CN107734215B - Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment - Google Patents
Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment Download PDFInfo
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- CN107734215B CN107734215B CN201610668807.1A CN201610668807A CN107734215B CN 107734215 B CN107734215 B CN 107734215B CN 201610668807 A CN201610668807 A CN 201610668807A CN 107734215 B CN107734215 B CN 107734215B
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- circuit board
- photosensitive
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- die
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 64
- 238000000465 moulding Methods 0.000 claims abstract description 271
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- 230000003287 optical effect Effects 0.000 claims description 78
- 238000000034 method Methods 0.000 claims description 48
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 24
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- 239000011265 semifinished product Substances 0.000 claims description 11
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 description 36
- 238000003384 imaging method Methods 0.000 description 27
- 238000010586 diagram Methods 0.000 description 14
- 239000013039 cover film Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 8
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- 229910000679 solder Inorganic materials 0.000 description 5
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention provides a camera module, a molded photosensitive assembly, a manufacturing method and an electronic device thereof, wherein the molded photosensitive assembly of the camera module comprises at least one supporting element, at least one photosensitive element, at least one circuit board, at least one group of leads and at least one molded base. Each group of leads is connected to the non-photosensitive area of each photosensitive element and each circuit board, and each module base comprises a molding main body and a light window, wherein each supporting element is used for preventing the inner surface of the molding die from pressing the leads when the molding main body is molded by the molding die, and the photosensitive area of the photosensitive element corresponds to the light window.
Description
Technical Field
The present invention relates to the field of optical imaging, and more particularly, to an imaging module, a molded photosensitive assembly, a method of manufacturing the same, and an electronic apparatus.
Background
In recent years, camera modules for capturing images are increasingly being used in applications such as personal electronics, automotive fields, medical fields, etc., and for example, camera modules have become one of the standard accessories of portable electronic devices such as smartphones, tablet computers, etc. The camera module applied to the portable electronic equipment not only can acquire images, but also can help the portable electronic equipment to realize functions such as instant video call and the like. Along with the trend of portable electronic equipment towards lighter and thinner and the requirement of users on imaging quality of the camera module, more severe requirements are put forward on the overall size of the camera module and the imaging capability of the camera module. That is, the trend of portable electronic devices requires camera modules to further increase and strengthen imaging capabilities on the basis of reduced size.
It is known that the imaging capability of the camera module is improved based on the configuration of a photosensitive element having a larger imaging area and more passive electronic components such as a driving resistor and a capacitor for the camera module, and because the camera module needs to be configured with the photosensitive element having the larger imaging area and more passive electronic components, the camera module is required to be reduced in size only by improving the packaging process. The currently commonly adopted camera module packaging process is COB (Chip On Board) packaging process, namely, a circuit board, a photosensitive element, a bracket and the like of a camera module are respectively manufactured, then a passive electronic component, the photosensitive element and the bracket are sequentially packaged on the circuit board, in order to ensure the imaging quality of the camera module, glue needs to be filled between every two components, for example, glue is filled between the bracket and the circuit board to package the bracket on the circuit board, and leveling of the bracket and the circuit board is realized through the glue, so that the size of the camera module cannot be effectively reduced due to the COB packaging process, and the packaging efficiency of the camera module is lower.
In order to solve this problem, a molding process is introduced into the field of camera modules, which allows the camera modules to be integrally molded on the circuit board during the process of being manufactured, in such a way that not only the size of the camera modules can be effectively reduced, but also the assembly errors of the camera modules can be reduced to improve the imaging quality of the camera modules. Nevertheless, there are many drawbacks to introducing the molding process directly into the field of camera modules.
Firstly, the photosensitive element of the camera module is attached to the circuit board and electrically connected with the photosensitive element and the circuit board through the lead, in general, two ends of the lead are welded to the photosensitive element and the circuit board respectively and are limited by the wire bonding process and the property of the lead, two ends of the lead are in an upper radian and protrude out of the upper surface of the photosensitive element after being welded to the photosensitive element and the circuit board, in the molding process of the camera module, the pressing surface of the upper mold of the molding mold can be contacted with the protruding part of the lead to cause the deformation of the lead due to the compression, and once the lead is deformed, the lead is difficult to recover to the initial state after the upper mold of the molding mold is removed. Secondly, when a molding material for forming the bracket is added to a molding space of the molding die and cured in the molding space to form the bracket, the deformed lead is covered inside the bracket to be maintained in a deformed state, and the ability of the deformed lead to transmit an electric signal between the photosensitive element and the wiring board is greatly reduced, so that the imaging ability and imaging efficiency of the camera module are greatly affected. More importantly, when the leads are extruded by the pressing surface of the upper die to deform, the deformation direction and the deformation degree of the leads are uncontrollable, so that adjacent leads can be contacted with each other after deformation to cause short circuit, and the defective rate of the product of the camera module is increased. In addition, after the photosensitive element is mounted on the circuit board, a gap is generated between the photosensitive element and the circuit board, and a fluid molding material is introduced into the gap formed between the photosensitive element and the circuit board during molding, so that the attachment relationship between the photosensitive element and the circuit board is changed, and once the attachment relationship between the photosensitive element and the circuit board is changed, the inclination of the photosensitive element is inevitably caused, so that the imaging quality of the imaging module is affected.
Disclosure of Invention
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly, a method of manufacturing the same, and an electronic apparatus, wherein the molded photosensitive assembly provides a supporting member capable of preventing an upper mold of a molding mold from pressing a lead wire for connecting the photosensitive member and a circuit board when a molding process is performed, thereby preventing the lead wire from being deformed by pressing.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein when an upper mold of the molding mold is clamped with a lower mold and a pressing surface of the upper mold is brought into contact with a top surface of the supporting member, the supporting member can support the upper mold upward to prevent the upper mold from directly pressing the leads, thereby preventing the leads from being deformed by pressing.
An object of the present invention is to provide an image pickup module, a molding photosensitive assembly and a manufacturing method thereof, and an electronic apparatus, wherein when the upper mold of the molding mold is clamped with the lower mold and the pressing surface of the upper mold is brought into contact with the top surface of the supporting member, the supporting member can support the upper mold upward to reserve a safe distance between the lead wire and the pressing surface of the upper mold, thereby preventing the pressing surface of the upper mold from directly contacting the lead wire.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a manufacturing method thereof, and an electronic apparatus, wherein the supporting member is formed of a material having elasticity so that when the upper mold of the molding mold presses the top surface of the supporting member, the supporting member can absorb an impact force generated when the pressing surface of the upper mold contacts the top surface of the supporting member, thereby preventing the photosensitive member, the wiring board, the leads, and the electronic components from being damaged when the upper mold and the lower mold of the molding mold are clamped.
An object of the present invention is to provide an image capturing module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein the supporting member is formed of a material having elasticity, so that when the upper mold of the molding mold presses the supporting member, the top surface of the supporting member can avoid a gap between the top surface of the supporting member and the pressing surface of the upper mold by deformation, thereby avoiding a phenomenon of "flash" at a light window position of the mold base when a molded base of the molded photosensitive assembly is molded, and further being beneficial to ensuring a yield of the image capturing module when packaged and ensuring an imaging quality of the image capturing module.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a manufacturing method thereof, and an electronic apparatus, wherein the supporting member is formed of a material having flexibility such that a top surface of the supporting member can avoid a gap between the top surface of the supporting member and a pressing surface of the upper mold by deforming when the upper mold of the molding die presses the supporting member, thereby preventing a molding material for forming the molding base from entering through a contact position of the top surface of the supporting member and the pressing surface of the upper mold to contaminate or damage a photosensitive region of the photosensitive member. That is, the support member brings the photosensitive region of the photosensitive member into a closed environment when the molding process is performed.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a manufacturing method thereof, and an electronic apparatus, wherein the supporting member is formed of a hard material, the pressing face of the upper mold of the molding die is provided with a cover film, and the cover film is located between the pressing face of the upper mold and the top surface of the supporting member when the pressing face of the upper mold is pressed against the top surface of the supporting member, on the one hand, the cover film can prevent a gap from being formed between the pressing face of the upper mold and the supporting member, and on the other hand, the cover film can prevent the photosensitive member, the wiring board, the leads, and the electronic components from being damaged when the upper mold and the lower mold of the molding die are clamped.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein the supporting member is formed of a hard material, and a pressing surface of the upper mold of the molding die is provided with a cover film so that the supporting member is not deformed when the pressing surface of the upper mold of the molding die is pressed against a top surface of the supporting member, thereby preventing deformation of the lead wire to protect good electrical properties of the lead wire.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein the supporting member is disposed along a non-photosensitive region of the photosensitive member so that the supporting member can prevent the molding material from entering the photosensitive region of the photosensitive member through a contact position of the supporting member and the non-photosensitive region of the photosensitive member to contaminate or damage the photosensitive region of the photosensitive member when the molding process is performed.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, in which the supporting member is provided to cover the connection positions of the lead wires and the photosensitive member and the connection positions of the lead wires and the wiring board, so that the supporting member isolates each connection position from the molding material when the molding process is performed, thereby making each connection position more reliable.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a manufacturing method thereof, and an electronic apparatus, wherein the supporting member is located in a molding space formed in the upper mold and the lower mold of the molding mold, so that the supporting member can block the molding material in a fluid state from striking the leads when the molding material is added to the molding space to be solidified to form the molding base.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a manufacturing method thereof, and an electronic apparatus, wherein the supporting member pre-fixes the wiring board and the photosensitive member so that the supporting member can keep the photosensitive member and the wiring board from being displaced when the molding material is added to the molding space to be cured to form the molded base.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein the supporting member is disposed to cover at least a portion of a non-photosensitive region of the photosensitive member, so as to prevent the molding material from contacting the photosensitive region of the photosensitive member when the molding process is performed, thereby preventing the photosensitive region of the photosensitive member from being contaminated or damaged.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein the supporting member is provided to simultaneously cover at least a portion of the photosensitive member and the wiring board, so as to close a gap formed between the photosensitive member and the wiring board by the supporting member, thereby preventing the molding material in a fluid form from entering between the photosensitive member and the wiring board when the molding process is performed.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, in which the supporting member is provided to cover the lead wire so that the supporting member maintains the lead wire in a predetermined optimum state when the molding process is performed.
An object of the present invention is to provide an image capturing module, a molded photosensitive assembly thereof, a manufacturing method thereof, and an electronic device, wherein the supporting element is disposed to cover the lead, so that stray light generated inside the image capturing module can be prevented from affecting the imaging quality of the image capturing module when the image capturing module is used later.
An object of the present invention is to provide an image capturing module, a molded photosensitive assembly, a manufacturing method thereof, and an electronic apparatus, wherein the supporting member has an adhesive property, and the supporting member is capable of adhering contaminants such as solder powder generated when mounting electronic components on the circuit board before the molding base is formed, so as to prevent the contaminants from contaminating the photosensitive area of the photosensitive member to generate a dirty spot.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein both ends of the lead are connected to a chip connector of the photosensitive element and a wiring board connector of the wiring board, respectively, and a top surface of the supporting element is higher than the chip connector of the photosensitive element, so that the chip connector of the photosensitive element is not damaged when a molding process is performed by the molding die.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein the supporting member covers the chip connection member of the photosensitive member to prevent the molding material from contacting the chip connection member of the photosensitive member when the molding process is performed, thereby protecting the chip connection member of the photosensitive member.
An object of the present invention is to provide an image pickup module, a molded photosensitive assembly thereof, a method of manufacturing the same, and an electronic apparatus, wherein the supporting member is disposed outside the chip connection member of the photosensitive member to prevent the molding material from contacting the chip connection member of the photosensitive member when the molding process is performed, thereby protecting the chip connection member of the photosensitive member.
According to one aspect of the present invention, there is provided a molded photosensitive assembly of an image capturing module, comprising:
at least one support element formed from a first medium;
at least one photosensitive element;
at least one circuit board;
at least one group of leads, wherein two ends of each group of leads are respectively connected to the chip connecting piece of each photosensitive element and the circuit board connecting piece of each circuit board; and
at least one molding base formed by a second medium, wherein each molding base comprises a molding main body and at least one optical window, wherein each supporting element is used for preventing a pressing surface of a molding die from pressing the lead wire when the molding main body is molded by a molding die through a molding process, and a photosensitive area of the photosensitive element corresponds to the optical window.
According to one embodiment of the invention, each of the support elements comprises a frame-shaped support body and a through hole, the support body covering at least a part of the non-photosensitive area of the photosensitive element, the photosensitive area of the photosensitive element corresponding to the through hole, wherein the support body has a top surface, an inner side surface and an outer side surface, the top surface of the support body extending inwardly and outwardly to connect to the inner side surface and the outer side surface, respectively, the inner side surface forming the through hole, wherein the press-fit surface of the forming die contacts the top surface of the support body when the molding process is performed.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inside portion, a chip connecting portion, and a chip outside portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inside portion and the chip outside portion being located inside and outside the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip inside portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inside portion, a chip connecting portion, and a chip outside portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inside portion and the chip outside portion being located inside and outside the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip inside portion and at least a portion of the chip connecting portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inside portion, a chip connecting portion, and a chip outside portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inside portion and the chip outside portion being located inside and outside the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip inside portion, the chip connecting portion, and at least a portion of the chip outside portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inside portion, a chip connecting portion, and a chip outside portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inside portion and the chip outside portion being located inside and outside the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip connecting portion and at least a portion of the chip outside portion of the photosensitive element.
According to one embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are located inside and outside the chip connecting portion, respectively, wherein the supporting body covers at least a portion of the chip outer portion of the photosensitive element.
According to an embodiment of the present invention, the non-photosensitive region of the photosensitive element includes a chip inside portion, a chip connecting portion, and a chip outside portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inside portion and the chip outside portion being respectively formed at an inside and an outside of the chip connecting portion, wherein the supporting body covers at least a portion of the chip connecting portion of the photosensitive element.
According to one embodiment of the invention, each of the supporting elements comprises a frame-shaped supporting body and a through hole, the supporting body covers at least a part of the edge area of the circuit board, the photosensitive area of the photosensitive element corresponds to the through hole, wherein the supporting body has a top surface, an inner side surface and an outer side surface, the top surface of the supporting body extends inwards and outwards to be connected to the inner side surface and the outer side surface respectively, the inner side surface forms the through hole, and the pressing surface of the forming die is contacted with the top surface of the supporting body when the molding process is carried out.
According to one embodiment of the invention, the support body further encloses at least a portion of the photosensitive element.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, and wherein the supporting body covers at least a portion of the circuit board inner portion and at least a portion of the chip outer portion.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, wherein the supporting body covers at least a portion of the circuit board inner portion, at least a portion of the chip outer portion, and at least a portion of the chip connecting portion.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, wherein the supporting body covers at least a portion of the circuit board inner portion, the chip outer portion, the chip connecting portion, and at least a portion of the chip inner portion.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, and wherein the supporting body covers at least a portion of the circuit board connecting portion, the circuit board inner portion, and at least a portion of the chip outer portion.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, wherein the supporting body covers at least a portion of the circuit board outer portion, the circuit board connecting portion, the circuit board inner portion, and at least a portion of the chip outer portion.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, wherein the supporting body covers at least a portion of the circuit board connecting portion, the circuit board inner portion, the chip outer portion, and at least a portion of the chip connecting portion.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, wherein the supporting body covers at least a portion of the circuit board connecting portion, the circuit board inner portion, the chip outer portion, the chip connecting portion, and at least a portion of the chip inner portion.
According to an embodiment of the present invention, the edge region of the circuit board includes a circuit board inner portion, a circuit board connecting portion, and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at an inner side and an outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element includes a chip inner portion, a chip connecting portion, and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at an inner side and an outer side of the chip connecting portion, wherein the supporting body covers at least a portion of the circuit board outer portion, the circuit board connecting portion, the circuit board inner portion, the chip outer portion, and at least a portion of the chip connecting portion.
According to an embodiment of the invention, the edge region of the circuit board comprises a circuit board inner portion, a circuit board connecting portion and a circuit board outer portion, wherein the circuit board connecting member of the circuit board is disposed at the circuit board connecting portion, the circuit board inner portion and the circuit board outer portion are respectively located at the inner side and the outer side of the circuit board connecting portion, wherein the non-photosensitive region of the photosensitive element comprises a chip inner portion, a chip connecting portion and a chip outer portion, wherein the chip connecting member of the photosensitive element is disposed at the chip connecting portion, the chip inner portion and the chip outer portion are respectively located at the inner side and the outer side of the chip connecting portion, and wherein the supporting body covers at least a part of the circuit board outer portion, the circuit board connecting portion, the circuit board inner portion, the chip outer portion, the chip connecting portion and at least a part of the chip inner portion.
According to one embodiment of the invention, the molded body covers the outer side of the support body.
According to one embodiment of the invention, the molded body further encapsulates at least a portion of the top surface of the support body.
According to one embodiment of the invention, the height of the support element is higher than or equal to the height of the upward projection of the lead.
According to one embodiment of the invention, the height of the support element is lower than the height of the upward projection of the lead.
According to one embodiment of the invention, the support element has elasticity.
According to one embodiment of the invention, the support element has an adhesive property.
According to another aspect of the present invention, there is further provided a molded photosensitive assembly of an image capturing module, comprising:
at least one photosensitive element;
at least one circuit board;
at least one group of leads, wherein two ends of each group of leads are respectively connected with the chip connecting piece of each photosensitive element and the circuit board connecting piece of each circuit board;
at least one support element, wherein each of said support elements is configured to encase at least a portion of each set of said leads; and
At least one molded base, wherein each molded base comprises a molded body and at least one optical window, wherein the molded body covers at least one part of the supporting element and the edge area of the circuit board after molding, and the photosensitive area of each photosensitive element corresponds to the optical window of each molded base.
According to one embodiment of the invention, the support element comprises a support body and a through hole, the support body having a top surface, an inner side surface and an outer side surface, the top surface of the support body extending inwardly and outwardly to connect to the inner side surface and the outer side surface, respectively, the inner side surface forming the through hole, wherein the support body is arranged to encase at least a portion of the lead, the photosensitive element corresponding to the through hole, the molded body encasing the outer side surface of the support body.
According to one embodiment of the invention, the molded base further comprises at least a portion of the top surface of the support body.
According to another aspect of the present invention, there is further provided an image pickup module with a molded photosensitive member, comprising:
At least one optical lens; and
at least one molded photosensitive assembly, wherein each molded photosensitive assembly further comprises:
a support element formed from a first medium;
a photosensitive element;
a circuit board;
a set of leads, wherein both ends of each of the leads are connected to a chip connector of the photosensitive element and a wiring board connector of the wiring board, respectively; and
a molding base formed by a second medium, wherein the molding base comprises a molding main body and has an optical window, wherein the supporting element is used for preventing a pressing surface of the molding die from pressing the lead wire when the molding main body is molded by a molding die, wherein a photosensitive area of the photosensitive element corresponds to the optical window, and each optical lens is respectively arranged on a photosensitive path of the photosensitive element of each molded photosensitive assembly.
According to one embodiment of the present invention, the image capturing module further includes at least one driver, wherein each of the optical lenses is assembled to each of the drivers, and each of the drivers is assembled to a top surface of the molded body of each of the molded photosensitive assemblies.
According to one embodiment of the present invention, the image capturing module further includes at least one filter element, wherein each filter element is disposed between each of the optical lenses and the photosensitive element of each of the molded photosensitive assemblies, respectively.
According to one embodiment of the present invention, each of the filter elements is assembled to a top surface of the molded body of each of the molded photosensitive members, respectively.
According to one embodiment of the present invention, the top surface of the molded body has an inner side surface and an outer side surface, wherein the plane of the inner side surface is lower than the plane of the outer side surface, so that the molded body forms a groove, the filter element is assembled to the inner side surface of the molded body and is located in the groove, and the driver is assembled to the outer side surface of the module body.
According to another aspect of the present invention, there is further provided an image pickup module with a molded photosensitive member, comprising:
at least one optical lens; and
at least one molded photosensitive assembly, wherein each molded photosensitive assembly further comprises:
a photosensitive element;
A circuit board;
a set of leads, wherein both ends of each lead are respectively connected to the chip connecting piece of the photosensitive element and the circuit board connecting piece of the circuit board;
a support element, wherein said support element is configured to encase at least a portion of each of said leads; and
the molded base comprises a molded body and a light window, wherein the molded body covers at least one part of the edge area of the circuit board and the supporting element after molding, the light sensing area of each light sensing element corresponds to the light window of the molded base, and each optical lens is arranged on the light sensing path of the light sensing element of each molded light sensing assembly.
According to one embodiment of the invention, the camera module is a fixed focus camera module.
According to one embodiment of the invention, the camera module is a zoom camera module.
According to another aspect of the present invention, there is further provided an electronic apparatus, comprising:
an electronic device body; and
the camera module comprises at least one camera module, wherein each camera module is respectively arranged on the electronic equipment body and used for acquiring images, each camera module further comprises at least one optical lens and at least one molded photosensitive assembly, each molded photosensitive assembly comprises a supporting element, a photosensitive element, a circuit board, a group of leads and a molded base, wherein two ends of each lead are respectively connected with a chip connector of the photosensitive element and a circuit board connector of the circuit board, the molded base comprises a molded main body and a light window, the supporting element is used for preventing a pressing surface of the molded main body from pressing the leads when the molded main body is molded by a molding die, the photosensitive area of the photosensitive element corresponds to the light window, and each optical lens is respectively arranged on a photosensitive path of the photosensitive element of each molded photosensitive assembly.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive assembly, wherein the method of manufacturing comprises the steps of:
(a) Connecting a photosensitive element and a circuit board through a group of leads;
(b) Placing the photosensitive element and the circuit board on an upper die or a lower die of a forming die;
(c) Supporting the upper die upward by a supporting member during the process of clamping the upper die and the lower die so as to prevent the pressing surface of the upper die from pressing each group of leads; and
(d) A fluid molding material is added to a molding space formed between the upper mold and the lower mold to form a molding base after the molding material is cured, wherein the molding base comprises a molding body and has a light window, wherein the molding body covers at least a portion of an edge region of the circuit board and at least a portion of the supporting member.
According to an embodiment of the present invention, in the step (c), a die inner side portion of a non-photosensitive area of the photosensitive element is glued to form a frame-shaped supporting body of the supporting element and a through hole after glue curing, the photosensitive area of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper die and a top surface of the supporting body are brought into contact so that the supporting body supports the upper die upward, wherein in the step (d), the molded body covers the edge area of the wiring board, a die outer side portion and a die connecting portion of the non-photosensitive area of the photosensitive element, and an outer side face of the supporting body after forming.
According to an embodiment of the present invention, in the step (c), glue is applied to the chip connection portion of the non-photosensitive area of the photosensitive element to form a frame-shaped supporting body of the supporting element and a through hole after the glue is cured, the photosensitive area of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and the top surface of the supporting body are brought into contact so that the supporting body supports the upper mold upward, wherein in the step (d), the molded body covers the edge area of the circuit board, the chip outer side portion of the non-photosensitive area of the photosensitive element, and the outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a die outer side portion of a non-photosensitive area of the photosensitive element is sized to form a frame-shaped supporting body of the supporting element and a through hole after the glue is cured, the photosensitive area of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molded body covers the edge area of the wiring board and an outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a die inner side portion and a die connecting portion of a non-photosensitive area of the photosensitive element are sized to form a frame-shaped supporting body of the supporting element and a through hole after the glue is cured, the photosensitive area of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molding body covers the edge area of the wiring board, a die outer side portion of the non-photosensitive area of the photosensitive element, and an outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a die connecting portion and a die outer side portion of a non-photosensitive area of the photosensitive element are sized to form a frame-shaped supporting body of the supporting element and a through hole after the glue is cured, the photosensitive area of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molding body covers the edge area of the wiring board and an outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a die inner side portion, a die connecting portion, and the die outer side portion of the non-photosensitive region of the photosensitive element are glued to form a frame-shaped supporting body and a through hole of the supporting element after the glue is cured, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molding body covers the edge region of the wiring board and an outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a circuit board inner side portion of the edge region of the circuit board is sized to form a frame-shaped supporting body of the supporting member and a through hole after the glue is cured, a photosensitive region of the photosensitive member corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molded body covers a circuit board outer side portion of the edge region of the circuit board, a circuit board connecting portion, and an outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a circuit board connection portion at the edge region of the circuit board is sized to form a frame-shaped supporting body of the supporting member and a through hole after the glue is cured, a photosensitive region of the photosensitive member corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molded body covers a circuit board outer side portion of the edge region of the circuit board and an outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a circuit board outer side portion of the edge region of the circuit board is sized to form a frame-shaped supporting body of the supporting member and a through hole after the glue is cured, a photosensitive region of the photosensitive member corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molded body covers the circuit board outer side portion of the edge region of the circuit board and an outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), a circuit board inner side portion and a circuit board connection portion of the edge region of the circuit board are sized to form a frame-shaped supporting body and a through hole of the supporting member after the glue is cured, a photosensitive region of the photosensitive member corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molding body covers a circuit board outer side portion and an outer side face of the supporting body of the edge region of the circuit board after the forming.
According to an embodiment of the present invention, in the step (c), a circuit board connection portion and a circuit board outer side portion of the edge region of the circuit board are sized to form a frame-shaped supporting body and a through hole of the supporting member after the glue is cured, a photosensitive region of the photosensitive member corresponding to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molding body covers the circuit board outer side portion and an outer side face of the supporting body of the edge region of the circuit board after the forming.
According to an embodiment of the present invention, in the step (c), a circuit board inner side portion, a circuit board connection portion, and a circuit board outer side portion of the edge region of the circuit board are sized to form a frame-shaped supporting body of the supporting member and a through hole after the glue is cured, a photosensitive region of the photosensitive member corresponds to the through hole, wherein the press-fit face of the upper mold and a top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molded body covers the circuit board outer side portion and an outer side face of the supporting body of the edge region of the circuit board after the forming.
According to one embodiment of the present invention, in the step (c), the chip outer side portions of the edge region of the circuit board and the non-photosensitive region of the photosensitive element are glued to form a frame-shaped supporting body of the supporting element and a through hole after glue curing, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and the top surface of the supporting body are brought into contact to cause the supporting body to support the upper mold upward, wherein in the step (d), the molded body covers the edge region of the circuit board and the outer side face of the supporting body after forming.
According to an embodiment of the present invention, in the step (c), the chip outer side portion and the chip connecting portion of the edge region of the wiring board and the non-photosensitive region of the photosensitive element are glued to form a frame-shaped supporting body and a through hole of the supporting element after the glue is cured, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and the top surface of the supporting body are brought into contact so that the supporting body supports the upper mold upward, wherein in the step (d), the molded body covers the edge region of the wiring board and the outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), the chip outer side portion, the chip connecting portion, and the chip inner side portion of the edge region of the wiring board and the non-photosensitive region of the photosensitive element are glued to form a frame-shaped supporting body of the supporting element and a through hole after the glue is cured, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and the top surface of the supporting body are brought into contact so that the supporting body supports the upper mold upward, wherein in the step (d), the molded body covers the edge region of the wiring board and the outer side face of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), the inner side portion of the chip, the chip connection portion and the outer side portion of the non-photosensitive region of the photosensitive element, and the inner side portion of the circuit board of the edge region of the circuit board are glued to form a frame-shaped supporting body of the supporting element and a through hole after glue curing, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit surface of the upper mold and the top surface of the supporting body are brought into contact so that the supporting body supports the upper mold upward, wherein in the step (d), the molding body covers the outer side portion of the circuit board, the circuit board connection portion and the outer side surface of the supporting body of the edge region of the circuit board after forming.
According to an embodiment of the present invention, in the step (c), the circuit board inner side portion, the chip connection portion and the chip outer side portion of the non-photosensitive region of the photosensitive element, and the circuit board inner side portion and the circuit board connection portion of the edge region of the circuit board are glued to form a frame-shaped supporting body and a through hole of the supporting element after glue curing, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit surface of the upper mold and the top surface of the supporting body are brought into contact so that the supporting body supports the upper mold upward, wherein in the step (d), the molding body covers the circuit board outer side portion of the edge region of the circuit board and the outer side surface of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), the inner side of the chip, the chip connection portion and the inner side of the chip in the non-photosensitive region of the photosensitive element, and the inner side of the circuit board, the connection portion of the circuit board and the outer side of the circuit board in the edge region of the circuit board are glued to form a frame-shaped supporting body and a through hole of the supporting element after the glue is cured, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit surface of the upper mold and the top surface of the supporting body are brought into contact so that the supporting body supports the upper mold upward, wherein in the step (d), the molding body covers the edge region of the circuit board and the outer side of the supporting body after the forming.
According to an embodiment of the present invention, in the step (c), the die connecting portion and the die outer side portion of the non-photosensitive region of the photosensitive element and the board connecting portion and the board inner side portion of the edge region of the board are glued to form a frame-shaped supporting body and a through hole of the supporting element after glue curing, the photosensitive region of the photosensitive element corresponding to the through hole, wherein the press-fit face of the upper mold and the top surface of the supporting body are brought into contact so that the supporting body supports the upper mold upward, wherein in the step (d), the molding body covers the board outer side portion of the edge region of the board and the outer side face of the supporting body after forming.
According to one embodiment of the invention, in said step (c), said molded body further encapsulates at least a portion of the top surface of said support body after being formed.
According to an embodiment of the present invention, in the step (c), the height of the supporting body is made higher than the height of the upward protrusion of the lead to reserve a safe distance between the lead and the press-fit surface of the upper die.
According to an embodiment of the present invention, in the step (c), the height of the supporting body is made higher than the height of the upward protrusion of the lead to reserve a safe distance between the lead and the press-fit surface of the upper die.
According to one embodiment of the present invention, in the step (c), when the pressing surface of the upper mold presses against the top surface of the supporting body, the top surface of the supporting body is deformed to closely adhere the pressing surface of the upper mold to the top surface of the supporting body, so that the photosensitive region of the photosensitive element is in a sealed environment, wherein in the step (d), the supporting body prevents the molding material from entering the sealed environment, so that the molding material forms the molding body covering the outer side of the supporting body after curing, and the optical window is formed on the inner side of the supporting body.
According to one embodiment of the present invention, in the step (c), when the pressing surface of the upper mold presses against the top surface of the supporting body, the top surface of the supporting body is deformed to closely adhere the pressing surface of the upper mold to the top surface of the supporting body, so that the photosensitive region of the photosensitive element is in a sealed environment, wherein in the step (d), the supporting body prevents the molding material from entering the sealed environment, so that the molding material forms the molding body covering at least a portion of the outer side surface and the top surface of the supporting body after curing, and the optical window is formed on the inner side surface of the supporting body.
In said step (c), a cover film is provided between said press-fit face of said upper mold and said top surface of said supporting body to prevent a gap from being generated between said press-fit face of said upper mold and said top surface of said supporting body, thereby exposing a photosensitive region of said photosensitive element to a sealed environment, wherein in said step (d), said supporting body prevents said molding material from entering said sealed environment, so that said molding material forms said molding body covering said outer side face of said supporting body after curing, and forms said optical window on an inner side face of said supporting body.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive assembly, wherein the method of manufacturing comprises the steps of:
(A) Connecting a photosensitive element and a circuit board through a group of leads;
(B) At least partially encasing the leads with a support element to form a molded photosensitive component blank;
(C) Placing the molded photosensitive assembly semi-finished product on an upper mold or a lower mold of a molding mold, wherein the supporting element supports the upper mold upwards to prevent a pressing surface of the upper mold from pressing the lead wire in the process of clamping the upper mold and the lower mold; and
(D) And adding a fluid molding material into a molding space formed between the upper mold and the lower mold to form a molding base after the molding material is solidified, wherein the molding base comprises a molding body and a light window, the molding body covers at least one part of the supporting element and the edge area of the circuit board, and the photosensitive area of the photosensitive element corresponds to the light window.
According to one embodiment of the invention, in said step (D), said molded body encapsulates at least a portion of the exterior side and top surface of said support body.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive assembly, wherein the method of manufacturing comprises the steps of:
(h) Attaching a photosensitive element to a circuit board;
(i) Pre-fixing the photosensitive element and the circuit board by a supporting element to obtain a molded photosensitive assembly semi-finished product, wherein the supporting element prevents gaps from being generated between the photosensitive element and the circuit board;
(j) Placing the molded photosensitive assembly semi-finished product on an upper die or a lower die of a molding die so as to form an annular molding space between the upper die and the lower die when the upper die and the lower die are closed; and
(k) And adding a fluid molding material into the molding space to form the molding base after the molding material is solidified, wherein the molding base comprises a molding body and a light window, the molding body covers the edge area of the circuit board and at least one part of the supporting element, and the photosensitive area of the photosensitive element corresponds to the light window.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive assembly, wherein the method of manufacturing comprises the steps of:
(H) The chip connecting piece is connected with the photosensitive element through a group of leads and the circuit board connecting piece is connected with the circuit board through a group of leads;
(I) Placing the photosensitive element and the circuit board on an upper die or a lower die of a forming die so as to form an annular forming space between the upper die and the lower die when the upper die and the lower die are clamped; the method comprises the steps of carrying out a first treatment on the surface of the
(J) Reducing the impact force of the molding material on the lead wire by a supporting element positioned in the molding space by blocking the molding material when the fluid molding material is added into the molding space; and
(K) And forming a molded base after the molding material is cured, wherein the molded base comprises a molded body and a light window, and the molded body covers at least one part of the edge area of the circuit board, the supporting element and the non-photosensitive area of the photosensitive element.
Drawings
Fig. 1 is a schematic diagram of one of the steps of manufacturing an image capturing module according to a preferred embodiment of the present invention, wherein a photosensitive element of the image capturing module is mounted on a circuit board, and a non-photosensitive area of the photosensitive element is connected to the circuit board through a set of leads.
Fig. 2A and 2B are schematic views of a second step of manufacturing the camera module according to the above preferred embodiment of the invention, wherein a supporting element of the camera module is disposed on the non-photosensitive area of the photosensitive element.
Fig. 3A is a schematic view of a third step of manufacturing the camera module according to the above preferred embodiment of the present invention, wherein the circuit board, the photosensitive element and the supporting element are placed between an upper mold and a lower mold of a molding mold, and the upper mold presses the supporting element.
Fig. 3B is a schematic view of a variant of the third manufacturing step of the camera module according to the above preferred embodiment of the present invention, wherein the circuit board, the photosensitive element and the supporting element are disposed between an upper mold and a lower mold of a molding mold, and a cover film is disposed between the pressing surface of the upper mold and the supporting element.
Fig. 4 is a schematic view of a fourth step of manufacturing the camera module according to the above preferred embodiment of the present invention, in which molding material for forming a molding base of the camera module is added to a molding space formed between the upper mold and the lower mold.
FIG. 5 is a schematic diagram of a fifth step of manufacturing the camera module according to the above preferred embodiment of the present invention, wherein the molding material is cured to form the molding base.
FIG. 6 is a schematic diagram of a sixth step in the manufacture of the camera module according to the above preferred embodiment of the present invention, in which a filter element of the camera module is assembled on the molded base.
FIG. 7 is a schematic diagram of a seventh step of manufacturing the camera module according to the above preferred embodiment of the present invention, wherein an optical lens of the camera module is assembled to a driver, and the driver is assembled to the molded base to manufacture the camera module.
Fig. 8 is a schematic diagram of a variant implementation of the camera module according to the above preferred embodiment of the present invention.
Fig. 9A is a schematic diagram of a first variant of a molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.
Fig. 9B is a schematic diagram of a second variant of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.
Fig. 9C is a schematic diagram of a third variant of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.
Fig. 10A is a schematic diagram of a fourth variant of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.
FIG. 10B is a schematic diagram of a fifth variation of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.
FIG. 11 is a schematic diagram of a sixth variation of the module photosensitive assembly of the camera module according to the above preferred embodiment of the present invention.
Fig. 12 is a schematic diagram of a variant implementation of the camera module according to the above preferred embodiment of the present invention.
Fig. 13 is a schematic diagram of another variant of the camera module according to the above preferred embodiment of the present invention.
Fig. 14 is a block diagram of an electronic device with the camera module according to the present invention.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.
It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.
