CN107994042B - Many cameras module - Google Patents
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- CN107994042B CN107994042B CN201711215529.5A CN201711215529A CN107994042B CN 107994042 B CN107994042 B CN 107994042B CN 201711215529 A CN201711215529 A CN 201711215529A CN 107994042 B CN107994042 B CN 107994042B
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
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- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The embodiment of the invention discloses a multi-camera module, which comprises a bare chip, a packaging substrate and a module substrate. A side bonding pad is arranged on the outer side edge of the packaging substrate, and a welding material is arranged on the side bonding pad; the peripheral size of the packaging substrate is larger than that of the bare chip, and the size difference between the packaging substrate and the bare chip does not exceed a preset threshold; the bare chip is arranged on the packaging substrate, and the functional pins of the bare chip are connected to the side bonding pads by using a semiconductor lead process to form a packaging chip; the packaging chip is attached to the surface of the module substrate and connected with the welding pad of the module substrate through the side pad of the packaging chip. The image effect of the multi-camera module prepared by the application is equal to that of a module manufactured by a COB (chip on board) packaging process, but a bonding gold wire in the traditional COB packaging process is avoided, the production line equipment investment is less, and the manufacturing cost is lower; still reduced the volume of whole many camera modules, be favorable to many camera modules towards miniaturized trend development.
Description
Technical Field
The embodiment of the invention relates to the technical field of packaging photographic equipment, in particular to a multi-camera module.
Background
With the increasing requirements of users on the quality of imaging pictures, the technology of camera shooting and photographing equipment is forced to be continuously developed so as to obtain high-quality and high-definition pictures.
The optical quality of the lens and the size of the sensor determine the quality of the camera image, and the size of the sensor and the optical quality of the lens are limited according to the light and thin requirements of the image pickup device (such as a mobile terminal). And the pixels of a single camera face a bottleneck in the development of high altitude, and it is impossible to obtain a high-quality picture by improving the pixels, for example, 2000 ten thousand pixels reach the limit for a mobile phone camera. In addition, the user does not need to realize such high pixels by the mobile phone, but needs to have the functions of faster focusing speed, changing aperture and soft focus, reducing noise in night photographing, improving pixels, improving dynamic range, 3D modeling, optical zooming and the like. And by a single camera, even some algorithms cannot be completely realized. Therefore, multiple camera modules are produced.
In the field of multiple camera modules, the packaging and manufacturing process of the module affects the production cost and the module volume of the whole module. The existing module manufacturing processes include CSP (Chip Scale Package) and COB (Chip on Board) packaging.
The CSP packaging technology can make the area of a chip very close to the packaging area, the photosensitive chip is used for adding packaging glass and bottom welding solder balls on the bare chip, the solder balls at the bottom of the package are usually connected with a circuit of a circuit board, light can be slightly refracted and reflected when penetrating through the packaging glass, so that energy loss is caused, and the COB technology module of the bare chip is not directly used in the image effect and has good effect.
The COB packaging process module adopts a bare chip to bind a gold thread, namely, the bare chip is connected with a circuit of a circuit board by the gold thread. The upper part of the chip is not provided with packaging glass, the light sensing performance is better, and the image effect is superior to that of a CSP process module. The photosensitive chip is connected with the multi-camera module by bonding gold wires, a certain distance needs to be designed between the photosensitive chip and other devices of the module, please refer to fig. 1, that is, the distance between the devices such as capacitors and the like and the COB chip is larger than that of the CSP chip, and the whole volume of the COB packaging process module is larger than that of the CSP process module; and adopt COB packaging technology to make the module, need drop into COB nation bonding gold wire equipment, every equipment all is the million grades, establishes that COB technology produces the capital input that the line needs the huge sum, and the manufacturing cost of the module of making a video recording is higher.
In view of this, it is an urgent need to solve the problem of how to reduce the cost of the multi-camera module and to miniaturize the multi-camera module on the basis of ensuring the image effect of the multi-camera module.
