CN208271949U - display panel motherboard - Google Patents
display panel motherboard Download PDFInfo
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- CN208271949U CN208271949U CN201820706360.7U CN201820706360U CN208271949U CN 208271949 U CN208271949 U CN 208271949U CN 201820706360 U CN201820706360 U CN 201820706360U CN 208271949 U CN208271949 U CN 208271949U
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- display panel
- reflecting layer
- layer
- motherboard
- display
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Abstract
The utility model discloses a kind of display panel motherboards, wherein the display panel motherboard includes multiple display panels and the cutting trough around each display panel, the first reflecting layer, the source/drain same layer in first reflecting layer and the display panel are provided in at least partly described cutting trough.The display panel motherboard is when being cut into display panel, reflecting layer can reflected laser energy play the role of amplify laser energy, therefore laser energy can suitably be reduced, reduce laser facula, cause to encapsulate the damage of the membrane materials such as film layer to reduce thermal expansion, causing steam from display panel side, infiltration causes to encapsulate undesirable risk, and then improves package reliability, improves the yield and service life of display panel.And the reflecting layer be display panel in source/drain, can form viewing area source/drain when synchronous forming, it is easy to produce without increasing technique.
Description
Technical field
The utility model relates to field of display technology, more particularly to a kind of display panel motherboard.
Background technique
In recent years, more and more for the demand of display as the technology of intelligent terminal and wearable device develops
Sample.Such as OLED (Orgnic Light-Emitting Diode, OLED) organic light emitting diode display has self-luminous
Performance eliminates the backlight module more to consume energy compared to liquid crystal display, therefore has the advantages that more energy efficient.
Currently, the manufacture of display panel is to cut separation again after carrying out integrated artistic production on motherboard, it is further complete
At back segment mould group technique.By taking flexible display panels as an example, multiple flexible display panels are formed to get display on one big substrate
Panel motherboard, cutting forms independent flexible display panels later.Generally, the cutting mode of display panel motherboard is usually knife
Wheel cutting and laser cutting.Compared to break bar, laser cutting is higher because having good high-energy, one-way, cutting efficiency and precision
The features such as and be widely used.
But in laser cutting process, membrane material and substrate will receive cutting heat and influence and damage.It specifically, is guarantor
Card flexible display substrates are effectively cut, and need to guarantee certain laser cutting intensity, and reserved cutting trough is certain to provide
Laser emission range.If laser cutting intensity is excessive, the heated biggish stress of generation of flexible substrate will lead to, to cause flexibility
Thin film transistor (TFT) sensitive for damages on substrate.If laser emission range is wide, the pixel of viewing area will lead to by laser hurt.
It is so highly vulnerable to breakage the element at display panel edge, steam is permeated from display panel side, causes to encapsulate bad.
Utility model content
Based on this, it is necessary to provide a kind of higher display panel motherboard of package reliability.
A kind of display panel motherboard, the cutting trough including multiple display panels and circular each display panel,
The first reflecting layer, the source/drain in first reflecting layer and the display panel are provided in at least partly described cutting trough
Pole same layer.
In above-mentioned display panel motherboard, it at least partly is provided with the first reflecting layer in cutting trough, is being cut into display
When panel, the first reflecting layer can reflected laser energy play the role of amplify laser energy；In actual operation, it can suitably reduce
Laser energy reduces laser facula, reaches cutting requirement by amplification of first reflecting layer to laser energy, to reduce
Thermal expansion causes to encapsulate the damage of the membrane materials such as film layer, and causing steam from display panel side, infiltration causes to encapsulate undesirable risk, into
And package reliability is improved, improve the yield and service life of display panel.
And thin film transistor (TFT) (Thin-film transistor, TFT) the array base in first reflecting layer and display panel
In plate source/drain same layer setting, can form viewing area source/drain when synchronous forming, it is easy to produce without increasing technique.
It is located at least in the cutting trough of the side of the display panel and is provided in one of the embodiments,
First reflecting layer.
The display panel further includes binding area in one of the embodiments, and the binding area is located at the display surface
The side of plate；Wherein, the cutting trough and the binding area for being provided with the first reflecting layer are not located at the display panel
Same side.
