CN105847645A - Shooting module based on integrated packaging technology, and integrated pedestal assembly and manufacturing method thereof - Google Patents

Shooting module based on integrated packaging technology, and integrated pedestal assembly and manufacturing method thereof Download PDF

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Publication number
CN105847645A
CN105847645A CN201610311232.8A CN201610311232A CN105847645A CN 105847645 A CN105847645 A CN 105847645A CN 201610311232 A CN201610311232 A CN 201610311232A CN 105847645 A CN105847645 A CN 105847645A
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CN
China
Prior art keywords
wiring board
base portion
camera module
main body
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610311232.8A
Other languages
Chinese (zh)
Other versions
CN105847645B (en
Inventor
王明珠
赵波杰
田中武彦
郭楠
黄桢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201610311232.8A priority Critical patent/CN105847645B/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to PCT/CN2016/092020 priority patent/WO2017140092A1/en
Priority to CN201690000252.7U priority patent/CN208353432U/en
Priority to EP16890320.1A priority patent/EP3419275A4/en
Priority to US15/999,858 priority patent/US11877044B2/en
Priority to KR1020217023290A priority patent/KR102465474B1/en
Priority to KR1020187026982A priority patent/KR102282687B1/en
Priority to JP2018543321A priority patent/JP6829259B2/en
Publication of CN105847645A publication Critical patent/CN105847645A/en
Priority to JP2018555482A priority patent/JP6952052B2/en
Priority to US15/512,065 priority patent/US10477088B2/en
Priority to PCT/CN2016/106402 priority patent/WO2017181668A1/en
Priority to KR1020187033639A priority patent/KR102152517B1/en
Priority to TW106204229U priority patent/TWM561225U/en
Priority to TW108100078A priority patent/TWI708987B/en
Priority to TW108100066A priority patent/TWI743429B/en
Priority to TW106110049A priority patent/TWI648587B/en
Priority to US15/627,418 priority patent/US10110791B2/en
Priority to US15/627,408 priority patent/US10129452B2/en
Priority to US15/627,425 priority patent/US9900487B2/en
Priority to US15/627,437 priority patent/US10194064B2/en
Priority to US15/627,429 priority patent/US9848109B2/en
Priority to US16/575,357 priority patent/US11533416B2/en
Application granted granted Critical
Publication of CN105847645B publication Critical patent/CN105847645B/en
Priority to JP2021007710A priority patent/JP7508380B2/ja
Priority to US17/833,025 priority patent/US20220303441A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The invention discloses a shooting module based on an integrated packaging technology, and an integrated pedestal assembly and manufacturing method thereof. The shooting module comprises a lens, a photosensitive chip and a circuit board assembly, wherein the photosensitive chip is installed on the circuit board assembly and the lens is disposed on a photosensitive path of the photosensitive chip; and the circuit board assembly comprises a circuit board portion and a packaging portion, the packaging portion is integrally packaged and connected with the circuit board portion, the packaging portion is provided with a through hole for providing the photosensitive path for an optical filter.

Description

Camera module based on integral packaging technique and integral base assembly thereof and manufacture method
Technical field
The present invention relates to camera module field, further, relate to a camera module based on integral packaging technique And integral base assembly and manufacture method.
Background technology
COB (Chip on Board chip package) technique be tradition camera module assembling manufacture process in extremely An important technical process.The camera module that traditional COB technique is made is generally by wiring board, photosensitive core The parts such as sheet, camera lens, microscope base and motor assemble.
As it is shown in figure 1, be a camera module schematic diagram of tradition COB technique manufacture.Described camera module bag Include a wiring board 1P, a sensitive chip 2P, a microscope base 3P, an optical filter 4P, a motor 5P and a camera lens 6P.Described sensitive chip 2P is mounted on described wiring board 1P, described optical filter 4P and is installed in described mirror Seat 3P, described camera lens 6P are installed in described motor 5P, described motor 5P and are installed in described microscope base 3P, Described microscope base 3P is by by being installed on described wiring board 1P, in order to described camera lens 6P and described optical filter 4P position Photosensitive path in described sensitive chip 2P.
Further, in COB technique, described microscope base 3P and described wiring board 1P glues typically by glue The mode connect is fixed on described wiring board 1P, and based on bonding technique and the characteristic of glue, described microscope base Easily there is the phenomenon such as (Tilt), bias in 3P, it usually needs by AA (Active Arrangement Automatically calibration) technique calibrates.
On the other hand, traditional described microscope base 3P typically by completing that single Shooting Technique manufactures, because of The flatness of this its own face is poor, and the negligible amounts of the described microscope base that once can manufacture.Assembling process leads to Being often to bond on wiring board by single support, each camera module is individually to assemble, and therefore manufactures Process is relative complex, production efficiency is relatively low.
It is noted that be usually installed some circuit devcies 11P on described wiring board 1P as circuit Driving element, such as resistance, electric capacity etc., these circuit devcies 11P protrudes from described wiring board 1P, and passes Group between wiring board 1P, described circuit devcie 11P and described microscope base 3P described in the COB technique of system Dress matching relationship has some unfavorable factors, and limits camera module to a certain extent to lightening development Direction.
Specifically, first, described circuit devcie 11P is directly exposed to the surface of described wiring board 1P, because of This is in follow-up assembling process, the most bonding described microscope base 3P, welds the processes such as described motor 5P, can not The meeting avoided is affected, and during welding, solder resist, dust are easily attached to described circuit devcie 11P, and described Circuit devcie 11P and described sensitive chip 2P is positioned at space, therefore the dust pollutant being interconnected Being easy to transfer, pollute described sensitive chip 2P, the camera module after such impact is likely to result in assembling is deposited In bad phenomenon such as pitch-black points, reduce product yield.
Secondly, described microscope base 3P is positioned at the outside of described circuit devcie 11P, in order to prevent described circuit devcie 11P damaged, generally when installing described microscope base, it usually needs at described microscope base and described circuit devcie 11P Between reserved certain safe distance, and direction in the horizontal direction and straight up is required for reserved safe distance, And such requirement increases the demand to camera module thickness the most to a certain extent so that it is thickness is difficult to reduce.
3rd, during COB assembles, described microscope base 3P is glued to institute by paste such as glue State wiring board 1P, AA to be carried out (Active Arrangement the calibrates automatically) technique when pasting, It is exactly to adjust described microscope base 3P, described wiring board 1P and the central axis of described motor 5P so that it is reach Horizontal direction is consistent with vertical direction, therefore to meet AA technique, needs in described microscope base 3P and institute State and be required between wiring board 1P and described microscope base and described motor 5P presetting more glue so that phase Leave adjustment space between Hu, and on the one hand this demand adds the thickness to camera module to a certain extent Degree demand so that it is thickness is difficult to reduce, on the other hand, repeatedly pastes assembling process and easily causes inclining of assembling The most inconsistent, and the planarization of described microscope base 3P, described wiring board 1P and described motor 5P is required relatively High.
Additionally, in traditional COB technique, described wiring board 1P provides most basic fixing, support carrier, Therefore, requiring possess certain structural strength for described wiring board 1P itself, this requirement makes described line Road plate 1P has bigger thickness, thus the pre-add thickness requirements of camera module the most again.
Along with various electronic products, the development of smart machine, camera module is the most increasingly to high-performance, lightening Direction is developed, and in the face of the various high performance demands for development such as high pixel, high imaging quality, the electronics in circuit Components and parts are more and more, the area of chip is increasing, drive the Passive components such as resistance, electric capacity to increase accordingly, This makes that the specification of electronic device is increasing, assemble that difficulty constantly increases, the overall dimensions of camera module more comes The biggest, and from the point of view of above-mentioned, traditional assembling mode of microscope base, wiring board and component etc. is to a certain degree On be also the very big restriction of the lightening development of camera module.
Summary of the invention
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, wherein said integral base assembly includes a base portion and a wiring board portion, described pedestal Portion is shaped in described wiring board portion rather than bonding mode.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, wherein said wiring board portion includes a wiring board main body and at least one component, described Component protrudes from described wiring board main body, and described component is coated with by described base portion, from without directly Connect and be externally exposed.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, be connected to described wiring board main body, with described line wherein said base portion integral packaging Road plate main body has stronger connection reliability, and strengthens the structural strength of described wiring board main body.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, be connected to described wiring board portion, and described pedestal wherein said base portion integral packaging Portion can spend less thickness and reach Structural strength calls, such that it is able to reduce the lateral dimension of described camera module.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, be connected to described wiring board main body wherein said base portion integral packaging, is assembling institute When stating camera module, it is not necessary to carry out AA adjustment, it is not required that reserved AA adjusts space, thus reduces institute State the height of camera module.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, wherein when manufacturing described camera module, multiple described base portion simultaneously integral packaging in One whole jigsaw, thus realize the jigsaw operation of described camera module, improve production efficiency.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method thereof, wherein said wiring board main body has an inner groovy, is suitable to install described camera module One sensitive chip, thus reduce described sensitive chip and the relative altitude of described wiring board main body, reduce further Requirement for height to described base portion.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, wherein said wiring board main body has a path and an external groove, and described external groove connects In described path, described groove installs described sensitive chip with being suitable to upside-down mounting.
It is an object of the present invention to provide a camera module based on integral packaging technique and one pedestal group Part and manufacture method thereof, wherein said wiring board portion includes a back-up coat, is arranged at described wiring board with being stacked Bottom part body, to strengthen structural strength and the heat dispersion of described wiring board main body.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, wherein wiring board main body has at least one reinforced hole, and described base portion extends into described Reinforced hole, further enhances the structural strength of described wiring board main body.