Referring to fig. 1 to 7 of the drawings, an image capturing module according to a preferred embodiment of the present invention is illustrated, wherein the image capturing module comprises at least one optical lens 10 and at least one molded photosensitive element 20. Each molded photosensitive assembly 20 further includes a photosensitive element 21, a circuit board 22, a molded base 23, and a set of leads 24, wherein two ends of each lead 24 extend to be connected to a non-photosensitive area of each photosensitive element 21 and each circuit board 22, and each molded base 23 is integrally formed with each circuit board 22, such that the molded base 23 and the circuit board 22 form an integral structure, and each optical lens 10 is disposed on a photosensitive path of each photosensitive element 21 of each molded photosensitive assembly 20. Light reflected by the object enters the inside of the image pickup module from each optical lens 10 to be subsequently received and photoelectrically converted by each photosensitive element 21, thereby obtaining an image associated with the object.
It should be noted that the photosensitive element 21 has a set of chip connectors 211, and the wiring board 22 has a set of wiring board connectors 221, wherein both ends of each of the leads 24 may be connected to each of the chip connectors 211 of the photosensitive element 21 and each of the wiring board connectors 221 of the wiring board 22, respectively, in such a manner that the photosensitive element 21 and the wiring board 22 are connected. In one example of the present invention, each of the chip connectors 211 of the photosensitive element 21 and each of the wiring board connectors 221 of the wiring board 22 may be lands, that is, each of the chip connectors 211 of the photosensitive element 21 and each of the wiring board connectors 221 of the wiring board 22 may be respectively disk-shaped for connecting both ends of each of the leads 24 to each of the chip connectors 211 of the photosensitive element 21 and each of the wiring board connectors 221 of the wiring board 22, respectively. In another example of the present invention, each of the chip connectors 211 of the photosensitive element 21 and each of the circuit board connectors 221 of the circuit board 22 may be spherical, for example, solder paste or other solder material is dispensed on the photosensitive element 21 and the circuit board 22 to form the chip connectors 211 of the photosensitive element 21 and the circuit board connectors 221 of the circuit board 22, respectively. Nevertheless, the shapes of the chip connection 211 of the photosensitive element 21 and the wiring board connection 221 of the wiring board 22 do not limit the content and scope of the present invention.
The photosensitive element 21 includes a photosensitive region 212 and a non-photosensitive region 213, wherein the photosensitive region 212 and the non-photosensitive region 213 of the photosensitive element 21 are integrally formed, and the photosensitive region 212 is located at a central portion of the photosensitive element 21, the non-photosensitive region 213 is located at an outer portion of the photosensitive element 21, and the non-photosensitive region 213 surrounds the photosensitive region 212 for one week. After the light reflected by the object enters the image capturing module from the optical lens 10, the light can be received by the photosensitive area 212 of the photosensitive element 21 and subjected to photoelectric conversion, so as to obtain an image associated with the object.
As will be appreciated by those skilled in the art, each of the die attach pieces 211 of the photosensitive element 21 is disposed in the non-photosensitive region 213 of the photosensitive element 21. In addition, the non-photosensitive region 213 of the photosensitive element 21 has a chip inner portion 2131, a chip connecting portion 2132, and a chip outer portion 2133, wherein the chip inner portion 2131 surrounds the photosensitive region 212 for one circle, and both sides of the chip connecting portion 2132 extend and are connected to the chip inner portion 2131 and the chip outer portion 2132, respectively. That is, the region of the non-photosensitive region 213 from the position where the chip connector 211 is provided to the position of the edge of the photosensitive region 212 is defined as the chip inside portion 2131, the region of the non-photosensitive region 213 where the chip connector 211 is provided is defined as the chip connecting portion 2132, and the region of the non-photosensitive region 213 from the position where the chip connector 211 is provided to the position of the outer edge of the photosensitive element 21 is defined as the chip outside portion 2132. In other words, the photosensitive element 21 is the chip outside portion 2133, the chip connecting portion 2132, the chip inside portion 2131, and the photosensitive area 212 in this order from the outside to the inside in a plan view of the photosensitive element 21.
In addition, the circuit board 22 includes a flat chip mounting region 222 and an edge region 223, wherein the edge region 223 is integrally formed with the chip mounting region 222, and the edge region 223 is located around the chip mounting region 222. The chip mounting area 222 is used for mounting the photosensitive element 21, and the wiring board connector 221 is disposed at the edge area 223. The edge region 223 of the circuit board 22 has a circuit board inner side portion 2231, a circuit board connecting portion 2232, and a circuit board outer side portion 2233, wherein the circuit board inner side portion 2231 surrounds the die attach region 222 for one turn, and both sides of the circuit board connecting portion 2232 extend and are connected to the circuit board inner side portion 2231 and the circuit board outer side portion 2233, respectively. That is, an area of the edge area 223 from a position where the wiring board connector 221 is provided to a position of an edge of the die attach area 222 is defined as the wiring board inside part 2231, an area of the edge area 223 where the wiring board connector 221 is provided is defined as the wiring board connection part 2232, and an area of the edge area 223 from a position where the wiring board connector 221 is provided to an outer edge of the edge area 223 is defined as the wiring board outside part 2233. In other words, the wiring board 22 is the wiring board outside portion 2233, the wiring board connection portion 2232, the wiring board inside portion 2231, and the die attach region 222A in this order from the inside to the outside in the plan view of the wiring board 22. The type of the lead wire 24 is not limited in the camera module of the present invention, and for example, in a specific example, the lead wire 24 may be implemented as a gold wire, that is, the photosensitive element 21 and the wiring board 22 may be connected together by way of a gold wire, so that the photosensitive element 21 can further transmit an electrical signal to the wiring board 22 through the lead wire 24 after converting the optical signal into the electrical signal. Those skilled in the art will appreciate that in other examples of the camera module, the lead 24 may be implemented as any material capable of transmitting the electrical signal between the photosensitive element 21 and the circuit board 22, such as silver wire, copper wire, or the like.
In addition, in one example, the image pickup module may be implemented as a fixed focus image pickup module in which the optical lens 10 is held in the photosensitive path of the photosensitive element 21 by a lens mount assembled to the mold base 23.
In another example, the camera module may be implemented as a zoom camera module, wherein the camera module adjusts the focal length of the camera module by changing the distance of the optical lens 10 and the photosensitive element 21. Specifically, in this example shown in fig. 7, the image capturing module further includes at least one driver 30, wherein each of the optical lenses 10 is respectively and correspondingly disposed at each of the drivers 30, each of the drivers 30 is respectively assembled at each of the molding bases 23, and each of the drivers 30 is respectively electrically connected to each of the circuit boards 22, so that after the circuit boards 22 transmit electric power and control signals to the drivers 30, the drivers 30 can drive the optical lenses 10 to move back and forth along the photosensitive path of the photosensitive element 21, thereby adjusting the focal length of the image capturing module. That is, the optical lens 10 is drivably provided to the driver 30.
It should be noted that the type of the driver 30 is not limited in the camera module of the present invention, and for example, in a specific example, the driver 30 may be implemented as any driver capable of driving the optical lens 10 to shift along the photosensitive path of the photosensitive element 21, such as a voice coil motor, where the driver 30 is capable of receiving power and control signals to be in an operating state.
Further, referring to fig. 7, the camera module further includes at least one filter element 40, wherein each filter element 40 is assembled to each molding base 23, and each filter element 40 is located in the photosensitive path of each photosensitive element 21. The light reflected by the object enters the image capturing module from the optical lens 10, and is filtered by the filter element 40 before being received by the photosensitive element 21 and subjected to photoelectric conversion. That is, the filter element 40 can filter stray light, such as infrared rays, in light reflected by an object, which enters the inside of the image pickup module from the optical lens 10, and in this way, the imaging quality of the image pickup module can be changed.
It will be appreciated by those skilled in the art that in different examples of the camera module, the filter element 40 can be implemented as a different type, for example, the filter element 40 can be implemented as an ir cut filter, a full spectrum filter, or a combination of other filters, for example, the filter element 40 can be implemented as a combination of an ir cut filter and a full spectrum filter, that is, the ir cut filter and the full spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21, for example, when the camera module is used in an environment where light is relatively sufficient such as daytime, the ir cut filter can be switched to the photosensitive path of the photosensitive element 21, so that the ir light reflected by an object entering the camera module is filtered by the ir cut filter, and when the camera module is used in an environment where light is relatively dark such as night, the full spectrum filter can be switched to the photosensitive path of the photosensitive element 21, so as to allow the portion of the ir light entering the reflected object to pass through the camera module.
Referring to fig. 7, the molded photosensitive assembly 20 of the camera module further includes a supporting element 25, wherein the supporting element 25 is disposed on the non-photosensitive area 213 of the photosensitive element 21 before the molded base 23 is molded, so that the molded base 23 covers the circuit board 22, the non-photosensitive area 213 of the photosensitive element 21 and a portion of the supporting element 25 after the molded base 23 is molded to form the molded photosensitive assembly 20, wherein the supporting element 25 is effective to improve the product yield of the camera module and to improve the imaging quality of the camera module, and further description and disclosure will be given of the features and advantages of the supporting element 25.
Further, the support member 25 has a top surface 2501, an inner side 2502, and an outer side 2503, wherein both sides of the top surface 2501 are connected to the inner side 2502 and the outer side 2503, respectively. It is noted that a side of the supporting member 25 facing the photosensitive member 21 is defined as the inner side 2502 of the supporting member 25, and a side of the supporting member 25 facing the wiring board 22 is defined as the outer side 2503 of the supporting member 25.
Referring to fig. 7, the molded photosensitive assembly 20 of the camera module further includes a plurality of electronic components 26, wherein each of the electronic components 26 may be attached to the edge region 223 of the circuit board 22 by a process such as SMT (Surface Mount Technology). Preferably, each of the electronic components 26 is mounted to the board outer side 2233 of the edge region 223. The photosensitive element 21 and each of the electronic components 26 may be mounted on the same side or opposite sides of the wiring board 22, for example, in a specific example, the photosensitive element 21 and each of the electronic components 26 are mounted on the same side of the wiring board 22, and the photosensitive element 21 is mounted on the die mounting region 222 of the wiring board 22, and each of the electronic components 26 is mounted on the edge region 223 of the wiring board 22. After the molding base 23 is integrally formed on the circuit board 22, the molding base 23 encapsulates each electronic component 26, so that the adjacent electronic components 26 are isolated by the molding base 23 and the electronic components 26 and the photosensitive element 21 are isolated, thereby, in the camera module of the invention, even when the distance between the adjacent electronic components 26 is relatively close, the molding base 23 can avoid the adjacent electronic components 26 from contacting or interfering with each other, and the manner that the molding base 23 encapsulates the electronic components 26 can also avoid the pollutants generated on the surface of the electronic components 26 from polluting the photosensitive area 212 of the photosensitive element 21, thereby reducing the volume of the camera module and improving the imaging quality of the camera module. That is, the camera module of the present invention allows the circuit board 22 with a small area to be mounted with more electronic components 26 by covering the electronic components 26 with the molding base 23. It is worth mentioning that the types of the electronic components 26 include, but are not limited to, resistors, capacitors, driving devices, etc.
In addition, it will be appreciated by those skilled in the art that although the steps of manufacturing the camera module and the steps of manufacturing the molded photosensitive assembly 20 are disclosed in fig. 1 to 7 using a single camera module as an example, the camera module may be implemented as a dual lens camera module or an array camera module in the example shown in fig. 8, and the present invention is not limited in this respect.
The steps of manufacturing the image pickup module and the steps of manufacturing the molded photosensitive member 20 are described in the examples shown in fig. 1 to 7.
Referring to fig. 1, the photosensitive element 21 is mounted to the chip mounting area 222 of the wiring board 22, and each of the chip connectors 211 of the non-photosensitive area 213 of the photosensitive element 21 and each of the wiring board connectors 221 of the edge area 223 of the wiring board 22 are connected by a set of the leads 24. In addition, each of the electronic components 26 is mounted to the board outside 2233 of the edge region 223 of the board 22. That is, both ends of a set of the leads 24 are connected to the photosensitive element 21 and the wiring board 22, respectively, wherein each of the leads 24 protrudes in an upper arc shape from the upper surface of the photosensitive element 21. It will be appreciated that, limited to the wire bonding process of connecting the photosensitive element 21 and the wiring board 22 using the lead wire 24 and the characteristics of the lead wire 24 itself, both ends of the lead wire 24 need to protrude in an upper arc shape from the upper surface of the photosensitive element 21 after each of the chip connectors 211 connected to the non-photosensitive region 213 of the photosensitive element 21 and each of the wiring board connectors 221 of the outer region 223 of the wiring board 22, respectively. In addition, maintaining the curvature of the curve of each of the leads 24 in a rounded state is advantageous in ensuring the ability of the leads 24 to transmit the electrical signal between the photosensitive element 21 and the wiring board 22. Wherein each of the leads 24 is arranged between the photosensitive element 21 and the wiring board 22, for example, each of the leads 24 may be equally spaced. As will be appreciated by those skilled in the art, maintaining each of the leads 24 in an initial state during manufacture of the camera module and during use of the camera module is advantageous in ensuring the ability of the leads 24 to transmit the electrical signals between the photosensitive element 21 and the circuit board 22, thereby ensuring the imaging quality of the camera module.