The side in the not set binding area of the display panel in one of the embodiments, the cutting trough
Inside it is provided with first reflecting layer.
First reflecting layer is metallic reflector or metal alloy reflecting layer in one of the embodiments,.
First reflecting layer is multilayered structure in one of the embodiments,.
First reflecting layer is Ti/Al/Ti lamination or Mo/Al/Mo lamination in one of the embodiments,.
The display panel further includes encapsulation region in one of the embodiments, and the cutting trough is around the envelope
Area is filled, the second reflecting layer is set in the non-display area in the encapsulation region.
First reflecting layer and the setting of the second reflecting layer same layer in one of the embodiments,.
First reflecting layer and the second reflecting layer are metallic reflector in one of the embodiments,.
Detailed description of the invention
Fig. 1 is the positive structure schematic of the display panel motherboard of an embodiment；
Fig. 2 is that the display panel formed after display panel motherboard shown in Fig. 1 is cut has cutting at reflecting layer in encapsulation region
Face cross-sectional view.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact
It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model
The understanding for opening content is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" includes
Any and all combinations of one or more related listed items.
Referring to Fig. 1, the display panel motherboard 10 of one embodiment of the utility model, including multiple display panels 100 and
Around the cutting trough 11 of each display panel 100.It is understood that multiple display panels 100 are in array distribution.
Fig. 1 and Fig. 2 is please referred to, is at least partly provided with the first reflecting layer (not shown) in cutting trough 11, first is anti-
The source/drain same layer for penetrating layer and display panel 100 is arranged.
In above-mentioned display panel motherboard 10, it at least partly is provided with the first reflecting layer in cutting trough 11, is being cut into
When display panel 100, the first reflecting layer can reflected laser energy play the role of amplifying laser energy, therefore in practical operation
In, laser energy can be suitably reduced, reduces laser facula, cutting is reached by amplification of first reflecting layer to laser energy
It is required that causing steam from 100 side of display panel, infiltration causes to seal so that reducing thermal expansion causes to encapsulate the damage of the membrane materials such as film layer
Undesirable risk is filled, and then improves package reliability, improves the yield and service life of display panel 100.
And thin film transistor (TFT) (Thin-film transistor, the TFT) battle array in first reflecting layer and display panel 100
In column substrate 120 source/drain same layer setting, can form viewing area 101 source/drain when synchronous forming, without increasing work
Skill is easy to produce.
Display panel 100 further includes encapsulation region 102 in one of the embodiments,.Trough 11 is cut around encapsulation region
102.Second reflecting layer 110 is set in the non-display area in encapsulation region 102.Such second reflecting layer 110 can further disperse to swash
Heat when light is cut, heat when being particularly conducive to reduce laser cutting enters the viewing area of display panel 100, to improve
The reliability of encapsulation.
Further, the first reflecting layer and the setting of 110 same layer of the second reflecting layer, are so convenient for synchronous forming.
Further, the first reflecting layer is that metallic reflector or metal alloy reflecting layer, reflecting effect are preferable.
Further, the second reflecting layer 110 is metallic reflector or metal alloy reflecting layer.
Further, the first reflecting layer is identical with the material in the second reflecting layer 110.Preferably, preferably the first reflecting layer
It is metallic reflector with the second reflecting layer 110.
Specifically, the first reflecting layer and/or the second reflecting layer 110 are multilayered structure.Preferably, the first reflecting layer and/or
Second reflecting layer 110 is three-decker.
Preferably, the first reflecting layer is identical as the material of source/drain of viewing area 101 in display panel 100.Preferably,
Second reflecting layer 110 is identical as the material of source/drain of viewing area 101 in display panel 100.So in molding viewing area 101
Source/drain when identical synchronous material can be used form the first reflecting layer and/or the second reflecting layer 110.
Further, the first reflecting layer and/or the second reflecting layer 110 be Ti/Al/Ti lamination or the first reflecting layer and/or
Second reflecting layer 110 is Mo/Al/Mo lamination.By taking Ti/Al/Ti lamination as an example, Ti/Al/Ti lamination can be by being successively formed continuously
Ti layers, Al layers and Ti layers are made.Further, the first reflecting layer and/or the second reflecting layer 110 are Ti/Al/Ti lamination.
