CN1719614A - Image inductor packaging structure and mfg. method thereof - Google Patents
Image inductor packaging structure and mfg. method thereof Download PDFInfo
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- CN1719614A CN1719614A CNA200410063366XA CN200410063366A CN1719614A CN 1719614 A CN1719614 A CN 1719614A CN A200410063366X A CNA200410063366X A CN A200410063366XA CN 200410063366 A CN200410063366 A CN 200410063366A CN 1719614 A CN1719614 A CN 1719614A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims description 75
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 6
- 239000011469 building brick Substances 0.000 claims description 5
- 230000000295 complement effect Effects 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 18
- 238000005520 cutting process Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Solid State Image Pick-Up Elements (AREA)
Abstract
An image sensor packaging structure includes a base plate, a chip, a transparent cover and a lens module, among which, said base plate margins an upper surface and a lower surface and has multiple joint pads matched on the low surface matched with a light sensing component and multiple projectors around it and electrically connected to said joint pads, said transparent cover is matched in the through open-end of said base plate and covering said light sensing component, the lens module is matched on the upper surface of said base plate for leading light to the light-sensing component.
Description
Technical field
The invention relates to a kind of image inductor packaging structure,, have short packaging structure whole height particularly relevant for a kind of image inductor packaging structure.
Background technology
Image sensor (Image Sensor) semiconductor is a kind of semiconductor chip, and it is converted to electric signal with the light signal.This image sensor semiconductor comprises a photosensory assembly, such as a complementary metal oxide silicon (Complementary Metal-Oxide Semiconductor; CMOS) or a charge coupled device (CCD).
United States Patent (USP) the 5th, 636, No. 104, it is incorporated this paper into and thinks reference, discloses a kind of image inductor packaging structure 10, as shown in Figure 1.This image inductor packaging structure 10 comprises a chip 30, a shell (Housing) 14, lens 16, a glass 18, reaches a substrate 20.This chip 30 is electrically connected on this substrate 20 by a dozen wire-bond technology.This chip 30 has a photosensory assembly 32, and it is positioned at this shell (Housing) 14.This shell 14 is attached on this substrate 20, and supports these lens 16 and this glass 18.This shell 14, this glass 18, this substrate 20 form a confined space 12, in order to hold this chip 30.When light passes through these lens 16 and this glass 18, and shine this photosensory assembly 32, this photosensory assembly 32 will work to light, and convert electrical signal to.This substrate 20 is provided with a plurality of metallic circuits 22, a plurality of weld pad 24, reaches a plurality of tin balls 26.This tin ball 26 is electrically connected at this chip 30 by this metallic circuit 22 and this weld pad 24, and is electrically connected at an external circuit (not shown), in order to transmit the signal of this photosensory assembly 32.
Known image inductor packaging structure 10 is subject to this chip 30 and is disposed on this substrate 20 with the routing combination process, and its whole height (by the distance of these lens to this substrate) is long, so will limit the adjustment of light focal length (Focal Distance).Moreover, when known image inductor packaging structure 10 is installed on an electronic product,, so will make the volume of this electronic product become big because the whole height of this image inductor packaging structure 1O is long.
With reference to figure 2, another kind of known image inductor packaging structure 60 mainly comprises a chip 80, a shell (Housing) 64, lens 66, a glass 68, reaches a resin bed 70.This chip 80 is to be electrically connected at this resin bed 70 by a Flip Chip.This chip 80 has a photosensory assembly 82 and plurality of bump 84.This shell 64 is attached on this resin bed 70, and supports this lens 66.This glass 68 is disposed between this shell 64 and this resin bed 70.This resin bed 70 is provided with a plurality of metallic circuits 72 and a plurality of contact 76.This metallic circuit 72 is in order to be electrically connected at this contact 76 this projection 84 of this chip 80.This contact 76 is electrically connected at an external circuit 90, in order to transmit the signal of this photosensory assembly 82.Though the whole height of above-mentioned image inductor packaging structure 60 (by the distance of these lens 66 to this chip 80) is reduced, for small electronic product, the whole height of its image inductor packaging structure 60 is still long.
Therefore, the image inductor packaging structure that a kind of wafer scale (Wafer Level) need be provided is arranged just, can solve aforesaid drawbacks.
Summary of the invention
The purpose of this invention is to provide a kind of image inductor packaging structure, have less packaging structure whole height.
For achieving the above object, the invention provides a kind of image inductor packaging structure, comprise a substrate, a chip, a transparent outer cover, reach a lens module.This substrate defines a upper surface and a lower surface, and has a plurality of connection pads, be disposed on this lower surface, and one runs through opening.This chip defines an active surface, and have a photosensory assembly be disposed on this active surface, and plurality of bump be disposed at periphery on this active surface, and be electrically connected to this connection pad.This transparent outer cover be disposed at this substrate this run through in the opening, and be covered on this photosensory assembly.This lens module is disposed on this upper surface of this substrate, in order to guide light to this photosensory assembly.
According to image inductor packaging structure of the present invention, its chip is to be connected in this substrate with a flip chip type formula, therefore can reduce the height of this image inductor packaging structure.Moreover this transparent outer cover directly is covered in this chip, also can reduce the height of this image inductor packaging structure.Therefore, compared to known image inductor packaging structure, this image inductor packaging structure has short whole height.
Description of drawings
In order to allow above and other objects of the present invention, feature and the advantage can be more obvious, preferred embodiment of the present invention cited below particularly, and conjunction with figs. is described in detail below:
Fig. 1 is the generalized section of an image inductor packaging structure of known technology.
Fig. 2 is the generalized section of another image inductor packaging structure of known technology.
Fig. 3 is the generalized section according to image inductor packaging structure of the present invention.
Fig. 4 to Figure 14 is the manufacture method according to image inductor packaging structure of the present invention.
Embodiment
With reference to figure 3, it shows image inductor packaging structure 100 according to an embodiment of the invention.This image inductor packaging structure 100 comprises a chip 130, a transparent outer cover 118, a substrate 120, reaches a lens module 116.This chip 130 has an active surface 136, one back sides 137, and a photosensory assembly 132 and plurality of bump 134 be disposed on this active surface 136, and this plurality of bump 134 is disposed at the periphery on the active surface 136 of this chip 130.In more detail, this plurality of bump 134 configurable on the active surface 136 of this chip 130 single side, dual-side, three sides or go up all around.This photosensory assembly 132 can be complementary metal oxide silicon (Complementary Metal-Oxide Semiconductor; CMOS) or charge coupled device (CCD).This projection 134 can be a gold medal projection or a solder bump.
This transparent outer cover 118 is attached on this chip 130 by a sealant 146, and covers this photosensory assembly 132.Sealing agent 146 can be a ultraviolet curing solid (UV glue), and preferably, it has a plurality of spacer particles 144 and is mixed in wherein.Sealing agent 146 is disposed between this transparent outer cover 118 and this chip 130, and therebetween distance can be depending on the size of this spacer particle 144.This transparent outer cover 118 can be the filter of any pattern, such as an infrared ray low pass filter (IR Low Pass Filter), perhaps is a transparent material manufacturing, such as glass.It is that glass (Borosilicate Glasses) is made that this spacer particle 144 can be borosilicate.
This substrate 120 has a relative upper surface 128 and an a lower surface 129, and has one and run through opening 121, runs through this substrate 120, and is corresponding with this photosensory assembly 132 of this chip 130.This projection 134 of this chip 130 is by Flip Chip, be connected on a plurality of connection pads 123 on the lower surface 129 of this substrate 120, and this transparent outer cover 118 is arranged in this and runs through opening 121.One fills glue 148 is disposed between this lower surface 129 of this chip 130 and this substrate 120, and seals this plurality of bump 134.A plurality of connection pads 126 are disposed on this lower surface 129 of this substrate 120, and by a plurality of first metallic circuits 122 and a plurality of connection pad 123, are electrically connected at this plurality of bump 134 of this chip 130.These a plurality of connection pads 126 can be via a plurality of tin balls 127, and are electrically connected at an external circuit 140 by a hot pressing processing procedure, such as a flexible printer circuit (FlexiblePrinted Circuit).Be familiar with this technology personage as can be known, this substrate 120 can have a welding resisting layer (not shown) in addition, is disposed on this lower surface 129, in order to define this connection pad 123 and connection pad 126.This substrate 120 is that a glass reinforced epoxy is made, such as: FR4 glass reinforced epoxy (Fiber Glass Reinforced Epoxy Resin) substrate or a glass fiber-reinforced BT (Bismalemide Triazine) resin substrate.
This substrate 120 is a multilager base plate, it has a plurality of second metallic circuits 156 in addition and is disposed on the upper surface 128 of this substrate 120, and a plurality of vias (Electrical Via) 152, electrically connect this first metallic circuit 122 and this second metallic circuit 156.A plurality of electronic building bricks 158 such as passive component, are disposed on this upper surface 128 of this substrate 120, and are electrically connected to this second metallic circuit 156.These a plurality of vias 152 can be a laser micropore (Laser via).
This lens module 116 has lens 117, and it is carried on this upper surface 128 of this substrate 120 by a shell 114, in order to collected light on this photosensory assembly 132.This shell 114 is attached on this upper surface 128 of this substrate 120.This lens module 116 has one in addition and adjusts assembly 115, in order to adjust the distance of these lens 117 and this photosensory assembly 132.
Now please refer to Fig. 4 to Figure 14, it is in order to the manufacture method of explanation according to this image inductor packaging structure 100 of the present invention.
Have a plurality of chips 130 with reference to figure 4,5, one wafers 160,130 of adjacent chips are separated by with line of cut 164.This wafer 160 or this chip 130 have an active surface 136 and a back side 137.Each chip 130 all has a photosensory assembly 132 and is disposed on this active surface 136.This line of cut 164 is positioned on the active surface 136 of this wafer 160 or this chip 130.
At first, one group of telltale mark of cutting on this wafer 160 is such as two otch 163, in order to define a two-dimentional reference coordinate 162.By this two dimension reference coordinate 162, and, just can define line of cut, and cut this wafer 160 accurately by the back side 137 of this wafer 160 with reference to the length and the width of this chip 130.Note that in the successive process of manufacturing method according to the invention this wafer 160 can be cut into other chip 130 along this line of cut 164.Yet under the preferable situation, by the back side 137 these wafers 160 of cutting of this wafer 160, but this back side 137 does not provide line of cut, so this wafer 160 need provide telltale mark, so that by the back side 137 these wafers 160 of cutting.This telltale mark can be the opening that runs through of any pattern, and such as otch, impenetrating mouth and groove, cutting coordinate or line of cut are defined in the back side 137 that is used to this wafer 160.
With reference to figure 6,7, on this active surface 136 of this chip 130, form plurality of bump 134, and be disposed at the periphery of the active surface 136 of this chip 130.
Be provided earlier with reference to figure 8,9, one transparent outer cover substrates 170, a plurality of groove 172 portraitlandscapes are formed on the surface 142 of this transparent outer cover substrate 170 then.The dual-side 174 of each this groove 172 defines two lines of cut 176 respectively, and defines a plurality of transparent outer covers 118 thus.
With reference to Figure 10, a plurality of sealants 146, preferably, it is to mix a plurality of spacer particles 144, on this active surface 136 that is disposed at these a plurality of chips 130 circlewise, and individually around this photosensory assembly 132.Being skillful in the present technique personage can understand, and sealing agent 146 mixes this spacer particle 144, also configurable on this surface 142 of this transparent outer cover substrate 170.