It is an object of the present invention to provide camera module based on integral packaging technique and an integral base thereof Assembly and manufacture method, wherein said base portion includes a camera lens construction section, is suitable to install described camera module One camera lens, thus provide stable installation site for described camera lens.
In order to realize above goal of the invention and other objects of the present invention and advantage, an aspect of of the present present invention provides One camera module based on integral packaging technique, comprising: at least one camera lens, at least one sensitive chip and one by one Susceptor body assembly；Wherein said integral base assembly includes a base portion and a wiring board portion, and described base portion is straight Grounding connection is in described wiring board portion, and described sensitive chip is installed in described wiring board portion, and described camera lens is positioned at The photosensitive path of described sensitive chip.
According to one embodiment of the invention, base portion described in described camera module forms at least one through hole, with Described sensitive chip is relative, in order to provide photosensitive path for described sensitive chip.
According to one embodiment of the invention, described camera module includes at least one motor and at least one optical filter, Described camera lens is installed in described motor, described optical filter and described motor and is installed in described integral base assembly Described base portion top.
According to one embodiment of the invention, described in described camera module, the thickness range of base portion is: 0.3～1.2mm.
According to one embodiment of the invention, the thickness of base portion described in described camera module is 0.6mm.
According to one embodiment of the invention, the lateral cross-sectional dimension model of camera module described in described camera module Enclose for: 5～20mm.
According to one embodiment of the invention, described in described camera module, the altitude range of camera module is: 3～6mm.
According to one embodiment of the invention, wiring board portion described in described camera module includes a wiring board main body, Described base portion is shaped in described wiring board main body in the way of molding.
According to one embodiment of the invention, described in described camera module, the thickness range of wiring board main body is: 0.15～0.5mm.
According to one embodiment of the invention, base portion described in described camera module is neighbour around described photosensitive Outside chip, thus extend described base portion thickness so that described base portion has higher with described wiring board portion Connectivity robustness.
According to one embodiment of the invention, described in described camera module, integral base assembly includes at least one horse Reaching attachment structure, described motor attachment structure includes at least one lead-in wire and at least one pin groove, and described lead-in wire is set Being placed in described base portion, and be electrically connected to described wiring board main body, described pin groove is arranged at described base portion Upper end, described lead-in wire includes that a motor connects end, and described motor connects end line in described groove bottom wall, in order to When at least one motor pin is plugged in described pin groove, it is electrically connected to described motor connects end.
According to one embodiment of the invention, described in described camera module, integral base assembly includes at least one horse Reaching attachment structure, described motor attachment structure includes at least one pin groove and at least one circuit junction, described circuit Contact is electrically connected to described wiring board main body, and described pin groove is arranged at described base portion, by described wiring board Main body extends to the top of described base portion, and described circuit junction is revealed in described pin groove, in order at least One motor pin is electrically connected to described circuit junction when being plugged in described pin groove.
According to one embodiment of the invention, described in described camera module, integral base assembly includes at least one horse Reaching attachment structure, described motor attachment structure includes at least one engraving circuit, and described engraving circuit is arranged at described Base portion, is electrically connected to described wiring board main body, in order to electrically connect a motor pin.
Another aspect of the present invention provides the manufacture method of a camera module, and it includes step: a wiring board master Unitary packed at least one base portion on body.
According to one embodiment of the invention, described manufacture method includes step: formed extremely in described base portion A few through hole.
According to one embodiment of the invention, described manufacture method includes step: in described wiring board main body Form the multiple described base portion of multiple layout arrangement.
According to one embodiment of the invention, described manufacture method includes step, described wiring board main body is entered Row segmentation, forms multiple independent integral base assembly.
According to one embodiment of the invention, described manufacture method includes step, is mounted on by a sensitive chip The described wiring board main body of described integral base assembly, and it is positioned at the inner side of described base portion.
According to one embodiment of the invention, described manufacture method includes step: be coated with by described base portion Protrude from the component of described wiring board main body.
According to one embodiment of the invention, described manufacture method includes step: form one in described base portion Mounting groove, is communicated in described through hole.
According to one embodiment of the invention, described manufacture method includes step: bury multiple lead-in wire underground to described Base portion, and make described lead-in wire electrically connect described wiring board main body, in order to connect a motor.
According to one embodiment of the invention, described manufacture method includes step: arrange multiple pin groove to institute State base portion top, and make the motor connection end of described lead-in wire be revealed in described pin groove.
According to one embodiment of the invention, described manufacture method includes step: arrange at least one circuit junction To described wiring board main body, and corresponding pin groove is set to described base portion so that each described circuit junction It is revealed in described pin groove, in order to motor pin is electrically connected to described circuit junction when inserting described pin groove.
According to one embodiment of the invention, described manufacture method includes step: arrange at least one engraving circuit To described base portion, each described engraving circuit is electrically connected to described wiring board main body, in order to be electrically connected one Motor.
According to one embodiment of the invention, carve circuit described in described manufacture method in the way of laser formation It is arranged at described base portion.
According to one embodiment of the invention, base portion described in described manufacture method is by molding or mould pressing process It is shaped in described wiring board main body.
Accompanying drawing explanation
Fig. 1 is the camera module of tradition COB technique.
Fig. 2 is that the camera module based on integral packaging technique of first preferred embodiment according to the present invention cuts open Depending on schematic diagram.
Fig. 3 is the integral base component manufacturing process schematic diagram of first preferred embodiment according to the present invention.
Fig. 4 is the integral base assembly manufacture method schematic diagram of first preferred embodiment according to the present invention.
Fig. 5 is that the camera module based on integral packaging technique of first preferred embodiment according to the present invention is another One embodiment.
Fig. 6 A, 6B, 6C and 6D be second preferred embodiment according to the present invention based on integral packaging work The camera module of skill and the different embodiments of motor attachment structure thereof.
Fig. 7 is the camera module based on integral packaging technique of the 3rd preferred embodiment according to the present invention And the cross-sectional schematic of integral base assembly.
Fig. 8 be the 4th preferred embodiment according to the present invention camera module based on integral packaging technique and The cross-sectional schematic of its integral base assembly.
Fig. 9 be the 5th preferred embodiment according to the present invention camera module based on integral packaging technique and The cross-sectional schematic of its integral base assembly.
Figure 10 be the 6th preferred embodiment according to the present invention camera module based on integral packaging technique and The cross-sectional schematic of its integral base assembly.
Figure 11 be the 7th preferred embodiment according to the present invention camera module based on integral packaging technique and The cut-away view of its integral base assembly.
Figure 12 be the 8th preferred embodiment according to the present invention camera module based on integral packaging technique and The cross-sectional schematic of its integral base assembly.
Figure 13 be the 9th preferred embodiment according to the present invention camera module based on integral packaging technique and The cross-sectional schematic of its integral base assembly.
Figure 14 be the tenth preferred embodiment according to the present invention camera module based on integral packaging technique and The cross-sectional schematic of its integral base assembly.
Figure 15 is the camera module based on integral packaging technique of the tenth preferred embodiment according to this invention Another embodiment.
Figure 16 is that the shooting based on integral packaging technique of the above preferred embodiment according to the present invention is taken the photograph with tradition As modular structure strength ratio relatively schematic diagram.
Figure 17 is camera module based on integral packaging technique and the biography of the above preferred embodiment according to the present invention The lateral dimension of system camera module compares schematic diagram.
Figure 18 is the camera module based on integral packaging technique according to above preferred embodiment of the present invention and tradition The aspect ratio of camera module relatively schematic diagram.
Figure 19 is the flat of the camera module based on integral packaging technique of the above preferred embodiment according to the present invention Whole degree schematic diagram.
Figure 20 is camera module based on integral packaging technique and the biography of the above preferred embodiment according to the present invention The image quality of system camera module compares schematic diagram.
Figure 21 A and 21B is the shooting based on integral packaging technique of the above preferred embodiment according to the present invention Module compares schematic diagram with tradition camera module manufacture process.
Detailed description of the invention
Hereinafter describe and be used for disclosing the present invention so that those skilled in the art are capable of the present invention.In below describing Preferred embodiment be only used as citing, it may occur to persons skilled in the art that other obvious modification.With The ultimate principle of the present invention defined in lower description can apply to other embodiments, deformation program, improvement side Case, equivalent and the other technologies scheme without departing from the spirit and scope of the present invention.
As shown in Figures 2 to 4, it is that first preferred embodiment according to the present invention is based on integral packaging technique Camera module.Described camera module can be applied to various electronic equipment, described to assist use to pass through Camera module carries out shooting activity, the most described camera module can be used for shooting object or the image of personage or Video image etc..Preferably, described camera module can be employed a mobile electronic device, the most described movement Electronic equipment can be but not limited to mobile phone or panel computer equipment.
As shown in Figures 2 to 4, described camera module includes integral base assembly 10, sensitive chip 30 With a camera lens 50.
Further, described sensitive chip 30 is installed in described integral base assembly 10,50, described camera lens On described integral base assembly 10, and described camera lens 50 is positioned at the photosensitive path of described sensitive chip 30. Described integral base assembly 10 can be coupled to described electronic equipment, thus coordinate with described electronic equipment and make With.Those skilled in the art is it should be appreciated that described camera lens 50 and described sensitive chip 30 can be mutual Coordinate filmed image.Specifically, subject, object or person thing reflection light by as described in camera lens After 50, received to carry out photoelectric conversion by described sensitive chip 30.In other words, described sensitive chip 30 The signal of telecommunication can be converted optical signal into, and the described signal of telecommunication can pass through described integral base assembly 10 quilt It is sent to described electronic equipment, thus on described electronic equipment, generates the image relevant to described reference object.
Described integral base assembly 10 includes base portion 11 and a wiring board portion 12, described base portion 11 1 Body encapsulation ground be connected to described wiring board portion 12, mold be connected to as described in wiring board portion 12.More specifically, Described base portion 11 (Molding On Board, MOB) molding by the way of being molded into wiring board connects In described wiring board portion.It is to say, described base portion 11 is attached directly to described wiring board portion 12, and Connecting not by intermedium, such as glue, the most described base portion 11 has preferably with described wiring board portion 12 Connectivity robustness.
Described wiring board portion 12 includes that a wiring board main body 121, described base portion 11 are integrally connected to described line Road plate main body 121.Described base portion 11 forms a through hole 1100, so that described base portion 11 is around institute State outside sensitive chip 30, and described camera lens 50 and the passage of light of described sensitive chip 30 are provided.Institute State sensitive chip 30 and be arranged at the described wiring board main body 121 of described through hole 1100 correspondence position.
Described wiring board portion 12 includes a connection circuit and at least one component 122, and described connection line is pre- Being located at described wiring board main body 121, described component 122 is electrically connected to described connection circuit, for described The photosensitive work process of sensitive chip 30.Described component 122 it may be that citing ground but be not limited to, electricity Resistance, electric capacity, diode, audion, potentiometer, relay, driver etc..
It is noted that described component 122 element can be coated on inside by described base portion 11, Hence in so that described component 122 will not be directly exposed in space, more specifically, be not exposed to In the enclosed environment that described sensitive chip 30 is connected.The existence of circuit devcie in different traditional camera modules Mode, as capacitance resistance ware protrudes from the mode of wiring board, thus prevents dust, foreign material from staying in described circuit elements Part 122 and pollute described sensitive chip 30.In this embodiment in accordance with the invention, with described component 122 Illustrate as a example by protruding from described wiring board main body 121, and in other embodiments of the invention, described electricity It is internal that circuit component 122 is embedded in described wiring board main body 121, and non-bulging described wiring board main body 121, Those skilled in the art is it should be appreciated that the structure of described component 122, type and the position that is set Putting not is the restriction of the present invention.It is understood that in the camera module of transmission, circuit devcie protrudes from Described wiring board, and base can only be installed in the outside of described component 122, the most described circuit devcie It is required for certain locus with described base, therefore higher in horizontal dimensional requirement to wiring board.And it is right In the camera module based on integral packaging technique of the present invention, described base portion 11 integral packaging is in described circuit Plate main body 121, and it is coated with described component 122, the most described base portion 11 and described component 122 Overlapped in space, thus add the space that described base portion 11 can inwardly be arranged, reduce institute State the outside extension demand of wiring board main body 121, thus reduce the lateral dimension of described camera module so that it is be permissible Meet the equipment of miniature requirement.
It is noted that described base portion 11 is coated with described component 122 has the described circuit elements of protection Part 122 so that it is avoid advantage that is contaminated and that by mistake touched, corresponding camera module is brought advantage simultaneously, But those skilled in the art is it should be appreciated that described base portion 11 is not limited to be coated with described component 122.It is to say, in other embodiments of the invention, described base portion 11 can directly be molded into not to be had The described wiring board main body 121 of the described component 122 protruded, it is also possible to be to be molded into described component The diverse locations such as the outside of 122, surrounding.
In this embodiment of the present invention, described base portion 11 protrudingly around outside described sensitive chip 30, Especially, described base portion 11 closes connection integratedly so that it is have good sealing, thus when described When camera lens 50 is installed in the photosensitive path of described sensitive chip 30, in described sensitive chip 30 is sealed in Portion, thus form space in the closing of correspondence.
Specifically, when manufacturing described integral base assembly 10, a traditional wiring board can be selected as institute State wiring board main body 121, mold on described wiring board main body 121 surface.Such as, in one embodiment, Injection machine can be used, SMT technique (Surface will be carried out by insert molding (Insert Molding) technique Mount Technology surface mount process) after wiring board carry out integral packaging, such as molded packages, shape Become described base portion 11, or form described base portion 11 by mould pressing process conventional in semiconductor packages.Enter One step, is mounted on described wiring board main body 121, then by each described photosensitive core by each described sensitive chip 30 Sheet 30 is electrically connected with described wiring board main body 121, such as plays gold thread electrical connection.Described wiring board main body 121 can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB Hardboard (without soft board) etc..Described base portion 11 formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described base portion 11 can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use epoxy resin.Those skilled in the art should When being understood by, the aforementioned manufacture that can select and the material that can select, it is illustrative only this Invention can be not the restriction of the present invention in the way of enforcement.
In other embodiments of the invention, the process of described integral base assembly 10 is manufactured it is also possible that elder generation Described wiring board main body 121 is carried out SMT technique, and then described sensitive chip 30 is mounted on described circuit Plate main body 121, and described sensitive chip 30 is electrically connected, such as with described wiring board main body 121 Play gold thread electrical connection, then described wiring board main body 121 will be carried out integral packaging, such as molded packages, logical The mode crossing insert molding forms described base portion 11, or by mould pressing process shape conventional in semiconductor packages Become described base portion 11.Those skilled in the art is it should be appreciated that the system of described integral base assembly 10 Make the restriction that order is not the present invention.
Described camera module includes that an optical filter 40, described optical filter 40 are installed in described base portion 11, with It is easy to provide stable, smooth mounting condition for described optical filter 40.
More specifically, in one embodiment of this invention, described optical filter 40 is implemented as an IR-cut filter Mating plate 40 (Infra-Red Cut Filter, IRCF), described cutoff filter 40 is to utilize precision optics Coating technique alternately plates the blooming of high index of refraction on optical base-substrate, it is achieved visible region (400-630nm) High saturating, the optical filter 40 that near-infrared (700-1100nm) ends, it can eliminate Infrared to institute State the Imaging of sensitive chip 30, such as CCD or CMOS.By the imaging system at described camera module System adds described cutoff filter 40, stops the infrared light of imaging system portion interference image quality, The become image of described camera module is made to more conform to the best perception of human eye.
It is noted that due to described sensitive chip 30, such as CCD or CMOS, sensing and the people to light Eye is different, and human eye can only see the visible ray of 380-780nm wave band, and described sensitive chip 30 then can be felt Should more multiband, such as infrared light and ultraviolet light, especially the most sensitive to infrared light, therefore at described camera module In infrared light have to be suppressed, and keep the high transmission of visible ray so that described sensitive chip 30 Sense close to human eye, so that the image of described camera module shooting also complies with the sensing of eyes, therefore institute It is indispensable for stating cutoff filter 40 for described camera module.
Especially, in an embodiment of the present invention, described optical filter 40 can be selected from combination: wafer scale is infrared Edge filter, narrow band pass filter, smalt IRCF.Those skilled in the art is it should be appreciated that institute The type stating optical filter 40 is not the restriction of the present invention.
In the camera module that traditional COB assembles, optical filter is usually installed in plastic feet, and base Being installed on wiring board typically by bonding mode, the most this plastic feet and corresponding mounting means are not Skew easily occurs or tilts, and the surface smoothness of plastic stent is poor, therefore can not carry for optical filter 40 For good mounting condition.According to this preferred embodiment of the present invention, described optical filter 40 is installed in described Base portion 11, and based on moulding technology, it is possible to obtain good surface smoothness, therefore, it is possible to be described filter Mating plate 40 provides smooth mounting condition, and integrated mode so that described base portion 11 is difficult to be occurred Eccentric, tilt phenomenon, thus reduce cumulative limit when described optical filter 40 is installed.
It will also be appreciated that the shape of described base portion 11 can determine as required, such as at described electricity Circuit component 122 position extends internally, and forms a protuberance, thus increases described base portion 11 correspondence Width, and there is no the position of described component 122, described disjunctor molded section 11 as one man extends, shape Become the shape of comparison rule, and width is less.Those skilled in the art is it should be appreciated that described base portion The concrete shape of 11 is not the restriction of the present invention.
Further, described base portion 11 includes cladding section 111 and an optical filter construction section 112, a described optical filtering Being integrally connected to described cladding section 111, described cladding section 111 molding is connected to institute sheet construction section 112 molding State wiring board main body 121, be used for being coated with described component 122.Described optical filter construction section 112 is used for pacifying Fill described optical filter 40.
It is to say, when described integral base assembly 10 is used for assembling described camera module, described shooting The described optical filter 40 of module is installed in described optical filter construction section 112 so that described optical filter 40 is positioned at On the photosensitive path of corresponding described sensitive chip 30, and need not provide extra optical filter 40 mounting bracket. It is to say, described base portion 11 has the function of traditional microscope base herein, but based on integral packaging technique Advantage, described optical filter construction section 112 top can be by the technology mode of mold so that it is have good Planarization so that described optical filter 40 is installed with being flattened, this point is also an advantage over traditional shooting Module.
Further, described optical filter construction section 112 forms a mounting groove 1121, and described mounting groove 1121 is even Lead in described through hole 1100, provide sufficient installing space for described optical filter 40 so that described optical filter 40 The top surface of optical filter construction section 112 will not be protruded from.It is to say, described base portion 11 upper end arranges institute State mounting groove 1121, thus respectively stable for described optical filter 40 is installed on described base portion 11, and will not be convex Top for described base portion 11.
