JP3100618U - Image sensor chip scale package (CSP: ChipScalePackage) structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip scale package structure of an image sensor capable of simplifying equipment and reducing manufacturing cost.
SOLUTION: In a flip-chip package structure 1 of an image sensor, a large number of bonding pads 11 are provided on the upper surface of a semiconductor chip 10 for an image sensor, and one vertical lead 12 is drawn out from each bonding pad 11. A transparent liquid resin material is applied to the upper surface of the image sensor semiconductor chip 10, and the dried resin material is formed on the light transmitting layer 13, and the upper surface 131 of the light transmitting layer is made completely flat by polishing. . The upper ends of the leads 12 extend to a plane P1 above the semiconductor chip 10 for an image sensor, and cover the light-transmitting layer 13 with a shielding layer. By covering the peripheral surface of the light transmitting layer 13 with the shielding layer, it is possible to prevent light rays from transmitting through the peripheral surface of the light transmitting layer 13 and adversely affecting the imaging quality of the semiconductor chip 10 for an image sensor. .
[Selection diagram] Fig. 1

Description

  The present invention relates to a chip scale package structure of an image sensor.

  Currently, ceramic packages (CLCC), resin substrate packages (PLCC), and C / F resin injection packages (KLCC) are widely applied as image sensor package technologies. The main common feature of these packaging technologies is to place the chip on the die pad before performing wire bonding. With the demand for lighter and thinner, more multifunctional and higher speed electronic products, the number of input / output terminals for electronic devices is increasing, the thickness is becoming thinner, and the area is becoming smaller. . Surface adhesive technology was developed after insertion-type components became unusable due to limitations on the dimensions of the insertion holes in the circuit board. According to the surface adhesive technology, the number of input / output terminals of the component can be increased, and the volume of the component can be reduced. Furthermore, since the reduction in the distance of the terminals has exceeded the technology for increasing the density of the printed circuit board, the arrangement of the terminals of the components has been changed from the peripheral arrangement to the array arrangement, thereby improving the non-defective rate of assembly. However, as the number of input / output terminals of the component increases, the size of the package also increases, so that problems such as defective soldering and deformation of the board are likely to occur. The most effective method for solving the above problem is to reduce the resin portion other than the chip as much as possible. When the volume of a packaged component is almost the same as the size of a chip, the concept of a package has been created to approximate the size of the chip.

  Therefore, the current packaging technology is progressing to a flip-chip package system. This package-based manufacturing process requires bumps to be grown on the wafer and then solder-bonded to the electronic contacts on the substrate, so that the top surface of the chip must face the substrate, The flip chip package method has excellent electrical characteristics, smaller package size, and excellent heat dissipation characteristics of the chip, because the sensing zone of the chip is limited by the precondition that it must be open. Application to image sensors is still difficult.

  FIG. 7 shows a flip-chip package structure of a conventional image sensor. An inner surface of an upper glass plate 91 is formed with an electronic circuit 910 by a light mask etching technique, and is formed by using a flip-chip technique. The ball 92 is used to solder-bond the chip 92 to an electronic contact in the central zone of the glass plate 91. In order to adhere to the surface of the circuit board 95, tin balls 94 are separately provided at the electronic contacts around the glass plate 91. Provided. The problem of such a design is that if the diameter of the tin ball 94 provided around the glass plate 91 is not larger than the thickness of the chip, the reliability is not high even when bonding to the circuit board. Therefore, the area of the glass plate must be increased in order to maintain a proper distance between each tin ball. This adversely affects the dimensions of the lens set 8 covering the image sensor, so that such flip-chip packaging technology has room for improvement.

Therefore, the present invention has been made to solve the above problems, and a main object of the present invention is to implement a package on a wafer, thereby simplifying equipment and reducing a manufacturing cost. An object of the present invention is to provide a chip scale package structure of a sensor.
Another object of the present invention is to provide a chip scale package structure of an image sensor which can meet market requirements by approximating a package volume to a chip scale.

