CN106817518A - Dual camera module - Google Patents
Dual camera module Download PDFInfo
- Publication number
- CN106817518A CN106817518A CN201510867090.9A CN201510867090A CN106817518A CN 106817518 A CN106817518 A CN 106817518A CN 201510867090 A CN201510867090 A CN 201510867090A CN 106817518 A CN106817518 A CN 106817518A
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- China
- Prior art keywords
- wiring board
- groove
- flip
- substrate
- camera module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000009977 dual effect Effects 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 230000003287 optical effect Effects 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000012528 membrane Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Abstract
The present invention relates to a kind of dual camera module, including wiring board, substrate and two flip-chips, substrate is arranged on wiring board and is electrically connected with wiring board, first through hole is offered on substrate, side wall of the first through hole near one end of wiring board is formed with the first groove to the direction depression away from wiring board, flatness of the flatness of the first groove more than wiring board, two flip-chips are packaged in two bottoms of the first groove respectively, the mode of the bottom that two flip-chips are therefore packaged in into the first groove respectively is more more difficult than the mode that image sensing chip is directly arranged at wiring board by tradition to produce inclination, that is the depth of parallelism of two central shafts of flip-chip is higher, therefore image quality can be improved.
Description
Technical field
The present invention relates to camera module technical field, more particularly to a kind of dual camera module.
Background technology
Dual camera module includes two independent cameras being installed on same circuit board, two cameras
Same object that can be simultaneously to equidirectional is taken pictures, and the first image and the second image are produced respectively, the
One image and the second image can be with compositing 3 d images, it is also possible to mutually compensate for obtaining the two dimensional image of high definition.
Dual camera module generally includes two lens units, two camera lens assembled bases, two IR cut filters
Piece, two image sensing chips and a circuit board.When image sensing chip is assembled with circuit board, first in circuit
The precalculated position dispensing of plate, two image sensing chips are separately assembled to precalculated position (die bonding), and
It is adhesively fixed with circuit board, then by terminal conjunction method (wire bonding), i.e., image sensing is made by gold thread
Chip is electrically connected with circuit board.
But two image sensing chips are separately assembled to when on circuit board, inclination, i.e., two shadows are easily produced
As the central shaft of sensor chip is not parallel, image quality is influenceed.
The content of the invention
Based on this, it is necessary to for above-mentioned technical problem, there is provided a kind of double shootings that can improve image quality
Head mould group.
A kind of dual camera module, including：
Wiring board；
Substrate, is arranged on the wiring board and is electrically connected with the wiring board, and two are offered on the substrate
The first through hole at individual interval, each first through hole is close to the side wall of one end of the wiring board to away from the line
The direction depression of road plate is formed with the first groove, and the flatness of the bottom of first groove is more than the circuit
The flatness of plate；And
Two flip-chips, are packaged in two bottoms of first groove, the flip-chip covering respectively
The first through hole, the flip-chip is electrically connected with the substrate.
Wherein in one embodiment, it is additionally provided between the bottom of the flip-chip and first groove
Projection, the flip-chip is electrically connected by the projection with the substrate.
Wherein in one embodiment, it is also filled between the bottom of the flip-chip and first groove
Adhesive linkage, the projection is embedded in the adhesive linkage, the adhesive linkage seal the flip-chip with it is described
The junction of the first groove.
Wherein in one embodiment, also including two optical filters, the optical filter is arranged on the substrate
And it is covered in the first through hole.
Wherein in one embodiment, the first through hole away from one end of the wiring board side wall to be close to
The direction depression of the wiring board is formed with the second groove, and the optical filter is arranged in second groove.
Wherein in one embodiment, it is additionally provided between the bottom of the optical filter and second groove and is added
Gu layer.
Wherein in one embodiment, surface and institute of the optical filter back on the bottom of second groove
Substrate is stated to be set back on the flush of wiring board.
Wherein in one embodiment, Anisotropically conductive glued membrane is provided between the wiring board and the substrate.
Wherein in one embodiment, also including a support and two camera lens modules, the support is arranged at institute
Substrate back on the surface of the wiring board is stated, two second through holes at interval, institute are offered on the support
Camera lens module is stated to be contained in second through hole.
Wherein in one embodiment, the camera lens module includes lens unit and lens barrel, the lens unit
It is assembled in the lens barrel, the lens barrel is assembled in second through hole by way of screw thread.
Above-mentioned dual camera module at least has advantages below：
It is more than the flatness of wiring board due to the flatness of the bottom of the first groove formed on substrate, therefore will
The mode that two flip-chips are packaged in the bottom of the first groove respectively directly sets image sensing chip than tradition
The more difficult generation of mode for being placed in wiring board inclines, i.e. the depth of parallelism of two central shafts of flip-chip is higher,
Therefore image quality can be improved.
