mems Technologies, Inc. Mems devices and processes for packaging such devices
WO2007149475A2 (en) * 2006-06-21 2007-12-27 Qualcomm Mems Technologies, Inc. Method for packaging an optical mems device
TWI543305B (en) * 2014-02-27 2016-07-21 姜崇義 Device package method and structure thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1773358A (en) * 2004-09-27 2006-05-17 Idc公司 Method and system for packaging MEMS devices with incorporated getter
JP2008172743A (en) * 2006-12-15 2008-07-24 Konica Minolta Opto Inc Imaging apparatus and mobile terminal
JP2012124633A (en) * 2010-12-07 2012-06-28 Konica Minolta Advanced Layers Inc Imaging apparatus and portable terminal
CN204810387U (en) * 2015-06-17 2015-11-25 南昌欧菲光电技术有限公司 Make a video recording module and electronic product
CN105898120A (en) * 2016-04-21 2016-08-24 宁波舜宇光电信息有限公司 Shooting module based on molding technology
CN206743374U (en) * 2017-04-28 2017-12-12 南昌欧菲光电技术有限公司 Camera module and its antisitic defect photosensory assembly

Also Published As

Publication number Publication date
CN111083315A (en) 2020-04-28

Similar Documents

Publication Publication Date Title
US20220375978A1 (en) Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device
JP6934522B2 (en) Array imaging module and its applications
CN108401093B (en) Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment
KR102195988B1 (en) Array imaging module and molded photosensitive assembly, cirduit board assembly and manufacturing method thereof for electronic device
CN112217969B (en) Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof
TWI657306B (en) Array camera module and molded photosensitive component thereof, circuit board assembly and manufacturing method, and electronic device
JP2010141865A (en) Image sensor camera module and method of manufacturing same
CN115134490B (en) Sinking camera module, sinking photosensitive assembly and manufacturing method thereof
EP3481046A2 (en) Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
CN111083315B (en) No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method
JP2019509512A (en) Integrated packaging process-based camera module, integrated base component thereof, and manufacturing method thereof
JP2008172743A (en) Imaging apparatus and mobile terminal
CN107734216B (en) Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module
CN107734215B (en) Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment
JP5931544B2 (en) Semiconductor device and manufacturing method of semiconductor device
CN109672806B (en) Camera module, photosensitive assembly and packaging method thereof
JP6831477B2 (en) Circuit boards and molded photosensitive modules and their manufacturing methods, as well as camera modules and electronic devices
GB2121598A (en) Sealing optoelectronic packages
JP2019191444A (en) Imaging apparatus and method for manufacturing imaging apparatus
JPH10233588A (en) Shape holding apparatus for flexible circuit board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant