CN109495671B

CN109495671B - Image pickup module, photosensitive assembly thereof and manufacturing method

Info

Publication number: CN109495671B
Application number: CN201710810764.0A
Authority: CN
Inventors: 田中武彦; 黄桢; 赵波杰; 梅哲文
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-09-11
Filing date: 2017-09-11
Publication date: 2023-12-26
Anticipated expiration: 2037-09-11
Also published as: CN109495671A

Abstract

The utility model provides a camera module and sensitization subassembly and manufacturing method thereof, this sensitization subassembly includes: a circuit board. A photosensitive element, and a molding base integrally formed with the circuit board and the photosensitive element and forming a light window providing a light path for the photosensitive element; wherein a distance between an outer edge thereof and an inner edge thereof is a corresponding to a portion of the molded base adjacent to a first end side of the flexible region; the distance between the outer edge of the molded base and its inner edge, corresponding to the portion of the molded base remote from the opposite second end side of the flexible region, is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a. Wherein the dimensions of a and c enable the corresponding molding grooves in the molding process to be filled with molding material, thereby preventing the partial failure of filling the molding material and the formation of defective products.

Description

Image pickup module, photosensitive assembly thereof and manufacturing method

Technical Field

The invention relates to the field of camera modules, in particular to a photosensitive assembly manufactured by a molding process, a manufacturing method thereof and a camera module with the photosensitive assembly.

Background

The molding packaging technology of the camera module is a packaging technology which is developed on the basis of the traditional COB packaging technology. As shown in fig. 1A to 1C, the circuit board is packaged by using the conventional integral packaging technology. In this structure, a package 1 is packaged on a circuit board 2 and a photosensitive chip 3 in an integrally packaged manner, so as to form an integrally packaged assembly, and the package 1 encapsulates a plurality of electronic components 201 of the circuit board 2 and a series of leads 202 electrically connecting the photosensitive chip 3 and the circuit board 2, so that the length-width dimension and thickness dimension of the camera module can be reduced, the assembly tolerance can be reduced, the lens or lens assembly above the integrally packaged assembly can be smoothly mounted, and the problem that dust attached on the electronic components affects the imaging quality of the camera module is solved.

More specifically, as shown in fig. 1A and 1B, in order to improve production efficiency, the integral package assembly is generally produced in a jig production manner, that is, a plurality of the integral package assemblies are produced at one time. More specifically, fig. 1A and 1B illustrate a manner of producing the integrated package assembly by splicing using a molding die. Wherein the forming mold comprises an upper mold 101 and a lower mold 102, wherein a circuit board jigsaw is put into the lower mold 102 of the forming mold, the circuit board jigsaw comprises a plurality of circuit boards 2 in each row, and each circuit board 2 is operatively connected with a photosensitive chip 3. The upper mold 101 and the lower mold 102 are clamped to form a molding cavity, so that the upper mold 101 is pressed on the circuit board jointed board, two flow passages 103 and 104 are formed in the upper mold corresponding to two end sides of the photosensitive chip 3 on each row of circuit boards, the upper mold 101 is provided with a plurality of protruding blocks 105, an intermediate flow passage 106 is formed between two adjacent protruding blocks 105, and a plurality of intermediate flow passages 106 extend between the two flow passages 103 and 104.

In the molding process, the fluid-like encapsulation material 4 flows forward along the two flow paths 103 and 104 and fills the intermediate flow path 106 between the adjacent two bumps 105, so that the area between the adjacent two photosensitive chips 3 is also filled with the encapsulation material 4, whereby the encapsulation sections 1 can be formed on the corresponding respective wiring boards 2 and the respective photosensitive chips 3 after the encapsulation material 4 is cured, and the optical windows in the middle of the encapsulation sections 1 are formed at the positions corresponding to the respective bumps 105, and these encapsulation sections 1 are integrally molded to form a unified structure, as shown in fig. 1C.

Referring to fig. 1F, the thermosetting encapsulating material 4 has a curing time T in the molding process, and the viscosity thereof decreases to the lowest point and then gradually increases to the highest point over time to be completely cured. Ideally, when the viscosity of the encapsulation material 4 is small, the flow paths 103, 104 and 106 are filled with the encapsulation material 4, and when the viscosity of the encapsulation material 4 is large and still flows forward, the encapsulation material is rubbed against the leads 202 between the wiring board 2 and the photosensitive chip 3 to easily cause deformation and damage of the leads 202.

In the above molding process, the encapsulation material 4 is a thermosetting material, melted, enters the two runners 103 and 104, and is cured under heating. However, in practice it has been found that, when the encapsulating material 4 flows along the two flow channels 103 and 104 during the molding process, if the widths of the two flow channels 103 and 104 are not in the same range, the encapsulating material 4 will not be in the same pace during the forward flow.

More specifically, since the encapsulation material 4 is a fluid having a predetermined viscosity, the dimensions of both of the flow paths 103 and 104 are relatively small and assuming that the flow path 103 is a narrow flow path, the flow rate in the flow path 103 is relatively small, and the influence of friction generated by the inner wall of the flow path 103 on the fluid-like encapsulation material 4 therein on the flow rate thereof is relatively large, the flow rate of the encapsulation material 4 in the flow path 103 is relatively slow. The flow channel 104 is a relatively wide flow channel in which the flow rate is relatively large, and the friction generated by the inner wall of the flow channel 104 on the fluid-like encapsulating material 4 therein has a relatively small influence on the flow rate thereof, so that the flow rate of the encapsulating material 4 in the flow channel 104 is relatively fast. Thus, during the curing time T of the encapsulating material 4, the encapsulating material 4 in the runner 104 is able to flow from its feed end to its end and at least part of the intermediate runner 106 is filled with the encapsulating material 4, whereas the encapsulating material 4 in the runner 103 may not flow from its feed end to its end during the curing time T, resulting in a partial position of the runner 103 not being filled, as in the region S shown in fig. 1D, so that a connected structure of the encapsulating portion 1 with a series of complete shapes is not formed between the upper and lower dies 101, 102, corresponding to the position of the region S, the encapsulating portion 1 forming a gap, so that a circumferentially closed light window is not formed.

In addition, if the flow rate of the encapsulation material 4 in the two runners 103 and 104 is not uniform, the flow rate in the runner 104 is faster during this curing time T to enable the runners 104 and 106 to be filled with the encapsulation material 4 when the viscosity is low, and the encapsulation material 4 in the runner 103 is too slow to flow forward when the viscosity is high, the encapsulation material still flows forward in the runner 103 to cause a large friction force against the wire 202 flowing therethrough to deflect the wire 202 forward by a large extent, thereby easily causing the wire 202 to be deformed and damaged, and easily to be detached from the pad.

Another situation is that when the encapsulating material 4 reaches the area between the first and second photo-sensitive chips, more encapsulating material 4 fills the area through the runner 104, so that as the encapsulating material 4 flows forward along the two runners 103 and 104, the proportion of encapsulating material 4 of the runner 104 to encapsulating material 4 between two adjacent photo-sensitive chips 3 increases gradually, and finally, the encapsulating material 4 of the runner 104 may flow to the runner 103 to obstruct the forward further flow of encapsulating material 4 in the runner 103, and thus, after the encapsulating material 4 is solidified, the encapsulating material 4 in the runner 103 may not flow to the end of the runner 103, so that the entire molding cavity cannot be filled with the encapsulating material 4, and thus, a complete annular encapsulating portion 1 cannot be provided for each corresponding circuit board 2 and photo-sensitive chip 3.

Moreover, the photosensitive chips 3 and the wiring board 2 are connected by the flexible leads 202, and when the encapsulating material 4 flowing forward in the two runners 103 and 104 laterally extends to the intermediate runner 106 between the adjacent two of the photosensitive chips, the encapsulating material 4 flowing from the two runners 103 and 104 is substantially equivalent to being joined in the intermediate runner 106 of the same size so that the flow rates thereof are substantially uniform without generating turbulence and without causing deformation and damage of the leads 202 for connecting the photosensitive chips 3 and the wiring board 2 between the adjacent two of the photosensitive chips 3. However, when the encapsulation material 4 in the wider runner 104 reaches the runner 103 from the middle runner 106, the encapsulation material 4 in the runner 103 is prevented from continuing to flow forward, and because the runner 10 and the runner 103 are different in size, collision is caused between two fluids at the junction to form turbulence, and the turbulence is extremely easy to cause deformation of the lead 202 and even fracture of the lead 202, so that defective products are formed.

More specifically, when the fluid of the flow passage 104 flows into the flow passage 103 and flows reversely toward the feed end, as shown in fig. 1E, when the encapsulation material 4 in the two flow passages 103 and 104 flows in opposite directions face to face and turbulence is generated, there is a pressure difference between the two fluids, causing the leads 202 through which the two fluids flow to swing in different directions, thereby generating friction between the adjacent leads 202 and possibly causing damage to the leads 202.

In addition, when the width dimensions of the two runners 103 and 104 are large enough, the encapsulation material 4 can fill the runners 103, 104 and 106 within the curing time T, which, however, results in the final size of the encapsulation 1 corresponding to each wiring board 2 being large, which is not in compliance with the requirements of some miniaturized camera modules.

Disclosure of Invention

An object of the present invention is to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein in the manufacturing method of a panel of the photosensitive assembly, molding material in a molding process can fill a molding guide groove of a base panel in a molding mold, so as to avoid defective products of the photosensitive assembly.

An object of the present invention is to provide an image pickup module, a photosensitive assembly thereof, and a method of manufacturing the same, in which the molding material is capable of forming a one-piece molded base on a circuit board panel in a molding process, and the one-piece molded base is capable of forming a light window having a closed periphery at a position corresponding to each photosensitive element, so that after the formed one-piece molded base is cut, a molded base having the light window is formed on each circuit board and the corresponding photosensitive element, preventing a partial formation of the molded base from opening to communicate the light window to the outside of the molded base.

An object of the present invention is to provide a camera module, a photosensitive assembly thereof, and a manufacturing method thereof, wherein the base panel molding guide groove is used for forming the one-piece molding base on a row of circuit boards, and has two guide grooves on both sides, and a plurality of filling grooves extending laterally between the two guide grooves, wherein the molding material flows and solidifies in the guide grooves and the filling grooves, and wherein the dimension ratio between the two guide grooves is within a predetermined range, so that the molding material can flow forward from the feeding ends of the two guide grooves and fill the guide grooves and the filling grooves of the entire base panel molding guide groove.

An object of the present invention is to provide a camera module, a photosensitive assembly thereof, and a method of manufacturing the same, wherein the base panel molding guide groove is used for forming the one-piece molding base on two adjacent circuit boards integrally combined in a rigid region, and has two first guide grooves on both sides, a second guide groove in the middle, and a plurality of filling grooves respectively located between the two first guide grooves and the second guide grooves, wherein the molding material flows and solidifies in the guide grooves and the filling grooves, and the dimensional ratio between the two first guide grooves and the second guide grooves is within a predetermined range, so that the molding material can flow forward from the feed ends of the two guide grooves and fill the guide grooves and the filling grooves of the entire base panel molding guide groove.

An object of the present invention is to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein when the size of the guide grooves is small to form the miniaturized photosensitive assembly, the dimensional proportion relationship among the guide grooves is selected, so that the guide grooves with small size still fill the whole base jointed board forming guide groove in the molding process.

An object of the present invention is to provide an image pickup module, a photosensitive assembly and a manufacturing method thereof, in which the molding material fills the base panel forming guide groove before the viscosity of the molding material reaches a high value and is cured, thereby preventing the connection line between the circuit board and the photosensitive element from being damaged by the molding material having a high viscosity flowing forward.

An object of the present invention is to provide a camera module, a photosensitive assembly and a manufacturing method thereof, in which the dimensions and proportions of the guide grooves are within a predetermined range such that the molding material can reach the end of each guide groove from the feed end thereof during the molding process, preventing the molding material in one guide groove from flowing to another guide groove to hinder the molding material in the other guide groove from flowing forward.

An object of the present invention is to provide an image pickup module, a photosensitive assembly thereof, and a manufacturing method thereof, in which the molding materials respectively flowing forward through the guide grooves are joined at substantially the middle of the filling grooves, thereby preventing the molding material in one guide groove from filling the filling grooves and further flowing toward the other guide groove to generate a turbulent flow of a collision intensity, resulting in deformation and damage of a connection line connecting the circuit board and the photosensitive element.

An object of the present invention is to provide an image pickup module, a photosensitive assembly thereof, and a manufacturing method thereof, in which the molding material flows forward in the guide grooves, thereby preventing the molding material in one guide groove from flowing through the filling groove and further toward the other guide body to flow backward toward the feed end, thereby affecting the filling efficiency of the molding material in a fluid state, and causing adjacent connection lines to deflect close to each other to generate friction to cause damage to the connection lines.

An object of the present invention is to provide an image capturing module, a photosensitive assembly and a manufacturing method thereof, in which the molding material can select a material having a relatively high viscosity range, so that the molding material can easily enter a photosensitive region of the photosensitive element to form flash during the molding process when selecting a material having a relatively low viscosity range, and the pressure applied to the photosensitive element by a light window forming portion is increased to prevent the flash from causing crushing of the photosensitive element.

An object of the present invention is to provide an image capturing module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the molding process can form the integrally molded base on a row of circuit boards and a row of photosensitive elements having a plurality of circuit boards at a time, thereby forming a row of a plurality of photosensitive assemblies, such as preferably 2-12 of the photosensitive assemblies, through a jigsaw process.

In order to achieve at least one of the above objects, the present invention provides a method for manufacturing a photosensitive assembly of an image capturing module, comprising the steps of:

(a) Fixing a circuit board jointed board to a second die of a forming die, wherein the circuit board jointed board comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards arranged side by side, each circuit board comprises a rigid area and a flexible area which are combined, and each circuit board is operably connected with a photosensitive element;

(b) Closing the second mold and the first mold, and filling molten molding material into a base jointed board molding guide groove in the molding mold, wherein the position corresponding to the light window molding part is prevented from being filled with the molding material; and

(c) Curing the molding material within the base panel forming channel to form a one-piece molded base at a location corresponding to the base panel forming channel, wherein the one-piece molded base is integrally molded to each corresponding column of the circuit board and each column of the photosensitive elements to form a photosensitive assembly panel and to form a light window for each of the photosensitive elements at a location corresponding to the light window forming portion, wherein the base panel forming channel has a first channel corresponding to a first end side of the one-piece molded base adjacent to the flexible region and a second channel corresponding to a second channel of the one-piece molded base remote from the flexible region, and a filling channel extending between the first channel and the second channel for filling the molding material between two adjacent ones of the photosensitive elements in each column of the light window forming portion, wherein a width of a bottom end of the first channel is a and a width of a bottom end of the second channel is c, wherein a width a corresponds to a distance between an inner edge of the one-piece molded base adjacent to the first end of the one-piece molded base; wherein the width c corresponds to the distance between the outer edge of the portion of the one-piece molded base remote from the opposite second end side of the flexible region and the inner edge thereof, wherein 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

The photosensitive component jointed board is used for manufacturing a plurality of the photosensitive components, wherein the method further comprises the steps of: the method also comprises the steps of: cutting the photosensitive component jointed board to obtain a plurality of photosensitive components, wherein each photosensitive component comprises the circuit board, the photosensitive element and the molding base, and the molding base is integrally formed on the circuit board and the photosensitive element and forms the light window for providing a light path for the photosensitive element.

Further, the method may further comprise the step of: cutting a portion of the photosensitive member corresponding to an opposite second end side of the molded base away from the flexible region so that a distance between an outer edge of the remaining portion of the molded base and an inner edge thereof is b, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

According to another aspect of the present invention, there is provided a method for manufacturing a photosensitive assembly of an image capturing module, including the steps of:

(A) A second mold for fixing a circuit board jointed board to a forming mold, wherein the circuit board jointed board comprises a plurality of rows of circuit boards, each row of circuit boards comprises one or more circuit boards arranged side by side, each circuit board comprises a rigid area and a flexible area which are combined, and each circuit board is operably connected with a photosensitive element;

(C) Curing the molding material within the base panel molding channel to form a one-piece molded base at a location corresponding to the base panel molding channel, wherein the one-piece molded base is integrally molded to two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements to form a photosensitive assembly panel and to form a light window for providing a light path for each of the photosensitive elements at a location corresponding to the light window molding portion, wherein the two adjacent rows of the circuit boards are arranged with their flexible regions remote from each other and with their rigid regions adjacent to each other, wherein the base panel molding channel has two first guide grooves corresponding to two end sides of the one-piece molded base adjacent to the flexible regions and a second guide groove corresponding to a region between the two adjacent rows of the photosensitive elements, and a filling groove extending between the two first guide grooves and the second guide grooves for filling the molding material between the two adjacent photosensitive elements of each row of the photosensitive elements and located between the two adjacent light window molding portions, wherein the width of the first guide groove is the width of the one-piece molded base adjacent to the bottom end of the one-piece molded base, and the width of the one-piece molded base is the width of the one-piece molded base adjacent to the bottom edge thereof; wherein c corresponds to a distance between two inner edges of a portion extending to the integrally molded base between the two adjacent rows of the photosensitive elements, wherein 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

Correspondingly, the method further comprises the steps of: cutting the photosensitive component jointed board to obtain a plurality of photosensitive components, wherein each photosensitive component comprises the circuit board, the photosensitive element and the molding base, and the molding base is integrally formed on the circuit board and the photosensitive element and forms the light window for providing a light path for the photosensitive element; and cutting a portion of the photosensitive member located between the adjacent two columns of the photosensitive elements to obtain a portion of the molded base corresponding to the opposite end side of the molded base from the flexible region, and making a distance between an outer edge thereof and an inner edge thereof be b, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

According to another aspect of the present invention, there is provided a photosensitive assembly of an image capturing module, comprising:

a circuit board comprising a rigid region and a flexible region in combination;

a photosensitive element; and

a molding base integrally formed with the circuit board and the photosensitive element and forming a light window providing a light path for the photosensitive element; wherein a distance between an outer edge thereof and an inner edge thereof is a corresponding to a portion of the molded base adjacent to a first end side of the flexible region; the distance between the outer edge of the molded base and its inner edge, corresponding to the portion of the molded base remote from the opposite second end side of the flexible region, is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

In some implementations, the portion of the photosensitive assembly remote from the opposite second end side of the flexible region is adapted to be cut such that a distance between an outer edge of the remaining portion of the molded base after cutting and an inner edge thereof is b, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

According to another aspect of the present invention, there is provided a photosensitive assembly of an image capturing module, including:

a circuit board comprising a rigid region and a flexible region in combination;

a photosensitive element; and

a molding base integrally formed with the circuit board and the photosensitive element and forming a light window providing a light path for the photosensitive element; wherein a distance between an outer edge thereof and an inner edge thereof is a corresponding to a portion of the molded base adjacent to a first end side of the flexible region; the portion of the molded base corresponding to the opposite second end side of the molded base remote from the flexible region has a cut surface and a distance b between its outer edge and its inner edge, wherein 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

According to another aspect of the present invention, there is provided a photosensitive assembly panel of a camera module, comprising:

One or more columns of circuit boards, each column of circuit boards comprising one or more circuit boards arranged side-by-side, each of the circuit boards comprising a combined rigid region and flexible region;

one or more rows of photosensitive elements; and

one or more integrally molded bases, each integrally formed with a row of the circuit boards and a row of the photosensitive elements and forming a light window providing a light path for each of the photosensitive elements; wherein a distance between an outer edge thereof and an inner edge thereof corresponding to a portion of the integrally molded base adjacent a first end side of the flexible region is a; the distance between the outer edge and the inner edge of the integrally molded base, corresponding to the portion of the integrally molded base remote from the opposite second end side of the flexible region, is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

a plurality of columns of circuit boards, each column of circuit boards comprising one or more circuit boards arranged side by side, each circuit board comprising a rigid region and a flexible region in combination;

A plurality of rows of photosensitive elements; and

one or more integrally molded bases, each integrally molded base being formed on two rows of adjacent circuit boards and two rows of adjacent photosensitive elements and forming a light window providing a light path for each of the photosensitive elements, and the two rows of adjacent circuit boards being arranged with their flexible regions distant from each other and with their rigid regions adjacent to each other, such that each of the integrally molded bases has two end sides adjacent to the flexible regions; wherein a distance between an outer edge thereof and an inner edge thereof corresponding to a portion of the integrally molded base adjacent each end side of the flexible region is a; the integrally molded base extends to a distance c between the two adjacent rows of the photosensitive elements, wherein 0.2mm < a < 1mm, and 0.2mm < c < 1.5a.

According to another aspect of the present invention, there is also provided an image capturing module, including:

a lens;

a circuit board comprising a rigid region and a flexible region in combination;

a photosensitive element; and

a molding base integrally formed with the circuit board and the photosensitive element and forming a light window providing a light path for the photosensitive element, wherein the lens is located in a photosensitive path of the photosensitive element; wherein a distance between an outer edge thereof and an inner edge thereof is a corresponding to a portion of the molded base adjacent to a first end side of the flexible region; the distance between the outer edge of the molded base and its inner edge, corresponding to the portion of the molded base remote from the opposite second end side of the flexible region, is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

According to a further aspect of the present invention there is provided a molding tool for use in a camera module, comprising a first mold and a second mold adapted to be separated and brought into close contact, wherein said first and second molds form a molding cavity when brought into close contact, and said molding tool is configured with a light window molding within said molding cavity and forms a base panel molding channel around said light window molding and is adapted to hold a circuit board panel within said molding cavity, wherein the circuit board panel comprises one or more rows of circuit boards, each row of circuit boards comprising one or more circuit boards arranged side by side, each circuit board comprising a rigid region and a flexible region in combination, and each circuit board is operatively connected with a photosensitive element, said base panel molding channel is adapted to be filled with the molding material to form a one-piece molding base in a position corresponding to said base panel molding channel, wherein the one-piece molding base is integrally molded with each row of said circuit board and each row of said photosensitive elements to form the photosensitive element and form the circuit board panel in a position corresponding to said light window molding channel, each row of said photosensitive element is formed in a position corresponding to said light window molding channel, the one of said two-piece molding channels is provided in a position corresponding to said light guide channel between said two adjacent side of said first and said base molding channel and has a width between said two adjacent side of said first region and said flexible region between said two adjacent side of said photosensitive elements, said two side of said two is filled with a photosensitive element, said flexible region between said two, and said molding channel is filled between said two molding channel is formed, the width of the bottom end of the second diversion trench is c, wherein a is more than or equal to 0.2mm and less than or equal to 1mm, and c is more than or equal to 0.2mm and less than or equal to 1.5a.

According to a further aspect of the present invention there is provided a forming die for making a photosensitive assembly panel for use in a camera module, comprising a first die and a second die adapted to be separated and brought into close contact, wherein said first and second dies when brought into close contact form a forming cavity, and said forming die is provided with a light window forming portion in said forming cavity and a base panel forming channel around said light window forming portion and is adapted to hold a circuit board panel in said forming cavity, wherein the circuit board panel comprises a plurality of rows of circuit boards, each row of circuit boards comprising one or more circuit boards arranged side by side, each circuit board comprising a combined rigid region and flexible region, and each circuit board being operatively connected to a photosensitive element, wherein the base panel forming guide groove is adapted to be filled with a molding material to form a one-piece molded base at a position corresponding to the base panel forming guide groove, wherein the one-piece molded base is integrally molded to two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements to form the photosensitive element panel and to form an optical window providing an optical path for each of the photosensitive elements at a position corresponding to the optical window forming portion, wherein the two adjacent rows of the circuit boards are arranged with flexible regions thereof being distant from each other and with rigid regions thereof being adjacent to each other, wherein the base panel forming guide groove has two first guide grooves corresponding to both end sides of the one-piece molded base adjacent to the flexible regions and a second guide groove corresponding to a region between the two adjacent rows of the photosensitive elements, and a filling groove which extends between the two first diversion grooves and the second diversion grooves and is used for filling the molding material between two adjacent photosensitive elements of each row of the photosensitive elements and is positioned between two adjacent light window forming parts, wherein the width of the bottom end of the first diversion groove is a, the width of the bottom end of the second diversion groove is c, wherein a is more than or equal to 0.2mm and less than or equal to 1mm, and c is more than or equal to 0.2mm and less than or equal to 1.5a.

According to another aspect of the present invention, the present invention further provides a method for manufacturing a photosensitive assembly of an image capturing module, including the steps of:

(1) Fixing a circuit board jointed board to a second die of a forming die, wherein the circuit board jointed board comprises one or more rows of circuit boards, each row of circuit boards comprises one or more circuit boards arranged side by side, each circuit board comprises a rigid area and a flexible area which are combined, and each circuit board is operably connected with a photosensitive element;

(2) Closing the second mold and the first mold, and filling molten molding material into a base jointed board molding guide groove in the molding mold, wherein the position corresponding to the light window molding part is prevented from being filled with the molding material;

(3) Solidifying the molding material in the base panel molding guide groove to form a one-piece molding base at a position corresponding to the base panel molding guide groove, wherein the one-piece molding base is integrally molded to each corresponding row of the circuit board and each row of the photosensitive elements to form a photosensitive assembly panel and to form an optical window providing a light path for each of the photosensitive elements at a position corresponding to the optical window molding portion, wherein the base panel molding guide groove has a first guide groove corresponding to a first end side of the one-piece molding base adjacent to the flexible region and a second guide groove corresponding to the one-piece molding base remote from the flexible region, and a filling groove extending between the first guide groove and the second guide groove for filling the molding material between two adjacent ones of the photosensitive elements in each row, wherein a width of a bottom end of the first guide groove is a, a bottom end of the second guide groove is d, wherein 0.2 a is greater than 1.5 mm, and a is greater than or equal to 1mm, and a flow-embedding part is provided on the one-piece molding base is located on the base side remote from the flexible region.

(α) a second mold for securing a circuit board panel to a forming mold, wherein said circuit board panel comprises a plurality of rows of circuit boards, each row of circuit boards comprising one or more circuit boards arranged side-by-side, each of said circuit boards comprising a rigid region and a flexible region in combination, and each of said circuit boards being operatively connected to a photosensitive element;

(β) closing the second mold and the first mold, filling molten molding material into a base panel molding channel in the molding mold, wherein a position corresponding to the light window molding is prevented from filling the molding material; and

and (gamma) solidifying the molding material in the base panel molding guide groove to form a one-piece molding base at a position corresponding to the base panel molding guide groove, wherein the one-piece molding base is integrally molded to two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements to form a photosensitive assembly panel and to form light windows for providing light paths for the respective photosensitive elements at positions corresponding to the light window molding portions, wherein the two adjacent rows of the circuit boards are arranged with their flexible regions apart from each other and with their rigid regions adjacent to each other, wherein the base panel molding guide groove has two first guide grooves corresponding to both end sides of the one-piece molding base adjacent to the flexible regions and a second guide groove corresponding to a region between the two adjacent rows of the photosensitive elements, and a light window for filling the molding material between the two adjacent photosensitive elements of each row of the photosensitive elements and located between the two adjacent light window molding portions, wherein the width of the first guide groove and the second guide groove is 1mm is set at a bottom end of the two guide grooves, and the width of the second guide groove is 1mm, and the width of the first guide groove is set to be 1mm, and the width of the second guide groove is set to be 1 mm.

According to another aspect of the present invention, an electronic device is provided, which includes one or more of the above-mentioned camera modules. Such electronic devices include, but are not limited to, cell phones, computers, televisions, smart wearable devices, vehicles, cameras, and monitoring equipment.

Drawings

Fig. 1A is a schematic structural diagram of a molding die of a photosensitive assembly obtained by encapsulation in the conventional integral encapsulation process.

Fig. 1B is a schematic diagram of a molding process of forming an integral package assembly by a conventional integral packaging process.