It is noted that in this embodiment in accordance with the invention, described mounting groove 1121 may be used for installing Described optical filter 40, and in other enforcements of the present invention, it is described that described mounting groove 1121 can be used to installation The parts such as the motor of camera module or camera lens, those skilled in the art is it should be appreciated that described mounting groove The purposes of 1211 is not the restriction of the present invention.
In other words, described base portion 11 has described mounting groove 1121, and described mounting groove 1121 is communicated in Described through hole 1100, in order to provide sufficient installing space for described optical filter 40.It is to say, described base The described top surface 1122 in seat portion 11 is in step-like structure, and is not that one extends, described top surface 1122 Each step on can be used for described optical filter 40, described camera lens 50 or described motor 60 are installed.
Further, the height of described mounting groove 1121 is more than the thickness of described optical filter 40, so that described filter When mating plate 40 is installed in described mounting groove 1121, described optical filter 40 will not protrude from described base portion 11 Top.
Especially, according to this embodiment of the invention, described optical filter 40 is square, described mounting groove 1121 The shape of shape and described optical filter 40 adapt.It is to say, described mounting groove 1121 is in square annular, It is communicated in described through hole 1100.
It is noted that in this embodiment in accordance with the invention, described mounting groove 1121 may be used for installing Described optical filter 40, and in other enforcements of the present invention, it is described that described mounting groove 1121 can be used to installation The parts such as the motor 60 of camera module or described camera lens 50, those skilled in the art is it should be appreciated that institute The purposes stating mounting groove 1121 is not the restriction of the present invention.
In this embodiment in accordance with the invention, described camera module includes a motor 60, such as voice coil motor, institute State camera lens 50 and be installed in described motor 60, in order to drive described camera lens 50 to move by described motor 60, Regulate the focal length of described camera module, say, that described camera module is a dynamic burnt module (Automatic Focus Model, AFM).
It will also be appreciated that in this embodiment in accordance with the invention, accompanying drawing is said as a example by dynamic burnt module Bright, and in other embodiments of the invention, described shooting can be one to focus module, those skilled in the art Member is it should be appreciated that the type of described camera module is not the restriction of the present invention.
Described motor 60 is installed in the described base portion 11 of described integral base assembly 10, further, institute State motor 60 and be installed in the described top surface 1122 of described base portion 11, say, that described optical filter 40 and the mutually coordinated described top surface 1122 taking described base portion 11 of described motor 60.
Described camera lens 50 is installed in described motor 60, and described motor 60 and described optical filter 40 are installed in Described base portion 11, thus described base portion 11 is equivalent to the function of base of tradition camera module, for described Motor 60 and described optical filter 40 provide the position supporting, fixing, but manufacture, assembling and form are the most not It is same as tradition COB technique.The base of the camera module of traditional COB technique is fixed in the way of bonding Wiring board, and described base portion 11 is fixed on described wiring board main body 121 by the way of being molded into wiring board, Need not the process of being adhesively fixed, molding mode relative to adhering fixed mode have more preferable connective stability and The controllability of technical process, planarization is higher, provides good for described motor 60 and described optical filter 40 Mounting condition, and described base portion 11 and described wiring board main body 121 do not exist AA adjust glue space, Therefore the headspace that tradition camera module AA adjusts is eliminated so that the thickness of described camera module is subtracted Little；On the other hand, described base portion 11 is coated with described component 122 so that conventional base space and electricity Circuit component 122 installing space can be spatially overlapping, it is not necessary to as traditional camera module, at circuit devcie The most reserved safe distance, so that the described base portion 11 with base functions can be arranged on less Size, thus further provide the space that camera module thickness can reduce.Additionally, described base portion 11 Replace traditional base, it is to avoid the heeling error that base brings when pasting and assembling, reduce described shooting mould The cumulative limit that group assembles.
It will also be appreciated that the shape of described base portion 11 can more it needs to be determined that, such as at described electricity Circuit component 122 position extends internally, and forms a protuberance, thus increases described base portion 11 correspondence Width, and there is no the position of described component 122, described disjunctor molded section as one man extends, and forms ratio Relatively regular shape, and width is less.Those skilled in the art is it should be appreciated that described base portion 11 Concrete shape be not the restriction of the present invention.
According to this embodiment of the invention, described sensitive chip 30 can the company of energising by least one connecting line 31 It is connected to described wiring board main body 121, and can be energized and be connected to described connecting line 31 tunnel.Described connecting line 31 May be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.Especially, described photosensitive The described connecting line 31 of chip 30 can be connected to described wiring board main body 121 by traditional COB mode, Citing ground but be not limited to, the mode of welding.It is to say, described sensitive chip 30 and described wiring board main body The connection of 121 can make full use of existing ripe interconnection technique, to reduce the cost of improvement technology, to traditional Technique and equipment make full use of, it is to avoid the wasting of resources.Certainly, those skilled in the art should manage Solving, described sensitive chip 30 can also pass through other any energy with the connection of described wiring board main body 121 The connected mode of the goal of the invention of enough present invention realized realizes, and the present invention is unrestricted in this regard.
It is noted that in this embodiment of the present invention, each described sensitive chip 30 is arranged at The upper surface of described wiring board main body 121, described base portion 11 is around the outside of described sensitive chip 30. When manufacturing described integral base assembly 10, different manufacturing sequence can be selected, citing ground but be not limited to, In a kind of embodiment, described sensitive chip 30 first can be installed in described wiring board main body 121, then Outside described sensitive chip 30, the described wiring board main body 121 upper mold described base portion of moulding one-tenth 11, and The described component 122 that will protrude above described wiring board main body 121 is coated on inside it.And the present invention's In another embodiment, can first in the described wiring board main body 121 upper mold described base portion of moulding one-tenth 11, And the described component 122 that will protrude above described wiring board main body 121 is coated on inside it, then by institute State sensitive chip 30 and be installed on described wiring board main body 121 so that it is be positioned at the inner side of described base portion 11.
With reference to Fig. 5, it is another embodiment of the camera module of first preferred embodiment according to the present invention, Described camera module can be one to focus module (Fix Focus Model, FFM).In described camera module, Described camera lens 50 is installed in the top surface 1122 of described base portion 11, and the focal length of the most described camera module is not Can freely be adjusted.Described camera lens 50 and described optical filter 40 coordinate to configure the institute of described base portion 11 Stating top surface 1122, described optical filter 40 is mounted described mounting groove 1121.Those skilled in the art should Being understood by, the type of described shooting molding is not the restriction of the present invention.
It is noted that according to this preferred embodiment of the present invention, described base portion 11 can be used to prop up Described optical filter 40 and described camera lens 50 are installed in support, have the function of conventional base, and based on the advantage molded, Described base portion 11 can control planarization and the concordance of described base portion 11 by mould, thus for institute State the installation environment that the described optical filter 40 of camera module provides smooth and consistent with described camera lens 50, thus Being easier to ensure that the concordance of the optical axis of camera lens 50 and optical filter 40 and sensitive chip 30, this point is to pass The camera module of system is not readily reachable by.
With reference to Fig. 6 A, according to the camera module of second preferred embodiment of the present invention, described camera module Described integral base assembly 10 includes a motor attachment structure 13, for connecting the motor 60 of described camera module. Described motor 60 has at least one motor pin 61.Described motor attachment structure 13 includes at least one lead-in wire 131, Each described lead-in wire 131 is used for electrically connecting described motor 60 and described wiring board main body 121.Each described lead-in wire 131 It is electrically connected to wiring board main body 121.Further, each described lead-in wire 131 is electrically connected to described wiring board main body 121 Connection circuit.Described lead-in wire 131 is arranged at described base portion 11, and extends to described base portion 11 Top.Described lead-in wire 131 includes that a motor connects end 1311, is revealed in the top of described base portion 11, For electrically connecting the described pin 61 of described motor 60.It is noted that described lead-in wire 131 can be in shape When becoming described base portion 11, embedding manner is arranged.In traditional connected mode, such as drive the parts such as motor Being all to be connected to wiring board by arranging single wire, manufacturing process is relative complex, and at this of the present invention The mode burying described lead-in wire 131 when planting molding underground can replace the technical processs such as traditional motor welding, and makes Obtain circuit and connect more stable.Especially, in an enforcement of the present invention, described lead-in wire 131 is a wire, It is embedded in described base portion 11 internal.Citing ground, described motor pin 61 can pass through anisotropic conductive Film is connected to described motor and connects end 1311, it is also possible to is connected to described motor by the way of welding and connects end 1311。
It is noted that the described motor of the burial place of described lead-in wire 131 and described lead-in wire 131 connects End 1311 can be arranged as required in the position of described base portion 11 display, such as, in a reality of the present invention Executing in example, the described motor of described lead-in wire 131 connects end 1311 and can be arranged at outside described base portion 11 Enclose, the top surface of the most described base portion 11, the top surface of described optical filter construction section 112, and in the present invention Another embodiment in, described motor connect end 1311 can be arranged at described base portion 11 in enclose, i.e. Described mounting groove 1121 bottom surface of described base portion 11, such that it is able to provide described motor 60 different installation Position.In other words, when described motor 60 needs to install to described base portion top, described motor connects End 1311 is arranged at described base portion periphery top surface, when described motor 60 needs to install to described mounting groove When 1121, described motor connection end 1311 encloses in being arranged at described base portion 11, the most described mounting groove 1121 Bottom surface.