Brief description of the drawings
Fig. 1 is the decomposing schematic representation of the dual camera module in an implementation method；
Fig. 2 is the sectional view of dual camera module shown in Fig. 1；
Fig. 3 is the partial schematic diagram in Fig. 2.
Specific embodiment
It is right below in conjunction with the accompanying drawings to enable the above objects, features and advantages of the present invention more obvious understandable
Specific embodiment of the invention is described in detail.Elaborate in the following description many details with
It is easy to fully understand the present invention.But the present invention can come real to be much different from other manner described here
Apply, those skilled in the art can do similar improvement, therefore this hair in the case of without prejudice to intension of the present invention
It is bright not limited by following public specific implementation.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly another
On individual element or can also there is element placed in the middle.When an element is considered as " connection " another yuan
Part, it can be directly to another element or may be simultaneously present centering elements.It is used herein
Term " vertical ", " level ", "left", "right" and similar statement simply to illustrate that mesh
, it is unique implementation method to be not offered as.
Unless otherwise defined, all of technologies and scientific terms used here by the article with belong to technology of the invention
The implication that the technical staff in field is generally understood that is identical.The art for being used in the description of the invention herein
Language is intended merely to describe the purpose of specific embodiment, it is not intended that in the limitation present invention.The above is implemented
Each technical characteristic of example can be combined arbitrarily, to make description succinct, not to above-described embodiment in it is each
The individual all possible combination of technical characteristic is all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Fig. 1 is referred to, is the dual camera module 10 in an implementation method, the dual camera module 10 can be with
Effectively improve image quality.Specific in present embodiment, dual camera module 10 include wiring board 100,
The flip-chip 300, two of substrate 200, two optical filter 400, support 500 and two camera lens modules 600.
Wiring board 100 can be flexible PCB or hard wiring board, when for flexible PCB, may be used also
To set reinforcing plate, to increase the intensity of flexible PCB.
Also referring to Fig. 2 and Fig. 3, substrate 200 is arranged on wiring board 100 and is electrically connected with wiring board 100
Connect.Specific in present embodiment, anisotropic conductive adhesive can be provided between substrate 200 and wiring board 100
Film (not shown), by heat pressing process, realizes that wiring board 100 is electrically connected with substrate 200.
Substrate 200 can be ceramic substrate or metal substrate, and the surface of ceramic substrate and metal substrate has
Preferable flatness.When for ceramic substrate, conductor wire can be buried in ceramics, to realize substrate 200
The purpose electrically connected with wiring board 100.Certainly, in other embodiments, substrate 200 can also be
Other have the material of preferable flatness.
Two first through hole 210 at interval are offered on substrate 200, each first through hole 210 is near wiring board
The side wall of 100 one end is formed with the first groove 220, the first groove to the direction depression away from wiring board 100
Flatness of the flatness of 220 bottom more than wiring board 100.
Two flip-chips 300 are packaged in two bottoms of the first groove 220 respectively, and flip-chip 300 covers
Lid first through hole 210, and flip-chip 300 electrically connects with substrate 200, thus flip-chip 300 also with line
Road plate 100 is electrically connected.In the present embodiment, there is spacing between flip-chip 300 and wiring board 100,
Therefore flip-chip 300 not with the directly contact of wiring board 100.Because wiring board 100 generally has ink layer,
And the flatness of ink layer is poor, and flip-chip 300 does not connect directly with wiring board 100 in present embodiment
Touch, but be packaged in the bottom of the first groove 220, therefore the flatness of flip-chip 300 can be improved,
Flip-chip 300 is difficult to incline, and is conducive to improving image quality.And two flip-chips 300 are sealed respectively
Bottom loaded on the first groove 220, additionally it is possible to effectively prevent flip-chip 300 reversely (i.e. one it is to the left,
Another is to the right) incline.
Refer to Fig. 3, specific in present embodiment, the bottom of the groove 220 of flip-chip 300 and first it
Between be additionally provided with projection 230, flip-chip 300 is electrically connected by projection 230 with substrate 200.Projection 230
Can be annular, the flatness of the flatness also greater than wiring board 100 of projection 230.
Adhesive linkage 240 is also filled between the bottom of the groove 220 of flip-chip 300 and first, projection 230 is embedding
In adhesive linkage 240, adhesive linkage 240 seals the junction of the groove 220 of flip-chip 300 and first.
The cementability that adhesive linkage 240 can increase between the bottom of the groove 220 of flip-chip 300 and first is set,
And be conducive to further ensureing that two flip-chips 300 are not inclined.Adhesive linkage 240 can be asphalt mixtures modified by epoxy resin
Fat etc. is formed.
