CN101752323A - Image sensor camera module and method of manufacturing the same - Google Patents

Image sensor camera module and method of manufacturing the same Download PDF

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Publication number
CN101752323A
CN101752323A CN200910006288A CN200910006288A CN101752323A CN 101752323 A CN101752323 A CN 101752323A CN 200910006288 A CN200910006288 A CN 200910006288A CN 200910006288 A CN200910006288 A CN 200910006288A CN 101752323 A CN101752323 A CN 101752323A
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China
Prior art keywords
image sensor
outer shell
mirror head
head outer
sensor package
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CN200910006288A
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Chinese (zh)
Inventor
金真宽
金奂
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Optopac Co Ltd
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Optopac Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Abstract

The present invention relates to an image sensor camera module and a method of manufacturing the same. An image sensor camera module according to the present invention includes a lens; a lens housing having the lens mounted thereto; an image sensor package adhering to a portion of an inside of the lens housing; and a protruding portion for maintaining a gap between the lens and the image sensor package, wherein the image sensor package adheres to the lens housing at an outside of the protruding portion. According to the present invention, since a lens barrel is not used and a focus adjusting process is not performed, the process simplification and automation process can be achieved, thereby saving a manufacturing cost and obtaining uniform focus quality. Further, it is possible to prevent an image defect from being generated by foreign substances, thereby improving a yield.

Description

Image sensor camera module and manufacture method thereof
Technical field
The present invention relates to a kind of image sensor camera module, particularly relate to a kind of image sensor camera module of wherein not carrying out the focus adjustment process, and a kind of manufacture method of image sensor camera module.
Background technology
Imageing sensor is the semiconductor device of photo that can take the image of people or object.Along with these imageing sensors are embedded in commercially available portable phone and digital camera or the video camera, the market of imageing sensor enlarges fast.This type of imageing sensor is with the form manufacturing of camera model, and is installed in the equipment mentioned above.
Camera model comprises camera lens, fixture, imageing sensor and printed circuit board (PCB) usually, and by chip on board (chip on board, COB), wafer-level package (chip scale package, (chip on film, COF) chip is made CSP) or on the film by method.In camera model, imageing sensor is electrically connected to printed circuit board (PCB), and fixture is fixed on the printed circuit board (PCB).Camera lens is installed to lens barrel and the camera lens placing portion that provides in the fixture is provided.The outer rim of lens barrel and camera lens placing portion manufactures has screw thread form, makes lens barrel be fastened to the camera lens placing portion with thread connecting mode.After lens barrel was fastened to the camera lens placing portion, lens barrel and fixture used adhesive bonded to each other.
In conventional camera model, should before lens barrel and fixture are bonded to each other, carry out the focus adjustment process, so that regulate the distance between lens barrel and the imageing sensor.Because the cause of focus adjustment process further needs a kind of equipment that is used for focus adjustment, and the manufacturing time increase, therefore may be difficult to realize automation process.
In addition, during lens barrel was fastened to the process of fixture, the friction between the screw thread of fixture and the screw thread of lens barrel can produce particulate.If this based fine particles is introduced in imageing sensor, then may in camera model, cause image deflects.In addition, during the process of making camera model, may cause imageing sensor and fixture to tilt, and therefore may not can realize the homogeneity of the focusing quality of camera model.
Simultaneously, have the light of specific wavelength band because conventional camera model should be equipped with independent IR filter and pass through, cost increases, light transmission worsens so can make inevitably.It is in addition, especially burnt behind the flange of bottom from the imageing sensor to the camera lens that (flange back length FBL) is configured to more in short-term, is difficult to install the IR filter, and this may cause and be difficult to design the camera lens with shorter FBL.
This shows that above-mentioned existing camera model and manufacture method thereof obviously still have inconvenience and defective, and demand urgently further being improved in product structure, manufacture method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product and method do not have appropriate structure and method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new image sensor camera module and manufacture method thereof, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The objective of the invention is to, overcome the defective that existing camera model and manufacture method thereof exist, and provide a kind of new image sensor camera module and manufacture method thereof, technical problem to be solved is to make wherein not carry out the focus adjustment process so that implementation procedure is simplified and automation process, make and be very suitable for practicality by the focusing quality that to save manufacturing cost and can realize homogeneous.
Another object of the present invention is to, overcome the defective that existing camera model and manufacture method thereof exist, and provide a kind of new image sensor camera module and manufacture method thereof, technical problem to be solved is to make it can prevent to produce particulate with improvement yield (yield), thereby is suitable for practicality more.
An also purpose of the present invention is, overcome the defective that existing camera model and manufacture method thereof exist, and provide a kind of new image sensor camera module and manufacture method thereof, technical problem to be solved is to make wherein that IR edge filter (IR cut-off filter) is coated on the image sensor package, even make FBL also can make camera model than short, thereby can reduce the height of camera model, thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.For achieving the above object, according to the invention provides a kind of image sensor camera module, described image sensor camera module comprises: camera lens; Mirror head outer shell is installed described camera lens on it; Image sensor package, it is adhered to the part of the inboard of mirror head outer shell; And ledge, it is used to keep the gap between camera lens and the image sensor package, and wherein image sensor package is adhered to mirror head outer shell in the outside of ledge.
Mirror head outer shell can comprise parallel with image sensor package and the horizontal component location; And extend upward to allow that camera lens is settled superincumbent camera lens placing portion from the inward flange of horizontal component.
Mirror head outer shell can further comprise the extension of extending from the outward flange of horizontal component downwards.
Ledge can extend downwards or extend from camera lens from the inboard of horizontal component.
The printed circuit board (PCB) of image sensor package is installed above image sensor camera module can further comprise, and the bottom surface of extension can further be adhered to top surface of printed circuit board.
Image sensor camera module can further comprise the passive device in the working region that is arranged on the printed circuit board (PCB).
Image sensor package can comprise image sensor chip; And be electrically connected to image sensor chip and be arranged on glass substrate on the image sensor chip.
Image sensor camera module can further comprise the IR edge filter that is coated on the glass substrate or attached to the IR film on the glass substrate.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.For achieving the above object, according to the manufacture method that the invention provides a kind of image sensor camera module, it comprises image sensor package is installed on the printed circuit board (PCB); Use adhesive that mirror head outer shell is adhered to image sensor package; And make adhesive solidify (cured), wherein mirror head outer shell is mounted to and makes adhesive be positioned at the outside of ledge.
In the manufacture method of image sensor camera module, mirror head outer shell is adhered to image sensor package can be included in adhesive is coated to and mirror head outer shell be installed to image sensor package after the image sensor package.Mirror head outer shell is adhered to image sensor package can be included in and inject adhesive after mirror head outer shell is installed on the image sensor package between mirror head outer shell and image sensor package.
Mirror head outer shell can form the extension with the outside that surrounds image sensor package.
Adhesive can be coated to the bottom surface of extension, then mirror head outer shell can be installed.
Described method is injected adhesive after can further being included in and being installed to mirror head outer shell on the image sensor package between extension and printed circuit board (PCB).
The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, image sensor camera module of the present invention and manufacture method thereof have following advantage and beneficial effect at least:
According to the present invention owing to do not use lens barrel and do not carry out the focus adjustment process, so but implementation procedure simplify and automation process, save manufacturing cost whereby and obtain the focusing quality of homogeneous.
In addition, can prevent to use the foreign substance that produces in the normal image sensor camera module of lens barrel to produce image deflects, improve yield whereby.
Simultaneously, the IR edge filter is coated on the image sensor package, or the IR cut film is attached to image sensor package, even make burnt (flange back length behind flange, FBL) more in short-term, also can make camera model, reduce the height of camera model whereby.
In sum, the invention relates to a kind of image sensor camera module and manufacture method thereof.Image sensor camera module according to the present invention comprises: camera lens; Mirror head outer shell is equipped with this camera lens on it; Image sensor package, it is adhered to the part of the inboard of mirror head outer shell; And ledge, it is used to keep the gap between camera lens and the image sensor package, and wherein image sensor package is adhered to mirror head outer shell in the outside of ledge.According to the present invention owing to do not use lens barrel and do not carry out the focus adjustment process, so but implementation procedure simplify and automation process, save manufacturing cost whereby and obtain the focusing quality of homogeneous.In addition, can prevent that foreign substance from producing image deflects, improves yield whereby.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the sectional view according to the image sensor camera module of an one exemplary embodiment of the present invention.
Fig. 2 is the sectional view of the image sensor package used in the image sensor camera module of one exemplary embodiment according to the present invention.
Fig. 3 is the sectional view according to the image sensor camera module of another one exemplary embodiment of the present invention.
Fig. 4 is the sectional view of the image sensor package used in the image sensor camera module according to another one exemplary embodiment of the present invention.
Fig. 5 is according to the sectional view of the image sensor camera module of an one exemplary embodiment more of the present invention.
Fig. 6 is the flow chart of explanation according to the manufacture method of the image sensor camera module of an one exemplary embodiment of the present invention.
Fig. 7 is the sectional view of manufacture method of the image sensor camera module of explanation one exemplary embodiment according to the present invention to Figure 10.
Figure 11 is a sectional view according to the image sensor camera module of multiple modification of the present invention to Figure 13.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to image sensor camera module and its embodiment of manufacture method, structure, manufacture method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Hereinafter, will describe one exemplary embodiment of the present invention in detail referring to accompanying drawing.Yet, the embodiment that the invention is not restricted to hereinafter disclose, but can be embodied as multi-form.Only provide these embodiment for purposes of illustration and in order to make the those skilled in the art understand scope of the present invention fully.In the accompanying drawing, for the sake of clarity lavish praise on oneself the thickness in layer and zone, and used same reference numerals to represent similar elements in specification and the accompanying drawing.In addition, for example layer, zone, elements such as substrate or plate are placed on another element or the expression way of top not only indicates described element directly to be placed on another element or directly over situation, and indicate another element to be inserted in situation between described element and described another element.
Fig. 1 is the sectional view according to the image sensor camera module of an one exemplary embodiment of the present invention, and Fig. 2 is the sectional view of the image sensor package used in the image sensor camera module of one exemplary embodiment according to the present invention.
Consult illustrated in figures 1 and 2, comprise image sensor package 100, the printed circuit board (PCB) 200 of image sensor package 100 is installed and is adhered to the mirror head outer shell 300 of image sensor package 100 regularly according to the image sensor camera module of one exemplary embodiment of the present invention with glass substrate 110 and image sensor chip 120.
As shown in Figure 2, image sensor package 100 comprise glass substrate 110, optionally be formed at metal trace 111 on the side of glass substrate 110, be formed on the metal trace 111 to be electrically connected to the image sensor chip 120 of the metal trace 111 of glass substrate 110 with the passivation layer 112 of its isolation, by Solder Joint in Flip Chip 113, be connected to the splicing ear 114 (for example, soldered ball) of the metal trace 111 of glass substrate 110 with the outside at image sensor chip 120.Dust-seal layer 115 is formed between glass substrate 110 and the image sensor chip 120, is inserted in the space between glass substrate 110 and the image sensor chip 120 in order to prevent particulate.Can will be used for transmission or stop that the IR edge filter 130 of the light with specific wavelength band is coated in the opposite side of glass substrate 110.Replace in IR edge filter 130, the IR cut film can be attached to glass substrate 110.