  To achieve the above object, a chip scale package structure of an image sensor according to claim 1 of the present invention has a plurality of bonding pads provided on an upper surface of a semiconductor chip for an image sensor, and each bonding pad is formed by bonding. Pulling out one vertical lead from the pad, applying a transparent liquid resin material on the upper surface of the image sensor semiconductor chip, forming the dried resin material on the one light transmitting layer, and forming the light transmitting layer The gist is that the image sensor has a chip scale package structure characterized in that the thickness is substantially the same as the height of the lead.

  According to claim 5 of the present invention, the one light transmitting layer covers an upper surface of the one image sensor semiconductor chip, and a plurality of bumps are provided on the upper surface of the image sensor semiconductor chip. The gist is to provide a chip scale package structure of an image sensor, which is substantially the same as the thickness of the light transmitting layer.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 illustrates a first embodiment of a flip chip package structure of an image sensor according to the present invention. In the flip-chip package structure 1 of this image sensor, a large number of bonding pads 11 are provided on the upper surface of the semiconductor chip 10 for image sensor, and one vertical lead 12 is drawn out from each bonding pad 11 by bonding. A transparent liquid resin material is applied to the upper surface of the image sensor semiconductor chip 10, and the dried resin material is formed on the light transmitting layer 13, and the upper surface 131 of the light transmitting layer is made to be a completely flat surface by polishing. The upper ends of the leads 12 extend to a plane P1 above the semiconductor chip 10 for an image sensor, and cover the light-transmitting layer 13 with a shielding layer. By covering the peripheral surface of the light transmitting layer 13 with the shielding layer, it is possible to prevent light rays from transmitting through the peripheral surface of the light transmitting layer 13 and adversely affecting the imaging quality of the semiconductor chip 10 for an image sensor. .

According to the package structure 1 of the present invention, the manufacturing process is simplified. That is, before dividing the wafer, first, leads are bonded, a transparent liquid resin material is applied to the surface of the wafer, and the dried resin material is formed into a single light transmitting layer. After polishing the surface of the transmission layer and dividing the wafer, the packaging process is completed.
The package structure of the image sensor shown in FIG. 1 achieves a chip scale package and a complicated manufacturing process such as a lead frame, a substrate molding, a chip loading, a bonding, and a glass plate cover in a conventional manufacturing process. Can be omitted, so that the production efficiency is improved and the production cost is reduced. In particular, the application of the package structure of the present invention is extremely ideal in the field of low lever image sensor application products.

  2 and 3 show an application example of modularization of the chip scale package structure 1 of the image sensor shown in FIG. After the solder balls 14 are provided at the ends of the leads 12, the ends are joined to the lower surface of the flexible circuit board 20. The flexible circuit board 20 has a rectangular hole 22 at a position corresponding to the sensing zone of the image sensor semiconductor chip. Is open. A conductive connection circuit 21 is provided on a lower surface of the flexible circuit board 20. In the conductive connection circuit 21, a first bonding point 211 similar to the number of the leads 12 is formed on a peripheral edge of the rectangular hole 22. The first bonding point 211 is electrically connected to the lead 12, and the second bonding point 212 of the conductive connection circuit 21 is concentrated on any one side of the flexible circuit board 20.

The lens set 30 has a support seat 31, the support seat 31 is mounted on the upper surface of the flexible circuit board 20, and a sidewall 311 extending from the bottom is formed along the peripheral surface of the glass plate. The sidewall 311 covers three sides of the chip scale package structure of the image sensor, and an opening 312 remains. One side of the flexible circuit board 20 extends from the opening 312 to outside the support seat 31.
According to the design of the module, it is possible to easily achieve in the assembly process that the optical axis of the lens set is aligned with the image sensing center of the semiconductor chip for the image sensor due to the contour accuracy of the glass plate.

