JP3100560U - Flip chip package structure of image sensor and its image sensor module - Google Patents

Abstract

A flip chip package structure of an image sensor capable of improving product reliability and reducing manufacturing cost and an image sensor module thereof are provided.
An upper surface of an image sensor semiconductor chip is in contact with a lower surface of a glass plate, and a large number of electronic contacts are provided on the image sensor semiconductor chip. A conductive connecting circuit 21 is formed on the lower surface of the glass plate 20, and a similar number of first bonding points are formed on the conductive connecting circuit 21 according to the positions of the electronic contacts. It is electrically connected to electronic contacts. The second bonding point of the conductive connection circuit 21 is concentrated on any one side of the glass plate 20. A shield 24 covers the lower surface of the glass plate 20 and the peripheral surface of the glass plate 20 other than the image sensor semiconductor chip 10.
[Selection diagram] Fig. 1

Description

The present invention forms an electronic circuit on the surface of a glass plate, thereby accurately positioning a lens set by a flip chip package structure of an image sensor to which a flip chip and a circuit board can be bonded, and a precise contour of the glass plate. The present invention relates to an image sensor module.

Currently, ceramic packages (CLCC), resin substrate packages (PLCC), and C / F resin injection packages (KLCC) are widely applied as image sensor package technologies. The main common feature of these package technologies is to place the chip on the die pad and then perform wire bonding. However, electronic products are required to be lighter, thinner and shorter, have more functions, and have higher speeds. The number of input / output terminals of the device is increasing, and the thickness is becoming smaller and the area is becoming smaller. Surface adhesive technology was developed after insertion-type components became unusable due to limitations on the dimensions of the insertion holes in the circuit board. According to the surface adhesive technology, the number of input / output terminals of a component can be increased, and the volume of the component can be reduced. However, since the reduction in the distance of the terminals has exceeded the technology for increasing the density of the printed circuit board, the arrangement of the terminals of the components has been changed from the peripheral arrangement to the array arrangement, thereby improving the non-defective rate of assembly. However, as the number of input / output terminals of the component increases, the dimensions of the package also increase, so that problems such as poor soldering and deformation of the board are likely to occur. The most effective method for solving the above problem is to reduce the resin portion other than the chip as much as possible. When the volume of a packaged component is almost the same as the size of a chip, the concept of a package has been created to approximate the size of the chip.

Therefore, the current packaging technology is progressing to the flip-chip packaging method. This package-based manufacturing process requires bumps to be grown on the wafer and then solder-bonded to the electronic contacts on the board, so the top surface of the chip needs to be directed to the board, In order to limit the precondition that the sensing zone of the chip must be open, the flip-chip package method has excellent electrical characteristics, smaller package dimensions, and excellent heat dissipation characteristics of the chip. Application to sensors is still difficult.

FIG. 9 shows a flip-chip package structure of a conventional image sensor, in which an electronic circuit 910 is formed on the inner surface of a glass plate 91 above by a light mask etching technique, and the flip-chip technique is used. The chip 92 is solder-bonded to the electronic contacts in the central zone of the glass plate 91 by soldering, and tin balls 94 are separately attached to the electronic contacts around the glass plate 91 in order to adhere to the surface of the circuit board 95. Is provided. The problem of such a design is that if the diameter of the tin ball 94 provided around the glass plate 91 is not larger than the thickness of the chip, the reliability is not high even when bonding to the circuit board. Therefore, the area of the glass plate must be increased in order to maintain a proper distance between each tin ball. This adversely affects the dimensions of the lens set 8 covering the image sensor, so that such flip-chip packaging technology has room for improvement.

The main purpose of the present invention is to solve the above-mentioned problems, to be able to complete the assembly with the surface adhesive package equipment, reduce the investment of production equipment, improve the reliability of the product, reduce the manufacturing cost, Provided is a flip-chip package structure of an image sensor capable of greatly reducing the volume of a package, and an image sensor module thereof.

According to a first aspect of the present invention, there is provided a semiconductor device for an image sensor, wherein an upper surface of a semiconductor chip for an image sensor is in contact with a lower surface of a glass plate, and a plurality of electronic contacts are provided on the semiconductor chip for the image sensor. That is, a conductive connection circuit is formed on the lower surface of the glass plate, and a similar number of first bonding points are formed according to the positions of electronic contacts formed on the image sensor semiconductor chip. The first and second bonding points of the conductive connection circuit are formed in the conductive connection circuit, and the first bonding points of the conductive connection circuit are electrically connected to the electronic contacts. And that the lower surface of the glass plate other than the image sensor semiconductor chip and the peripheral surface of the glass plate are covered with a shielding object. It is summarized in that a flip-chip package structure of the image sensor.

According to claim 7 of the present invention, the upper surface of the image sensor semiconductor chip is in contact with the lower surface of the glass plate, and a plurality of electronic contacts are provided on the image sensor semiconductor chip; A conductive coupling circuit is formed on the lower surface of the semiconductor chip, and a similar number of first bonding points are formed in the conductive coupling circuit according to positions of electronic contacts formed on the image sensor semiconductor chip, The first bonding points are electrically connected to the electronic contacts, and the second bonding point of the conductive connection circuit is concentrated on the side of the glass plate, and the lens set is supported. The support seat rests on the upper surface of the glass plate, and the thickness of the sidewall extending from the bottom is at least the same as the thickness of the glass plate. The cover covers three sides of the glass plate, leaving an opening, and a conductive connecting circuit provided in the glass plate extends out of the support seat from the opening. The gist is that it is a video sensor module.

第一 With reference to FIG. 1, the first embodiment of the flip chip package structure of the image sensor according to the present invention will be described in detail. In the flip-chip package structure 1 of this image sensor, an upper surface 11 of an image sensor semiconductor chip 10 is brought into contact with a lower surface of a glass plate, and the periphery of the chip 10 is filled with a gel 12 so as to be air-tight. A large number of bonding pads 111 are provided on the sensor semiconductor chip 10, and solder balls 13 such as tin balls are provided on each bonding pad 111. A conductive connection circuit 21 is formed on the lower surface, and a similar number of first bonding points 22 are provided in the conductive connection circuit in accordance with the positions of the bonding pads 111 formed on the image sensor semiconductor chip 10. Formed, and their first bonding points 22 are electrically connected to the bonding pads 111. That is, as shown in FIG. 3, the second bonding point 211 of the conductive connection circuit 21 is concentrated on any one side of the glass plate 20. This includes that the shield 24 covers the lower surface of the glass plate 20 and the peripheral surface of the glass plate 20 other than the above.

By covering the lower surface of the glass plate 20 other than the image sensor semiconductor chip 10 and the peripheral surface of the glass plate 20 with the shield 24, the light beam passes through the bottom of the glass plate 20 and the image sensor semiconductor chip 10 It is possible to avoid adversely affecting the photographing quality and to make the periphery of the image sensor semiconductor chip 10 airtight.

第二 Referring to FIG. 2, a second embodiment of the flip-chip package structure of the image sensor according to the present invention will be described in detail. The flip-chip package structure 3 of the image sensor has an upper surface 31 of an image sensor semiconductor chip 30 in contact with the lower surface of the glass plate 20, and fills the periphery of the chip 30 with the gel 12, thereby making the chip 30 airtight. A plurality of bumps 311 are provided on the image sensor semiconductor chip 10, and a conductive connection circuit 21 is formed on the lower surface of the glass plate 20. A similar number of first bonding points 22 are formed in the conductive connection circuit 21 according to the positions of the bumps 311 that have been formed, and the first bonding points 22 are electrically connected to the bumps 311; The second bonding point 211 of the conductive connection circuit 21 is concentrated on any one side of the glass plate 20. And it has, above the peripheral surface of the lower surface and the glass plate 20 of the image sensor for the semiconductor chip 30 a glass plate 20 other than and a possible shield 24 is covered.

By covering the lower surface of the glass plate 20 other than the image sensor semiconductor chip 30 and the peripheral surface of the glass plate 20 with the shield 24, the light beam passes through the bottom of the glass plate 20 and It is possible to avoid adversely affecting the photographing quality and to make the periphery of the image sensor semiconductor chip 10 airtight.