With reference to Figure 11, with 170 alignment of this transparent outer cover substrate and be covered on this wafer 160, these a plurality of grooves 172 are respectively corresponding to these a plurality of lines of cut 164, and these a plurality of grooves 172 hold this plurality of bump 134.Afterwards, sealing agent 146 is solidified, with so that this transparent outer cover substrate 170 be attached on this wafer 160.In in the case, this photosensory assembly 132 is sealed in sealing agent 146 and this transparent outer cover substrate 170.
With reference to Figure 12, by this two dimension reference coordinate, and with reference to the length and the width of this chip 130, with a cutting instrument 183 in the back side of this wafer 160 137 these wafers 160 of cutting.Another cutting tool 182 is along these line of cut 176 these transparent outer cover substrates 170 of cutting.When practical operation, this cutting tool 183 and 182 can be cuts this wafer 160 and this transparent outer cover substrate 170 or cut and wear, and carries out (breaking) operation of splitting afterwards again, to form other optical module packaging structure 190, is shown among Figure 13.
With reference to Figure 14, one substrate 120 defines a upper surface 128 and a lower surface 129, and has one and run through opening 121, a plurality of first metallic circuits 122 and be disposed at this lower surface 129, a plurality of second metallic circuits 156 and be disposed at this upper surface 128 and a plurality of via 152 in order to this second metallic circuit 156 is electrically connected to this first metallic circuit 122.This substrate 120 can provide a plurality of electronic building bricks 158 in addition, and for example, this electronic building brick 158 is disposed on this upper surface 128, is connected in this second metallic circuit 156.
This substrate 120 has a plurality of connection pads 123 and connection pad 126 in addition, is disposed on this lower surface 129, and is electrically connected to this first metallic circuit 122.This optical module packaging structure 190 is fixed on the lower surface 129 of this substrate 120 by Flip Chip, and this transparent outer cover 118 is arranged in this and runs through opening 121.Projection 134 on this chip 130 can be connected on this connection pad 123 by back welding process (reflow).Then, one fills glue 148 by dispensing and capillarity, and filling is in 120 of this chip 130 and this substrates.Then, these a plurality of connection pads 126 can be via a plurality of tin balls 127, and are electrically connected at an external circuit 140 by a hot pressing processing procedure, on a flexible printer circuit (FlexiblePrinted Circuit).Being skillful in the present technique personage can understand, and this external circuit 140 can be the circuit board of any pattern, and this substrate 120 also can be fixed on this external circuit board 140 by different modes.
Then, a lens module 116 that will have a shell 114 and an adjustment assembly 115 is attached on this upper surface 128 of this substrate 120, so can form this image inductor packaging structure 100, as shown in Figure 3.
This chip 130 of image inductor packaging structure 100 is to be connected in this substrate 120 with a flip chip type formula according to an embodiment of the invention, therefore can reduce the height (by the distance of these lens 117 to this chip 130) of this image inductor packaging structure 100.Moreover this transparent outer cover 118 directly is covered in this chip 130, also can reduce the height of this image inductor packaging structure 100.Therefore, compared to known image inductor packaging structure, this image inductor packaging structure 100 has short whole height.
Though the present invention discloses with previous embodiment, so it is not in order to limiting the present invention, anyly has the knack of this technology personage, without departing from the spirit and scope of the present invention, and when doing various changes and modification.Therefore protection scope of the present invention should be defined with the claim of application and is as the criterion.
Claims (41)
1, a kind of image inductor packaging structure comprises:
One substrate defines a upper surface and a lower surface, and has a plurality of first connection pads, be disposed on this lower surface, and one runs through opening;
One chip defines an active surface, and have a photosensory assembly be disposed on this active surface, and plurality of bump be disposed at periphery on this active surface, and be electrically connected to this first connection pad;
One transparent outer cover, this that is disposed at this substrate runs through in the opening, and is covered on this photosensory assembly; And
One lens module is disposed on this upper surface of this substrate, in order to guide light to this photosensory assembly.