Printed circuit board (PCB) 200 is electrically connected to image sensor package 100 by splicing ear 114, and above be printed with driving voltage and the electric current of circuit pattern to apply from the outside to image sensor package 100 supply whereby.Printed circuit board (PCB) 200 can comprise and can supply driving voltage and various types of printed circuit board (PCB)s of electric current, for example single or multiple lift printed circuit board (PCB), operplate printing circuit board and the flexible printed circuit board that applies from the outside to image sensor package 100.In addition, for example passive component (not shown) such as decoupling capacitor can be installed in the working region on the printed circuit board (PCB) 200, that is, and and in the zone except the zone that image sensor package 100 is installed.
Mirror head outer shell 300 comprises: horizontal component 310, and it is parallel to glass substrate 110 and is horizontally disposed with edge with part cover glass substrate 110; Extension 320, its outward flange from horizontal component 310 extends downwards to surround the outside of image sensor package 100; And camera lens placing portion 330, its inward flange from horizontal component 310 extends upward with above allowing camera lens 360 is placed in.Mirror head outer shell 300 can be formed by plastics with electro-magnetic screen function or metal material.
And camera lens placing portion 330 comprises from the inside outstanding camera lens support section 331 of its presumptive area level with from the inwardly outstanding camera lens standing part 332 of the upper horizontal of mirror head outer shell 300.Camera lens support section 331 can form and be coupled to mirror head outer shell 300 removably, and camera lens standing part 332 can integrally form with mirror head outer shell 300.In the case, camera lens 360 is fixed to camera lens standing part 332, and camera lens support section 331 is coupled to mirror head outer shell 300, makes camera lens 360 can be placed on the camera lens placing portion 330.Perhaps, camera lens support section 331 can integrally form with mirror head outer shell 300, and camera lens standing part 332 can form and is coupled to mirror head outer shell 300 removably.In the case, camera lens 360 is fixed to camera lens support section 331, and camera lens standing part 332 is coupled to mirror head outer shell 300, makes camera lens 360 can be placed on the camera lens placing portion 330.That is, any one in camera lens support section 331 and the camera lens standing part 332 and mirror head outer shell 300 integrally form, and another person forms and be coupled to mirror head outer shell 300 removably, make camera lens 360 can be placed on the camera lens placing portion 330.Herein, camera lens 360 can have planar edge and convex center part, or has planar edge and smooth core.Camera lens 360 can be made by glass or plastics.Number that can be by controls lens support section 331 and camera lens standing part 332 and position and a camera lens 360 or two or more camera lenses 360 (in some cases) are placed in the mirror head outer shell 300.When two or more camera lenses 360 are placed in the mirror head outer shell 300, distance piece (not shown) can be inserted between the camera lens 360, so that can keep gap between the camera lens 360.Simultaneously, camera lens 360 should be through design realizing highest resolution, and therefore should be taken into account the focal length between camera lens 360 and the image sensor chip 120 and be placed in the mirror head outer shell 300.For this reason, can when design camera lens 360, consider the length of camera lens placing portion 330 and the position of camera lens support section 331 and camera lens standing part 332.
Ledge 340 outstanding downwards and that separate with extension 320 further is set at the interior section place of horizontal component 310.For instance, ledge 340 can be outstanding downwards from the working region corresponding to the horizontal component 310 of camera lens placing portion 330.Ledge 340 contacts to keep the distance between image sensor chip 120 and the camera lens 360 with the end face of glass substrate 110.Therefore, consider the end face of image sensor chip 120 and the distance between the camera lens 360, can determine the length of ledge 340, or go back the position of scalable camera lens standing part 332.When ledge 340 is set, defining predetermined space between ledge 340 and the extension 320 and between glass substrate 110 and the horizontal component 310.Adhesive 350a is coated to described space.Therefore, mirror head outer shell 300 is adhered to glass substrate 110 by adhesive 350a.That is, in image sensor camera module according to the present invention, the horizontal component 310 of mirror head outer shell 300 is adhered to image sensor package 100 regularly.Adhesive 350a can comprise the commercial binder usually, for example, and by the hot setting adhesive or the UV cure adhesive of heat curing.The adhesive 350a that ledge 340 can prevent to be coated to glass substrate 110 is penetrated in the image-region between image sensor chip 120 and the camera lens 360.If adhesive 350a is penetrated in the image-region, then the image sensing fault may take place.Especially when adhesive 350a was coated to the bottom surface of ledge 340, adhesive 350a was penetrable in image-region.In addition, if the bottom surface that adhesive 350a is coated to ledge 340 then is difficult to accurately regulate the gap between image sensor chip 120 and the camera lens 360.Therefore, in the present invention, adhesive 350a is coated to space between ledge 340 and the extension 320.