Two optical filters 400 are arranged on substrate 200 and are covered in first through hole 210.Optical filter 400 can be with
It is cutoff filter.Specific in present embodiment, optical filter 400 is embedded on substrate 200.Tool
Body ground, first through hole 210 is recessed to the direction near wiring board 100 away from the side wall of one end of wiring board 100
Fall into and be formed with the second groove 250, optical filter 400 is arranged in the second groove 250.
Back-up coat 260 is additionally provided between the bottom of the groove 250 of optical filter 400 and second, back-up coat 260 can
Think fortified resins, fortified resins can be the curable fortified resins of UV, be mixed with carbon black-filled thing, face
Material etc., to improve the fastness of optical filter 400.Certainly, in other embodiments, optical filter 400
Substrate 200 back on the surface of wiring board 100 can also be directly arranged at.
Surface and substrate 200 back on wiring board 100 of the optical filter 400 back on the bottom of the second groove 250
Flush set, to reduce the height of whole dual camera module 10.
Support 500 is arranged at substrate 200 back on the surface of wiring board 100, and support 500 is mainly used in holding
Carry camera lens module 600.Offer two second through holes 510 at interval on support 500, the second through hole 510 with
First through hole 210 is coaxially disposed.
Camera lens module 600 is contained in the second through hole 510.Specifically, camera lens module 600 includes camera lens list
Unit and lens barrel, lens unit are assembled in lens barrel.Lens unit can be constituted for single lens, or
Multiple lens sets are constituted.Lens barrel can be assembled in the second through hole 510 by way of screw thread.Certainly, exist
In other implementation methods, lens barrel can also be arranged in the second through hole 510 by cementing mode.
Above-mentioned dual camera module 10 at least has advantages below：
Because the flatness of the bottom of the first groove 220 formed on substrate 200 is flat more than wiring board 100
Whole degree, therefore two flip-chips 300 are packaged in the mode ratio tradition of the bottom of the first groove 220 respectively
The more difficult generation of mode that image sensing chip is directly arranged at into wiring board 100 inclines, i.e., two upside-down mountings
The depth of parallelism of the central shaft of chip 300 is higher, therefore can improve image quality.
Embodiment described above only expresses several embodiments of the invention, and its description is more specific and detailed,
But can not therefore be construed as limiting the scope of the patent.It should be pointed out that for this area
For those of ordinary skill, without departing from the inventive concept of the premise, some deformations can also be made and changed
Enter, these belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be defined.
Claims (10)
1. a kind of dual camera module, it is characterised in that including：
Wiring board；
Substrate, is arranged on the wiring board and is electrically connected with the wiring board, and two are offered on the substrate
The first through hole at individual interval, each first through hole is close to the side wall of one end of the wiring board to away from the line
The direction depression of road plate is formed with the first groove, and the flatness of the bottom of first groove is more than the circuit
The flatness of plate；And
Two flip-chips, are packaged in two bottoms of first groove, the flip-chip covering respectively
The first through hole, the flip-chip is electrically connected with the substrate.
2. dual camera module according to claim 1, it is characterised in that the flip-chip and institute
Projection is additionally provided between the bottom for stating the first groove, the flip-chip passes through the projection and the substrate
Electrical connection.
3. dual camera module according to claim 2, it is characterised in that the flip-chip and institute
Adhesive linkage is also filled between the bottom for stating the first groove, the projection is embedded in the adhesive linkage, described
Adhesive linkage seals the junction of the flip-chip and first groove.
4. dual camera module according to claim 1, it is characterised in that also including two optical filters,
The optical filter is arranged on the substrate and is covered in the first through hole.
5. dual camera module according to claim 4, it is characterised in that the first through hole away from
The side wall of one end of the wiring board is formed with the second groove near the direction of wiring board depression, described
Optical filter is arranged in second groove.
6. dual camera module according to claim 5, it is characterised in that the optical filter with it is described
Back-up coat is additionally provided between the bottom of the second groove.
7. dual camera module according to claim 5, it is characterised in that the optical filter back on
The surface of the bottom of second groove is set with the substrate back on the flush of wiring board.
8. dual camera module according to claim 1, it is characterised in that the wiring board with it is described
Anisotropically conductive glued membrane is provided between substrate.
9. dual camera module according to claim 1, it is characterised in that also including a support and two
Individual camera lens module, the support is arranged at the substrate back on the surface of the wiring board, on the support
Two second through holes at interval are offered, the camera lens module is contained in second through hole.
