KR101159807B1 - Chip Scale Package of Image Sensor and Manufacturing Method Thereof - Google Patents

Chip Scale Package of Image Sensor and Manufacturing Method Thereof Download PDF

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Publication number
KR101159807B1
KR101159807B1 KR1020100043115A KR20100043115A KR101159807B1 KR 101159807 B1 KR101159807 B1 KR 101159807B1 KR 1020100043115 A KR1020100043115 A KR 1020100043115A KR 20100043115 A KR20100043115 A KR 20100043115A KR 101159807 B1 KR101159807 B1 KR 101159807B1
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South Korea
Prior art keywords
printed circuit
circuit board
image sensor
mold layer
support mold
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KR1020100043115A
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Korean (ko)
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KR20110123567A (en
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조재원
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(주) 엔지온
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Priority to KR1020100043115A priority Critical patent/KR101159807B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

The present invention relates to an image sensor package and a method of manufacturing the same, wherein by curing a liquid synthetic resin to form a support mold layer on a printed circuit board, the image sensor chip can be directly mounted on the printed circuit board, and accordingly a ceramic mold This eliminates the need for a further miniaturization, reduces manufacturing processes and manufacturing costs, and simultaneously forms a supporting mold layer on a printed circuit board module in which unit printed circuit boards are continuously formed, thereby providing a printed circuit board module based on a unit printed circuit board. By cutting a process, a plurality of image sensor packages can be manufactured at the same time, thereby providing an image sensor package and a method of fabricating the same.

Description

Chip Scale Package of Image Sensor and Manufacturing Method Thereof}

The present invention relates to an image sensor package and a manufacturing method thereof. More specifically, by curing the liquid synthetic resin to form a support mold layer on the printed circuit board, the image sensor chip can be directly mounted on the printed circuit board, thereby eliminating the need for a ceramic mold, which makes it possible to further reduce the size. Process and manufacturing costs are reduced, and a plurality of image sensors are formed by cutting a printed circuit board module based on a unit printed circuit board by simultaneously forming a supporting mold layer on a printed circuit board module in which unit printed circuit boards are continuously formed. The present invention relates to an image sensor package and a method of manufacturing the same, which can produce the package at the same time, thereby improving productivity.

In general, an image sensor is a semiconductor device, which is called a solid-state imaging device (CCD) or CMOS image sensor (CIS). An image sensor uses a photoelectric conversion device and a charge-coupled device to capture an object and electrically It means a device that outputs a signal, and is used in a wide variety of applications such as public welfare, industrial, broadcasting, and military. Recently, it is widely used in cameras, camcorders, multimedia, personal computers and surveillance cameras, and the demand is exploding.

Such an image sensor is manufactured and used in a package form, and a package means a form sealed with a plastic resin or ceramic so that an integrated circuit chip designed with a microcircuit can be mounted and used in an actual electronic device. Since a package generally has a much larger size than an integrated circuit chip embedded therein, miniaturization of the package size to a chip size is constantly being studied.

1 is a view schematically showing the structure of a conventional image sensor package according to the prior art.

As a general image sensor package, a ceramic package using ceramics is mainly used, and as shown in FIG. 1, the image sensor chip 20 is mounted on a ceramic mold 10 having a pattern circuit and then bonded through a bonding wire (W). The transparent glass cover 40 is sealingly coupled to the upper portion of the image sensor chip 20. The transparent glass cover 40 is disposed to be spaced upward from the image sensor chip 20 due to the characteristics of the image sensor so that the cavity C is formed therein. For this purpose, the ceramic mold 10 has an edge circumferential portion 12. It is formed in the form of protruding upwards, and the transparent glass cover 40 is configured to be sealingly coupled thereto. Meanwhile, a separate contact pin 11 is mounted on the lower end of the ceramic mold 10 for electrical connection with an external electronic device.

The image sensor package having a general ceramic shape configured as described above has a problem in that its application range is limited because the overall shape of the ceramic mold 10 and the overall size of the package are relatively large. In addition, the manufacturing of the ceramic mold 10 is not easy, and a manufacturing process such as a wire bonding process or a sealing bonding process of the transparent glass cover is complicated, and thus there is a problem such as an increase in manufacturing time and manufacturing cost.

The present invention has been invented to solve the problems of the prior art, and an object of the present invention is to form a support mold layer on a printed circuit board by curing a liquid synthetic resin to mount an image sensor chip directly on the printed circuit board. It is possible to provide a miniaturized image sensor package and a manufacturing method by eliminating the need for ceramic molds.

Another object of the present invention is to form a support mold layer in such a manner as to cure a liquid synthetic resin and to easily seal the protective cover to the support mold layer through this, so that the horizontal state of the protective cover is automatically aligned and the manufacturing process is easy. In addition to reducing manufacturing costs, the present invention provides an image sensor package and a manufacturing method which are structurally stable and thus improve durability.

Yet another object of the present invention is to form a plurality of image sensor packages through a process of cutting a printed circuit board module based on a unit printed circuit board by simultaneously forming a support mold layer on a printed circuit board module in which a unit printed circuit board is continuously formed. It can be produced at the same time to provide an image sensor package manufacturing method that improves productivity.

The present invention, a printed circuit board; An image sensor chip mounted on the printed circuit board and bonded to the wire by bonding; A protection dam formed along an edge of an upper surface of the image sensor chip; A protective cover disposed upwardly spaced from the image sensor chip; And a support mold layer formed to surround an outer circumference of the image sensor chip along the protection dam, and the protection cover is coupled to and supported by an upper end to seal the cavity between the protection cover and the image sensor chip. The support mold layer provides an image sensor package, wherein a liquid synthetic resin is cured by a curing process after being supplied to the printed circuit board.

In this case, the support mold layer may be formed by an epoxy resin.

In addition, the support mold layer may be formed to surround all the bonding wires for wire bonding and bonding the image sensor chip to the printed circuit board.

On the other hand, the present invention, a preparatory step of preparing a printed circuit board module in which a plurality of unit printed circuit boards are continuously formed on one panel; A bonding step in which an image sensor chip is mounted on each unit printed circuit board of the printed circuit board module and wire bonded to each other; A protection dam forming step of forming a protection dam around an edge of an upper surface of the image sensor chip; A support mold layer forming step of forming a support mold layer on the printed circuit board module to surround the outer periphery of each of the image sensor chips along the protection dam; A protective cover that covers all of the plurality of unit printed circuit boards may be mounted on an upper end of the support mold layer, and then the sealing cover and the support mold layer may be sealed to form a cavity between the protection cover and the image sensor chip. To combine the cover; And a cutting step of cutting the combination of the printed circuit board module and the protective cover coupled by the support mold layer based on the unit printed circuit board, respectively.

In this case, the forming of the support mold layer may include supplying a liquid synthetic resin to the printed circuit board module within a limit in which a supply region is limited by the protection dam; And a primary curing step of curing the liquid synthetic resin supplied to the printed circuit board module into a solid phase through a primary curing process to form the support mold layer.

In addition, the cover coupling step may be a mounting step of mounting the protective cover on the upper end of the support mold layer; And a second curing step of sealing the bonding of the protective cover and the support mold layer while sequentially changing the state of the support mold layer from the solid phase to the liquid phase and then from the liquid phase to the solid phase through a secondary curing process. have.

The image sensor package manufacturing method may further include an outer dam forming step of forming an outer dam along a circumference of the printed circuit board module.

The image sensor package manufacturing method may further include forming a unit outer dam along the periphery of each edge of the unit printed circuit board, and the supplying step may be performed in each area of the unit outer dam. It can be configured to distribute and supply each of the liquid synthetic resin by the same amount.

According to the present invention, by forming a support mold layer on a printed circuit board by curing the liquid synthetic resin, the image sensor chip can be directly mounted on the printed circuit board, thus eliminating the need for a ceramic mold, thereby further miniaturizing the image sensor package. It can work.

In addition, by forming the support mold layer by curing the synthetic resin in the liquid and easily sealing bonding the protective cover to the support mold layer through this, the manufacturing process is not only easy to reduce the manufacturing cost, but also structurally stable and durable There is an effect that can be improved.

In addition, by simultaneously forming a support mold layer on a printed circuit board module in which the unit printed circuit board is continuously formed, a plurality of image sensor packages can be simultaneously manufactured by cutting the printed circuit board module based on the unit printed circuit board. There is an effect that can improve the productivity.

1 is a cross-sectional view showing a schematic configuration of a conventional image sensor package according to the prior art,
2 is a cross-sectional view showing a schematic configuration of an image sensor package according to an embodiment of the present invention;
3 is an operation flowchart showing a manufacturing method of an image sensor package according to an embodiment of the present invention;
4 is a plan view conceptually showing the manufacturing step shape of the image sensor package according to an embodiment of the present invention;
5 is a cross-sectional view conceptually illustrating a shape of a manufacturing step of the image sensor package according to an embodiment of the present invention;
6 and 7 are a plan view and a cross-sectional view conceptually showing the manufacturing step shape of the image sensor package according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

2 is a cross-sectional view showing a schematic configuration of an image sensor package according to an embodiment of the present invention.

The image sensor package according to an embodiment of the present invention is a chip scale package in which the size of the package is reduced to a chip size, and includes a printed circuit board 100, an image sensor chip 200, and a protection dam ( 300, a protective cover 400, and a support mold layer 500.

The image sensor chip 200 is mounted and bonded to the printed circuit board 100 by wire bonding, and the substrate pad 120 is formed on the upper surface of the printed circuit board 100 for the wire bonding bonding. In addition, a separate contact pin 110 is mounted on the bottom surface of the printed circuit board 100 so that the image sensor package may be mounted and used in an external electronic device.

The image sensor chip 200 is a semiconductor device for photographing a subject by using a photoelectric conversion device and a charge coupling device and outputting it as an electrical signal. The image sensor chip 200 is mounted on the printed circuit board 100 and wire-bonded through a bonding wire (W). Are bonded. In this case, the chip pad 210 is formed on the image sensor chip 200 to bond the wire, and the bonding wire W is bonded to the chip pad 210 and the substrate pad 120. ) Is wire bonded to the printed circuit board 100.

A separate protection dam 300 is formed around the top edge of the image sensor chip 200 to guide a supply region of the support mold layer 500 to be described later. The protection dam 300 is preferably formed at an outer periphery of the sensitive area so that the sensitive area (not shown) formed at the center of the image sensor chip 200 may be exposed to light. The support mold layer 500 formed in the outer region may be formed without interference with light and the sensitive region of the image sensor chip 200.

The protective cover 400 is sealingly coupled to the upper end of the support mold layer 500 and disposed to be spaced upward from the upper surface of the image sensor chip 200, thereby hollowing between the image sensor chip 200 and the protective cover 400. The cavity C is configured to seal. The protective cover 400 may be formed to prevent the inflow of foreign matters and moisture to the image sensor chip 200 and to allow light to pass therethrough, for example, in the form of a transparent glass panel coated with infrared rays.

The support mold layer 500 is formed to surround the outer periphery of the image sensor chip 200 along the protection dam 300, and the protection cover 400 is sealedly coupled to the upper end of the protection cover 400 as described above. The cavity C is sealed between the image sensor chip 200 and the image sensor chip 200. The support mold layer 500 is formed in such a manner that the liquid synthetic resin is cured by a curing process according to an embodiment of the present invention.

In more detail, as shown in FIG. 2, a liquid synthetic resin is formed on the outer printed circuit board 100 of the image sensor chip 200 while the image sensor chip 200 is wire bonded to the printed circuit board 100. When supplied on the), the liquid synthetic resin is filled up to the height of the upper surface of the image sensor chip 200, and then the inflow into the center direction is prevented by the protection dam 300 formed on the image sensor chip 200. At this time, the height of the protection dam 300 may be formed to be the same height as the height of the support mold layer 500, otherwise it may be formed lower than the height of the support mold layer 500, as shown in FIG. . This is because the liquid synthetic resin may be formed higher than the protection dam 300 by the surface tension. As such, when the liquid synthetic resin is supplied to the outer periphery of the image sensor chip 200 by the protection dam 300, the support resin layer 500 may be cured by curing the liquid synthetic resin through a curing process in this state. ) Is formed. After the protective cover 400 is seated on the upper end of the support mold layer 500, the image sensor package is manufactured by sealing bonding. At this time, the sealing coupling method of the support mold layer 500 and the protective cover 400 may be configured in various forms, such as using a separate adhesive, according to an embodiment of the present invention 2 Through the secondary curing process, the support mold layer 500 and the protective cover 400 may be sealed and coupled, and a detailed description of such a manufacturing process will be described later.