Simultaneously, mirror head outer shell 300 can be adhered to printed circuit board (PCB) 200 to stop sidelight.As shown in Figure 3, with the bottom surface that adhesive 350b is coated to the extension 320 of mirror head outer shell 300, impel extension 320 to be adhered to printed circuit board (PCB) 200 regularly whereby.Preferred use and adhesive 350a identical materials are as adhesive 350b.
Specifically, adhesive 350a is coated on the glass substrate 110; Mirror head outer shell 300 is contacted with glass substrate 110; With adhesive 350b injection and be coated in the space between extension 320 and the printed circuit board (PCB) 200; And adhesive 350b is solidified, make mirror head outer shell 300 be adhered to glass substrate 110 and printed circuit board (PCB) 200 whereby.
Different therewith is, can after adhesive 350a and 350b are coated to glass substrate 110 and printed circuit board (PCB) 200 respectively mirror head outer shell 300 be adhered to glass substrate 110 and printed circuit board (PCB) 200 regularly.Perhaps, adhesive 350a can be coated to glass substrate 110 and after adhesive 350b being coated to the bottom surface of extension 320, mirror head outer shell 300 be adhered to glass substrate 110 and printed circuit board (PCB) 200 by flooding the bottom surface of this extension 320 in adhesion stage.
In image sensor camera module according to one exemplary embodiment mentioned above of the present invention, after being placed in camera lens 360 in the mirror head outer shell 300, mirror head outer shell 300 can be adhered to image sensor package 100 by adhesive 350a, or mirror head outer shell 300 can be adhered to image sensor package 100 and printed circuit board (PCB) 200 by adhesive 350a and 350b.In addition, owing to the gap that can accurately regulate by ledge 340 between image sensor chip 120 and the camera lens 360, so do not need to regulate separately the conventional process of the focal length between image sensor chip and the camera lens.Therefore, but implementation procedure automation and yield improve.
Simultaneously, as another one exemplary embodiment of the present invention, can use image sensor package shown in Figure 4 to come the image sensor camera module of shop drawings 5.Fig. 4 is the sectional view according to the image sensor package of another one exemplary embodiment of the present invention, and Fig. 5 is to use the sectional view of image sensor camera module of the image sensor package of Fig. 4.
Consult shown in Figure 4, according to the image sensor package of one exemplary embodiment of the present invention comprise glass substrate 110, optionally be formed at metal trace 111 on the side of glass substrate 110, be formed on the metal trace 111 with passivation layer 112 that metal trace 111 is isolated, be electrically connected to the image sensor chip 120 of the metal trace 111 of glass substrate 110 by Solder Joint in Flip Chip 113, and be installed in passive component 117 and a plurality of splicing ear 116 on the metal trace 111 in the outside of image sensor chip 120.Herein, passive component 117 comprises decoupling capacitor.And image sensor package further comprises the IR edge filter 130 on the opposite side that is coated in glass substrate 110.
Has configuration configuration much at one with image sensor package shown in Figure 2 according to the image sensor package of this one exemplary embodiment shown in Figure 4.Yet, image sensor package shown in Figure 4 has following configuration: constitute passive component 117 such as the needed for example decoupling capacitor of camera model and can be installed in together on the glass substrate 110, and be used for the splicing ear 116 that glass substrate 110 is connected to printed circuit board (PCB) is arranged on a surface of glass substrate 110.In the case, can not use printed circuit board (PCB).Therefore, as shown in Figure 5, adhesive 350a is coated to the opposite side of glass substrate 110, and glass substrate 110 is adhered to the extension 320 of mirror head outer shell 300 and the horizontal component 310 between the ledge 340, makes mirror head outer shell 300 be fixed to glass substrate 110.
