CN110854152A - Packaging structure, packaging structure manufacturing method and display panel - Google Patents
Packaging structure, packaging structure manufacturing method and display panel Download PDFInfo
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- CN110854152A CN110854152A CN201911036248.2A CN201911036248A CN110854152A CN 110854152 A CN110854152 A CN 110854152A CN 201911036248 A CN201911036248 A CN 201911036248A CN 110854152 A CN110854152 A CN 110854152A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 150
- 239000000853 adhesive Substances 0.000 claims abstract description 149
- 230000001070 adhesive effect Effects 0.000 claims abstract description 147
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 238000005520 cutting process Methods 0.000 claims abstract description 22
- 239000012939 laminating adhesive Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000013464 silicone adhesive Substances 0.000 claims 1
- 238000012858 packaging process Methods 0.000 abstract description 16
- 230000001681 protective effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application provides a packaging structure, a packaging structure manufacturing method and a display panel, wherein the packaging structure comprises: the array substrate comprises a first surface and a second surface which are oppositely arranged; the micro light-emitting diode is arranged on the first surface and corresponds to the effective display area; the adhesive material is arranged on the first surface and the micro light-emitting diode; and the packaging adhesive material covers the first surface, the micro light-emitting diode and the laminating adhesive material. In the cutting process, the adhesive material can be used as a protective adhesive material to prevent the array substrate from being damaged by the cutting process and improve the packaging process precision of the display panel.
Description
Technical Field
The present application relates to the field of display technologies, and in particular, to a package structure, a package structure manufacturing method, and a display panel.
Background
As a next generation display technology, Micro Light Emitting Diode (Mini/Micro-Light Emitting Diode, Mini/Micro-LED) display really achieves seamless splicing, has an excellent display effect, is strong in color reducibility, has a wide viewing angle, a high refresh rate, a high contrast ratio, high stability, low power consumption, high gray scale and the like, and shows more excellent performance than Liquid Crystal Display (LCD) and Organic Light Emitting Diode (OLED) display. In the long run, with the breakthrough of key technologies such as transfer, the micro light emitting diode will be fully used in various display fields from small screen to large screen.
At present, the commonly used packaging process of the micro light emitting diode display panel mainly comprises dispensing and glue pressing, wherein the dispensing mode is limited by the width of a dam, the glue pressing mode is limited by the precision of a glue pressing tool and the alignment precision, precision packaging in an effective display Area (Active Area, AA) cannot be realized, meanwhile, glue overflow and other problems outside the effective display Area can be caused in the process, and the splicing seam width can be influenced by the problems. In order to realize seamless splicing, the precision of the packaging process of the existing miniature light-emitting diode display panel still needs to be greatly improved.
Disclosure of Invention
The embodiment of the application provides a packaging structure, a packaging structure manufacturing method and a display panel, which can reduce the splicing seam width of a micro light-emitting diode and improve the packaging process precision.
The application provides a packaging structure, includes:
the array substrate comprises a first surface and a second surface which are oppositely arranged;
the micro light-emitting diode is arranged on the first surface and corresponds to the effective display area;
the adhesive material is arranged on the first surface and the micro light-emitting diode;
and the packaging adhesive material covers the first surface, the micro light-emitting diode and the laminating adhesive material.
In some embodiments, the adhesive material is any one of an ultraviolet photosensitive adhesive material, a polymer adhesive material, an organic adhesive material, a resin adhesive material, and an organic silicon adhesive material.
In some embodiments, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and the adhesive material at least partially covers the surface of the micro light emitting diode away from the array substrate.
In some embodiments, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and the adhesive material completely covers a surface of the micro light emitting diode away from the array substrate.
The application provides a manufacturing method of a packaging structure, comprising the following steps:
providing an array substrate, wherein the array substrate comprises a first surface and a second surface which are oppositely arranged;
arranging a micro light-emitting diode on the first surface, wherein the micro light-emitting diode corresponds to the effective display area;
arranging a gluing material on the first surface and the micro light-emitting diode;
covering a packaging adhesive material on the first surface, the micro light-emitting diode and the bonding adhesive material;
cutting the packaging adhesive material at the edge of the effective display area corresponding to the micro light-emitting diode;
and removing the adhesive material and the packaging adhesive material between the edge of the micro light-emitting diode of the first surface and the edge of the array substrate.
In some embodiments, cutting the encapsulation adhesive material at the edge of the active display area corresponding to the micro light emitting diode includes: and cutting the packaging adhesive material along the edge of the effective display area corresponding to the micro light-emitting diode in the direction vertical to the first surface.
In some embodiments, removing the adhesive material between the edge of the micro light emitting diode of the first surface and the edge of the array substrate and the encapsulation adhesive material includes:
providing a light shield for shielding the effective display area corresponding to the micro light-emitting diode;
providing ultraviolet light, and irradiating the ultraviolet light from the edge of the first micro light-emitting diode to the edge of the array substrate to reduce the viscosity of the adhesive material;
and peeling the adhesive material and the packaging adhesive material from the edge of the first-side micro light-emitting diode to the edge of the array substrate.
In some embodiments, a bonding adhesive material is disposed on the first surface and the micro light emitting diode, including: and arranging a plurality of layers of adhesive materials on the first surface and the micro light-emitting diode.
In some embodiments, removing the adhesive material between the edge of the micro light emitting diode of the first surface and the edge of the array substrate and the encapsulation adhesive material includes:
and at least peeling off one layer of the bonding adhesive material between the edge of the first-surface micro light-emitting diode and the edge of the array substrate, and peeling off the packaging adhesive material between the edge of the first-surface micro light-emitting diode and the edge of the array substrate.
The application provides a display panel, including above packaging structure.
The packaging structure provided by the embodiment of the application comprises an array substrate, a micro light-emitting diode, a bonding adhesive material and a packaging adhesive material. The array substrate comprises a first surface and a second surface which are oppositely arranged; the micro light-emitting diode is arranged on the first surface and corresponds to the effective display area; the adhesive material is arranged on the first surface and the micro light-emitting diode; the packaging adhesive material covers the first surface, the micro light-emitting diode and the bonding adhesive material. By covering the bonding adhesive material, the bonding adhesive material can be used as a protective adhesive material in the process of cutting the packaging adhesive material so as to prevent the array substrate from being damaged by a cutting process; in addition, the arrangement of the adhesive material can also greatly improve the precision of the packaging process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of a package structure provided in an embodiment of the present application.
Fig. 2 is a schematic view of another package structure provided in the embodiment of the present application.
Fig. 3 is a flowchart of a packaging process according to an embodiment of the present disclosure.
Fig. 4 is a schematic view of a partial attachment packaging process according to an embodiment of the present application.
Fig. 5 is a schematic view of a full-surface mount package process according to an embodiment of the present disclosure.
Fig. 6 is a flowchart of another packaging process provided in an embodiment of the present application.
Fig. 7 is a schematic view of another partial attach package process according to an embodiment of the present application.
Fig. 8 is a schematic view of another full-surface-mount package process according to an embodiment of the present disclosure.
Fig. 9 is a flow chart of another packaging process provided in the embodiments of the present application.
Fig. 10 is a schematic view of another partial attach package process according to an embodiment of the present application.
Fig. 11 is a schematic view of another full-surface-mount package process according to an embodiment of the present disclosure.
Fig. 12 is a schematic structural diagram of a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that in the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present application.
The present embodiment provides a package structure 10, and the package structure 10 is described in detail below.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a package structure 10 according to an embodiment of the present disclosure. The packaging structure 10 includes an array substrate 101, a micro light emitting diode 102, a bonding adhesive material 103 and a packaging adhesive material 104, the array substrate 101 has a first surface 101a and a second surface 101b which are oppositely arranged, the micro light emitting diode 102 is arranged on the first surface 101a, an area where the micro light emitting diode 102 is arranged corresponds to an effective display area 105, the bonding adhesive material 103 is arranged on the first surface 101a and the micro light emitting diode 102, the bonding adhesive material 103 is used for protecting the array substrate 101 in a cutting process in a packaging process, and the packaging adhesive material 104 covers the array substrate 101, the micro light emitting diode 102 and the bonding adhesive material 103. By covering the adhesive material 103, the adhesive material 103 can be used as a protective adhesive material to prevent the array substrate 101 from being damaged by the cutting process in the process of cutting the packaging adhesive material 104; in addition, the arrangement of the adhesive material 103 can also greatly improve the precision of the packaging process, thereby reducing the width of the splicing seam of the micro light-emitting diode 102.
