CN106384738A - Micro-LED display device based on imprinting process - Google Patents
Micro-LED display device based on imprinting process Download PDFInfo
- Publication number
- CN106384738A CN106384738A CN201610960873.6A CN201610960873A CN106384738A CN 106384738 A CN106384738 A CN 106384738A CN 201610960873 A CN201610960873 A CN 201610960873A CN 106384738 A CN106384738 A CN 106384738A
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- China
- Prior art keywords
- micro
- led
- display device
- led display
- light source
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention relates to a Micro-LED display device based on an imprinting process. The Micro-LED display device comprises the components of a Micro LED array light source, and a packaging film layer which covers the surfaces of LED particles. The packaging film layer covers each LED pixel in an imprinting manner. The Micro-LED display device for improving output light has advantages of effectively improving light extraction efficiency by means of the imprinting process, ensuring normal operation of the chip and supplying a large-batch operation manner. Furthermore the Micro-LED display device ensures the advantages such as high efficiency, high brightness, high reliability and high response speed in the LED.
Description
Technical field
The present invention relates to a kind of Micro-LED display device based on imprint process.
Background technology
The performance of Micro LED advantage it is obvious that it inherits the high efficiency of inorganic LED, high brightness, high-reliability and anti-
Between seasonable fast the features such as, more energy-conservation, mechanism be simple, small volume, the advantage such as slim.Micro LED also has the big characteristic to be exactly
Resolution superelevation.Because ultra micro is little, the resolution of performance is especially high and brightness that have longer luminescent lifetime and Geng Gao and
There is preferably stability of material, life-span length, askiatic branding.
The photon that in LED, PN junction area sends is nondirectional, and that is, all directions all have the light of identical probability to launch, and therefore can
Send out light how many, depending on the quality of semi-conducting material, the structure of chip, geometric form encapsulation internal material and packaging material.
Imprint process, it uses male and female mold, under certain pressure acts on, makes base material that plastic deformation to occur, thus right
Surface is processed.The various picture and text of impressing and decorative pattern, show the different grain pattern of the depth, not only artistically have the work of uniqueness
With equally having consequence in the product of batch production inherent structure.
The problem existing for above-mentioned technology, the present invention is intended to provide one kind has be easier to produce display floater, to solve
Certainly weak point of the prior art.
Content of the invention
It is an object of the invention to provide a kind of Micro-LED display device based on imprint process, to overcome existing skill
Defect present in art.
For achieving the above object, the technical scheme is that：A kind of Micro-LED display based on imprint process
Part, including：Micro-LED array light source and uniform fold LED particle upper surface and work in this Micro-LED array light source
Encapsulation film layer for package lens.
In an embodiment of the present invention, described LED particle is monochromatic light LED or the LED being made up of various light sources；Described
It is spaced apart 5 μm to 30 μm between LED particle.
In an embodiment of the present invention, it is additionally provided with one between described Micro-LED array light source and described encapsulation film layer
Layer implant.In an embodiment of the present invention, described encapsulation film layer is uniformly distributed in described LED according to default 3 dimensional coil geometry
Granule upper surface, and be single-layer and transparent structure or multi-layer transparent structure.
In an embodiment of the present invention, by preparing the encapsulating film of described default 3 dimensional coil geometry using imprint process
Layer.
In an embodiment of the present invention, prepare the encapsulation film layer of described default 3 dimensional coil geometry in accordance with the following steps：
S1：Using computer, the three-dimensional digital model of described Micro-LED array light source and described packaging film structure is carried out
Structure design；
S2：According to the structure of described packaging film structure three-dimensional digital model, design impressing model；And according to made making ide
Type makes impressing mould；
S3：The three-dimensional digital model of described Micro-LED array light source and described packaging film is input to an impression system
In, the starting point of packaging film as package lens, cut-off point are set out and imprint path；
S4：It is irrigated according to predetermined material, after reaching default perfusion standard, each self-stopping technology；
S5：Start described impression system, impression process is carried out by described impressing mould；
S6：Device surface is processed；The device removal printing device completing will be manufactured, cleaning device surface, including in moulding process
Remain in the unnecessary material of device surface.