Simultaneously, except one exemplary embodiment mentioned above, also can adopt multiple image sensor package.For instance, widely used COB, CSP or COF type image sensor package can be applicable to the present invention in the prior art.
Fig. 6 is the flow chart of explanation according to the manufacture method of the image sensor camera module of an one exemplary embodiment of the present invention, and Fig. 7 is the sectional view of manufacture method that the image sensor camera module of one exemplary embodiment according to the present invention is described to Figure 10.Consult Fig. 7 to shown in Figure 10, below will describe the manufacture method of the image sensor camera module of one exemplary embodiment according to the present invention.
At first, as shown in Figure 7, image sensor package 100 is installed to printed circuit board (PCB) 200 (S100).Image sensor package 100 comprises glass substrate 110, is electrically connected to the image sensor chip 120 of the metal trace on the side that is formed on glass substrate 110 by Solder Joint in Flip Chip, and is coated in the IR edge filter 130 on the opposite side of glass substrate 110.And printed circuit board (PCB) 200 is formed with circuit pattern (not shown), and for example passive component (not shown) such as decoupling capacitor can be installed in the working region on the printed circuit board (PCB) 200.Image sensor package 100 be electrically connected to the circuit pattern (not shown) of printed circuit board (PCB) 200 sensor package 100 splicing ear 114 (for example, soldered ball etc.) mode and be installed on the printed circuit board (PCB) 200.
Subsequently, as shown in Figure 8, adhesive 350a is coated to the end face of image sensor package 100, that is, and the edge of glass substrate 110 (S200).Adhesive 350a can be included in the hot setting adhesive that solidifies under the predetermined temperature or pass through the UV cure adhesive that UV solidifies.For instance, when using plastic lens, the adhesive that solidifies under 80 ℃ of temperature can be used as hot setting adhesive.Under the situation of glass lens, the adhesive that solidifies under 100 ℃ to 150 ℃ temperature can be used as hot setting adhesive.To understand, when using glass lens, the curing temperature of hot setting adhesive can increase.In the case, can reduce curing time.
As shown in Figure 9, preparation mirror head outer shell 300.Mirror head outer shell 300 comprises horizontal component 310, from extension 320 that the outward flange of horizontal component 310 extends downwards, from the upwardly extending camera lens placing portion 330 of the inward flange of horizontal component 310 with from the inboard outstanding downwards ledge 340 of horizontal component 310.Camera lens support section 331 and camera lens standing part 332 are arranged on camera lens placing portion 330 inboards, make camera lens 360 be placed between camera lens support section 331 and the camera lens standing part 332.At this moment, camera lens support section 331 can form and be coupled to mirror head outer shell 300 with removably, and camera lens standing part 332 can integrally form with mirror head outer shell 300.In the case, the mirror head outer shell 300 that can have the camera lens support section 331 that separates with it by upset is inserted into camera lens 360 in the camera lens standing part 332 and then camera lens support section 331 is coupled to mirror head outer shell 300 and camera lens 360 is fixed to mirror head outer shell 300.Perhaps, camera lens support section 331 can integrally form with mirror head outer shell 300, and camera lens standing part 332 can form and is coupled to mirror head outer shell 300 with removably.In the case, can separate with mirror head outer shell 300, camera lens 360 is inserted in the camera lens support section 331 also then camera lens standing part 332 is coupled to mirror head outer shell 300 and camera lens is fixed to mirror head outer shell 300 by making camera lens standing part 332.Herein, at least two camera lenses 360 can be placed in the mirror head outer shell 300, and distance piece (not shown) can be inserted between the camera lens 360, so as can to keep or controls lens 360 between the gap.In addition, mirror head outer shell 300 is mounted to the space orientation that makes between ledge 340 and the extension 320 and is being coated on the adhesive 350a of glass substrate 110 (S300).