An Active Area (AA) refers to an operable Area of a display screen on which text and graphics are displayed.
The first surface 101a may be an upper surface of the array substrate 101, and the second surface 101b may be a lower surface of the array substrate 101. Of course, the first surface 101a may be a lower surface of the array substrate 101, and the second surface 101b may be an upper surface of the array substrate 101. In the embodiment of the present invention, without specific description, the first surface 101a is the upper surface of the array substrate 101, and the second surface 101b is the lower surface of the array substrate 101.
The array substrate 101 may be any one of a Thin Film Transistor (TFT) substrate, a glass substrate, and a flexible substrate.
Wherein, the adhesive material 103 is any one of an ultraviolet photosensitive adhesive material, a polymer adhesive material, an organic adhesive material, a resin adhesive material and an organic silicon adhesive material; the adhesive material 103 needs to have both high transparency and the property of resisting high temperature of at least 150 ℃; the type of the adhesive material 103 at least includes Ultraviolet (UV) light-reduced adhesive, normal temperature easy-to-peel adhesive material, and non-peel adhesive material.
The non-strippable adhesive material is a transparent high-temperature-resistant protective coating, and is not easy to be completely stripped off from an object after being dried into a film.
The adhesive material 103 extends from the edge of the array substrate 101 to the edge of the micro light emitting diode 102, and the adhesive material 103 at least partially covers one surface of the micro light emitting diode 102 away from the array substrate.
Referring to fig. 2, fig. 2 is another structural schematic diagram of a package structure 10 according to an embodiment of the present application. The adhesive material 103 extends from the edge of the array substrate 101 to the edge of the micro light emitting diode 102, and the adhesive material 103 completely covers one surface of the micro light emitting diode 102 away from the array substrate 101.
The present invention provides a method for fabricating a package structure, which is described in detail below. Referring to fig. 3, fig. 3 is a schematic flow chart of a packaging process in the embodiment of the present application.
An array substrate is provided 201, which includes a first side and a second side disposed opposite to each other.
The array substrate may be a Thin Film Transistor (TFT) substrate, a glass substrate, or a flexible substrate. The first surface may be an upper surface of the array substrate, and the second surface may be a lower surface of the array substrate. Of course, the first surface may also be a lower surface of the array substrate, and the second surface may be an upper surface of the array substrate. In the embodiment of the present application, without specific description, the default is that the first surface is an upper surface of the array substrate, and the second surface is a lower surface of the array substrate.
202 a micro led is disposed on the first side, and the micro led corresponds to the active display area.
Among them, a Mini/Micro-Light-Emitting Diode (Mini/Micro-LED) may also be called a small-pitch LED. The micro light emitting diode is fixed on the array substrate through a transfer and bonding (bonding) process.
Bonding refers to the use of an anisotropic conductive adhesive to interconnect components during the manufacture of a display module, followed by aligned pressure and heat to form a stable and reliable mechanical and electrical connection between the components. It can also be called thermal compression welding or thermal compression according to the process characteristics. In the embodiment of the application, the micro light-emitting diode arranged on the first surface can be spliced on the array substrate by using the conductive adhesive through a bonding process, and then the micro light-emitting diode is fixed by hot pressing.
203 are provided with adhesive material on the first side and the micro light emitting diode.
The adhesive material can partially adhere to the effective display area and the array substrate, as shown in fig. 4. Specifically, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and at least part of the adhesive material covers one surface of the micro light emitting diode far away from the array substrate.
The adhesive material can be adhered to the entire surface of the effective display area and the array substrate, as shown in fig. 5. Specifically, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and the adhesive material completely covers the surface of the micro light emitting diode far away from the array substrate.
Wherein, can set up the individual layer and laminate the gluey material on first face and miniature emitting diode, also can set up the multilayer and laminate gluey material on first face and miniature emitting diode.
204 covering the first surface of the array substrate, the micro light emitting diode and the bonding adhesive material with a packaging adhesive material.
205 cutting the packaging adhesive material at the edge of the effective display area corresponding to the micro light emitting diode.