Meanwhile, the liquid synthetic resin may use an epoxy resin having excellent adhesion according to an embodiment of the present invention, and the support mold layer 500 formed through the liquid synthetic resin may print the image sensor chip 200 on a printed circuit. The substrate 100 may be formed in a form to surround all of the bonding wires W for wire bonding bonding. Therefore, as described above, the protection dam 300 is located outward from the center of the sensitive area of the image sensor chip 200 and at the same time as the center of the protection dam 300 rather than the position of the chip pad 210 for wire bonding of the image sensor chip 200. In this state, the liquid synthetic resin supplied for the formation of the support mold layer 500 is preferably supplied at a height enough to cover all the bonding wires W. According to this structure, the bonding wires W are disposed in a form embedded in the support mold layer 500 during the process of curing the liquid synthetic resin, whereby the bonding wires W are formed by the support mold layer 500. In addition to being protected from the outside, the bonding force to the chip pad 210 and the substrate pad 120 may be further strengthened. Therefore, even if an impact from the outside, the wire bonding bonding force to the image sensor chip 200 is strengthened, thereby preventing damage and enhancing durability.

According to such a structure, the image sensor package according to an embodiment of the present invention, unlike the prior art, may be configured by mounting the image sensor chip 200 directly on the printed circuit board 100 without using a separate ceramic mold. Therefore, it is possible to reduce the production cost by eliminating the need for ceramic molds, and to simplify the manufacturing process, thereby greatly improving productivity. In addition, by forming the support mold layer 500 in such a manner that the liquid synthetic resin is cured without using a complicated and large ceramic mold to form the internal cavity, the size of the package is reduced to the size of the printed circuit board 100. In addition, the sealing coupling method of the protective cover 400 is also easy to reduce the manufacturing process and manufacturing cost is a structure.

The present invention also provides a manufacturing method of the image sensor package described above, and looks at the image sensor package manufacturing method as follows.

3 is an operation flowchart illustrating a manufacturing method of an image sensor package according to an embodiment of the present invention, and FIGS. 4 and 5 are plan views conceptually illustrating shapes of manufacturing steps of the image sensor package according to an embodiment of the present invention. And cross section.

As described above, the image sensor package according to an embodiment of the present invention mounts the image sensor chip 200 on one printed circuit board 100 to combine the support mold layer 500 and the protective cover 400. It can be produced one by one, otherwise it can be configured in a manner to produce a plurality of image sensor packages at the same time, will be described below with respect to this.

In order to simultaneously manufacture a plurality of image sensor packages, first, a printed circuit board module P having a plurality of unit printed circuit boards 100 continuously formed on one panel is prepared (S1). As shown in (a) of FIG. 4, the printed circuit board module P is regularly arranged such that the unit printed circuit board 100 contacts and aligns with each other. The unit printed circuit board 100 arranged as described above is disposed. An edge portion P1 is formed around the outer edge of the edge. The edge P1 is cut off in the final manufacturing process.

Each unit printed circuit board 100 formed on the printed circuit board module P is mounted with an image sensor chip 200 and wire bonded to each other as shown in FIG. 4B (S2). Accordingly, the substrate pad 120 is formed on each unit printed circuit board 100 so that the bonding wires W can be bonded to each other, and the chip pad 210 is formed on the image sensor chip 200.

After the wire bonding of the image sensor chip 200 to each unit printed circuit board 100 as described above, the above-described protection dam 300 is formed along the periphery of the upper edge of each image sensor chip 200 (S3). . The process of forming the protection dam 300 may be performed after the wire bonding bonding of the image sensor chip 200 to the unit printed circuit board 100. Alternatively, the protection dam 300 may be formed before the wire bonding bonding of the image sensor chip 200. After forming 300, the method may be performed by wire bonding. At this time, the protection dam 300 is preferably formed to be located outside the sensitive area of the image sensor chip 200 and located inside the chip pad 210 as described above.