It is to say, when manufacturing described integral base assembly 10, can first mount each described sensitive chip 30 To described wiring board main body 121, then mold described in described wiring board main body 121 in the way of MOB Base portion 11, and described lead-in wire 131 can be set inside described base portion 11 with embedding manner when molding, And make described lead-in wire 131 be electrically connected to described wiring board main body 121, and make the institute of described lead-in wire 131 State motor connection end 1311 and be shown in the top of described base portion, in order to be connected to the described of described motor 60 Motor pin 61.Citing ground, when described integral base assembly 10 is used for assembling described shooting molding, institute The each described pin 61 stating motor 60 is connected to the described motor connection of described lead-in wire 131 by the way of welding End 1311, so that described motor 60 is electrically connected to described wiring board main body 121, and needs to arrange individually Wire described motor 60 and described wiring board main body 121 are connected, and make the described horse of described motor 60 The length reaching pin 61 can reduce.
The equivalence with reference to Fig. 6 B being the described motor attachment structure of the above preferred embodiment according to the present invention is real Execute example.It is described that described motor attachment structure 13 includes that a pin groove 133, described pin groove 133 are used for accommodating The described motor pin 61 of the described motor 60 of camera module.Described pin groove 133 is arranged at described pedestal Upper end, portion 11.Described motor attachment structure 13 includes that at least one lead-in wire 134 each described lead-in wires 134 are for being electrically connected Connect described motor 60 and described wiring board main body 121.Described lead-in wire 134 is arranged at described base portion 11, And extend upwardly to the groove bottom wall of the described pin groove 133 of described base portion 11.Described lead-in wire 134 includes One motor connects end 1341, is revealed in the groove bottom wall of the described pin groove 133 of described base portion 11, for electricity Connect the described motor pin 61 of described motor 60.Especially, in one embodiment, described motor is even Connect end 1341 and may be implemented as a pad.Described lead-in wire 134 may be implemented as a wire, is embedded in Described base portion 11 is internal.
It is to say, when manufacturing described integral base assembly 10, first mount described sensitive chip 30, then In described wiring board main body 122, in the way of MOB, mold described base portion 11, and preset pre-fixed length The described pin groove 133 of degree, and described lead-in wire 134 can be set with embedding manner when molding, and make institute State lead-in wire 134 and be electrically connected to described wiring board main body 122, and the described motor of described lead-in wire 134 is connected End 1341 is shown in the groove bottom wall of the described pin groove 133 of described base portion 11, in order to be connected to described horse Reach the described pin 61 of 60.Citing ground, is used for assembling described shooting mould at described integral base assembly 10 When moulding, each described motor pin 61 of described motor 60 inserts described pin groove 133, and by the side of welding Formula is connected to the described motor of described lead-in wire 134 and connects end 1341, so that described motor 60 is electrically connected to Described wiring board main body 122, and need to arrange single wire by described motor 60 and described wiring board main body 122 connect, and make can stably the connecting of described motor pin 61 of described motor 60, prevent outside Unwanted touch described motor pin 61.Especially, described lead-in wire 134 may be implemented as a wire, It is embedded in described base portion 11 internal.
With reference to Fig. 6 C, it is that another equivalence of the motor attachment structure of the above preferred embodiment according to the present invention is real Execute example.It is described that described motor attachment structure 13 includes that a pin groove 135, described pin groove 135 are used for accommodating The described motor pin 61 of the described motor 60 of camera module.Described pin groove 135 is arranged at described pedestal Portion 11.Described motor attachment structure 13 includes that at least one circuit junction 132, described circuit junction 132 are preset In described wiring board main body 122, and it is electrically connected to the described connection line of 122 in described wiring board main body. Further, each described pin groove 135 is extended to described wiring board main body 122 by the top of described base portion 11, And described circuit junction 132 is shown.In a kind of way of example, described motor pin 61 is suitable to Insert described pin groove 135, and can be welded to connect with described circuit junction 132.
It is to say, when manufacturing described integral base assembly 10, described wiring board main body 122 is preset Each described circuit junction 132, and then mount 121, described photosensitive core, then in described wiring board main body 122 On, in the way of MOB, mold described base portion 11, and the described pin groove 135 of default predetermined length, And described circuit junction 132 is shown by described pin groove 135, in order to it is connected to described motor 60 Described motor pin 61.Citing ground, is used for assembling described shooting molding at described integral base assembly 10 Time, each described motor pin 61 of described motor 60 inserts described pin groove 135, and by the way of welding The described circuit junction 132 being connected in wiring board main body 122, so that described motor 60 is electrically connected to Described wiring board main body 122, and the described motor pin 61 of described motor 60 can stably be connected, Prevent from outside unwanted touching described motor pin 61.
With reference to Fig. 6 D, it is that above-mentioned another equivalence being preferable to carry out inner motor attachment structure according to the present invention is implemented Example.Described motor attachment structure 13 includes that an engraving circuit 136, described engraving circuit 136 are used for electrically connecting The parts such as described connection line, described sensitive chip 30 and motor in described wiring board main body 122.Lift Example ground but be not limited to, described engraving circuit 136 can by laser formation (LDS) by the way of formed described in Arrange during base portion 11.In traditional connected mode, such as driving the parts such as motor is all by arranging list Only wire is connected to wiring board, and manufacturing process is relative complex, and arranges institute when this molding of the present invention The mode stating engraving circuit 136 can replace the technical processs such as traditional motor welding, and circuit is connected More stable.More specifically, the forming process of described engraving circuit 136 is it may be that presently described base portion 11 arrange engraving groove, then arranging circuit in the way of plating in described engraving groove.
In different embodiments of the invention, the described motor 60 of described camera module is connected to described one base The mode of holder assembly 10 connected mode corresponding with Fig. 6 A, 6B, 6C and 6D can carry out free combination, Select the mode that is suitable for connect described motor 60, use described pin groove 133 with go between 134, as described in pin groove 135 and described circuit junction 132.And in one embodiment of this invention, with reference to Fig. 2, described motor 60 can To be connected to described integral base assembly 10, such as by the way of welding in the way of traditional.This area Skilled artisan understands that, the connected mode of described motor 60 and described integral base assembly 10 is not It is that the present invention limits.
As it is shown in fig. 7, be camera module and the integral base group thereof of the 3rd preferred embodiment according to the present invention Part.Unlike above preferred embodiment, described integral base assembly 10 includes wiring board main body 121A. Described wiring board main body 121A includes that two inner groovy 1211A, each described sensitive chip 30 are arranged at correspondence Described inner groovy 1211A in.It is different from integral base assembly 10 in above-described embodiment, described sensitive chip 30 are set in described inner groovy 1211A, and are accommodated therein by described sensitive chip 30 so that described sense Optical chip 30 will not substantially protrude from the upper surface of described wiring board main body 121A so that described sensitive chip The height reduction of 30 the most described base portion 11, thus reduce described sensitive chip 30 to described base portion 11 Limitation in height, it is provided that reduce further the probability of height, and described sensitive chip 30 be mounted on described In inner groovy 1211A, described sensitive chip 30, the most described connecting line 31 can be protected, prevent outside Parts touch described sensitive chip 30 by mistake.
Further, described sensitive chip 30 is connected to described wiring board main body 121 by described connecting line 31, And it is electrically connected to described connection line.Described lead-in wire may be implemented as, citing ground but be not limited to, gold thread, Copper cash, aluminum steel, silver wire.It is to say, described sensitive chip 30 and described connecting line 31 are all located at described line In the described inner groovy 1211A of road plate main body 121A.In one embodiment, described integral base group is being manufactured During part 10, need first in described wiring board main body 121A, to arrange described inner groovy 1211A.It is to say, Traditional wiring board is opened described inner groovy 1211A so that it is be suitable to accommodate and described sensitive chip 30 is installed.
Fig. 8 is the 4th camera module of preferred embodiment according to the present invention and cuing open of integral base assembly thereof Diagram.
Being different from above preferred embodiment, described integral base assembly 10 includes wiring board main body 121B, Described wiring board main body 121B has a path 1212B, and it is described that the bottom of described path 1212B is suitable to installation Sensitive chip 30.Described path 1212B makes the described upper and lower both sides of wiring board main body 121B be connected, thus When described sensitive chip 30 is installed on upward by the back side and the photosensitive area of described wiring board main body 121B During described wiring board main body 121B, the photosensitive area of described sensitive chip 30 is able to receive that by described camera lens 50 The light entered.
Further, described wiring board master has external groove 1213B, and it is right that described external groove 1213B is communicated in The described path 1212B answered, it is provided that the installation site of described sensitive chip 30.Especially, when described photosensitive When chip 30 is installed in described external groove 1213B, the outer surface of described sensitive chip 30 and described circuit The surface of plate main body 121B is consistent, is generally aligned in the same plane, thus ensures the table of described integral base assembly 10 Face planarization.
It is to say, in this embodiment in accordance with the invention, described path 1212B is step-like, thus just In installing described sensitive chip 30, provide stable installation site for described sensitive chip 30, and make it photosensitive District represents in interior space.
It is noted that in this embodiment in accordance with the invention, it is provided that a kind of be different from traditional chip and install Mode, i.e. flip-chip mode (Flip Chip, FC).By described sensitive chip 30 from described wiring board master The direction, the back side of body 121B be installed on described wiring board main body 121B rather than as above-described embodiment needs from The front of described wiring board main body 121B, i.e. from the top of described wiring board main body 121B, and described sense The photosensitive area of optical chip 30 is installed on described wiring board main body 121B upward.Such structure and installation side Formula so that described sensitive chip 30 and described base portion 11 are relatively independent, the installation of described sensitive chip 30 Will not be affected by described base portion 11, described base portion 11 molded to described sensitive chip 30 Impact the least.Additionally, described sensitive chip 30 is embedded in the lateral surface of described wiring board main body 121B, And the medial surface of described wiring board main body 121B will not be protruded from, so that described wiring board main body 121B Inner side reserves bigger space so that the height of described base portion 11 will not be by the height of described sensitive chip 30 Degree limits so that described base portion 11 can reach less height.
