CN110364540A - Photosensory assembly, camera module and preparation method thereof - Google Patents
Photosensory assembly, camera module and preparation method thereof Download PDFInfo
- Publication number
- CN110364540A CN110364540A CN201810311064.1A CN201810311064A CN110364540A CN 110364540 A CN110364540 A CN 110364540A CN 201810311064 A CN201810311064 A CN 201810311064A CN 110364540 A CN110364540 A CN 110364540A
- Authority
- CN
- China
- Prior art keywords
- sensitive chip
- annular support
- colour filter
- photosensory assembly
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title description 2
- 238000000465 moulding Methods 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000002313 adhesive film Substances 0.000 claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000007650 screen-printing Methods 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 30
- 230000003287 optical effect Effects 0.000 claims description 20
- 238000005516 engineering process Methods 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 238000013459 approach Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 238000007731 hot pressing Methods 0.000 claims description 7
- 230000009467 reduction Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 12
- 241000218202 Coptis Species 0.000 description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000010009 beating Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Chemical class 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000004693 imidazolium salts Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Chemical class 0.000 description 1
- 229920001021 polysulfide Chemical class 0.000 description 1
- 239000005077 polysulfide Chemical class 0.000 description 1
- 150000008117 polysulfides Chemical class 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14692—Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The present invention provides a kind of photosensory assemblies, comprising: sensitive chip, with photosensitive region and around the non-photo-sensing region of the photosensitive region；Colour filter is located above the sensitive chip；And annular support, it is formed by chip adhesive film moulding material and between the sensitive chip and the colour filter；The following table face contact of the annular support and be bonded in the sensitive chip upper surface the position corresponding to the non-photo-sensing region, and the upper surface of the annular support contacts and is bonded in the lower surface of the colour filter.The present invention also provides the production methods of corresponding camera module and photosensory assembly and camera module.The present invention can effectively reduce the height dimension of mould group, to meet comprehensive screenization, the lightening demand of mobile phone and other electronic equipments.The present invention also provides reliable techniques so that colour filter is attached directly to chip surface.The present invention can promote product yield.
Description
Technical field
The present invention relates to optical technical fields, specifically, the present invention relates to photosensory assembly and camera modules and photosensitive
The production method of component and camera module.
Background technique
With the rapid development of smart phone and other electronic equipments, since mobile phone screen is increasingly intended to shield comprehensively
Change, is lightening therefore more more and more intense to the miniature requirement of camera module.
Fig. 1 shows a kind of typical conventional camera module in the prior art, it is generally the case that camera module includes a mirror
1, one camera lens 2 of seat, a wiring board 3 and a sensitive chip 4, camera lens 2 are installed on microscope base 1, and microscope base 1 is installed on wiring board 3, photosensitive core
Piece 4 is installed on wiring board 3, that is to say, that camera lens 1 and wiring board 3 are assembled by microscope base 1.Further, in camera lens 2 and sense
Between optical chip 4 there is a colour filter 5 to carry out filtering infrared light, so that sensitive chip 4 collects the preferable image letter of quality
Breath.
In the prior art, usual colour filter 5 is installed in microscope base 2, and colour filter 5 is located at the lower position of camera lens 1, because
, for the ease of installing colour filter 5, microscope base 1 needs to provide an inner convex platform 6 to support the edge of colour filter 5, so that colour filter for this
Piece 5 is supported in microscope base 1, and between camera lens 1 and sensitive chip 4.
It can see from conventional this modular structure, firstly, colour filter 1 is installed on the inner convex platform 6 of microscope base, inner convex platform
With certain thickness, between camera lens and sensitive chip, and sensitive chip usually passes through the gold thread of arc and is connected to line
Furthermore road plate needs to install capacitance resistance around chip, therefore since it is desired that avoiding above-mentioned electricity between colour filter and sensitive chip
The evacuation height that subcomponent (gold thread/capacitance resistance etc.) needs to keep certain again hurts above-mentioned electronic component to prevent stopping loss, this makes
Camera module increases perpendicular to the size on optical axis direction；Secondly as colour filter installation plane it is higher, camera lens it is last
The image planes of a piece of eyeglass generally require certain safe distance；Third, colour filter are thin type sheets, and to be installed on inner convex platform needs
Higher technological level is wanted, the thickness of the colour filter generallyd use at present is 0.3mm or 0.2mm, and the smaller colour filter of thickness
The difficulty of its assembling of piece is bigger, and yields is low, these factors make coke BFL (back focal after the machinery of camera module
Length) often design reserve it is larger, without being easily reduced；It is burnt after machinery to increase the height increasing that frequently can lead to camera module
Greatly.
As seen from the above analysis, the colour filter of existing typical camera module and its Installation Modes are due to various factors
Cause the height of camera module larger, this biggish height is not able to satisfy completely for application product becoming to lightening development
Important and influential persons is asked.For example, one of limitation lesser principal element of mobile phone integral thickness is exactly to image in the application of mobile phone camera module
The height that mould group itself needs.
If colour filter is directly installed on sensitive chip, the above problem can be efficiently solved, thus preferably full
Sufficient application product is required to the trend of lightening development, while additionally aiding reduction sensitive chip warpage.However, at present not
Colour filter is directly installed on to the mature technology for being suitable for scale of mass production of sensitive chip.The introducing of new production technology, can
The problems such as energy can face reliability deficiency, and process is tedious, and optical imagery quality is not up to standard equal, these problems all may cause product
It is bad, scrapping for the high value component such as sensitive chip is caused, and then the economic value of the production technology is caused to decline, even
The problems such as volume production can not be put into.
Summary of the invention
The present invention is intended to provide a kind of solution at least one defect that can overcome the prior art.
According to an aspect of the invention, there is provided a kind of photosensory assembly, comprising: sensitive chip, with photosensitive region
With the non-photo-sensing region for surrounding the photosensitive region；Colour filter is located above the sensitive chip；And annular support,
It is formed by chip adhesive film moulding material and between the sensitive chip and the colour filter；The annular support
Following table face contact and be bonded in the sensitive chip upper surface the position corresponding to the non-photo-sensing region, and it is described
The upper surface of annular support contacts and is bonded in the lower surface of the colour filter.
In one embodiment, the contact area of the supporter and the sensitive chip is less than the supporter and institute
State the contact area of colour filter.
In one embodiment, on the section by the axis of the sensitive chip, the supporter forms ladder
The shape of shape.
In one embodiment, the sensitive chip further include positioned at the non-photo-sensing region, around or partially around
Weld pad on the outside of the sensitive chip；Also, in the non-photo-sensing region for being provided with the weld pad, the annular support and institute
The contact surface of sensitive chip is stated between the weld pad and the photosensitive region.
In one embodiment, the photosensory assembly further includes wiring board, and the following table face contact of the sensitive chip is simultaneously
It is fixed on the wiring board.
In one embodiment, the weld pad passes through metal wire and the circuit board electrical connection.
In one embodiment, the photosensory assembly further include: molded section is formed in the line by moulding technology
Road plate surface, around the sensitive chip and to the sensitive chip extend and contact the sensitive chip.
In one embodiment, the photosensory assembly further includes the electronic component for being formed in PCB surface, the mould
Modeling portion covers the metal wire and the electronic component.
In one embodiment, the molded section covers at least part fringe region of the colour filter and contacts
The lateral surface of the annular support.
In one embodiment, the molded section has the smooth molded section top surface formed by mold pressing,
And the molded section top surface is higher than the upper surface of the colour filter.
According to another aspect of the present invention, a kind of camera module is additionally provided comprising described in aforementioned any embodiment
Photosensory assembly.
According to another aspect of the present invention, a kind of camera module is additionally provided comprising described in aforementioned any embodiment
Photosensory assembly, and the bottom surface of the lens assembly bears against the molded section top surface.
According to another aspect of the present invention, a kind of photosensory assembly production method is additionally provided, comprising:
By silk-screen printing technique, annular support is formed on the surface of colour filter by chip adhesive film moulding material,
Described in the photosensitive region of annular support area encompassed and sensitive chip match；By the colour filter with it is described photosensitive
Chip contraposition makes the surface of the annular support correspond to the non-photo-sensing region of the sensitive chip, wherein the non-photo-sensing
Region is centered around around the photosensitive region；It approaches the surface of the annular support and contacts the table of the sensitive chip
Face；And bond the annular support and the sensitive chip.
In one embodiment, the step of formation annular support includes: that plates for screen printing is covered colour filter
Surface, there is on the plates for screen printing pierced pattern corresponding to the annular brace shape；In plates for screen printing and filter
It is coated with chip adhesive film moulding material paste on color chips and it is made to fill the pierced pattern；By the plates for screen printing from institute
State colour filter and annular support separation；And precuring is carried out to the chip adhesive film moulding material, make its molding
For solid annular support.
In one embodiment, in the formation annular support the step of, the plates for screen printing includes pattern
Layer and silk screen superficial layer；And by plates for screen printing covering colour filter surface sub-step in, the pattern layer with it is described
Colour filter contact, the silk screen surface level are located at the pattern layer in the side back to the colour filter, the pierced pattern.
In one embodiment, the coating sub-step include: be coated on plates for screen printing and colour filter it is paste
Chip adhesive film moulding material；And it is struck off with scraper in the silk screen superficial layer.
In one embodiment, in the formation annular support the step of, the pierced pattern is perpendicular to institute
State trapezoidal on the sectional view of plates for screen printing, and the opening face positioned at silk screen superficial layer side of the pierced pattern
Product is less than the opening area backwards to the other side of the silk screen superficial layer.
In one embodiment, the precuring includes: to add to the chip adhesive film moulding material paste
Heat or exposure, increasing its hardness becomes the dam body with rigidity, and its viscosity reduction is made to reach threshold value.
In one embodiment, described the step of bonding the annular support with the sensitive chip includes: logical
High temperature hot pressing processing is crossed, the chip adhesive film moulding material for being located at the contact surface of the annular support and the sensitive chip is made
Melt and restores viscosity；And form the chip adhesive film for being located at the contact surface of the annular support and the sensitive chip
Material is permanent cured, so that the annular support and the sensitive chip be made to bond.
In one embodiment, the permanent cured step includes: to the sensitive chip, the annular support
It is toasted with the assembly of the colour filter, makes the chip for being located at the contact surface of the annular support and the sensitive chip
Adhesive film moulding material is permanent cured.
In one embodiment, the photosensory assembly production method further include: make the annular support with it is described
After the step of sensitive chip bonds, the assembly of the sensitive chip, the annular support and the colour filter is installed on
Wiring board, wherein sensitive chip is installed on the surface of the wiring board.
In one embodiment, the photosensory assembly production method further include: weld pad and institute in the sensitive chip
It states and connects metal wire between wiring board, electronic component is installed in the PCB surface.
In one embodiment, the photosensory assembly production method further include: by moulding technology in the wiring board
Surface forms around the sensitive chip and extends and contact the molded section of the sensitive chip, the mould to the sensitive chip
Modeling portion covers the metal wire and the electronic component, covers at least part fringe region of the colour filter and contact institute
State the lateral surface of annular support.
In one embodiment, described the step of molded section is formed by moulding technology further include: pressed by mold
Smooth molded section top surface is formed, and the molded section top surface is higher than the upper surface of the colour filter.
In one embodiment, the step of formation annular support includes: that annular branch is formed on color filter substrate
Support body array；And the cutting color filter substrate, obtain the group of the colour filter and annular support corresponding to single sensitive chip
It is fit.
In one embodiment, the photosensory assembly production method further include: arranged on substrate multiple described photosensitive
Chip forms sensitive chip array；By multiple annular supports being formed on the colour filter and the sensitive chip battle array
Column are aligned, and the surface of each annular support is made to correspond respectively to the non-photo-sensing area of the sensitive chip
Domain；It approaches the surface of the annular support and contacts the surface of the corresponding sensitive chip；Make each ring
Shape supporter is bonded with the corresponding sensitive chip；And the removal substrate.
In one embodiment, in the step of formation annular support, first by the plates for screen printing from described
Colour filter and annular support separation, then carry out precuring to the chip adhesive film moulding material again, make its molding
For solid annular support.
In one embodiment, in the step of formation annular support, the plates for screen printing has isolation film,
Its surface contacted with the die bonding film moulding material for being formed in the plates for screen printing；Also, first to the chip
Adhesive film moulding material carry out precuring, make it be shaped to solid annular support, then again by the plates for screen printing from
The colour filter and annular support separation.
According to another aspect of the invention, a kind of camera module production method is additionally provided comprising: it utilizes aforementioned any
Photosensory assembly production method described in one embodiment makes photosensory assembly；And by lens assembly and the photosensory assembly group
It is fitted together, obtains camera module.
Compared with prior art, the present invention has at least one following technical effect:
1, the present invention can effectively reduce the height dimension (along the size of optical axis direction) of mould group, with meet mobile phone and
Comprehensive screenization, the lightening demand of other electronic equipments.
2, the present invention can effectively reduce the length and width dimensions (perpendicular to the size of optical axis direction) of mould group, to meet mobile phone
And comprehensive screenization, the lightening demand of other electronic equipments.
3, the present invention provides the feasible production technologies that colour filter is installed on to sensitive chip.