Specifically, form viewing area 101 source/drain when in encapsulation region 102 non-display area and cutting trough
11 the first reflecting layer of synchronous forming and the second reflecting layer 110, it is easy to produce without increasing technique.
That is, the source/drain in viewing area 101 positioned at outer rim extends to non-display area and the cutting of encapsulation region 102
Reflecting layer 110 is formed in trough 11.Normally, in viewing area 101 formed tft array 120 during, using evaporation or
The techniques such as sputtering form source/drain, are then patterned to the source/drain of viewing area 101, obtain desired electrode shape.
The unwanted part of source/drain is removed for example, by using etching technics.And it only needs to be formed in viewing area 101 in the present invention
Non-display area and cutting trough 11 when source/drain, while to above-mentioned encapsulation region 102 form similar source/drain and can obtain
To the first reflecting layer and the second reflecting layer 110.
It is understood that can be cut along the encapsulation boundary of encapsulation region 102 when cutting, to form multiple display panels 100.
Further, it is located at least in the cutting trough 11 of the side of display panel 100 and is provided with the first reflecting layer.
Display panel 100 further includes binding area 130.Binding area 130 is located at 100 side of display panel.It is anti-to be provided with first
It penetrates the cutting trough 11 of floor and binds the same side that area 130 is not located at display panel 100.That is, the first reflecting layer is set
In the cutting trough 11 without binding area.And display panel 100 is not provided with the side in binding area 130,11 is equal in cutting trough
It is provided with the first reflecting layer.
Specifically, binding area 130 is intensive wiring region, and it typically is metal routing portion, metal routing portion itself can be right
Laser plays reflex, thus the region in the binding area 130 can be not provided with reflecting layer 110.It is understood that in other embodiments
In, binding area 130 may also set up reflecting layer 110.
It in one of the embodiments, include pixel confining layer 140 in viewing area 101.It is limited in encapsulation region 102 around pixel
Given layer 140 is provided with the first dykes and dams 161 and the second dykes and dams 162.First dykes and dams 161 are located at the second dykes and dams 162 and encapsulation region 102
It encapsulates between boundary.The dykes and dams can play the role of increasing the distance of water oxygen infiltration and preventing inkjet printing from forming organic film having
The problem of machine material is spread, and then improve package reliability.It is understood that in other embodiments, tft array substrate 120 and picture
Planarization layer (not shown) can be also equipped between plain confining layers 140.
Further, there is interval between the first dykes and dams 161 and the second dykes and dams 162.Display panel 100 further includes film envelope
Assembling structure 150.Thin-film packing structure 150 is set on viewing area 101 and encapsulation region 102, and thin-film packing structure 150 is in interval shape
At groove.
Specifically, thin-film packing structure 150 includes at least two layers of the inorganic encapsulated layer 151 being stacked, and setting exists
Organic encapsulation layer 152 between adjacent two layers inorganic encapsulated layer 151.Inorganic encapsulated layer 151 in such thin-film packing structure 150
Interval on the first dykes and dams 161 and the second dykes and dams 162, can increase the adhesive force of inorganic encapsulated layer.Thin-film packing structure
150 form groove in interval, can further play the role of the distance for increasing water oxygen infiltration, and then it is reliable to improve encapsulation
Property.It is understood that the setting of thin-film packing structure 150 is in encapsulation boundary.
Further, the organic encapsulation layer 152 of thin-film packing structure 150 is arranged within the second dykes and dams 162.It can so keep away
Exempt from organic encapsulation layer 152 organic material it is excessive caused by package failure problem.
It specifically, further include the third dykes and dams 163 for surrounding pixel confining layer 140 in encapsulation region 102, third dykes and dams 163 are set
It sets within the second dykes and dams 162, and is spaced and is arranged with the second dykes and dams 162.So further increase package reliability.
The utility model additionally provides the display panel 100 of an embodiment, is cut by above-mentioned display panel motherboard 10
It is formed.