It is noted that in other embodiments of the invention, institute is installed in the upper end of described path 1212B State optical filter 40, say, that, it is not necessary to described optical filter 40 is installed on described base portion 11, thus subtracts The back focal length of little described camera module, reduces the height of described shooting.Especially, described optical filter 40 is permissible Being carried out example is cutoff filter IRCF.
Fig. 9 is the 5th camera module of preferred embodiment according to the present invention and cuing open of integral base assembly thereof Diagram.
Described integral base assembly 10 includes a back-up coat 123C, is connected to described back-up coat 123C lamination Described wiring board main body 121 bottom, in order to strengthen the structural strength of described wiring board main body 121.Namely Say, in described wiring board main body 121 at the bottom of the region at described base portion 11 and described sensitive chip 30 place Laminating fills described back-up coat 123C, so that described wiring board main body 121 reliablely and stablely supports described base Seat portion 11 and described sensitive chip 30.
Further, described back-up coat 123C is a metallic plate, and described metallic plate is attached at described wiring board main body The bottom of 121, increases the structural strength of described wiring board main body 121, on the other hand, increases described one base The heat dispersion of holder assembly, the heat that the described sensitive chip 30 that can effectively scatter and disappear sends.
It is noted that described wiring board main body 121 can use FPC (Flex Print Circuit, flexibility Printed circuit board), and by the rigidity of FPC described in described back-up coat 123C so that there is good bendability The FPC of energy disclosure satisfy that the bearing requirements of described integral base assembly.It is to say, described wiring board main body The selectable range of 121 is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RG (Rigid Flex, Rigid Flex).Described wiring board master is increased by described back-up coat 123B The structural strength of body 121 and improve heat dispersion, such that it is able to reduce the thickness of described wiring board main body 121, The height making described integral base assembly reduces further, and is assembled the height of the camera module obtained by it Reduce.
Figure 10 is the 6th camera module of preferred embodiment according to the present invention and cuing open of integral base assembly thereof Diagram.
Being different from above preferred embodiment, described wiring board main body 121D has at least one reinforced hole 1214D, described base portion 11 extends in described reinforced hole 1214D, thus strengthens described wiring board master The structural strength of body 121D.
The position of described reinforced hole 1214D can select as required, and the structure according to described wiring board Strength demand is arranged, structure the most symmetrically.Setting by described reinforced hole 1214D makes described The structural strength of wiring board main body 121D strengthens, such that it is able to reduce the thickness of described wiring board main body 121D, Reduce the thickness of the camera module assembled by it, and improve the heat dispersion of described integral base assembly.
It is noted that described reinforced hole 1214D is groove-like, thus manufacture described integral base assembly Time, the moulding material of described base portion 11 will not be spilt by described reinforced hole 1214D.
Figure 11 is the 7th camera module of preferred embodiment according to the present invention and cuing open of integral base assembly thereof Diagram.
Being different from above preferred embodiment, described wiring board main body 121E has at least one reinforced hole 1214E, Described base portion 11 extends in described reinforced hole 1214E, thus strengthens described wiring board main body 121E Structural strength.
The position of described reinforced hole 1214E can select as required, and the structure according to described wiring board Strength demand is arranged, structure the most symmetrically.Setting by described reinforced hole 1214E makes described The structural strength of wiring board main body 121E strengthens, such that it is able to reduce the thickness of described wiring board main body 121E, Reduce the thickness of the camera module assembled by it, and improve the heat dispersion of described integral base assembly.
It is noted that described reinforced hole 1214E is perforation, say, that through described wiring board master Body 121E's so that the both sides connection of described wiring board main body 121E, thus manufacture described integral base group During part, the moulding material of described base portion 11 is combined with described wiring board main body 121E fully, is formed more Firm composite structure, and the structure of the most described groove-like, described perforation is easier to processing and manufacturing.
Figure 12 is the 8th camera module of preferred embodiment according to the present invention and cuing open of integral base assembly thereof Diagram.
Being different from above preferred embodiment, described base portion 11F includes cladding section 111F, an optical filtering A sheet construction section 112F and camera lens construction section 113F, described optical filter construction section 112F and described camera lens are installed Section 113F molds the most integratedly and is connected to described cladding section 111F, and described cladding section 111F molding is connected to Described wiring board main body 121, is used for being coated with described component 122 and described connecting line 31.Described optical filter Construction section 112F is used for installing described optical filter 40, say, that when described integral base assembly is used for group When filling described camera module, the optical filter 40 of described camera module is installed in described optical filter construction section 112F, Described optical filter 40 is positioned on the photosensitive path of described sensitive chip 30, and need not provide extra filter Mating plate 40 mounting bracket.It is to say, described base portion 11F has the function of conventional stent herein, but Being advantage based on integral packaging technique, described optical filter construction section 112F top can be by the work of mold Skill mode so that it is there is good planarization, so that described optical filter 40 is entirely mounted, this Point is also an advantage over traditional camera module.Described camera lens construction section 113F is used for installing described camera lens 50, the most just Being to say, when described integral base assembly is used for assembling described camera module, described camera lens 50 is installed in Inside the described camera lens construction section 11F3 of described base portion 11F, in order to provide stable for described camera lens 50 Installation site.
Further, described optical filter construction section 112F has two mounting groove 1121F, described mounting groove 1121F It is communicated in the described through hole 1100F of correspondence, provides sufficient installing space for each described optical filter 40 so that Each described optical filter 40 is stable to be installed.Described camera lens construction section 113F has two camera lens mounting groove 11211F, Each described camera lens mounting groove 11211F is communicated in the described through hole 1100F of correspondence, the most each described camera lens 50 Sufficient installing space is provided.
In other words, described optical filter construction section 112F and described camera lens construction section 113F upwardly extends integratedly, And it is internally formed step-like structure, the most described optical filter 40 and described camera lens 50 provide and support fixed position, From without providing extra parts to install described optical filter 40 and described camera lens 50.
Described camera lens construction section 113F has two camera lens inwall 1132F, each described camera lens inwall 1132F respectively In closed annular, being suitable to camera lens 50 provides installing space.It is noted that described camera lens construction section 1132F Each described camera lens inwall 1132F surfacing, thus be suitable to install threadless described camera lens 50, formed Focus module.Especially, described camera lens 50 can be fixed on described camera lens construction section 113F by the way of bonding.
With reference to Figure 13, it is integral base assembly and the camera module of the 9th preferred embodiment according to the present invention. Being different from above preferred embodiment, described integral base assembly 10 includes a screen layer 126, described screen Cover layer 126 and wrap up described wiring board main body 122 and described base portion 11, thus strengthen described wiring board master While the structural strength of body 122, strengthen the anti-electromagnetic interference capability of described integral base assembly 10.
With reference to Figure 14, according to camera module and the integral base assembly thereof of the tenth preferred embodiment of the present invention. Being different from above preferred embodiment, described camera module includes at least one bearing 70G, is used for installing each institute State optical filter 40, each described camera lens 50 or each described motor 60.According to this embodiment of the invention, described Bearing 70 is installed in described base portion 11, and each described optical filter 40 is installed in described bearing 70, each institute State motor 60 and be installed in described bearing 70.The concrete shape of described bearing 70 can be arranged as required to, Boss is such as set, in order to install each described optical filter.
According to this embodiment of the invention, described bearing 70G has one first seat slot 71G and one second Propping up seat slot 72G, described first seat slot 71G is used for installing described optical filter 40 so that described optical filter 40 Surface will not protrude from the top of described bearing 70.Described second seat slot 72G, is used for being installed on described Base portion 11, so that described base portion 11 upwardly extends along described bearing 70G, and described optical filter 40 Positional to downwards, thus reduce the back focal length of described camera module.
In other words, described bearing 70G extends in described through hole 1100, and downwardly extends, thus by institute State optical filter 40 to be supported in above described sensitive chip 30, and utilize the space in described through hole 1100, make While optical filter 40 is stably installed, described optical filter 40 will not take space outerpace.
It is noted that the distance that described bearing 70G extends internally is positioned at the photosensitive of described sensitive chip 30 Outside district, say, that described bearing 70G will not block the described photosensitive area of described sensitive chip 30, with Avoiding affecting the photo-process of described sensitive chip 30, the size of described bearing 70G can design with real needs.
In this embodiment and respective drawings of the present invention, illustrate as a example by dynamic burnt module, described mirror 50 by by being installed on described motor 60, and described motor 60 is installed in described bearing 70G.It is to say, Described bearing 70G provides installation site for described optical filter 40 and described motor 60.And this present invention's In other embodiments, described camera module can also is that one focuses module.Described camera lens 50 is installed in described Bearing 70G, say, that described bearing 70G provides for described optical filter 40 and described camera lens 50 and installs Position, those skilled in the art is it should be appreciated that the concrete structure of described bearing 70 and described shooting mould The type of group is not the restriction of the present invention.
With reference to Figure 15, according to another embodiment of the camera module of the tenth preferred embodiment of the present invention. Being different from above preferred embodiment, described camera module includes that a bearing 70H, described bearing 70H use In installing described optical filter 40.Described bearing 70H is installed in described encapsulation part 11, described optical filter 40 Being installed in described encapsulation part 11, described motor 60 or described camera lens 50 are installed in described encapsulation part 11.