According to the image inductor packaging structure of claim 1, it is characterized in that 2, other comprises:
One sealant is disposed between this transparent outer cover and this chip, in order to this transparent outer cover is attached on this chip.
According to the image inductor packaging structure of claim 1, it is characterized in that 3, wherein the sealing agent is a ultraviolet curing solid.
According to the image inductor packaging structure of claim 2, it is characterized in that 4, other comprises:
A plurality of spacer particles are disposed in the sealing agent, in order to control the distance between this transparent outer cover and this chip.
According to the image inductor packaging structure of claim 4, it is characterized in that 5, wherein this spacer particle is that borosilicate glass is made.
According to the image inductor packaging structure of claim 4, it is characterized in that 6, wherein this spacer particle has consistent height.
According to the image inductor packaging structure of claim 1, it is characterized in that 7, other comprises:
One fills glue, is disposed between this chip and this substrate, and seals this plurality of bump.
According to the image sensing packaging structure of claim 1, it is characterized in that 8, wherein this substrate has in addition:
A plurality of second connection pads are disposed on this lower surface, are electrically connected at this first connection pad, in order to be connected to an external circuit.
According to the image sensing packaging structure of claim 8, it is characterized in that 9, wherein this substrate has a plurality of tin balls in addition, in order to being electrically connected at this external circuit by a plurality of second connection pads.
According to the image inductor packaging structure of claim 9, it is characterized in that 10, wherein this tin ball is to be connected in this external circuit by a hot pressing processing procedure.
According to the image inductor packaging structure of claim 9, it is characterized in that 11, wherein this external circuit is a flexible printer circuit.
According to the image inductor packaging structure of claim 8, it is characterized in that 12, wherein substrate has in addition:
A plurality of electronic building bricks are disposed on this upper surface of this substrate, and are electrically connected to this first connection pad.
According to the image inductor packaging structure of claim 1, it is characterized in that 13, wherein lens module has:
One lens; And
One shell carries this lens, and is attached on this upper surface of this substrate.
14, according to the image inductor packaging structure of claim 13, wherein lens module has in addition:
One adjusts assembly, in order to adjust the distance of these lens and this photosensory assembly.
According to the image inductor packaging structure of claim 1, it is characterized in that 15, wherein this projection is a gold medal projection.
According to the image inductor packaging structure of claim 1, it is characterized in that 16, wherein this projection is a solder bump.
According to the image inductor packaging structure of claim 1, it is characterized in that 17, wherein this transparent outer cover is a filter.
According to the image inductor packaging structure of claim 17, it is characterized in that 18, wherein this filter is a glass.
According to the image inductor packaging structure of claim 17, it is characterized in that 19, wherein this filter is an infrared ray low pass filter.
According to the image inductor packaging structure of claim 1, it is characterized in that 20, wherein this photosensory assembly is a complementary metal oxide silicon.
According to the image inductor packaging structure of claim 1, it is characterized in that 21, wherein this photosensory assembly is a charge coupled device.
22, a kind of manufacture method of image inductor packaging structure comprises the following step:
One wafer is provided, has an active surface and a back side, this active surface has a plurality of first lines of cut and defines each individual chip, and this chip has a photosensory assembly and is disposed on this active surface;
On this active surface of this chip, form plurality of bump;
One transparent outer cover substrate is provided, defines a surface;
Form a plurality of grooves on this surface of this transparent outer cover substrate, the dual-side of each groove defines two second lines of cut respectively, and defines a plurality of transparent outer covers thus;
With the alignment of this transparent outer cover substrate and be installed on this wafer;
By the back side of this wafer, along this first line of cut, cut this wafer, and cut this transparent outer cover substrate, to form other optical module packaging structure along this second line of cut;
One substrate is provided, defines a upper surface and a lower surface, and have a plurality of first connection pads, be disposed on this lower surface, and have one and run through opening;
This optical module packaging structure is alignd with this substrate, make this transparent outer cover be arranged in this and run through opening, and the projection on this chip is disposed at and is electrically connected on this connection pad; And
One lens module is provided, is attached on this upper surface of this substrate, so can form this image inductor packaging structure.