The display panel 100 is including viewing area 101 and in the encapsulation region 102 of 101 periphery of viewing area, encapsulation region 102
With reflecting layer 110, reflecting layer 110 is source/drain.
Further, the source/drain in viewing area 101 positioned at outer rim, which extends to, forms reflecting layer 110 in encapsulation region 102.
The utility model additionally provides the display terminal of an embodiment, includes above-mentioned display panel 100.
The display terminal can be the equipment such as mobile phone, TV or tablet computer.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of display panel motherboard, which is characterized in that including multiple display panels and cutting around each display panel
Trough is cut, is provided with the first reflecting layer, first reflecting layer and the display surface at least partly shown cutting trough
The source/drain same layer of plate.
2. display panel motherboard as described in claim 1, which is characterized in that be located at least in the institute of the side of the display panel
It states in cutting trough and is provided with first reflecting layer.
3. display panel motherboard as described in claim 1, which is characterized in that the display panel includes binding area, described to tie up
Determine the side that area is located at the display panel；Wherein, the cutting trough and the binding area in the first reflecting layer are provided with
It is not located at the same side of the display panel.
4. display panel motherboard as claimed in claim 3, which is characterized in that the not set binding area of display panel
Side is provided with first reflecting layer in the cutting trough.
5. display panel motherboard as described in claim 1, which is characterized in that first reflecting layer is metallic reflector or gold
Belong to alloy reflective layer.
6. display panel motherboard as described in claim 1, which is characterized in that first reflecting layer is multilayered structure.
7. display panel motherboard as described in claim 1, which is characterized in that first reflecting layer be Ti/Al/Ti lamination or
Person's Mo/Al/Mo lamination.
8. display panel motherboard as described in any one of claims 1 to 7, which is characterized in that the display panel further includes envelope
Area is filled, the second reflecting layer is arranged in the non-display area in the encapsulation region, the encapsulation region in the cutting trough.
9. display panel motherboard as claimed in claim 8, which is characterized in that first reflecting layer and the second reflecting layer same layer
Setting.
10. as claim 9 requires the display panel motherboard, which is characterized in that first reflecting layer and the second reflection
Layer is metallic reflector.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820706360.7U CN208271949U (en) | 2018-05-11 | 2018-05-11 | display panel motherboard |
| PCT/CN2019/071468 WO2019214285A1 (en) | 2018-05-11 | 2019-01-11 | Display panel motherboard, display panel, and display panel manufacturing method |
| US16/565,504 US20200006714A1 (en) | 2018-05-11 | 2019-09-10 | Display panel motherboards, display panels, and methods for manufacturing display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820706360.7U CN208271949U (en) | 2018-05-11 | 2018-05-11 | display panel motherboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271949U true CN208271949U (en) | 2018-12-21 |
Family
ID=64682598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820706360.7U Active CN208271949U (en) | 2018-05-11 | 2018-05-11 | display panel motherboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208271949U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019214285A1 (en) * | 2018-05-11 | 2019-11-14 | 云谷（固安）科技有限公司 | Display panel motherboard, display panel, and display panel manufacturing method |
| CN110634925A (en) * | 2019-09-25 | 2019-12-31 | 京东方科技集团股份有限公司 | Display panel, manufacturing method and binding method thereof and display device |
-
2018
- 2018-05-11 CN CN201820706360.7U patent/CN208271949U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019214285A1 (en) * | 2018-05-11 | 2019-11-14 | 云谷（固安）科技有限公司 | Display panel motherboard, display panel, and display panel manufacturing method |
| CN110634925A (en) * | 2019-09-25 | 2019-12-31 | 京东方科技集团股份有限公司 | Display panel, manufacturing method and binding method thereof and display device |
| CN110634925B (en) * | 2019-09-25 | 2022-05-13 | 京东方科技集团股份有限公司 | Display panel, manufacturing method and binding method thereof and display device |
| US11493793B2 (en) | 2019-09-25 | 2022-11-08 | Beijing Boe Technology Development Co., Ltd. | Display panel and method for manufacturing same, bonding method, and display device |
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