Compared to prior art, the invention has the advantages that：
1）Micro-LED display device proposed by the present invention significantly improves the light aggregate capabilities of LED pixel, more clear for providing
Clear image provides and ensures.
2）Micro-LED display device proposed by the present invention carries out surface modification using imprint process, combines impressing work
The advantage of skill, solving the photon sending in Micro-LED production is nondirectional problem, and can realize high-volume
Operation.
3）Micro-LED display device proposed by the present invention effectively increase light extraction efficiency using imprint process it is ensured that
Chip normal work；
4）Micro-LED display device proposed by the present invention can adopt multiple impressing modes, can flexible design LED structure, potential
Improve Display panel performance.
5）Micro-LED display device proposed by the present invention possesses high efficiency, high brightness, high-reliability and the reaction of LED
The features such as time is fast.
Brief description
Fig. 1 is the schematic diagram of the Micro-LED making in one embodiment of the invention.
Fig. 2 is to be made through the procedure chart that imprint process makes package lens in one embodiment of the invention.
Fig. 3 is making Micro-LED encapsulating structure profile in one embodiment of the invention.
Fig. 4 is to make schematic diagram after Micro-LED lens packages in one embodiment of the invention.
【Label declaration】：110-Micro-LED array light source；210- impressing mould；220- is coated with encapsulation film layer
Micro-LED array light source；230- possesses the encapsulation film layer of 3 dimensional coil geometry；310- package lens；320- mono- or many
LED.
Specific embodiment
Below in conjunction with the accompanying drawings, technical scheme is specifically described.
The present invention provides a kind of Micro-LED display device based on imprint process, including：Micro-LED array light source
And the encapsulation film layer of uniform fold LED particle upper surface in this Micro-LED array light source, wherein, Micro-LED array
LED in light source goes out light by this encapsulation film layer, and light is converged, and equally distributed material can make impressing more accurate, with
Realize the more preferable picture of display floater to show.As shown in figure 1, being Micro-LED array light source 110, being driven by coupling, making this
Each pixel of display device can addressing, be operated alone and light.
Further, in the present embodiment, LED particle is monochromatic light LED or the LED being made up of various light sources, this LED
Grain is the LED pixel point of micron dimension, is spaced apart 5 μm to 30 μm between LED particle.
Further, in the present embodiment, encapsulation film layer is uniformly distributed according to 3 dimensional coil geometry and certain thickness
LED particle upper surface, and be single-layer and transparent structure or multi-layer transparent structure.
Further, in the present embodiment, encapsulation film layer adopts plastic material, is imprinted with making plastic material that plasticity to occur
Deformation, and then form lens arrangement, make pixel light orient uniform.This encapsulation can not only protect wick moreover it is possible to improve light
Extraction efficiency, lifts LED service life.Preferably, this plastic material can adopt epoxy resin.
Further, in the present embodiment, by preparing the encapsulation film layer of 3 dimensional coil geometry using imprint process.Preferably
, this 3 dimensional coil geometry can be hemispherical, and encapsulates film layer for hemispherical lens.
Further, in the present embodiment, prepare the encapsulation film layer of 3 dimensional coil geometry in accordance with the following steps：
S1：Using computer, structure design is carried out to the three-dimensional digital model of Micro-LED array light source and packaging film, can
Using three-dimensional picture software kit include Pro/E, SolidWorks, CATIA, UG, Solidege or AUTO CAD；
S2：According to the structure of packaging film structure three-dimensional digital model, design impressing model；And according to made impressing model system
Make impressing mould；As shown in Fig. 2 impressing mould 210 can have various ways to constitute, in the present embodiment, impressing mould 210 is
Wheeled；
S3：The three-dimensional digital model of Micro-LED array light source and packaging film is input in an impression system, setting envelope
The starting point of dress thin film, cut-off point and impressing path；Preferably, the impression system being adopted can meet this size impressing work
Skill.