It will be appreciated by those skilled in the art that although the steps of manufacturing the camera module and the steps of manufacturing the molded photosensitive assembly 20 of the camera module of the present invention are illustrated in fig. 1 by taking an example in which one of the photosensitive elements 21 is mounted on one of the circuit boards 22, in another example, a plurality of the photosensitive elements 21 may be mounted on a different position of one of the circuit boards 22 to manufacture a dual lens camera module or an array camera module later, in another example, a plurality of the circuit boards 22 may be spliced together to form a circuit board imposition, and then each of the photosensitive elements 21 is mounted on the circuit board 22 at a corresponding position of the circuit board imposition, respectively, to separate the circuit board imposition later. The invention is not limited in this regard.
Referring to fig. 2A and 2B, the supporting member 25 is disposed at the non-photosensitive region 213 of the photosensitive member 21 to form a molded photosensitive assembly semi-finished product from the photosensitive member 21, the wiring board 22 and the supporting member 25, wherein the supporting member 25 is disposed to cover the chip inner side 2131, the chip connecting portion 2232 and the chip outer side 2233 of the non-photosensitive region 213 of the photosensitive member 21. That is, the following is true. The support member 25 can cover a portion of each of the leads 24 to allow the support member 25 to cover the leads 24 during subsequent fabrication of the camera module and during molding of the photosensitive assembly 20 to improve the imaging quality of the camera module. It will be appreciated by those skilled in the art that in this embodiment of the camera module of the present invention, the support member 25 encloses the chip attach 211 of the photosensitive member 21. Further, the supporting member 25 includes a frame-shaped supporting body 251 and has a through hole 252, wherein the supporting body 251 is disposed at the non-photosensitive region 213 of the photosensitive member 21 such that the photosensitive region 212 of the photosensitive member 21 corresponds to the through hole 252 of the supporting member 25, so that the supporting body 251 can protect the photosensitive region 212 of the photosensitive member 21 when the molding process is performed. The molded base 23, after being formed, encapsulates the outer side 2503 of the support body 251 and at least a portion of the fixed surface 2501. It is worth mentioning that the inner side 2502 of the supporting element 25 is used to form the through hole 252 of the supporting element 25.
Preferably, the supporting body 251 covers the chip inner side portion 2131, the chip connecting portion 2131 and the chip outer side portion 2133 of the photosensitive element 21, that is, the supporting body 251 can cover the chip connecting member 211, so that the supporting body 251 can prevent the connection position of the lead wire 24 and the chip connecting member 211 from being contacted with a molding material for forming the molding base 23 to prevent the lead wire 24 from falling off from the chip connecting member 211. It is understood that when the supporting body 251 covers the connection positions of the leads 24 and the die attach 211, the supporting body 251 can isolate the connection positions of the leads 24 and the die attach 211 from the molding material, thereby preventing the molding material from causing deformation of the ends of the leads 24 for attaching the die attach 211 or the leads 24 from being detached from the die attach 211 when the molding process is performed. In one embodiment, the supporting body 251 may be formed by disposing glue on the non-photosensitive region 213 of the photosensitive element 21 and after the glue is cured to make the supporting body 251 elastic, wherein the inner side 2502 of the supporting body 251 forms the through hole 252 after the supporting body 251 is formed, and the photosensitive region 212 of the photosensitive element 21 corresponds to the through hole 252. In addition, the supporting body 251 formed of glue may also have an adhesive property for adhering contaminants such as dust at a later time, thereby preventing the contaminants from contaminating the photosensitive region 212 of the photosensitive element 21 and causing a dirty spot to the photosensitive region 212 of the photosensitive element 21 to further secure the imaging quality of the camera module. For example, the supporting body 251 is disposed between the photosensitive region 212 of the photosensitive element 21 and the electronic component 26, so that contaminants such as solder powder generated when the electronic component 26 is mounted on the wiring board 22 may be adhered by the supporting body 251, thereby preventing the contaminants such as solder powder from contaminating the photosensitive region 212 of the photosensitive element 21.
Preferably, the supporting body 251 may be coated on the non-photosensitive region 213 of the photosensitive element 21 by glue in a glue state and formed after the glue is cured, so as to avoid the occurrence of the situation that the glue flows after being coated on the non-photosensitive region 213 of the photosensitive element 21 to contaminate the photosensitive region 212 of the photosensitive element 21. In other words, the glue has good plasticity before curing to form the supporting body 251, so as to avoid the glue being applied to the non-photosensitive area 213 of the photosensitive element 21 and being deformed during curing. It will be appreciated by those skilled in the art that the support body 251 formed of glue can be made to cover the leads 24 by applying glue in a glue state to the non-photosensitive areas 213 of the photosensitive elements 21, and damage to the leads 24 is avoided during the application of glue to the non-photosensitive areas 213 of the photosensitive elements 21.
Referring to fig. 3A, in the molding process, the molding material is formed into the molding base 23 integrally molded at least on the circuit board 22 after being solidified by a molding die 100, in this way, the size of the camera module and the assembly error of the camera module can be reduced, thereby making the structure of the camera module more compact and improving the imaging quality of the camera module.
Specifically, the molding die 100 includes an upper die 101 and a lower die 102, wherein at least one of the upper die 101 and the lower die 102 is movable to enable the upper die 101 and the lower die 102 to be subjected to a clamping operation, and at least a molding space 103 is formed between the upper die 101 and the lower die 102, wherein the molding base 23 is formed by the molding material being added to the molding space 103 and after curing. For example, in one embodiment, the lower mold 102 is generally fixed, and the upper mold 101 is movable along guide posts relative to the lower mold 102 to close the mold when the upper mold 101 is moved toward the lower mold 102, thereby forming the molding space 103 between the upper mold 101 and the lower mold 102, and to draw the mold when the upper mold 102 is moved away from the lower mold 102. Or in another example, the upper mold 101 is fixed, and the lower mold 102 is movable along guide posts relative to the upper mold 101 to be clamped when the lower mold 102 is moved toward the upper mold 101, thereby forming the molding space 103 between the lower mold 102 and the upper mold 101, and to be drawn when the lower mold 102 is moved away from the upper mold 101.
After the photosensitive element 21 and the wiring board 22 are connected by a set of the leads 24 and the support body 251 is formed in the non-photosensitive region 213 of the photosensitive element 21 to cover a portion of the leads 24, the molded photosensitive assembly semifinished product is formed, the molded photosensitive assembly semifinished product is placed in the lower mold 102 of the molding mold 100, the upper mold 101 and/or the lower mold 101 of the molding mold 100 are operated to clamp the upper mold 101 and the lower mold 102 to form the molding space 103 between the upper mold 101 and the lower mold 102, and the photosensitive element 21, the wiring board 22, and the support element 25 are respectively partially in the molding space 103 of the molding mold 100, wherein the pressing face 1011 of the upper mold 101 is in contact with the top surface 2501 of the support body 251 to upwardly support the upper mold 101 by the support body 251 so as to avoid the pressing face 1011 of the upper mold 101 against the leads 24. For example, in this specific example of the present invention such as shown in fig. 7, the outside of the wiring board 22, the non-photosensitive region of the photosensitive element 21, and a portion of the supporting element 25 are located in the molding space 103 of the molding die 100, so that the molding base 23 covers the outside of the wiring board 22, the non-photosensitive region of the photosensitive element 21, and a portion of the supporting element 25 after the molding base 23 is molded in the molding space 103.
Thus, it will be appreciated by those skilled in the art that the molding space 103 of the molding die 100 may be an annular space to form the annular molded base 23 after the molding material is added to the molding space 103 and cured.
It should be noted that the supporting body 251 has elasticity, so that when the molding die 100 is subjected to the clamping operation, the impact force generated by the pressing face 1011 of the upper die 101 of the molding die 100 at an instant of contacting the top surface 2501 of the supporting body 251 is absorbed by the supporting body 251 to prevent the impact force from being further transmitted to the photosensitive element 21, thereby preventing the photosensitive element 21 from being damaged or preventing the photosensitive element 21 from being displaced relative to the photosensitive element 22 due to the force. As will be appreciated by those skilled in the art, the manner in which the impact force is absorbed by the supporting body 251 to prevent the impact force from being further transmitted to the photosensitive element 21 can also ensure that the flatness of the photosensitive element 21 when mounted on the circuit board 22 is not affected, thereby ensuring the imaging quality of the camera module.
It should be noted that the shore hardness of the supporting body 251 is in the range of a50-a80, and the elastic modulus is in the range of 0.1Gpa-1Gpa.
Preferably, in this example of the present invention such as shown in fig. 7, the height of the supporting body 251 may be implemented to be higher than or equal to the height of the upward protrusion of the lead wire 24, so that the supporting body 251 can support the upper mold 101 upward while preventing the upper mold 101 from pressing the lead wire 24 when the press-fit surface 1011 of the upper mold 101 of the molding mold 100 is in contact with the top surface 2501 of the supporting body 251 when the molding mold 100 is subjected to the mold clamping operation. For example, in one example, the height of the supporting body 251 is equal to the height of the upward protrusion of the lead 24, so that when the upper mold 101 and the lower mold 102 of the molding mold 100 are subjected to the mold clamping operation, the supporting body 251 supports the upper mold 101 upward so that the press-fit surface 1011 of the upper mold 101 can be brought into contact with the lead 24, but the press-fit surface 1011 of the upper mold 101 cannot press the lead 24. In another example, the height of the supporting body 251 is higher than the height of the lead 24 protruding upward, so that when the upper mold 101 and the lower mold 102 of the molding mold 100 are subjected to the mold clamping operation, the supporting body 251 supports the upper mold 101 upward so that the press-fit face 1011 of the upper mold 101 does not contact the lead 24, thereby avoiding the press-fit face 1011 of the upper mold 101 from pressing the lead 24. That is, the supporting body 251 can upwardly support the upper die 101 to reserve a safe distance between the press face 1011 of the upper die 101 and the lead 24.
In addition, the support body 251 has elasticity, and after the upper mold 101 and the lower mold 102 of the molding mold 100 are subjected to the mold clamping operation, the press face 1011 of the upper mold 101 is brought into contact with the top surface 2501 of the support body 251 to press the top surface 2501 of the support body 251, wherein the pressure applied to the top surface 2501 of the support body 251 by the press face 1011 of the upper mold 101 can cause the support body 251 to slightly deform for preventing the generation of a gap between the press face 1011 of the upper mold 101 and the top surface 2501 of the support body 251. That is, the upper mold 101 of the molding module 100 can be closely adhered to the supporting body 251 so that the photosensitive region of the photosensitive element 21 corresponding to the through hole 252 of the supporting element 25 is in a sealed environment, to prevent the molding material from entering the sealed environment to contaminate the photosensitive region of the photosensitive element 21 when the molding process is performed.
Fig. 3B shows a modified embodiment of the molded photosensitive assembly 20 of the present invention in this process, in which the supporting member 25 may be made of a hard material, that is, when the supporting body 251 of the supporting member 25 is formed on at least a portion of the non-photosensitive region 213 of the photosensitive member 21 and the pressing surface 1011 of the upper mold 101 of the molding mold 100 presses the top surface 2501 of the supporting body 251, the supporting body 251 is not deformed to ensure good electrical properties of the leads 24, thereby ensuring yield of the camera module in the subsequent process and further ensuring imaging quality of the camera module.
It should be noted that the shore hardness of the supporting body 251 is greater than D70, and the elastic modulus is greater than 1Fpa.