Fig. 1C is an enlarged schematic view illustrating forward flow of the encapsulation material along two flow channels in the conventional integral encapsulation process.

Fig. 1D is an enlarged schematic view illustrating a partial underfill encapsulation material in a conventional integral encapsulation process.

Fig. 1E is an enlarged schematic view of a conventional integral packaging process, which causes friction between leads to damage.

FIG. 1F is a schematic diagram showing the viscosity change of the molding material during the curing time.

Fig. 2 is a block diagram schematically showing an apparatus for manufacturing a photosensitive-component panel of an image-pickup module according to a first preferred embodiment of the present invention.

Fig. 3A is a schematic structural view of a molding die of an apparatus for manufacturing a photosensitive assembly panel of an image capturing module according to the first preferred embodiment of the present invention.

Fig. 3B is an enlarged schematic view of a partial area a of a first mold of a molding mold of an apparatus for manufacturing a photosensitive assembly panel of an image pickup module according to the first preferred embodiment of the present invention.

Fig. 4 is a schematic structural view of a photosensitive assembly panel of the camera module according to the first preferred embodiment of the present invention.

Fig. 5A is an enlarged schematic view of the photosensitive assembly of the camera module according to the first preferred embodiment of the present invention.

Fig. 5B is an enlarged schematic view of the photosensitive assembly of the camera module according to the first preferred embodiment of the present invention.

Fig. 6A is a sectional view of the photosensitive member of the image pickup module according to the above-described first preferred embodiment of the present invention taken along the line C-C in fig. 5A.

Fig. 6B is a sectional view of the photosensitive member of the image pickup module according to the above-described first preferred embodiment of the present invention after the second end side is further cut.

Fig. 7A is a cross-sectional view illustrating a process of pushing a melted molding material into a base panel molding guide groove in the molding mold of the photosensitive-component panel according to the above-described first preferred embodiment of the present invention, wherein the cross-sectional view is a cross-sectional view corresponding to the line A-A shown in fig. 4.

Fig. 7B is a partially enlarged schematic view at B in fig. 7A.

Fig. 8 is a cross-sectional view illustrating a case where a molding guide groove of a base panel is filled with a melted molding material in the molding mold of the photosensitive-component panel according to the above-described first preferred embodiment of the present invention, wherein the cross-sectional view is a cross-sectional view corresponding to the line A-A shown in fig. 4.

FIG. 9 is a cross-sectional view showing a state where a molten molding material is filled in a molding guide groove of a base panel in the molding mold of the light-sensitive component panel according to the above-mentioned first preferred embodiment of the present invention, wherein the cross-sectional view is a cross-sectional view corresponding to the line B-B shown in FIG. 4

Fig. 10 is a cross-sectional view corresponding to the line A-A of fig. 4, illustrating a step of demolding in the molding die of the photosensitive-component panel according to the above-described first preferred embodiment of the present invention, to form a one-piece molded base.

Fig. 11 is a schematic perspective view of an image capturing module according to the first preferred embodiment of the present invention.

Fig. 12 is a schematic exploded view of an image pickup module according to the first preferred embodiment of the present invention.

Fig. 13A illustrates a cross-sectional view of the camera module according to the above first preferred embodiment of the present invention taken along the line D-D in fig. 12.

Fig. 13B illustrates a cross-sectional view of the camera module according to the first preferred embodiment of the present invention taken along line E-E in fig. 12.

Fig. 14 is a cross-sectional view showing a modified embodiment of the image pickup module according to the above-described first preferred embodiment of the present invention.

Fig. 15 illustrates a cross-sectional view of an image pickup module according to another modified embodiment of the image pickup module according to the above-described first preferred embodiment of the present invention.

Fig. 16 is a cross-sectional view of an image pickup module according to another modified embodiment of the image pickup module according to the above-described first preferred embodiment of the present invention.

Fig. 17A is a schematic structural view of a molding die of an apparatus for manufacturing a photosensitive-element panel of an image pickup module according to a second preferred embodiment of the present invention.

Fig. 17B is an enlarged view of a part C of a first mold of a molding die of an apparatus for manufacturing a photosensitive assembly panel of an image pickup module according to the second preferred embodiment of the present invention.

Fig. 18 is a schematic view showing a construction of a photosensitive assembly panel of the camera module according to the second preferred embodiment of the present invention.

Fig. 19A is an enlarged view of a photosensitive assembly panel D of an image capturing module according to the second preferred embodiment of the present invention.

Fig. 19B is an enlarged schematic view illustrating the structure of two adjacent photosensitive members of the photosensitive member tiles of the camera module according to the second preferred embodiment of the present invention.

Fig. 20A is a cross-sectional view of a photosensitive assembly panel of an image capturing module according to the second preferred embodiment of the present invention, taken along line H-H of fig. 19A.

Fig. 20B is a schematic structural view of a photosensitive assembly panel of the camera module according to the second preferred embodiment of the present invention cut to obtain two photosensitive assemblies.

Fig. 21A is a cross-sectional view illustrating a process of pushing a melted molding material into a base panel molding guide groove in the molding mold of the photosensitive-component panel according to the second preferred embodiment of the present invention, wherein the cross-sectional view is a cross-sectional view corresponding to the direction of the line F-F illustrated in fig. 18.

Fig. 21B is a partially enlarged schematic view at E in fig. 21A.

Fig. 22 is a cross-sectional view illustrating a case where a molding guide groove of a base panel is filled with a melted molding material in the molding mold of the photosensitive-component panel according to the above-described second preferred embodiment of the present invention, wherein the cross-sectional view is a cross-sectional view corresponding to the direction of the line F-F illustrated in fig. 18.

Fig. 23 is a cross-sectional view illustrating a case where a molding guide groove of a base panel is filled with a melted molding material in the molding mold of the photosensitive-component panel according to the above-described second preferred embodiment of the present invention, wherein the cross-sectional view is a cross-sectional view corresponding to the G-G line direction illustrated in fig. 18.

Fig. 24 is a cross-sectional view corresponding to the line F-F of fig. 18, showing a step of demolding in the molding die of the photosensitive-component panel according to the second preferred embodiment of the present invention.

Fig. 25A to 25C are schematic views showing a sectional view of a photosensitive member panel and an enlarged structure of the photosensitive member cut out according to a modified embodiment of the above-described first and second preferred embodiments of the present invention, respectively.

FIG. 26A is a schematic view showing a construction of a panel of photosensitive elements according to another variation of the above-described second preferred embodiment of the present invention.

Fig. 26B is an enlarged schematic view illustrating a photosensitive assembly according to another variation of the above-described second preferred embodiment of the present invention.

Fig. 27 is a sectional view taken along line I-I in fig. 26B illustrating a photosensitive assembly according to another variation of the above-described second preferred embodiment of the present invention.

Fig. 28A is a schematic structural view of a molding die of an apparatus for manufacturing a photosensitive-element panel of an image capturing module according to the third preferred embodiment of the present invention.

Fig. 28B is an enlarged schematic view of a part F of a first mold of a molding mold of an apparatus for manufacturing a photosensitive assembly panel of an image pickup module according to the third preferred embodiment of the present invention.

Fig. 29 is a schematic view showing a construction of a photosensitive assembly panel of an image capturing module according to the third preferred embodiment of the present invention.

Fig. 30 is a cross-sectional view of a photosensitive assembly panel of the camera module according to the third preferred embodiment of the present invention taken along the line J-J in fig. 29.

Fig. 31 is an enlarged sectional view of the photosensitive assembly of the camera module according to the third preferred embodiment of the present invention, from which the embedded slow-flow member is removed.

Fig. 32 is a cross-sectional view of the molding die of the photosensitive-component panel according to the third preferred embodiment of the present invention, in which the melted molding material is filled in the molding guide groove of the base panel, wherein the cross-sectional view is a cross-sectional view corresponding to the direction of the line J-J in fig. 29.

Fig. 33A is a schematic structural view of a molding die of an apparatus for manufacturing a photosensitive-element panel of an image capturing module according to the fourth preferred embodiment of the present invention.

Fig. 33B is a schematic view of a partial G enlarged structure of a first mold of a molding mold of an apparatus for manufacturing a photosensitive assembly panel of an image pickup module according to the fourth preferred embodiment of the present invention.

Fig. 34 is a schematic view showing a construction of a photosensitive assembly panel of the camera module according to the fourth preferred embodiment of the present invention.

Fig. 35 is a cross-sectional view of a photosensitive assembly panel of the camera module according to the fourth preferred embodiment of the present invention taken along line K-K in fig. 34.

Fig. 36 is an enlarged sectional view of the photosensitive assembly of the camera module according to the fourth preferred embodiment of the present invention, with the embedded slow flow member removed.

Fig. 37 is a cross-sectional view showing a case where a molding guide groove of a base panel is filled with a melted molding material in the molding mold of the photosensitive-component panel according to the fourth preferred embodiment of the present invention, wherein the cross-sectional view is a cross-sectional view along a line K-K in fig. 34.

Fig. 38 is a schematic structural diagram of the camera module according to the present invention applied to an intelligent electronic device.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

Fig. 2 to 14 show an image capturing module 100 and a photosensitive assembly 10 according to a first preferred embodiment of the present invention and a method of manufacturing the same. The camera module 100 may be applied to various electronic devices 300, and the electronic device 300 includes a device main body 301 and one or more camera modules 100 mounted on the device main body 301, as shown in fig. 38, the electronic device 30 is, for example, but not limited to, a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, and the like, and the camera module cooperates with the electronic device to implement image acquisition and reproduction of a target object.

More specifically, a photosensitive assembly 10 of the camera module 100 and a manufacturing apparatus 200 thereof are illustrated. The photosensitive assembly 10 includes a circuit board 11, a molding base 12 and a photosensitive element 13, wherein the molding base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms a light window 122 providing a light path for the photosensitive element 13. Wherein the molded base 12 of the present invention is integrally molded to the circuit board 11 and the photosensitive element 13 by the manufacturing apparatus 200 through a molding process, more specifically, a transfer molding process, so that the molded base 12 can replace a lens holder or a bracket of a conventional camera module and it is not necessary to attach the lens holder or bracket to the circuit board 11 by glue like in a conventional packaging process.

Still further, referring to fig. 2-4 and 7A to 10, the present invention manufactures a photosensitive-component tile 1000 by the manufacturing apparatus 200, i.e., manufactures the photosensitive-component tile 1000 having a plurality of photosensitive components 10 by a tile process. The photosensitive assembly tile 1000 includes a circuit board tile 1100 and one or more integrally molded bases 1200. The circuit board panel 1100 includes a plurality of columns of circuit boards, such as 4 columns of circuit boards as shown in fig. 4, each column of circuit boards including a plurality of circuit boards 11, such as 2-12 of the circuit boards 11, such as 6 of the circuit boards 11 as shown in the figure, each of the circuit boards 11 being operatively connected to a photosensitive element 13. Each of the integrally molded bases 1200 is formed on one row of the circuit boards and integrally molded to at least a portion of the non-photosensitive area 132 of each of the photosensitive elements 13 of one row of the photosensitive elements 13 and exposes the photosensitive area 131 of the photosensitive element 13. Each of the integrally molded bases 1200 has a plurality of light windows 122, and each of the light windows 122 is positioned corresponding to each of the photosensitive elements 13 for providing a light path for the corresponding photosensitive element 13.

The apparatus 200 for manufacturing the photosensitive assembly tile 1000 of the camera module 100 includes a molding die 210, a molding material feeding mechanism 220, a die fixing device 230, a temperature control device 250 and a controller 260, wherein the molding material feeding mechanism 220 is used for providing a molding material 14 to a base tile molding guide slot 215. The mold fixture 230 is used to control the opening and closing of the molding mold 210, the temperature control device 250 is used to heat the thermosetting molding material 14, the controller 260 is used to automatically control the molding material feeding mechanism 220, the mold fixture 230, and the operation of the temperature control device 250 during the molding process.

The molding die 210 includes a first die 211 and a second die 212 that can be opened and closed by the die fixing device 230, that is, the die fixing device 230 can separate and close the first die 211 and the second die 212 to form a molding cavity 213, and when closed, the circuit board panel 1100 is fixed in the molding cavity 213, and the fluid molding material 14 enters the molding cavity 213, so as to be integrally formed on each row of the circuit board 11 and each corresponding row of the photosensitive elements 13, and after being cured, form the integral molding base 1200 on each row of the circuit board 11 and each row of the photosensitive elements 13.

More specifically, the molding module 210 further has one or more base panel molding channels 215 and includes a plurality of light window molding portions 214 located within the base panel molding channels 215. When the first and second molds 211 and 212 are clamped, the optical window molding portion 214 and the base panel molding guide 215 extend into the molding cavity 213, and the fluid molding material 14 is filled into the base panel molding guide 215, but the fluid molding material 14 cannot be filled at a position corresponding to the optical window molding portion 214, so that the fluid molding material 14 is cured at a position corresponding to the base panel molding guide 215 to form the one-piece molded base 1200 including the annular molding body 121 of the molded base 12 corresponding to each of the photosensitive members 10, and the optical window 122 of the molded base 12 is formed at a position corresponding to the optical window molding portion 214. The molding material 14 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer ), PP (Polypropylene), epoxy, etc.

The first and second molds 211 and 212 may be capable of producing relative movement of two molds, such as one of the two molds being fixed and the other being movable; or both dies may be movable, as the invention is not limited in this respect. In the example of this embodiment of the invention, the first mold 211 is embodied as a fixed upper mold, and the second mold 212 is embodied as a movable lower mold. The fixed upper die and the movable lower die are coaxially disposed, and as the movable lower die is slidable upward along a plurality of positioning shafts, the forming cavity 213 can be formed to be tightly closed when the fixed upper die is clamped.