S4：It is irrigated according to material requested, after reaching required default perfusion standard, each self-stopping technology；Preferably, at this
Material adopt epoxy resin, when reaching the standard completing hemispherical lens structure and encapsulation being reached, then stop perfusion；
S5：Start impression system, be imprinted with mould 210 and carry out impression process, as shown in Fig. 2 in Micro-LED array light source
The preparation of 220 upper surfaces possesses the encapsulation film layer 230 of 3 dimensional coil geometry；
S6：Device surface is processed；The device removal printing device completing will be manufactured, cleaning device surface, including in moulding process
Remain in the unnecessary material of device surface.
Further, complete to encapsulate after film layer preparation using imprint process, namely complete to Micro-LED array light source
Encapsulation.As shown in figure 3, encapsulating sectional view for the single LEDs after the completion of encapsulation, possesses the encapsulation film layer pair of dimension geometry
After Micro-LED array light source uniform fold, form package lens 310 in every LEDs 310 upper surface.As shown in figure 4, being
Schematic diagram after Micro-LED array light source lens packages.
Further, in the present embodiment, it is additionally provided with one layer of filling between Micro-LED array light source and encapsulation film layer
Thing.Implant is optional, and plasticity is strong, light transmission is superior, can protect the normal material of tube core, such as resin colloid.Implant and pressure
Printed material material can select multiple or same material, and different ratio mixes, and is specifically joined according to the different light demands that goes out
Than.
It is more than presently preferred embodiments of the present invention, all changes made according to technical solution of the present invention, produced function is made
With without departing from technical solution of the present invention scope when, belong to protection scope of the present invention.
Claims (6)
1. a kind of Micro-LED display device based on imprint process is it is characterised in that include：Micro-LED array light source with
And uniform fold LED particle upper surface and the encapsulation film layer as package lens in this Micro-LED array light source.
2. a kind of Micro-LED display device based on imprint process according to claim 1 is it is characterised in that described
LED particle is monochromatic light LED or the LED being made up of various light sources；It is spaced apart 5 μm to 30 μm between described LED particle.
3. a kind of Micro-LED display device based on imprint process according to claim 1 is it is characterised in that described
It is additionally provided with one layer of implant between Micro-LED array light source and described encapsulation film layer.
4. a kind of Micro-LED display device based on imprint process according to claim 1 is it is characterised in that described
Encapsulation film layer is uniformly distributed in described LED particle upper surface according to default 3 dimensional coil geometry, and is single-layer and transparent structure or many
Layer transparent configuration.
5. a kind of Micro-LED display device based on imprint process according to claim 4 is it is characterised in that pass through
Prepare the encapsulation film layer of described default 3 dimensional coil geometry using imprint process.