4, the present invention can effectively ensure the reliability of colour filter installation, help to promote yield.
5, the present invention can be effectively protected chip surface, help to promote product yield.
6, the present invention can provide the technical solution that a kind of colour filter is attached directly to chip surface by supporter, be not necessarily to
Other adhesion means.
Detailed description of the invention
Exemplary embodiment is shown in reference attached drawing.Embodiment and attached drawing disclosed herein should be considered illustrative
, and not restrictive.
Fig. 1 shows a kind of typical conventional camera module in the prior art；
Fig. 2 shows the diagrammatic cross-sections of the photosensory assembly 1000 of one embodiment of the invention；
Fig. 3 shows the diagrammatic cross-section of the photosensory assembly 1000 of another embodiment of the present invention；
Fig. 4 shows the diagrammatic cross-section of the camera module 2000 of one embodiment of the invention；
Fig. 5 shows the diagrammatic cross-section of the camera module 2000 of another embodiment of the present invention；
Fig. 6 a shows the diagrammatic cross-section of the plates for screen printing 8000 in one embodiment of the invention；
Fig. 6 b shows the top view of pattern layer 801 shown in Fig. 6 a；
Fig. 7 a shows the schematic diagram that plates for screen printing 8000 is covered to the surface of color filter substrate 1020；
Fig. 7 b, which is shown, is coated with chip adhesive film paste on 1020 colour filter of plates for screen printing 8000 and color filter substrate
The schematic diagram of moulding material 1030；
Fig. 7 c, which is shown, divides the plates for screen printing 8000 from the color filter substrate 1020 and the annular support 102
From schematic diagram；
Fig. 7 d is shown to be formed by chip adhesive film moulding material on the surface of colour filter 101 by silk-screen printing technique
The schematic diagram of annular support 102；
Fig. 8 shows the schematic diagram cut to step 140 assembly obtained；
Fig. 9 a shows the surface for making the annular support 102 in one embodiment of the invention and approaches and contact described
The schematic diagram on the surface of sensitive chip 103；
Fig. 9 b shows the schematic diagram of the processing of the high temperature hot pressing in one embodiment of the invention；
Fig. 9 c show in one embodiment of the invention to the sensitive chip 103, the annular support 102 and institute
State the schematic diagram that the assembly of colour filter 101 is toasted.
Specific embodiment
Various aspects of the reference attached drawing to the application are made more detailed description by the application in order to better understand.It answers
Understand, the only description to the illustrative embodiments of the application is described in detail in these, rather than limits the application in any way
Range.In the specification, the identical element of identical reference numbers.Stating "and/or" includes associated institute
Any and all combinations of one or more of list of items.
It should be noted that in the present specification, the first, second equal statement is only used for a feature and another feature differentiation
It comes, without indicating any restrictions to feature.Therefore, discussed below without departing substantially from teachings of the present application
First main body is also known as the second main body.
In the accompanying drawings, for ease of description, thickness, the size and shape of object are slightly exaggerated.Attached drawing is merely illustrative
And it is and non-critical drawn to scale.
It will also be appreciated that term " comprising ", " including ", " having ", "comprising" and/or " including ", when in this theory
In bright book use when indicate exist stated feature, entirety, step, operations, elements, and/or components, but do not exclude the presence of or
It is attached with one or more of the other feature, entirety, step, operation, component, assembly unit and/or their combination.In addition, ought be such as
When the statement of at least one of " ... " appears in after the list of listed feature, entire listed feature is modified, rather than is modified
Individual component in list.In addition, when describing presently filed embodiment, use " can with " indicate " one of the application or
Multiple embodiments ".Also, term " illustrative " is intended to refer to example or illustration.
As it is used in the present context, term " substantially ", " about " and similar term are used as the approximate term of table, and
Be not used as the term of table degree, and be intended to illustrate by by those skilled in the art will appreciate that, measured value or calculated value
In inherent variability.
Unless otherwise defined, otherwise all terms (including technical terms and scientific words) used herein all have with
The application one skilled in the art's is generally understood identical meaning.It will also be appreciated that term (such as in everyday words
Term defined in allusion quotation) it should be interpreted as having and their consistent meanings of meaning in the context of the relevant technologies, and
It will not be explained with idealization or excessively formal sense, unless clear herein so limit.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Fig. 2 shows the diagrammatic cross-sections of the photosensory assembly 1000 of one embodiment of the invention.With reference to Fig. 2, this photosensitive group
Part 1000 includes: colour filter 101, annular support 102, sensitive chip 103, wiring board 104, gold thread 105 and electronic component
107.Wherein, sensitive chip 103 its with photosensitive region 1031 and around the non-photo-sensing region of the photosensitive region 1031
1032.Colour filter 101 is located at 103 top of sensitive chip.Annular support 102 is formed by chip adhesive film moulding material and position
Between the sensitive chip 103 and the colour filter 101.The following table face contact of annular support 102 is simultaneously bonded in the sense
The position corresponding to the non-photo-sensing region 1032 of the upper surface of optical chip 103, and the upper table of the annular support 102
Face contact and the lower surface for being bonded in the colour filter 101.Wherein, chip adhesive film moulding material, that is, chip adhesive film magma.
Chip adhesive film English name is Die Attach Film, is abbreviated as DAF.Existing chip adhesive film is usually attached to wafer
The back side is to be pasted to other surfaces (such as surface of PCB surface or another chip) for the chip cut by wafer.This
In invention, supporter is formed using some characteristics of chip adhesive film magma, to obtain making colour filter 101 suitable for volume production
It is more nearly the photosensory assembly 1000 on 103 surface of sensitive chip.Sensitive chip 103 further includes being located at the non-photo-sensing region
1032, around or partially around the weld pad 1033 in 103 outside of sensitive chip.Also, it is being provided with the weld pad 1033
Non-photo-sensing region 1032, the contact surface of the annular support 102 and the sensitive chip 103 be located at the weld pad 1033 with
Between the photosensitive region 1031.The following table face contact of the sensitive chip 103 is simultaneously fixed on the wiring board 104.The weldering
Pad 1033 is electrically connected by gold thread 105 with the wiring board 104.Gold thread 105 is for realizing sensitive chip 103 and wiring board 104
Between electrical connection.It may be noted that in other embodiments, gold thread 105 can also be replaced by other metal wires.The work of " beating gold thread "
Skill (English name is by Wire Bonding) can also be replaced by other modes that wiring board and sensitive chip can be made to be connected, than
Such as flip technique (FlipChip).Electronic component 107 can be capacity cell and/or resistive element etc..
In another embodiment, the sensitive chip 103 can also not have weld pad 1033.Such as it can be in photosensitive core
Solder ball array is arranged in the back side (i.e. the one side opposite with photosurface) of piece 103, is electrically connected by solder ball array with wiring board 104.