The second mold 212, i.e., the lower mold, may have a circuit board positioning groove 2121, which may be formed in a groove shape or by a positioning column, for mounting and fixing the circuit board 11, and the light window molding 214 and the base panel molding guide 215 may be formed at the first mold 211, i.e., the upper mold, so that the molding cavity 213 is formed when the first and second molds 211 and 212 are clamped. And the molding material 14 in a fluid form is injected into the base board molding guide groove 215 of the top side of the circuit board 1100, thereby forming the one-piece molded base 1200 at the top side of each column of the circuit board 11 and each column of the photosensitive elements 13.

It will be appreciated that the board positioning groove 2121 may also be provided on the first mold 211, i.e., the upper mold, for mounting and fixing the board panel 1100, and the light window forming portion 214 and the base panel forming guide groove 215 may be formed on the second mold 211, so that the forming cavity 213 is formed when the first and second molds 211 and 212 are clamped. The circuit board panel 1100 may be disposed in the upper mold with the front side facing and the molding material 14 in fluid form injected into the base panel forming guide slot 215 of the bottom side of the inverted circuit board panel 1100, thereby forming the one-piece molded base 1200 on the bottom side of the inverted circuit board panel 1100.

More specifically, when the first and second molds 211 and 212 are clamped and the molding step is performed, the optical window molding portion 214 is overlapped and closely adhered to the top surface of the photosensitive element 13, so that the molding material 14 in a fluid state is prevented from entering the photosensitive region 1311 of the top surface 131 of the photosensitive element 13 on the circuit board 11, thereby enabling the optical window 122 of the integrated molding base 1200 to be finally formed at a position corresponding to the optical window molding portion 214. It will be appreciated that the light window molding 214 may be a solid structure or a structure having a groove shape inside as shown in the drawings.

It will be appreciated that the molding surface of the first mold 211 forming the base plate molding guide 215 may be configured to be flat and in the same plane, so that when the molded base 12 is cured, the top surface of the molded base 12 is flat, thereby providing a flat mounting condition for optical components such as drivers, lenses, and fixed barrels above the photosensitive assembly 10 of the camera module 100, and reducing tilt errors of the assembled camera module 100.

It should be noted that the base panel forming guide slot 215 and the light window forming portion 214 may be integrally formed on the first mold 211. The first mold 211 may further include a detachable molding structure, where the base panel molding guide slot 215 and the light window molding portion 214 are formed. Thus, the base panel forming guide groove 215 and the light window forming portion 214 of different shapes and sizes can be designed according to the shape and size requirements of the photosensitive member 10 such as the diameter and thickness of the molded base, etc. In this way, the manufacturing apparatus can be adapted to the photosensitive assembly 10 having different specifications by only replacing a different molding structure. It will be appreciated that the second mold 212 may correspondingly also include removable fixing blocks to provide the recess 2121 of a different shape and size to facilitate replacement of the circuit board 11 adapted to a different shape and size.

It will be appreciated that the molding material 14 is a thermoset material and that the molding material 14 is rendered fluid by heating to melt the thermoset material in a solid state. During the molding process, the thermosetting molding material 14 is cured by a further heating process and is no longer melted after curing, thereby forming the one-piece molded base 1200.

It will be appreciated that in the molding process of the present invention, the molding material 14 may be in the form of a block, pellet, or powder, which is heated to become fluid within the mold 210 and then cured to form the one-piece molded base 1200.

More specifically, each of the base panel forming guide grooves 215 of the present invention has a first guide groove 2151 and a second guide groove 2152 that are substantially parallel, and a plurality of filling grooves 2153 that extend between the first guide groove 2151 and the second guide groove 2152, wherein the filling grooves 2153 are formed between two adjacent light window forming portions 214, as schematically shown, the base panel forming guide groove 215 has 7 of the filling grooves 2153,6 and the light window forming portions 214 are located between two adjacent filling grooves 2153. The molding material 14 flows along the first and second guide grooves 2151 and 2152 from the feed end 215A toward the end 215B thereof, and when the size and ratio of the first and second guide grooves 2151 and 2152 are within a predetermined range, the molding material 14 can fill each of the filling grooves 2153, thereby forming the integrated mold base 1200 after the molding material 14 is cured.

Referring to fig. 7A to 10, which are schematic views illustrating a process of manufacturing the photosensitive assembly tile 1000 of the camera module 100 according to the preferred embodiment of the present invention, as shown in fig. 7A, the molding mold 210 is in a closed state, the circuit board tile 1100 to be molded and the molding material 14 in a solid state are ready to be put in place, the molding material 14 in a solid state is heated so as to be fed into the base tile molding guide groove 215 while melting the molding material 14 into a fluid state or a semi-solid semi-fluid state, and the filling grooves 2153 between two adjacent light window molding portions 214 are filled along the first guide grooves 2151 and the second guide grooves 2152.

As shown in fig. 8 and 9, when the molding material 14 in fluid form is filled in the base plate molding guide slot 215, the molding material 14 in fluid form is cured and molded into the integral molding base 1200 integrally formed on each row of the circuit board 11 and each row of the photosensitive elements 13 through the curing process.

As shown in fig. 10, after the molding material 14 is solidified to form the one-piece molded base 1200, the demolding process of the present invention, that is, the mold fixing device 230 moves the first and second molds 211 and 212 away from each other, so that the light window forming portion 214 is separated from the one-piece molded base 1200, and the light windows 122 corresponding to the respective photosensitive elements 13 are formed in the one-piece molded base 1200.

As shown in fig. 4-6, the resulting photosensitive-component puzzle 1000 can be further cut to produce individual photosensitive components 10. Each photosensitive assembly 10 includes at least one circuit board 11, at least one photosensitive element 13, and the molded base 12 integrally molded with the circuit board 11 and the photosensitive element 13. Each of the circuit boards 11 includes a rigid region 111 and a flexible region 112 that are combined, that is, each of the circuit boards 11 may be implemented as a rigid-flex board in this embodiment of the present invention. Wherein the molding base 12 integrally molds the rigid region 111 of the circuit board 11 and at least a portion of the non-photosensitive region 132 of the photosensitive element 13, and forms the light window 122 providing a light path for the photosensitive region 131 of the photosensitive element 13.

It should be noted that the manufacturing method of the photosensitive-element board 1000 of the present invention is suitable for manufacturing the photosensitive element 10 with a small size. In the molding process, the width of the bottom end of the first diversion trench 2151 is a, and the width of the bottom end of the second diversion trench 2152 is c. The width a corresponds to the width of the bottom end of the first diversion trench 2151 adjacent to the position where the rigid region 111 and the flexible region 112 of the circuit board 11 are combined, and the width c corresponds to the width of the bottom end of the second diversion trench 2152 away from the other side of the flexible region 112. The widths a and c are such that 0.2 mm.ltoreq.a.ltoreq.1 mm and 0.2 mm.ltoreq.c.ltoreq.1.5 a, the molding material 14 in the fluid state is able to flow forward along the first and second guide grooves 2151 and 2152 and fill the entire base panel forming guide groove 215 with the molding material 14 before the molding material 14 is cured. It is worth mentioning that more preferably 0.7a.ltoreq.c.ltoreq.1.3 a, e.g. in some embodiments c=0.8a or c=1a or c=1.2a.

Accordingly, the molding process of the present invention results in the photosensitive-component tile 1000 comprising: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, and one or more of the integrally molded bases 1200. Each column of the circuit boards 11 comprises one or more of the circuit boards 11 arranged side by side, each of the circuit boards 11 comprising the rigid region 111 and the flexible region 112 combined. Each of the integrally molded bases 1200 is integrally formed with one row of the circuit boards 11 and one row of the photosensitive elements 13 and forms the light windows 122 that provide light paths for each of the photosensitive elements 13. Wherein a distance between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 1200A of the integrally molded base 1200 adjacent a first end side of the flexible region 112 is a; corresponding to the portion 1200B of the integrally molded base 1200 remote from the opposite second end side of the flexible region 112, the distance between its outer edge 1203 and its inner edge 1204 is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a. Wherein the first end side of the integrally molded base 1200 corresponds to the combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., the proximal end side adjacent to the flexible region 112; the second end side of the integrally molded base 1200 corresponds to a distal side of the circuit board 11 remote from the flexible region 112.

After cutting of the photosensitive assembly tile 1000, a single one of the photosensitive assemblies 10 can be obtained, wherein in the cutting step, the molded base 12 can be obtained by cutting at both sides of the one-piece molded base 1200 except for the first end side and the second end side, while the corresponding portion 1200B of the molded base at the second end side is not cut, thus obtaining the photosensitive assembly 10 having the portion 1200C of the one-piece molded base at a pair of opposite sides.

As shown in fig. 6A, accordingly, the photosensitive assembly 10 includes the circuit board 11, the photosensitive element 13, and the molded base 12. Wherein said circuit board 11 comprises said rigid region 111 and said flexible region 112 in combination. The molding base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the light window 122 that provides a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connection lines 15. A distance a between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 12A of the molded base 12 adjacent a first end side of the flexible region 112; corresponding to the portion 12B of the molded base 12 remote from the opposite second end side of the flexible region 112, the distance between its outer edge 1203 and its inner edge 1204 is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

Accordingly, as shown in FIG. 6B, in order to further reduce the size of the photosensitive assembly 10, at least a portion of the photosensitive assembly 10 of the molding base 12 remote from the opposite second end side of the flexible region 112 is adapted to be removed, such as cut with a knife, or ground away, such that the distance between the outer edge 1205 of the remaining portion of the molding base 12 after cutting and the inner edge 1204 thereof is B, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm. Wherein b is reduced by 0.2mm relative to c, which corresponds to the minimum accuracy of the cutting tool, i.e. the cutting dimension of the cutting tool limit, enables the molded base 12 to be cut into portions of approximately 0.2mm width.

A.ltoreq.1 mm is selected based on the consideration of the small size of the photosensitive member 10. And, according to practical manufacturing experience, when the widths a and c are relatively large, such as greater than 1mm, the flow rates and flows in the two channels 2151 and 2152 are sufficient to fill the entire base panel forming channel 215 before the molding material 14 cures.

It has been found in practice that when a <0.2mm or c <0.2mm, the flow rate and the flow rate of the molding material 14 in the corresponding first and second channels 2151, 2152 are relatively small because of the relatively small dimensions of the widths a and c, thereby resulting in the inability to fill the base panel forming channel 215 with the molding material 14 during the curing time of the molding material.

When c > 1.5a, i.e. when c is greater than 1.5 times a, for example, when c=1.6a, in actual production, the base panel forming guide slot 215 may be partially not filled, and defective products may be generated. Thus, in this embodiment of the invention, 0.2 mm.ltoreq.a.ltoreq.1 mm and 0.2 mm.ltoreq.c.ltoreq.1.5 a. The width a and the width c are in a range such that the molding material 14 can fill the base plate molding guide 215 during the molding process, thereby avoiding defective photosensitive elements.

In this embodiment of the present invention, when 0.2mm < 1mm and 0.2mm < C < 1.5a, the molding material 14 can form the one-piece molded base 1200 on the circuit board panel 1100 in a molding process, and the one-piece molded base 1200 can form the light windows 122 with four closed sides at positions corresponding to each of the photosensitive elements 13, so that after the formed one-piece molded base 1200 is cut, a molded base 12 having the light windows 122 is formed on each circuit board 11 and the corresponding photosensitive element 13, preventing a partial formation of the molded base like an opening in fig. 1C from communicating the light windows 122 to the outside of the molded base 12.

That is, the molding material 14 of the present invention is able to flow forward from the feed ends 215A of the two guide grooves 2151 and 2152 and fill the guide grooves 2151 and 2152 and the filling groove 2153 throughout the base panel forming guide groove 215. The molding material 14 is capable of flowing along the two channels 2151 and 2152 from its feed end 215A to its end 215B prior to curing. And before the viscosity of the molding material 14 reaches a high value and cures, the molding material 14 fills the base panel forming guide groove 215, thereby preventing the connection line 15 between the circuit board 11 and the photosensitive element 13 from being damaged by the molding material 14 having a high viscosity flowing forward. And the flow in both channels 2151 and 2152 is substantially in the same radial direction, the two flows converging substantially in the fill channel 2153, preventing the molding material 14 in one channel from flowing to the other channel and impeding the forward flow of the molding material 14 in the other channel. And turbulence are not generated, resulting in deformation and damage caused by irregular oscillation of the connection line 15 connecting the circuit board 11 and the photosensitive element 13.

Accordingly, the molding material 14 of the present invention can also be selected to have a relatively high viscosity range, thereby avoiding flash formation by the molding material 14 easily entering the photosensitive region 131 of the photosensitive element 13 during the molding process when selecting a material having a relatively low viscosity range.

In addition, as shown in fig. 7B, for facilitating demolding and bonding of the rigid region 111 of the circuit board 11, the first mold 211 further includes a plurality of bonding blocks 216, and the outer edge 1201 of the molding base 12 and the outer edge of the rigid region 111 of the circuit board 11 form a bonding edge 1111 having a width W, that is, in the molding process, an area suitable for the bonding blocks 216 to be bonded to the rigid region 111 of the circuit board 11, for example, the bonding distance W may be 0.1-1 mm, such as in a specific example, the bonding distance W may be 0.2mm. The press blocks 216 are further press-fitted over the flexible regions 112 of each row of the circuit board 11, preventing the molding material 14 from flowing toward the flexible regions 112. In addition, the rigid areas 111 of each row of the circuit board 11 are integrally formed to form an integral rigid area panel 110, thereby facilitating the press fit of the first mold to each row of the circuit board 11.