Subsequently, in the state in which the protection dam 300 is formed on the image sensor chip 200 and the image sensor chip 200 is wire bonded to the unit printed circuit board 100, each of the image sensors along the protection dam 300. A support mold layer 500 is formed on the printed circuit board module P to surround the outer circumference of the chip 200 (S6). At this time, the method of forming the support mold layer 500 is a supply step (S6-1) for supplying a liquid synthetic resin to the printed circuit board module (P) within the limit that the supply region is limited by the protection dam 300. And a primary curing step of forming the support mold layer 500 by curing the liquid synthetic resin into a solid phase through a primary curing process in a state where the liquid synthetic resin is supplied to the printed circuit board module (P) ( S6-2). That is, when the liquid synthetic resin is supplied onto the printed circuit board module P of the outer portion of the protection dam 300, the liquid synthetic resin is shown in each image sensor chip 200 as shown in FIG. The supply is limited to the inner region by the protection dam 300 formed in the) and is supplied to the entire outer region. As such, the liquid synthetic resin supplied to the entire area of the printed circuit board module P, except for the inner area of the protection dam 300, is cured in such a state and is formed of the support mold layer 500, which is printed on each unit. Each of the supporting mold layers 500 for the circuit board 100 may function. In this case, as long as the printed circuit board module P is disposed in a horizontal state, the liquid resin may be evenly disposed in a horizontal state in the entire area of the printed circuit board module P except for the protection dam 300. When the synthetic resin of the cured and formed into the support mold layer 500, the height of the support mold layer 500 in each unit printed circuit board 100 are all formed in the same state in a horizontal state.

On the other hand, according to the process of forming the support mold layer 500, the liquid synthetic resin is limited to supply by the protection dam 300 and the support mold layer 500 is formed outside the protection dam 300, wherein, In order to prevent the synthetic resin from leaking out from the area of the printed circuit board module P, a separate outer dam along the circumference of the edge P1 of the printed circuit board module P is shown as shown in FIG. It is preferable to form 600 (S4). Therefore, the liquid synthetic resin supplied to the printed circuit board module P is uniformly supplied to the entire region except the protection dam 300 in a state where external leakage is prevented by the outer dam 600. In this case, the outer dam 600 may be finished by cutting and removing the edge dam P1 of the printed circuit board module P together in the cutting step S8 to be described later.

When the support mold layer 500 is formed as described above, the protective cover 400, which may cover all of the plurality of unit printed circuit boards 100, is mounted on the upper end of the support mold layer 500, and then the protective cover 400 is provided. The protective cover 400 and the support mold layer 500 are hermetically sealed to form a cavity C between the image sensor chip 200 and the image sensor chip 200 (S7). The sealing coupling method of the protective cover 400 and the support mold layer 500 may be configured in a variety of ways, such as by using an adhesive, as described above, according to an embodiment of the present invention for the support mold layer 500 Through a secondary curing process it can be configured in such a way to change the state sequentially from the liquid phase to the solid phase from the solid phase to the liquid phase. That is, the cover bonding step (S7) for sealingly coupling the protective cover 400 to the upper end of the support mold layer 500, mounting step (S7-1) for mounting the protective cover 400 to the upper end of the support mold layer 500 And the protective cover 400 and the support mold layer 500 are sealingly bonded in the process of changing the state while sequentially changing the state of the support mold layer 500 from the solid phase to the liquid phase through the secondary curing process. It may be configured to include a secondary curing step (S7-2) to be.

When the printed circuit board module P and the protective cover 400 are coupled by the support mold layer 500 through these processes, the combinations are respectively shown in FIG. 4C based on the unit printed circuit board 100. Cut along the cutting line (L) shown by the dotted line (S8). That is, as shown in (a) of FIG. 5, a plurality of unit image sensor packages are simultaneously formed through the above-described processes, which are illustrated in (a) of FIG. 5 based on each unit printed circuit board 100. When cutting along the cutting line (L), as shown in Figure 5 (b) is cut into each one image sensor package is completed production.