6. a kind of Micro-LED display device based on imprint process according to claim 5 it is characterised in that according to
Following steps prepare the encapsulation film layer of described default 3 dimensional coil geometry：
S1：Using computer, the three-dimensional digital model of described Micro-LED array light source and described packaging film structure is carried out
Structure design；
S2：According to the structure of described packaging film structure three-dimensional digital model, design impressing model；And according to made making ide
Type makes impressing mould；
S3：The three-dimensional digital model of described Micro-LED array light source and described packaging film is input to an impression system
In, the starting point of packaging film as package lens, cut-off point are set out and imprint path；
S4：It is irrigated according to predetermined material, after reaching default perfusion standard, each self-stopping technology；
S5：Start described impression system, impression process is carried out by described impressing mould；
S6：Device surface is processed；The device removal printing device completing will be manufactured, cleaning device surface, including in moulding process
Remain in the unnecessary material of device surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610960873.6A CN106384738A (en) | 2016-10-28 | 2016-10-28 | Micro-LED display device based on imprinting process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610960873.6A CN106384738A (en) | 2016-10-28 | 2016-10-28 | Micro-LED display device based on imprinting process |
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| Publication Number | Publication Date |
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| CN106384738A true CN106384738A (en) | 2017-02-08 |
Family
ID=57956661
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610960873.6A Pending CN106384738A (en) | 2016-10-28 | 2016-10-28 | Micro-LED display device based on imprinting process |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107121806A (en) * | 2017-05-19 | 2017-09-01 | 合肥市惠科精密模具有限公司 | A kind of Micro LED LCDs based on imprint process |
| CN107146835A (en) * | 2017-06-30 | 2017-09-08 | 中国科学院半导体研究所 | A kind of preparation method of micro- LED component array element |
| CN109521647A (en) * | 2017-09-18 | 2019-03-26 | 北京德瑞工贸有限公司 | One kind being based on Micro-LED maskless scan-type ultraviolet exposure machine |
| CN110854152A (en) * | 2019-10-29 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | Packaging structure, packaging structure manufacturing method and display panel |
| WO2021190245A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display apparatus |
| WO2023133762A1 (en) * | 2022-01-13 | 2023-07-20 | 厦门市芯颖显示科技有限公司 | Micro led display panel and fabricating method therefor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100321640A1 (en) * | 2009-06-22 | 2010-12-23 | Industrial Technology Research Institute | Projection display chip |
| CN102386200A (en) * | 2010-08-27 | 2012-03-21 | 财团法人工业技术研究院 | Light emitting unit array and projection system |
| CN102707378A (en) * | 2012-06-12 | 2012-10-03 | 华南师范大学 | Method for manufacturing silicone micro-nano optical structure by using imprinting technology |
| CN204760430U (en) * | 2015-05-21 | 2015-11-11 | 明基材料有限公司 | Emitting diode's lens encapsulation system |
-
2016
- 2016-10-28 CN CN201610960873.6A patent/CN106384738A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100321640A1 (en) * | 2009-06-22 | 2010-12-23 | Industrial Technology Research Institute | Projection display chip |
| CN102386200A (en) * | 2010-08-27 | 2012-03-21 | 财团法人工业技术研究院 | Light emitting unit array and projection system |
| CN102707378A (en) * | 2012-06-12 | 2012-10-03 | 华南师范大学 | Method for manufacturing silicone micro-nano optical structure by using imprinting technology |
| CN204760430U (en) * | 2015-05-21 | 2015-11-11 | 明基材料有限公司 | Emitting diode's lens encapsulation system |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107121806A (en) * | 2017-05-19 | 2017-09-01 | 合肥市惠科精密模具有限公司 | A kind of Micro LED LCDs based on imprint process |
| CN107146835A (en) * | 2017-06-30 | 2017-09-08 | 中国科学院半导体研究所 | A kind of preparation method of micro- LED component array element |
| CN109521647A (en) * | 2017-09-18 | 2019-03-26 | 北京德瑞工贸有限公司 | One kind being based on Micro-LED maskless scan-type ultraviolet exposure machine |
| CN110854152A (en) * | 2019-10-29 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | Packaging structure, packaging structure manufacturing method and display panel |
| WO2021190245A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display apparatus |
| WO2023133762A1 (en) * | 2022-01-13 | 2023-07-20 | 厦门市芯颖显示科技有限公司 | Micro led display panel and fabricating method therefor |
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Address after: 350301, Fujian, Fuzhou, Fuqing Province, 36 West Ring Road, National Chiao Tung economic and Technological Development Zone, Fuzhou University, Fuqing Institute Applicant after: Fuzhou University Address before: 350002 Fuzhou, Gulou District, Fujian Industrial Road, No. 523 Applicant before: Fuzhou University |
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Application publication date: 20170208 |