As shown in FIG. 5, the manufacturing process of the flip-chip package structure of the above two types of image sensors is performed by using a light mask etching technique on a surface of any one of the glass plates 2 having a large area. As shown in FIG. 6, the semiconductor chip 10 for image sensor or the semiconductor chip 30 for image sensor is bonded to the plurality of first bonding points 22 in a flip chip manner by a surface adhesive package facility as shown in FIG. Then, each first bonding point 22 is electrically connected to a bonding pad or a bump formed on the semiconductor chip for an image sensor.

Finally, when the sections formed on the glass plate 2 are divided, a number of packaged image sensors are completed. Then, depending on the requirements of the applied product, it is determined whether or not the lower surface of the glass plate 20 other than the image sensor semiconductor chip 30 is covered with the shield 24.

According to the flip-chip package structure of the image sensor shown in FIGS. 1 and 2, since the conductive connection circuit on the glass plate is formed by an etching process, the circuit can be laid out in an extremely narrow width. A package volume close to the chip dimensions and a very thin thickness can be achieved. In addition, since the second bonding point of the conductive connection circuit is concentrated on any one side of the glass plate, it can be connected to a circuit board in an applied product by soldering, and an appropriate layout is used. If so, the gap between these second bonding points can be larger. This can improve the reliability of bonding with the circuit board.

Of course, the present invention allows various design changes. For example, the arrangement of the second bonding points 211 of the conductive connection circuits 21 concentrated on any one side of the glass plate may be arranged in parallel at a distance as shown in FIG. As shown in FIG. 4, it may be distributed in an array form. The second bonding points 211 distributed in an array form can prevent the second bonding points 211 of the conductive connection circuit from becoming dense when there are many terminals of the semiconductor chip for an image sensor, and can prevent the second bonding points 211 from being bonded to the circuit board. Reliability can be improved.

On the other hand, according to the present invention, the image sensor can be modularized by connecting a conductive connection circuit to a microprocessor (not shown) in a flip-chip manner.
In addition, according to the present invention, an image sensor module can be configured using the flip chip package structure 1 and the flip chip package structure 3 of the image sensor. As shown in FIGS. 7 and 8, the lens set 4 has a support seat 40. The support seat 40 is mounted on the upper surface of the glass plate 20, and the thickness of the side wall 41 extending from the bottom is at least glass. The side wall 41 covers the three sides of the glass plate, leaving an opening 411, and the conductive connection circuit provided in the glass plate 20 is connected to the support seat 40 through the opening 411. It extends outside and joins with the circuit board 50. The present invention optionally plating the surface of the glass plate with a light filtering material instead of incorporating the light filtering glass in the lens set.

According to the present invention, the following effects can be obtained.
The flatness of the surface of the glass plate provides the best mounting reference plane for the support seat, which allows the optical axis of the lens set to be exactly orthogonal to the surface of the semiconductor chip for the image sensor, In the side wall, it is easy to assemble in the assembling process that the optical axis of the lens set is aligned with the image sensing center of the semiconductor chip for the image sensor due to the contour accuracy of the glass plate.

FIG. 3 is a cross-sectional view illustrating a first embodiment of a flip chip package structure of the image sensor according to the present invention; FIG. 4 is a cross-sectional view illustrating a flip chip package structure of an image sensor according to a second embodiment of the present invention; FIG. 4 is a schematic view illustrating a state in which a conductive connection circuit is formed on a lower surface of a glass plate in a flip chip package structure of an image sensor according to an embodiment of the present invention; FIG. 4 is a schematic view illustrating a state in which another conductive connection circuit is formed on a lower surface of a glass plate in a flip chip package structure of an image sensor according to an embodiment of the present invention; FIG. 3 is a schematic view illustrating a state in which a plurality of conductive connection circuits are formed on a large-area glass plate having a flip-chip package structure of an image sensor according to an embodiment of the present invention; FIG. 3 is a schematic view illustrating a state in which a semiconductor chip for an image sensor is bonded on a conductive connection circuit of a flip chip package structure of the image sensor according to an embodiment of the present invention; FIG. 3 is a cross-sectional view illustrating a first embodiment of an image sensor module having a flip-chip package structure of the image sensor according to the present invention; FIG. 4 is a cross-sectional view illustrating a second embodiment of the image sensor module having a flip-chip package structure of the image sensor according to the present invention; FIG. 9 is a schematic diagram illustrating a configuration of a conventional image sensor package.