Above-described embodiment can make colour filter 101 be more nearly 103 surface of sensitive chip, can effectively reduce the height of mould group
Spend size (along the size of optical axis direction) and/or length and width dimensions (perpendicular to the size of optical axis direction), with meet mobile phone and its
Comprehensive screenization, the lightening demand of his electronic equipment.
Further, referring still to Fig. 1, in one embodiment, the contact of the supporter and the sensitive chip 103
Area is less than the contact area of the supporter and the colour filter 101.In the section of the axis by the sensitive chip 103
On, the supporter forms the shape of inverted trapezoidal.On the one hand, the inverted trapezoidal design in the present embodiment can be effectively avoided or subtract
Support shape is destroyed in few shaping process, it is possible to reduce the molecule formed in shaping process is to photosensitive core
Piece 103 pollutes, to improve product yield.On the other hand, the inverted trapezoidal design in the present embodiment additionally aids reduction branch
The lower surface of support body makes it easier for the tiny area being precisely directed between weld pad 1033 and photosensitive region 1031, to keep away
Exempt from or reduce because colour filter 101 and sensitive chip 103 align it is inaccurate due to caused by product it is bad, while also adapting to photosensitive at present
The diminishing development trend in 103 non-photo-sensing region of chip 1032.Further, the supporter can be black glue material, this
Sample can reduce the veiling glare for reflexing to 103 surface of sensitive chip, can be further reduced in combination with the design of above-mentioned inverted trapezoidal miscellaneous
Light, to improve image quality.
Further, Fig. 3 shows the diagrammatic cross-section of the photosensory assembly 1000 of another embodiment of the present invention.In Fig. 2
On the basis of illustrated embodiment, the photosensory assembly 1000 of the present embodiment further includes integrally formed molded section.Molded section passes through mould
Modeling technique is formed in the PCB surface, extends around the sensitive chip 103 and to the sensitive chip 103 and contact institute
State sensitive chip 103.In the present embodiment, the molded section 106 covers the metal wire 105 and electronic component 107.Also, institute
Molded section 106 is stated to cover at least part fringe region of the colour filter 101 and contact the outer of the annular support 102
Side.The molded section 106 also has smooth 106 top surface of molded section formed by mold pressing, and the molding
106 top surface of portion is higher than the upper surface of the colour filter 101.In the present embodiment, since the colour filter 101 is attached at photosensitive core
103 surface of piece can overcome chip to be molded portion 106 and be shaped in warpage issues caused by wiring board 104, improve chip
Flatness, to reduce the curvature of field of optical lens or corresponding camera module.
Further, in other embodiments of the invention, corresponding camera module 2000, the camera module are additionally provided
2000 may include the photosensory assembly 1000 of aforementioned any embodiment.Fig. 4 shows the camera module of one embodiment of the invention
2000 diagrammatic cross-section.The camera module 2000 includes lens assembly 3000 and photosensory assembly 1000.Wherein, photosensory assembly
1000 structure is consistent with embodiment shown in Fig. 2, repeats no more.Lens assembly 3000 includes optical lens 301 and microscope base
302.Microscope base 302 is tubular, and the optical lens 301 is mounted on 302 inside of microscope base.Microscope base 302 bottom surface installation (such as with
The mode of HA or AA is installed) on the wiring board 104.In the present embodiment, since colour filter 101 is adhered to sensitive chip
103 surfaces, under the premise of there are identical evaded distance, optical lens 301 can be closer to sensitive chip 103, therefore
The height of camera module 2000 can be reduced.Also, microscope base 302 can be omitted inner convex platform 6 as shown in Figure 1, to reduce mirror
The height of seat.In another embodiment, lens assembly 3000 can also include motor (being not shown in Fig. 4), and optical lens 301 is pacified
On the inside of the carrier of motor.Motor base installs (such as installing in a manner of HA or AA) on wiring board 104.It may be noted that
In other embodiments, motor can also be replaced by other types of optical actuator.
Further, Fig. 5 shows the diagrammatic cross-section of the camera module 2000 of another embodiment of the present invention.This implementation
In example, camera module 2000 includes lens assembly 3000 and photosensory assembly 1000, and wherein photosensory assembly 1000 includes shown in Fig. 3
Molded section 106.The bottom surface of lens assembly 3000 bears against 106 top surface of molded section.In one example, the lens group
Part 3000 may include the camera lens supporter 303 of optical lens 301 and tubular, and the bottom surface of the camera lens supporter 303 is born against
106 top surface of molded section.Molded section 106 is formed in 104 surface of wiring board by moulding technology, around the photosensitive core
Piece 103 simultaneously extends to the sensitive chip 103 and contacts the sensitive chip 103.In the present embodiment, the molded section 106 is covered
Cover the metal wire 105.Also, the molded section 106 covers at least part fringe region of the colour filter 101 and connects
Touch the lateral surface of the annular support 102.The molded section 106 also has the smooth molding formed by mold pressing
106 top surface of portion, and 106 top surface of the molded section is higher than the upper surface of the colour filter 101.Further, described photosensitive group
Part 1000 can also include electronic component 107, such as capacitor or resistance etc..In the present embodiment, the molded section 106 also covers institute
State the top surface of electronic component.Under current production technology, the height of capacitor or resistance is not less than 400um, this height is usually big
In the sum of sensitive chip 103 and the thickness of colour filter 101, therefore, the minimum constructive height of 106 top surface of molded section is mainly by capacitor
Or the limitation of the height of resistance.In the present embodiment, since the colour filter 101 is attached at 103 surface of sensitive chip,
Be integrally formed ground mold the molded section 106 when, pressure head can be pressed together on the upper surface of colour filter 101, so as to avoid pressure head with
The direct contact of sensitive chip 103.Therefore, the present embodiment can overcome chip to be molded portion 106 to be shaped in wiring board
Warpage issues caused by 104 improve the flatness of chip, reduce the curvature of field.Also, due to colour filter 101 be adhered to it is photosensitive
103 surface of chip, under the premise of there are identical evaded distance, lens assembly 3000 can be closer to sensitive chip 103,
Therefore the height of camera module 2000 can be reduced.In another example, the lens assembly 3000 may include motor and
It is installed on the optical lens 301 of the carrier of motor, the pedestal of the motor bears against 106 top surface of molded section.It may be noted that
In other examples, motor can also be omitted or be replaced by other types of optical actuator.