23, according to the manufacture method of the image inductor packaging structure of claim 22, it is characterized in that other comprises the following step:
On this wafer, form one group of telltale mark, so that cut this wafer by the back side of this wafer.
24, according to the manufacture method of the image inductor packaging structure of claim 22, it is characterized in that other comprises the following step:
With a sealant, be disposed at this transparent outer cover substrate and this chip both one on, in order to this transparent outer cover substrate is attached on this chip.
25, according to the manufacture method of the image inductor packaging structure of claim 24, it is characterized in that other comprises the following step:
A plurality of spacer particles are provided, mix mutually, in order to control the distance between this transparent outer cover substrate and this chip with the sealing agent.
26, according to the manufacture method of the image inductor packaging structure of claim 22, it is characterized in that other comprises the following step:
Provide one to fill glue, be disposed between this chip and this substrate, and seal this plurality of bump.
27, according to the manufacture method of the image inductor packaging structure of claim 22, it is characterized in that wherein this substrate has in addition:
A plurality of second connection pads are disposed on this lower surface, are electrically connected at this first connection pad, in order to be connected to an external circuit.
28, according to the manufacture method of the image inductor packaging structure of claim 27, it is characterized in that other comprises the following step:
A plurality of tin balls are disposed on this this second connection pad; And
This tin ball is electrically connected at this external circuit.
29, according to the manufacture method of the image inductor packaging structure of claim 28, it is characterized in that wherein this tin ball is to be connected in this external circuit by a hot pressing processing procedure.
30, according to the manufacture method of the image inductor packaging structure of claim 27, it is characterized in that wherein this external circuit is a flexible printer circuit.
31, according to the manufacture method of the image inductor packaging structure of claim 27, it is characterized in that wherein this substrate has in addition:
With a plurality of electronic building bricks, be disposed on this upper surface of this substrate, and be electrically connected to this first connection pad.
32, according to the manufacture method of the image inductor packaging structure of claim 22, it is characterized in that wherein lens module has:
One lens; And
One shell carries these lens, is attached on this upper surface of this substrate.
33, according to the manufacture method of the image inductor packaging structure of claim 32, it is characterized in that wherein lens module has in addition:
One adjusts assembly, in order to adjust the distance of these lens and this photosensory assembly.
34, a kind of optical module packaging structure comprises:
One chip defines an active surface, and have a photosensory assembly be disposed on this active surface, and plurality of bump be disposed on this active surface around; And
One transparent outer cover is covered on this photosensory assembly.
35, according to the optical module packaging structure of claim 34, it is characterized in that other comprises:
One sealant is disposed between this transparent outer cover and this chip, in order to this transparent outer cover is attached on this chip.
36, according to the optical module packaging structure of claim 35, it is characterized in that other comprises:
A plurality of spacer particles are disposed in the sealing agent, in order to control the distance between this transparent outer cover and this chip.
37, a kind of manufacture method of optical module packaging structure comprises the following step:
One wafer is provided, has an active surface and a back side, this active surface has a plurality of first lines of cut and defines each individual chip, and this chip has a photosensory assembly and is disposed on this active surface;
On this active surface of this chip, form plurality of bump;
One transparent outer cover substrate is provided, defines a surface;
Form a plurality of grooves on this surface of this transparent outer cover substrate, the dual-side of each groove defines two second lines of cut respectively, and defines a plurality of transparent outer covers by this;
With the alignment of this transparent outer cover substrate and be installed on this wafer; And
By the back side of this wafer, along this first line of cut, cut this wafer, and cut this transparent outer cover substrate, to form other optical module packaging structure along this second line of cut.
38, according to the manufacture method of the optical module packaging structure of claim 37, it is characterized in that other comprises the following step:
On this wafer, form one group of telltale mark, so that cut this wafer by the back side of this wafer.