Accordingly, the present invention provides a method for manufacturing the photosensitive assembly 12 of the camera module 100, which includes the following steps:

fixing the circuit board panel 1100 to the second mold 212 of the molding mold 210, wherein the circuit board panel 1100 comprises one or more columns of circuit boards, each column of circuit boards comprising one or more circuit boards 11 arranged side by side, each circuit board 11 comprising a rigid region 111 and a flexible region 112 in combination, and each circuit board 111 operatively connected to the photosensitive element 13;

clamping the second mold 212 and the first mold 211 by the mold fixing device 213, and filling the melted molding material 14 into the base panel molding guide slot 215 in the molding mold 210, wherein the position corresponding to the light window molding 214 is prevented from being filled with the molding material 14;

the molding material 14 in the base panel molding guide 215 is subjected to a curing process to form the integrally molded base 1200 at a position corresponding to the base panel molding guide 215, wherein the integrally molded base 1200 is integrally molded to each row of the circuit board 11 and each row of the photosensitive elements 13 corresponding to each row of the circuit board 11 to form a photosensitive assembly panel 1000 and is formed to provide a light path for each of the photosensitive elements 13 at a position corresponding to the light window molding portion 214, wherein the base panel molding guide 215 has a first guide groove 2151 corresponding to a first end side of the integrally molded base 1200 adjacent to the flexible region 112 and a second guide groove 2152 corresponding to a second end side of the integrally molded base 1200 remote from the flexible region 112, and a filling groove 122 extending between the first guide groove 2151 and the second guide groove 2152 for filling the molding material 14 between two adjacent ones of the photosensitive elements 13 in each row of the photosensitive elements 13 and located between two adjacent ones of the light window molding portions 214, wherein a width of the first guide groove 2153 adjacent to the first end side of the integrally molded base 1200 is a width of the base 1200A corresponding to the bottom end side 215a of the flexible region 215 a; wherein width c corresponds to the distance between the outer edge 1203 of the portion 1200B of the one-piece molded base 1200 remote from the opposite second end side of the flexible region 112 and the inner edge 1204 thereof, wherein 0.2mm ∈a ∈1mm,0.2mm ∈c ∈1.5A, and preferably 0.7a ∈c ∈1.3a, such as c=0.8 a or c=1a or c=1.2a, whereby the width dimensions of the first and second channels 2151, 2152 enable the molding material 14 to fill the base panel molding channel 215 and the molding material 14 to reach the ends 215B of the first and second channels 2151, 2152, respectively, from the feed ends 215A of the first and second channels 2151, 2152;

The photosensitive assembly jig 1000 is cut to obtain a plurality of the photosensitive assemblies 10, wherein each of the photosensitive assemblies 10 includes the circuit board 11, the photosensitive element 13, and the molding base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the optical window 122 providing a light path for the photosensitive element 13.

And, the method may further comprise the steps of: the portion of the photosensitive member corresponding to the opposite second end side of the molding base 12 away from the flexible region 112, that is, a portion of the portion 12B of the molding base and a portion of the circuit board 11, is cut so that the molding base 12B has a cut surface 125 at the opposite second end side away from the flexible region 112, and a distance between an outer edge 1203 of the remaining portion of the molding base and an inner edge 1204 thereof is B, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

As shown in fig. 5A to 6B, the circuit board 11 includes a plurality of electronic components 113 formed on the rigid region 111 such as mounted by SMT process, the electronic components 113 including but not limited to resistors, capacitors, driving devices, etc. In this embodiment of the present invention, the molding base 12 is integrally coated on the electronic component 113, thereby preventing dust, foreign matters, and the like in the conventional camera module from adhering to the electronic component 113, and further contaminating the photosensitive element 13, thereby affecting the imaging effect. In addition, it is preferable that the plurality of electronic components 113 are provided on at least one wing side 11C on the rigid region 111 on both sides of the photosensitive element 11 except for a first end side 11A and a second end side 11B of the rigid region 111 of the circuit board 11 adjacent to the flexible region 112 and distant from the flexible region 112, wherein the molding base 12 integrally embeds the electronic components 113.

That is, as shown in fig. 8 and 9, without the electronic components 113 in the corresponding first and second guide grooves 2151 and 2152, the electronic components 113 may be intensively disposed in the filling groove 2153, so that no blocking occurs in the first and second guide grooves 2151 and 2152 during the molding process, and thus the molding material 14 is not affected to flow forward along the first and second guide grooves 2151 and 2152, so that the molding material 14 flows from the feed end 215A to the end 215B thereof in a shorter time as much as possible.

It will be appreciated that the connection lines 15 may be disposed on four sides of the photosensitive element 13 or may be disposed centrally on both wing sides 11C of the rigid region 111 of the circuit board 11, so as to be also centrally located in the filling groove 2153 during the molding process, so as not to affect the forward flow of the molding material 14 along the first and second guide grooves 2151 and 2152.

Fig. 11 to 14 show the photographic module 100 manufactured by applying the photosensitive assembly 10 of the present invention. The camera module comprises a photosensitive component 10, a lens 20 and a filtering component 30. The photosensitive assembly 10 includes the circuit board 11, the molded base 12, and the photosensitive element 13. The lens 20 includes a structural member 21 and one or more lenses 22 received within the structural member 21. The optical filter assembly 30 includes an optical filter element holder 31 and an optical filter element 32, the optical filter element holder 31 is assembled on the top side of the molding base 12, and the lens 20 is directly assembled on the top side of the optical filter element holder 31 to form a focusing camera module. Wherein in this embodiment, the top side of the molding base 12 is a plane, the optical filter element mount 31 is assembled on the planar top surface of the molding base 12, and the optical filter element 32 functions to filter the light passing through the lens 20, such as an optical filter that may be implemented to filter infrared light, and is located between the lens 20 and the photosensitive element 13. In this way, the light passing through the lens 30 can pass through the filter element 32 and reach the photosensitive element 13 via the optical window 122, so that the camera module 100 can provide an optical image after photoelectric conversion.

As shown in fig. 13A, in the photosensitive assembly 10 of the image pickup module 100, a distance between an outer edge 1201 thereof and an inner edge 1202 thereof is a corresponding to a portion 12A of the molded base 12 adjacent to a first end side of the flexible region 112; corresponding to the portion 12B of the molded base 12 remote from the opposite second end side of the flexible region 112, the distance between its outer edge 1203 and its inner edge 1204 is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a, enabling a small size of the photosensitive assembly 10, so that the size of the entire camera module 100 is also further reduced. It will be appreciated that the molding base 12 may be further cut away from the opposite second end side of the flexible region 112 such that the remainder of the molding base 12 after cutting has a cut surface 125 and the distance between its outer edge and its inner edge is b, where 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm, as shown in FIG. 14. In addition, as shown in fig. 13B, it can be seen that the electronic components 113 may be disposed centrally on at least one of the two wing sides of the photosensitive assembly 10, such as may be.

It will be appreciated that in other variant embodiments, the filter element mount 31 may be omitted, the filter element 32 may be assembled directly to the molded base 12, or the filter element 32 may be assembled to the lens 20, or the filter element 32 may be assembled to a carrier of the lens 20 such as a driver or a fixed barrel.

As shown in fig. 15, the camera module 100 may include a carrier 40, which is a driver or a fixed lens barrel, schematically shown as a driver, such as a voice coil motor, a piezoelectric motor, etc., to form a moving focus camera module, and the lens 20 is mounted on the driver. The molded base 12 has a recess 123 in its top side for mounting the filter mount 31 and the actuator can be mounted directly to the top side of the molded base 12. It will be appreciated that in other variant embodiments, the carrier 40 may also be mounted on the filter element mount 31, or partly on the filter element mount 31 and partly on the molded base 12.

As shown in fig. 16, in this embodiment of the present invention and in the drawings, the image capturing module 100 may include a carrier 40, which is a fixed barrel to which the lens 20 is mounted. The molded base 12 has a recess 123 in its top side for mounting the filter mount 31 and the fixed barrel is mounted to the molded base 12 on its top side.

Fig. 17A to 24 show the photosensitive assembly 10 of the camera module 100 and the manufacturing process thereof according to the second embodiment of the present invention. In this embodiment, a photosensitive-element tile 1000 is also formed by a tile operation, and then cut to obtain the photosensitive element 10. Wherein in the embodiment shown in fig. 2-16, the rigid regions 111 of one column of circuit boards are arranged adjacent to the flexible regions 112 of another column of circuit boards in a plurality of columns of circuit boards. In this embodiment, however, two adjacent columns of circuit boards may have the rigid regions 111 disposed adjacent to each other, with the corresponding flexible regions 112 spaced apart. More preferably, the rigid regions 111 of adjacent two columns of circuit boards are integrally formed such that the middle of the adjacent two columns of circuit boards forms an integral rigid region.

Accordingly, more specifically, the molding die 210 forms a molding cavity 213 when closed, and provides a plurality of optical window molding portions 214 and one or more base panel molding guide grooves 215, each of the base panel molding guide grooves 215 including a first guide groove 2151 aligned in a longitudinal direction substantially parallel at both ends, a second guide groove 2152 located in the middle of two of the first guide grooves 2151, and a plurality of filling grooves 2153 extending between two of the first guide grooves 2151 and the second guide groove 2152 in a lateral arrangement, wherein two columns of the filling grooves 2153 extend between two of the first guide grooves 2151 and the second guide grooves 2152, respectively.

For example, in this embodiment, the circuit board panel 1100 includes 4 columns of the circuit boards 11, and two columns of the circuit boards 11 are formed as a group, and the rigid areas 111 of the two columns of the circuit boards 11 of each group of the circuit boards 11 are located in the middle and integrally formed, such as 6 circuit boards of each column of the circuit boards 11, and the rigid areas 111 thereof are integrally formed. The forming die 210 has two base panel forming guide grooves 215, each base panel forming guide groove 215 has 7 filling grooves 2153 between each first guide groove 2151 and each second guide groove 2152, and each filling groove 2153 is between two adjacent light window forming 214. The molding material 14 flows along the two first guide grooves 2151 and the middle second guide groove 2152 from the feed end 215A thereof toward the end 215B thereof, and when the size and ratio of the first guide grooves 2151 and the second guide grooves 2152 are within a predetermined range, the molding material 14 can fill each of the filling grooves 2153, thereby forming the integrated molding base 1200 after the molding material 14 is cured.

In this embodiment of the present invention, the integrally molded base 1200 is integrally formed with two adjacent rows of the circuit boards 11 and two adjacent rows of the photosensitive elements 13 to form a photosensitive assembly panel 1000 and form the optical windows 122 for providing the light paths for the respective photosensitive elements 13 at positions corresponding to the optical window forming portions 214.

As shown in fig. 21A to 24, which are schematic views illustrating a manufacturing process of the photosensitive assembly tile 1000 of the camera module 100 according to the preferred embodiment of the present invention, as shown in fig. 21A, the molding mold 210 is in a closed state, the circuit board 11 to be molded and the molding material 14 in a solid state are ready to be put in place, the molding material 14 in a solid state is heated so as to be fed into the base tile molding guide groove 215 when the molding material 14 is melted into a fluid state or a semi-solid semi-fluid state, and the filling groove 2153 between two adjacent light window molding portions 214 is filled along the first guide groove 2151 and the second guide groove 2152. In addition, in order to make the molding surface of the first mold 211 closely adhere to the circuit board 11 and the photosensitive element 13 and facilitate demolding, an elastic film 219 is further disposed between the molding surface of the first mold 211 and the circuit board 11 and the photosensitive element 13.

As shown in fig. 22 and 23, when the two first guide grooves 2151, the second guide grooves 2152, and the filling grooves 2153 of the base jigsaw forming guide groove 215 are all filled with the fluid molding material 14, the fluid molding material 14 is cured and formed into the integrally molded base 1200 integrally formed with the two adjacent rows of the circuit boards 11 and the two rows of the photosensitive elements 13 through the curing process.

As shown in fig. 24, after the molding material 14 is solidified to form the integrated molding base 1200, the demolding process of the present invention is performed, that is, the mold fixing device 230 moves the first and second molds 211 and 212 away from each other, so that the optical window forming portion 214 is separated from the integrated molding base 1200, and two rows of the optical windows 122 corresponding to the respective photosensitive elements 13 are formed in the integrated molding base 1200.

As shown in fig. 20B, the resulting photosensitive-component tile 1000 can be further cut to produce individual photosensitive components 10. Each photosensitive assembly 10 includes at least one circuit board 11, at least one photosensitive element 13, and the molded base 12 integrally molded with the circuit board 11 and the photosensitive element 13. As shown in fig. 19A to 20B, the rigid regions 111 integrally formed between two adjacent columns of the circuit boards 11 are separated so that each of the circuit boards 11 includes the rigid regions 111 and the flexible regions 112 combined. The molding base 12 integrally molds the rigid region 111 of the circuit board 11 and at least a portion of the non-photosensitive region 132 of the photosensitive element 13, and forms the light window 122 providing a light path for the photosensitive region 131 of the photosensitive element 13.

It should be noted that, when each photosensitive element 10 of the single body obtained by cutting the photosensitive element board 1000 is used for manufacturing a live-focus camera module, that is, an auto-focus camera module, the molding die 210 is further provided with a plurality of driver lead groove molding blocks 218, each driver lead groove molding block 218 extends into the filling groove 2153 of the base board molding guide groove 215, so that the flow of the molding material 14 in the three guide grooves 2151, 2152 and 2153 is not affected, and during the molding process, the fluid molding material 14 does not fill the position corresponding to each driver lead groove molding block 218, so that after the curing step, a plurality of the optical windows 122 and a plurality of driver lead grooves 124 are formed in the integral molding base 1200 of the photosensitive element board 1000, and each molding base 12 of the photosensitive element 10 obtained by cutting is configured with the driver lead grooves 124, so that the live-focus camera module 100 is attached to the photosensitive element board 11 by soldering or the like by the driver lead pins 100 during the manufacturing process.

It should be noted that the manufacturing method of the photosensitive-element board 1000 of the present invention is suitable for manufacturing the photosensitive element 10 with a small size. In the molding process, the width of the bottom end of each first channel 2151 is a, and the width of the bottom end of each second channel 2152 is c. The width a corresponds to the width of the bottom end of the first diversion trench 2151 adjacent to the position where the rigid region 111 and the flexible region 112 of the circuit board 11 are combined, and the width c corresponds to the width of the bottom end of the second diversion trench 2152 away from the other side of the flexible region 112. The widths a and c are such that 0.2 mm.ltoreq.a.ltoreq.1 mm and 0.2 mm.ltoreq.c.ltoreq.1.5 a, the molding material 14 in the fluid state can flow forward along the outer two first guide grooves 2151 and the middle second guide groove 2152 and fill the entire base panel forming guide groove 215 with the molding material 14 before the molding material 14 is cured. It is worth mentioning that more preferably 0.7a.ltoreq.c.ltoreq.1.3 a, e.g. in some embodiments c=0.8a or c=1a or c=1.2a.