Further, described bearing 70H is installed in the described mounting groove 1121 of described encapsulation part 11, and described The height of mounting groove 1121 setting height(from bottom) more than described bearing 70H, so that described bearing 70H will not Protrude from the top of described encapsulation part 11.
According to this embodiment of the invention, described bearing 70H has one first seat slot 71H and one second Propping up seat slot H, described first seat slot 71H is used for installing described optical filter 40 so that described optical filter 40 Surface will not protrude from the top of described bearing 70H.Described second seat slot 72H, is used for being installed on described Encapsulation part 11, so that described encapsulation part 11 upwardly extends along described bearing 70H, and described optical filter 40 Positional to downwards, thus reduce the back focal length of described camera module.
In other words, described bearing 70H extends in described through hole 1100, and downwardly extends, thus by institute State optical filter 40 to be supported in above described sensitive chip 30, and utilize the space in described through hole 1100, make While optical filter 40 is stably installed, described optical filter 40 will not take space outerpace.
It is noted that the distance that described bearing 70H extends internally is positioned at the photosensitive of described sensitive chip 30 Outside district, say, that described bearing 70H will not block described sensitive chip 30, to avoid impact described The photo-process of sensitive chip 30, the size of described bearing 70C can design with real needs.
It is different from above preferred embodiment, described second seat slot 71H and the described installation of described encapsulation Groove 1121 cooperates, and forms the interface arrangment of coupling, so that the peace that described bearing 70H is stabilized It is loaded in described mounting groove 1121.Relative 3rd preferred embodiment, the described optical filter in this embodiment 40 is less apart from described sensitive chip 30, it is possible to obtain has the described camera module of less back focal length.
In this embodiment and respective drawings of the present invention, illustrate as a example by dynamic burnt module, described mirror 50 by by being installed on described motor 60, and described motor 60 is installed in described bearing 70H.It is to say, Described bearing 70H provides installation site for described optical filter 40 and described motor 60.And this present invention's In other embodiments, described camera module can also is that one focuses module.Described camera lens 50 is installed in described Bearing 70H, say, that described bearing 70H provides for described optical filter 40 and described camera lens 50 and installs Position, those skilled in the art is it should be appreciated that the concrete structure of described bearing 70H and described shooting The type of module is not the restriction of the present invention.
Figure 16 is that the shooting based on integral packaging technique of the above preferred embodiment according to the present invention is taken the photograph with tradition As modular structure strength ratio relatively schematic diagram.Being tradition camera module on the left of Figure 16, right side is according to the present invention Camera module based on integral packaging technique.The thickness of the described microscope base 3P of tradition camera module is represented with a1, A2 represents the thickness of the described base portion 11 of the camera module of the present invention.
Described in tradition camera module, microscope base 3P is used for installing described optical filter 4P, described motor 5P or described Camera lens 6P, and the plastic components that described microscope base 3P is formed typically by the mode being molded.Tradition camera module In, described microscope base 3P is usually installed in the outside of described circuit devcie 11P, is not therefore increasing described line In the case of the lateral dimension of road plate main body, the installing space reserved for described microscope base 3P is limited, described microscope base The thickness a1 of 3P also can only be limited in less scope, such as 0.3mm, at this moment, described microscope base 3P and institute State wiring board 1P to be mutually bonded area less, therefore connective stability is poor, say, that make for a long time With or when having stronger External Force Acting, the easy and described wiring board 1P of described microscope base 3P is separated from each other or occurs splitting Stricture of vagina.
And camera module based on integral packaging technique according to a preferred embodiment of the invention, described base portion 11 integral packagings are in described wiring board main body 121, as described in be packaged in by the way of molding (Molding) Wiring board main body, and cover described component 122, the most described base portion 11 is relative to described microscope base 3P Have bigger can installation space, and extend to described wiring board main body 121 is internal, described thus without extension The Outside Dimensions of wiring board main body.According to this embodiment of the invention, described base portion 11 can reach relatively Big thickness a2, such as 0.6mm.Described base portion 11 has more preferable stability of strutting system, and by integrally sealing The mode of dress, described base portion 11 is more firmly connected to described wiring board main body 121 so that described shooting Module is more reliable and more stable during using.On the other hand, described base portion 11 integral packaging is in described The mode of wiring board main body 121, adds the structural strength of wiring board main body 121 described in connecting portion, described Base portion 11 plays the effect protecting described wiring board main body 121.
Figure 17 is camera module based on integral packaging technique and the biography of the above preferred embodiment according to the present invention The lateral dimension of system camera module compares schematic diagram.Being tradition camera module on the left of Figure 17, right side is according to this The camera module based on integral packaging technique of invention.The lateral cross-sectional dimension of tradition camera module is represented with b1, The lateral cross-sectional dimension of the camera module based on integral packaging technique of the present invention is represented with b2.
Described in camera module in tradition COB technique, microscope base 3P is installed in described circuit devcie 11P's Outside, described microscope base 3P and described circuit devcie 11P are separate on installing space, are required for occupying one Determine space, and in order to protect described circuit devcie 11P, around described circuit devcie 11P, need reserved one Fixed safe distance, such as the safe distance of reserved 0.35mm, these factors all make the horizontal stroke of described camera module Relatively big to size b1, the probability that lateral dimension reduces is less, it is impossible to meet undersized for camera module Demand.
And according to the camera module based on integral packaging technique of the present invention, described base portion 11 1 is packaged in institute State wiring board main body 121, and described base portion 11 is coated with described component 122, the most described base portion 11 on the basis of the requirement meeting fundamental strength, it is only necessary to described component 122 is wrapped by less size Covering, such as 0.15mm, described base portion 11 and described component 122 are overlapped, make full use of installation sky Between, the transverse dimension B 2 of the most described camera module is reduced.Especially, according to an enforcement of the present invention Example, the lateral dimension b2 of described camera module based on integral packaging technique can reach than traditional camera module The monolateral little 0.2mm of lateral dimension b1.
Figure 18 is the camera module based on integral packaging technique according to above preferred embodiment of the present invention and tradition The aspect ratio of camera module relatively schematic diagram.Being tradition camera module on the left of Figure 18, right side is according to the present invention Camera module based on integral packaging technique.Represent the height of tradition camera module with c1, represent this with c2 The height of bright camera module based on integral packaging technique, represents the described circuit of tradition camera module with d1 The thickness of plate 1P, represents the described wiring board master of the camera module based on integral packaging technique of the present invention with d2 The thickness of body 121.Tradition camera module described microscope base 3P by being adhered to described wiring board 1P, and in order to Meeting AA and adjust requirement, resin added is relatively big, and glue layer is thicker, and also needs above described circuit devcie 11P Mounting distance to be reserved, hence in so that the height c1 of described camera module is bigger.On the other hand, described microscope base 3P is positioned at outside described circuit devcie 11P, and horizontal span is relatively big, and the most described wiring board 1P requires have relatively High intensity ensures the shape of described camera module, thus it requires the thickness d 1 of described wiring board 1P is relatively big, This also makes the whole height d1 of described camera module bigger.
And according to the camera module based on integral packaging technique of the present invention, wherein said pedestal 11 integral packaging In described wiring board main body 121, it is not necessary to glue bonding space, and need not reserved AA adjustment space, and It is not necessary for described component 122 and reserves safe distance, therefore described height based on moulding technology camera module Degree c2 is reduced.On the other hand, described base portion 11 is coated with described component 122 so that described base Seat portion 11 can extend internally, and reduces the horizontal span in the middle of described base portion 11, the deformation of equal wiring board Measure less, therefore reduce the requirement of strength to described wiring board main body 121, and described base portion 11 can increase The structural strength of strong described wiring board main body 121, so that the thickness d 2 of described wiring board main body 121 can To reduce, so that the whole height c1 of described camera module based on integral packaging technique reduces further.
Figure 19 is the flat of the camera module based on integral packaging technique of the above preferred embodiment according to the present invention Whole degree schematic diagram.
The described microscope base 3P of tradition camera module manufactures by the way of injection, and assembles by the way of bonding In described camera module, the most described camera module easily occur, the phenomenon such as eccentric.And described microscope base The surface smoothness of 3P is poor, it is impossible to provide smooth mounting condition for parts such as optical filter, motor or camera lenses.
And according to the camera module based on integral packaging technique of the present invention, described base portion 11 is by integrally sealing Dress mode is connected to described wiring board main body 121, molding be connected to as described in wiring board main body 121.More enter One step, is that bronze drum on a rare occasion molding die 1 forms described base portion, passes through manufacturing described integral base assembly Described molding die 1 ensures the profile pattern of described base portion 11, and makes the top table of described base portion 11 Face 1122 is consistent with the surface, adhesion zone 1215 of described sensitive chip, for described optical filter 40, described camera lens 50 or described motors 60 are by smooth mounting condition, and make described sensitive chip 30, described optical filter 40, the optical axis of described camera lens 50 and described motor 60 is consistent.
Figure 20 is camera module based on integral packaging technique and the biography of the above preferred embodiment according to the present invention The image quality of system camera module compares schematic diagram.Being tradition camera module on the left of Figure 20, right side is according to this The camera module based on integral packaging technique of invention.The described circuit devcie 11P of tradition camera module is exposed to In the enclosed environment being interconnected with described sensitive chip 2P, and when assembling described camera module, described electricity Some dusts, the such as solder resist when welding described motor would generally be adhered on the device 11P of road, and these are grey Dirt is more difficult to remove, remains in described circuit devcie 11P surface, after described camera module is packed, dust meeting Move freely, and fall described sensitive chip when dust, during the photosensitive area of the most described sensitive chip, described Camera module arises that pitch-black point, hence in so that the image quality of described camera module is poor.