  The above embodiment is provided for explaining the present invention, and is not intended to limit the present invention. Therefore, any change in the numerical value or replacement of a part having the same effect is required for registration of the present invention. Belongs to the range. For example, FIG. 5 shows a second embodiment of the flip chip package structure of the image sensor according to the present invention. In the flip-chip package structure 4 of this image sensor, a large number of bumps 41 are provided on the upper surface of a semiconductor chip 40 for an image sensor, and the upper surface of the semiconductor chip 40 for an image sensor has a transparent glass plate 42 having similar dimensions. In order for each bump 41 provided on the image sensor semiconductor chip 40 to penetrate to the upper surface of the glass plate 42, a through hole 421 is provided in the glass plate 42 according to the position of the bump 41. Covering the peripheral surface of the glass plate 42 with a shielding layer 422. By covering the peripheral surface of the glass plate 42 with the shielding layer 422, it is possible to prevent light rays from penetrating the peripheral surface of the glass plate 42 and adversely affecting the imaging quality of the semiconductor chip 40 for an image sensor.

  FIG. 6 shows an application example of modularizing the chip scale package structure 4 of the image sensor shown in FIG. After the solder balls 43 are provided at the ends of the bumps 41, the ends are joined to the lower surface of the flexible circuit board 20 by a surface adhesion technique, and as shown in FIG. A rectangular hole 22 is formed at a position corresponding to the sensing zone of the semiconductor chip, and a conductive connection circuit 21 is provided on a lower surface of the flexible circuit board 20. In the conductive connection circuit 21, first bonding points 211 having the same number as the number of the bumps 41 are formed on the periphery of the rectangular hole 22, the first bonding points 211 are electrically connected to the bumps 41, and The second bonding points 212 of the connection circuit 21 are concentrated on any one side of the flexible circuit board 20.

The lens set 30 has one support seat 31, and the support seat 31 is mounted on the upper surface of the flexible circuit board 20, and a sidewall 311 extending from the bottom is formed along the peripheral surface of the glass plate. The sidewall 311 covers three sides of the chip scale package structure of the image sensor, and one opening 312 remains, and one side of the flexible circuit board 20 extends out of the support seat 31 from the opening 312. .
According to the design of the module, the planar accuracy of the surface of the glass plate provides the best mounting reference plane of the support seat, whereby the optical axis of the lens set is exactly perpendicular to the surface of the semiconductor chip for the image sensor The side wall of the support seat can be easily achieved by the assembling process so that the optical axis of the lens set is aligned with the image sensing center of the image sensor semiconductor chip due to the contour accuracy of the glass plate.

  Another embodiment of the present invention is similar to the second embodiment. The difference is that instead of a glass plate, a transparent liquid resin material is applied on the upper surface of the image sensor semiconductor chip, and the dried resin material is formed in a single light transmitting layer, The upper surface of the light-transmitting layer is completely flat by glazing and covers the shielding layer on the peripheral surface of the light transmitting layer. The features and the application of modularization later are almost the same as those of the first embodiment, and therefore, the description is omitted.

According to the present invention, the following effects can be obtained.
In addition to achieving chip-scale packages, packaging can be performed before splitting the wafer, so complex processes such as lead frame, substrate molding, chip loading, bonding, and glass plate covering in the conventional manufacturing process can be performed. A simple manufacturing process can be omitted, production efficiency can be improved, manufacturing costs can be reduced, and investment in equipment can be significantly reduced.

FIG. 4 is a cross-sectional view illustrating a first embodiment of a package structure of the image sensor according to the present invention. FIG. 3 is a cross-sectional view illustrating a module having a package structure of the image sensor according to the first embodiment of the present invention; FIG. 2 is an exploded perspective view showing the image sensor module according to the first embodiment of the present invention. It is a bottom view showing a flexible circuit board. FIG. 4 is a cross-sectional view illustrating a second embodiment of the package structure of the image sensor according to the present invention. FIG. 3 is a cross-sectional view illustrating a module having a package structure of an image sensor according to a second embodiment of the present invention. It is sectional drawing of the package structure of the conventional image sensor.