Accordingly, the molding process of the present invention results in the photosensitive-component tile 1000 comprising: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, and one or more of the integrally molded bases 1200. Each column of the circuit boards 11 comprises one or more of the circuit boards 11 arranged side by side, each of the circuit boards 11 comprising the rigid region 111 and the flexible region 112 combined. Each of the integrally molded bases 1200 is integrally formed with two rows of adjacent circuit boards 11 and two rows of adjacent photosensitive elements 13 and forms a light window 122 providing a light path for each of the photosensitive elements 13, and the two rows of adjacent circuit boards 11 are arranged with their flexible regions 112 distant from each other and their rigid regions 11 adjacent to each other, such that each of the integrally molded bases 1200 has two end sides adjacent to the flexible regions 112; wherein a distance between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 1200A of the integrally molded base 1200 adjacent each end side of the flexible region 112 is a; the integrally molded base 1200 extends to a portion 1200B between the two adjacent rows of the photosensitive elements 13, with a distance c between the two inner edges 1204, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a. Wherein each of the end sides of the integrally molded base 1200 corresponds to a combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., a proximal side adjacent to the flexible region 112; the integrally molded base 1200 extends between two adjacent rows of the photosensitive elements 13 corresponding to the distal end side of the circuit board 11 away from the flexible region 112.

After cutting of the photosensitive element tile 1000, a single photosensitive element 10 can be obtained, wherein in the cutting step, the molding base 12 can be obtained by cutting on the other side of the one-piece molding base 1200 except the end-side portion 1200A, wherein the portion 1200B of the molding base corresponding to the space between two adjacent columns of the photosensitive elements 13 is also cut.

Accordingly, as shown in fig. 20B, the photosensitive assembly 10, which includes the circuit board 11, the photosensitive element 13, and the molded base 12, is obtained after dicing. Wherein said circuit board 11 comprises said rigid region 111 and said flexible region 112 in combination. The molding base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the light window 122 that provides a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connection lines 15. After cutting the photosensitive element tiles 1000, each of the photosensitive elements 10 is made to have a first end side without cutting and a second end side with cutting, similar to the above-described embodiments. A distance a between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 12A of the molded base 12 adjacent a first end side of the flexible region 112; a portion 12B of the molded base corresponding to the second opposite end side of the molded base 12 from the flexible region 112 has a cut surface 125 and has an outer edge 1205 spaced from an inner edge 1204 thereof by a distance B of 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

A.ltoreq.1 mm is selected based on the consideration of the small size of the photosensitive member 10. And in practice it has been found that when a <0.2mm or c <0.2mm, because of the relatively small dimensions of widths a and c, the flow rates and flows of the molding material 14 in the corresponding two first and second channels 2151 and 2152 are relatively small, resulting in the inability to fill the base panel forming channel 215 with the molding material 14 during the curing time of the molding material. When c > 1.5a, i.e. when c is greater than 1.5 times a, the base panel forming guide slot 215 may not be partially filled in actual production, and defective products may be generated. Thus, in this embodiment of the invention, 0.2 mm.ltoreq.a.ltoreq.1 mm and 0.2 mm.ltoreq.c.ltoreq.1.5 a. The width a and the width c are in a range such that the molding material 14 can fill the base plate molding guide 215 during the molding process, thereby avoiding defective photosensitive elements.

That is, in this embodiment of the invention, the molding material 14 is able to flow forward from the feed ends 215A of the three channels 2151 and 2152 and fill the channels 2151 and 2152 and the fill channel 2153 throughout the base panel forming channel 215. The molding material 14 is capable of flowing along three of the channels 2151 and 2152 from its feed end 215A to its end 215B prior to curing. And before the viscosity of the molding material 14 reaches a high value and cures, the molding material 14 fills the base panel forming guide groove 215, thereby preventing the connection line 15 between the circuit board 11 and the photosensitive element 13 from being damaged by the molding material 14 having a high viscosity flowing forward. And the fluid in the three channels 2151 and 2152 flows substantially in the same radial direction, preventing the molding material 14 in one channel from flowing to the other channel and impeding the forward flow of the molding material 14 in the other channel. And turbulence are not generated, resulting in deformation and damage caused by irregular oscillation of the connection line 15 connecting the circuit board 11 and the photosensitive element 13.

As shown in fig. 21B, to facilitate demolding and bonding of the rigid region 111 of the circuit board 11, the first mold 211 further includes a plurality of bonding blocks 216, and the outer edge 1201 of the molding base 12 and the outer edge of the rigid region 111 of the circuit board 11 form a bonding edge 1111 having a width W, that is, in the molding process, two bonding blocks 216 are bonded to the regions on the rigid regions 111 of the two columns of the circuit board 11 respectively, for example, the bonding distance W may be 0.1 to 1mm, such as in a specific example, the bonding distance W may be 0.2mm. Two of the pressing blocks 216 are pressed over the respective sets of the flexible regions 112 of the adjacent two columns of the circuit boards 11, preventing the molding material 14 from flowing toward the flexible regions 112. In addition, the rigid areas 111 of two adjacent columns of the circuit boards 11 are integrally formed to form an integral rigid area board 110, and the two pressing blocks 216 are respectively pressed on two end sides of the integral rigid area board 110, so that the first mold 211 is convenient for pressing the two adjacent columns of the circuit boards 11.

Accordingly, this embodiment of the present invention provides a method of manufacturing the photosensitive member 12 of the image pickup module 100, comprising the steps of:

curing the molding material 14 within the base panel molding guide slot 215 to form a unitary molded base 1200 at a position corresponding to the base panel molding guide slot 215, wherein the unitary molded base 1200 is integrally molded to two adjacent rows of the circuit board 11 and two adjacent rows of the photosensitive elements 13 to form a photosensitive assembly panel 1000 and is formed into the optical window 122 providing a light path for each of the photosensitive elements 13 at a position corresponding to the optical window molding portion 214, wherein the two adjacent rows of the circuit board 12 are arranged with their flexible regions 112 away from each other and their rigid regions 11 adjacent to each other, wherein the base panel molding guide slot 215 has two first guide grooves 2151 corresponding to two end sides of the unitary molded base 1200 adjacent to the flexible regions 112 and a second guide groove 2152 corresponding to an area between the two adjacent rows of the photosensitive elements 13, and a filling width of the optical window 2152 between the two adjacent rows of the photosensitive elements 13 and the optical window molding material 2152 between the two adjacent rows of the photosensitive elements 13 and the respective end sides of the base 1200A, wherein the width of the molded base 1200A is equal to the width of the respective end sides 2151 a, 215 a is the width between the respective end sides of the molded base side edges 215 a; wherein c corresponds to a portion 1200B extending to the integrally molded base between the two adjacent columns of the photosensitive elements 13, a distance between two inner edges 1204 thereof, wherein 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a;

And, the method may further comprise the steps of: the portion of the photosensitive element 10 located between the adjacent two columns of the photosensitive elements 13 is cut to obtain a portion 12B of the molded base corresponding to the opposite end side of the molded base 12 from the flexible region 112, and the distance between the outer edge 1205 thereof and the inner edge 1204 thereof is made to be B, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a to 0.2mm. Namely, the rigid regions 111 of the molded base 12 and the circuit board 11 from the photosensitive element 10 between the adjacent two rows of the photosensitive elements 13 are adapted to be cut so that the distal end sides of the adjacent two rows of the photosensitive elements 10 away from the flexible region 112 are cut sides, respectively, and cut surfaces 125 are formed, respectively.

The circuit board 11 includes a plurality of electronic components 113 formed in the rigid region 111, such as mounted by SMT, and in the corresponding two first and second guide grooves 2151 and 2152, the electronic components 113 may be intensively disposed in the filling groove 2153 without the electronic components 113, so that during molding, the two first and second guide grooves 2151 and 2152 do not have any obstruction therein, and thus the molding material 14 is not influenced to flow forward along the two first and second guide grooves 2151 and 2152, thereby allowing the molding material 14 to flow from the feed end 215A to the end 215B thereof in a relatively short time as much as possible.

In the step of manufacturing the photosensitive assembly 10 of the single body: the photosensitive assembly plate 1000 can be cut to obtain a plurality of independent photosensitive assemblies 10 for manufacturing a single camera module. The two or more photosensitive assemblies 10 that are integrally connected may be cut and separated from the photosensitive assembly jointed board 1000, so as to be used for manufacturing split-type array camera modules, that is, each camera module of the array camera module has an independent photosensitive assembly 10, where the two or more photosensitive assemblies 10 may be respectively connected to a control motherboard of the same electronic device, so that the array camera modules manufactured by the two or more photosensitive assemblies 10 may transmit images captured by the plurality of camera modules to the control motherboard for image information processing.

As shown in fig. 25A, a photosensitive-component tile 1000 according to another variation of the first embodiment of the present invention, which includes the inventive molding process, yields the photosensitive-component tile 1000, which includes: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, one or more columns of the protective frames 16, and one or more of the integrally molded bases 1200. Each column of the circuit boards 11 comprises one or more of the circuit boards 11 arranged side by side, each of the circuit boards 11 comprising the rigid region 111 and the flexible region 112 combined. Each of the protective frames 16 is formed on the photosensitive element 13 and located at the non-photosensitive region 132 of the photosensitive element 13, that is, located outside the photosensitive region 131, and each of the integrally molded bases 1200 is integrally formed on one row of the circuit boards 11, one row of the photosensitive elements 13, and one row of the protective frames 16 and forms the optical window 122 providing a light path for each of the photosensitive elements 13.

That is, before the integral molded base 1200 is molded, the protective frame 16 is formed on each of the photosensitive elements 13 in advance, and may be formed of another material different from the molding material 14, such as glue applied to the non-photosensitive region 132 of the photosensitive element 13, or may be a rigid frame, and attached to the non-photosensitive region 132 of the photosensitive element 13 by glue. Thus, in the process of molding the integrally molded base 1200, the light window molding portion 214 is pressed against the protective frame 16 having a predetermined hardness, so that the fluid molding material 14 is prevented from flowing into the photosensitive area 131 of the photosensitive element 13 when the fluid molding material 14 enters the base panel molding guide groove 215, thereby forming a molding burr. For example, in one specific example, the protective frame 16 is formed of glue having predetermined elasticity and hardness, and may be further implemented to remain tacky after curing, thereby serving to adhere dust particles within the photosensitive assembly 10 of the fabricated camera module. More specifically, in some embodiments, the protective frame 16 has a shore hardness in the range of a50-a80 and an elastic modulus in the range of 0.1Gpa-1Gpa.

Similarly, a distance a between an outer edge 1201 and an inner edge 1202 thereof corresponds to a portion 1200A of the integrally molded base 1200 adjacent a first end side of the flexible region 112; corresponding to the portion 1200B of the integrally molded base 1200 remote from the opposite second end side of the flexible region 112, the distance between its outer edge 1203 and its inner edge 1204 is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a. Wherein the first end side of the integrally molded base 1200 corresponds to the combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., the proximal end side adjacent to the flexible region 112; the second end side of the integrally molded base 1200 corresponds to a distal side of the circuit board 11 remote from the flexible region 112.

After cutting of the photosensitive assembly tile 1000, a single photosensitive assembly 10 may be obtained, as shown in fig. 25C, wherein in the cutting step, the molded base 12 may be obtained by cutting at both sides of the one-piece molded base 1200 except for the first end side and the second end side, while the corresponding portion 1200B of the molded base at the second end side is not cut, thus obtaining the photosensitive assembly 10 having the portion 1200C of the one-piece molded base at a pair of opposite sides.

Accordingly, the photosensitive assembly 10 includes the circuit board 11, the photosensitive element 13, the protection frame 16 and the molding base 12. Wherein said circuit board 11 comprises said rigid region 111 and said flexible region 112 in combination. The molding base 12 is integrally formed with the circuit board 11, and the photosensitive element 13 and the protection frame 16 are formed as the light window 122 providing a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connection lines 15. The protective frame 16 may be located inside the connection line 15, or may cover at least a portion of the connection line 15. The portion 12A of the molded base corresponding to the first end side of the molded base 12 adjacent the flexible region 112 has a distance a between its outer edge 1201 and its inner edge 1202; corresponding to the portion 12B of the molded base 12 remote from the opposite second end side of the flexible region 112, the distance between its outer edge 1203 and its inner edge 1204 is c, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

Accordingly, as shown in FIG. 25C, in order to further reduce the size of the photosensitive assembly 10, at least a portion of the photosensitive assembly 10 of the molding base 12 away from the opposite second end side of the flexible region 112 is adapted to be removed, forming a cut surface 125 such that the distance between the outer edge 1205 of the remaining portion of the molding base 12 after being cut and the inner edge 1204 thereof is b, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

As shown in fig. 25B, a modified embodiment of the second embodiment of the present invention is the photosensitive-component jigsaw 1000 obtained by a molding process, which includes: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, one or more columns of the protective frames 16, and one or more of the integrally molded bases 1200, each of the protective frames 16 being formed on a corresponding one of the photosensitive elements 13. Each column of the circuit boards 11 comprises one or more of the circuit boards 11 arranged side by side, each of the circuit boards 11 comprising the rigid region 111 and the flexible region 112 combined. Each of the integrally molded bases 1200 is integrally formed with two rows of adjacent circuit boards 11, two rows of adjacent photosensitive elements 13, two rows of adjacent protective frames 16, and forms a light window 122 providing a light path for each of the photosensitive elements 13, and the two rows of adjacent circuit boards 11 are arranged with their flexible regions 112 away from each other and their rigid regions 11 adjacent to each other, such that each of the integrally molded bases 1200 has both end sides adjacent to the flexible regions 112; wherein a distance between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 1200A of the integrally molded base 1200 adjacent each end side of the flexible region 112 is a; the integrally molded base 1200 extends to a distance c between the two adjacent rows of the photosensitive elements 13, where 0.2 mm.ltoreq.a.ltoreq.1 mm, and between the two inner edges 1204, where 0.2 mm.ltoreq.c.ltoreq.1.5 a. Wherein each of the end sides of the integrally molded base 1200 corresponds to a combined side of the rigid region 111 and the flexible region 112 of the circuit board 11, i.e., a proximal side adjacent to the flexible region 112; the integrally molded base 1200 extends between two adjacent rows of the photosensitive elements 13 corresponding to the distal end side of the circuit board 11 away from the flexible region 112.