Therefore, in the image sensor package manufacturing method according to an embodiment of the present invention, a plurality of unit printed circuit boards 100 may be formed without forming a support mold layer 500 for each image sensor package, without coupling the protective cover 400, respectively. By forming the support mold layer 500 at the same time through the formed printed circuit board module (P) to combine one integral protective cover 400 and then cut into a plurality of image sensor packages, respectively, the manufacturing process is very simplified The manufacturing of two image sensor packages can be performed very quickly, and the characteristics of each image sensor package can be formed relatively uniformly to ensure stability of quality.

For example, the liquid crystal resin for the method of manufacturing the image sensor package described above using an epoxy resin will be described. First, the printed circuit board module P having the unit printed circuit board 100 continuously formed is prepared ( S1), the image sensor chip 200 is mounted on each unit printed circuit board 100 and wire bonded (S2). While forming the protection dam 300 on the upper surface of the image sensor chip 200 (S3), the outer dam 600 is formed along the circumference of the printed circuit board module (P) (S4). In this way, the liquid epoxy resin is supplied to the printed circuit board module P in a state in which the protection dam 300 and the outer dam 600 are formed, and the liquid epoxy resin is cured to a solid state through the first curing process. The mold layer 500 is formed (S6). Thereafter, the protective cover 400 is mounted on the upper end of the support mold layer 500, and the protective cover 400 and the support mold layer 500 are hermetically coupled through the second curing process (S7). Through this process, the combined body is cut based on the unit printed circuit board 100 (S8) to simultaneously generate a plurality of image sensor packages.

Here, the curing process is a process of applying heat to the synthetic resin of the liquid for a predetermined time, the liquid synthetic resin is generally cured to a solid phase through such a curing process, the first curing according to an embodiment of the present invention The process is a process of curing the solid resin by applying heat to the synthetic resin in the liquid phase, the second curing process is changed to a liquid phase by applying heat to the support mold layer 500 changed into a solid phase through the first curing process It is a process to change. The primary curing and the secondary curing process can be carried out in various ways depending on the type of synthetic resin and the conditions of use, and generally corresponding to the process widely used in connection with the synthetic resin, detailed description thereof will be omitted. do. However, when looking at the epoxy resin according to an embodiment of the present invention, the first curing process proceeds by heating the liquid epoxy resin to about 80 ℃ to cure in a solid phase, the second curing process is 1 The secondary curing process may be performed by heating the cured epoxy resin to about 120 ° C. The secondary curing process is performed so that the epoxy resin cured through the primary curing process, that is, the support mold layer 500 changes from a solid phase to a liquid phase, and then hardens to a solid phase again. As described above, in the process of changing the support mold layer 500 from the solid phase to the liquid phase, the support mold layer 500 and the protective cover 400 are sealed by the adhesive force of the epoxy resin. That is, after the protective cover 400 is mounted on the upper end of the support mold layer 500 cured into a solid state through the primary curing process, the support mold layer 500 is in the liquid phase through the secondary curing process in this state. In the process of changing to a state, the support mold layer 500 and the protective cover 400 are bonded and bonded to each other, and the support mold layer 500 is changed into a solid state in the sealed state.

On the other hand, the support mold layer 500 may be a case where the upper surface is irregularly formed in the process of curing the liquid epoxy resin into a solid phase through the first curing process or fail to achieve a horizontal state by a specific condition, In this case, the horizontal state of the protective cover 400 mounted on the upper end of the support mold layer 500 may not be maintained accurately. However, in the image sensor package according to the exemplary embodiment of the present invention, since the support mold layer 500 is changed into a liquid phase through a second curing process, the support mold layer 500 may be horizontal in this process. In this state, since the protective cover 400 remains in a state of being seated on the upper end of the support mold layer 500, the horizontal state of the protective cover 400 is automatically aligned and sealingly coupled with the support mold layer 500. do. According to this process, the image sensor according to the exemplary embodiment of the present invention may be manufactured in a relatively accurate dimension and shape without performing a separate leveling work or horizontal work on the protective cover 400.

6 and 7 are a plan view and a cross-sectional view conceptually showing the manufacturing step shape of the image sensor package according to another embodiment of the present invention.