Subsequently, as shown in figure 10, make adhesive 350a solidify (S400).At this moment, when using hot setting adhesive as adhesive 350a, when using anchor clamps pressure to be applied to the end face (being preferably camera lens standing part 332) of mirror head outer shell 300, adhesive 350a solidifies under predetermined temperature in baking box.Simultaneously, when using the UV adhesive, when pressure is applied to the end face of mirror head outer shell 300, solidify by make adhesive 350a with UV rayed adhesive 350a as adhesive 350a.
Subsequently, be furnished with in the above under the situation of printed circuit board (PCB) 200 of a plurality of individual elements, printed circuit board (PCB) 200 is separated into individual elements (S500).Described separation can be carried out by punching press (punching) method, sawing method or laser cutting method.Simultaneously, when at corresponding individual elements implementation, do not carry out described separation process.
Simultaneously, in this one exemplary embodiment, after only being coated in adhesive 350a on the glass substrate 110, glass substrate 110 is installed and be adhered to mirror head outer shell 300.Yet, can be by mirror head outer shell 300 be installed on the glass substrate 110, and then mirror head outer shell 300 be positioned ledge 340 and extension 320 between glass substrate 110 between inject adhesive 350a, and mirror head outer shell is adhered to glass substrate.Perhaps, mirror head outer shell 300 can also be adhered to printed circuit board (PCB) 200 except that glass substrate 110.In the case, mirror head outer shell 300 can be adhered to glass substrate 110 and printed circuit board (PCB) 200 with following mode: adhesive 350a is coated to glass substrate 110, horizontal component 310 is contacted with glass substrate 110, and then adhesive 350a is injected between extension 320 and the printed circuit board (PCB) 200 and curing.Perhaps, adhesive is coated to glass substrate 110 and printed circuit board (PCB) 200 respectively, and then mirror head outer shell 300 can be adhered to regularly glass substrate 110 and printed circuit board (PCB) 200.Perhaps, mirror head outer shell 300 can be adhered to glass substrate 110 and printed circuit board (PCB) 200 with following mode: adhesive 350a is coated to glass substrate 110, and adhesive is coated to the bottom surface of this extension 320 by flooding the bottom surface of this extension 320 in adhesion stage.
Simultaneously, the present invention also can carry out different modifications except that one exemplary embodiment.As shown in figure 11, remove the extension, and mirror head outer shell 300 only possess horizontal component 310 and camera lens placing portion 330 from mirror head outer shell 300.Camera model is inserted in the rectangular hexahedron socket 400 with open top, and can covers radome 500, make the top of camera model be open and a side of socket 400 besieged.
And as shown in figure 12, mirror head outer shell 300 can be through revising for example to surround passive component 117 such as decoupling capacitor.That is, thus mirror head outer shell 300 can be through revising so that extension 320 also surrounds passive component by extending level part 310 in the horizontal direction.At this moment, when the height of passive component 117 was lower than the height of image sensor package 100, the bottom part of horizontal component 310 can partly be given prominence to.
As shown in figure 13, can not use the ledge of mirror head outer shell 300 and be to use camera lens 360 to keep distance between image sensor chip 120 and the camera lens 360.For this reason, by when forming the injection-molded process, forming from the outstanding downwards ledge 340a of camera lens 360, fixed lens 360, and impel mirror head outer shell 300 to be adhered to the top of glass substrate 110, can allow to keep distance between image sensor chip 120 and the camera lens 360 from camera lens 360 outstanding ledge 340a.At this moment, the length that can regulate ledge 340a according to the distance between image sensor chip 120 and the camera lens 360.