39, according to the manufacture method of the optical module packaging structure of claim 37, it is characterized in that other comprises the following step:
With a sealant, be disposed at this transparent outer cover substrate and this chip both one of on the person, in order to this transparent outer cover substrate is attached on this chip.
40, according to the manufacture method of the optical module packaging structure of claim 39, it is characterized in that other comprises the following step:
A plurality of spacer particles are provided, mix mutually, in order to control the distance between this transparent outer cover substrate and this chip with the sealing agent.
41, according to the manufacture method of the optical module packaging structure of claim 37, it is characterized in that other comprises the following step:
Provide one to fill glue, be disposed between this chip and this substrate, and seal this plurality of bump.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB200410063366XA CN100364101C (en) | 2004-07-08 | 2004-07-08 | Image inductor packaging structure and mfg. method thereof |
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| CNB200410063366XA CN100364101C (en) | 2004-07-08 | 2004-07-08 | Image inductor packaging structure and mfg. method thereof |
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| CN1719614A true CN1719614A (en) | 2006-01-11 |
| CN100364101C CN100364101C (en) | 2008-01-23 |
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| CNB200410063366XA Expired - Fee Related CN100364101C (en) | 2004-07-08 | 2004-07-08 | Image inductor packaging structure and mfg. method thereof |
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| CN (1) | CN100364101C (en) |
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| CN104465797A (en) * | 2014-12-26 | 2015-03-25 | 江苏长电科技股份有限公司 | Packaging structure provided with trumpet-shaped opening and used for light-sensing chip and technological method |
| CN106653783A (en) * | 2015-11-04 | 2017-05-10 | 豪威科技股份有限公司 | Wafer level method for encapsulating camera module and related camera module |
| WO2017088729A1 (en) * | 2015-11-27 | 2017-06-01 | 苏州晶方半导体科技股份有限公司 | Image sensing chip packaging structure and method |
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| WO2019196584A1 (en) * | 2018-04-09 | 2019-10-17 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, and manufacturing methods therefor |
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| CN110636185A (en) * | 2018-06-21 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and intelligent terminal equipment |
| CN112951864A (en) * | 2021-04-29 | 2021-06-11 | 中国科学院长春光学精密机械与物理研究所 | Narrow-edge flexible packaging structure of image sensor for splicing and packaging method thereof |
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| JPH08116042A (en) * | 1994-10-18 | 1996-05-07 | Olympus Optical Co Ltd | Solid-state image sensing device and its manufacture |
| EP1041628A3 (en) * | 1999-03-29 | 2008-05-28 | Interuniversitair Microelektronica Centrum Vzw | An image sensor ball grid array package and the fabrication thereof |
| JP3887162B2 (en) * | 2000-10-19 | 2007-02-28 | 富士通株式会社 | Imaging semiconductor device |
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- 2004-07-08 CN CNB200410063366XA patent/CN100364101C/en not_active Expired - Fee Related
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| CN107644883A (en) * | 2016-07-21 | 2018-01-30 | 许志行 | Portable electronic devices and its image acquiring module |
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| CN108010931A (en) * | 2017-12-28 | 2018-05-08 | 苏州晶方半导体科技股份有限公司 | A kind of encapsulating structure and method for packing of optical finger print chip |
| WO2019196584A1 (en) * | 2018-04-09 | 2019-10-17 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, and manufacturing methods therefor |
| CN110364540A (en) * | 2018-04-09 | 2019-10-22 | 宁波舜宇光电信息有限公司 | Photosensory assembly, camera module and preparation method thereof |
| CN110636185A (en) * | 2018-06-21 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and intelligent terminal equipment |
| CN112951864A (en) * | 2021-04-29 | 2021-06-11 | 中国科学院长春光学精密机械与物理研究所 | Narrow-edge flexible packaging structure of image sensor for splicing and packaging method thereof |
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