Explanation of reference numerals

  1 chip scale package structure of image sensor, 4 chip scale package structure of image sensor, 10 semiconductor chip for image sensor, 11 bonding pad, 12 lead, 13 light transmission layer, 14 solder ball, 20 flexible circuit board, 22 rectangular hole, Reference Signs List 21 conductive connection circuit, 30 lens group, 31 support seat, 40 image sensor semiconductor chip, 41 bump, 42 glass plate, 43 solder ball, 131 upper surface of light transmitting layer, 132 shielding layer, 211 first bonding point, 212 Second bonding point, 311 sidewall, 312 opening, 421 through hole

Claims (10)

A large number of bonding pads are provided on the upper surface of the image sensor semiconductor chip, and one vertical lead is pulled out from each bonding pad by bonding,
A transparent liquid resin material is applied to the upper surface of the image sensor semiconductor chip, and the dried resin material forms a light transmission layer, and the thickness of the light transmission layer is substantially the same as the height of the lead. The chip scale package structure of the image sensor characterized by the following.   The chip scale package structure of an image sensor according to claim 1, wherein the upper surface of the light transmitting layer becomes a perfect flat surface by glazing, and covers a shielding layer around the light transmitting layer.   After the solder balls are provided at the ends of the leads, the ends are joined to the lower surface of the circuit board, and a rectangular hole is formed in the circuit board at a position corresponding to the sensing zone of the semiconductor chip for an image sensor. A conductive connecting circuit is provided on a lower surface of the conductive connecting circuit. In the conductive connecting circuit, a first bonding point similar to the number of leads is formed on a periphery of a rectangular hole, and the first bonding point is electrically connected to the lead. The chip scale package structure of claim 2, wherein the second bonding point of the conductive connection circuit is concentrated on one side of the circuit board.   4. The chip scale package structure of claim 3, wherein the second bonding points formed in the conductive connection circuit are distributed in an array. 5.   The light transmitting layer covers an upper surface of the image sensor semiconductor chip, and a number of bumps are provided on the upper surface of the image sensor semiconductor chip, and the height of each bump is substantially the same as the thickness of the light transmitting layer. The chip scale package structure of the image sensor characterized by the following.   The light transmissive layer is a transparent glass plate, and the light transmissive layer is adhered to the image sensor semiconductor chip, and each bump provided on the image sensor semiconductor chip penetrates to the upper surface of the glass plate, The chip scale package structure of an image sensor according to claim 5, wherein a through hole is provided in the glass plate according to a position of the bump. The area of the glass plate and the semiconductor chip for an image sensor are the same, and a shielding layer covers the peripheral surface of the glass plate,
After the solder balls are provided at the ends of the bumps, the ends are joined to the lower surface of the circuit board, and a rectangular hole is formed in the circuit board at a position corresponding to the sensing zone of the semiconductor chip for an image sensor. A conductive connecting circuit is provided on the lower surface of the conductive connecting circuit, and the conductive connecting circuit has a first bonding point similar to the number of bumps formed on the periphery of the rectangular hole, and the first bonding point is electrically connected to the bump. The chip scale package structure of claim 6, wherein the second bonding point of the conductive connection circuit is concentrated on any one side of the circuit board.   The chip scale package structure of an image sensor according to claim 5, wherein the light transmitting layer is formed by applying a transparent liquid resin material and drying the resin material.   9. The chip scale package structure of claim 8, wherein an upper surface of the light transmitting layer is made completely flat by polishing, and a peripheral surface of the light transmitting layer is covered with a shielding layer.   After the solder balls are provided at the ends of the bumps, the ends are joined to the lower surface of the circuit board, and a rectangular hole is formed in the circuit board at a position corresponding to the sensing zone of the semiconductor chip for an image sensor. A conductive connecting circuit is provided on a lower surface of the conductive connecting circuit, and the conductive connecting circuit has a first bonding point similar to the number of bumps formed on a periphery of a rectangular hole, and the first bonding point is electrically connected to the bump. The chip scale package structure of claim 9, wherein the second bonding point of the conductive connection circuit is concentrated on any one side of the circuit board.

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