Disclosure of Invention
The embodiment of the invention aims to provide the multi-camera module, which reduces the cost of the multi-camera module on the basis of ensuring the image effect of the multi-camera module, reduces the volume of the multi-camera module and is beneficial to realizing the miniaturization of the multi-camera module.
In order to solve the above technical problems, embodiments of the present invention provide the following technical solutions:
the embodiment of the invention provides a multi-camera module, which comprises:
bare chip, package substrate and module substrate;
a side bonding pad is arranged on the outer side edge of the packaging substrate, and a welding material is arranged on the side bonding pad; the peripheral size of the packaging substrate is larger than that of the bare chip, and the size difference between the packaging substrate and the bare chip does not exceed a preset threshold;
the bare chip is arranged on the packaging substrate, and the functional pins of the bare chip are connected to the side bonding pads by using a semiconductor lead process to form a packaging chip;
the packaging chip is attached to the surface of the module substrate and connected with the welding pad of the module substrate through the side bonding pad of the packaging chip.
Optionally, the bonding pad protection layer is further included;
the pad protection layer is arranged on the periphery of the welding pad and the side pad and used for preventing the welding pad and the side pad from being broken or peeled.
Optionally, the pad protection layer is formed by spraying glue on the peripheries of the welding pad and the side pad and then curing the glue.
Optionally, the packaged chip is attached to the surface of the module substrate in a glue painting manner or a semi-solid glue attaching manner.
Optionally, the connection between the side bonding pad of the package chip and the bonding pad of the module substrate is as follows:
and spot-welding the side bonding pads of the packaged chip on the bonding pads of the module substrate one by one through pulse laser emitted by a laser welding machine.
Optionally, the module substrate is provided with a plurality of packaged chips, and the packaged chips are different in packaging process type.
Optionally, the side pad is provided with a welding material:
and solder balls are planted on the outer side of the side bonding pad.
Optionally, the side pad is provided with a welding material:
and a metal sheet is pasted on the side bonding pad.
Optionally, two opposite outer side edges of the package substrate are provided with side pads.
Optionally, the functional pins of the bare chip are connected to the side pads by using a side lead or a through-lead process.
The embodiment of the invention provides a multi-camera module, which comprises a bare chip, a packaging substrate and a module substrate. A side bonding pad is arranged on the outer side edge of the packaging substrate, and a welding material is arranged on the side bonding pad; the peripheral size of the packaging substrate is larger than that of the bare chip, and the size difference between the packaging substrate and the bare chip does not exceed a preset threshold; the bare chip is arranged on the packaging substrate, and the functional pins of the bare chip are connected to the side bonding pads by using a semiconductor lead process to form a packaging chip; the packaging chip is attached to the surface of the module substrate and connected with the welding pad of the module substrate through the side pad of the packaging chip.
The technical scheme that this application provided's advantage lies in, with bare chip and the encapsulation base plate combination that is provided with the side pad for the encapsulation chip, then will encapsulate the chip and paste the dress on the module base plate, utilize the side pad of encapsulation chip to be connected with the pad on the module base plate. The image effect of preparing the multi-camera module is equal to that of a module manufactured by a COB (chip on board) packaging process, but the bonding gold wire in the traditional COB packaging process is avoided, namely expensive COB bonding equipment and expensive bonding gold wires are not needed, the investment of production line equipment is less, and the manufacturing cost is lower; the spacing that leaves because the gold thread is connected has still been eliminated to reduce the volume of whole many camera modules, be favorable to many camera modules towards miniaturized trend development.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a COB package process module according to the prior art according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a multi-camera module according to the present invention;
fig. 3 is a schematic structural diagram of a package substrate according to an embodiment of the invention;
FIG. 4 is a schematic top view of a packaged chip according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a packaged chip according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a structure in which functional pins of a bare chip are connected to side pads by a semiconductor wire bonding process according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a structure in which functional pins of a bare chip are connected to side pads by another semiconductor wire bonding process according to an embodiment of the invention;
FIG. 8 is a schematic structural diagram of a module substrate according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of an embodiment of a laser spot welding packaged chip and a module substrate according to the present invention;
fig. 10 is a schematic structural diagram of another embodiment of a multi-camera module according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of an embodiment of a dual-camera module according to an embodiment of the present invention.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first", "second", "third", "fourth", etc. in the description of the present application and the above-described drawings are used for distinguishing different objects, and are not used for describing a particular order. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may include other steps or elements not expressly listed.