10. dual camera module according to claim 9, it is characterised in that the camera lens module bag
Lens unit and lens barrel are included, the lens unit is assembled in the lens barrel, the side that the lens barrel passes through screw thread
Formula is assembled in second through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510867090.9A CN106817518A (en) | 2015-11-30 | 2015-11-30 | Dual camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510867090.9A CN106817518A (en) | 2015-11-30 | 2015-11-30 | Dual camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106817518A true CN106817518A (en) | 2017-06-09 |
Family
ID=59108115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510867090.9A Withdrawn CN106817518A (en) | 2015-11-30 | 2015-11-30 | Dual camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106817518A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333037A (en) * | 2017-07-04 | 2017-11-07 | 信利光电股份有限公司 | A kind of camera module module and assemble method |
| CN107994042A (en) * | 2017-11-28 | 2018-05-04 | 信利光电股份有限公司 | A kind of multi-cam module |
| CN108696686A (en) * | 2018-07-02 | 2018-10-23 | 惠州凯珑光电有限公司 | A kind of dual-lens camera head |
| CN109756655A (en) * | 2017-11-08 | 2019-05-14 | 深圳市凯木金科技有限公司 | A kind of PLCC encapsulation adds the cobasis plate dual camera of CSP encapsulation |
| CN110278679A (en) * | 2018-03-13 | 2019-09-24 | 鸿海精密工业股份有限公司 | Sensing module and its electronic device |
| CN110363051A (en) * | 2018-04-10 | 2019-10-22 | 鸿海精密工业股份有限公司 | Sensing module and its electronic device |
| WO2020219877A1 (en) * | 2019-04-26 | 2020-10-29 | Qualcomm Incorporated | Image sensor system |
| WO2021078138A1 (en) * | 2019-10-21 | 2021-04-29 | 宁波舜宇光电信息有限公司 | Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly |
| CN112770019A (en) * | 2019-10-21 | 2021-05-07 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, preparation method thereof and camera module |
| CN113819868A (en) * | 2021-01-29 | 2021-12-21 | 常州铭赛机器人科技股份有限公司 | Hot-pressing detection system and method |
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| CN205195817U (en) * | 2015-11-30 | 2016-04-27 | 南昌欧菲光电技术有限公司 | Double -camera module |
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| TW200511509A (en) * | 2003-09-01 | 2005-03-16 | Siliconware Precision Industries Co Ltd | Photosensitive semiconductor device and method for fabrication the same |
| CN2773722Y (en) * | 2005-02-04 | 2006-04-19 | 沈阳敏像科技有限公司 | Microcamera mould set |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333037A (en) * | 2017-07-04 | 2017-11-07 | 信利光电股份有限公司 | A kind of camera module module and assemble method |
| CN109756655A (en) * | 2017-11-08 | 2019-05-14 | 深圳市凯木金科技有限公司 | A kind of PLCC encapsulation adds the cobasis plate dual camera of CSP encapsulation |
| CN107994042B (en) * | 2017-11-28 | 2020-07-31 | 信利光电股份有限公司 | Many cameras module |
| CN107994042A (en) * | 2017-11-28 | 2018-05-04 | 信利光电股份有限公司 | A kind of multi-cam module |
| CN110278679A (en) * | 2018-03-13 | 2019-09-24 | 鸿海精密工业股份有限公司 | Sensing module and its electronic device |
| CN110278679B (en) * | 2018-03-13 | 2021-05-04 | 鸿海精密工业股份有限公司 | Sensing module and electronic device thereof |
| CN110363051A (en) * | 2018-04-10 | 2019-10-22 | 鸿海精密工业股份有限公司 | Sensing module and its electronic device |
| CN108696686A (en) * | 2018-07-02 | 2018-10-23 | 惠州凯珑光电有限公司 | A kind of dual-lens camera head |
| WO2020219877A1 (en) * | 2019-04-26 | 2020-10-29 | Qualcomm Incorporated | Image sensor system |
| CN113841374A (en) * | 2019-04-26 | 2021-12-24 | 高通股份有限公司 | Image sensor system |
| US11277559B2 (en) | 2019-04-26 | 2022-03-15 | Qualcomm Incorporated | Image sensor system |
| WO2021078138A1 (en) * | 2019-10-21 | 2021-04-29 | 宁波舜宇光电信息有限公司 | Circuit board assembly, photosensitive assembly, camera module, and preparation methods for circuit board assembly and photosensitive assembly |
| CN112770019A (en) * | 2019-10-21 | 2021-05-07 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, preparation method thereof and camera module |
| CN112770019B (en) * | 2019-10-21 | 2022-07-12 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, preparation method thereof and camera module |
| CN113819868A (en) * | 2021-01-29 | 2021-12-21 | 常州铭赛机器人科技股份有限公司 | Hot-pressing detection system and method |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Applicant after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: OFilm Tech Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Applicant before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: Shenzhen OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Applicant after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Applicant after: Nanchang OFilm Tech. Co.,Ltd. Applicant after: Ophiguang Group Co.,Ltd. Applicant after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Applicant before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: OFilm Tech Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211021 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Applicant before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Applicant before: Nanchang OFilm Tech. Co.,Ltd. Applicant before: Ophiguang Group Co.,Ltd. Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170609 |