6 and 7 is a method of manufacturing an image sensor package according to another embodiment of the present invention to form an outer dam 600 on the edge portion (P1) of the printed circuit board module (P), unlike the method described above Instead, as shown in (b) of FIG. 6, a unit outer dam forming step (S5) is formed to form unit outer dams 700 along the periphery of each unit printed circuit board 100, respectively. do. That is, the liquid resin is not configured to be simultaneously supplied to the entire area of the printed circuit board module P except the protection dam 300, but the liquid resin is independently supplied to each unit printed circuit board 100. It consists of. At this time, the supply step (S6-1) for supplying the liquid synthetic resin to the printed circuit board module (P) is configured to distribute and supply the liquid synthetic resin in the same amount to each of the inner area of the unit outer dam 700, respectively. . Accordingly, since the same amount of the synthetic resin is supplied to the inner region of each unit outside dam 700, the same type and support mold layers 500 are formed, respectively, so that the unit printed circuit board ( 100) The protective cover 400 which can cover all is sealed to the support mold layer 500 to be cut along the unit printed circuit board 100, respectively. At this time, the cutting line (L) is formed to pass through the center of the unit outer dam 700, as shown in Figure 7 (a), each of the image sensor package includes a portion of the unit outer dam 700 Although not shown, the unit outer dam 700 may be formed in each image sensor package as shown in FIG. 7B so as to be cut along both sides of the unit outer dam 700. It may be configured not to be included. All other configurations are performed in the same manner as described above, and thus descriptions thereof will be omitted here for the purpose of avoiding duplication of description.

Such a manufacturing method may be independently controlled for each unit printed circuit board 100 in the process of forming the supporting mold layer 500, and may be more advantageous than controlling the entire area of the printed circuit board module P integrally. In particular, since the area for supplying the liquid synthetic resin is separated by each unit dam 700 and formed relatively narrow, the supply state of the liquid synthetic resin in each supply region can be made more accurately, As a result, a horizontal unstable state such as the supply state of the liquid synthetic resin is biased in one direction can be prevented.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

100: printed circuit board 200: image sensor chip
300: protective dam 400: protective cover
500: support mold layer 600: outer dam
700: unit dam outside P: printed circuit board module

Claims (8)

delete delete delete Preparing a printed circuit board module in which a plurality of unit printed circuit boards are repeatedly formed on one panel;
A bonding step in which an image sensor chip is mounted on each unit printed circuit board of the printed circuit board module and wire bonded to each other;
A protection dam forming step of forming a protection dam around an edge of an upper surface of the image sensor chip;
A support mold layer forming step of forming a support mold layer on the printed circuit board module to surround the outer periphery of each of the image sensor chips along the protection dam;
A protective cover that covers all of the plurality of unit printed circuit boards may be mounted on an upper end of the support mold layer, and then the sealing cover and the support mold layer may be sealed to form a cavity between the protection cover and the image sensor chip. Making a cover coupling step; And
Cutting step of cutting the combination of the printed circuit board module and the protective cover bonded by the support mold layer based on the unit printed circuit board, respectively
Including,
The supporting mold layer forming step
A supply step of supplying a liquid synthetic resin to the printed circuit board module within a limit in which a supply region is limited by the protection dam; And
Primary curing step of curing the liquid synthetic resin supplied to the printed circuit board module to a solid phase through a primary curing process to form the support mold layer
Including,
The cover coupling step
A mounting step of mounting the protective cover on an upper end of the support mold layer; And
Secondary curing to align the horizontal state of the protective cover while sequentially changing the state of the support mold layer from the solid phase to the liquid phase through the secondary curing process, and the protective cover and the support mold layer sealingly bonded Ring steps
Image sensor package manufacturing method comprising a.
delete delete The method of claim 4, wherein
The method of claim 1, further comprising an outer dam forming step of forming an outer dam along the circumference of the printed circuit board module.
The method of claim 4, wherein
The method may further include forming a unit outer dam along the periphery of each unit printed circuit board.
The supplying step of the image sensor package manufacturing method, characterized in that for supplying each of the synthetic resin of the liquid distribution in the same amount to each of the unit outer dam inner region.
KR1020100043115A 2010-05-07 2010-05-07 Chip Scale Package of Image Sensor and Manufacturing Method Thereof KR101159807B1 (en)

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