And cutting the packaging adhesive material along the edge of the effective display area corresponding to the micro light-emitting diode in the direction vertical to the first surface of the array substrate. The cutting mode at least comprises any one of cutter wheel cutting, water jet cutting, guillotine cutting and laser cutting.
206 the bonding glue material and the packaging glue material between the edge of the micro light emitting diode of the first surface and the edge of the array substrate are removed.
Wherein, the normal temperature easy-to-strip glue material can be directly removed by a simple stripping mode; for Ultraviolet (UV) light anti-sticking glue, the removal mode is to use a light cover to shield an effective display area corresponding to the micro light-emitting diode, then use ultraviolet light to irradiate the edge of the micro light-emitting diode on the first surface of the array substrate to the edge of the array substrate so as to reduce the viscosity of the adhesive material, and then strip the adhesive material from the edge of the micro light-emitting diode on the first surface to the edge of the array substrate and the packaging adhesive material; and for the normal-temperature non-peelable adhesive material, the removing method comprises the steps of peeling at least one layer of the adhesive material between the edge of the first-surface micro light-emitting diode and the edge of the array substrate, and peeling the packaging adhesive material between the edge of the first-surface micro light-emitting diode and the edge of the array substrate.
In the process of cutting the packaging adhesive material, the packaging process flow provided by the application prevents the array substrate from being damaged by the cutting process by covering the attaching adhesive material as a protective adhesive material; after cutting, the adhesive material and the packaging adhesive material outside the effective display area are removed, and meanwhile, the array substrate is not damaged or the adhesive material is not left. In addition, the arrangement of the adhesive material can also greatly improve the precision of the packaging process, thereby reducing the width of the splicing seam of the micro light-emitting diode.
Referring to fig. 6, fig. 6 is another flow chart illustrating a packaging process in the embodiment of the present application.
301 provides an array substrate comprising oppositely disposed first and second faces.
302 are disposed on the first side with micro leds corresponding to the active display area.
303 the first surface and the micro light emitting diode are provided with a bonding adhesive material.
Wherein, the adhesive material is Ultraviolet (UV) viscosity reducing adhesive.
The UV-adhesive can partially attach the active display area and the array substrate, as shown in fig. 7. Specifically, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and at least part of the adhesive material covers one surface of the micro light emitting diode far away from the array substrate.
The UV-adhesive can be applied to the active display area and the array substrate on the whole surface, as shown in fig. 8. Specifically, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and the adhesive material completely covers the surface of the micro light emitting diode far away from the array substrate.
304 the first surface of the array substrate, the micro light emitting diodes and the bonding adhesive are covered with a packaging adhesive.
305 dicing the packaging adhesive material at the edge of the effective display area corresponding to the micro light emitting diode.
306 providing a light shield for shielding the effective display area corresponding to the micro light emitting diode; providing ultraviolet light to irradiate the edge of the micro light emitting diode on the first surface of the array substrate to the edge of the array substrate to reduce the viscosity of the adhesive material, as shown in fig. 7 and 8.
307 peeling the bonding glue material and the packaging glue material from the edge of the first micro light emitting diode to the edge of the array substrate.
Referring to fig. 9, fig. 9 is a schematic flow chart illustrating a packaging process according to an embodiment of the present application.
401 provides an array substrate comprising oppositely disposed first and second faces.
402 a micro light emitting diode is disposed on a first surface of the array substrate, and the micro light emitting diode corresponds to the active display area.
403, arranging a plurality of layers of adhesive materials on the first surface of the array substrate and the micro light-emitting diode.
Wherein, the adhesive material is a non-peelable adhesive material.
The non-peelable adhesive material may partially adhere to the active display area and the array substrate, as shown in fig. 10. Specifically, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and at least part of the adhesive material covers one surface of the micro light emitting diode far away from the array substrate.
The non-peelable adhesive material can be bonded to the entire surface of the active display area and the array substrate, as shown in fig. 11. Specifically, the adhesive material extends from the edge of the array substrate to the edge of the micro light emitting diode, and the adhesive material completely covers the surface of the micro light emitting diode far away from the array substrate.
404 the first surface of the array substrate, the micro light emitting diodes and the bonding adhesive are covered with a packaging adhesive.