After cutting of the photosensitive element panel 1000, a single photosensitive element 10 can be obtained, wherein the cutting step can be performed on the other side of the one-piece molded base 1200 except the end side portion 1200A, thereby obtaining the molded base 12, wherein the portion 1200B of the molded base corresponding to between two adjacent columns of the photosensitive elements 13 is also cut, thus obtaining the photosensitive element 10 having the one-piece molded base portion 1200C on a pair of opposite wing sides. A distance a between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 12A of the molded base 12 adjacent a first end side of the flexible region 112; a portion 12B of the molded base corresponding to the second opposite end side of the molded base 12 from the flexible region 112 has a cut surface 125 and has an outer edge 1205 spaced from an inner edge 1204 thereof by a distance B of 0.2mm ∈a ∈1mm,0.2mm ∈b ∈1.5a-0.2mm, as shown in fig. 25C.

As shown in fig. 26A to 27, the molding process of the jigsaw operation may also be used to manufacture the photosensitive assembly 10 having two or more of the light windows 122, wherein such photosensitive assembly 10 may be used to manufacture an array camera module for a common substrate. That is, taking the photosensitive assembly 10 for manufacturing the dual camera module as an example, each circuit board 11 of the circuit board jigsaw 1100 is provided with two light window forming portions 214 correspondingly on one circuit board substrate 111 in the molding process, so that after the molding process and cutting are completed, each circuit board 11 forms a molded base 12 having two light windows 122 and sharing one circuit board 11, and two photosensitive elements 13 and two lenses 30 are correspondingly mounted. The circuit board 11 may be connected to a control motherboard of an electronic device, so that the array camera module manufactured in this embodiment may transmit images captured by a plurality of camera modules to the control motherboard for image information processing.

Fig. 28A to 32 show a method of manufacturing a photosensitive member according to a third preferred embodiment of the present invention. In this preferred embodiment of the present invention, each of the base panel forming guide grooves 215 has a first guide groove 2151 and a second guide groove 2152 which are substantially parallel, and a plurality of filling grooves 2153 extending between the first guide groove 2151 and the second guide groove 2152, wherein the filling grooves 2153 are formed between two adjacent light window forming portions 214, as schematically shown, the base panel forming guide groove 215 has 7 of the filling grooves 2153,6 of the light window forming portions 214 located between two adjacent filling grooves 2153. The molding material 14 flows along the first guide groove 2151 and the second guide groove 2152 from the feeding end 215A to the tail end 215B, the second guide groove 2152 is larger in size, one or more slow flow parts 114 are arranged on the circuit board 11 in the second guide groove 2152 when the first mold 211 and the second mold 212 are assembled, and the slow flow parts 114 slow the flow speed of the molding material 14 in the second guide groove 2152, so that the molding material 14 can fill each filling groove 2153 along the two guide grooves 2151 and 2152 in a fluid state during the curing time T, and the integrated molding base 1200 is formed after the molding material 14 is cured.

As shown in fig. 32, which is a schematic view of a manufacturing process of the photosensitive assembly tile 1000 of the camera module 100 according to the preferred embodiment of the present invention, the molding mold 210 is in a closed state, the circuit board 11 to be molded and the molding material 14 in a solid state are ready to be put in place, the molding material 14 in a solid state is heated so as to be fed into the base tile molding guide groove 215 when the molding material 14 is melted into a fluid state or a semi-solid semi-fluid state, and flows forward along the first guide groove 2151 and the second guide groove 2152 and fills the filling groove 2153 between the adjacent two of the optical window molding parts 214, wherein the slow flow member 114 located in the second guide groove 2152 blocks the flow of the fluid in the second guide groove 2152, thereby reducing the flow rate of the molding material 14 in the second guide groove 2152. In this way, when the base panel forming guide groove 215 can be completely filled with the fluid molding material 14, the fluid molding material 14 is cured and formed into the integral molding base 1200 integrally formed with each row of the circuit board 11 and each row of the photosensitive elements 13 through the curing process.

It should be noted that, in the molding process, the width of the bottom end of the first diversion trench 2151 is a, and the width of the bottom end of the second diversion trench 2152 is d. The width a corresponds to the width of the bottom end of the first diversion trench 2151 adjacent to the position where the rigid region 111 and the flexible region 112 of the circuit board 11 are combined, and the width d corresponds to the width of the bottom end of the second diversion trench 2152 far from the other side of the flexible region 112. The widths a and d are 0.2 mm.ltoreq.a.ltoreq.1 mm and d > 1.5a, respectively, because the slow flow member 114 is provided in the second flow guide groove 2152 during the molding process, the purpose of filling the base panel molding guide groove 215 during the molding process can be achieved.

Accordingly, the molding process of the present invention results in the photosensitive-component tile 1000 comprising: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, and one or more of the integrally molded bases 1200. Each column of the circuit boards 11 comprises one or more of the circuit boards 11 arranged side by side, each of the circuit boards 11 comprising the rigid region 111 and the flexible region 112 combined. Each of the integrally molded bases 1200 is integrally formed with one row of the circuit boards 11 and one row of the photosensitive elements 13 and forms the light windows 122 that provide light paths for each of the photosensitive elements 13. Wherein a distance between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 1200A of the integrally molded base 1200 adjacent a first end side of the flexible region 112 is a; the distance between the outer edge 1203 of the integrally molded base 1200 corresponding to the portion of the integrally molded base 1200 that is distal from the opposite second end side of the flexible region 112 and its inner edge 1204 is d, where 0.2 mm.ltoreq.a.ltoreq.1 mm, d > 1.5a. The second end side of the one-piece molded base 1200 corresponds to the circuit board 11 of the distal end side of the circuit board 11 away from the flexible region 112 and further includes one or more of the slow flow members 114 provided on the rigid region 111 thereof, and the one-piece molded base 1200 integrally embeds the slow flow members 114.

Individual ones of the photosensitive elements 10 can be obtained after cutting of the photosensitive element panel 1000, wherein the photosensitive element 10 includes the circuit board 11, the photosensitive element 13 and the molded base 12. Wherein said circuit board 11 comprises said rigid region 111 and said flexible region 112 in combination. The molding base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the light window 122 that provides a light path for the photosensitive element 13. The circuit board 11 and the photosensitive element 13 are connected by a series of connection lines 15. A distance a between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 12A of the molded base 12 adjacent a first end side of the flexible region 112; the distance between the outer edge 1203 of the molded base 12 corresponding to the portion 12B of the molded base away from the opposite second end side of the flexible region 112 and the inner edge 1204 thereof is d, where 0.2 mm.ltoreq.a.ltoreq.1 mm, d > 1.5a, and the portion 12B of the molded base 12 away from the opposite second end side of the flexible region 112 is embedded with the slow flow component 114.

Accordingly, as shown in FIG. 31, in order to further reduce the size of the photosensitive assembly 10, at least a portion of the photosensitive assembly 10 of the molding base 12 remote from the opposite second end side of the flexible region 112 is adapted to be removed, such as cut with a cutter, or ground, to form a cut surface 125, and the distance between the outer edge 1205 of the remaining portion of the molding base 12 after cutting and the inner edge 1204 thereof is made to be b, where 0.2 mm.ltoreq.b.ltoreq.d-0.2 mm. Preferably, the portion of the molded base 12 in which the slow flow member 114 is embedded is removed, and the corresponding portion of the circuit board 11 is also removed, preferably 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

Accordingly, this embodiment of the present invention provides a method for manufacturing a photosensitive assembly of an image module, which includes the following steps:

fixing the circuit board panel 1100 to the second mold 212 of the molding mold 210, wherein the circuit board panel 1100 comprises one or more rows of circuit boards, each row of circuit boards comprising one or more circuit boards arranged side by side, 11 each of the circuit boards 11 comprising a rigid region 111 and a flexible region 112 in combination, and each of the circuit boards 11 being operatively connected with a photosensitive element 13;

closing the second mold 212 and the first mold 211, filling the melted molding material 14 into a base panel molding guide slot 215 in the molding mold 210, wherein a position corresponding to the light window molding 214 is prevented from being filled with the molding material 14;

solidifying the molding material 14 in the base panel molding guide groove 215 to form a one-piece molded base 1200 at a position corresponding to the base panel molding guide groove 214, wherein the one-piece molded base 1200 is integrally molded to each corresponding row of the circuit board 11 and each corresponding row of the photosensitive elements 13 to form a photosensitive assembly panel 1000 and is formed to each of the photosensitive elements 13 at a position corresponding to the optical window molding portion 214 to form an optical window 122 providing an optical path for the photosensitive elements 13, wherein the base panel molding guide groove 215 has a first guide groove 2151 corresponding to a first end side of the one-piece molded base 1200 adjacent to the flexible region 112 and a second guide groove 2152 corresponding to the one-piece molded base 1200 remote from the flexible region 112, and a filling groove 3 between adjacent two of the photosensitive elements 13 to fill the molding material between adjacent two of the optical window molding portions 214, wherein the first guide groove 215 has a width of 1mm and the second guide groove 2152 corresponding to the one-piece molded base 1200 is provided at a base end side of 1mm and the one-piece molded base 1200 is provided at a base end side of 1.114 mm and a width of the two-piece molded base 1200 is 0.114 mm;

The photosensitive assembly jig 1000 is cut to obtain a plurality of photosensitive assemblies 10, wherein each of the photosensitive assemblies 10 includes the circuit board 11, the photosensitive element 13, and the molding base 12 is integrally formed with the circuit board 11 and the photosensitive element 13 and forms the light window 122 providing a light path for the photosensitive element 13. And preferably, in the cutting step, the portion of the molded base 12 embedding the slow flow member 114 is removed.

Fig. 33A to 37 show the photosensitive assembly 10 of the camera module 100 and the manufacturing process thereof according to the fourth embodiment of the present invention. In this embodiment, a photosensitive-element tile 1000 is also formed by a tile operation, and then cut to obtain the photosensitive element 10. In this embodiment, as distinguished from the third embodiment described above, two adjacent columns of circuit boards may have the rigid regions 111 disposed adjacent, with the corresponding flexible regions 112 spaced apart. More preferably, the rigid regions 111 of adjacent two columns of circuit boards are integrally formed such that the middle of the adjacent two columns of circuit boards forms an integral rigid region.

In this embodiment, in the molding process, the second guide grooves 2152 having a larger size are provided therein with a flow slowing member 114 to reduce the flow rate of the fluid in the second guide grooves 2152, so that the first molding material 14 flows along the two first guide grooves 2151 and the middle second guide groove 2152 from the feeding end 215A thereof toward the end 215B thereof, and the molding material 14 can fill each of the filling grooves 2153 to form the integral molding base 1200 after the molding material 14 is solidified.

In this embodiment of the present invention, the integrally molded base 1200 is integrally formed with two adjacent rows of the circuit boards 11 and two adjacent rows of the photosensitive elements 13 to form a photosensitive assembly panel 1000 and form the optical windows 122 for providing the light paths for the respective photosensitive elements 13 at positions corresponding to the optical window forming portions 214. The rigid region 111 of the circuit board 11 between the two rows of the photosensitive elements 13 is provided with the slow flow member 114 so as to appropriately block the flow of the molding material 14 in the second guide groove 2152.

As shown in fig. 37, the molding die 210 is in a clamped state, the circuit board 11 to be molded and the molding material 14 in a solid state are ready to be put in place, the molding material 14 in a solid state is heated so as to be fed into the base panel molding guide groove 215 when the molding material 14 is melted into a fluid state or a semi-solid semi-fluid state, the first guide groove 2151 and the second guide groove 2152 are flown forward and filled in the filling groove 2153 between the adjacent two light window molding portions 214, and the slow flow member 114 is provided so that the flow rate of the molding material 14 in the second guide groove 2152 is slowed down.

As shown in fig. 34 to 36, the resulting photosensitive-component puzzle 1000 can be further cut to produce individual photosensitive components 10. Each photosensitive assembly 10 includes at least one circuit board 11, at least one photosensitive element 13, and the molded base 12 integrally molded with the circuit board 11 and the photosensitive element 13. The rigid areas 111 integrally formed between the adjacent two columns of the circuit boards 11 are separated, and preferably, the portions of the molded base 12 embedding the slow flow members 114 are removed.

In the molding process, the width of the bottom end of each first channel 2151 is a, and the width of the bottom end of each second channel 2152 is c. The width a corresponds to the width of the bottom end of the first diversion trench 2151 adjacent to the position where the rigid region 111 and the flexible region 112 of the circuit board 11 are combined, and the width d corresponds to the width of the bottom end of the second diversion trench 2152 far from the other side of the flexible region 112. The widths a and d are set to be 0.2 mm.ltoreq.a.ltoreq.1 mm and d > 1.5a, the slow flow members 114 are provided on the rigid regions 111 of the circuit board 11 in the second guide grooves 2152, the fluid-like molding material 14 can flow forward along the outer two first guide grooves 2151 and the middle second guide grooves 2152, and the entire base panel molding guide 215 is filled with the molding material 14 before the molding material 14 is cured.