In image sensor camera module according to the present invention, the mirror head outer shell that camera lens is installed is adhered to image sensor package.And, be provided for keeping the ledge of the distance between camera lens and the image sensor package.Image sensor package and mirror head outer shell are adhered to the outside of ledge, and ledge prevents that the adhesive that is used for allowing image sensor package to be adhered to mirror head outer shell is penetrated into image-region.In addition, the IR filter can append to the end face of image sensor package.
According to the present invention owing to do not use lens barrel and do not carry out the focus adjustment process, so but implementation procedure simplify and automation process, save manufacturing cost whereby and obtain the focusing quality of homogeneous.
In addition, can prevent to use the foreign substance that produces in the normal image sensor camera module of lens barrel to produce image deflects, improve yield whereby.
Simultaneously, the IR edge filter is coated on the image sensor package, or the IR cut film is attached to image sensor package, even make burnt (flange back length behind flange, FBL) more in short-term, also can make camera model, reduce the height of camera model whereby.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.

Claims (16)

1. image sensor camera module is characterized in that it comprises:
Camera lens;
Mirror head outer shell is installed described camera lens on it;
Image sensor package, it is adhered to the part of the inboard of described mirror head outer shell; And
Ledge, it is used to keep the gap between described camera lens and the described image sensor package,
Wherein said image sensor package is adhered to described mirror head outer shell in the outside of described ledge.
2. image sensor camera module according to claim 1 is characterized in that, described mirror head outer shell comprises parallel with described image sensor package and the horizontal component location; And extend upward to allow that described camera lens is settled superincumbent camera lens placing portion from the inward flange of described horizontal component.
3. image sensor camera module according to claim 2 is characterized in that, described mirror head outer shell further comprises the extension of extending from the outward flange of described horizontal component downwards.
4. image sensor camera module according to claim 2 is characterized in that, described ledge extends downwards from the inboard of described horizontal component.
5. image sensor camera module according to claim 1 is characterized in that described ledge extends from described camera lens downwards.
6. image sensor camera module according to claim 3 is characterized in that it is equipped with the printed circuit board (PCB) of described image sensor package above further comprising.
7. image sensor camera module according to claim 6 is characterized in that the bottom surface of described extension further is adhered to described top surface of printed circuit board.
8. image sensor camera module according to claim 4 is characterized in that it further comprises the passive device in the working region that is arranged on the described printed circuit board (PCB).
9. image sensor camera module according to claim 1 is characterized in that described image sensor package comprises image sensor chip; And be electrically connected to described image sensor chip and be arranged on glass substrate on the described image sensor chip.
10. image sensor camera module according to claim 9 is characterized in that it further comprises the IR edge filter that is coated on the described glass substrate or attached to the IR film on the described glass substrate.
11. the manufacture method of an image sensor camera module is characterized in that it may further comprise the steps:
Image sensor package is installed on the printed circuit board (PCB);
Use adhesive that mirror head outer shell is adhered to described image sensor package; And
Described adhesive is solidified,
Wherein said mirror head outer shell is mounted to and makes described adhesive be positioned at the outside of ledge.
12. manufacture method according to claim 11, it is characterized in that, described mirror head outer shell is adhered to described image sensor package is included in described adhesive is coated to and described mirror head outer shell is installed to described image sensor package after the described image sensor package.
13. manufacture method according to claim 11, it is characterized in that, described mirror head outer shell is adhered to described image sensor package is included in and between described mirror head outer shell and described image sensor package, injects described adhesive after described mirror head outer shell is installed on the described image sensor package.
14. manufacture method according to claim 11 is characterized in that, described mirror head outer shell is formed the extension with the outside that surrounds described image sensor package.
15. manufacture method according to claim 14 is characterized in that, adhesive is coated to the bottom surface of described extension, and described mirror head outer shell then is installed.
16. manufacture method according to claim 14 is characterized in that it further is included in to inject adhesive after described mirror head outer shell is installed on the described image sensor package between described extension and described printed circuit board (PCB).
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TW201023640A (en) 2010-06-16

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