Further, according to one embodiment of present invention, a kind of 1000 production method of photosensory assembly is additionally provided, is wrapped
Include the following steps 100 to 400:
Step 100, by silk-screen printing technique, ring is formed on the surface of colour filter 101 by chip adhesive film moulding material
Shape supporter 102 (refers to Fig. 7 d), wherein the photosensitive area of the annular support 102 area encompassed and sensitive chip 103
Domain 1031 matches.Fig. 7 a-d shows the process of the step 100 in one embodiment of the invention, with reference to Fig. 7 a-d, step 100
It is as follows including sub-step 110 to 140:
Step 110, plates for screen printing 8000 is covered to the surface of colour filter 101.Fig. 7 a is shown plates for screen printing
The schematic diagram on the surface of 8000 covering color filter substrates 1020.Colour filter can be obtained after cutting in color filter substrate 1020 in the present embodiment
101.There is the pierced pattern 8011 corresponding to the annular brace shape on the plates for screen printing 8000.Fig. 6 a is shown
The diagrammatic cross-section of plates for screen printing 8000 in one embodiment of the invention.Wherein, which is perpendicular to plates for screen printing
The section on 8000 surface.With reference to Fig. 6 a, the plates for screen printing 8000 includes pattern layer 801 and silk screen superficial layer 802.Its
In, the pattern layer 801 and the colour filter 101 (colour filter 101 can be obtained after color filter substrate 1020 is cut in the present embodiment)
Contact, the silk screen superficial layer 802 are located at back to the side of the color filter substrate 1020, and the pierced pattern 8011 is located at described
Pattern layer.In one embodiment, the plates for screen printing 8000 can be steel mesh printing plate.Fig. 6 b is shown shown in Fig. 6 a
The top view of pattern layer 801.As can be seen that the pierced pattern 8011 in pattern layer 801 form it is corresponding with annular support 102
Annular.Silk screen superficial layer 802 is reticular structure, therefore will not cover the pierced pattern 8011 in pattern layer 801.To make to illustrate
It is more succinct, silk screen superficial layer 802 is not shown in Fig. 7 a-c.
Step 120, chip adhesive film moulding material paste is coated on plates for screen printing 8000 and color filter substrate 1020
1030 and its is made to fill the pierced pattern 8011.Fig. 7 b is shown in 1020 colour filter of plates for screen printing 8000 and color filter substrate
The schematic diagram of upper coating chip adhesive film moulding material 1030 paste.It, can be in plates for screen printing 8000 and filter in this step
It is coated with chip adhesive film moulding material 1030 paste on chromogen substrate 1020, is then scraped with scraper in the silk screen superficial layer
It is flat.Extra chip adhesive film moulding material 1030 paste can be removed by striking off operation, and also contribute to making core paste
Piece adhesive film moulding material 1030 is sufficient filling with the pierced pattern of the pattern layer.
Step 130, the plates for screen printing 8000 is divided from the color filter substrate 1020 and the annular support 102
From.Fig. 7 c, which is shown, separates the plates for screen printing 8000 from the color filter substrate 1020 and the annular support 102
Schematic diagram.Referring still to Fig. 6 a, in one embodiment, the pierced pattern 8011 is perpendicular to the plates for screen printing 8000
Sectional view on trapezoidal, and the opening area positioned at 8000 side of silk screen superficial layer of the pierced pattern 8011
Less than the opening area backwards to the other side of the silk screen superficial layer 8000.In this way, working as plates for screen printing 8000 from the colour filter
When substrate 1020 (or colour filter 101) and the annular support 102 separate, due to draft inclined-plane 8010, separation behaviour
Work will not destroy the shape of chip adhesive film moulding material 1030 paste, while also avoiding or reducing lock out operation generation can
The molecule of sensitive chip 103 can be polluted, to improve product yield.
Step 140, precuring is carried out to the chip adhesive film moulding material 1030, makes it be shaped to solid annular branch
Support body 102.The precuring includes: that the chip adhesive film moulding material 1030 paste is heated or exposed, and makes it
Hardness, which increases, becomes the dam body with rigidity, and its viscosity reduction is made to reach threshold value.
Further, in one embodiment, step 140 assembly obtained is cut, available correspondence
In the assembly of single sensitive chip being made of colour filter 101 and annular support 102.Fig. 8 is shown to step 140 institute
The schematic diagram that the assembly of acquisition is cut.As shown in figure 8, cutting color filter substrate from the back side along dotted line with cutter 1090
1020, the assembly being made of colour filter 101 and annular support 102 corresponding to single sensitive chip can be obtained.
In another embodiment of the present invention, step 130 can be replaced mutually with sequence the step of step 140, also
It is to say, first carries out step 140, precuring is carried out to the die bonding film moulding material 1030, makes it be shaped to solid ring
Shape supporter 102.Then step 130 is being carried out, the plates for screen printing 8000 is being propped up from the colour filter 101 and the annular
Support body 102 separates.It in the present embodiment, can also be by plates for screen printing 8000 and die bonding film moulding material 1030
Coating surface, coating or the spraying of contact form one layer of isolation film, thus when preventing from executing step 140, the forming of die bonding film
Material 1030 clings printing plate, is not easy to execute the step 130.
In one embodiment, the precuring of chip adhesive film moulding material 1030 belongs to physical change, and property changes
Are as follows: the higher the better for hardness increase, viscosity reduction, and hardness to prevent it from collapsing, deforming, sticky then more lower better to prevent from propping up
Support body (i.e. dam body) is stained with dust (if supporter is stained with dust, may pollute the photosensitive of sensitive chip 103 in the subsequent process
Region 1031 causes product bad).Since the change of above-mentioned property belongs to physical change scope, there is invertibity, also
It is to say, supporter can be local melting and restores viscosity under certain condition (such as under conditions of high temperature hot pressing).
After completing step 140, step 200 can be performed.
Step 200, the colour filter 101 and the sensitive chip 103 are aligned, makes the table of the annular support 102
Face correspond to the sensitive chip 103 non-photo-sensing region 1032, wherein the non-photo-sensing region 1032 be centered around it is described photosensitive
Around region 1031.Fig. 9 a shows in one embodiment of the invention that the colour filter 101 and the sensitive chip 103 is right
The schematic diagram of position.Wherein colour filter 101 is by the intake of intake mechanism 1010 and movement.It in one embodiment, can be by multiple senses
Optical chip 103 is arranged on a working substrate 1040, while multiple groups colour filter 101 and the sensitive chip 103 being aligned, from
And improve production efficiency.
Step 300, it approaches the surface of the annular support 102 and contacts the surface of the sensitive chip 103.Fig. 9 a
The surface for making the annular support 102 in one embodiment of the invention is shown to approach and contact the sensitive chip 103
Surface schematic diagram.
Step 400, the annular support 102 is bonded with the sensitive chip 103.In one embodiment, step
400 include sub-step 410 and 420.