Having described the technical solutions of the embodiments of the present invention, various non-limiting embodiments of the present application are described in detail below.
Referring to fig. 2, fig. 2 is a structural diagram of an embodiment of a multi-camera module according to an embodiment of the present invention, where the multi-camera module includes:
The multi-camera module can be two camera modules, or 3, 4 and other modules of a plurality of cameras; the camera module can be a fixed-focus lens type module, and also can be a miniature camera module with automatic focusing, optical zooming or other types; this is not intended to be limiting in any way.
The bare chip 21 is a photosensitive chip in a multi-camera module.
The package substrate 22 is provided with side pads 221 on the outer side, and a solder material 222 is provided on the side pads 221.
The side pads 221 may be disposed on any one of the outer sides of the package substrate 22, or on any plurality of outer sides, for example, 2, 3, etc., without affecting the implementation of the present application. In one embodiment, two side pads 221 may be disposed on two outer sides of the package substrate 22, for example, as shown in fig. 3, the side pads 221 are disposed on two opposite outer sides of the package substrate 22.
The side pads 221 are not limited to the half-hole structure shown in fig. 3, and may be pads with other shapes such as square, non-hollow, convex, etc., and the distribution structure of the pads may also be random, which is not limited in this application.
The solder ball may be the solder ball, and certainly, the solder ball may also be a metal of any other material, and the connection manner between the solder ball 222 and the side pad 221 is not limited in this application. For example, solder balls may be placed on the outer side of the side pads 221, or a metal plate may be attached to the side pads 221.
The peripheral size of the package substrate 22 is larger than the size of the bare chip 21, and the size difference between the package substrate and the bare chip does not exceed a preset threshold, which may be 2 mm. Generally, in order to reduce the volume of the whole multi-camera module, the size of the package substrate is slightly larger than the size of the bare chip 21, for example, the size of the bare chip 21 is 9 × 10mm (length × width), and the peripheral size of the package substrate 22 is 10 × 11mm (length × width).
The bare chip 21 is disposed on the package substrate 22, and the functional pins of the bare chip 21 are connected to the side pads 221 by a semiconductor wire bonding process to constitute a packaged chip.
The functional pins of the bare chip 21 can be connected to the side pads 221 by using a side wire or through-hole wire process, such as shown in fig. 6 and 7, but other semiconductor wire processes can be used, which does not affect the implementation of the present application.
In an embodiment, fig. 4 and 5 are schematic structural diagrams of a packaged chip, and fig. 4 and 5 are schematic top views and corresponding cross-sectional views of the packaged chip according to an embodiment of the present invention.
The packaged chip is attached to the surface of the module substrate 23 and connected to the bonding pads 231 of the module substrate 23 through the side pads 221 of the packaged chip.
The packaging of the bare chip can be completed by a professional chip packaging factory, and a camera module manufacturer directly uses the packaged chip to perform subsequent welding and mounting.
The module substrate 23 is a substrate on which other components of the multi-camera module are mounted by using Surface Mount Technology (SMT).
The package substrate 21 and the module substrate 23 include, but are not limited to, a flexible printed circuit board (FPC), a rigid Printed Circuit Board (PCB), a rigid-flex board or other types of circuit boards.
The packaged chip may be attached to the surface of the module substrate 23 by a glue drawing method, for example, as shown in fig. 8, or may be attached by a semi-solid glue or other methods, which is not limited in this application.
The package chip is connected to the module substrate 23 via the side pads 221 of the package substrate 22 and the bonding pads 231 of the module substrate 23.
The two pads (the side pads 221 and the bonding pads 231) can be connected by laser spot welding, i.e., the side pads of the packaged chip are spot-welded on the bonding pads of the module substrate one by the pulse laser emitted from the laser welding machine, as shown in fig. 9.
