CN107734216B - Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module - Google Patents

Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module Download PDF

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Publication number
CN107734216B
CN107734216B CN201610669214.7A CN201610669214A CN107734216B CN 107734216 B CN107734216 B CN 107734216B CN 201610669214 A CN201610669214 A CN 201610669214A CN 107734216 B CN107734216 B CN 107734216B
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CN
China
Prior art keywords
circuit board
photosensitive
die
molded
attach
Prior art date
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Active
Application number
CN201610669214.7A
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Chinese (zh)
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CN107734216A (en
Inventor
王明珠
郭楠
陈振宇
田中武彦
赵波杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201610669214.7A priority Critical patent/CN107734216B/en
Priority to US16/088,435 priority patent/US11289521B2/en
Priority to EP23176877.1A priority patent/EP4231653A3/en
Priority to KR1020187031125A priority patent/KR102152516B1/en
Priority to JP2018550699A priority patent/JP7025345B2/en
Priority to PCT/CN2016/103247 priority patent/WO2017166798A1/en
Priority to EP16896568.9A priority patent/EP3468165B1/en
Priority to JP2018547880A priority patent/JP2019519087A/en
Priority to US15/317,117 priority patent/US10908324B2/en
Priority to EP16894174.8A priority patent/EP3429181A4/en
Priority to KR1020187029337A priority patent/KR102193819B1/en
Priority to PCT/CN2016/103736 priority patent/WO2017157015A1/en
Priority to KR1020207036129A priority patent/KR102335306B1/en
Priority to TW106203473U priority patent/TWM565451U/en
Priority to TW106108124A priority patent/TWI703715B/en
Priority to TW108117228A priority patent/TWI706212B/en
Priority to TW106110048A priority patent/TWI661258B/en
Priority to TW108117229A priority patent/TWI706213B/en
Priority to TW106204228U priority patent/TWM555960U/en
Priority to US15/473,573 priority patent/US9781325B1/en
Priority to US15/473,605 priority patent/US10033913B2/en
Priority to US15/473,609 priority patent/US9906700B2/en
Priority to US15/473,607 priority patent/US9826132B2/en
Priority to KR1020207019834A priority patent/KR102281383B1/en
Priority to JP2018556877A priority patent/JP6865232B2/en
Priority to EP17788772.6A priority patent/EP3481046A4/en
Priority to PCT/CN2017/082000 priority patent/WO2017186120A2/en
Priority to KR1020217022035A priority patent/KR20210091363A/en
Priority to KR1020187034256A priority patent/KR102147896B1/en
Priority to US15/679,146 priority patent/US10274694B2/en
Priority to US15/705,225 priority patent/US10175447B2/en
Priority to US15/705,232 priority patent/US10126519B2/en
Priority to US15/784,167 priority patent/US10578837B2/en
Publication of CN107734216A publication Critical patent/CN107734216A/en
Priority to US16/737,863 priority patent/US20200218034A1/en
Priority to US17/114,466 priority patent/US11822099B2/en
Priority to JP2021060338A priority patent/JP7344924B2/en
Priority to US17/678,347 priority patent/US11824071B2/en
Priority to US17/740,887 priority patent/US20220268968A1/en
Application granted granted Critical
Publication of CN107734216B publication Critical patent/CN107734216B/en
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The invention provides an array camera module, a molded photosensitive assembly and a manufacturing method thereof and an electronic device with the array camera module. Each photosensitive element is respectively attached to a chip attaching region of each circuit board, two ends of each group of leads are respectively connected to a chip connecting piece of each photosensitive element and a circuit board connecting piece of each circuit board, the module base comprises a molded body and a plurality of light windows, the support element protects the leads, the circuit boards and the photosensitive elements when the molded body is molded, the molded body is integrally combined with at least one part of each circuit board after the molded body is molded, and the photosensitive region of each photosensitive element corresponds to each light window of the molded base.

Description

Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module
Technical Field
The present invention relates to the field of optical imaging, and more particularly, to an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module.
Background
In recent years, camera modules for capturing images are increasingly being used in applications such as personal electronics, automotive fields, medical fields, etc., and for example, camera modules have become one of the standard accessories of portable electronic devices such as smartphones, tablet computers, etc. The camera module applied to the portable electronic equipment not only can acquire images, but also can help the portable electronic equipment to realize functions such as instant video call and the like. Along with the trend of the portable electronic devices toward lighter and thinner, the size requirements of the camera module are more and more strict, especially the height and size requirements of the camera module are more strict. In addition, the functions of the portable electronic device equipped with the camera module and the requirements of the user for the imaging quality of the camera module are also increasing, and in this case, the array camera module is beginning to appear. The array camera module comprises at least two sets of imaging systems, each set of imaging system comprises a photosensitive element and an optical lens arranged on a photosensitive path of the photosensitive element, and compared with a single-lens camera module with the same imaging quality, the array camera module can have smaller height dimension, so that the configuration of the array camera module on the light and thin portable electronic equipment is an important development trend of the electronic equipment in the future.
Similar to the single-lens camera module, the improvement of the imaging capability of the array camera module is also based on the configuration of the photosensitive element with larger imaging area and more passive electronic components such as driving resistor and capacitor for the array camera module, just because the array camera module needs to be configured with the photosensitive element with larger imaging area and more passive electronic components, the size of the array camera module can be further reduced only by improving the packaging process. Currently, a COB (Chip On Board) packaging process is generally adopted for packaging an array camera module, that is, a circuit board, a photosensitive element, a lens holder, an optical lens, a driver or a lens holder of the array camera module are respectively manufactured, then a passive electronic component, the photosensitive element and the lens holder are sequentially packaged on the circuit board, the optical lens is assembled on the driver or the lens holder, and the driver or the lens holder is assembled on the lens holder, so that the optical lens is kept on a photosensitive path of the photosensitive element, thereby forming the array camera module. In order to ensure the imaging quality of the array camera module, glue needs to be filled between every two components, for example, glue needs to be filled between the lens base and the circuit board to encapsulate the lens base on the circuit board, and leveling of the lens base and the circuit board is achieved through the glue. This also results in that the size of the array camera module packaged by the COB packaging process cannot be effectively reduced, and the packaging efficiency of the array camera module using the COB packaging process is low.
In order to solve this problem, a molding process is introduced into the field of manufacturing of camera modules, which allows an array camera module to integrally mold a lens holder on a circuit board in the course of being manufactured, in such a way that not only the size of the array camera module can be effectively reduced, but also the assembly error of the array camera module can be reduced, thereby improving the imaging quality of the array camera module. Nevertheless, there are still many drawbacks to introducing the molding process directly into the field of camera module manufacturing.
First, each photosensitive element of the array camera module is mounted on a circuit board and electrically connected with the photosensitive element and the circuit board through a lead, in which case, two ends of the lead can be welded to a non-photosensitive area of the photosensitive element and an edge area of the circuit board, respectively, and are limited by a wire bonding process and the properties of the lead itself, and after being welded to the photosensitive element and the circuit board, the two ends of the lead protrude upward to be higher than the upper surface of the photosensitive element. When the array camera module is molded by a molding process, the pressing surface of the upper die of the molding die is in contact with the protruding portion of the lead, so that the lead is deformed under pressure, and once the lead is deformed during the molding process, the lead is difficult to recover to an initial state after the upper die of the molding die is removed. Secondly, when a molding material for forming the lens holder is added to a molding space of the molding die and cured in the molding space to form the lens holder, the deformed leads are wrapped inside the lens holder to be maintained in a deformed state, and the ability of the deformed leads to transmit electrical signals between the photosensitive element and the circuit board is greatly reduced, so that the imaging ability and imaging efficiency of the camera module are greatly affected. More importantly, when the leads are extruded by the pressing surface of the upper die to deform, the deformation direction and the deformation degree of the leads are uncontrollable, so that adjacent leads can be contacted with each other after deformation to cause short circuit, and the defective rate of the product of the camera module is increased. In addition, after the photosensitive element is mounted on the circuit board, a gap is generated between the photosensitive element and the circuit board, and a fluid molding material is introduced into the gap formed between the photosensitive element and the circuit board during molding, so that the attachment relationship between the photosensitive element and the circuit board is changed, and once the attachment relationship between the photosensitive element and the circuit board is changed, the inclination of the photosensitive element is inevitably caused, so that the imaging quality of the array camera module is affected.
Disclosure of Invention
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the molded photosensitive assembly provides a supporting element for preventing a pressing surface of the molding die from pressing a lead of the molded photosensitive assembly to prevent the lead from being deformed when a molding process is performed.
An object of the present invention is to provide an array camera module, a molding photosensitive assembly and a manufacturing method thereof, and an electronic apparatus having the array camera module, wherein when a molding process is performed, an upper mold and a lower mold of the molding mold are clamped to bring a pressing surface of the upper mold into contact with a top surface of the supporting member, and at this time, the supporting member supports the upper mold upward to prevent the pressing surface of the upper mold from directly pressing the leads, thereby preventing the leads from being deformed by being pressed.
An object of the present invention is to provide an array camera module, a molding photosensitive assembly and a manufacturing method thereof, and an electronic apparatus having the array camera module, wherein when a molding process is performed, an upper mold and a lower mold of the molding mold are clamped to bring a bonding surface of the upper mold into contact with a top surface of the supporting member, and at this time, the supporting member upwardly supports the upper mold to reserve a safe distance between the leads and the bonding surface of the upper mold, thereby preventing the bonding surface of the upper mold from directly contacting the leads.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, wherein the supporting member is formed of a material having elasticity so that the supporting member can absorb an impact force generated when a pressing surface of the upper mold contacts a top surface of the supporting member, thereby preventing damage to the photosensitive member, a circuit board, an electronic component, and the leads of the molded photosensitive assembly when the upper mold and the lower mold of the molding mold are clamped.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting element is formed of a material having elasticity, so that when the pressing surface of the upper mold presses the top surface of the supporting element, the top surface of the supporting element can avoid generating gaps between the top surface of the supporting element and the pressing surface of the upper mold in a deformation manner, thereby avoiding a phenomenon of "flash" at a light window position of the molded base when the molded base of the molded photosensitive assembly is molded, and further being beneficial to ensuring the yield of the array camera module when the array camera module is packaged and ensuring the imaging quality of the array camera module.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, wherein the supporting member is formed of a material having elasticity so that when the pressing surface of the upper mold presses the top surface of the supporting member, the top surface of the supporting member can avoid a gap between the top surface of the supporting member and the pressing surface of the upper mold by deforming, so that the photosensitive region of the photosensitive member is in a sealed environment, thereby preventing a molding material for forming the molded base from entering the sealed environment to contaminate the photosensitive region of the photosensitive member.
An object of the present invention is to provide an array camera module, a molding photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, in which the supporting member is formed of a hard material, a cover film is provided overlapping the pressing surface of the upper mold when the molding process is performed, and the cover film is positioned between the pressing surface of the upper mold and the top surface of the supporting member when the pressing surface of the upper mold is pressed against the top surface of the supporting member, so that the cover film can prevent damage to the photosensitive member, the wiring board, the electronic component, and the leads when the upper mold and the lower mold are clamped.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus having the array camera module, wherein the supporting member is formed of a hard material, and the cover film is overlapped on the pressing surface of the upper mold when the molding process is performed, so that the cover film makes the photosensitive region of the photosensitive member in the sealing environment when the pressing surface of the upper mold presses the top surface of the supporting member, thereby preventing the molding material from entering the sealing environment to pollute the photosensitive region of the photosensitive member.