And according to the camera module based on integral packaging technique of the present invention, described component 122 is by described base Seat portion is coated with, and is not exposed in the environment identical with described sensitive chip 30, even if therefore at described circuit Element 11P has the dust of residual, such as solder resist, also will not fall described photosensitive core after the encapsulation of described camera module Sheet, therefore can ensure that the stability of the image quality of described camera module, will not occur pitch-black point after packaging.
Figure 21 A and 21B is the shooting based on integral packaging technique of the above preferred embodiment according to the present invention Module compares schematic diagram with tradition camera module manufacture process.
The assembling manufacture process of tradition camera module is typically: manufacture described microscope base 3P by the way of injection； Cutting monoblock wiring board, is adhered to single described wiring board 1P by described microscope base 3P；Then by described chip It is attached at described wiring board 1P；And then by parts peaces such as optical filter 4P, described camera lens 6P or described motor 5P It is loaded on described microscope base 3P, thus is assembled into and focuses module or dynamic burnt module.In this manufactures assembling process, Described microscope base 3P completes by the way of injection, once can only manufacture small amount, such as 4 to 8, then will Single described microscope base 3P is adhered to independent described wiring board 1P respectively, and these make described camera module Manufacture inefficient, and the more difficult control of concordance between each module.
And be typically according to the assembling manufacture process of the camera module based on integral packaging technique of the present invention: pass through Mode the most one-body molded multiple described base portion 11 on layout wiring board 2 of molding；Then to described spelling Version is split, and described layout is divided into multiple single described integral base assembly；And then in described one Described sensitive chip 30 is mounted, then by described optical filter 40, described camera lens 50 or described horse on base assembly Reach the 60 described base portion of installation, thus be assembled into dynamic burnt module or focus module.This process is different from tradition Assembling mode, the production efficiency of the described camera module that the mode of layout operation is greatly improved, and be easier to protect Demonstrate,prove the concordance between multiple module.Such as, during layout operation, can be with the described one base of one-shot forming 90 Holder assembly.
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as Illustrate and be not limiting as the present invention.The purpose of the present invention is completely and be effectively realized.The function of the present invention and Structural principle is shown the most in an embodiment and illustrates, without departing under described principle, and embodiments of the present invention Can there be any deformation or amendment.

Claims (25)

1. a camera module based on integral packaging technique, it is characterised in that including:
At least one camera lens；
At least one sensitive chip；With
One integral base assembly；Wherein said integral base assembly includes a base portion and a wiring board portion, described Base portion is attached directly to described wiring board portion, and described sensitive chip is installed in described wiring board portion, described Camera lens is positioned at the photosensitive path of described sensitive chip.
Camera module the most according to claim 1, wherein said base portion forms at least one through hole, with Described sensitive chip is relative, in order to provide photosensitive path for described sensitive chip.
Camera module the most according to claim 2, wherein said camera module include at least one motor and At least one optical filter, described camera lens is installed in described motor, described optical filter and described motor and is installed in institute State the described base portion top of integral base assembly.
Camera module the most according to claim 2, the thickness range of wherein said base portion is: 0.3～1.2mm.
Camera module the most according to claim 2, the lateral cross-sectional dimension model of wherein said camera module Enclose for: 5～20mm.
Camera module the most according to claim 2, the altitude range of wherein said camera module is: 3～6mm.
7., according to the arbitrary described camera module of claim 2 to 6, wherein said wiring board portion includes a line Road plate main body, described base portion is shaped in described wiring board main body in the way of molding.
Camera module the most according to claim 7, the thickness range of wherein said wiring board main body is: 0.15～0.5mm.
Camera module the most according to claim 7, wherein said base portion is neighbour around described photosensitive Outside chip, thus extend described base portion thickness so that described base portion has higher with described wiring board portion Connectivity robustness.
Camera module the most according to claim 7, wherein said integral base assembly includes at least one Motor attachment structure, described motor attachment structure includes at least one lead-in wire and at least one pin groove, described lead-in wire quilt Being arranged at described base portion, and be electrically connected to described wiring board main body, described pin groove is arranged at described pedestal Upper end, portion, described lead-in wire includes that a motor connects end, and described motor connects end line in described groove bottom wall, with It is easy to when at least one motor pin is plugged in described pin groove be electrically connected to described motor and connects end.
11. camera modules according to claim 7, wherein said integral base assembly includes at least one Motor attachment structure, described motor attachment structure includes at least one pin groove and at least one circuit junction, described electricity Road contact is electrically connected to described wiring board main body, and described pin groove is arranged at described base portion, by described circuit Plate main body extends to the top of described base portion, and described circuit junction is revealed in described pin groove, in order to extremely A few motor pin is electrically connected to described circuit junction when being plugged in described pin groove.
12. camera modules according to claim 7, wherein said integral base assembly includes at least one Motor attachment structure, described motor attachment structure includes at least one engraving circuit, and described engraving circuit is arranged at institute State base portion, be electrically connected to described wiring board main body, in order to electrically connect a motor pin.
The manufacture method of 13. 1 camera modules, it is characterised in that include step: in a wiring board main body Unitary packed at least one base portion.
14. manufacture methods according to claim 13, including step: formed in described base portion At least one through hole.
15. manufacture methods according to claim 14, including step: in described wiring board main body The multiple described base portion of upper formation multiple layout arrangement.
16. manufacture methods according to claim 15, including step, by described wiring board main body Split, form multiple independent integral base assembly.
17. manufacture methods according to claim 16, including step, by a sensitive chip attachment In the described wiring board main body of described integral base assembly, and it is positioned at the inner side of described base portion.
18. according to the arbitrary described manufacture method of claim 13 to 17, including step: by institute State base portion cladding and protrude from the component of described wiring board main body.
19. according to the arbitrary described manufacture method of claim 13 to 17, including step: described Base portion forms a mounting groove, is communicated in described through hole.
20. according to the arbitrary described manufacture method of claim 13 to 17, including step: bury underground many Individual lead-in wire is to described base portion, and makes described lead-in wire electrically connect described wiring board main body, in order to connect a horse Reach.
21. according to the arbitrary described manufacture method of claim 13 to 17, including step: arrange many Individual pin groove is to described base portion top, and makes the motor connection end of described lead-in wire be revealed in described pin groove.
22. according to the arbitrary described manufacture method of claim 13 to 17, including step: arrange extremely A few circuit junction is to described wiring board main body, and arranges corresponding pin groove to described base portion so that each Described circuit junction is revealed in described pin groove, in order to motor pin is electrically connected to institute when inserting described pin groove State circuit junction.
23. according to the arbitrary described manufacture method of claim 13 to 17, including step: arrange extremely A few engraving circuit is to described base portion, and each described engraving circuit is electrically connected to described wiring board main body, in order to It is electrically connected a motor.
24. manufacture methods according to claim 23, wherein said engraving circuit is with the side of laser formation Formula is arranged at described base portion.
25. according to the arbitrary described manufacture method of claim 13 to 17, and wherein said base portion passes through mould Mould or mould pressing process is shaped in described wiring board main body.
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CN201610311232.8A CN105847645B (en) 2016-05-11 2016-05-11 Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof
CN201690000252.7U CN208353432U (en) 2016-02-18 2016-07-28 Camera module and its integral base component based on integral packaging technique
EP16890320.1A EP3419275A4 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor
US15/999,858 US11877044B2 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof
PCT/CN2016/092020 WO2017140092A1 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor
KR1020217023290A KR102465474B1 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor
KR1020187026982A KR102282687B1 (en) 2016-02-18 2016-07-28 Camera module based on integrated packaging process, integrated base part thereof, and manufacturing method thereof
JP2018543321A JP6829259B2 (en) 2016-02-18 2016-07-28 Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them
JP2018555482A JP6952052B2 (en) 2016-04-21 2016-11-18 Camera modules and array camera modules based on integrated packaging technology
US15/512,065 US10477088B2 (en) 2016-04-21 2016-11-18 Camera module and array camera module based on integral packaging technology
PCT/CN2016/106402 WO2017181668A1 (en) 2016-04-21 2016-11-18 Camera module and array camera module based on integration packaging process
KR1020187033639A KR102152517B1 (en) 2016-04-21 2016-11-18 Camera module and array camera module based on integrated packaging process
TW106204229U TWM561225U (en) 2016-04-01 2017-03-26 Integral packaging process-based camera module and integral base component of same
TW108100078A TWI708987B (en) 2016-04-01 2017-03-26 Camera module based on integrated packaging process and integrated base assembly and manufacturing method thereof
TW108100066A TWI743429B (en) 2016-04-01 2017-03-26 Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof
TW106110049A TWI648587B (en) 2016-04-01 2017-03-26 Camera module based on integrated packaging process and integrated base assembly and manufacturing
US15/627,437 US10194064B2 (en) 2016-04-21 2017-06-19 Array camera module based on integral packaging technology
US15/627,408 US10129452B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US15/627,425 US9900487B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US15/627,418 US10110791B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US15/627,429 US9848109B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US16/575,357 US11533416B2 (en) 2016-04-21 2019-09-18 Camera module and array camera module based on integral packaging technology
JP2021007710A JP7508380B2 (ja) 2016-02-18 2021-01-21 一体パッケージングプロセスベースのカメラモジュール、その一体ベース部品、およびその製造方法
US17/833,025 US20220303441A1 (en) 2016-04-21 2022-06-06 Camera module and array camera module based on integral packaging technology

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