The mounting of the packaged chip and the module substrate 23 is not limited to a laser spot welding manner, and may be performed by ultrasonic or other high-energy welding processes.
It should be noted that a plurality of packaged chips may be disposed on the module substrate 23, and the packaging process types of the packaged chips are different. For example, 3 packaged chips are mounted on the module substrate 23, the first packaged chip is a light sensing chip packaged according to the technical scheme of the present application, the second packaged chip is a light sensing chip packaged by using a conventional COB packaging process, and the third packaged chip is a chip packaged by using a CSP packaging process. That is, the packaged chip mounted on the module substrate 23 may be a combination of a laser welding chip and a laser welding chip, or a combination of a laser welding chip and a COB chip, or a combination of a laser welding chip and a CSP chip or other package type chip.
After the packaging chips are connected with the module substrate, a base and a lens are respectively carried on each photosensitive chip for focusing detection, and the manufacture of the double-camera module or the multiple-camera module is completed.
In the technical scheme provided by the embodiment of the invention, the bare chip and the packaging substrate provided with the side bonding pads are combined into the packaging chip, then the packaging chip is attached to the module substrate, and the side bonding pads of the packaging chip are connected with the bonding pads on the module substrate. The image effect of preparing the multi-camera module is equal to that of a module manufactured by a COB (chip on board) packaging process, but the bonding gold wire in the traditional COB packaging process is avoided, namely expensive COB bonding equipment and expensive bonding gold wires are not needed, the investment of production line equipment is less, and the manufacturing cost is lower; the spacing that leaves because the gold thread is connected has still been eliminated to reduce the volume of whole many camera modules, be favorable to many camera modules towards miniaturized trend development.
In view of the pad being easily broken or peeled off, a pad protection layer 24 may be further included based on the above-described embodiment.
The pad protection layer 24 may be disposed at the peripheries of the bonding pad 231 and the side pad 221 for preventing the bonding pad 231 and the side pad 221 from being broken or peeled off.
The pad protection layer 24 may be a protection layer formed by spraying glue on the periphery of the bonding pad and the side pad and then curing the glue, for example, as shown in fig. 10, fig. 10 is a schematic structural view of another specific embodiment of a multi-camera module according to an embodiment of the present invention.
In order to ensure the welding reliability of the packaged chip, glue is sprayed and cured on the periphery of the packaging bonding pad formed by the welding bonding pad 231 and the side bonding pad 221, so that the two bonding pads are prevented from being easily broken and peeled off due to external force. The reliability of the multi-camera module is improved, the use cost of a user is reduced, and the use experience of the user is improved.
In order to make the principle of the technical solution of the present application more clear and definite by those skilled in the art, the present application also provides an embodiment, taking a dual-camera module as an example, please refer to fig. 11, which specifically includes:
the bare chip 111 is firstly mounted on the package substrate 112, the functional pins of the bare chip are led to the side pads of the package substrate 112 by a semiconductor lead process, and then solder balls or other metal materials are planted on the edges of the side pads of the package substrate 112. After the double-camera module substrate finishes SMT welding of other devices, the packaged chip is pasted on the module substrate 113, and the welding pad of the packaged substrate 113 is burned by laser welding equipment, so that the packaged chip is welded and conducted with the welding pad of the module substrate 112. In order to ensure the welding reliability of the packaged chip, glue is sprayed on the periphery of the packaging bonding pad and the formed bonding pad protective layer 114 is solidified, so that the bonding pad is prevented from being easily broken and stripped due to the influence of external force. And finally, respectively carrying the base 115 and the lens 116 for the double-shooting module, and carrying out focusing detection to complete the manufacture of the double-shooting module.