An object of the present invention is to provide an array camera module, a molding photosensitive assembly and a manufacturing method thereof, and an electronic apparatus having the array camera module, wherein the supporting member is formed of a hard material, and the cover film is overlapped on the pressing surface of the upper mold when the molding process is performed, so that the supporting member is not deformed when the pressing surface of the upper mold is pressed against the top surface of the supporting member, thereby preventing the leads from being deformed to protect good electrical properties of the leads.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, wherein the supporting member covers at least a portion of a non-photosensitive area of the photosensitive member, so that the supporting member can prevent the molding material from entering the sealing environment through a contact position of the supporting member and the non-photosensitive area of the photosensitive member to contaminate the photosensitive area of the photosensitive member when the molding process is performed.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, in which the supporting member covers connection positions of a chip connector of the photosensitive member and the leads and connection positions of a board connector of the circuit board and the leads, so that the supporting member isolates each connection position from the molding material when performing a molding process, to make each connection position more reliable.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting member covers a portion of an edge area of the circuit board, so that the supporting member can block the molding material in a fluid state from striking the leads when the molding process is performed.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting element wraps a part of an edge area of the circuit board, so that the supporting element is far away from a photosensitive area of the photosensitive element, and thus a material for forming the supporting element does not pollute the photosensitive area of the photosensitive element in a molding process of the supporting element, so as to avoid a situation that the photosensitive element has a dirty and damaged spot.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, in which the supporting member covers a portion of an edge region of the circuit board and at least a portion of a non-photosensitive region of the photosensitive member at the same time to fix the circuit board and the photosensitive member so that the supporting member can cover the photosensitive member and the circuit board without displacement when the upper mold and the lower mold are closed and the molding material is added to a molding space formed between the upper mold and the lower mold.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting member covers a portion of an edge region of the circuit board and at least a portion of a non-photosensitive region of the photosensitive member at the same time, so that the supporting member can prevent the molding material from entering between the photosensitive member and the circuit board when the molding process is performed.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting element wraps at least a portion of the lead wire, so that the supporting element maintains the lead wire in an optimal state during a molding process, so as to ensure good electrical properties of the lead wire.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting element covers at least a portion of the lead, so as to prevent stray light from being generated inside the array camera module to affect the imaging quality of the array camera module when the array camera module is used later.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting element has an adhesive property, so that before the molding of the molding base, the supporting element can be adhered to pollutants such as welding powder generated when the electronic component is attached to the circuit board, so as to prevent the pollutants from polluting a photosensitive area of the photosensitive element to generate a dirty spot.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, wherein a top surface of the supporting member is higher than a chip connection member of the photosensitive member so as not to damage the chip connection member of the photosensitive member when the molding process is performed.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the supporting element wraps the chip connector of the photosensitive element, so as to prevent the molding material from contacting the chip connector of the photosensitive element when the molding process is performed, thereby wrapping the chip connector of the photosensitive element. Similarly, the support member can prevent the molding material from contacting the wiring board connector of the wiring board, thereby protecting the wiring board connector of the wiring board.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic apparatus with the array camera module, wherein the supporting member is disposed outside the chip connection member of the photosensitive member to prevent the molding material from contacting the chip connection member of the photosensitive member to thereby cover the chip connection member of the photosensitive member when the molding process is performed. Similarly, the support member can prevent the molding material from contacting the wiring board connector of the wiring board, thereby protecting the wiring board connector of the wiring board.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the array camera module provides a bracket, the bracket has at least two mounting channels, and a driver or a lens holder for assembling the optical lenses is respectively assembled in each of the mounting channels of the bracket, so that the coaxiality of each optical lens is maintained by the bracket.
An object of the present invention is to provide an array camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device with the array camera module, wherein the array camera module provides at least one filter element, the filter element is held between the photosensitive element and the optical lens, and the filter element is used for filtering stray light entering the interior of the array camera module from the optical lens, so as to improve the imaging quality of the array camera module.
In accordance with one aspect of the present invention, there is provided a molded photosensitive assembly comprising:
at least one support element formed from a first medium;
at least one circuit board, wherein each circuit board is provided with at least one chip mounting area respectively;
At least two photosensitive elements, wherein each photosensitive element is respectively attached to each chip attaching area of each circuit board;
at least two groups of leads, wherein two ends of each group of leads are respectively connected to a chip connecting piece of each photosensitive element and a circuit board connecting piece of each circuit board; and
a molded base formed of a second medium, wherein the molded base includes a molded body and has at least two optical windows, wherein the supporting member protects the leads, the wiring boards, and the photosensitive members when the molded body is molded, the molded body is integrally bonded with at least a portion of each of the wiring boards after the molded body is molded, and a photosensitive region of each of the photosensitive members corresponds to each of the optical windows of the molded base, respectively.
According to one embodiment of the present invention, the molded photosensitive assembly includes two of the support members, one of the wiring boards, two of the photosensitive members, and two sets of the leads, and the wiring board has two of the die attach areas.
According to one embodiment of the present invention, the molded photosensitive assembly includes two of the support members, two of the wiring boards, two of the photosensitive members, and two sets of the leads, and each of the wiring boards has one of the die attach areas, respectively.
According to one embodiment of the present invention, the molded photosensitive assembly further comprises at least one electronic component, wherein the circuit board has an edge region, the edge region and the die attach region are integrally formed, each of the electronic components is attached to the edge region, respectively, and wherein the supporting member is located between the electrical component and the photosensitive region of the photosensitive member.
According to one embodiment of the invention, the support element comprises a frame-shaped support body and a through-hole, the support body being arranged outside the photosensitive area of the photosensitive element, the photosensitive area of the photosensitive element corresponding to the through-hole, wherein the molded body encloses a portion of the support body.
According to one embodiment of the invention, the support body has a top surface, an inner side surface and an outer side surface, the top surface extending inwardly and outwardly to connect to the inner side surface and the outer side surface, respectively, the inner side surface forming the through hole, wherein the molded body covers the outer side surface of the support body.
According to one embodiment of the invention, the support body has a top surface, an inner side surface and an outer side surface, the top surface extending inwardly and outwardly to connect to the inner side surface and the outer side surface, respectively, the inner side surface forming the through hole, wherein the molded body encloses at least a portion of the outer side surface and the top surface of the support body.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are located on both sides of the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip inner portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are located on both sides of the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip connecting portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are located on both sides of the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip outer portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are located on both sides of the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip inner portion and at least a portion of the chip connecting portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are located on both sides of the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip connecting portion and at least a portion of the chip outer portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are located on both sides of the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip inner portion, the chip connecting portion, and at least a portion of the chip outer portion of the photosensitive element.
According to one embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at both sides of the circuit board connecting portion, wherein the supporting body covers at least a portion of the circuit board inner portion of the circuit board.
According to one embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at both sides of the circuit board connecting portion, wherein the supporting body covers at least a portion of the circuit board connecting portion of the circuit board.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at both sides of the circuit board connecting portion, wherein the supporting body covers a portion of the circuit board outer portion of the circuit board.
According to one embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at both sides of the circuit board connecting portion, wherein the supporting body covers at least a portion of the circuit board inner portion and at least a portion of the circuit board connecting portion of the circuit board.
According to one embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at both sides of the circuit board connecting portion, wherein the supporting body covers at least a portion of the circuit board connecting portion and a portion of the circuit board outer portion of the circuit board.
According to one embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at both sides of the circuit board connecting portion, wherein the supporting body covers at least a portion of the circuit board inner portion, the circuit board connecting portion, and a portion of the circuit board outer portion of the circuit board.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are disposed on both sides of the chip connecting portion, respectively, wherein the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are disposed on both sides of the circuit board connecting portion, respectively, wherein the supporting body covers at least a portion of the circuit board inner portion and at least a portion of the chip outer portion of the photosensitive element.
According to an embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are disposed on both sides of the chip connecting portion, respectively, wherein the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, the circuit board connecting member is disposed on the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are disposed on both sides of the circuit board connecting portion, respectively, wherein the supporting body covers at least a portion of the circuit board inner portion and the circuit board connecting portion, and at least a portion of the chip outer portion of the photosensitive element.
According to an embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, the chip connecting member is disposed on the chip connecting portion, the chip inner portion and the chip outer portion are located on both sides of the chip connecting portion, respectively, wherein the edge region of the wiring board includes a wiring board inner portion, a wiring board connecting portion, and a wiring board outer portion, the wiring board connecting member is disposed on the wiring board connecting portion, the wiring board inner portion and the wiring board outer portion are located on both sides of the wiring board connecting portion, respectively, wherein the supporting body covers at least a portion of the wiring board inner portion, the wiring board connecting portion, and the wiring board outer portion, and at least a portion of the chip outer portion of the photosensitive element.
According to an embodiment of the invention, the supporting body further encloses at least a portion of the chip connection portion of the photosensitive element.
According to one embodiment of the invention, the support body further encloses at least a portion of the chip inner portion of the photosensitive element.
According to another aspect of the present invention, there is further provided an array camera module, comprising:
at least two optical lenses; and
a molded photosensitive assembly, wherein the molded photosensitive assembly further comprises:
at least one support element formed from a first medium;
at least one circuit board, wherein each circuit board is provided with at least one chip mounting area respectively;
at least two photosensitive elements, wherein each photosensitive element is respectively attached to each chip attaching area of each circuit board;
at least two groups of leads, wherein two ends of each group of leads are respectively connected to a chip connecting piece of each photosensitive element and a circuit board connecting piece of each circuit board; and
a molded base formed of a second medium, wherein the molded base includes a molded body and has at least two optical windows, wherein the supporting member protects the leads, the circuit board and the photosensitive elements when the molded body is molded, the molded body is integrally combined with at least a portion of each of the circuit boards after the molded body is molded, and a photosensitive area of each of the photosensitive elements corresponds to each of the optical windows of the molded base, and each of the optical lenses is disposed in a photosensitive path of each of the photosensitive elements, respectively, to provide a light path for the optical lenses and the photosensitive elements through the optical windows.
According to one embodiment of the present invention, the array camera module further includes at least two drivers, wherein each of the optical lenses is assembled to each of the drivers, and each of the drivers is assembled to the top surface of the molding body.
According to one embodiment of the present invention, the array camera module further includes at least one driver and at least one lens barrel, each of the optical lenses being assembled to each of the drivers and each of the lens barrels, respectively, wherein each of the drivers and each of the lens barrels are located at different positions of the top surface of the molded body, respectively.
According to an embodiment of the present invention, the array camera module further includes at least two lens barrels, wherein each of the lens barrels is integrally formed on a top surface of the molded body, and each of the optical lenses is assembled to each of the lens barrels, respectively; or further comprises at least two lens barrels, wherein at least one lens barrel is integrally formed on the top surface of the molding main body, the other lens barrel is attached on the top surface of the molding main body, and each optical lens is respectively assembled on each lens barrel; or the array camera module comprises two lens barrels attached to the top surface of the molding main body, and each optical lens is assembled to each lens barrel respectively.
According to one embodiment of the present invention, the array camera module further includes at least one filter element, wherein each filter element is assembled to the top surface of the molded body, respectively, such that each filter element is held between each optical lens and each photosensitive element.
According to one embodiment of the invention, the top surface of the molded body has at least two inner side surfaces and an outer side surface, wherein each of the filter elements is assembled to each of the inner side surfaces of the molded body, and each of the drivers is assembled to a different position of the outer side surface of the molded body.
According to one embodiment of the present invention, the plane of the inner side surface of the molded body is lower than the plane of the outer side surface, so as to form at least one groove of the molded body, wherein each filter element is respectively located in each groove.
According to one embodiment of the invention, the support element comprises a frame-shaped support body and a through-hole, the support body being arranged outside the photosensitive area of the photosensitive element, the photosensitive area of the photosensitive element corresponding to the through-hole, wherein the molded body encloses a portion of the support body.
According to one embodiment of the invention, the support body encloses a portion of the edge region of the circuit board.
According to one embodiment of the invention, the support body encloses at least a portion of the non-photosensitive area of the photosensitive element.
According to one embodiment of the invention, the supporting body covers both a part of the edge area of the circuit board and at least a part of the non-photosensitive area of the photosensitive element.
According to an embodiment of the present invention, the array camera module further includes at least one support member and at least one filter element, wherein each filter element is assembled to each support member, and each support member is assembled to a top surface of the molded body, respectively, such that each filter element is held between each optical lens and each photosensitive element.
According to another aspect of the present invention, there is further provided an electronic apparatus, comprising:
an electronic device body; and
an array camera module, wherein the array camera module is set up in the electronic equipment body for obtain the image, wherein the array camera module further includes:
At least two optical lenses; and
a molded photosensitive assembly, wherein the molded photosensitive assembly further comprises:
at least one support element formed from a first medium;
at least one circuit board, wherein each circuit board is provided with at least one chip mounting area respectively;
at least two photosensitive elements, wherein each photosensitive element is respectively attached to each chip attaching area of each circuit board;
at least two groups of leads, wherein two ends of each group of leads are respectively connected to a chip connecting piece of each photosensitive element and a circuit board connecting piece of each circuit board; and
a molded base formed of a second medium, wherein the molded base includes a molded body and has at least two optical windows, wherein the supporting member protects the leads, the circuit board and the photosensitive elements when the molded body is molded, the molded body is integrally combined with at least a portion of each of the circuit boards after the molded body is molded, and a photosensitive area of each of the photosensitive elements corresponds to each of the optical windows of the molded base, and each of the optical lenses is disposed in a photosensitive path of each of the photosensitive elements, respectively, to provide a light path for the optical lenses and the photosensitive elements through the optical windows.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive member, wherein the method comprises the steps of:
(a) At least two photosensitive elements and at least one circuit board are connected through a group of leads;
(b) Placing each photosensitive element and each circuit board on an upper die or a lower die of a forming die;
(c) During the process of clamping the upper die and the lower die, the upper die is supported upwards by at least one supporting element so as to prevent the pressing surface of the upper die from pressing each group of leads; and
(d) And adding a fluid molding material into a molding space formed between the upper mold and the lower mold to form a molding base after the molding material is solidified, wherein the molding base comprises a molding body and at least two optical windows, wherein the molding body covers a part of the edge area of each circuit board and at least a part of the supporting element, and the photosensitive area of each photosensitive element corresponds to each optical window respectively.
Drawings
Fig. 1 is a schematic perspective sectional view of one of the steps of manufacturing an array camera module according to a preferred embodiment of the present invention, wherein a photosensitive element of the array camera module is mounted on a chip mounting area of a circuit board, and a chip connector of the photosensitive element and a circuit board connector of the circuit board are connected by a set of leads, wherein the circuit board is an integrated circuit board.
FIG. 2 is a schematic perspective view of a second step of manufacturing the array camera module according to the above preferred embodiment of the present invention, wherein a supporting body of the array camera module is disposed to cover at least a portion of the non-photosensitive area of the photosensitive element to form a molded photosensitive assembly semi-finished product.
Fig. 3A is a schematic perspective view of a third step of manufacturing the array camera module according to the above preferred embodiment of the present invention, wherein the molded photosensitive component semi-finished product is placed between an upper mold and a lower mold of a molding mold, and a pressing surface of the upper mold is in contact with a top surface of the supporting body.
Fig. 3B is a schematic perspective sectional view of a variant of the third manufacturing step of the array camera module according to the above preferred embodiment of the present invention, in which a cover film is disposed on the pressing surface of the upper mold so that the cover film is located between the pressing surface of the upper mold and the top surface of the supporting body when the pressing surface of the upper mold presses the top surface of the supporting body.
Fig. 4 is a schematic perspective sectional view of a fourth step of manufacturing the array camera module according to the above preferred embodiment of the present invention, in which a molding material is added to a molding space formed between the upper mold and the lower mold.
FIG. 5 is a schematic perspective sectional view of a fifth step of manufacturing the array camera module according to the above preferred embodiment of the present invention, wherein a molded photosensitive member of the array camera module is formed after the molding material is cured.
FIG. 6 is a schematic perspective view showing a sixth step of manufacturing the array camera module according to the above preferred embodiment of the present invention, wherein a filter element of the array camera module is assembled on the top surface of the molded base.
Fig. 7 is a schematic perspective view of a seventh step of manufacturing the array camera module according to the above preferred embodiment of the present invention, wherein an optical lens of the array camera module is assembled to a driver, and the driver is assembled to a top surface of the module base.
Fig. 8 is a schematic perspective view illustrating an eighth step of manufacturing the array camera module according to the above preferred embodiment of the present invention, wherein each of the drivers is mounted in each mounting space of a bracket of the array camera module to form the array camera module.
Fig. 9 is a schematic perspective view of the array camera module according to the above preferred embodiment of the invention.
Fig. 10 is a schematic perspective view of a first variant of the array camera module according to the above preferred embodiment of the present invention.
Fig. 11 is a schematic perspective sectional view of a second variant of the array camera module according to the above preferred embodiment of the present invention.
Fig. 12 is a schematic perspective sectional view of a third variant of the array camera module according to the above preferred embodiment of the present invention.
Fig. 13A is a schematic perspective sectional view of a fourth variant of the array camera module according to the above preferred embodiment of the present invention.
Fig. 13B is a schematic perspective sectional view of a fifth variant of the array camera module according to the above preferred embodiment of the present invention.
Fig. 14A is a schematic perspective view of a first variant of the molded photosensitive assembly semi-finished product of the array camera module according to the above preferred embodiment of the present invention, in which the supporting body covers at least a portion of the edge region of the circuit board and at least a portion of the chip outer side, the chip connecting portion and the chip inner side of the non-photosensitive region of the photosensitive element.
Fig. 14B is a schematic perspective view of a second variant of the molded photosensitive assembly semi-finished product of the array camera module according to the above preferred embodiment of the present invention, in which the supporting body covers at least a portion of the edge area of the circuit board and at least a portion of the chip outer side portion and the chip connection portion of the non-photosensitive area of the photosensitive element.
Fig. 14C is a schematic perspective view of a third variant of the molded photosensitive assembly semi-finished product of the array camera module according to the above preferred embodiment of the present invention, in which the supporting body covers at least a portion of the edge region of the circuit board and at least a portion of the chip outer side of the non-photosensitive region of the photosensitive element.
Fig. 14D is a schematic perspective view of a fourth variant of the molded photosensitive component semi-finished product of the array camera module according to the above preferred embodiment of the present invention, in which the supporting body covers at least a portion of the edge area of the circuit board.
Fig. 14E is a schematic perspective view of a fifth variant of the molded photosensitive component semi-finished product of the array camera module according to the above preferred embodiment of the present invention, in which the supporting body covers at least a portion of the edge area of the circuit board.
Fig. 15 is a cross-sectional view of a variation of the molded photosensitive assembly of the array camera module according to the above preferred embodiment of the present invention, wherein the molded base covers the outer side of the supporting body.
Fig. 16 is a schematic perspective cross-sectional view of an array camera module according to another preferred embodiment of the invention.
Fig. 17 is a schematic perspective sectional view of an array camera module according to another preferred embodiment of the present invention.
Fig. 18 is a schematic perspective sectional view of an array camera module according to another preferred embodiment of the invention. Fig. 19 is a schematic view of an electronic device with the array camera module according to the above preferred embodiment of the present invention.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.
It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.
Referring to fig. 1 to 9 of the drawings, an array camera module according to a preferred embodiment of the present invention is illustrated, wherein the array camera module comprises at least two optical lenses 10 and a molded photosensitive element 20, wherein the molded photosensitive element 20 further comprises at least two photosensitive elements 21, a circuit board 22, a molded base 23, and at least two sets of leads 24.
Each photosensitive element 21 includes a set of chip connectors 211, a photosensitive area 212, and a non-photosensitive area 213, wherein the photosensitive area 212 and the non-photosensitive area 213 are integrally formed, the photosensitive area 212 is located in the middle of the photosensitive element 21, the non-photosensitive area 213 is located outside the photosensitive element 21, and the non-photosensitive area 213 surrounds the photosensitive area 212 for one week, and the chip connectors 211 are disposed on the non-photosensitive area 213.
Accordingly, the circuit board 22 includes at least two sets of circuit board connectors 221, at least two flat chip mounting regions 222, and an edge region 223, wherein the edge region 223 and each of the chip mounting regions 222 are integrally formed, and the edge region 223 is located around each of the chip mounting regions 222, and the circuit board connectors 221 are disposed at the edge region 223.
Each of the leads 24 has a chip connection end 241 and a wiring board connection end 242, respectively, wherein the leads 24 extend curvedly between the chip connection end 241 and the wiring board connection end 242.
Each of the photosensitive elements 21 is mounted to each of the chip mounting areas 222 of the wiring board 22, respectively, wherein the chip connection ends 241 of the leads 24 are connected to the chip connectors 211 of the photosensitive elements 21, the wiring board connection ends 242 of the leads 24 are connected to the wiring board connectors 221 of the wiring board 22, and the molding base 23 is integrally bonded with at least the edge areas 223 of the wiring board 22 to form the molded photosensitive assembly 20, wherein each of the optical lenses 10 is disposed to a photosensitive path of each of the photosensitive elements 21 of the molded photosensitive assembly 20, respectively. Light reflected by the object enters the array camera module from each optical lens 10 to be received and photoelectrically converted by the photosensitive region 222 of each photosensitive element 21, so as to obtain an image associated with the object.
In one example of the array camera module of the present invention, the chip connector 211 of the photosensitive element 21 and the wiring board connector 221 of the wiring board 22 may be lands, respectively, that is, the chip connector 211 of the photosensitive element 21 and the wiring board connector 221 of the wiring board 22 may be disk-shaped for causing the chip connection end 241 of the lead 24 to be connected to the chip connector 211 of the photosensitive element 21 and the wiring board connection end 242 of the lead 24 to be connected to the wiring board connector 221 of the wiring board 22, respectively, and in another example of the array camera module of the present invention, the chip connector 211 of the photosensitive element 21 and the wiring board connector 221 of the wiring board 22 may be spherical, for example, solder paste or other solder material may be dispensed at the non-photosensitive area 213 of the photosensitive element 21 and the edge area 223 of the wiring board 22, respectively, to form the chip connector 211 of the photosensitive element 21 and the wiring board 22, respectively. However, it should be understood by those skilled in the art that the chip connector 211 of the photosensitive element 21 and the wiring board connector 221 of the wiring board 22 do not constitute limitations on the content and scope of the present invention, i.e., in other examples, the chip connector 211 of the photosensitive element 21 and the wiring board connector 221 of the wiring board 22 may have other shapes not exemplified above.
The non-photosensitive region 213 of the photosensitive element 21 further has a chip inner portion 2131, a chip connecting portion 2132 and a chip outer portion 2133, wherein the chip connecting member 211 is disposed on the chip connecting portion 2132, the chip inner portion 2131 surrounds the photosensitive region 212 for one circle, and both sides of the chip connecting portion 2132 extend and are connected to the chip inner portion 2131 and the chip outer portion 2132, respectively. That is, in the present invention, the region of the non-photosensitive region 213 from the position where the chip connector 211 is provided to the edge position of the photosensitive region 212 is defined as the chip inside portion 2131, the region of the non-photosensitive region 213 where the chip connector 211 is provided is defined as the chip connecting portion 2132, and the region of the non-photosensitive region 213 from the position where the chip connector 211 is provided to the outer edge of the photosensitive element 21 is defined as the chip outside portion 2133. In other words, the photosensitive element 21 is the photosensitive region 212, the chip inner portion 2131, the chip connecting portion 2132, and the chip outer portion 2133 in this order from the inside to the outside in a plan view of the photosensitive element 21.
Similarly, the edge region 223 of the circuit board 22 further has a circuit board inner side portion 2231, a circuit board connecting portion 2232, and a circuit board outer side portion 2233, wherein the circuit board connecting member 221 is disposed on the circuit board connecting portion 2232, the circuit board inner side portion 2231 surrounds the die attach region 222 for one turn, and both sides of the circuit board connecting portion 2232 are respectively extended and connected to the circuit board inner side portion 2231 and the circuit board outer side portion 2233. That is, in the present invention, the edge position of the edge region 223 from the position where the wiring board connector 221 is provided to the die attach region 222 is defined as the wiring board inside part 2231, the region of the edge region 223 where the wiring board connector 221 is provided is defined as the wiring board connecting part 2232, and the region of the edge region 223 from the position where the wiring board connector 221 is provided to the outer edge of the wiring board 22 is defined as the wiring board outside part 2233. It should be noted that, in this embodiment of the array camera module of the present invention, the circuit board 22 is a unitary circuit board, and preferably, each of the die attach areas 222 is symmetrically disposed at two ends of the circuit board 22, so that the circuit board 22 forms a symmetrical structure.
In addition, the type of the lead wire 24 is not limited in the array camera module of the present invention, and for example, in a specific example, the lead wire 24 may be implemented as a gold wire, that is, the photosensitive element 21 and the wiring board 22 may be connected together by way of gold wire bonding, so that after the photosensitive region 212 of the photosensitive element 21 converts the optical signal into an electrical signal, the electrical signal can be further transmitted to the wiring board 22 through the lead wire 24. It will be appreciated by those skilled in the art that in other examples of the array camera module of the present invention, the lead 24 may be made of any material capable of transmitting the electrical signal between the photosensitive element 21 and the circuit board 22, such as silver wire, copper wire, or the like.
The array camera module can be a fixed focus camera module or a zooming camera module, for example, the array camera module can have optical zooming capability under the premise of being controlled in height dimension so as to improve the imaging quality of the array camera module. Specifically, in this example of the array camera module shown in fig. 7, the array camera module further includes at least two drivers 30, wherein each of the optical lenses 10 is assembled to each of the drivers 30, and each of the drivers 30 is assembled to the top surface of the mold base 23, so that each of the optical lenses 10 is held on the photosensitive path of each of the photosensitive elements 21 of the mold photosensitive assembly 20, respectively. Each of the drivers 30 is electrically connected to the circuit board 22, so that after the circuit board 22 transmits electric energy and control signals to each of the drivers 30, each of the drivers 30 can move back and forth along the photosensitive path of each of the photosensitive elements 21, so as to adjust the focal length of the array camera module. That is, the optical lens 10 may be drivingly disposed to the driver 30.
It should be noted that the type of the driver 30 is not limited in the array camera module of the present invention, and for example, in a specific example, the driver 30 may be implemented as any driver capable of driving the optical lens 10 to shift along the photosensitive path of the photosensitive element 21, such as a voice coil motor, where the driver 30 is capable of receiving power and control signals to be in an operating state.
With further reference to fig. 7, the array camera module further includes at least one filter element 40. For example, in one illustrative example of the present invention, the array camera module may include one of the filter elements 40, wherein the filter element 40 is assembled to the top surface of the mold base 23 such that different positions of the filter element 40 respectively correspond to the photosensitive paths of each of the photosensitive elements 21. In another illustrative example, the array camera module may include at least two optical filter elements 40, wherein each optical filter element 40 is assembled to the top surface of the module base 23, such that each optical filter element 40 corresponds to a photosensitive path of each photosensitive element 21, that is, each photosensitive element 21, each optical filter element 40, and each optical lens 10 of the array camera module are in a one-to-one correspondence.
When the array camera module is used, the light reflected by the object enters the array camera module from the optical lens 10, and can be received by the photosensitive element 21 and subjected to photoelectric conversion after being filtered by the filter element 40. That is, the filter element 40 can filter stray light, such as the infrared ray, in the light reflected by the object entering the array camera module from the optical lens 10, and in this way, the imaging quality of the array camera module can be improved.
In addition, the filter element 40 may be directly assembled on the top surface of the molding base 23, or the filter element 40 may be assembled on a support member, and then the support member is assembled on the top surface of the molding base 23, so that the size of the filter element 40 can be reduced, so as to reduce the manufacturing cost of the array camera module.
It will be appreciated by those skilled in the art that in different examples of the array camera module, the filter element 40 can be implemented as a different type, for example, the filter element 40 can be implemented as an ir cut filter, a full spectrum filter, or a combination of a plurality of filters, for example, the filter element 40 can be implemented as a combination of an ir cut filter and a full spectrum filter, that is, the ir cut filter and the full spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21, for example, when the array camera module is used in an environment where light is relatively sufficient such as daytime, the ir cut filter can be switched to the photosensitive path of the photosensitive element 21, so as to filter the infrared light in the light reflected by the object entering the array camera module by the ir cut filter, and when the array camera module is used in an environment where light is relatively dark such as night, the full spectrum filter can be switched to the path of the photosensitive element 21, so as to allow the infrared light entering the light reflected by the object camera module to be partially transmitted through the photosensitive path of the photosensitive element 21.
Referring to fig. 8 and 9, the array camera module further includes a bracket 50, wherein the bracket 50 has at least two mounting spaces 51, and each of the mounting spaces 51 is respectively communicated with both sides of the bracket 50, i.e., each of the mounting spaces 51 may respectively form a channel. Each of the drivers 30 is mounted in each of the mounting spaces 51 of the bracket 50, respectively, so that each of the drivers 30 is maintained in a stable state by the bracket 50, thereby ensuring the coaxiality of each of the optical lenses 10 assembled to each of the drivers 30 and improving the strength of the array camera module to further improve the imaging quality of the array camera module.
Preferably, after each of the drivers 30 is mounted in each of the mounting spaces 51 of the bracket 50, respectively, a filler is filled between inner walls of the bracket 50 of the housing of each of the drivers 30 so that each of the drivers 30 does not shake after being mounted in each of the mounting spaces 51 of the bracket 50. More preferably, the filler filled between the housing of each of the drivers 30 and the inner wall of the bracket 50 may be glue.
The molded photosensitive assembly 20 further includes at least one support member 25 to protect the leads 24 and the photosensitive member 21 by the support member 25 when the molding process is performed. In this example of the invention, the number of support elements 25 is embodied as a minimum of two. Preferably, the number of the supporting members 25 is identical to the number of the photosensitive members 21, and each of the supporting members 25 is disposed to cover the non-photosensitive region 213 of each of the photosensitive members 21 before the molding base 23 is formed, so that the module base 23 covers the edge region 223 of the circuit board 22, a part of the non-photosensitive region 213 of the photosensitive member 21, and a part of the supporting member 25 after the molding base 23 is formed to form the molded photosensitive assembly 20. The supporting element 25 can effectively improve the product yield of the array camera module and improve the imaging quality of the array camera module. In other examples of the invention, the number of support elements 25 may also be embodied as one, which will be further described later.
Each of the support bodies 251 includes a frame-shaped support body 251 and has a through hole 252, wherein the support body 251 is disposed to cover at least a portion of the non-photosensitive region 213 of the photosensitive element 21, and the photosensitive region 212 of the photosensitive element 21 corresponds to the through hole 252 of the support body 25. Preferably, the supporting body 251 covers at least a portion of the chip inner side portion 2131, the chip connecting portion 2132, and at least a portion of the chip outer side portion 2133 of the non-photosensitive region 213 of the photosensitive element 21. Further, the support body 251 has a top surface 2501, an inner side 2502, and an outer side 2503, wherein both sides of the top surface 2501 extend inward and outward to connect to the inner side 2502 and the outer side 2503, respectively. In the present invention, a side of the support body 251 facing the photosensitive region 212 is defined as the inner side 2502 of the support body 251, and a side of the support body 251 facing the edge region 223 of the wiring board 22 is defined as the outer side 2503 of the support body 251. In this embodiment, the molded base 23 encapsulates at least a portion of the top surface 2501 and the outer side 2503 of the support body 251 after molding.
In addition, the molded photosensitive assembly 20 of the array camera module further includes a plurality of electronic components 26, wherein each of the electronic components 26 may be attached to the edge region 223 of the circuit board 22 by a process such as SMT (Surface Mount Technology). Preferably, each of the electronic components 26 is mounted to the board outer side 2233 of the edge region 223. The photosensitive element 21 and each of the electronic components 26 may be mounted on the same side or opposite sides of the wiring board 22, for example, in a specific example, the photosensitive element 21 and each of the electronic components 26 are mounted on the same side of the wiring board 22, and the photosensitive element 21 is mounted on the die mounting region 222 of the wiring board 22, and each of the electronic components 26 is mounted on the edge region 223 of the wiring board 22. After the molding base 23 is integrally formed in the edge area 223 of the circuit board 22, the molding base 23 encapsulates each electronic component 26, so that the adjacent electronic components 26 are isolated from each other and the electronic component 26 and the photosensitive element 21 are isolated by the molding base 23, thereby, in the array camera module of the present invention, even when the distance between the adjacent electronic components 26 is relatively close, the molding base 23 can avoid the adjacent electronic components 26 from contacting or interfering with each other, and the manner that the molding base 23 encapsulates the electronic components 26 can avoid the pollutants generated on the surface of the electronic components 26 from polluting the photosensitive area 212 of the photosensitive element 21, thereby reducing the volume of the array camera module and improving the imaging quality of the array camera module. That is, the array camera module of the present invention enables the circuit board 22 with a small area to be mounted with more electronic components 26 by covering the electronic components 26 with the molding base 23. It is worth mentioning that the types of the electronic components 26 include, but are not limited to, resistors, capacitors, driving devices, etc.
With reference to fig. 1 to 9, although the following description of the present invention will further illustrate the features and advantages of the array camera module of the present invention by taking the example of the array camera module as a dual-lens camera module, it will be understood by those skilled in the art that the array camera module of the present invention may include more optical lenses 10 in a modified embodiment of the array camera module of the present invention shown in fig. 10.
The process of manufacturing the molded photosensitive assembly 20 of the array camera module is described in the examples shown in fig. 1 to 5, and the process of manufacturing the array camera module with the molded photosensitive assembly 20 is further described in the examples shown in fig. 6 to 8.
Referring to fig. 1, two photosensitive elements 21 are respectively mounted on two die mounting areas 222 of the circuit board 22 in a one-to-one correspondence manner, wherein one set of the die connectors 211 of each photosensitive element 21 and two sets of the circuit board connectors 222 of the circuit board 22 are respectively connected by one set of the leads 24. Each of the electronic components 26 is mounted on the edge area 233 of the wiring board 22, respectively. Preferably, each of the electronic components 26 is attached to the board outside part 2233 of the edge region 223, respectively. More preferably, each of the electronic components 26 is spaced apart from each other, so that each of the electronic components 26 does not interfere with each other after the array camera module is completed.
The lead 24 protrudes upward to be higher than the upper surface of the photosensitive element 21 after the chip connection terminal 241 and the wiring board connection terminal 242 of the lead 24 are connected to the chip connection 211 of the photosensitive element 21 and the wiring board connection 221 of the wiring board 22, respectively, subject to the wire bonding process of the lead 24 and the characteristics of the lead 24 itself. As will be appreciated by those skilled in the art, maintaining each of the leads 24 in an initial state during the manufacture and use of the array camera module is advantageous in ensuring good electrical characteristics of the leads 24 and in ensuring imaging quality of the array camera module.
Referring to fig. 2, each of the supporting bodies 251 is provided to cover at least a portion of the non-photosensitive region 213 of each of the photosensitive elements 21, wherein the photosensitive region 212 of each of the photosensitive elements 21 corresponds to the through hole 252 of each of the supporting elements 25, respectively, to form a molded photosensitive assembly semi-finished product by each of the supporting elements 25, each of the photosensitive elements 21, the wiring board 22, and each of the sets of the leads 24. In this example of the array camera module of the present invention, the support main 251 covers at least a part of the chip outside portion 2131, the chip connection portion 2132, and at least a part of the chip inside portion 2133 of the photosensitive element 21. That is, the supporting body 251 can cover the connection positions of the chip connection ends 241 of the leads 24 and the chip connection pieces 211 of the photosensitive element 21, so that the supporting body 251 can prevent the connection positions of the chip connection ends 241 of the leads 24 and the chip connection pieces 211 of the photosensitive element 21 from coming into contact with a molding material for forming the molding base 23 when a molding process is performed, thereby preventing the chip connection ends 241 of the leads 24 from falling off from the chip connection pieces 211 of the photosensitive element 21.
It is understood that the supporting body 251 covers the connection positions of the chip connection ends 241 of the leads 24 and the chip connection pieces 211 of the photosensitive element 21, so that the supporting body 251 can isolate the chip connection ends 241 of the leads 24 and the chip connection pieces 211 of the photosensitive element 21 from the molding material, thereby preventing the molding material from causing the chip connection ends 241 of the leads 24 to deform or the chip connection ends 241 of the leads 24 to be separated from the chip connection pieces 211 when the molding process is performed.
In addition, the supporting body 251 covers a portion of each of the leads 24, so that each of the leads 24 is prevented from being deformed by the supporting body 251 and pre-fixing each of the leads 24 when the molding process is performed, and the supporting body 251 can prevent short circuits caused by contact between adjacent leads 24 due to deformation, thereby ensuring the yield of the array camera module after the array camera module is manufactured.
In one embodiment, the supporting body 251 may be formed by disposing glue on the non-photosensitive region 213 of the photosensitive element 21 and after the glue is cured to make the supporting body 251 elastic, wherein the inner side 2502 of the supporting body 251 forms the through hole 252 of the supporting element 25 after the supporting body 251 is formed, and the photosensitive region 212 of the photosensitive element 21 corresponds to the through hole 252. In addition, the supporting body 251 formed of glue has an adhesive property for adhering contaminants such as dust to prevent the contaminants from contaminating the photosensitive area 212 of the photosensitive element 21, to prevent the photosensitive area 212 of the photosensitive element 21 from being stained, and to further secure the imaging quality of the array camera module. For example, the supporting body 251 is formed between the electronic component 26 and the photosensitive region 212 of the photosensitive element 21, so that contaminants such as solder powder generated when the electronic component 26 is mounted on the circuit board 22 are adhered to the supporting body 251 to prevent the contaminants such as solder powder from contaminating the photosensitive region 212 of the photosensitive element 21.
Preferably, the supporting body 251 may be formed by applying glue in a glue state to the non-photosensitive region 213 of the photosensitive element 21 and after the glue is cured, so as to prevent the glue from flowing after being applied to the non-photosensitive region 213 of the photosensitive element 21 to contaminate the photosensitive region 212 of the photosensitive element 21. In other words, the glue has good plasticity before curing to form the supporting body 251, so as to avoid deformation of the glue during the curing process and the application of the glue to the non-photosensitive areas 213 of the photosensitive element 21. It will be appreciated by those skilled in the art that after the die attach ends 241 of the leads 24 are disposed to be attached to the die attach 211 of the photosensitive element 21, glue in a glue state can coat the die attach ends 241 of the leads 24 after being applied to the non-photosensitive areas 213 of the photosensitive element 21, and after the glue is cured, the support body 251 is formed to coat the leads 24, thereby avoiding damage to the leads 24 during molding of the support body 251.
Referring to fig. 3A, in the molding process, the molding base 23 is formed by curing the molding material through a molding die 100, so that the size of the array camera module and the assembly error of the array camera module can be reduced, thereby making the structure of the array camera module more compact and improving the imaging quality of the array camera module.
Specifically, the molding die 100 includes an upper die 101 and a lower die 102, wherein at least one of the upper die 101 and the lower die 102 is movable to enable the upper die 101 and the lower die 102 to be subjected to a clamping operation, and at least two molding spaces 103 communicating with each other are formed between the upper die 101 and the lower die 102, wherein the molding base 23 is formed after being filled with the molding material into the molding spaces 103 and being cured.
For example, in one embodiment, the lower mold 102 may be fixed, the upper mold 101 may be movable along guide posts with respect to the lower mold 102 to be clamped when the upper mold 101 is moved toward the lower mold 102, and to be drawn when the upper mold 101 is moved away from the lower mold 102, and each of the molding spaces 103 may be formed between the upper mold 101 and the lower mold 102 when the upper mold 101 and the lower mold 102 are subjected to a clamping operation. In another embodiment, the upper mold 101 may be fixed, and the lower mold 102 may be movable along guide posts relative to the upper mold 101 to close the mold when the lower mold 102 is moved toward the upper mold 101, and to draw the mold when the lower mold 101 is moved away from the upper mold 101.
After the molded photosensitive assembly semi-finished product is placed on the upper mold 101 and/or the lower mold 102, the upper mold 101 and the lower mold 102 are operated to be clamped so that the molded photosensitive assembly semi-finished product is positioned in each of the molding spaces 103 formed in the upper mold 101 and the lower mold 102, wherein a pressing surface 1011 of the upper mold 101 presses against the top surface 2501 of the supporting body 251 to upwardly support the upper mold 101 by the supporting body 251, thereby preventing the pressing surface 1011 of the upper mold 101 from directly pressing against the leads 24 to protect the leads 24 from being damaged when a molding process is performed, wherein at least the edge region 223 of the circuit board 22 in the molded photosensitive assembly semi-finished product corresponds to the molding space 103.
It should be noted that each of the molding spaces 103 is respectively annular, and adjacent molding spaces 103 communicate with each other to form the molding base 23 after the molding material is added to the molding space 103 and the molding material is cured.
Preferably, the supporting body 251 has elasticity such that, when the molding die 100 is die-operated, an impact force generated by the pressing face 1011 of the upper die 101 at an instant of pressing against the top surface 2501 of the supporting body 251 is absorbed by the supporting body 251 to prevent the impact force from being further transmitted to the photosensitive element 21, thereby preventing the photosensitive element 21 from being damaged or preventing the photosensitive element 21 from being displaced relative to the wiring board 22 due to a force. As will be appreciated by those skilled in the art, the manner in which the supporting body 251 absorbs the impact force and prevents the impact force from being further transmitted to the photosensitive element 21 can also ensure that the flatness of the photosensitive element 21 attached to the circuit board 22 is not subject to images, thereby improving the product yield of the array camera module.
Preferably, in one example, the height of the supporting body 251 may be implemented to be higher than the height of the upward protrusion of the lead wire 24 so that the press-fit surface 1011 of the upper mold 101 can directly press the top surface 2501 of the supporting body 251 when the molding mold 100 is subjected to the mold clamping operation to prevent the press-fit surface 1011 of the upper mold 101 from pressing the lead wire 24 by the top surface 2501 of the supporting body 251 supporting the upper mold 101 upward. That is, a safe distance is reserved between the lead 24 and the press face 1011 of the upper die 101. In another example, the height of the supporting body 251 is equal to the height of the upward protrusion of the lead 24, so that the press-fit surface 1011 of the upper mold 101 is not capable of pressing the lead 24 although it can be in contact with the lead 24 when the molding die 100 is clamped.
In addition, the support body 251 has elasticity, and after the molding die 101 is subjected to the clamping operation, the press face 1011 of the upper die 101 presses the top surface 2501 of the support body 251 to slightly deform the top surface 2501 of the support body 251 for preventing a gap from being generated between the press face 1011 of the upper die 101 and the top surface 2501 of the support body 251. That is, the press-fit surface 1011 of the upper mold 101 and the top surface 2501 of the supporting body 251 are closely adhered to each other so that the photosensitive region 212 of the photosensitive element 21 corresponding to the through hole 252 of the supporting element 25 is in a sealed environment, whereby the molding material does not enter the sealed environment when the molding process is performed, to prevent the molding material from contaminating the photosensitive region 212 of the photosensitive element 21. It should be noted that the shore hardness of the supporting body 251 is in the range of a50-a80, and the elastic modulus is in the range of 0.1Gpa-1Gpa.
In addition, when the molding process is performed, the pressing surface 1011 of the upper mold 101 and the top surface 2501 of the supporting body 251 are tightly attached to prevent the molding material from entering the sealing environment, so that the phenomenon of "flash" can be avoided after the molding base 23 is molded, and the product yield of the array camera module can be ensured.
Fig. 3B shows a variant embodiment of the molded photosensitive component 20 of the array camera module according to the present invention in this process, in which the supporting body 251 may also be supported by a hard material, that is, when the pressing surface 1011 of the upper mold 101 presses the top surface 2501 of the supporting body 251, the supporting body 251 may not deform, so as to ensure good electrical properties of the leads 24, thereby ensuring the subsequent product yield of the camera module and further ensuring the imaging quality of the camera module. It should be noted that the shore hardness of the supporting body 251 is greater than D70, and the elastic modulus is greater than 1Fpa.
The molding die 100 further includes a cover film 104, wherein the cover film 104 is overlapped on the press-fit face 1011 of the upper die 101, so that the cover film 104 is located between the press-fit face 1011 of the upper die 101 and the top surface 2501 of the supporting body 251 when the molding die 100 is subjected to the clamping operation, so that the photosensitive region 212 of the photosensitive element 21 is in the sealed environment.
It should be noted that the cover film 104 located on the press face 1011 of the upper mold 101 and the top surface 2501 of the supporting body 251 can prevent a gap from being generated between the press face 1011 of the upper mold 101 and the top surface 2501 of the supporting body 251, on the one hand, and the cover film 104 can absorb an impact force generated when the press face 1011 of the upper mold 101 presses the top surface 2501 of the supporting body 251, on the other hand, so as to avoid the impact force from damaging the photosensitive element 21, the wiring board 22, and the leads 24.
In addition, the cover film 104 is provided to facilitate the removal of the molding die 100 after the molding of the molding base 23.
Referring to fig. 4, after the fluid molding material is introduced into each of the molding spaces 103 of the molding die 100, the molding material fills the entire area of each of the molding spaces 103, wherein the support body 251 formed at least a portion of the non-photosensitive region 213 of the photosensitive element 21 can prevent the molding material from entering the sealing environment. Specifically, the support body 251 can prevent the molding material from entering the sealing environment from the contact position of the support body 251 and the non-photosensitive region 213 of the photosensitive element 21, and can also prevent the molding material from entering the sealing environment from the contact position of the top surface 2501 of the support body 251 and the press-fit face 1011 of the upper mold 101.
It should be noted that the fluid-like molding material according to the present invention may be a liquid material or a solid particulate material or a mixture of liquid and solid particulate materials, and it is understood that the molding material, whether implemented as a liquid material or as a solid particulate material or as a mixture of liquid and solid particulate materials, is capable of solidifying to form the molding base 23 after being added to the molding space 103 of the molding die 100. For example, in this particular example of the invention, the molding material in fluid form is embodied as a thermoplastic material, such as a liquid, wherein the molding material solidifies after being introduced into the molding space 103 of the molding die 100 to form the molding base 23. It should be noted that, after the fluid molding material is added into the molding space 103 of the molding die 100, the curing manner of the fluid molding material does not limit the content and scope of the present invention.
Referring to fig. 5, when the molding material is introduced into the molding space 103, the supporting body 251 prevents the molding material from entering the photosensitive region 212 of the photosensitive element 21, so that after the molding material is solidified to form the molding base 23, the molding base 23 further forms at least two light windows 231, each of the light windows 231 corresponding to the photosensitive region 212 of each of the photosensitive elements 21 and each of the optical lenses 10, respectively, to provide a light path for the optical lenses 10 and the photosensitive elements 21 by the light windows 231. The molding material, after curing, forms a molded body 232 of the molded base 23. In this embodiment, the molded body 232 encapsulates the edge region 223 of the circuit board 22 and at least a portion of the outer side 2503 and the top surface 2501 of the support body 251 to form the molded photosensitive assembly 20. In other words, the molding base 23 includes one molding body 232 and has at least two light windows 231, and the filter element 40 and the driver 30 are subsequently assembled to the top surface of the molding body 232, respectively, such that the optical lens 10 assembled to the driver 30 is held in the photosensitive path of the photosensitive element 21.
It should be noted that the molding body 232 integrally combined with the edge region 223 of the circuit board 22 further encapsulates each of the electronic components 26, so that the adjacent electronic components 26 are isolated by the molding body 232 and the electronic components 26 and the photosensitive element 21 are isolated by the molding body 232, in such a manner that the molding body 232 can prevent the adjacent electronic components 26 from contacting or interfering with each other even when the adjacent electronic components 26 are closely spaced, and the molding body 232 can prevent the contaminants generated by the electronic components 26 from contaminating the photosensitive region 212 of the photosensitive element 21, so as to further improve the imaging quality of the camera module.
In addition, the molding body 232 encapsulates each electronic component 26 to avoid mutual interference between adjacent electronic components 26, so that the distance between adjacent electronic components 26 can be further reduced, and even on the circuit board 22 with smaller area, a larger number of electronic components 26 can be attached, so as to improve the imaging quality of the array camera module on the premise of reducing the size of the array camera module as much as possible. In addition, the invention uses the mode of coating each electronic component 26 by the molding main body 232 to isolate the electronic component 26 and the photosensitive element 21, so that even if the photosensitive element 21 is close to the electronic component 26, the photosensitive element 21 and the electronic component 26 do not interfere with each other, and the photosensitive element 21 with the larger photosensitive area 212 can be attached on the circuit board 22 with smaller area, thereby improving the imaging quality of the array camera module.
Preferably, the molding body 232 has good heat insulation, so that heat generated from the photosensitive element 21 when performing photoelectric conversion is not transferred to the electronic component 26 during the use of the array camera module, to ensure the reliability of the array camera module when in use.
Referring to fig. 6 and 7, the filter element 40 is assembled on the top surface of the molding base 23, so that the filter element 40 closes the light window 231 of the molding base 23, so that the light entering the interior of the array camera module from the optical lens 10 can be further filtered by the filter element 40 to improve the imaging quality of the array camera module. As described above, although the features and advantages of the array camera module of the present invention are described with reference to two filter elements 40 in fig. 6, it will be understood by those skilled in the art that the array camera module may also include one filter element 40, and each of the light windows 231 is simultaneously closed by one filter element 40 after the filter element 40 is assembled on the top surface of the mold base 23, so that the photosensitive areas 212 of each of the photosensitive elements 21 respectively correspond to different positions of the filter elements 40.
Further, the top surface of the mold base 23 includes at least two inner side surfaces 233 and an outer side surface 234, wherein in one example, each of the inner side surfaces 233 and the outer side surfaces 234 are in the same plane so that the top surface of the mold base 23 forms a complete plane, wherein each of the filter elements 40 is assembled to each of the inner side surfaces 233 of the mold base 23 to close each of the light windows 231 by each of the filter elements 40, and each of the drivers 40 is assembled to a different position of the outer side surfaces 234 of the mold base 23 to position the filter elements 40 between the optical lens 10 assembled to the driver 30 and the photosensitive region 212 of the photosensitive element 21. In another example, each of the inner side surfaces 233 is located at a lower level than the outer side surface 234 to form at least two grooves 235 of the molding base 23, i.e., the top surface of the molding base 23 is stepped, wherein the filter element 40 assembled to the inner side surface 233 of the molding base 23 is located within the grooves 235 of the molding base 23.
Referring to fig. 8, each of the drivers 30 of the array camera module is mounted in each of the mounting spaces 51 of the holders 50, respectively, and then filled between the outer case of each of the drivers 30 and the inner wall of the holders 50 by a filler such as glue to ensure that each of the drivers 30 does not shake when the array camera module is mounted or used, thereby ensuring the coaxiality of each of the optical lenses 10 assembled to each of the drivers 30 by the holders 50, and the holders 50 can also strengthen the structure of the array camera module to improve the stability of the array camera module. It should be noted that in one embodiment, the driver 30 may be disposed only in the mounting space 51 of the bracket 50, such that the bracket 50 covers at least a portion of the driver 30, and in another embodiment, the bracket 50 may further cover at least a portion of the molded base 23, and the present invention is not limited in this respect.
Fig. 11 shows a second variant of the array camera module, which includes two circuit boards 22, wherein each circuit board 22 includes one chip mounting region 222 and one edge region 223, respectively, wherein each photosensitive element 21 is mounted to the chip mounting region 222 of each circuit board 22, respectively, wherein the molding body 232 of the molding base 23 is integrally combined with at least a portion of the edge region 223 of each circuit board 22 when the molding process is performed to form the molding base 23, unlike the implementation of the above preferred embodiment of the present invention. That is, in this embodiment of the array camera module of the present invention, the wiring board 22 is a split type wiring board.
Fig. 12 shows a third modified embodiment of the array camera module, wherein the array camera module comprises at least one lens barrel 60 and at least one actuator 30, wherein the lens barrel 60 integrally extends on the top surface of the molding base 23, the actuator 30 is assembled on the top surface of the molding base 23, and the lens barrel 60 and the actuator 30 are respectively used for assembling the optical lens 10, preferably, the lens barrel 60 and the molding base 23 are integrally molded by a molding process. For example, when the array camera module is implemented as a dual-lens camera module, the array camera module includes one of the drivers 30 and one of the lens barrels 60.
Fig. 13A shows a fourth modified embodiment of the array camera module, in which the array camera module includes at least two lens barrels 60, each of the lens barrels 60 integrally extends to a top surface of the base seat 23, each of the optical lenses 10 is assembled to each of the lens barrels 60, and preferably, each of the lens barrels 60 and the molded base 23 are integrally molded by a molding process.
Fig. 13B shows a fifth modified embodiment of the array camera module, wherein the array camera module includes at least two lens barrels 60, wherein after the molded photosensitive assembly 20 is molded, each lens barrel 60 is assembled at a different position on the top surface of the molded base 23, and each optical lens 10 is assembled to each lens barrel 60, so that each optical lens 10 is held in the photosensitive path of each photosensitive element 10. It should be noted that the lens barrel 60 may be a threaded lens barrel or a non-threaded lens barrel, and the present invention is not limited in this respect.
In addition, two embodiments of the array camera module shown in fig. 13A and 13B, respectively, are merely exemplary descriptions, and in other examples, at least one lens barrel 60 may be integrally formed with the mold base 23 through a molding process, and additional lens barrels 60 may be assembled to the top surface of the mold base 23. For example, when the array camera module is implemented as a dual-lens camera module, one of the lens barrels 60 may be integrally formed with the mold base 23 through a molding process, and the other lens barrel 60 may be assembled to the top surface of the mold base 23 to facilitate focusing.
Fig. 14A shows a first variant embodiment of the molded photosensitive assembly 20 of the array camera module, in which the support body 251 encloses a portion of the edge region 223 of the circuit board 22 and at least a portion of the chip outer side 2133, the chip connecting portion 2132 and the chip inner side 2131 of the non-photosensitive region 213 of the photosensitive element 21, so that after the molding base 23 is formed, the molding body of the molding base 23 encloses a portion of the edge region 223 of the circuit board 22 and at least a portion of the outer side 2503 and the top surface 2501 of the support body 251.
It should be noted that the supporting body 251 can cover the entire portion of the leads 24 to achieve fixation of each of the leads 24 before the molding base 23 is formed, so that the supporting body 251 can prevent the leads 24 from contacting the molding material during the molding process, thereby avoiding deformation of the leads 24 due to impact force generated by the molding material introduced into the molding space 103. In addition, the supporting body 251 may have good heat-insulating properties so that heat is not transferred to the leads 24 through the supporting body 251 during the curing of the molding material after the molding material is introduced into the molding space 103, thereby further securing good electrical properties of the leads 24.
In addition, the supporting body 251 is simultaneously formed at a portion of the edge region 223 of the circuit board 22 and at least a portion of the non-photosensitive region 213 of the photosensitive element 21 to achieve fixation of the photosensitive element 21 and the circuit board 22, so that the supporting body 251 can prevent displacement of the photosensitive element 21 and the circuit board 22 during clamping of the molding die 100 during the molding process to ensure flatness of the photosensitive element 21.
In addition, the supporting body 251 is simultaneously formed at a portion of the edge region 223 of the circuit board 22 and at least a portion of the non-photosensitive region 213 of the photosensitive element 21 to prevent a gap from being generated between the photosensitive element 21 and the mounting position of the circuit board 22 by the supporting body 251, so that the supporting body 251 can prevent the molding material from entering between the photosensitive element 21 and the circuit board 22 during the molding process to ensure the flatness of the mounted photosensitive element 21, thereby further improving the imaging quality of the array camera module.
Fig. 14B shows a second variant embodiment of the molded photosensitive assembly 20 of the array camera module of the present invention, in which the support body 251 covers a portion of the edge region 223 of the circuit board 22 and at least a portion of the chip outer side 2133 and the chip connection 2132 of the non-photosensitive region 213 of the photosensitive element 21, so that after the molding base 23 is molded, the molding body 232 of the molding base 23 covers a portion of the edge region 223 of the circuit board 22 and at least a portion of the outer side 2503 and the top surface 2501 of the support body 251.
Similarly, fig. 14C shows a third modified embodiment of the molded photosensitive assembly 20 of the array camera module of the present invention, in which the support body 251 covers a portion of the edge region 223 of the wiring board 22 and at least a portion of the chip outside portion 2133 of the non-photosensitive region 213 of the photosensitive element 21, so that after the molding base 23 is molded, the molding body 232 of the molding base 23 covers a portion of the edge region 223 of the wiring board 22 and at least a portion of the outside surface 2503 and the top surface 2501 of the support body 251.
It will be appreciated by those skilled in the art that in both of the embodiments of the molded photosensitive assembly 20 shown in fig. 14B and 14C, the supporting body 251 may not cover the chip inner portion 2131 of the non-photosensitive region 213 of the photosensitive element 21, so that the size of the chip inner portion 2131 of the photosensitive element 21 may be made smaller, so that the photosensitive element 21 of the same size may have the larger photosensitive region 212, in such a way that the imaging quality of the array camera module can be improved while controlling the size of the array camera module.
In addition, the supporting body 251 may not cover the chip inner side 2131 of the photosensitive element 21, so that the glue flows only to the chip inner side 2131 of the photosensitive element 21 and not to the photosensitive region 212 of the photosensitive element 21 even in the case where the glue flows because the glue is far from the photosensitive region 212 of the photosensitive element 21 before the glue is applied to a portion of the non-photosensitive region 213 of the photosensitive element 21 and the glue is cured to form the supporting body 251, thereby preventing the photosensitive region 212 of the photosensitive element 21 from being contaminated. That is, the chip inside 2131 may reserve a safe distance between the support body 251 and the photosensitive area 212 of the photosensitive element 21.
Fig. 14D shows a fourth variant embodiment of the molded photosensitive component 20 of the array camera module of the present invention, in which the support body 251 covers a portion of the edge region 223 of the wiring board 22, so that after the molding base 23 is molded, the molding body 232 of the molding base 23 covers another portion of the edge region 223 of the wiring board 22 and at least a portion of the outer side 2503 and the top surface 2501 of the support body 251.
Fig. 14E shows a fifth variant embodiment of the molded photosensitive assembly 20 of the array camera module of the present invention, in which the number of the supporting members 25 may be one, and the supporting body 251 of the supporting member 25 covers a portion of the edge region 223 of the wiring board 22, so that the photosensitive region 212 of each of the photosensitive members 21 simultaneously corresponds to the through hole 252 of the supporting member 25, so that after the molding base 23 is molded, the molding body 232 of the molding base 23 covers another portion of the edge region 223 of the wiring board 22 and at least a portion of the outer side 2503 and the top surface 2501 of the supporting body 251.
In both embodiments of the molded photosensitive assembly 20 of the array camera module of the present invention shown in fig. 14D and 14E, the support body 251 may not cover any position of the non-photosensitive region 213 of the photosensitive element 21, thereby keeping the support body 251 away from the photosensitive region 212 of the photosensitive element 21, so as to avoid contamination of the photosensitive region 212 of the photosensitive element 21 by glue or other material used to form the support body 251 during molding of the support body 251. Preferably, in both embodiments of the molded photosensitive assembly 20 of the array camera module of the present invention shown in fig. 14D and 14E, the supporting body 251 may cover the connection positions of the leads 24 and the circuit board connectors 221 of the circuit board 22, so that the supporting body 251 can prevent the molding material from contacting the connection positions of the leads 24 and the circuit board connectors 221 of the circuit board 22 to prevent the leads 24 from being deformed and detached when the molding process is performed.
It will be appreciated by those skilled in the art that although various embodiments of the molded photosensitive assembly 20 of the array camera module are illustrated in fig. 14A to 14E, which illustrate features and advantages of the present invention by way of example only, the support body 251 may cover the wiring board outer side 2233, the wiring board connection 2232, and the wiring board inner side 2231 of the wiring board 22, and at least a portion of at least one of the chip outer side 2133, the chip connection 2132, and the chip inner side 2131 of the photosensitive element 21, as desired. For example, the supporting body 251 may cover a part of the wiring board connection portion 2232 of the wiring board 22, or may cover the entire wiring board connection portion 2232. Therefore, although the position where the supporting body 251 is provided with the coating will not be described in detail in the following description of the present invention, it will be understood by those skilled in the art that the scope of the array camera module of the present invention may include any position and any combination of positions where the supporting body 251 is provided with the coating of the edge region 223 of the circuit board 22 and the non-photosensitive region 213 of the photosensitive element 21.
In addition, fig. 15 shows another modified embodiment of the molded photosensitive component 20 of the array camera module of the present invention, in which the press-fit surface 1011 of the upper mold 101 is relieved from at least a portion of the top surface 2501 of the support body 251 so that the mold body 232 may further cover at least a portion of the top surface 2501 of the support body 251 after the mold base 23 is molded.
It should be noted that, according to one embodiment of the present invention, the array camera module includes at least two optical lenses 10 and one molded photosensitive element 20, where each optical lens 10 is disposed on a photosensitive path of each photosensitive element 21 of the molded photosensitive element 20, as described in the foregoing description of the present invention. In yet another embodiment, referring to fig. 16, the array camera module may also include at least two optical lenses 10, one molded photosensitive component 20 and at least one additional photosensitive component 21A, wherein each additional photosensitive component 21A is assembled on the circuit board 22 of the molded photosensitive component 20, and each optical lens 10 is disposed on a photosensitive path of each photosensitive component 21 and each additional photosensitive component 21A of the molded photosensitive component 20, respectively, so as to form the array camera module. In addition, the array camera module further includes at least one additional bracket 27 and at least one additional driver 30A or at least one additional lens barrel 60A, wherein each of the additional brackets 27 is assembled to the circuit board 22 of the molded photosensitive assembly 20, each of the additional drivers 30A or each of the additional lens barrels 60A is assembled to the circuit board 22, each of the optical lenses 10 is assembled to the driver 30 or the lens barrel 60 or the additional driver 30A or the additional lens barrel 60A, respectively, such that each of the optical lenses 10 is held in a photosensitive path of each of the photosensitive elements 21 and each of the additional photosensitive elements 21A of the molded photosensitive assembly 20, respectively. In addition, the additional photosensitive elements 21A may not be mounted on the circuit board 22 of the molded photosensitive assembly 20, but an additional circuit board 22A may be provided by the array camera module for being mounted on each of the additional photosensitive elements 21A.
Fig. 17 shows another modified embodiment of the array camera module, in which the filter element 40 is not directly assembled to the molding body 232 of the molding base 23, but at least one support 70 is further provided by the array camera module, each filter element 40 may be assembled to each support 70, and then each support 70 is assembled to the top surface of the molding body 232, so that each filter element 40 is held between each optical lens 10 and each photosensitive element 21, in such a way that the size of the filter element 40 can be reduced to reduce the manufacturing cost of the array camera module.
It should be noted that in one embodiment, the number of the supporting members 70 is identical to the number of the filtering elements 40, that is, the supporting members 70 and the filtering elements 40 are matched one by one. For example, when the number of the filter elements 40 is one, the number of the holders 70 is also one. In another embodiment, the number of holders 70, the number of filter elements 40 and the number of optical lenses 10 are identical, for example, in the example shown in fig. 7, the number of holders 70, the number of filter elements 40 and the number of optical lenses 10 are two.
In another embodiment, the number of the supporting members 70 may not be identical to the number of the optical filtering elements 40, for example, the number of the supporting members 70 may be only one, and the number of the optical filtering elements 40 may be more than one, wherein each optical filtering element 40 may be assembled at a different position of the supporting member 70.
With further reference to fig. 17, the top surface of the molding body 232 of the molding base 23 is a flat surface, so that the holder 70 is assembled to the top surface of the molding body 232 after the molding base 23 is molded, and then the driver 30 or the lens barrel 60 is assembled to the holder 70. That is, the driver 30 or the lens barrel 60 may not be directly assembled to the top surface of the molding body 232, but may be assembled to the supporter 70.
Fig. 18 shows another modified embodiment of the array camera module, in which at least one recess 235 is formed on the top surface of the molding body 232, and the holder 70 assembled to the top surface of the molding base 232 is received in the recess 235 to further reduce the height dimension of the array camera module, in which case the driver 30 or the lens barrel 60 may be directly assembled to the top surface of the molding body 232.
However, it will be appreciated by those skilled in the art that in other examples of the array camera module of the present invention, the optical lens 10 may be directly assembled to the top surface of the molding body 232 or directly assembled to the top surface of the supporter 70.
In accordance with another aspect of the present invention, referring to fig. 19, the present invention further provides an electronic device with an array camera module, wherein the electronic device with an array camera module includes an electronic device body 200 and at least one array camera module, wherein each of the array camera modules is respectively disposed on the electronic device body 200 for obtaining a graphic. In accordance with another aspect of the present invention, the present invention further provides a method of manufacturing a molded photosensitive assembly 20, wherein the method of manufacturing comprises the steps of:
(a) At least two photosensitive elements 21 and at least one circuit board 22 are connected by a set of leads 24;
(b) Placing each of the photosensitive elements 21 and each of the wiring boards 22 in an upper mold 101 or a lower mold 102 of a molding mold 100;
(c) During the closing of the upper die 101 and the lower die 102, the upper die 101 is supported upward by at least one supporting member 25 to prevent the pressing surface 1011 of the upper die 101 from pressing against each set of the leads 24; and
(d) A fluid molding material is added to a molding space 103 formed between the upper mold 101 and the lower mold 102 to form a molding base 23 after the molding material is cured, wherein the molding base 23 includes a molding body 232 and has at least two light windows 231, wherein the molding body 232 covers a portion of an edge region 223 of each of the circuit boards 22 and at least a portion of the supporting member 25, and a photosensitive region 212 of each of the photosensitive members 21 corresponds to each of the light windows 231, respectively.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting.
The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims (41)

1. A molded photosensitive assembly, comprising:
at least one support element formed from a first medium;
at least one circuit board, wherein each circuit board is provided with at least one chip mounting area respectively;
at least two photosensitive elements, wherein each photosensitive element is respectively attached to each chip attaching area of each circuit board;
At least two groups of leads, wherein two ends of each group of leads are respectively connected to a chip connecting piece of each photosensitive element and a circuit board connecting piece of each circuit board; and
a molding base formed of a second medium, wherein the molding base includes a molding body and has at least two optical windows, wherein the supporting member protects the leads, the wiring boards and the photosensitive members when the molding body is molded, the molding body is integrally combined with at least a portion of each of the wiring boards after the molding body is molded, and a photosensitive area of each of the photosensitive members corresponds to each of the optical windows of the molding base, respectively, wherein the supporting member includes a frame-shaped supporting body having a height higher than a height at which the leads protrude upward, so that pressing of the upper mold against the leads is prevented by a top surface of the supporting body supporting an upper mold of a molding die upward when the molding base is prepared by a molding process; wherein the supporting body has elasticity with an elastic modulus of 0.1Gpa to 1Gpa so that the pressing surface of the upper mold can be closely attached to the top surface of the supporting body, thereby exposing the photosensitive area of the photosensitive element corresponding to the through hole of the supporting element to a sealed environment.
2. The molded photosensitive assembly of claim 1, wherein said molded photosensitive assembly comprises two of said support elements, one of said circuit boards, two of said photosensitive elements, and two sets of said leads, and said circuit board has two of said die attach areas.
3. The molded photosensitive assembly of claim 1, wherein said molded photosensitive assembly comprises two of said support members, two of said circuit boards, two of said photosensitive members, and two sets of said leads, and each of said circuit boards has one of said die attach areas, respectively.
4. The molded photosensitive assembly of claim 1, further comprising at least one electronic component, wherein said circuit board has an edge region, said edge region and said die attach region being integrally formed, each of said electronic components being attached to said edge region, respectively, wherein said support member is positioned between said electronic component and said photosensitive region of said photosensitive member.
5. The molded photosensitive assembly of claim 4, wherein said support member has a through hole, said support body is disposed outside of said photosensitive region of said photosensitive member, said photosensitive region of said photosensitive member corresponds to said through hole, wherein said molded body encases a portion of said support body.
6. The molded photosensitive assembly of claim 5, wherein said support body has a top surface, an inner side and an outer side, said top surface extending inwardly and outwardly to connect to said inner side and said outer side, respectively, said inner side forming said through-hole, wherein said molded body covers at least said outer side of said support body.
7. The molded photosensitive assembly of claim 5, wherein said support body has a top surface, an inner side surface and an outer side surface, said top surface extending inwardly and outwardly to connect to said inner side surface and said outer side surface, respectively, said inner side surface forming said through-hole, wherein said molded body encases at least a portion of said outer side surface and said top surface of said support body.
8. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach member being disposed on the die-attach portion, the die-in portion and the die-out portion being located on respective sides of the die-attach portion, wherein the support body encases at least a portion of the die-in portion of the photosensitive element.
9. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach member being disposed on the die-attach portion, the die-in portion and the die-out portion being located on respective sides of the die-attach portion, wherein the support body encases at least a portion of the die-attach portion of the photosensitive element.
10. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach member being disposed on the die-attach portion, the die-in portion and the die-out portion being located on respective sides of the die-attach portion, wherein the support body encases at least a portion of the die-out portion of the photosensitive element.
11. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach member being disposed on the die-attach portion, the die-in portion and the die-out portion being located on opposite sides of the die-attach portion, respectively, wherein the support body encases at least a portion of the die-in portion and at least a portion of the die-attach portion of the photosensitive element.
12. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach member being disposed on the die-attach portion, the die-in portion and the die-out portion being located on opposite sides of the die-attach portion, respectively, wherein the support body encases at least a portion of the die-attach portion and at least a portion of the die-out portion of the photosensitive element.
13. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach member being disposed on the die-attach portion, the die-in portion and the die-out portion being located on opposite sides of the die-attach portion, respectively, wherein the support body encases at least a portion of the die-in portion, the die-attach portion, and at least a portion of the die-out portion of the photosensitive element.
14. The molded photosensitive assembly of claim 7, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connection portion, and a circuit board exterior portion, said circuit board connection member being disposed on said circuit board connection portion, said circuit board interior portion and said circuit board exterior portion being located on either side of said circuit board connection portion, respectively, wherein said support body encases at least a portion of said circuit board interior portion of said circuit board.
15. The molded photosensitive assembly of claim 7, wherein said edge region of said circuit board comprises a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, said circuit board connector being disposed on said circuit board connecting portion, said circuit board inner portion and said circuit board outer portion being located on either side of said circuit board connecting portion, respectively, wherein said support body encases at least a portion of said circuit board connecting portion of said circuit board.
16. The molded photosensitive assembly of claim 7, wherein said edge region of said circuit board comprises a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, said circuit board connecting member being disposed at said circuit board connecting portion, said circuit board inner portion and said circuit board outer portion being located on either side of said circuit board connecting portion, respectively, wherein said support body encases a portion of said circuit board outer portion of said circuit board.
17. The molded photosensitive assembly of claim 7, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connection portion, and a circuit board exterior portion, said circuit board connection member being disposed on said circuit board connection portion, said circuit board interior portion and said circuit board exterior portion being located on either side of said circuit board connection portion, respectively, wherein said support body encases at least a portion of said circuit board interior portion and at least a portion of said circuit board connection portion of said circuit board.
18. The molded photosensitive assembly of claim 7, wherein said edge region of said circuit board comprises a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, said circuit board connector being disposed on said circuit board connecting portion, said circuit board inner portion and said circuit board outer portion being located on either side of said circuit board connecting portion, respectively, wherein said support body encases at least a portion of said circuit board connecting portion and a portion of said circuit board outer portion of said circuit board.
19. The molded photosensitive assembly of claim 7, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, said circuit board connector being disposed on said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being located on either side of said circuit board connector portion, respectively, wherein said support body encases at least a portion of said circuit board interior portion, said circuit board connector portion, and a portion of said circuit board exterior portion of said circuit board.
20. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach member being disposed on the die-attach portion, the die-in portion and the die-out portion being disposed on either side of the die-attach portion, respectively, wherein the edge region of the circuit board comprises a circuit-board-in portion, a circuit-board-attach portion, and a circuit-board-out portion, the circuit-board-attach member being disposed on the circuit-board-attach portion, the circuit-board-in portion and the circuit-board-out portion being disposed on either side of the circuit-board-attach portion, respectively, wherein the support body encases at least a portion of the circuit-board-in portion of the circuit board and at least a portion of the die-out portion of the photosensitive element.
21. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach portion being disposed on the die-attach portion, the die-in portion and the die-out portion being disposed on opposite sides of the die-attach portion, respectively, wherein the edge region of the circuit board comprises a circuit-board-in portion, a circuit-board-attach portion, and a circuit-board-out portion, the circuit-board-attach portion being disposed on the circuit-board-attach portion, the circuit-board-in portion and the circuit-board-out portion being disposed on opposite sides of the circuit-board-attach portion, respectively, wherein the support body encases at least a portion of the circuit-board-in portion and the circuit-board-attach portion of the photosensitive element and at least a portion of the die-out portion of the photosensitive element.
22. The molded photosensitive assembly of claim 7, wherein the non-photosensitive region of the photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, the die-attach portion being disposed on the die-attach portion, the die-in portion and the die-out portion being disposed on either side of the die-attach portion, respectively, wherein the edge region of the circuit board comprises a circuit-board-in portion, a circuit-board-attach portion, and a circuit-board-out portion, the circuit-board-attach portion being disposed on the circuit-board-attach portion, the circuit-board-in portion and the circuit-board-out portion being disposed on either side of the circuit-board-attach portion, respectively, wherein the support body encases the circuit-board-in portion, a portion of the circuit-board-attach portion, and at least a portion of the die-out portion of the photosensitive element.
23. The molded photosensitive assembly of claim 20, wherein said support body further encapsulates at least a portion of said die attach portion of said photosensitive element.
24. The molded photosensitive assembly of claim 21, wherein said support body further encapsulates at least a portion of said die attach portion of said photosensitive element.
25. The molded photosensitive assembly of claim 22, wherein said support body further encapsulates at least a portion of said die attach portion of said photosensitive element.
26. The molded photosensitive assembly of claim 23, wherein said support body further encapsulates at least a portion of said chip interior portion of said photosensitive element.
27. The molded photosensitive assembly of claim 24, wherein said support body further encapsulates at least a portion of said chip interior portion of said photosensitive element.
28. The molded photosensitive assembly of claim 25, wherein said support body further encapsulates at least a portion of said chip interior portion of said photosensitive element.
29. An array camera module, characterized by comprising:
at least two optical lenses; and
A molded photosensitive assembly, wherein the molded photosensitive assembly further comprises:
at least one support element formed from a first medium;
at least one circuit board, wherein each circuit board is provided with at least one chip mounting area respectively;
at least two photosensitive elements, wherein each photosensitive element is respectively attached to each chip attaching area of each circuit board;
at least two groups of leads, wherein two ends of each group of leads are respectively connected to a chip connecting piece of each photosensitive element and a circuit board connecting piece of each circuit board; and
a molded base formed of a second medium, wherein the molded base comprises a molded body and has at least two optical windows, wherein the supporting member protects the leads, the wiring boards and the photosensitive members when the molded body is molded, the molded body is integrally bonded with at least a portion of each of the wiring boards after the molded body is molded, and a photosensitive area of each of the photosensitive members corresponds to each of the optical windows of the molded base, each of the optical lenses is disposed in a photosensitive path of each of the photosensitive members to provide a light path for the optical lenses and the photosensitive members through the optical windows, wherein the supporting member comprises a frame-shaped supporting body having a height higher than a height of the upward protrusions of the leads, so that pressing of the bonding face of the upper die against the leads is prevented by upwardly supporting the upper die of the molding die by a top surface of the supporting body when the molded base is prepared by a molding process; wherein the supporting body has elasticity with an elastic modulus of 0.1Gpa to 1Gpa so that the pressing surface of the upper mold can be closely attached to the top surface of the supporting body, thereby exposing the photosensitive area of the photosensitive element corresponding to the through hole of the supporting element to a sealed environment.
30. The array camera module of claim 29, further comprising at least two drivers, wherein each of the optical lenses is assembled to each of the drivers, and each of the drivers is assembled to a top surface of the molded body.
31. The array camera module of claim 29, further comprising at least one driver and at least one barrel, each of the optical lenses being assembled to each of the drivers and each of the barrels, respectively, wherein each of the drivers and each of the barrels are located at different locations on the top surface of the molded body, respectively.
32. The array camera module of claim 29, further comprising at least two lens barrels, wherein each of the lens barrels is integrally formed at a top surface of the molded body, and each of the optical lenses is assembled to each of the lens barrels, respectively; or further comprises at least two lens barrels, wherein at least one lens barrel is integrally formed on the top surface of the molding main body, the other lens barrel is attached on the top surface of the molding main body, and each optical lens is respectively assembled on each lens barrel; or the array camera module comprises two lens barrels attached to the top surface of the molding main body, and each optical lens is assembled to each lens barrel respectively.
33. The array camera module of claim 30, further comprising at least one filter element, wherein each filter element is assembled to a top surface of the molded body such that each filter element is held between each optical lens and each photosensitive element.
34. The array camera module of claim 33, wherein the top surface of the molded body has at least two inner side surfaces and an outer side surface, wherein each of the filter elements is assembled to each of the inner side surfaces of the molded body, and each of the drivers is assembled to a different location of the outer side surface of the molded body.
35. The array camera module of claim 34, wherein the plane of the inner surface of the molded body is lower than the plane of the outer surface to form at least one recess of the molded body, wherein each of the filter elements is located in each of the recesses.
36. The array camera module of any of claims 29 to 35, wherein the support element has a through hole, the support body is disposed outside the photosensitive region of the photosensitive element, the photosensitive region of the photosensitive element corresponds to the through hole, and wherein the molded body encases a portion of the support body.
37. The array camera module of claim 36, wherein the support body encloses a portion of an edge region of the circuit board.
38. The array camera module of claim 36, wherein the support body encloses at least a portion of a non-photosensitive region of the photosensitive element.
39. The array camera module of claim 36, wherein the support body encloses both a portion of an edge region of the circuit board and at least a portion of a non-photosensitive region of the photosensitive element.
40. The array camera module of claim 29, further comprising at least one support and at least one filter element, wherein each filter element is assembled to each support, each support is assembled to a top surface of the molded body, respectively, such that each filter element is held between each optical lens and each photosensitive element.
41. An electronic device, comprising:
an electronic device body; and
an array camera module according to any one of claims 29 to 40, wherein the array camera module is disposed on the electronic device body for capturing images.
CN201610669214.7A 2016-03-12 2016-08-12 Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module Active CN107734216B (en)

Priority Applications (38)

Application Number Priority Date Filing Date Title
CN201610669214.7A CN107734216B (en) 2016-08-12 2016-08-12 Array camera module, molding photosensitive assembly and manufacturing method thereof and electronic equipment with array camera module
EP23176877.1A EP4231653A3 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020187031125A KR102152516B1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device
JP2018550699A JP7025345B2 (en) 2016-03-28 2016-10-25 Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices
PCT/CN2016/103247 WO2017166798A1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
EP16896568.9A EP3468165B1 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
US16/088,435 US11289521B2 (en) 2016-03-28 2016-10-25 Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device
US15/317,117 US10908324B2 (en) 2016-03-12 2016-10-28 Molded photosensitive assembly of array imaging module
JP2018547880A JP2019519087A (en) 2016-03-12 2016-10-28 Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices
EP16894174.8A EP3429181A4 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020187029337A KR102193819B1 (en) 2016-03-12 2016-10-28 Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device
PCT/CN2016/103736 WO2017157015A1 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020207036129A KR102335306B1 (en) 2016-03-12 2016-10-28 Array Imaging Module and Molded Photensitive Assembly and Manufacturing Method Thereof for Electronic Device
TW106203473U TWM565451U (en) 2016-03-12 2017-03-13 Array camera module and its molded photosensitive element and electronic device
TW106108124A TWI703715B (en) 2016-03-12 2017-03-13 Array camera module, molded photosensitive element and manufacturing method thereof, and electronic equipment
TW108117228A TWI706212B (en) 2016-03-28 2017-03-25 Camera module and manufacturing method of moulded photosensitive component
TW106110048A TWI661258B (en) 2016-03-28 2017-03-25 Camera module and its molded photosensitive component
TW108117229A TWI706213B (en) 2016-03-28 2017-03-25 Camera module and its molded photosensitive component
TW106204228U TWM555960U (en) 2016-03-28 2017-03-26 Photographing module and its molded photosensitive component and electronic equipment
US15/473,573 US9781325B1 (en) 2016-03-12 2017-03-29 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,605 US10033913B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,609 US9906700B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,607 US9826132B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
KR1020207019834A KR102281383B1 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
JP2018556877A JP6865232B2 (en) 2016-04-28 2017-04-26 Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices.
EP17788772.6A EP3481046A4 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
PCT/CN2017/082000 WO2017186120A2 (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
KR1020217022035A KR20210091363A (en) 2016-04-28 2017-04-26 Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device
KR1020187034256A KR102147896B1 (en) 2016-04-28 2017-04-26 Photographic module and molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly and manufacturing method and electronic device
US15/679,146 US10274694B2 (en) 2016-03-12 2017-08-16 Manufacturing method of a molded photosensitive assembly of an array imaging module
US15/705,225 US10175447B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/705,232 US10126519B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/784,167 US10578837B2 (en) 2016-03-12 2017-10-15 Molded photosensitive assembly for array imaging module for electronic device
US16/737,863 US20200218034A1 (en) 2016-03-12 2020-01-08 Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
US17/114,466 US11822099B2 (en) 2016-03-12 2020-12-07 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
JP2021060338A JP7344924B2 (en) 2016-04-28 2021-03-31 Imaging module manufacturing method
US17/678,347 US11824071B2 (en) 2016-03-28 2022-02-23 Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device
US17/740,887 US20220268968A1 (en) 2016-03-12 2022-05-10 Molded photosensitive assembly for array imaging module for electronic device and manufacturing method thereof

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110364540A (en) * 2018-04-09 2019-10-22 宁波舜宇光电信息有限公司 Photosensory assembly, camera module and preparation method thereof
CN110634960B (en) * 2018-06-21 2024-02-02 宁波舜宇光电信息有限公司 Photosensitive assembly, camera module, corresponding terminal equipment and manufacturing method
CN110636186A (en) * 2018-06-22 2019-12-31 宁波舜宇光电信息有限公司 Molded photosensitive assembly, camera module, manufacturing method of camera module and electronic equipment
US11356582B2 (en) 2018-07-11 2022-06-07 Samsung Electro-Mechanics Co., Ltd. Camera module with gap maintaining member

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200635053A (en) * 2005-03-22 2006-10-01 Taiwan Ic Packaging Corp Package structure (I) of image sensing device
CN103700635A (en) * 2013-12-25 2014-04-02 北京必创科技有限公司 Chip packaging structure with cavity and packaging method thereof
CN103779286A (en) * 2014-01-26 2014-05-07 清华大学 Encapsulation structure, encapsulation method and template used in encapsulation method
CN105681637A (en) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 Array camera module and photosensitive assembly thereof and manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200635053A (en) * 2005-03-22 2006-10-01 Taiwan Ic Packaging Corp Package structure (I) of image sensing device
CN103700635A (en) * 2013-12-25 2014-04-02 北京必创科技有限公司 Chip packaging structure with cavity and packaging method thereof
CN103779286A (en) * 2014-01-26 2014-05-07 清华大学 Encapsulation structure, encapsulation method and template used in encapsulation method
CN105681637A (en) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 Array camera module and photosensitive assembly thereof and manufacturing method

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