Step 410, it is handled by high temperature hot pressing, makes the core between the colour filter 101 and the sensitive chip 103
Piece adhesive film moulding material 1030 melts and restores viscosity.Fig. 9 b is shown at the high temperature hot pressing in one embodiment of the invention
The schematic diagram of reason.Wherein intake mechanism 1010 can be downwardly applied to press to reach the pressure condition of high temperature hot pressing processing.
Step 420, make the chip adhesive film moulding material between the colour filter 101 and the sensitive chip 103
It is permanent cured, so that the annular support 102 be made to bond with the sensitive chip 103.Fig. 9 c shows a reality of the invention
Apply being toasted to the assembly of the sensitive chip 103, the annular support 102 and the colour filter 101 in example
Schematic diagram.In one embodiment, the permanent cured sub-step may include: to the sensitive chip 103, the annular
The assembly of supporter 102 and the colour filter 101 is toasted, and makes to be located at the annular support 102 and the photosensitive core
The chip adhesive film moulding material 1030 of the contact surface of piece 103 is permanent cured.In one embodiment, this step is permanent cured
It may is that under the baking of certain time length, the generation of chip adhesive film moulding material 1030 caused irreversibly to react, so that
Annular support 102 permanently hardens and loses viscosity.
Further, in one embodiment, 1000 production method of photosensory assembly further include:
Step 500, after executing the step 400, by the sensitive chip 103, the annular support 102 and the filter
The assembly of color chips 101 is installed on wiring board 104, and wherein sensitive chip 103 is attached at the surface of the wiring board 104.
Step 600, gold thread 105 is connected (i.e. between the weld pad 1033 and the wiring board 104 of the sensitive chip 103
" beating gold thread ", the English name of the technique are Wire Bonding).
Step 607, it is formed on 104 surface of wiring board around the sensitive chip 103 and to institute by moulding technology
The molded section 106 that sensitive chip 103 extends and contacts the sensitive chip 103 is stated, the molded section 106 covers the metal wire
105, it covers at least part fringe region of the colour filter 101 and contacts the lateral surface of the annular support 102.
In one embodiment, described the step of forming molded section 106 by moulding technology can also include: to press to be formed by mold
Smooth 106 top surface of molded section, and 106 top surface of the molded section is higher than the upper surface of the colour filter 101.
Further, in one embodiment, annular support 102 can be formed on colour filter 101 in bulk.This
In embodiment, then step 100 can cut the filter by forming 102 array of annular support on color filter substrate 1020
Chromogen substrate 1020 is realized.101 He of colour filter corresponding to single sensitive chip 103 can be obtained after cutting color filter substrate 1020
The assembly of annular support 102.The detailed process that 102 array of annular support is formed on color filter substrate 1020 can refer to
Step 110 is to step 140 above.It is formed in the present embodiment, on plates for screen printing 8000 corresponding with multiple annular supports 102
Multiple pierced patterns.
In above-described embodiment, the combination of sensitive chip 103, colour filter 101 and annular support 102 can be made in bulk
Body.Wherein, arrange that multiple sensitive chips 103 form 103 array of sensitive chip on substrate.It will be described in multiple be formed in
The annular support 102 on colour filter 101 is aligned with 101 array of sensitive chip, makes each annular branch
The surface of support body 102 corresponds respectively to the non-photo-sensing region 1032 of the sensitive chip 103.Then, make the ring
The surface of shape supporter 102 approaches and contacts the surface of the corresponding sensitive chip 103.Make each annular branch again
Support body 102 is bonded with the corresponding sensitive chip 103.Finally remove the substrate.
It is noted that in other embodiments, one by one annular support 102 can also be formed on colour filter 101.
In these embodiments, the color filter substrate 1020 in Fig. 7 a-c is replaced with colour filter 101.
Further, in one embodiment, a kind of 2000 production method of camera module is additionally provided, this method can wrap
It includes: utilizing 1000 production method of the photosensory assembly production photosensory assembly 1000 of hereinbefore any one embodiment；Then by camera lens
Component 3000 obtains camera module 2000 together with photosensory assembly assembling 1000.
In one embodiment, on the section by the axis of the sensitive chip 103, the height of the supporter 102
Degree can be about 5-400um, and when the section of supporter is inverted trapezoidal, the mean breadth on the inverted trapezoidal section be can be about
50-600um, while this width is slightly less than the sensitive chip 103 for being commonly used in mobile phone camera module 2000 currently on the market
Weld pad and the distance between photosensitive region 1031 (about 400-1000um).And current silk-screen printing technique can achieve production
The craft precision of the lines of width about 100um.Therefore, the present embodiment is suitable for the photosensitive mould group 1000 of volume production and corresponding camera shooting mould
Group 2000.
Further, in one embodiment, the ingredient of chip adhesive film moulding material 1030 includes: epoxy resin, consolidates
Agent and with epoxy resin be non-compatibility property high-molecular compound.Wherein, epoxy resin is, for example: bisphenol type epoxy tree
Two functional group epoxy resin such as rouge or bisphenol f type epoxy resin, phenolic resin varnish type epoxy resin or cresol novolacs type epoxy resin
Equal type epoxies resin etc..In addition, the common tree such as polyfunctional epoxy resin or the epoxy resin containing heterocycle can also be used
Rouge.The effect of epoxy resin be it is cured manifest bonding effect, selection is not restricted to above-mentioned material.
Curing agent may, for example, be: polyfunctional group phenols, amine, imidazolium compounds, anhydride, organic phosphorus compound and this
Halide, polyamide, polysulfide, the boron trifluoride etc. of a little compounds.In the present invention, the effect of curing agent is to make epoxy resin
Solidification, selection are not restricted to above-mentioned material.
The high-molecular compound of non-compatibility property may, for example, be: the rubber such as acrylic copolymer, acrylic rubber, silicon
The silicon such as resin, Si modification polyamide-(acyl)-imines modify resin etc..In the present invention, the work of the high-molecular compound of non-compatibility property
With being for controlling colloid elasticity, mobility under the condition of high temperature etc., it is immiscible with epoxy resin.Its selection is not restricted to
Above-mentioned material.
In above-described embodiment, colour filter can be attached directly to core by the supporter that chip adhesive film moulding material is formed
Piece surface is not necessarily to other adhesion means between supporter and colour filter and between supporter and sensitive chip.
Above description is only the better embodiment of the application and the explanation to institute's application technology principle.Art technology
Personnel should be appreciated that invention scope involved in the application, however it is not limited to skill made of the specific combination of above-mentioned technical characteristic
Art scheme, while should also cover in the case where not departing from the inventive concept, by above-mentioned technical characteristic or its equivalent feature into
Row any combination and the other technical solutions formed.Such as features described above and (but being not limited to) disclosed herein have class
Technical characteristic like function is replaced mutually and the technical solution that is formed.