The camera module manufactured by the technical scheme has the advantages that the length and width of the camera module are smaller than all the sizes manufactured by the COB process, the image effect of the camera module is equal to that of the camera module manufactured by the COB process, the camera module is more suitable for smaller requirements and trends of the camera module, expensive COB bonding equipment and expensive bonding gold wires are not needed for manufacturing the double-camera or multi-camera module, the equipment investment of a production line is less, and the manufacturing cost is lower.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. For the embodiment disclosure device, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and for the relevant points, refer to the description of the method part.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The multi-camera module provided by the invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (8)
1. The utility model provides a many cameras module which characterized in that includes:
bare chip, package substrate and module substrate;
a side bonding pad is arranged on the outer side edge of the packaging substrate, and a welding material is arranged on the side bonding pad; the peripheral size of the packaging substrate is larger than that of the bare chip, and the size difference between the packaging substrate and the bare chip does not exceed a preset threshold;
the bare chip is arranged on the packaging substrate, and the functional pins of the bare chip are connected to the side bonding pads by using a semiconductor lead process to form a packaging chip; the module substrate is provided with a plurality of packaged chips, and the packaged chips are different in packaging process type;
the packaging chip is attached to the surface of the module substrate, and the side bonding pads of the packaging chip are spot-welded on the welding bonding pads of the module substrate one by one through pulse laser emitted by a laser welding machine.
2. The multi-camera module of claim 1, further comprising a pad protection layer;
the pad protection layer is arranged on the periphery of the welding pad and the side pad and used for preventing the welding pad and the side pad from being broken or peeled.
3. The multi-camera module of claim 2, wherein the pad protection layer is formed by spraying glue around the solder pads and the side pads and then curing the glue.
4. The multi-camera module of claim 1, wherein the packaged chips are attached to the surface of the module substrate by painting or attaching a semi-solid adhesive.
5. The multi-camera module of claim 1, wherein the placement of the solder material on the side pads is:
and solder balls are planted on the outer side of the side bonding pad.
6. The multi-camera module of claim 1, wherein the placement of the solder material on the side pads is:
and a metal sheet is pasted on the side bonding pad.
7. The multi-camera module of claim 1, wherein two opposing outer sides of the package substrate are provided with side pads.
8. The multi-camera module of claim 7, wherein the functional pins of the bare chip are connected to the side pads using a side-lead or through-lead process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711215529.5A CN107994042B (en) | 2017-11-28 | 2017-11-28 | Many cameras module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711215529.5A CN107994042B (en) | 2017-11-28 | 2017-11-28 | Many cameras module |
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| CN107994042A CN107994042A (en) | 2018-05-04 |
| CN107994042B true CN107994042B (en) | 2020-07-31 |
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| CN109361877B (en) * | 2018-12-25 | 2020-11-27 | 信利光电股份有限公司 | Multi-camera module assembly and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205179186U (en) * | 2015-07-28 | 2016-04-20 | 南昌欧菲光电技术有限公司 | Camera module and circuit board thereof |
| CN205336387U (en) * | 2015-12-21 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Make a video recording module and photosensitive device who seals is glued to routing |
| CN106505075A (en) * | 2016-12-27 | 2017-03-15 | 苏州晶方半导体科技股份有限公司 | Double image sensor encapsulation modules and forming method thereof |
| CN106817518A (en) * | 2015-11-30 | 2017-06-09 | 南昌欧菲光电技术有限公司 | Dual camera module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090152659A1 (en) * | 2007-12-18 | 2009-06-18 | Jari Hiltunen | Reflowable camera module with improved reliability of solder connections |
-
2017
- 2017-11-28 CN CN201711215529.5A patent/CN107994042B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205179186U (en) * | 2015-07-28 | 2016-04-20 | 南昌欧菲光电技术有限公司 | Camera module and circuit board thereof |
| CN106817518A (en) * | 2015-11-30 | 2017-06-09 | 南昌欧菲光电技术有限公司 | Dual camera module |
| CN205336387U (en) * | 2015-12-21 | 2016-06-22 | 宁波舜宇光电信息有限公司 | Make a video recording module and photosensitive device who seals is glued to routing |
| CN106505075A (en) * | 2016-12-27 | 2017-03-15 | 苏州晶方半导体科技股份有限公司 | Double image sensor encapsulation modules and forming method thereof |
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| CN107994042A (en) | 2018-05-04 |
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