The molding die 100 further includes a cover film 106, so that when the upper die 101 and the lower die 102 are clamped, the cover film 106 is positioned between the press-fit surface 1011 of the upper die 101 and the top surface 2501 of the support body 251, and preferably, the cover film 106 may be provided on the press-fit surface 1011 of the upper die 101 before the upper die 101 and the lower die 102 are clamped. The cover film 106 is provided between the press-fit surface 1011 of the upper die 101 and the support main 251, so that on the one hand, a gap between the press-fit surface 1011 of the upper die 101 and the support main 251 can be prevented from being generated, and on the other hand, the cover film 106 can absorb an impact force generated when the upper die 101 and the lower die 102 are clamped, thereby preventing the photosensitive element 21, the wiring board 22, and the lead 24 from being damaged when the upper die 101 and the lower die 102 are clamped.
Referring to fig. 4, after the fluid molding material is introduced into the molding space 103 of the molding die 100, the molding material fills the entire molding space 103, wherein the support body 251 formed at the non-photosensitive region 213 of the photosensitive element 21 can prevent the molding material from entering the photosensitive region 212 of the photosensitive element 21 at the contact position of the support body 251 and the non-photosensitive region 213 of the photosensitive element 21, and in addition, the support body 251 can prevent the occurrence of a gap between the pressing surface 1011 of the upper die 101 and the top surface 2501 of the support body 251 by deformation, can prevent the molding material from entering the sealing environment at the contact position of the top surface 2501 of the support body 251 and the pressing surface 1011 of the upper die 101, and can avoid the occurrence of a phenomenon of "flash" after the molding material is cured.
It should be noted that the fluid-like molding material according to the present invention may be a liquid material or a solid particulate material or a mixture of liquid and solid particulate materials, and it is understood that the molding material, whether implemented as a liquid material or as a solid particulate material or as a mixture of liquid and solid particulate materials, is capable of solidifying to form the molding base 23 after being added to the molding space 103 of the molding die 100. For example, in this particular example of the invention, the molding material in fluid form is embodied as a thermoplastic material, such as a liquid, wherein the molding material solidifies after being introduced into the molding space 103 of the molding die 100 to form the molding base 23. It should be noted that, after the fluid molding material is added into the molding space 103 of the molding die 100, the curing manner of the fluid molding material does not limit the content and scope of the present invention.
Referring to fig. 5, the supporting body 251 is disposed along the non-photosensitive region 213 of the photosensitive element 21, and the supporting body 251 is capable of preventing the molding material from entering the photosensitive region 212 of the photosensitive element 21 after the molding material is introduced into the molding space 103 of the molding die 100, so that after the molding material is cured to form the molding base 23, the molding base 23 is further formed with an optical window 231 to correspond to the photosensitive region 212 of the photosensitive element 21, so that, subsequently, the optical window 231 of the molding base 23 allows light to pass therethrough to be received by the photosensitive region 212 of the photosensitive element 21 and to undergo photoelectric conversion. That is, the molding material introduced into the molding space 103 of the molding die 100 forms a molding body 232 of the molding base 23 after curing and forms the light window 231 at the middle of the molding base 23. In other words, the molding base 23 includes the molding body 232 and the optical window 231, and the optical window 231 provides a light path for the optical lens 10 and the photosensitive element 21, so that after the light reflected by the object enters the inside of the image capturing module from the optical lens 10, the light is received and photoelectrically converted by the photosensitive region 212 of the photosensitive element 21 through the optical window 231 of the molding base 23.
It should be noted that, after the molding base 23 is formed, the molding base 23 encapsulates each of the electronic components 26, so that each of the electronic components 26 is isolated by the molding base 23 and the electronic components 26 and the photosensitive element 21 are isolated by the molding base 23, in such a manner that the molding base 23 can prevent the adjacent electronic components 26 from contacting even when the adjacent electronic components 26 are closely spaced, and the molding base 23 can prevent the contaminants generated by the electronic components 26 from contaminating the photosensitive area of the photosensitive element 21, so as to improve the imaging quality of the camera module.
Referring to fig. 6, the optical filter 40 is assembled on the top surface of the molding base 23, so that the optical filter 40 closes the optical window 231 of the molding base 23, so that the light entering the inside of the camera module from the optical lens can be further filtered by the optical filter 40 to improve the imaging quality of the camera module.
Further, the top surface of the mold base 23 forms an inner side surface 233 and an outer side surface 234, wherein in one example, the inner side surface 233 and the outer side surface 234 of the mold base 23 are in the same plane so that the top surface of the mold base 23 forms a flat plane, wherein the filter element 40 is assembled to the inner side surface 233 of the mold base 23, the driver 30 or the lens mount is assembled to the outer side surface 234 of the mold base 23, or the optical lens 10 is directly assembled to the outer side surface 234 of the mold base 23. In another example, the plane of the inner side surface 233 of the molding base 23 may be lower than the plane of the outer side surface 234, so that the top surface of the molding base 23 forms a stepped surface, that is, the plane of the inner side surface 233 of the molding base 23 is lower than the plane of the outer side surface 234 to form a groove 235 of the molding base 23, wherein the filter element 40 assembled to the inner side surface 233 of the molding base 23 is received in the groove 235 of the molding base 23, and the actuator 30 is assembled to the outer side surface 234 of the molding base 23, so that the optical lens 10 assembled to the actuator 30 is further held in the photosensitive path of the photosensitive element 21, as shown in fig. 7, thereby manufacturing the camera module.
Referring to fig. 9A, there is shown a first modified embodiment of the camera module of the present invention, in which each of the leads 24 of the molded photosensitive member 20 is entirely enclosed within the support body 251, unlike the above-described embodiment of the camera module of the present invention.
Specifically, the support body 251 covers at least a part of the chip inner portion 2131, the chip connection portion 2132, the chip outer portion 2133, the board inner portion 2231, the board connection portion 2232, and at least a part of the board outer portion 2233, so that the support body 251 covers not only the eye portion of the lead 24 but also the connection position of the lead 24 and the chip connection member 211 of the photosensitive element 21 and the connection position of the lead 24 and the board connection member 221 of the board 22, so that the lead 24 is pre-fixed by the support body 251. So that the press-fit surface 1011 of the upper mold 101 is brought into contact with the top surface 2501 of the support body 251 during the process of closing the upper mold 101 and the lower mold 102 of the molding mold 100 to prevent the press-fit surface 1011 of the upper mold 101 from directly pressing the lead 24, thereby preventing the lead 24 from being deformed or damaged by a force, when the molding process is subsequently performed to form the molding base 23.
In addition, the leads 24 are entirely covered inside the support body 251, so that the support body 251 can prevent the molding material fed into the molding space 103 formed between the upper mold 101 and the lower mold 102 from directly contacting the leads 24, to prevent the molding material having a relatively high temperature from damaging the leads 24. Preferably, the support body 251 has good thermal insulation to avoid the support body 251 from transferring the temperature of the molding material to the leads 24. More preferably, the height of the supporting body 251 is higher than the height of the protruding portion of the lead 24, so that the supporting body 251 supports the upper mold 101 upward to reserve a safe distance between the press-fit surface 1011 of the upper mold 101 and the protruding portion of the lead 24 when the molding process is performed.
And, the supporting body 251 covers the chip outside portion 2133 of the photosensitive element 21 and the circuit board inside portion 2231 of the circuit board 22, so that the mounting positions of the photosensitive element 21 and the circuit board 22 are covered by the supporting body 251, by which the supporting body 251 can not only pre-fix the photosensitive element 21 and the circuit board 22, so that the supporting body 251 can prevent the respective portions of the photosensitive element 21 and the circuit board 22 from being displaced due to uneven stress when the molding process is performed, but also prevent the molding material from contacting the mounting positions of the photosensitive element 21 and the circuit board 22, so as to ensure the flatness of the photosensitive element 21 and improve the imaging quality of the camera module.
As will be appreciated by those skilled in the art, the support body 251 is disposed along the mounting location of the photosensitive element 21 and the circuit board 22 such that the support body 251 is square-frame shaped, such that the support body 251 is capable of preventing the molding material from entering the photosensitive region 212 of the photosensitive element 21 when the molding process is performed, such that the molding material forms the molding body 232 covering the edge region 223 of the circuit board 22 and the outer side 2503 of the support body 251 after curing, and forms the optical window 231 in the middle of the molding body 232, wherein the photosensitive region 212 of the photosensitive element 21 corresponds to the optical window 231 of the molding base 23, such that the optical window 231 provides a light path to the optical lens 10 and the photosensitive element 21. He preferably, the molded body 232, after molding, encapsulates at least a portion of the edge region 223 of the wiring board 22, the outer side 2503 of the support body 251, and the top surface 2501.
In the second modified embodiment of the image capturing module according to the present invention shown in fig. 9B, the supporting body 251 covers at least a part of the chip outside portion 2133 of the photosensitive element 21, the wiring board inside portion 2231, the wiring board connection portion 2232, and the wiring board outside portion 2233 of the wiring board 22. That is, in this example of the image pickup module shown in fig. 9B, the supporting body 251 may not cover the chip connection portion 2132 of the photosensitive element 21. In the third embodiment of the camera module according to the present invention shown in fig. 9C, the supporting body 251 covers the chip connection portion 2132 and the chip outer portion 2133 of the photosensitive element 21 and the board inner portion 2231 and the board connection portion 2232 of the board 22. That is, in this embodiment of the image pickup module of the present invention shown in fig. 9C, the supporting body 251 may not cover the chip inner portion 2131 of the photosensitive element 21 and the board outer portion 2233 of the board 22. That is, in the several modified embodiments of the camera module shown in fig. 9A, 9B and 9C, the supporting body 251 can cover the mounting positions of the photosensitive element 21 and the circuit board 22 at the same time, to pre-fix the photosensitive element 21 and the circuit board 22 by the supporting body 251, and to prevent the generation of a gap at the mounting positions of the photosensitive element 21 and the circuit board 22 by the supporting body 251, so that the supporting body 251 can prevent the respective portions of the photosensitive element 21 and the circuit board 22 from being displaced due to uneven stress when the molding process is performed, and the supporting body 251 can prevent the molding material from entering between the photosensitive element 21 and the circuit board 22, to ensure the flatness of the photosensitive element 21.
Referring to fig. 10A, there is shown a fourth modified embodiment of the camera module according to the present invention, in which the supporting body 251 covers at least a portion of the board inside part 2231, the board connection part 2232, and at least a portion of the board outside part 2233 of the edge region 22 of the board 22, that is, the supporting body 251 covers the board connection part 221 of the board 22, so that the lead 24 is pre-fixed by the supporting body 251 on the one hand and the lead 24 and the board connection part 221 are prevented from contacting the molding material by the supporting body 251 on the other hand, thereby preventing the lead 24 from falling off from the board connection part 221 when the molding process is performed.
Referring to fig. 10B, there is shown a fifth modified embodiment of the camera module of the present invention, in which the supporting body 251 covers only the chip inner side portion 2131 of the photosensitive element 21, so that the supporting body 251 prevents the molding material from entering the photosensitive region 212 of the photosensitive element 21 when the molding process is performed, thereby forming the molding body 232 covering the edge region 223 of the circuit board 22 and the chip outer side portion 2133 and the chip connection portion 2132 of the photosensitive element 21 after the molding material is cured, and forming the optical window 231 at a position corresponding to the photosensitive region 212 of the photosensitive element 21.
Referring to fig. 11, there is shown a sixth modified embodiment of the camera module of the present invention, in which the molded body 232 does not cover the top surface 2501 of the support body 251 after molding, unlike the above-described embodiment of the present invention. For example, in the particular example shown in fig. 11, the molded body 232 encapsulates the edge region 223 of the circuit board 22 and the outer side 2503 of the support body 251 after molding.
It should be noted that although the height of the supporting body 251 is higher than the height of the protruding portion of each lead 24 is illustrated in fig. 1 to 11, in other examples of the camera module of the present invention, the height of the supporting body 251 may be equal to the height of the protruding portion of each lead 24, or in other examples, the height of the supporting body 251 may be lower than the height of the protruding portion of each lead 24, as long as the press face 1011 of the upper mold 101 of the molding mold 100 is in contact with the top surface of the supporting body 251 and the press face of the upper mold 101 does not directly press against each lead 24 at the time of the molding process.