405 dicing the encapsulation adhesive material at the edge of the effective display area corresponding to the micro light emitting diode.
406 at least one layer of bonding adhesive material is peeled off from the edge of the micro light emitting diode on the first side of the array substrate and the edge of the array substrate, and the packaging adhesive material is peeled off from the edge of the micro light emitting diode on the first side of the array substrate and the edge of the array substrate.
A display panel 100 is provided, and fig. 12 is a schematic structural diagram of the display panel 100 in the embodiment of the present application. The display panel 100 includes the above-described package structure 10 and the color film substrate 20, and the display panel 100 may further include other devices. In the embodiment of the present application, the color filter substrate 20, other devices and their assembly are well known to those skilled in the art, and are not described herein in detail.
The package structure, the package structure manufacturing method and the display panel provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are described herein using specific examples, which are only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A package structure, comprising:
the array substrate comprises a first surface and a second surface which are oppositely arranged;
the micro light-emitting diode is arranged on the first surface and corresponds to the effective display area;
the adhesive material is arranged on the first surface and the micro light-emitting diode;
and the packaging adhesive material covers the first surface, the micro light-emitting diode and the laminating adhesive material.
2. The package structure of claim 1, wherein the adhesive material is any one of an ultraviolet photosensitive adhesive material, a polymer adhesive material, an organic adhesive material, a resin adhesive material, and a silicone adhesive material.
3. The package structure of claim 1, wherein the adhesive material extends from an edge of the array substrate to an edge of the micro light emitting diode, and the adhesive material at least partially covers a surface of the micro light emitting diode away from the array substrate.
4. The package structure of claim 1, wherein the adhesive material extends from an edge of the array substrate to an edge of the micro light emitting diode, and the adhesive material completely covers a surface of the micro light emitting diode away from the array substrate.
5. A manufacturing method of a package structure includes:
providing an array substrate, wherein the array substrate comprises a first surface and a second surface which are oppositely arranged;
arranging a micro light-emitting diode on the first surface, wherein the micro light-emitting diode corresponds to the effective display area;
arranging a gluing material on the first surface and the micro light-emitting diode;
covering a packaging adhesive material on the first surface, the micro light-emitting diode and the bonding adhesive material;
cutting the packaging adhesive material at the edge of the effective display area corresponding to the micro light-emitting diode;
and removing the adhesive material and the packaging adhesive material between the edge of the micro light-emitting diode of the first surface and the edge of the array substrate.
6. The process of claim 5, wherein cutting the encapsulation adhesive on the edge of the active display area corresponding to the micro light emitting diode comprises:
and cutting the packaging adhesive material along the edge of the effective display area corresponding to the micro light-emitting diode in the direction vertical to the first surface.
7. The process method of claim 5, wherein removing the bonding glue and the encapsulation glue between the edge of the micro light emitting diode of the first surface and the edge of the array substrate comprises:
providing a light shield for shielding the effective display area corresponding to the micro light-emitting diode;
providing ultraviolet light, and irradiating the ultraviolet light from the edge of the first micro light-emitting diode to the edge of the array substrate to reduce the viscosity of the adhesive material;
and peeling the adhesive material and the packaging adhesive material from the edge of the first-side micro light-emitting diode to the edge of the array substrate.
8. The process of claim 5, wherein the step of providing a bonding adhesive on the first surface and the micro light emitting diode comprises:
and arranging a plurality of layers of adhesive materials on the first surface and the micro light-emitting diode.
9. The process method of claim 8, wherein removing the bonding glue and the encapsulation glue between the edge of the micro light emitting diode of the first surface and the edge of the array substrate comprises:
and at least peeling off one layer of the bonding adhesive material between the edge of the first-surface micro light-emitting diode and the edge of the array substrate, and peeling off the packaging adhesive material between the edge of the first-surface micro light-emitting diode and the edge of the array substrate.
10. A display panel comprising an encapsulation structure according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911036248.2A CN110854152A (en) | 2019-10-29 | 2019-10-29 | Packaging structure, packaging structure manufacturing method and display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911036248.2A CN110854152A (en) | 2019-10-29 | 2019-10-29 | Packaging structure, packaging structure manufacturing method and display panel |
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| CN110854152A true CN110854152A (en) | 2020-02-28 |
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