Explanation of reference numerals

1 Flip chip package structure of image sensor, 3 Flip chip package structure of image sensor, 4 lens group, 10 chip semiconductor chip for image sensor, 11 top surface, 12 gel, 13 solder ball, 20 glass plate, 21 conductive coupling circuit, 22 1st bonding point, 24 ° shield, 30 ° image sensor semiconductor chip, 31 ° top surface, 40 ° support seat, 41 ° sidewall, 50 ° circuit board, 111 ° bonding pad, 211 ° second bonding point, 311 bump

Claims (13)

The upper surface of the image sensor semiconductor chip is in contact with the lower surface of the glass plate, and a plurality of electronic contacts are provided on the image sensor semiconductor chip,
A conductive connection circuit is formed on the lower surface of the glass plate, and a similar number of first bonding points are provided on the conductive connection circuit according to the positions of the electronic contacts formed on the image sensor semiconductor chip. Being formed, their first bonding points are electrically connected to the electronic contacts, and the second bonding points of the conductive connection circuit are concentrated on any one side of the glass plate. ,
A shielding object covers the lower surface of the glass plate and the peripheral surface of the glass plate other than the image sensor semiconductor chip,
A flip-chip package structure for an image sensor, characterized by including: 4. The flip chip package structure of claim 1, wherein the chip is sealed by filling the periphery of the chip with a gel. The flip chip package structure of claim 1, wherein the plurality of electronic contacts are bumps. The flip chip package structure of claim 1, wherein the plurality of electronic contacts are bonding pads, and solder balls are provided on each of the bonding pads. 2. The flip chip of claim 1, wherein the second bonding points of the conductive connection circuit, which are concentrated on any one side of the glass plate, are arranged at a distance from each other. 3. Package structure. 2. The flip chip package of claim 1, wherein the second bonding points of the conductive connection circuit concentrated on one side of the glass plate are distributed in an array. Construction. The upper surface of the image sensor semiconductor chip is in contact with the lower surface of the glass plate, and a plurality of electronic contacts are provided on the image sensor semiconductor chip,
A conductive connection circuit is formed on the lower surface of the glass plate, and a similar number of first bonding points are provided on the conductive connection circuit according to the positions of the electronic contacts formed on the image sensor semiconductor chip. Being formed, their first bonding points are electrically connected to the electronic contacts, and the second bonding points of the conductive connection circuit are concentrated on any one side of the glass plate. ,
The lens set has a support seat, the support seat rests on the upper surface of the glass plate, the thickness of the sidewall extending from the bottom is at least the same as the thickness of the glass plate, and the sidewall is formed of the glass plate. Covering three sides, leaving an opening, the conductive connection circuit provided in the glass plate extending out of the support seat from the opening,
An image sensor module comprising: The electronic contact provided on the image sensor semiconductor chip is a bonding pad, and a solder ball is provided on each bonding pad, and a lower surface of a glass plate other than the image sensor semiconductor chip and a glass plate are provided. The image sensor module according to claim 7, wherein a shield is covered on a peripheral surface. The image sensor module according to claim 8, wherein the second bonding points of the conductive connection circuit, which are concentrated on any one side of the glass plate, are distributed in an array. 9. The image sensor module according to claim 8, wherein the second bonding points of the conductive connection circuit concentrated on any one side of the glass plate are arranged in parallel at a distance. The electronic contact provided on the image sensor semiconductor chip is a bump, and the lower surface of the glass plate and the peripheral surface of the glass plate other than the image sensor semiconductor chip are covered with a shield. The image sensor module according to claim 7. The image sensor module according to claim 11, wherein the second bonding points of the conductive connection circuit concentrated on one side of the glass plate are distributed in an array. The image sensor module according to claim 11, wherein the second bonding points of the conductive connection circuits concentrated on any one side of the glass plate are arranged in parallel at a distance.

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