Fig. 12 shows a modified embodiment of the camera module, in which the filter element 40 is not directly assembled to the module body 232, but at least one support 70 is provided by the camera module, the filter element 40 is assembled to the support 70, and then the support 70 is assembled to the top surface of the molding body 232, so that the filter element 40 is held between the optical lens 10 and the photosensitive element 21, in such a way that the size of the filter element 40 can be reduced to reduce the height of the camera module.
Further, the top surface of the molding body 232 may be a flat surface, so that the supporter 70 is assembled to the top surface of the molding body 232 after the molding base 23 is formed, and then the driver 30 or the lens barrel 60 is assembled to the supporter 70. That is, the driver 30 or the lens barrel 60 may not be directly assembled to the top surface of the molding body 232, but may be assembled to the supporter 70.
Fig. 13 shows another modified embodiment of the camera module, in which the top surface of the molding body 232 is formed with one recess 235, and the holder 70 assembled to the top surface of the molding body 232 is received in the recess 235 to further reduce the height dimension of the camera module, in which case the driver 30 or the lens barrel 60 may be directly assembled to the top surface of the molding body 232.
However, it will be appreciated by those skilled in the art that in other examples of the camera module of the present invention, the optical lens 10 may be directly assembled to the top surface of the molding body 232 or the optical lens 10 may be directly assembled to the top surface of the supporter 70. According to another aspect of the present invention, the present invention further provides a method of manufacturing a molded photosensitive assembly 20, wherein the method of manufacturing comprises the steps of:
(a) A photosensitive element 21 and a wiring board 22 are connected by a set of leads 24;
(b) Placing the photosensitive element 21 and the circuit board 22 in an upper mold 101 or a lower mold 102 of a molding mold 100;
(c) During the closing of the upper die 101 and the lower die 102, the upper die 101 is supported upward by a supporting member 25 to prevent the pressing face 1011 of the upper die 101 from pressing against each set of the leads 24; and
(d) A fluid-like molding material is added to a molding space 103 formed between the upper mold 101 and the lower mold 102 to form a molding base 23 after the molding material is cured, wherein the molding base 23 includes a molding body 232 and has a light window 231, wherein the molding body 232 covers at least a portion of an edge region 223 of the circuit board 22 and at least a portion of the supporting member 25.
According to another aspect of the present invention, the present invention further provides a method of manufacturing a molded photosensitive assembly 20, wherein the method of manufacturing comprises the steps of:
(A) A photosensitive element 21 and a wiring board 22 are connected by a set of leads 24;
(B) At least partially encasing said leads 24 by a support member 25 to form a molded photosensitive assembly blank;
(C) Placing the molded photosensitive assembly blank on an upper mold 101 or a lower mold 102 of a molding mold 100, wherein the supporting member 25 supports the upper mold 101 upward to prevent the pressing surface 1011 of the upper mold 101 from pressing the leads 24 during the closing of the upper mold 101 and the lower mold 102; and
(D) A fluid molding material is added into a molding space 103 formed between the upper mold 101 and the lower mold 102 to form a molding base 23 after the molding material is cured, wherein the molding base 23 includes a molding body 232 and has an optical window 231, the molding body 232 covers at least a portion of the supporting member 25 and an edge region 223 of the circuit board 22, and a photosensitive region 212 of the photosensitive member 21 corresponds to the optical window 231.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive assembly, wherein the method of manufacturing comprises the steps of:
(h) Attaching a photosensitive element 21 to a circuit board 22;
(i) Pre-fixing the photosensitive element 21 and the wiring board 22 by a supporting member 25 to obtain a molded photosensitive assembly semi-finished product, and the supporting member 25 prevents generation of a gap between the photosensitive element 21 and the wiring board 22;
(j) Placing the molded photosensitive assembly semi-finished product in an upper mold 101 or a lower mold 102 of a molding mold 100 to form an annular molding space 103 between the upper mold 101 and the lower mold 102 when the upper mold 101 and the lower mold 102 are closed; and
(k) A fluid molding material is added into the molding space 103 to form the molding base 23 after the molding material is cured, wherein the molding base 23 includes a molding body 232 and has an optical window 231, the molding body 23 covers the edge region 223 of the circuit board 22 and at least a portion of the supporting member 25, and the photosensitive region 212 of the photosensitive member 21 corresponds to the optical window 231.
According to another aspect of the present invention, there is further provided a method of manufacturing a molded photosensitive assembly, wherein the method of manufacturing comprises the steps of:
(H) A chip connector 211 connected to a photosensitive element 21 and a wiring board connector 221 of a wiring board 22 through a set of leads 24;
(I) Placing the photosensitive element 21 and the circuit board 22 in an upper mold 101 or a lower mold 102 of a molding mold 100 to form an annular molding space 103 between the upper mold 101 and the lower mold 102 when the upper mold 101 and the lower mold 102 are closed;
(J) When the fluid molding material is added into the molding space 103, the impact force generated by the molding material on the lead 24 is reduced by blocking the molding material by a supporting element 25 positioned in the molding space 103; and
(K) After the molding material is cured, a molded base 23 is formed, wherein the molded base 23 comprises a molded body 232 and has an optical window 231, wherein the molded body 232 encloses at least a portion of the edge region 223 of the circuit board 22, the support member 25, and the non-photosensitive region 213 of the photosensitive member 21.
Referring to fig. 14, the present invention further provides an electronic apparatus, wherein the electronic apparatus comprises an electronic apparatus body 200 and at least one camera module, wherein each camera module is respectively disposed on the electronic apparatus body 200 for capturing a pattern, wherein each camera module 200 further comprises at least one optical lens 10 and at least one molded photosensitive element 20, respectively, the molded photosensitive element 20 comprises a supporting element 25, a photosensitive element 21, a circuit board 22, a set of leads 24 and a molded base 23, wherein both ends of each lead 24 are respectively connected to a chip connector 211 of the photosensitive element 21 and a circuit board connector 221 of the circuit board 22, wherein the molded base 23 comprises a molded body 232 and a light window 231, wherein the supporting element 25 is used for preventing a pressing face 1011 of the molding die 100 from pressing against the lead 24 when the molding body 232 is molded by a molding process of the molding die 100, wherein a photosensitive area 212 of the photosensitive element 21 corresponds to the light window 231, wherein each optical lens 10 is respectively disposed on the photosensitive element 21 of the molded photosensitive element 20.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting.
The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.
Claims (41)
1. A molded photosensitive assembly for a camera module, comprising:
at least one support element formed from a first medium;
at least one photosensitive element;
at least one circuit board;
at least one set of leads, wherein both ends of each set of leads are connected to a chip connector of each of the photosensitive elements and a wiring board connector of each of the wiring boards, respectively, wherein the supporting element covers at least a portion of each set of leads; and
at least one molded base formed of a second medium, wherein each of the molded bases includes a molded body and has at least one optical window, respectively, wherein the supporting member is for protecting the photosensitive member and the leads when the molded body is molded by a molding process by a molding die, wherein a photosensitive area of the photosensitive member corresponds to the optical window, wherein the molded body covers at least a portion of an outer side surface and a top surface of the supporting body of the supporting member.
2. The molded photosensitive assembly of claim 1, wherein each of said support members comprises a frame-shaped said support body and having a through-hole, respectively, said support body surrounding at least a portion of a non-photosensitive area of said photosensitive member, said photosensitive area of said photosensitive member corresponding to said through-hole, wherein said support body has said top surface, an inner side surface and said outer side surface, said top surface of said support body extending inwardly and outwardly to connect to said inner side surface and said outer side surface, respectively, said inner side surface forming said through-hole, wherein upon performing a molding process, a press-fit surface of said molding die contacts said top surface of said support body.
3. The molded photosensitive assembly of claim 2, wherein said non-photosensitive region of said photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, wherein said die-attach portion of said photosensitive element is disposed at said die-attach portion, said die-in portion and said die-out portion being located inside and outside of said die-attach portion, respectively, wherein said support body encases at least a portion of said die-in portion of said photosensitive element.
4. The molded photosensitive assembly of claim 2, wherein said non-photosensitive region of said photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, wherein said die-attach member of said photosensitive element is disposed at said die-attach portion, said die-in portion and said die-out portion being located inside and outside of said die-attach portion, respectively, wherein said support body encases at least a portion of said die-in portion and at least a portion of said die-attach portion of said photosensitive element.
5. The molded photosensitive assembly of claim 2, wherein said non-photosensitive region of said photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, wherein said die-attach member of said photosensitive element is disposed at said die-attach portion, said die-in portion and said die-out portion being located inside and outside of said die-attach portion, respectively, wherein said support body encases at least a portion of said die-in portion, said die-attach portion, and at least a portion of said die-out portion of said photosensitive element.
6. The molded photosensitive assembly of claim 2, wherein said non-photosensitive region of said photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, wherein said die-attach member of said photosensitive element is disposed at said die-attach portion, said die-in portion and said die-out portion being located inside and outside of said die-attach portion, respectively, wherein said support body encases at least a portion of said die-attach portion and at least a portion of said die-out portion of said photosensitive element.
7. The molded photosensitive assembly of claim 2, wherein said non-photosensitive region of said photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, wherein said die-attach portion of said photosensitive element is disposed at said die-attach portion, said die-in portion and said die-out portion being located inside and outside of said die-attach portion, respectively, wherein said support body encases at least a portion of said die-out portion of said photosensitive element.
8. The molded photosensitive assembly of claim 2, wherein said non-photosensitive region of said photosensitive element comprises a die-in portion, a die-attach portion, and a die-out portion, wherein said die-attach member of said photosensitive element is disposed at said die-attach portion, said die-in portion and said die-out portion being formed respectively inside and outside said die-attach portion, wherein said support body encases at least a portion of said die-attach portion of said photosensitive element.
9. The molded photosensitive assembly of claim 1, wherein each of said support members comprises a frame-shaped said support body and having a through hole, respectively, said support body surrounding at least a portion of an edge region of said circuit board, said photosensitive region of said photosensitive member corresponding to said through hole, wherein said support body has said top surface, an inner side surface and said outer side surface, said top surface of said support body extending inwardly and outwardly to connect to said inner side surface and said outer side surface, respectively, said inner side surface forming said through hole, wherein upon performing a molding process, a press-fit surface of said molding die contacts said top surface of said support body.
10. The molded photosensitive assembly of claim 9, wherein said support body further encapsulates at least a portion of said photosensitive element.
11. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed at said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed at an interior side and an exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed at said chip connector portion, said chip interior portion and said chip exterior portion being disposed at an interior side and an exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board interior portion and at least a portion of said chip exterior portion.
12. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connection portion, and a circuit board exterior portion, wherein said circuit board connection member of said circuit board is disposed at said circuit board connection portion, said circuit board interior portion and said circuit board exterior portion being disposed at an interior side and an exterior side of said circuit board connection portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connection portion, and a chip exterior portion, wherein said chip connection member of said photosensitive element is disposed at said chip connection portion, said chip interior portion and said chip exterior portion being disposed at an interior side and an exterior side of said chip connection portion, respectively, wherein said support body encases at least a portion of said circuit board interior portion, said chip exterior portion, and at least a portion of said chip connection portion.
13. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed on said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed on an interior and exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed on said chip connector portion, said chip interior portion and said chip exterior portion being disposed on an interior and exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board interior portion, said chip exterior portion, said chip connector portion, and at least a portion of said chip interior portion.
14. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed at said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed at an interior side and an exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed at said chip connector portion, said chip interior portion and said chip exterior portion being disposed at an interior side and an exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board connector portion, said circuit board interior portion, and at least a portion of said chip exterior portion.
15. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed on said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed on an interior and exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed on said chip connector portion, said chip interior portion and said chip exterior portion being disposed on an interior and exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board exterior portion, said circuit board connector portion, said circuit board interior portion, and at least a portion of said chip exterior portion.
16. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed on said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed on an interior and exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed on said chip connector portion, said chip interior portion and said chip exterior portion being disposed on an interior and exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board connector portion, said circuit board interior portion, said chip exterior portion, and at least a portion of said chip connector portion.
17. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed on said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed on an interior and exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed on said chip connector portion, said chip interior portion and said chip exterior portion being disposed on an interior and exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board connector portion, said circuit board interior portion, said chip exterior portion, said chip connector portion, and at least a portion of said chip interior portion.
18. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed on said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed on an interior and exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed on said chip connector portion, said chip interior portion and said chip exterior portion being disposed on an interior and exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board exterior portion, said circuit board connector portion, said circuit board interior portion, said chip exterior portion, and at least a portion of said chip connector portion.
19. The molded photosensitive assembly of claim 9, wherein said edge region of said circuit board comprises a circuit board interior portion, a circuit board connector portion, and a circuit board exterior portion, wherein said circuit board connector of said circuit board is disposed on said circuit board connector portion, said circuit board interior portion and said circuit board exterior portion being disposed on an interior and exterior side of said circuit board connector portion, respectively, wherein said non-photosensitive region of said photosensitive element comprises a chip interior portion, a chip connector portion, and a chip exterior portion, wherein said chip connector of said photosensitive element is disposed on said chip connector portion, said chip interior portion and said chip exterior portion being disposed on an interior and exterior side of said chip connector portion, respectively, wherein said support body encases at least a portion of said circuit board exterior portion, said circuit board connector portion, said circuit board interior portion, said chip exterior portion, said chip connector portion, and at least a portion of said chip interior portion.
20. The molded photosensitive assembly of any of claims 1-19, wherein a height of the support element is greater than or equal to a height of the lead upward protrusions.
21. The molded photosensitive assembly of any of claims 1-19, wherein a height of the support element is lower than a height of the lead upward protrusions.
22. The molded photosensitive assembly of any of claims 1-19, wherein the support member has elasticity.
23. The molded photosensitive assembly of any of claims 1-19, wherein said support member has an adhesive property.
24. The molded photosensitive assembly of claim 23, wherein said support member has a shore hardness in the range of a50-a80 and an elastic modulus in the range of 0.1Gpa-1Gpa.
25. A molded photosensitive assembly for a camera module, comprising:
at least one photosensitive element;
at least one circuit board;
at least one group of leads, wherein two ends of each group of leads are respectively connected with the chip connecting piece of each photosensitive element and the circuit board connecting piece of each circuit board;
at least one support element, wherein each of said support elements is configured to encase at least a portion of each set of said leads; and
at least one molded base, wherein each molded base comprises a molded body and at least one optical window, wherein the molded body covers at least a part of the supporting element and an edge area of the circuit board after molding, and a photosensitive area of each photosensitive element corresponds to the optical window of each molded base, and the molded body covers at least a part of the outer side surface and the top surface of the supporting body of the supporting element.
26. The molded photosensitive assembly of claim 25, wherein said support member comprises said support body and a through hole, said support body having said top surface, an inner side surface and said outer side surface, said top surface of said support body extending inwardly and outwardly to connect to said inner side surface and said outer side surface, respectively, said inner side surface forming said through hole, wherein said support body is configured to encase at least a portion of said leads, said photosensitive member corresponding to said through hole, said molded body encasing said outer side surface of said support body.
27. The molded photosensitive assembly of claim 26, wherein said molded base further comprises at least a portion of said top surface of said support body.
28. A camera module with molded photosensitive assembly, comprising:
at least one optical lens; and
at least one molded photosensitive assembly, wherein each molded photosensitive assembly further comprises:
a support element formed from a first medium;
a photosensitive element;
a circuit board;
a plurality of leads, wherein both ends of each of the leads are connected to a chip connector of the photosensitive element and a wiring board connector of the wiring board, respectively, wherein the supporting member covers at least a portion of each of the plurality of leads; and
A molded base formed of a second medium, wherein the molded base comprises a molded body and has an optical window, wherein the supporting member is configured to prevent a pressing surface of the molding die from pressing the lead wire when the molded body is molded by the molding die, wherein a photosensitive area of the photosensitive member corresponds to the optical window, wherein each of the optical lenses is disposed on a photosensitive path of the photosensitive member of each of the molded photosensitive assemblies, respectively, wherein the molded body covers at least a portion of an outer side surface and a top surface of the supporting body of the supporting member.
29. The camera module of claim 28, further comprising at least one actuator, wherein each of the optical lenses is assembled to each of the actuators, and each of the actuators is assembled to a top surface of the molded body of each of the molded photosensitive components.
30. The camera module of claim 28 or 29, further comprising at least one filter element, wherein each filter element is disposed between each of the optical lenses and the photosensitive element of each of the molded photosensitive assemblies, respectively.
31. The camera module of claim 30, wherein each of the filter elements is assembled to a top surface of the molded body of each of the molded photosensitive assemblies, respectively.
32. The camera module of claim 29, further comprising at least one filter element, wherein each filter element is disposed between each optical lens and each photosensitive element of each molded photosensitive assembly, wherein the top surface of the molded body has an inner side surface and an outer side surface, wherein the inner side surface is in a lower plane than the outer side surface so that the molded body forms a recess, the filter element is assembled to the inner side surface of the molded body and is positioned in the recess, and the driver is assembled to the outer side surface of the molded body.
33. The camera module of claim 30, further comprising at least one support, wherein each of the filter elements is assembled to each of the supports, each of the supports is assembled to a top surface of the molded body such that each of the filter elements is disposed between each of the optical lenses and the photosensitive element of each of the molded photosensitive assemblies, respectively.
34. A camera module with molded photosensitive assembly, comprising:
at least one optical lens; and
at least one molded photosensitive assembly, wherein each molded photosensitive assembly further comprises:
a photosensitive element;
a circuit board;
a set of leads, wherein both ends of each lead are respectively connected to the chip connecting piece of the photosensitive element and the circuit board connecting piece of the circuit board;
a support element, wherein said support element is configured to encase at least a portion of each of said leads; and
a molded base, wherein the molded base comprises a molded body and has a light window, wherein the molded body covers an edge region of the circuit board and at least a portion of the supporting member after molding, a light sensing region of each of the light sensing members corresponds to the light window of the molded base, respectively, wherein each of the optical lenses is disposed on a light sensing path of the light sensing member of each of the molded light sensing assemblies, respectively, wherein the molded body covers at least a portion of an outer side surface and a top surface of the supporting body of the supporting member.
35. The camera module of claim 34, wherein the camera module is a fixed focus camera module or a zoom camera module.
36. An electronic device, comprising:
an electronic device body; and
at least one camera module, wherein each camera module is respectively arranged on the electronic equipment body for obtaining images, wherein each camera module further comprises at least one optical lens and at least one molded photosensitive assembly, each molded photosensitive assembly comprises a supporting element, a photosensitive element, a circuit board, a group of leads and a molded base, wherein two ends of each lead are respectively connected with a chip connector of the photosensitive element and a circuit board connector of the circuit board, the supporting element covers at least one part of each lead, the molded base comprises a molded main body and a light window, wherein the supporting element is used for preventing a pressing surface of the molded main body from pressing the leads when the molded main body is molded by a molding process, the photosensitive area of the photosensitive element corresponds to the light window, each optical lens is respectively arranged on a photosensitive path of the photosensitive element of each molded assembly, and the molded main body covers at least one part of the outer side surface of the supporting main body and the top surface of the supporting element.
37. A method of manufacturing a molded photosensitive assembly, the method comprising the steps of:
(a) Connecting a photosensitive element and a circuit board through a group of leads;
(b) Placing the photosensitive element and the circuit board on an upper die or a lower die of a forming die;
(c) Supporting the upper die upward by a support member during clamping of the upper die and the lower die to prevent the pressing surface of the upper die from pressing each set of the leads, wherein the support member covers at least a portion of each set of the leads; and
(d) A fluid-like molding material is added to a molding space formed between the upper mold and the lower mold to form a molding base after the molding material is cured, wherein the molding base comprises a molding body and has at least one optical window, wherein the molding body covers at least a portion of an edge region of the circuit board and at least a portion of the supporting member, wherein the molding body covers at least a portion of an outer side surface and a top surface of a supporting body of the supporting member.
38. The manufacturing method according to claim 37, wherein in the step (c), when the pressing face of the upper mold presses the top surface of the support body, the top surface of the support body is deformed to closely adhere the pressing face of the upper mold to the top surface of the support body so that the photosensitive region of the photosensitive element is in a sealed environment, wherein in the step (d), the support body prevents the molding material from entering the sealed environment so that the molding material forms the molding body covering the outer side face of the support body after curing, and the optical window is formed on the inner side face of the support body.
39. A method of manufacturing a molded photosensitive assembly, the method comprising the steps of:
(A) Connecting a photosensitive element and a circuit board through a group of leads;
(B) At least partially encasing the leads with a support element to form a molded photosensitive component blank;
(C) Placing the molded photosensitive assembly semi-finished product on an upper mold or a lower mold of a molding mold, wherein the supporting element supports the upper mold upwards to prevent a pressing surface of the upper mold from pressing the lead wire in the process of clamping the upper mold and the lower mold; and
(D) And adding a fluid molding material into a molding space formed between the upper mold and the lower mold to form a molding base after the molding material is solidified, wherein the molding base comprises a molding body and a light window, the molding body covers at least one part of the supporting element and the edge area of the circuit board, and the photosensitive area of the photosensitive element corresponds to the light window.
40. A method of manufacturing a molded photosensitive assembly, the method comprising the steps of:
(h) Attaching a photosensitive element to a circuit board;
(i) Pre-fixing the photosensitive element and the circuit board by a supporting element to obtain a molded photosensitive assembly semi-finished product, wherein the supporting element prevents gaps from being generated between the photosensitive element and the circuit board;
(j) Placing the molded photosensitive assembly semi-finished product on an upper die or a lower die of a molding die so as to form an annular molding space between the upper die and the lower die when the upper die and the lower die are closed; and
(k) And adding a fluid molding material into the molding space to form a molding base after the molding material is solidified, wherein the molding base comprises a molding body and a light window, the molding body covers at least one part of the edge area of the circuit board and the supporting element, the photosensitive area of the photosensitive element corresponds to the light window, and the molding body covers at least one part of the outer side surface and the top surface of the supporting body of the supporting element.
41. A method of manufacturing a molded photosensitive assembly, the method comprising the steps of:
(H) The chip connecting piece is connected with the photosensitive element through a group of leads and the circuit board connecting piece is connected with the circuit board through a group of leads;
(I) Placing the photosensitive element and the circuit board on an upper die or a lower die of a forming die so as to form an annular forming space between the upper die and the lower die when the upper die and the lower die are clamped;
(J) Reducing the impact force of the molding material on the lead by blocking the molding material by a supporting element which is positioned in the molding space and covers at least one part of the lead when the fluid molding material is added into the molding space; and
(K) Forming a molded base after the molding material is cured, wherein the molded base comprises a molded body and has a light window, wherein the molded body covers at least a portion of the edge region of the circuit board, the support element, and the non-photosensitive region of the photosensitive element, wherein the molded body covers at least a portion of the top surface and the outer side of the support body of the support element.
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| Application Number | Priority Date | Filing Date | Title |
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| US16/088,435 US11289521B2 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
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| CN201780049556.1A CN109891870B (en) | 2016-08-12 | 2017-08-14 | Camera module and array camera module based on integrated packaging technology |
| CN202110534866.0A CN113992818A (en) | 2016-08-12 | 2017-08-14 | Camera module and array camera module based on integrated packaging technology |
| PCT/CN2017/097425 WO2018028718A1 (en) | 2016-08-12 | 2017-08-14 | Camera module based on integral encapsulation technique and array camera module |
| JP2021060338A JP7344924B2 (en) | 2016-04-28 | 2021-03-31 | Imaging module manufacturing method |
| US17/678,347 US11824071B2 (en) | 2016-03-28 | 2022-02-23 | Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device |
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| US11758253B2 (en) | 2018-04-17 | 2023-09-12 | Ningbo Sunny Opotech Co., Ltd. | Camera module having chamfer, photosensitive assembly, preparation method, and electronic device |
| KR102500699B1 (en) * | 2018-04-17 | 2023-02-15 | 닝보 써니 오포테크 코., 엘티디. | Camera module, photosensitive assembly and electronic device with chamfer |
| CN111355871A (en) * | 2018-12-21 | 2020-06-30 | 三赢科技（深圳）有限公司 | Lens module and assembling method thereof |
| CN111752066B (en) * | 2019-03-28 | 2022-05-03 | 日本电产三协株式会社 | Optical unit with shake correction function |
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