Claims (29)
1. a kind of photosensory assembly characterized by comprising
Sensitive chip, with photosensitive region and around the non-photo-sensing region of the photosensitive region；
Colour filter is located above the sensitive chip；And
Annular support, formed by chip adhesive film moulding material and be located at the sensitive chip and the colour filter it
Between；The following table face contact of the annular support and be bonded in the sensitive chip upper surface correspond to the non-photo-sensing area
The position in domain, and the upper surface of the annular support contacts and is bonded in the lower surface of the colour filter.
2. photosensory assembly according to claim 1, which is characterized in that the contact surface of the supporter and the sensitive chip
Product is less than the contact area of the supporter and the colour filter.
3. photosensory assembly according to claim 2, which is characterized in that in the section of the axis by the sensitive chip
On, the supporter forms the shape of inverted trapezoidal.
4. photosensory assembly according to claim 1, which is characterized in that the sensitive chip further includes being located at the non-photo-sensing
Region, around or partially around the weld pad on the outside of the sensitive chip；Also, in the non-photo-sensing area for being provided with the weld pad
The contact surface of domain, the annular support and the sensitive chip is between the weld pad and the photosensitive region.
5. photosensory assembly according to claim 4, which is characterized in that the photosensory assembly further includes wiring board, the sense
The following table face contact of optical chip is simultaneously fixed on the wiring board.
6. photosensory assembly according to claim 5, which is characterized in that the weld pad passes through metal wire and wiring board electricity
Connection.
7. photosensory assembly according to claim 6, which is characterized in that the photosensory assembly further include:
Molded section is formed in the PCB surface, around the sensitive chip and to the photosensitive core by moulding technology
Piece extends and contacts the sensitive chip.
8. photosensory assembly according to claim 7, which is characterized in that the photosensory assembly further includes forming assist side table
The electronic component in face, the molded section cover the metal wire and the electronic component.
9. photosensory assembly according to claim 8, which is characterized in that the molded section covers at least the one of the colour filter
Part edge region and the lateral surface for contacting the annular support.
10. photosensory assembly according to claim 9, which is characterized in that the molded section, which has, presses shape by mold
At smooth molded section top surface, and the molded section top surface be higher than the colour filter upper surface.
11. a kind of camera module, which is characterized in that including photosensory assembly described in any one of claim 1-10.
12. a kind of camera module, which is characterized in that including lens assembly and photosensory assembly described in any one of claim 10, the mirror
The bottom surface of head assembly bears against the molded section top surface.
13. a kind of photosensory assembly production method characterized by comprising
By silk-screen printing technique, annular support is formed on the surface of colour filter by chip adhesive film moulding material, wherein institute
The photosensitive region for stating annular support area encompassed and sensitive chip matches；
The colour filter and the sensitive chip are aligned, the surface of the annular support is made to correspond to the sensitive chip
Non-photo-sensing region, wherein the non-photo-sensing region is centered around around the photosensitive region；
It approaches the surface of the annular support and contacts the surface of the sensitive chip；And
Bond the annular support and the sensitive chip.
14. photosensory assembly production method according to claim 13, which is characterized in that the step for forming annular support
Suddenly include:
Plates for screen printing is covered to the surface of colour filter, is had on the plates for screen printing corresponding to the annular brace shape
Pierced pattern；
It is coated with chip adhesive film moulding material paste on plates for screen printing and colour filter and it is made to fill the pierced pattern；
The plates for screen printing is separated from the colour filter and the annular support；And
Precuring is carried out to the chip adhesive film moulding material, makes it be shaped to solid annular support.
15. photosensory assembly production method according to claim 14, which is characterized in that in the formation annular support
In step, the plates for screen printing includes pattern layer and silk screen superficial layer；And
By in the sub-step on the surface of plates for screen printing covering colour filter, the pattern layer is contacted with the colour filter, described
Silk screen surface level is located at the pattern layer in the side back to the colour filter, the pierced pattern.
16. photosensory assembly production method according to claim 15, which is characterized in that the coating sub-step includes:
Chip adhesive film moulding material paste is coated on plates for screen printing and colour filter；And
It is struck off with scraper in the silk screen superficial layer.
17. photosensory assembly production method according to claim 15, which is characterized in that in the formation annular support
In step, the pierced pattern is trapezoidal on the sectional view perpendicular to the plates for screen printing, and the pierced pattern
Opening area positioned at silk screen superficial layer side is less than the opening area backwards to the other side of the silk screen superficial layer.
18. photosensory assembly production method according to claim 14, which is characterized in that the precuring includes:
The chip adhesive film moulding material paste is heated or exposed, increasing its hardness becomes the dam with rigidity
Body, and its viscosity reduction is made to reach threshold value.
19. photosensory assembly production method according to claim 18, which is characterized in that it is described make the annular support with
The sensitive chip bond the step of include:
Handled by high temperature hot pressing, make to be located at the chip adhesive film of the contact surface of the annular support and the sensitive chip at
Type material melts simultaneously restore viscosity；And
Keep the chip adhesive film moulding material positioned at the annular support and the contact surface of the sensitive chip permanent cured, from
And bond the annular support and the sensitive chip.
20. photosensory assembly production method according to claim 19, which is characterized in that the permanent cured step packet
It includes: the assembly of the sensitive chip, the annular support and the colour filter is toasted, make to be located at the annular branch
The chip adhesive film moulding material of support body and the contact surface of the sensitive chip is permanent cured.
21. photosensory assembly production method according to claim 13, which is characterized in that further include:
After the step of making the annular support and the sensitive chip bonds, by the sensitive chip, the annular brace
The assembly of body and the colour filter is installed on wiring board, and wherein sensitive chip is installed on the surface of the wiring board.
22. photosensory assembly production method according to claim 21, which is characterized in that further include:
Metal wire is connected between the weld pad and the wiring board of the sensitive chip, in PCB surface installation electronics member
Part.
23. photosensory assembly production method according to claim 22, which is characterized in that further include:
It is formed in the PCB surface around the sensitive chip by moulding technology and extends and connect to the sensitive chip
The molded section of the sensitive chip is touched, the molded section covers the metal wire and the electronic component, the covering colour filter
At least part fringe region and contact the lateral surface of the annular support.
24. photosensory assembly production method according to claim 23, which is characterized in that described to form mould by moulding technology
The step of modeling portion further include: press to form smooth molded section top surface by mold, and the molded section top surface is higher than described
The upper surface of colour filter.
25. photosensory assembly production method described in 3-24 any one according to claim 1, which is characterized in that the formation ring
The step of shape supporter includes:
Annular brace volume array is formed on color filter substrate；And
The color filter substrate is cut, the assembly of the colour filter and annular support corresponding to single sensitive chip is obtained.