Accordingly, the molding process of the present invention results in the photosensitive-component tile 1000 comprising: one or more columns of the circuit board 11, one or more columns of the photosensitive elements 13, and one or more of the integrally molded bases 1200. Each column of the circuit boards 11 comprises one or more of the circuit boards 11 arranged side by side, each of the circuit boards 11 comprising the rigid region 111 and the flexible region 112 combined. Each of the integrally molded bases 1200 is integrally formed with two rows of adjacent circuit boards 11 and two rows of adjacent photosensitive elements 13 and forms a light window 122 providing a light path for each of the photosensitive elements 13, and the two rows of adjacent circuit boards 11 are arranged with their flexible regions 112 distant from each other and their rigid regions 11 adjacent to each other, such that each of the integrally molded bases 1200 has two end sides adjacent to the flexible regions 112; wherein a distance between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 1200A of the integrally molded base 1200 adjacent each end side of the flexible region 112 is a; the integrally molded base 1200 extends to a distance d between the two adjacent rows of the photosensitive elements 13 and between the two inner edges 1204, where 0.2 mm.ltoreq.a.ltoreq.1 mm, d > 1.5a, and the flow slowing member 114 is provided on the rigid region 111 of the circuit board 11 between the two adjacent rows of the photosensitive elements 13, the flow slowing member 114 being integrally embedded by the integrally molded base 1200.

Accordingly, as shown in fig. 36, the photosensitive assembly 10, which includes the circuit board 11, the photosensitive element 13 and the molded base 12, is obtained after dicing. After cutting the photosensitive element tiles 1000, each of the photosensitive elements 10 is made to have a first end side without cutting and a second end side with cutting, similar to the above-described embodiments. A distance a between an outer edge 1201 and an inner edge 1202 thereof corresponding to a portion 12A of the molded base 12 adjacent a first end side of the flexible region 112; corresponding to the portion 12B of the molded base 12 remote from the opposite second end side of the flexible region 112, which forms the cut surface 125, and the distance between the outer edge 1205 and its inner edge 1204 is B, where 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.b.ltoreq.d-0.2 mm, preferably 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

That is, in this embodiment of the present invention, since the flow-slowing member 114 is provided in the second guide grooves 2151 and 2152, the flow rate of the fluid in the second guide groove 2152 is reduced, and the molding material 14 can flow forward from the feed ends 215A of the three guide grooves 2151 and 2152 and fill the guide grooves 2151 and 2152 and the filling groove 2153 of the entire base panel forming guide groove 215. The molding material 14 is capable of flowing along three of the channels 2151 and 2152 from its feed end 215A to its end 215B prior to curing. And before the viscosity of the molding material 14 reaches a high value and cures, the molding material 14 fills the base panel forming guide groove 215, thereby preventing the connection line 15 between the circuit board 11 and the photosensitive element 13 from being damaged by the molding material 14 having a high viscosity flowing forward. And the fluid in the three channels 2151 and 2152 flows substantially in the same radial direction, preventing the molding material 14 in one channel from flowing to the other channel and impeding the forward flow of the molding material 14 in the other channel. And turbulence are not generated, resulting in deformation and damage caused by irregular oscillation of the connection line 15 connecting the circuit board 11 and the photosensitive element 13.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. The manufacturing method of the photosensitive assembly of the camera module comprises the following steps:

(b) Closing the second mold and the first mold, and filling molten molding material into a base jointed board molding guide groove in the molding mold, wherein the position corresponding to the light window molding part is prevented from being filled with the molding material; and (c) solidifying the molding material within the base panel forming channel to form a one-piece molded base at a location corresponding to the base panel forming channel, wherein the one-piece molded base is integrally molded to each corresponding column of the circuit board and each column of the photosensitive elements to form a photosensitive assembly panel and to form a light window for each of the photosensitive elements to provide a light path at a location corresponding to the light window molding, wherein the base panel forming channel has a first guide groove corresponding to a first end side of the one-piece molded base adjacent the flexible region and a second guide groove corresponding to a second guide groove of the one-piece molded base remote from the flexible region, and a plurality of filling grooves extending between the first guide groove and the second guide groove, wherein each of the light window molding is located between two adjacent filling grooves, wherein a bottom end of the first guide groove has a width a, and a bottom end of the second guide groove has a width c, wherein a corresponds to a distance between an inner edge of the one-piece molded base adjacent the first end side of the one-piece molded base and an outer edge thereof; wherein the width c corresponds to the distance between the outer edge of the portion of the one-piece molded base remote from the opposite second end side of the flexible region and the inner edge thereof, wherein 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

2. The method of claim 1, further comprising the step of: cutting the photosensitive component jointed board to obtain a plurality of photosensitive components, wherein each photosensitive component comprises the circuit board, the photosensitive element and the molding base, and the molding base is integrally formed on the circuit board and the photosensitive element and forms the light window for providing a light path for the photosensitive element.

3. The method of claim 1, wherein 0.7 a.ltoreq.c.ltoreq.1.3 a.

4. The method of claim 2, further comprising the step of: cutting a portion of the photosensitive member corresponding to an opposite second end side of the molded base away from the flexible region so that a distance between an outer edge of the remaining portion of the molded base and an inner edge thereof is b, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

5. The method of any one of claims 1 to 4, wherein the rigid region of each circuit board leaves a press-fit distance W between adjacent first end sides of the flexible regions, which is in the range of 0.1 to 1mm, for press-fitting of the press-fit blocks of the first mold in the molding process.

6. The method of any one of claims 1 to 4, wherein the rigid regions of each column of the circuit board are integrally formed to form a unitary rigid region panel.

7. The manufacturing method of the photosensitive assembly of the camera module comprises the following steps:

(B) Closing the second mold and the first mold, and filling molten molding material into a base jointed board molding guide groove in the molding mold, wherein the position corresponding to the light window molding part is prevented from being filled with the molding material; and (C) solidifying the molding material in the base panel molding guide groove to form a one-piece molded base at a position corresponding to the base panel molding guide groove, wherein the one-piece molded base is integrally molded to the adjacent two rows of the circuit boards and the adjacent two rows of the photosensitive elements to form a photosensitive assembly panel and to form a light window providing a light path for each of the photosensitive elements at a position corresponding to the light window molding portion, wherein the adjacent two rows of the circuit boards are arranged with their flexible regions distant from each other and with their rigid regions adjacent to each other, wherein the base panel molding guide groove has two first guide grooves corresponding to both end sides of the one-piece molded base adjacent to the flexible regions and a second guide groove corresponding to a region between the adjacent two rows of the photosensitive elements, and a plurality of filling grooves extending between the two first guide grooves and the second guide grooves, wherein each of the light window molding portions is located between the adjacent two filling grooves, wherein a width of the first guide groove is a width of the bottom end of the first guide groove a, and a width of the bottom end of the second guide groove is a width of the one-piece molded base adjacent to the edge thereof, and a width of the one-piece molded base is adjacent to the bottom edge thereof; wherein c corresponds to a distance between two inner edges of a portion extending to the integrally molded base between the two adjacent rows of the photosensitive elements, wherein 0.2 mm.ltoreq.a.ltoreq.1 mm,0.2 mm.ltoreq.c.ltoreq.1.5 a.

8. The method of claim 7, further comprising the step of: cutting the photosensitive component jointed board to obtain a plurality of photosensitive components, wherein each photosensitive component comprises the circuit board, the photosensitive element and the molding base, and the molding base is integrally formed on the circuit board and the photosensitive element and forms the light window for providing a light path for the photosensitive element.

9. The method of claim 7, wherein 0.7 a.ltoreq.c.ltoreq.1.3 a.

10. The method of claim 8, further comprising the step of: cutting a portion of the photosensitive member located between the adjacent two columns of the photosensitive elements to obtain a portion of the molded base corresponding to the opposite end side of the molded base from the flexible region, and making a distance between an outer edge thereof and an inner edge thereof be b, wherein 0.2 mm.ltoreq.b.ltoreq.1.5 a-0.2mm.

11. A method according to any one of claims 7 to 10, wherein said rigid region of each of said circuit boards is left adjacent to a first end side of said flexible region with a press-fit distance W for which press-fitting of said press-fit blocks of said first mold in a molding process is facilitated, in a range of 0.1 to 1mm.

12. The method of any one of claims 7 to 10, wherein the rigid regions of the adjacent two columns of the circuit board are integrally formed to form a unitary rigid region panel.

13. A molding die to make a light sensitive component panel for use in a camera module, comprising a first die and a second die adapted to be separated and brought into close contact, wherein the first and second dies form a molding cavity when brought into close contact, and the molding die is configured with a light window molding within the molding cavity and a base panel molding channel around the light window molding and adapted to hold a circuit board panel within the molding cavity, wherein the circuit board panel comprises one or more columns of circuit boards, each column of circuit board comprises one or more side-by-side arranged circuit boards, each circuit board comprises a combined rigid region and a flexible region, and each circuit board is operatively connected with a light sensitive element, the base panel molding channel is adapted to be filled with molding material to form a one-piece molded base at a location corresponding to the base panel molding channel, wherein the one-piece molded base is integrally formed with each column of the circuit board and each column of the light sensitive element to form the light sensitive component and is formed with a light window providing a path for each of the light sensitive elements at a location corresponding to the light window molding channel, wherein the one-piece has a width corresponding to the first side of the one-piece molded base channel and a width of the two-piece molded base channels is 2mm, wherein the one-piece molded base channels is 2mm is filled with a width of the one-piece molded base channel and 2mm between the two adjacent to the two-piece molded channels and the two-2 mm bottom end region, wherein the two-piece molded channels are filled with a width of the one-piece molded base channel is 2mm and 2 mm.

14. A molding die to make a light-sensitive component panel for application to a camera module, comprising a first die and a second die adapted to be separated and brought into close contact, wherein said first and second dies form a molding cavity when brought into close contact, and said molding die is configured with a light window molding in said molding cavity and a base panel molding channel around said light window molding and is adapted to hold a circuit board panel in said molding cavity, wherein the circuit board panel comprises a plurality of columns of circuit boards, each column of circuit boards comprising one or more side-by-side arranged circuit boards, each circuit board comprising a combined rigid region and a flexible region, and each circuit board is operatively connected with a light-sensitive element, wherein said base panel molding channel is adapted to be filled with molding material to form a one-piece molded base at a location corresponding to said base panel molding channel, wherein the one-piece molded base is integrally formed with two adjacent columns of the circuit boards and two adjacent columns of the light-sensitive elements to form the light-sensitive component and to form a light window for each of the light-sensitive element providing a passage at a location corresponding to said light window molding, wherein the two adjacent columns of the circuit boards are disposed adjacent to each other and the two guide channels are located at a width between said two adjacent columns of the two-piece molded base molding channel, wherein the two adjacent columns of the two guide channels are located between the two adjacent to each other, and the two adjacent side of the two guide channels are located between the two adjacent to each side of the two channels are formed adjacent to each side of the two base molding channel, wherein the two molding channel is a and the base molding channel is formed between one has a respective light-piece molded channel, the width of the bottom end of the second diversion trench is c, wherein a is more than or equal to 0.2mm and less than or equal to 1mm, and c is more than or equal to 0.2mm and less than or equal to 1.5a.

15. The manufacturing method of the photosensitive assembly of the camera module comprises the following steps:

(3) Solidifying the molding material within the base panel forming channel to form a one-piece molded base at a location corresponding to the base panel forming channel, wherein the one-piece molded base is integrally molded between each corresponding row of the circuit board and each corresponding row of the photosensitive elements to form a photosensitive assembly panel and is formed with a light window providing a light path for each of the photosensitive elements at a location corresponding to the light window molding, wherein the base panel forming channel has a first channel corresponding to a first end side of the one-piece molded base adjacent the flexible region and a second channel corresponding to the one-piece molded base remote from the flexible region, and a plurality of filling channels extending between the first channel and the second channel, wherein each of the light window molding locations is between two adjacent filling channels, wherein a width of a bottom end of the first channel is a, a width of a bottom end of the second channel is d, wherein 0.2 mm.ltoreq.1 mm, d > 1.5a, and a plurality of filling channels extending between the first channel and the second channel is positioned on the one-piece molded base remote from the flexible base and is embedded in the rigid base region.

16. The method of claim 15, further comprising the step of: cutting the photosensitive component jointed board to obtain a plurality of photosensitive components, wherein each photosensitive component comprises the circuit board, the photosensitive element and the molding base, and the molding base is integrally formed on the circuit board and the photosensitive element and forms the light window for providing a light path for the photosensitive element.

17. The method of claim 15, further comprising the step of: removing a portion of the integral molded base embedding the slow flow component.

18. The manufacturing method of the photosensitive assembly of the camera module comprises the following steps:

(β) closing the second mold and the first mold, filling molten molding material into a base panel molding channel in the molding mold, wherein a position corresponding to the light window molding is prevented from filling the molding material; and (gamma) solidifying the molding material in the base panel molding guide groove to form a one-piece molding base at a position corresponding to the base panel molding guide groove, wherein the one-piece molding base is integrally molded to two adjacent rows of the circuit boards and two adjacent rows of the photosensitive elements to form a photosensitive assembly panel and to form an optical window providing a light path for each of the photosensitive elements at a position corresponding to the optical window molding portion, wherein the two adjacent rows of the circuit boards are arranged with their flexible regions away from each other and their rigid regions adjacent to each other, wherein the base panel molding guide groove has two first guide grooves corresponding to two end sides of the one-piece molding base adjacent to the flexible regions and a second guide groove corresponding to a region between the two adjacent rows of the photosensitive elements, and a plurality of filling grooves extending between the two first guide grooves and the second guide grooves, wherein each of the optical window molding portions is located between the two adjacent filling grooves, wherein the width of the first guide groove is 1mm, the width of the bottom end of the first guide groove is 1mm, and the width of the second guide groove is 1mm is set in the circuit board, and the width is 1 mm.

19. The method of claim 18, further comprising the step of: cutting the photosensitive component jointed board to obtain a plurality of photosensitive components, wherein each photosensitive component comprises the circuit board, the photosensitive element and the molding base, and the molding base is integrally formed on the circuit board and the photosensitive element and forms the light window for providing a light path for the photosensitive element.

20. The method of claim 19, further comprising the step of: and removing a portion of the integrally molded base between the adjacent two rows of the photosensitive elements and removing a portion of the embedded slow-flow member.