26. photosensory assembly production method described in 3-24 any one according to claim 1, which is characterized in that further include:
Arrange that multiple sensitive chips form sensitive chip array on substrate；
Multiple annular supports being formed on the colour filter are aligned with the sensitive chip array, are made each
The surface of the annular support corresponds respectively to the non-photo-sensing region of the sensitive chip；
It approaches the surface of the annular support and contacts the surface of the corresponding sensitive chip；
Bond each annular support with the corresponding sensitive chip；And
Remove the substrate.
27. photosensory assembly production method according to claim 14, which is characterized in that the step for forming annular support
In rapid, the plates for screen printing is separated from the colour filter and the annular support first, then the chip is bonded again
Film moulding material carries out precuring, makes it be shaped to solid annular support.
28. photosensory assembly production method according to claim 15, which is characterized in that the step for forming annular support
In rapid, the plates for screen printing has isolation film, and be formed in the plates for screen printing shapes material with the die bonding film
Expect the surface of contact；Also, precuring first is carried out to the chip adhesive film moulding material, makes it be shaped to solid annular branch
Then support body again separates the plates for screen printing from the colour filter and the annular support.
29. a kind of camera module production method characterized by comprising using described in any one of claim 13-28
Photosensory assembly production method makes photosensory assembly；And
Lens assembly and the photosensory assembly are fitted together, camera module is obtained.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810311064.1A CN110364540A (en) | 2018-04-09 | 2018-04-09 | Photosensory assembly, camera module and preparation method thereof |
| PCT/CN2019/077764 WO2019196584A1 (en) | 2018-04-09 | 2019-03-12 | Photosensitive assembly, camera module, and manufacturing methods therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810311064.1A CN110364540A (en) | 2018-04-09 | 2018-04-09 | Photosensory assembly, camera module and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110364540A true CN110364540A (en) | 2019-10-22 |
Family
ID=68211852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810311064.1A Pending CN110364540A (en) | 2018-04-09 | 2018-04-09 | Photosensory assembly, camera module and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110364540A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111627948A (en) * | 2020-06-05 | 2020-09-04 | 中国电子科技集团公司第四十四研究所 | CCD structure with on-chip optical filter |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1719614A (en) * | 2004-07-08 | 2006-01-11 | 日月光半导体制造股份有限公司 | Image inductor packaging structure and mfg. method thereof |
| CN1985379A (en) * | 2004-05-13 | 2007-06-20 | 微米技术有限公司 | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronic imagers |
| CN101950751A (en) * | 2009-07-10 | 2011-01-19 | 菱光科技股份有限公司 | Image sensor and encapsulating method thereof |
| JP2011187482A (en) * | 2010-03-04 | 2011-09-22 | Sharp Corp | Solid-state imaging apparatus, module for optical device, and method of manufacturing solid-state imaging apparatus |
| JP2014216475A (en) * | 2013-04-25 | 2014-11-17 | 凸版印刷株式会社 | Solid state image pickup device and manufacturing method of the same |
| CN107734216A (en) * | 2016-08-12 | 2018-02-23 | 宁波舜宇光电信息有限公司 | Array camera module and its molding photosensory assembly and manufacture method and the electronic equipment with array camera module |
| CN207993864U (en) * | 2018-04-09 | 2018-10-19 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module |
-
2018
- 2018-04-09 CN CN201810311064.1A patent/CN110364540A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1985379A (en) * | 2004-05-13 | 2007-06-20 | 微米技术有限公司 | Covers for microelectronic imagers and methods for wafer-level packaging of microelectronic imagers |
| CN1719614A (en) * | 2004-07-08 | 2006-01-11 | 日月光半导体制造股份有限公司 | Image inductor packaging structure and mfg. method thereof |
| CN101950751A (en) * | 2009-07-10 | 2011-01-19 | 菱光科技股份有限公司 | Image sensor and encapsulating method thereof |
| JP2011187482A (en) * | 2010-03-04 | 2011-09-22 | Sharp Corp | Solid-state imaging apparatus, module for optical device, and method of manufacturing solid-state imaging apparatus |
| JP2014216475A (en) * | 2013-04-25 | 2014-11-17 | 凸版印刷株式会社 | Solid state image pickup device and manufacturing method of the same |
| CN107734216A (en) * | 2016-08-12 | 2018-02-23 | 宁波舜宇光电信息有限公司 | Array camera module and its molding photosensory assembly and manufacture method and the electronic equipment with array camera module |
| CN207993864U (en) * | 2018-04-09 | 2018-10-19 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111627948A (en) * | 2020-06-05 | 2020-09-04 | 中国电子科技集团公司第四十四研究所 | CCD structure with on-chip optical filter |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208956151U (en) | Circuit board module, photosensory assembly and camera module | |
| CN100378933C (en) | Method for manufacturing a semiconductor package with a laminated chip cavity | |
| CN103299408B (en) | The manufacture method of electronic component module and electronic component module | |
| CN207820032U (en) | Camera module and photosensory assembly and electronic equipment | |
| CN100594710C (en) | Camera module | |
| CN115134490B (en) | Sinking camera module, sinking photosensitive assembly and manufacturing method thereof | |
| CN106973210A (en) | Plastic packaging adds stent-type to minimize cam device and preparation method thereof | |
| CN101752323A (en) | Image sensor camera module and method of manufacturing the same | |
| EP1093407A1 (en) | Method of making an adhesive preform lid for electronic devices | |
| CN102169876A (en) | Resin-sealed electronic control device and method of fabricating the same | |
| CN101014092A (en) | Camera module | |
| CN207993864U (en) | Photosensory assembly and camera module | |
| JP2012028484A (en) | Module and manufacturing method of the same | |
| EP0949675A2 (en) | Heat-resistant solid-state pickup device and manufacturing method thereof | |
| JP2011171540A (en) | Method of manufacturing module | |
| CN110783254A (en) | Chip transfer method and semiconductor device | |
| CN110364540A (en) | Photosensory assembly, camera module and preparation method thereof | |
| CN101785099B (en) | Electronic component | |
| CN104347535B (en) | Electronic packaging module and manufacturing method thereof | |
| CN114982216B (en) | Filtering component, camera module and multi-camera module | |
| CN112397669B (en) | Display module, manufacturing method thereof and display device | |
| WO2019196584A1 (en) | Photosensitive assembly, camera module, and manufacturing methods therefor | |
| CN112312675A (en) | Chip attaching method and camera module | |
| JP2012049419A (en) | Module and method for manufacturing the same | |
| CN201274603Y (en) | Soft and hard composite board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |