CN107682596B

CN107682596B - Molded photosensitive component, jointed board thereof and manufacturing method

Info

Publication number: CN107682596B
Application number: CN201710711359.3A
Authority: CN
Inventors: 王明珠; 陈振宇; 郭楠; 田中武彦; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2016-08-01
Filing date: 2016-08-01
Publication date: 2021-03-09
Anticipated expiration: 2036-08-01
Also published as: CN107682591B; CN107682596A; CN107682591A; CN110650273B; CN110650273A

Abstract

The invention provides a molded photo-sensing component jointed board, which comprises: the substrate is provided with a first area and a second area, wherein the second area is provided with a hollow part; a plurality of photosensitive elements mounted on the first region of the substrate; and a molded base panel formed from a molding material over the first region of the substrate and over the plurality of photosensitive elements. The invention also provides a corresponding method for manufacturing the jointed board of the molding photosensitive assembly, the corresponding molding photosensitive assembly and a manufacturing method thereof.

Description

Molded photosensitive component, jointed board thereof and manufacturing method

Technical Field

The invention relates to the field of camera modules, in particular to a camera module manufactured by a molding process, a forming mold and a manufacturing method thereof, a molding photosensitive assembly, a jointed board and a manufacturing method thereof.

Background

The camera module is one of the parts of the intelligent electronic device that cannot be obtained, such as but not limited to a smart phone, a camera, a computer device, a wearable device, and the like. And along with the continuous development and the popularization of various smart machines, the requirement to the module of making a video recording is also higher and higher.

In recent years, the development of intelligent electronic devices has been rapidly increased, and the smart electronic devices are increasingly light and thin, and the camera module is adapted to the development of the smart electronic devices, and is also increasingly required to be multifunctional, light, thin and small, so that the smart electronic devices can be thinner and thinner, and the imaging requirements of the smart electronic devices on the camera module can be met. Therefore, manufacturers of camera modules are continuously dedicated to designing and manufacturing camera modules satisfying these requirements.

The molding packaging technology is a packaging technology which is newly developed on the basis of the traditional COB packaging technology. As shown in fig. 1A, the circuit board is packaged by using the conventional integrated packaging technology. In the structure, the packaging part 1 is packaged in the circuit board 2 and the photosensitive chip 3 in an integrated packaging mode, and the electronic component on the circuit board and the lead of the electric connection chip and the circuit board are coated, so that the space occupied by the electronic component of the camera module is reduced, the size of the camera module can be reduced, and the problem that dust attached to the electronic component influences the imaging quality of the camera module is solved.

Compared with the traditional bracket type COB packaging technology, the packaging technology has more advantages theoretically, but the packaging technology only stays in a theoretical or manual experiment stage for a period of time, is not well implemented, is not put into practical production for quantitative production, and has the following aspects.

First, the one-piece packaging technology is a well-known technology in other large-scale industrial fields, but is a new application in the field of camera modules, and different industries need different objects to be produced by molding, and different problems are faced. Taking smart mobile phone as an example, the organism is more and more frivolous, so thickness is less and less, consequently requires the module of making a video recording to reach such thickness as well, just can not increase the whole thickness of cell-phone, and it can be imagined that the part in the module of making a video recording all processes at a less size grade, therefore the ideal structure of design but can not produce through conventional mode. In the above structure, it is usually necessary to form a through hole through the package portion 1 to provide a light path for the photosensitive chip 3 on the circuit board 2, and the through hole is usually designed to be a vertical square column shape. That is, this technique is only in the manual trial stage, but cannot be put into practical production. More specifically, the packaging process requires a forming mold, and referring to fig. 1B and 1C, when the forming block 4 of the upper mold of the forming mold is in a vertical square column shape, in the forming process, at the position where the upper mold contacts with the formed packaging part, when the mold is separated from the molding material, because the bottom of the upper mold is in a sharp edge shape, the mold will affect the shape of the molded packaging part 1 in the process of being pulled out, so that the molded packaging part 1 is deformed, such as a flash, and in addition, when the upper mold is pulled out and separated from the packaging part, the outer side surface of the upper mold forming block 4 always generates a large friction force with the packaging part 1, so that the packaging part 1 may be damaged, and this effect may be ignored in the large industrial field, but becomes a crucial influencing factor in the small-size fine-scale production field of camera modules, so the theoretical structure of the vertical square column shape of the through hole is feasible, but is not suitable for mass production.

Secondly, the camera module is an optical electronic device, and light is an important factor for determining the imaging quality. Referring to fig. 1D, in traditional support equipment mode, electronic components's installation space 6 need be reserved to support 5 of installing on the circuit board, consequently forms the indent space, and the existence in this space has improved the size of the module of making a video recording, but the light incidence back, and direct irradiation in the support inner wall is few very few, therefore the reflection light of support inner wall is less, can not influence the imaging quality of the module of making a video recording. When the support is replaced by the conventional square-column-shaped packaging part 1, referring to fig. 1E, compared to the support structure, after light rays with the same incident angle enter the lens, reflected light rays are not generated in the support structure, but act on the inner wall of the packaging part 1 in the integrally packaged structure, and the reflected light rays easily reach the photosensitive chip 3, so that the influence of stray light is increased, the imaging quality of the camera module is reduced, and therefore, the structure of the through hole formed in the packaging part 1 and having the square column shape is not suitable for being applied in terms of optical imaging quality.

Finally, when the camera module is assembled, the package portion 1 usually needs to be mounted with components such as a lens or a motor, and therefore the package portion 1 needs to satisfy a certain structural strength, and therefore, when the shape of the package portion 1 is set, the package portion 1 needs to be designed by considering a plurality of aspects such as luminous flux, structural strength, light reflectivity, convenience in mold release, and prevention of damage to the package portion 1 from mold release, and obviously, the conventional structure of the package portion 1 does not consider these factors in combination.

Disclosure of Invention

The invention aims to provide a camera module, a molding photosensitive component and a manufacturing method thereof, wherein the camera module comprises the molding photosensitive component formed by a molding process, and the molding photosensitive component can be subjected to large-scale mass production experiments through the molding process by a forming mold.

The invention aims to provide a camera module, a molding photosensitive assembly and a manufacturing method thereof, wherein the molding photosensitive assembly comprises a circuit board, a photosensitive element and a molding base integrally formed on the circuit board and the photosensitive element, and the molding base forms an optical window, wherein the optical window is not in a square column shape in the prior art, so that in the manufacturing process, the damage of an optical window molding block of a molding die to the molding base is reduced, and the optical window molding block is convenient to pull out.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a manufacturing method thereof, wherein a first inclined angle which is acute and facilitates mold release is formed between at least a portion of the molded base integrally extending from the photosensitive element and an optical axis direction, and after the molded base is formed by a molding process, the optical window forming block can be smoothly pulled out, and friction with the molded base is reduced, so that the molded base can be kept as it is as possible, and influence caused when the optical window forming block is pulled out is reduced.

An object of the present invention is to provide a camera module, a molded photosensitive component thereof and a manufacturing method thereof, wherein an included angle between at least a portion of an inner side surface of the molded base integrally extending from a top surface of the photosensitive element and an optical axis of the molded base is defined as the first inclination angle, so that light incident to the inner side surface is not easy to reach the photosensitive element, and influence of stray light on imaging quality is reduced.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a method for manufacturing the same, wherein an angle between at least one of outer sides of a mold base and a direction of an optical axis is an acute angle, i.e., a second inclination angle, which facilitates mold release, and when a partition block of the mold is pulled out of the mold base during manufacturing by the mold, friction between the partition block of the mold and the outer side of the mold base is reduced, so that the outer side of the mold base is kept as original as possible, and the partition block of the mold is easily pulled out.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a manufacturing method thereof, wherein the inner side of the molding base is sequentially provided with a first part inner side surface extending from the photosensitive element in an inclined manner, a second part inner side surface extending from the first part inner side surface, and a third part inner side surface extending from the second part inner side surface in an inclined manner, and an included angle between the third part inner side surface and the optical axis is defined as a third inclined angle which is convenient for demolding, so that when an optical window molding block of the molding die is pulled out, friction between the base of the optical window molding block and the inner side of the top end of the molding base is reduced, the second part inner side surface of the molding base is kept as original as possible, and the molding die of the molding die is easily pulled out.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof, and a method of manufacturing the same, in which the first inclination angle is within a predetermined range, pulling out is facilitated, and a lead connecting the photosensitive element and the circuit board is not damaged.

It is an object of the present invention to provide a camera module, a molded photosensitive assembly thereof and a method of manufacturing the same, wherein the bottom side of the molding die is generally provided with an elastic film layer, and the angles of inclination are not at right angles, so as to prevent the film layer from being punctured.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a method for manufacturing the same, wherein the molded base has a top side surface, and the first, second and third inclination angles are within a predetermined range, so as to facilitate the extraction of the optical window forming block and the separating block, and not to make the top side surface too small to provide a stable mounting area for a driver or a lens.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof and a manufacturing method thereof, wherein the angles of the first, second and third tilt angles are within a predetermined range, so as to facilitate the extraction of the optical window forming block, and provide a stable mounting area for the optical filter or the optical filter lens holder.

An object of the present invention is to provide a camera module, a molded photosensitive assembly thereof, and a method of manufacturing the same, wherein the molded base forms an optical window with a slope, increasing the light flux, and meeting the requirements of the field of view and the range of angular incidence of the photosensitive element.

An object of the present invention is to provide a camera module, a molded photosensitive member thereof, and a method of manufacturing the same, in which each of the draft angles is set to a predetermined angle range, thereby ensuring structural strength and light reflectance of the molding and reducing mold release friction.

In order to achieve at least one of the above objects, an aspect of the present invention provides a molded photosensitive device, a molded photosensitive device applied to a camera module, including at least a circuit board, at least a photosensitive element, and at least a molded base, the molded base is integrally combined with the circuit board and the photosensitive element by a molding process, wherein the molded base forms at least a light window corresponding to the photosensitive element, and at least a portion of an inner side surface of the molded base integrally extending from the photosensitive element extends in an inclined manner.

In some embodiments, an included angle between the at least a portion of the inner side surface of the mold base and an optical axis line of the camera module is 10 ° to 80 °.

In some embodiments, the molding base has an inner side surface linearly extending integrally from a non-photosensitive region of a top surface of the photosensitive element, so that all inner side surfaces of the molding base extend in an inclined manner, and an inclined angle α is provided between the inner side surface of the molding base and an optical axis line of the camera module for facilitating demolding and avoiding stray light, wherein α is in a range of 10 ° to 80 °. Such as 10-30 degrees, 30-45 degrees, 45-55 degrees or 55-80 degrees.

In some embodiments, the photosensitive element and the circuit board are electrically connected through a set of leads, wherein the leads are wire-bonded in a manner that when the photosensitive element faces the circuit board, the value of α is selected from 10 ° to 55 °.

In some embodiments, the photosensitive element and the circuit board are electrically connected through a set of leads, wherein the wire bonding connection mode of the leads is that when the leads face the photosensitive element from the circuit board, the value of alpha is selected from 10 degrees to 88 degrees.

In some embodiments, the mold base has an outer side surface linearly extending integrally from the circuit board, wherein an inclined angle γ facilitating mold release is provided between the outer side surface of the mold base and an optical axis line of the camera module, and γ ranges from 3 ° to 45 °. Such as from 3 to 15, from 15 to 30, or from 30 to 45.

In some embodiments, the molding base has a top groove at the top end, the molding base has an inner side surface extending in a bending way, and the molding base comprises a first part inner side surface, a second part inner side surface and a third part inner side surface which are sequentially and integrally extended, the first part inner side surface integrally and obliquely extends to a non-photosensitive area of a top surface of the photosensitive element, the third part inner side surface integrally and obliquely extends to the second part inner side surface, and the second part inner side surface and the third part inner side surface define and form the top groove.

In some embodiments, an inclined angle α is formed between the first portion inner side surface and the optical axis line of the camera module, which facilitates demolding and avoids stray light, where α is in a range of 10 ° to 80 °, and an inclined angle β is formed between the third portion inner side surface and the optical axis line of the camera module, which facilitates demolding and avoids stray light, where β is in a range of 3 ° to 30 °.

In some embodiments, the value of α is selected from the group consisting of 10 ° to 30 °, 30 ° to 45 °, 45 ° to 55 °, or 55 ° to 80 °, wherein the value of β is selected from the group consisting of 3 ° to 15 °, 15 ° to 20 °, or 20 ° to 30 °.

In some embodiments, the second portion inner side surface is based parallel to the top surface of the photosensitive element.

In some embodiments, the molded photosensitive component further comprises one or more driver pin grooves, wherein a pin groove wall surface defining each driver pin groove and an optical axis line of the camera module have a slant angle δ for facilitating demolding, wherein δ is in a range of 3 ° to 30 °.

In some embodiments, the molded photosensitive assembly further includes at least one optical filter, the optical filter is stacked with the photosensitive element, and the molding base is integrally formed on the optical filter, the photosensitive element and the circuit board.

In some embodiments, the substrate of the circuit board is left with a pressing distance W for facilitating pressing of at least one separation block of a forming mold in a molding process, which is in a range of 0.1 to 0.6mm, outside at least one outer peripheral surface of the outer side surface of the molding base.

In some embodiments, the material surface of the mold base has a reflectance of less than 5% at a light wavelength range of 435- & 660 nm.

The section of the light window is in a trapezoid or multi-step shape gradually enlarged from bottom to top, so that demolding is facilitated, damage to a molding base is prevented, stray light is avoided, and damage to the lead wire connecting the photosensitive element and the circuit board in a molding process is prevented.

The invention also provides a camera module which comprises at least one lens and the at least one molded photosensitive assembly, wherein the molded photosensitive assembly comprises at least one circuit board, at least one photosensitive element and at least one molded base, the molded base is integrally combined with the circuit board and the photosensitive element through a molding process, the molded base forms at least one optical window, the optical window provides a light path for the photosensitive element and the lens, and at least one part of the inner side surface of the molded base integrally extending from the photosensitive element extends in an inclined manner.

In some embodiments, the molded photosensitive assembly further includes at least one optical filter, the optical filter is stacked with the photosensitive element, and the molding base is integrally formed on the optical filter, the photosensitive element and the circuit in a packaging manner.

In some embodiments, the optical filter is mounted on the top end of the molding base.

In some embodiments, it further comprises at least one filter mounted to the top-side recess of the mold base.

In some embodiments, the optical filter module further comprises at least one filter base and at least one filter, wherein the filter is mounted on the filter base, and the filter base is mounted at the top end of the molding base.

In some embodiments, it further comprises at least one driver mounted to a top side of the mold base such that the mold base supports the driver, wherein the lens is mounted within the driver to achieve auto-focus.

In some embodiments, the molding device further comprises at least one blocking element in a ring shape to prevent molding material from reaching a photosensitive region of the photosensitive element during the molding process.

In some embodiments, a plurality of the camera modules are assembled into an array of camera modules.

In some embodiments, the molded photosensitive assembly includes a plurality of the photosensitive elements and has a plurality of the optical windows, thereby forming an array camera module with a plurality of the lenses.

The invention also provides electronic equipment which comprises one or more camera modules. Including, but not limited to, cell phones, computers, televisions, smart wearable devices, vehicles, cameras, and surveillance equipment.

The invention also provides a forming die, which is applied to manufacturing at least one molding photosensitive assembly of at least one camera module and comprises a first die and a second die which can be separated or closed, wherein the first die and the second die form at least one forming cavity when being closed, the forming die is provided with at least one optical window forming block and a base forming guide groove positioned around the optical window forming block in the forming cavity, when at least one circuit board connected with at least one photosensitive element is installed in the forming cavity, a molding material filled into the base forming guide groove undergoes a liquid-to-solid conversion process under the action of temperature control to be cured and formed, a molding base is formed at a position corresponding to the base forming guide groove, an optical window of the molding base is formed at a position corresponding to the optical window forming block, and the molding base is integrally formed on the circuit board and at least one part of non-photosensitive areas of the photosensitive element to form a molding base And forming the molding photosensitive assembly of the camera module.

In some embodiments, the light window shaping block has an obliquely extending base inner side shaping surface along its periphery for forming an integral linearly extending inner side of the molding base.

In some embodiments, the base inner side surface molding surface of the light window molding block has an inclination angle with the vertical line, which facilitates demolding, wherein the size range of α is 10 ° to 80 °.

In some embodiments, the light window shaping block includes a press head portion and a groove shaping portion integrally extending from the press head portion, the groove shaping portion having a larger inner diameter than the press head portion for forming a top side groove at a top side of the molding base.

In some embodiments, the presser head part has an inclination angle α between an outer side surface along its outer periphery and a vertical line to facilitate mold release and to avoid stray light, wherein α is in a range of 10 ° to 80 °, and the groove forming part has an inclination angle β between an outer side surface along its outer periphery and a vertical line, wherein β is in a range of 3 ° to 30 °. The photosensitive element is in conductive connection with the circuit board through a group of leads, wherein the wire bonding connection mode of the leads is that when the photosensitive element faces the circuit board, the numerical value of alpha is selected from 10 degrees to 55 degrees; the wire bonding connection mode of the lead is that when the lead faces the photosensitive element from the circuit board, the numerical value of alpha is selected from 10-88.

In some embodiments, the first mold further comprises at least one spacer block having a base outer surface forming surface with an inclination angle γ from the vertical to facilitate demolding, the value of γ being selected from 3 ° to 45 °.

According to another aspect of the present invention, there is also provided a molded panel of photosensitive elements, comprising: the substrate is provided with a first area and a second area, wherein the second area is provided with a hollow part; a plurality of photosensitive elements mounted on the first region of the substrate; and a molded base panel formed from a molding material over the first region of the substrate and over the plurality of photosensitive elements; the molding material surrounds each photosensitive element corresponding to the first area, extends towards and contacts the surrounding photosensitive element and extends away from the surrounding photosensitive element, so that the molding material forms an integral molding base jointed board.

Wherein the second region includes a plurality of connectors.

Wherein the plurality of connectors of the second region are arranged in rows; and there is a space between two adjacent connectors in the same row.

Wherein the second area comprises one or two rows of connectors.

The plurality of photosensitive elements are arranged in rows, and the molding base jointed board is formed on the first area of the substrate corresponding to the two adjacent rows of photosensitive elements to form the molding photosensitive assembly jointed board with an integral structure.

The molded light sensing component jointed board is provided with a first side and an opposite second side, and the two adjacent rows of light sensing elements comprise a plurality of first light sensing elements which are close to the first side and are arranged along the first side and a plurality of second light sensing elements which are close to the second side and are arranged along the second side.

The plurality of connectors comprise a plurality of first connectors arranged in rows and a plurality of second connectors arranged in rows, the first side of the molded photosensitive component jointed board is connected with the plurality of first connectors, each first connector corresponds to one first photosensitive element, the second side of the molded photosensitive component jointed board is connected with the plurality of second connectors, and each second connector corresponds to one second photosensitive element.

And a plurality of jointed boards of the molding photosensitive assembly are formed on one substrate.

Wherein each of said first connectors has a first end and an opposite second end, and said first ends of said first connectors are attached to a first side of said molded light sensitive component panel, and said second ends of said first connectors are attached to a second connector or an edge of said substrate; each of the second connectors has a first end and an opposite second end, and the first ends of the second connectors are connected to the second side of the panels of the molded photo-responsive component, and the second ends of the second connectors are connected to the first connectors or the edges of the substrate.

The molded light sensing component jointed board is provided with a first side and a second side, wherein the first side and the second side are connected with the first side and the second side respectively, and the first side and the second side are connected with the first side and the second side respectively.

Wherein a plurality of the molded photosensitive assembly panels are formed on one of the substrates, each of the molded photosensitive assembly panels further having a third side intersecting the first and second sides and the third side connecting an extension; wherein the extensions connected to the respective panels of the plurality of molded photosensitive assemblies are joined together.

Wherein the molded base panel forms a plurality of optical windows, each optical window corresponding in position to one of the plurality of light sensing elements.

Wherein, the included angle between at least one part of the inner side surface of the molding base makeup and the optical axis straight line corresponding to the photosensitive element is 10-80 degrees.

Wherein the molding base makeup has an outer side surface linearly extending from the rigid region of the rigid-flexible board, wherein an inclined angle gamma facilitating demolding is provided between the outer side surface of the molding base makeup and an optical axis straight line corresponding to the photosensitive element, and the size of gamma ranges from 3 degrees to 45 degrees.

The outer side of the outer side face of the molding base plate is provided with a pressing distance in a rigid area corresponding to the molding photosensitive assembly plate; the pressing distance is the distance of a forming die in the molding process which is convenient for pressing.

Wherein, the numerical range of the pressing distance is 0.1-0.6 mm.

Wherein, the included angle between at least one part of the inner side surface of the molding base makeup and the optical axis straight line corresponding to the photosensitive element is 15-55 degrees.

Wherein the size range of the inclination angle gamma is 3-15 deg.

The substrate is a rigid-flex board, the first area is a rigid area, and the second area is a flexible area.

According to another aspect of the invention, the molded photosensitive component is obtained by cutting the spliced board of the molded photosensitive component.

The molded photosensitive assembly obtained through cutting is provided with a vertical flat surface, and the vertical flat surface is formed by cutting the molded base jointed plate and the substrate.

Wherein at least a portion of the molded photosensitive assembly has two or three cut surfaces formed by cutting the molded base panel and the substrate.

According to another aspect of the invention, a camera module is also provided, and the camera module comprises the molded photosensitive component.

According to another aspect of the present invention, there is provided a method for manufacturing a jointed board of a molded photosensitive assembly, including:

preparing a substrate, wherein the substrate is provided with a first area and a second area, and the second area is provided with a hollow part;

mounting a plurality of photosensitive elements on the first region of the substrate; and

forming a molded base panel on the first region of the substrate and on the plurality of photosensitive elements by a molding process to form a molded photosensitive assembly panel comprising the substrate, the plurality of photosensitive elements, and the molded base panel; wherein a molding material is surrounded around each of the photosensitive elements corresponding to the first regions; the molding material surrounding each of the light sensing elements extends toward and contacts the surrounding light sensing element and extends away from the surrounding light sensing element such that the molding material forms an integral molding base panel.

Wherein, in the step of preparing the substrate, the second region includes a plurality of connectors arranged in a row; and there is a space between two adjacent connectors in the same row.

Wherein, in the step of preparing the substrate, the second area includes one row or two rows of connectors.

Wherein in the step of mounting a plurality of photosensitive elements, the plurality of photosensitive elements are arranged in a row;

in the step of forming the molded base jointed board, the molded base jointed board is formed on the first area of the substrate corresponding to the two adjacent rows of photosensitive elements to form the molded photosensitive assembly jointed board with an integral structure.

In the step of forming the molded base panel, the molded light sensing component panel has a first side and an opposite second side, and the two adjacent rows of light sensing elements include a plurality of first light sensing elements arranged along the first side and close to the first side and a plurality of second light sensing elements arranged along the second side and close to the second side.

In the step of forming the molded base plate, the plurality of connectors include a plurality of first connectors arranged in a row and a plurality of second connectors arranged in a row, the first side of the molded photosensitive assembly plate is connected with the plurality of first connectors, each first connector corresponds to one first photosensitive element, and the second side of the molded photosensitive assembly plate is connected with the plurality of second connectors, each second connector corresponds to one second photosensitive element.

In the step of forming the molded base jointed board, a plurality of molded photosensitive assembly jointed boards are formed on one substrate.

Wherein, in the step of forming the molded base panel, each of the first connectors has a first end and an opposite second end, and the first ends of the first connectors are connected to a first side of the molded photosensitive assembly panel, and the second ends of the first connectors are connected to a second connector or an edge of the substrate; each of the second connectors has a first end and an opposite second end, and the first ends of the second connectors are connected to the second side of the panels of the molded photo-responsive component, and the second ends of the second connectors are connected to the first connectors or the edges of the substrate.

In the step of forming the molded base jointed board, the molded light sensing component jointed board is further provided with a third side intersecting the first side and the second side, and the third side is connected with an extension part.

Wherein, in the step of forming the molded base plate, a plurality of the molded photosensitive assembly plates are formed on one of the base plates, each of the molded photosensitive assembly plates further has a third side intersecting the first side and the second side, and the third side is connected with an extension portion; wherein the extensions connected to the respective panels of the plurality of molded photosensitive assemblies are joined together.

In the step of forming the molded base jointed board, the molded base jointed board forms a plurality of optical windows, and each optical window corresponds to one position of the plurality of photosensitive elements.

In the step of forming the molding base jointed board, the included angle between at least one part of the inner side surface of the molding base jointed board and the optical axis straight line corresponding to the photosensitive element is 10-80 degrees.

In the step of forming the molding base jointed board, the molding base jointed board has an outer side surface linearly extending from the rigid region of the rigid-flexible board, wherein an inclined angle gamma facilitating demoulding is formed between the outer side surface of the molding base jointed board and an optical axis straight line corresponding to the photosensitive element, and the size range of gamma is 3-45 degrees.

In the step of forming the molded base jointed board, a pressing distance is reserved in a rigid area corresponding to the molded photosensitive assembly jointed board on the outer side of the outer side surface of the molded base jointed board; the pressing distance is the distance of a forming die in the molding process which is convenient for pressing.

In the step of forming the molded base jointed board, the pressing distance is in a numerical range of 0.1-0.6 mm.

In the step of forming the molding base jointed board, the included angle between at least one part of the inner side surface of the molding base jointed board and the optical axis straight line corresponding to the photosensitive element is 15-55 degrees.

Wherein, in the step of forming the molded base jointed board, the size range of the inclination angle gamma is 3-15 degrees.

In the step of preparing the substrate, the substrate is a rigid-flex board, the first region is a rigid region, and the second region is a flexible region.

Wherein the step of forming the molded base panel comprises:

arranging a forming die on the substrate, wherein the forming die is provided with a forming cavity;

feeding the molding material melted into a liquid state or a semi-solid state into the molding cavity;

solidifying and molding the molding material into the molding base jointed board integrally formed on the substrate and the plurality of photosensitive elements; and

and performing a demolding process to enable the forming mold to be separated from the molding base plate.

In the step of arranging the forming mold on the substrate, a plurality of optical window forming blocks and base forming guide grooves positioned around each optical window forming block are arranged in the forming cavity, and the plurality of base forming guide grooves are communicated to form a base forming guide groove splicing plate;

in the step of feeding the molding material melted into the liquid state or the semi-solid state into the molding cavity, the molding material is fed into the base molding guide groove.

According to another aspect of the present invention, there is also provided a method of manufacturing a molded photosensitive member, comprising:

manufacturing a molded photosensitive assembly jointed board according to the molded photosensitive assembly jointed board manufacturing method; and

and cutting the jointed board of the molding photosensitive assembly to obtain the monomeric molding photosensitive assembly.

In the cutting step, the molded photosensitive assembly obtained by cutting is provided with a vertical flat surface, and the vertical flat surface is formed by cutting the molded base jointed plate and the substrate.

In the cutting step, at least one part of the molded photosensitive assembly is provided with two or three cutting surfaces, and the cutting surfaces are formed by cutting the molded base jointed board and the substrate.

Drawings

Exemplary embodiments are illustrated in referenced figures of the drawings. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive.

FIG. 1A is a schematic diagram of a prior art packaged photosensitive assembly;

FIG. 1B is a schematic diagram of a conventional photosensitive assembly forming process;

FIG. 1C is a schematic diagram illustrating a process of demolding a photosensitive assembly in a conventional integrated packaging process;

FIG. 1D is a schematic view of an optical path of a conventional COB-based camera module;

fig. 1E is a schematic view of an optical path of a conventional camera module in an integrated package manner;

FIG. 2 is a schematic block diagram of an apparatus for manufacturing a molded photosensitive member of a camera module according to a first preferred embodiment of the present invention;

fig. 3A is a schematic exploded perspective view of a camera module according to a first preferred embodiment of the present invention;

fig. 3B is a sectional view of the camera module according to the first preferred embodiment of the present invention taken along the length direction thereof;

FIG. 4 is a perspective view of a molded photosensitive member of the camera module according to the first preferred embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of the molded photosensitive assembly of the camera module according to the first preferred embodiment of the present invention taken along the line A-A in FIG. 4;

FIG. 6 is a partially enlarged schematic view illustrating the mold-release facilitating tilt angle of the molded photosensitive member of the camera module according to the above-described first preferred embodiment of the present invention;

fig. 7 is a schematic view of the camera module according to the first preferred embodiment of the present invention for avoiding stray light;

FIG. 8A is a sectional view showing when a liquid molding material is pushed into a base molding guide groove in the molding die of the molded photosensitive member according to the above-described first preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line A-A shown in FIG. 4;

FIG. 8B is a sectional view corresponding to the direction of line A-A in FIG. 4, showing a molding base formed by performing a molding step in the molding die of the apparatus for manufacturing the molded photosensitive member according to the above-described first preferred embodiment of the present invention;

FIG. 8C is a schematic view of a demolding process of the molded photosensitive assembly after being molded according to the above-described first preferred embodiment of the present invention;

FIG. 9 is a schematic structural view showing another modified embodiment of the molded photosensitive member according to the above first preferred embodiment of the present invention;

fig. 10 is a perspective exploded view of a camera module according to a second preferred embodiment of the present invention;

fig. 11 is a sectional view of the camera module according to the second preferred embodiment of the present invention taken along the length direction thereof;

fig. 12 is a cross-sectional view of a variant embodiment of the camera module according to the second preferred embodiment of the invention;

FIG. 13 is a perspective view of a molded photosensitive member of the camera module according to the second preferred embodiment of the present invention;

FIG. 14 is a schematic cross-sectional view of the molded photosensitive assembly of the camera module according to the second preferred embodiment of the invention taken along line C-C of FIG. 13;

FIG. 15 is a partially enlarged schematic view illustrating the mold-release facilitating tilt angle of the molded photosensitive member of the camera module according to the second preferred embodiment of the present invention;

FIG. 16 is a sectional view showing a liquid molding material being pushed into the base panel forming guide grooves in the molding die of the molded photosensitive element according to the second preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line C-C shown in FIG. 13;

FIG. 17 is a sectional view showing a liquid molding material being pushed into the base panel forming guide grooves in the molding die of the molded photosensitive element according to the second preferred embodiment of the present invention, wherein the sectional view is a sectional view corresponding to the direction of line C-C shown in FIG. 13;

FIG. 18 is a sectional view, corresponding to the direction of line E-E in FIG. 13, illustrating a molding step performed in the mold for molding the photosensitive element to form a molded base panel according to the second preferred embodiment of the present invention;

FIG. 19 is a schematic view of a process of releasing the molded photosensitive member according to the second preferred embodiment of the present invention after molding;

FIG. 20 is a schematic perspective view of a panel of the molded photo sensor assembly made by the molding process according to the second embodiment of the present invention;

FIG. 21 is a schematic structural view of a single molded photosensitive element cut from the jointed molded photosensitive element board manufactured by the molding process according to the second embodiment of the present invention;

FIG. 22 is a cross-sectional view of the molded photosensitive member according to another modified embodiment of the above second embodiment of the present invention;

fig. 23 is a schematic cross-sectional view of a camera module according to a further variant of the second preferred embodiment of the invention;

fig. 24 is a schematic cross-sectional view of a camera module according to a further variant of the second preferred embodiment of the invention;

fig. 25 is a schematic structural diagram of the camera module according to the present invention applied to a mobile phone;

FIG. 26 is a partially enlarged schematic view illustrating the draft angle for facilitating demolding of the first example of the molded photosensitive member made by the molding process according to the second embodiment of the present invention;

FIG. 27 is an enlarged, fragmentary, schematic view illustrating the draft angle for facilitating demolding of a second exemplary molded photosensitive member made by the molding process according to the second embodiment of the present invention;

FIG. 28 is an enlarged, fragmentary, schematic view illustrating a third exemplary demolding-facilitating oblique angle of the molded photosensitive member made by the molding process according to the second embodiment of the present invention;

FIG. 29 is a partially enlarged schematic view illustrating a fourth exemplary draft angle for facilitating demolding of the molded photosensitive member made by the molding process according to the above-described second embodiment of the present invention;

FIG. 30 is a partially enlarged schematic view illustrating a fifth exemplary draft angle for facilitating demolding of the molded photosensitive member fabricated by the molding process according to the above-described second embodiment of the present invention;

FIG. 31 is an enlarged, fragmentary, schematic view illustrating a sixth exemplary draft angle for facilitating demolding of the molded photosensitive member made by the molding process according to the second embodiment of the present invention;

FIG. 32 is an enlarged, fragmentary, schematic view illustrating a seventh exemplary draft-facilitating oblique angle of the molded photosensitive member made by the molding process according to the second embodiment of the present invention;

FIG. 33 is a perspective view of a molded panel of photosensitive elements made by a molding process in accordance with one embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

As shown in fig. 1 to 8C, the present invention is a camera module according to a first preferred embodiment of the present invention. The camera module can be applied to various electronic devices, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, and the like, and the camera module is matched with the electronic devices to acquire and reproduce images of target objects.

More specifically, a molded photosensitive element 10 of the camera module 100 and a manufacturing apparatus 200 thereof. The molded photosensitive assembly 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13. The mold base 12 of the present invention is integrally encapsulated and formed on the circuit board 11 and the photosensitive element 13 by the manufacturing apparatus 200, so that the mold base 12 can replace a lens base or a bracket of a conventional camera module, and the lens base or the bracket does not need to be attached to the circuit board by glue like in the conventional encapsulation process.

The camera module 100 further includes a lens 30. Wherein the mold base 12 includes a ring-shaped mold body 121 with a light window 122 in the middle to provide a light path for the lens 30 and the photosensitive element 13. The photosensitive element 13 is operatively connected to the circuit board 11, such as by cob (chip On board) wire bonding, and the photosensitive element 13 is connected to the circuit board 11 and located On the top side of the circuit board 11. The photosensitive element 13 and the lens 30 are respectively assembled on two sides of the mold base 12 and are arranged in optical alignment, so that light passing through the lens 30 can reach the photosensitive element through the optical window 122, and the image pickup module 100 can provide an optical image after photoelectric conversion.

As shown in fig. 3A and 3B, the camera module 100 may be a moving focus camera module having a driver 40 such as a voice coil motor, a piezoelectric motor, etc., and the lens 30 is mounted to the driver 40. The molded base 12 may be used to support the driver 40. The top side of the molded base 12 may also be provided with a filter 50 for filtering light passing through the lens 30, such as an infrared cut filter. In this embodiment of the present invention and the accompanying drawings, a moving focus camera module is taken as an example to illustrate one way in which the present invention can be implemented, but is not limited thereto, and in other embodiments of the present invention, the lens 30 can be mounted to the molded photosensitive assembly 10 without the driver 40, that is, to form a fixed focus module, it should be understood by those skilled in the art that the type of camera module is not a limitation of the present invention, and the camera module 100 can be a fixed focus camera module or a moving focus camera module.

The circuit board 11 includes a substrate 111, and a plurality of electronic components 112 formed on the substrate 111, such as mounted by SMT, wherein the electronic components 112 include, but are not limited to, resistors, capacitors, driving devices, and the like. In this embodiment of the present invention, the mold base 12 integrally covers the electronic component 112, so as to prevent dust and impurities from adhering to the electronic component 112 and further contaminating the photosensitive element 13, which affects the imaging effect, like in a conventional camera module. It is understood that in another modified embodiment, it is also possible that the electronic component 112 is embedded in the substrate 111, i.e., the electronic component 112 may not be exposed. The substrate 111 of the circuit board 111 may be a hard PCB, a soft PCB, a rigid-flex board, a ceramic substrate, or the like. It should be noted that, in the preferred embodiment of the present invention, since the molding base 12 can completely cover the electronic components 112, the electronic components 112 may not be embedded in the substrate 111, and the substrate 111 is only used for forming the conductive traces, so that the finally manufactured molded photosensitive assembly 10 can have a smaller thickness.

In this preferred embodiment of the present invention, the photosensitive element 13 is laminated on a flat laminated region of the circuit board 11 inside the electronic component 112, and the mold base 12 is integrally formed on the circuit board 11 and the photosensitive element 13 through a molding process, that is, the mold base 11 and the circuit board 11 and the photosensitive element 13 are integrally bonded. The photosensitive element 13 has a top surface 131, and the top surface 131 has a central photosensitive region 1311 and a non-photosensitive region 1312 surrounding the photosensitive region 1311. The mold base 12 integrally encapsulates at least a portion of the non-photosensitive region 1312 and the circuit board 11.

Further, as shown in fig. 2, the apparatus 200 for manufacturing the molded photosensitive assembly 10 of the camera module 100 includes a molding die 210, a molding material supply mechanism 220, a die fixing device 230, a temperature control device 250 and a controller 260, wherein the molding material supply mechanism 220 is used for supplying the molding material 14 to the base molding guide 215. The mold fixing device 230 is used for controlling opening and closing of the molding mold 210, the temperature control device 250 is used for heating or cooling the molding material 14, and the controller 260 is used for automatically controlling the operation of the molding material supply mechanism 220, the mold fixing device 230, and the temperature control device 250 in a molding process.

The molding die 210 includes a first die 211 and a second die 212 which can be opened and closed by the die fixing device 230, that is, the die fixing device 230 can separate and closely fit the first die 211 and the second die 212 to form a molding cavity 213, when the dies are closed, the circuit board 11 is fixed in the molding cavity 213, and the liquid molding material 14 enters the molding cavity 213 to be integrally molded on the circuit board 11, and after being cured, the molding base 12 integrally molded on the circuit board 11 and the photosensitive element 13 is formed.

More specifically, the molding module 210 further includes an optical window molding block 214 and a base molding guide groove 215 formed around the optical window molding block 214, when the first and

second molds

211 and 212 are closed, the optical window molding block 214 and the base molding guide groove 215 are extended in the molding cavity 213, and the molding material 14 in a liquid state is filled into the base molding guide groove 215, and the molding material 14 in a liquid state cannot be filled at a position corresponding to the optical window molding block 214, so that the molding material 14 in a liquid state after being solidified at a position corresponding to the base molding guide groove 215 can form the annular molding body 121 of the molding base 12, and the optical window 122 of the molding base 12 is formed at a position corresponding to the optical window molding block 214. The molding material 14 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.

The first and

second molds

211 and 212 may be two molds capable of relative movement, e.g., one of the two molds may be fixed and the other movable; or both molds may be movable, the invention is not limited in this respect. In the example of this embodiment of the invention, the first mold 211 is embodied as a fixed upper mold, while the second mold 212 is embodied as a movable lower mold. The stationary upper mold and the movable lower mold are coaxially arranged, and as the movable lower mold is slidable in the upward direction along a plurality of positioning axes, the molding cavity 213 can be formed to be tightly closed when the upper mold is clamped.

The second mold 212, i.e., the lower mold, may have a circuit board positioning groove 2121, which may be recessed or formed with positioning posts, for mounting and fixing the circuit board 11, and the optical window forming block 214 and the base forming guide groove 215 may be formed at the first mold 211, i.e., the upper mold, to form the forming cavity 213 when the first and

second molds

211 and 212 are closed. And the molding material 14 in a liquid state is injected into the base forming guide groove 215 on the top side of the circuit board 11, thereby forming the molding base 12 on the top sides of the circuit board 11 and the photosensitive element 13.

It is understood that the circuit board positioning groove 2121 may be provided in the first mold 211, i.e., the upper mold, for mounting and fixing the circuit board 11, and the optical window molding block 214 and the base molding guide groove 215 may be formed in the second mold 211 to form the molding cavity 213 when the first and

second molds

211 and 212 are closed. The circuit board 11 may be arranged in the upper mold in a front-side orientation, and the molding material 14 in a liquid state is injected into the base forming guide groove 215 of the bottom side of the circuit board 11 which is inverted, thereby forming the molding base 12 on the bottom side of the circuit board 11 which is inverted.

More specifically, when the first and

second molds

211 and 212 are closed and the molding step is performed, the optical window molding block 214 is overlapped with and closely attached to the light sensing region 1311 of the top surface 131 of the light sensing element 13, so that the molding material 14 in a liquid state is prevented from entering the light sensing region 1311 of the top surface 131 of the light sensing element 13 on the circuit board 11, and the optical window 122 of the mold base 12 can be finally formed at a position corresponding to the optical window molding block 214.

It is understood that the molding surface of the first mold 211 forming the base molding guide 215 may be configured as a flat surface and be in the same plane, so that when the molding base 12 is cured, the top surface of the molding base 12 is flat, thereby providing a flat mounting condition for the driver 40, the lens 30 or other bearing components of the lens, and reducing the tilt error of the camera module 100 after assembly.

It should be noted that the base forming guide groove 215 and the light window forming block 214 may be integrally formed with the first mold 211. Alternatively, the first mold 211 further includes a detachable molding structure, and the molding structure is formed with the base molding guide groove 215 and the light window molding block 214. Thus, the base forming guide groove 215 and the light window forming block 214 can be designed in different shapes and sizes according to the requirements of different shapes and sizes of the molded photosensitive assembly 10, such as the diameter and thickness of the molded base, and the like. In this way, only different molding structures need to be replaced, and the manufacturing apparatus can be adapted to be applied to the molded photosensitive assembly 10 with different specifications. It will be appreciated that the second mold 212 may also include a removable retaining block to provide the recess 2121 with different shapes and sizes to facilitate replacement of the circuit board 11 for different shapes and sizes.

It is understood that the molding material 14 may be a hot melt material such as a thermoplastic material, and the hot melt material in a solid state is heated and melted by the temperature control device 250 to become the molding material 14 in a liquid state. During the molding process, the hot-melt molding material 14 is solidified and formed through a cooling process. The molding material 14 may also be a thermosetting material, and the molding material 14 is changed into a liquid state by heating and melting the thermosetting material in a solid state. During the molding process, the thermosetting molding material 14 is cured by a further heating process and is no longer melted after being cured, thereby forming the molding base 12.

It is understood that in the molding process of the present invention, the molding material 14 may be in the form of a block, a granule, or a powder, which is heated to become liquid in the molding die 210 and then solidified to form the molding base 12.

It is understood that in this embodiment, the molding process of one circuit board 11 is illustrated, and in application, a plurality of independent circuit boards 11 may be molded simultaneously. Alternatively, the panel splicing work described in the second embodiment below may be used.

Fig. 8A to 8C are schematic diagrams illustrating a manufacturing process of the molded photosensitive member 10 of the camera module 100 according to the preferred embodiment of the present invention, and fig. 8A shows that the molding die 210 is in a clamping state, the circuit board 11 to be molded and the molding material 14 in a solid state are fixed in position, and the molding material 14 in a solid state is heated, so that the molding material 14 is fed into the base molding guide groove 215 while being melted into a liquid state or a semi-solid state, and reaches the periphery of the light window molding block 214.

As shown in fig. 8B, when the base forming guide groove 215 is completely filled with the liquid molding material 14, the liquid molding material 14 is cured and formed into the molding base 12 integrally formed on the circuit board 11 and the photosensitive element 13 through a curing process. Taking the molding material 14 as a thermosetting material as an example, the molding material 14 that is heated and melted to be liquid is then subjected to a heating process, so as to be cured and formed.

As shown in fig. 8C, after the molding material 14 is cured to form the molding base 12, the demolding process of the present invention is performed, that is, the mold fixing device 230 moves the first and

second molds

211 and 212 away from each other, so that the optical window forming block 214 is moved away from the molding base 12, and the optical window 122 is formed in the molding base 12.

In the prior art, as shown in fig. 1B, the bottom of the square-column-shaped molding block 4 has a sharp edge, and during the die-drawing process, the sharp edge can generate a large friction with the inner side surface of the package portion 1, thereby damaging the inner side surface of the package portion 1. In the present invention, the structure of the light window forming block 214 of the present invention does not cause damage to the mold base 12.

More specifically, in this embodiment of the present invention, as shown in fig. 8A to 8C, the cross section of the light window forming block 214 is tapered, that is, the light window forming block 214 is tapered like a frustum, and the inside thereof is solid or hollow, that is, it may be like a hollow cover, which can cover the photosensitive element 13 to facilitate the subsequent molding process.

In this example of the invention, it is a solid structure, and the light window molding block 214 has a bottom side press-fit surface 2141, and a linearly extending outer peripheral molding surface extending circumferentially as a base inner side molding surface 2142. The included angle between the base inner side surface molding surface 2142 and the vertical line is a first inclination angle α, which is not an included angle of 0 degree in the prior art, but an acute angle. More specifically, the magnitude of the first included angle α is preferably in the range of 10 ° to 80 °, and more preferably, 30 ° to 55 °.

It can be understood that, as shown in fig. 5 and 6, the molded body 121 of the molded base 12 of the molded photosensitive member 10 of the camera module 100 of the present invention has an inner side surface 124 extending linearly, and the inner side surface 124 and the linear direction of the optical axis Y of the photosensitive element 13 of the molded photosensitive member 10 have the same magnitude of the first inclination angle α.

The value of the first included angle α is not as large as possible, and as shown in fig. 6, the photosensitive element 13 is connected to the circuit board 11 through a set of electrical connection structures. More specifically, the electrical connection structure includes a photosensitive element land 132 provided on the non-photosensitive region 1312 of the photosensitive element 13, a circuit board land 113 provided on the substrate 111 of the circuit board 11, and a lead 15 extending between the photosensitive element land 132 and the circuit board land 113, thereby achieving conductive connection of the photosensitive element 13 and the circuit board 11. The lead 15 is exemplified by, but not limited to, gold wire, silver wire, copper wire, aluminum wire, and the like. The shapes of the photosensitive element lands 132 and the circuit board lands 113 may be, for example, but not limited to, a square shape, a spherical shape, and the like. In order to prevent the lead 15 from being broken due to the crush of the optical window forming block 214 when the optical window forming block 214 is pressed on the photosensitive element in the molding process, the inner side surface 2142 of the base of the optical window forming block 214 must not exceed the highest point of the lead 15. The maximum value of the first included angle α also differs according to the wire bonding manner, and further detailed analysis will be provided in the following specific examples.

As shown in fig. 8A, the cross section of the light window forming block 214 is a trapezoid gradually increasing from bottom to top, and accordingly, the cross section of the light window 122 of the mold base 12 is formed to be a trapezoid gradually increasing from bottom to top, the inner side surface 124 of the mold base 12 does not contact with and the first included angle α preferably ranges from 10 ° to 80 °, and more preferably ranges from 30 ° to 55 °, so as to facilitate mold release without damaging the lead 15. And the light window 122 of the mold base 12 having a trapezoidal cross section can save materials while ensuring strength.

It should be noted that, the size range of the first included angle α of the present invention can be selected, so as to effectively avoid stray light. In the existing camera module packaged by molding, referring to fig. 1E, light is incident from a lens, part of the light reaches the photosensitive chip for performing a photosensitive action, and another part of the light, for example, the light L in fig. 1D is projected to the vertical inner wall of the packaging portion 1, is easily reflected by the inner wall of the packaging portion 1 and then reaches the photosensitive chip 3, and participates in the photoelectric conversion process of the photosensitive chip 3, so that the imaging quality of the camera module is affected. According to the embodiment of the present invention, referring to fig. 7, light is incident from the lens, a part of the light reaches the photosensitive element 13, and another part of the light, for example, the light M in the same direction, is projected to the inner side 124 of the inclined molding base 12 and reflected by the inner side 124 of the molding base 12, so that the reflected light is far away from the photosensitive element 13 and does not reach the photosensitive element 13, and participates in the photosensitive action of the photosensitive element 13, thereby reducing the influence of the reflected stray light on the imaging quality of the camera module.

It is worth mentioning that, in the present invention, the reflectivity of the material surface of the mold base 12 in the light wavelength range of 435 and 660nm is less than 5%. That is, most of the light incident on the surface of the mold base 12 cannot be reflected to form disturbing stray light reaching the photosensitive element 13, thereby significantly reducing the influence of the reflected stray light.

In addition, as shown in the drawing, the mold base 12 has an inner side surface 124 in its inner circumferential direction, an outer side surface 125 in its outer circumferential direction, and an annular top side surface 126. The inner side 124 integrally extends to the top surface 131 of the photosensitive element 13, and the outer side 125 integrally extends to the top surface 1111 of the substrate 111 of the circuit board 11. The first mold 211 of the forming mold 210 is further provided with one or more spacer blocks 216 for forming the outer side 125 of the mold base 12 during the molding process. More specifically, the divider block 216 has a base outer side molding surface 2161 to determine the location and shape of the outer side 125 of the mold base 12 formed by curing the molding material 14 during the molding process. A top side molding surface 217 is provided between the spacer block 216 and the light window molding block 214 to determine the position and shape of the top side 126 of the mold base 12 formed by curing the molding material 14 during the molding process. In the prior art, the outer side surface of the packaging part 1 is also perpendicular to the circuit board, namely the outer side surface molding surface of the base of the separation block of the mold is along the vertical direction, so that in the demolding process, the outer side surface molding surface of the base of the mold always rubs with the outer side surface of the packaging part 1, the demolding operation is inconvenient, and the formed outer side surface of the packaging part 1 is easy to damage.

In the present invention, the base outer side molding surface 2161 has a second inclination angle γ with respect to the vertical direction, and the second inclination angle γ is the same between the outer side 125 of the mold base 12 and the optical axis Y direction, i.e. when the mold base 12 is horizontally arranged, the outer side 125 of the mold base 12 has the second inclination angle γ with respect to the vertical line. The angle is acute for facilitating the demolding, and the second inclination angle γ cannot be too large for the top side 126 of the mold base 12 to have a sufficient size for facilitating the subsequent completion of the lens 30 or the actuator 40. That is, if the second inclination angle γ is too large and both the inner side 124 and the outer side 125 of the mold base 12 are inclined, the length of the top side 126 thereof is too small to stably mount the lens 30 or the actuator 40. Also in this embodiment, the bottom of the actuator 40 has an abutting surface that abuts the top side 126 of the mold base 12, which may cause inconvenience in positioning the actuator 40 when the top side 126 of the mold base 12 is too small, such as smaller than the abutting surface, and may shake and be unstable when the actuator 40 is mounted on the top side 126 of the mold base 12, and thus cannot prevent falling and collision. Therefore, in the present invention, the maximum value of the angle of the second inclination angle γ is preferably not more than 45 °. In addition, the minimum value is to facilitate the demolding operation of the molding process and the processing of the forming mold 210, and therefore, in the present invention, the minimum value of the angle of the second inclination angle γ is preferably not less than 3 °. Therefore, in the present invention, the second inclination angle γ is preferably in the range of 3 ° to 45 °, more preferably 3 ° to 15 °. It should be noted that, as shown in fig. 5, in order to facilitate demolding and pressing the substrate 111 of the circuit board 11, a pressing distance W is formed between the outer side surface 125 of the molded base 12 and the outer edge of the substrate 111 of the circuit board 11 after molding, that is, in a molding process, a region where the separating block 216 is adapted to be pressed on the substrate 111 of the circuit board 11 is a distance between a position where the outer side surface 125 of the molded base 12 integrally extends from the substrate 111 of the circuit board 11 and the outer edge of the substrate 111 of the circuit board 11, for example, the pressing distance W may be 0.1 to 0.6mm, and in a specific example, the pressing distance W may be 0.2 mm.

It can be understood that, due to the presence of the first inclination angle α and the second inclination angle γ in the above ranges, that is, the inner side surface 124 and the outer side surface 125 of the mold base 12 have inclinations, the friction force with the first mold 211 is reduced at the time of demolding, and the mold base 12 is easily pulled out to obtain a better molding state. More specifically, as shown in fig. 8C, when the mold release operation is started after the molding process forms the solidified mold base 12, the optical window forming block 214 and the separating block 216 start to move vertically upward, and the in-base side forming surface 2142 of the optical window forming block 214 and the out-base side forming surface 2161 of the separating block 216 are separated from the inner side 124 and the outer side 125 of the mold base 12, respectively, so that the in-base side forming surface 2142 of the optical window forming block 214 and the out-base side forming surface 2161 of the separating block 216 do not come into frictional contact with the inner side 124 and the outer side 125 of the mold base 12 to damage the inner side 124 and the outer side 125 of the mold base 12, respectively, while facilitating smooth extraction thereof.

Meanwhile, the forming mold 210 forms the shape of the base forming guide groove 215 without a right-angle dead angle and with a proper slope, so that the molding material 14 in a fluid state has better fluidity when entering the base forming guide groove 215. Moreover, the first inclination angle α and the second inclination angle γ are acute angles, unlike the right angle in the prior art, so that the included angle between the top surface 131 of the photosensitive element 13 of the molding photosensitive assembly 10 and the inner side surface 124 of the molding base 12 becomes a more rounded obtuse angle, and the optical window forming block 214 and the separating block 216 do not form a sharp corner to scratch the inner side surface 124 and the outer side surface 125 of the molding base 12. Moreover, the range of the first inclination angle α is set such that the mold base 12 can prevent stray light from affecting the imaging quality of the camera module 100.

As shown in fig. 9, according to another variant embodiment, the filter element 50 may be superimposed on the photosensitive element 13, and then integrally bonded to the filter element 50, the photosensitive element 13 and the mold base 12 of the circuit board 11 by the molding process of the present invention.

Fig. 10 to 21 show the molded photosensitive member 10 of the camera module 100 and the manufacturing process thereof according to the second embodiment of the present invention. In this embodiment, a molded photo sensor assembly panel 1000 is fabricated by panel assembly and then cut to obtain the molded photo sensor assembly 10.

Accordingly, and more particularly, the mold 210 forms a mold cavity 213 when closed, and provides a plurality of optical window molding blocks 214 and one or more base panel molding channels 2150, which correspond to the provision of a plurality of base molding channels 215 in communication, with the base molding channels 215 forming an integral channel.

Before the molding process, a circuit board assembly 1100 is fabricated, which includes a plurality of circuit boards 11 integrally connected to each other, and each of the circuit boards 11 can be connected to the photosensitive element 13 by wire bonding.

When the circuit board panel 1100 with the plurality of light sensing elements 13 attached thereto is placed in the molding cavity 213 and the molding die 210 is in a clamped state, the molding material 14 in a solid state is melted by heat and fed into the base panel molding guide 2150, thereby filling the periphery of each of the light window molding blocks 214. Finally, the liquid molding material 14 is subjected to a curing process to cure and harden the liquid molding material 14 located in the base panel forming guide 2150 to form the molding bases 12 integrally molded on the circuit boards 11 and the photosensitive elements 13 of the circuit board panel 1100, and the molding bases 12 form the integrated molding base panel 1200.

In order to make the molding surface of the first mold 211 closely attached to the circuit board 11 and the photosensitive element 13 and facilitate demolding, the molding surface of the first mold 211, the circuit board 11 and the photosensitive element 13 are further provided with an elastic film 219.

It should be noted that when each of the single molded photosensitive assemblies 10 cut from the molded photosensitive assembly panel 1000 is used to manufacture a focus-enabled camera module, i.e. an auto-focus camera module, the forming mold 210 is further provided with a plurality of driver pin slot forming blocks 218, each of the driver pin slot forming blocks 218 extends into the base panel forming guide groove 2150, so that the liquid molding material 14 does not fill the positions corresponding to the driver pin slot forming blocks 218 during the molding process, so that after the curing step, a plurality of the optical windows 122 and a plurality of driver pin slots 127 are formed in the molded base panel 1200 of the molded photosensitive assembly panel 1000, and the molded base 12 of each of the single molded photosensitive assemblies 10 cut from the molded photosensitive assembly panel 1000 is configured with the driver pin slots 127, therefore, when the moving focus camera module 100 is manufactured, the pins 41 of the driver 40 are connected to the circuit board 11 of the molded photosensitive component 10 by soldering, conductive adhesive bonding, or the like.

It will be appreciated that, in contrast to the above-described process for manufacturing the single molded photosensitive element 10 of the first embodiment, in the panel assembly operation, two adjacent base forming guide grooves 215 for forming two molded bases 12 are substantially integrated together, and a plurality of light window forming blocks 214 are disposed at intervals, so that the molding material 14 finally forms the molded base panel 1200 of a unitary structure.

In the step of fabricating the molded photosensitive member 10 of a single body: the molded photo sensor assembly panel 1000 may be cut to obtain a plurality of independent molded photo sensor assemblies 10 for making a single camera module. Or two or more integrally connected molded photosensitive assemblies 10 can be cut and separated from the molded photosensitive assembly jigsaw 1000 to manufacture a split type array camera module, that is, each camera module of the array camera module is provided with an independent molded photosensitive assembly 10, wherein the two or more molded photosensitive assemblies 10 can be connected to a control main board of the same electronic device, so that the images shot by the plurality of camera modules can be transmitted to the control main board for image information processing by the two or more molded photosensitive assemblies 10 manufactured by the array camera module.

As shown in fig. 22, the molding process of the panel assembly may also be used to fabricate a molded light sensing assembly 10 having two or more of the light windows 122, wherein such a molded light sensing assembly 10 may be used to fabricate an array camera module of a common substrate. That is, taking the molded photosensitive assembly 10 for manufacturing a dual camera module as an example, in a molding process of each circuit board 11 of the circuit board assembly 1100, one circuit board substrate 111 is correspondingly provided with two optical window forming blocks 214, and two base forming guide grooves 215 which are integrally communicated are formed around the two optical window forming blocks 214 which are spaced from each other, so that after the molding process is completed, each circuit board 11 forms a connected molded base which shares one circuit board substrate 111 and has two optical windows 122, and two photosensitive elements 13 and two lenses 30 are correspondingly mounted. And the substrate 111 of the circuit board 11 can be connected to a control motherboard of an electronic device, so that the array camera module manufactured in this embodiment can transmit images taken by a plurality of camera modules to the control motherboard for image information processing.

As shown in fig. 23, according to a variant embodiment, the mold base 12 of the molding process of the invention can be further extended integrally to form a lens mount 16 having a through hole 161 therein adapted to mount the lens 30. It should be noted that the light window forming block 214 and the separating block 216 have only arc-shaped chamfered transitions at the corners, and it is understood that in the above embodiment, the light window forming block 214 and the separating block 216 may be configured to have arc-shaped chamfered transitions at the corners so as to avoid damage to the formed molding base 12 during demolding.

As shown in fig. 24, according to another variant embodiment, before the molding process, the photosensitive element 13 may be provided with an annular blocking element 17, which is attached or coated on the non-photosensitive area 1312 of the top surface 131 of the photosensitive element 13 and has elasticity, so that during the molding process, the light window forming block 214 is pressed against the blocking element 17 to prevent the molding material 14 from entering the photosensitive area 1311 of the photosensitive element 13, and the pressing surface 2141 of the light window forming block 214 is spaced apart from the photosensitive element 13, so that the pressing surface 2141 of the light window forming block 214 does not damage the photosensitive area 1311 of the photosensitive element 13. In a specific example, the blocking element 17 is in the shape of a square ring and is implemented as a step glue, i.e. a glue is applied by coating or painting on the non-photosensitive area 1312 of the top surface 131 of the photosensitive element 13, and then the blocking element 17 is formed after the glue is cured.

Referring to fig. 11-15, to further illustrate the structure of the camera module 100 according to the second embodiment of the present invention, the camera module 100 includes a molded photosensitive component 10. The molded photosensitive assembly 10 includes a circuit board 11, a molded base 12 and a photosensitive element 13. The camera module 100 further includes a lens 30. Wherein the mold base 12 includes a ring-shaped mold body 121 with a light window 122 in the middle to provide a light path for the lens 30 and the photosensitive element 13. The photosensitive element 13 is operatively connected to the circuit board 11, such as by COB wire bonding, the photosensitive element 13 is connected to the circuit board 11 and is located on the top side of the circuit board 11. The photosensitive element 13 and the lens 30 are respectively assembled on two sides of the mold base 12 and are arranged in optical alignment, so that light passing through the mirror 30 can reach the photosensitive element through the optical window 122, and the image pickup module 100 can provide an optical image after photoelectric conversion. Fig. 25 shows an application of the camera module 100 in an intelligent electronic device 300, for example, the camera module 100 is applied to a mobile phone and is arranged along a thickness direction thereof, and one or more camera modules 100 can be respectively arranged in front and at the back.

The difference from the first embodiment is that the top side of the mold base 12 forms a top side groove 123 for mounting the filter 50. Or the topside recess 123 is used to facilitate the support of an additional filter holder 60, the filter holder 60 being used to mount the filter 50, as shown in fig. 12.

Accordingly, the circuit board 11 includes a substrate 111 and a plurality of electronic components 112 formed on the substrate 111, for example, mounted by an SMT process. The light sensing element 13 has a top surface 131, a central light sensing region 1311 and a non-light sensing region 1312 at the outer edge, and the molding base 12 is integrally formed on the circuit board 11 and at least a portion of the non-light sensing region 1312 of the light sensing element 13 and covers the electronic component 112.

The mold base 12 has an inner side 124, an outer side 125 and a top side 126, i.e. the inner side 124 along its inner circumferential direction, the outer side 125 along its outer circumferential direction and the top side 126 in the form of a ring defining the shape of the ring-shaped mold body 121.

In this embodiment, the inner side 124 of the mold base 12 is a flat inner surface extending non-linearly, but an inner surface extending in a bent shape, and more particularly, it further includes a first part inner side 1241, a second part inner side 1242 and a third part inner side 1243 extending integrally. As shown in the figure, the first partial inner side surface 1241 extends obliquely integrally with the non-photosensitive area 1312 of the photosensitive element 13, the second partial inner side surface 1242 extends substantially horizontally with respect to the first partial inner side surface 1241, and the third partial inner side surface 1243 extends obliquely integrally with respect to the second partial inner side surface 1242, which are vertically aligned with each other in the image capturing module 100. The annular mold body 121 of the mold base 12 is correspondingly formed with a base portion 121a at a bottom side, and a step portion 121b integrally extended from the base portion 121 a. The step portion 121b may form an integral annular step, or may be multi-step, such as three-step, and one side of the molding base has no protruding step. The stepped portion 121b has a larger inner diameter with respect to the abutment portion 121 a. An inner surface of the base portion 121a, i.e., the first partial inner side surface 1241 of the inner side surface 124 of the mold base 12, a top surface of the base portion 121a, i.e., the second partial inner side surface 1242 of the inner side surface 124 of the mold base 12, an inner surface of the step portion 121b, i.e., the third partial inner side surface 1243 of the inner side surface 124 of the mold base 12, and a top surface of the step portion 121b, i.e., the top side surface 126 of the mold base 12.

It can be understood that the first partial inner side surface 1241 has a first inclination angle α with respect to a straight line direction of the optical axis Y of the camera module 100, that is, when the camera modules 100 are vertically aligned, the first partial inner side surface 1241 has the first inclination angle α with respect to a vertical line. The extending direction of the second part inner side surface 1242 is substantially perpendicular to the linear direction of the optical axis Y of the camera module 100. A third inclination angle β is formed between the third part inner side surface 1243 and a straight line direction of the optical axis Y of the camera module 100, that is, when the camera modules 100 are arranged in the vertical direction, the third inclination angle β is formed between the third part inner side surface 1243 and a vertical line.

The outer side surface 125 of the molding base 12 extending to the top surface 1111 of the substrate 111 of the circuit board 11 may include one or more outer peripheral surfaces 1251, wherein in the second embodiment of the present invention, since the integrally connected molding photosensitive assembly panels 1000 may be manufactured and finally cut to obtain a single molding photosensitive assembly 10, wherein some of the outer peripheral surfaces 1251 of the outer side surface 125 of the molding base 12 of the molding photosensitive assembly 10 in the peripheral direction are cut to be vertical flat surfaces, and at least one outer peripheral surface 1251 is defined by the base outer side surface molding surface 2161 of the partition block 216 of the molding die 210 in the molding process, as shown in fig. 21, the front outer peripheral surface 1251 of the cut molding photosensitive assembly 10 is formed by the base outer side surface molding surface 2161 of the partition block 216 corresponding to the molding die 210, the front outer peripheral surface 1251 has a second inclination angle γ with respect to a straight direction of the optical axis Y of the camera module 100, that is, when the camera modules 100 are arranged in a vertical direction, the front outer peripheral surface 1251 has the second inclination angle γ with respect to a vertical line. In addition, the mold base 12 is formed with one or more driver pin grooves 127 each having a pin groove wall surface 1271, and the pin groove wall surface 1271 has a fourth inclination angle δ with respect to a straight line direction of the optical axis Y of the camera module 100, that is, when the camera module 100 is arranged in a vertical direction, the pin groove peripheral surface 1271 has the fourth inclination angle δ with respect to a vertical line.

It should be noted that, similar to the above embodiment, as shown in fig. 14, in order to facilitate demolding and pressing the substrate 111 of the circuit board 11, a pressing distance W between a position where the outer side surface 125 of the mold base 12 integrally extends from the substrate 111 of the circuit board 11 and an outer edge of the substrate 111 of the circuit board 11 is set to be 0.1-0.6 mm, for example, the pressing distance W may be 0.2 mm.

In this embodiment of the invention, the first inclination angle α ranges from 10 ° to 80 °, and in some embodiments, it may be 10 ° to 30 °, or 30 ° to 45 °, or 45 ° to 55 °, or 55 ° to 80 °. The second inclination angle γ ranges from 3 ° to 45 °, and in some embodiments, may be 3 ° to 15 °, or 15 ° to 30 °, or 30 ° to 45 °. The third angle of inclination β ranges from 3 ° to 30 °, and in some embodiments, it may be 3 ° to 15 °, or 15 ° to 20 °, or 20 ° to 30 °. The fourth inclination angle δ ranges from 3 ° to 45 °, and in some embodiments, it may be 3 ° to 15 °, or 15 ° to 30 °, or 30 ° to 45 °.

The light window forming block 214 and the separating block 216 are frustum-shaped, and the edges and corners thereof may be linearly transited or transited in an arc shape to be relatively rounded, but the extending angle range of each surface is approximately within the specific range.

Correspondingly, the first mold 211 of the forming mold 210 is configured with an integral forming surface for forming the mold base 12 of the above structure. More specifically, as shown in the drawing, the light window molding block 214 includes a bottom-side indenter section 214a and a top-side groove molding section 214 b. The swage portion 214a and the groove forming portion 214b are used together to form the light window 122 of the mold base 12, and the groove forming portion 214b is used to form the top side groove 123 on the top side of the mold base 12.

It is understood that the light window molding block 214 includes a pressing surface 2141 on the bottom side and a base inner side molding surface 2142 in the peripheral direction. Further, in this embodiment, the base inner side molding surface 2142 of the light window molding block 214 includes a first portion molding surface 21421, a second portion molding surface 21422 and a third portion molding surface 21423 which are integrally extended. Respectively for forming the first part inner side 1241, the second part inner side 1242 and the third part inner side 1243, which extend integrally inside the mold base 12.

In this embodiment of the present invention, as shown in the drawing, the camera module 100 is placed vertically, and the straight direction of the optical axis Y of the photosensitive element 13 of the camera module 100 is parallel to a vertical line. Correspondingly, the first portion molding surface 21421 has the first inclination angle α with respect to the vertical line in the range of 10 ° to 88 °, and the third portion molding surface 21423 has the third inclination angle β with respect to the vertical line in the range of 3 ° to 30 °.

Accordingly, the bottom side surface of the head pressing portion 214a forms the pressing surface 2141 of the optical window molding block 214, the outer side surface of the head pressing portion 214a forms the first portion molding surface 21421 of the optical window molding block 214, the bottom side surface of the groove molding portion 214b forms the second portion molding surface 21422 of the optical window molding block 214, the outer side surface of the groove molding portion 214b forms the third portion molding surface 21423 of the optical window molding block 214, and the head pressing portion 214a and the groove molding portion 214b are configured to be frustum-shaped. The presser head portion 214a and the groove forming portion 214b have a trapezoidal cross section, thereby preventing damage to the elastic film 219. More specifically, taking the groove forming portion 214b as an example, the forming block in the prior art has a sharp corner, and during the demolding process, the elastic film layer 219 is easily punctured at the position where the second part forming surface 21422 and the third part forming surface 21423 meet. And the groove forming part 214b has an obtuse angle between the second partial forming surface 21422 and the third partial forming surface 21423 at the bottom side and the outer circumferential side, respectively, thereby facilitating the mold release of the groove forming part 214 b.

The partition block 216 has a base outer surface molding surface 2161 corresponding to at least one of the outer surfaces 1251 of the molded photosensitive assembly 10, and the second inclination angle γ is preferably in the range of 3 ° to 45 ° with respect to the vertical line.

The plurality of driver lead groove forming blocks 218 further provided by the forming mold 210 have a lead groove side forming surface 2181 having the fourth inclination angle δ with the vertical line, which is preferably in the range of 3 ° to 30 °.

Accordingly, the above-described configuration of the first mold 211 of the molding mold 210 of the present invention and the mold base have the following advantages.

In a first aspect, the operation of demolding the light window forming block 214 and the separating block 216 configured with the first mold 211 is facilitated. That is, since the first inclination angle α, the second inclination angle γ, the third inclination angle β and the fourth inclination angle δ which are acute angles for facilitating mold release are provided, friction between the light window forming block 214 and the partition block 216 and the mold base 12 is reduced, and the mold base 12 can be easily pulled out, and a preferable molding state can be obtained. As shown in fig. 19, as long as the optical window forming block 214 and the separating block 216 are separated from the mold base 12 and undergo relative up and down displacement, the optical window forming block 214 and the separating block 216 no longer generate friction with the mold base 12, that is, the base inner

side forming surfaces

21421, 21422 and 21423 of the optical window forming block 214 are separated from the

inner side surfaces

1241, 1242 and 1243 of the mold base 12, and the base outer side forming surface 2161 of the separating block 216 is separated from the outer side surface 125 of the mold base 12, so that the optical window forming block 214 and the separating block 216 can be more smoothly pulled out from the mold base 12, thereby reducing the influence on the molding state of the mold base 12.

In a second aspect, the forming mold 210 is shaped to form the base panel forming guide 2150 without dead corners, and has a suitable slope to make the molding material 14 in a fluid form more fluid when entering the base panel forming guide 215. That is, the molding material 14 is generally in a fluid state during the molding process, and needs to flow in the molding cavity 213, and the size of the flow area affects the filling effect. The configuration of the base panel forming guide 2150 of the present invention allows for increased flow rates and thus shorter molding times and better facilitates the molding of the molded base 12

In the third aspect, the first inclination angle α, the second inclination angle γ, the third inclination angle β and the fourth inclination angle δ, which are acute angles, are not right angles as in the prior art, and the light window forming block 214 and the separating block 216 do not form sharp edges to scratch the inner side surface 124 and the outer side surface 125 of the mold base 12.

In a fourth aspect, the acute angles of the first, second, third and fourth angles of inclination α, γ, β, δ are set such that the inner side surface 124, at least a portion of the outer side surface 125 and the leadthrough wall 1271 of the mold base 12 are inclined, resulting in a relatively small volume of the mold base 12 and a reduced overall volume of the mold material 14 to be filled.

In the fifth aspect, the ranges of the first inclination angle α and the third inclination angle β of the acute angles are set so that the molding base 12 can prevent stray light from affecting the imaging quality of the camera module 100. More specifically, it reduces the possibility of stray light reaching the light-sensitive element 13. That is, when the stray light in the image capturing module 100 enters the inner side surface 124 of the mold base 12 extending in a bending manner, the first partial inner side surface 1241 and the third partial inner side surface 1243 in an inclined shape and the second partial inner side surface 1242 extending in a horizontal direction reflect the entering stray light to a position away from the photosensitive element 13, so that the stray light is not easy to reach the photosensitive element 13 and affects the imaging quality of the image capturing module 100.

In addition, the ranges of the first inclination angle α, the second inclination angle γ, and the third inclination angle β are also set to enable the mold base 12 to perform its supporting function, such as ensuring that the top side 126 has a sufficient size to facilitate the completion of the lens 30 or the driver 40, and ensuring that the second portion inner side 1242 has a sufficient size to facilitate the installation of the optical filter 50 or the optical filter base 60. I.e. the first inclination angle a, the second inclination angle y, the third inclination angle β cannot be too large, resulting in that the length of the top side 126 thereof, for example, is too small to provide a stable mounting position for the lens 30 or the actuator 40. And the first inclination angle α also needs to be considered that the light window molding block 214 cannot be pressed to the lead wire 15, resulting in breakage of the lead wire 15.

Next, the ranges of the first inclination angle α, the second inclination angle γ, and the third inclination angle β will be specifically described with seven examples of the second embodiment shown in fig. 26 to 32. In these seven examples, the first portion inside surface 1241 of the mold base 12 has the first inclination angle α with respect to a vertical line, the second inclination angle γ is provided between at least one outer peripheral surface 1251 of the outside surface 125 of the mold base 12 in the peripheral circulation direction and a vertical line, and the third portion inside surface 1243 of the inside surface 124 of the mold base 12 has the third inclination angle β with respect to a vertical line. A distance between a position where the first portion inside surface 1241 of the mold base 12 is connected to the photosensitive element 13 and a position where the first portion inside surface 1241 is connected to the second portion inside surface 1242 is L1, a distance between a position where the first portion inside surface 1241 is connected to the second portion inside surface 1242 and a position where the top surface 126 is connected to the third portion inside surface 1243 is L2, a length of the top surface 126 of the mold base 12 is L3, a distance between the top surface 126 of the mold base 12 and a top surface of the substrate 111 of the circuit board 11 is H1, a distance between the second portion inside surface 1242 and a top surface of the substrate 111 of the circuit board 11 is H2, and a distance between a highest point of the lead 15 and the photosensitive element 13 is H3.

As shown in fig. 26 to 28, in these three examples, the wire bonding connection between the photosensitive element 13 and the circuit board 11 is from the photosensitive element 13 to the circuit board 11. That is, by disposing the photosensitive element connecting pad 132 on the photosensitive element 13, a wire bonding jig firstly forms a first end 151 of the lead 15 connected to the photosensitive element connecting pad 132 by wire bonding at the top end of the photosensitive element connecting pad 132, then raises the preset position, then moves toward the circuit board connecting pad 113 and descends again to form a second end 152 of the lead 15 connected to the circuit board connecting pad 113 at the top end of the circuit board connecting pad 113, so that the lead 15 extends in a curved shape, and the top end of the lead 15 cannot be crushed by the first part of the base inner side surface forming surface 21421 of the optical window forming block 214 during a molding process, so that the size of the first inclination angle α has a maximum limit value.

As shown in fig. 29 to 32, in these four examples, the wire bonding connection between the photosensitive element 13 and the circuit board 11 is from the circuit board 11 to the photosensitive element 13. That is, by providing the circuit board land 113 on the circuit board 11, a wire bonding jig first forms the second end 152 of the lead 15 connected to the circuit board land 113 by wire bonding at the top end of the circuit board land 113, then raises the preset position, then translates toward the circuit board land 113 and forms the opposite first end 151 of the lead 15 connected to the light sensing element land 132 at the top end of the light sensing element land 132, so that the lead 15 extends in a curved shape, and the top end of the lead 15 cannot be crushed by the first partial base inner side surface molding surface 21421 of the light window molding block 214 during the molding process, so that the size of the first inclination angle α has the maximum limit value. In addition, the second and third inclination angles γ and β should not be excessively large in order to provide the second part inner side surface 1242 and the top side surface 126 with sufficient dimensions. That is, the ranges of the second inclination angle γ and the third inclination angle β have a constraint relationship with the above parameters L1, L2, L3, H1, H2, and H3.

As shown in fig. 26, the α angle is 10 °, the β angle is 3 °, and the γ angle is 3 °. Wherein the L1 value is 0.23mm, the L2 value is 1.09mm, the L3 value is 0.99mm, the H1 value is 1.30mm, the H2 value is 0.93mm, and the H3 value is 0.17 mm. The first inclination angle α, the second inclination angle γ, and the third inclination angle β are set to a suitable minimum value.

As shown in fig. 27, the α angle is 30 °, the β angle is 20 °, and the γ angle is 30 °. Wherein the L1 value is 0.38mm, the L2 value is 1.25mm, the L3 value is 0.21mm, the H1 value is 1.34mm, the H2 value is 0.93mm, and the H3 value is 0.17 mm.

As shown in fig. 28, the α angle is 55 °, the β angle is 30 °, and the γ angle is 45 °. Wherein the L1 value is 0.54mm, the L2 value is 0.39mm, the L3 value is 0.42mm, the H1 value is 0.86mm, the H2 value is 0.38mm, and the H3 value is 0.17 mm. Wherein the maximum value of the first inclination angle alpha is 55 degrees when the wire bonding connection mode between the photosensitive element 13 and the circuit board 11 is from the photosensitive element 13 to the circuit board 11.

More specifically, as shown in fig. 29, α angle is 10 ° in size, β angle is 30 ° in size, and γ angle is 45 ° in size. Wherein the L1 value is 0.23mm, the L2 value is 1.28mm, the L3 value is 0.82mm, the H1 value is 1.30mm, the H2 value is 0.93mm, and the H3 value is 0.13 mm. The magnitude of the first inclination angle α is a suitable minimum value, and the magnitudes of the second inclination angle γ and the third inclination angle β are suitable maximum values.

As shown in fig. 30, the α angle is 30 °, the β angle is 20 °, and the γ angle is 30 °. Wherein the L1 value is 0.38mm, the L2 value is 1.24mm, the L3 value is 0.21mm, the H1 value is 1.34mm, the H2 value is 0.93mm, and the H3 value is 0.13 mm.

As shown in fig. 31, the α angle is 45 °, the β angle is 15 °, and the γ angle is 15 °. Wherein the L1 value is 0.73mm, the L2 value is 0.65mm, the L3 value is 1.88mm, the H1 value is 1.33mm, the H2 value is 1.00mm, and the H3 value is 0.13 mm.

As shown in fig. 32, the α angle is 80 °, the β angle is 3 °, and the γ angle is 3 °. Wherein the L1 value is 1.57mm, the L2 value is 0.15mm, the L3 value is 2.19mm, the H1 value is 1.45mm, the H2 value is 0.54mm, and the H3 value is 0.13 mm. When the wire bonding connection between the photosensitive element 13 and the circuit board 11 is from the circuit board 11 to the photosensitive element 13, the highest point of the lead 51 is lowered because the lead does not need to be raised as in the wire bonding manner in fig. 26 to 28, and the maximum value of the first inclination angle α is 80 °. And in this example the magnitude of the second inclination angle gamma and the third inclination angle beta are suitably minimal.

It should be understood that the specific values of the parameters L1, L2, L3, H1, H2 and H3 are only used as examples and are not intended to limit the present invention, and in practical applications, the parameters may vary according to the specification requirements of the camera module 100 and the molded photosensitive assembly 10.

According to this embodiment of the present invention, as can be shown by the data exemplified above, the appropriate range of the first inclination angle α is 10 ° to 80 °, the appropriate range of the second inclination angle γ is 3 ° to 45 °, and the appropriate range of the third inclination angle β is 3 ° to 30 °.

Further, fig. 33 is a schematic perspective view of a molded panel of photosensitive elements manufactured by a molding process according to an embodiment of the invention. In this embodiment, a molded panel of photosensitive elements, comprising: a substrate 3300, a plurality of light sensing elements 3321, and a molded base panel 3322. The substrate 3300 has a first region 3320 and a second region 3310. Wherein the second region 3310 has a hollowed-out portion. And a plurality of photosensitive elements 3321 mounted on the first region 3320 of the substrate 3300. Molded base panels 3322 are formed from a molding material by a molding process on first region 3320 of substrate 3300 and on plurality of light sensing elements 3321. Wherein the molding material surrounds each of the light sensing elements 3321 corresponding to the first region 3320, the molding material surrounding each of the light sensing elements 3321 extends toward and contacts the surrounding light sensing element 3321 and each extends flatly away from the surrounding light sensing element 3321 such that the molding material forms an integral molding base panel 3322.

The second region 3310 includes a plurality of connectors (e.g.,

connectors

3311, 3312, 3313, 1134). The connectors are arranged in rows. Each second region 3310 may include one or two rows of connectors. Two adjacent connectors in the same row have a gap between them. For example, two

adjacent connectors

3311, 3313 in the same row have a gap 3315 between them.

The plurality of photosensitive elements 3321 are arranged in rows, and the molded base panels 3322 are formed on the first region 3320 of the substrate 3300 corresponding to two adjacent rows of photosensitive elements 3321, forming a molded photosensitive assembly panel having an integral structure.

The molded photo-sensing component panel has a first side 3323 and a second side 3324 opposite the first side 3323, and the two adjacent rows of photo-sensing elements include a plurality of first photo-sensing elements disposed adjacent to the first side 3323 and along the first side 3323 and a plurality of second photo-sensing elements disposed adjacent to the second side 3324 and along the second side 3324. The plurality of connectors includes a plurality of first connectors arranged in a row and a plurality of second connectors arranged in a row, the first side 3323 of the molded light sensitive component panel 3322 connects the plurality of first connectors and wherein each first connector corresponds to a respective one of the first light sensitive elements, the second side 3324 of the molded light sensitive component panel 3322 connects the plurality of second connectors and wherein each second connector corresponds to a respective one of the second light sensitive elements.

In one embodiment, a plurality of the molded photo component panels are formed on one of the base panels 3300. Each of the

first connectors

3312, 3314 has a first end and an opposite second end, and the first ends of the

first connectors

3312, 3314 connect to the first side 3323 of the molded photo component panel and the second ends of the

first connectors

3312, 3314 connect to the

second connectors

3311, 3313. Alternatively, the second end of the first connector may also be connected to an edge of the substrate 3300. Each of the

second connectors

3311, 3313 has a first end and an opposite second end, and the first ends of the

second connectors

3311, 3313 are connected to the second side 3324 of the molded photo component panel and the second ends of the

second connectors

3311, 3313 are connected to the

first connectors

3312, 3314. Alternatively, the second end of the second connector may also be connected to an edge of the substrate 3300.

Further, in one embodiment, the molded photo component panel also has a third side 3325 intersecting the first side 3323 and the second side 3324, the third side 3325 being connected to an extension 3326.

Further, in one embodiment, a plurality of the molded photo component panels are formed on one of the base plates 3300, and the extensions 3326 connected to the respective molded photo component panels are joined together.

In one embodiment, the molded base panels 3322 form a plurality of optical windows, each corresponding to a location in the plurality of light sensing elements 3321.

In one embodiment, the included angle between at least one part of the inner side surface of the molding base makeup and the optical axis line corresponding to the photosensitive element is 10-80 degrees.

In one embodiment, the mold base imposition has an outer side surface linearly extending from the rigid region of the rigid-flexible board, wherein the outer side surface of the mold base imposition and the optical axis line corresponding to the photosensitive element have an inclination angle γ for facilitating mold release, and the size of γ ranges from 3 ° to 45 °.

In one embodiment, a pressing distance is reserved between the rigid areas corresponding to the molded photosensitive assembly jointed boards on the outer side of the outer side surface of the molded base jointed board; the pressing distance is the distance of a forming die in the molding process which is convenient for pressing. The preferable numerical range of the pressing distance is 0.1-0.6 mm.

In one embodiment, the preferable range of the included angle between at least a part of the inner side surface of the molding base makeup and the optical axis line corresponding to the photosensitive element is 15 ° to 55 °.

In one embodiment, the preferred range of the inclination angle γ is 3 ° to 15 °.

In one embodiment, the substrate is a rigid-flex board, the first region is a rigid region, and the second region is a flexible region.

Further, according to an embodiment of the present invention, there is provided a molded photosensitive element, wherein the molded photosensitive element is obtained by cutting the molded photosensitive element panel described above.

In one embodiment, the cut molded photosensitive component has a vertical flat surface formed by cutting the molded base panel and the substrate.

In one embodiment, at least a portion of the molded photosensitive component has two or three cut surfaces (see FIG. 21) formed by cutting the molded base panel and the substrate.

Further, in an embodiment, there is provided a method for manufacturing a molded panel of a photosensitive assembly, including:

In one embodiment, in the step of preparing the substrate, the second region includes a plurality of connectors arranged in a row; and there is a space between two adjacent connectors in the same row.

In one embodiment, the step of preparing the substrate, the second area includes one or two rows of connectors.

In one embodiment, in the step of mounting a plurality of photosensitive elements, the plurality of photosensitive elements are arranged in a row;

In one embodiment, the step of forming the molded base panel includes forming the molded light sensing component panel with a first side and an opposite second side, and the two adjacent rows of light sensing elements include a plurality of first light sensing elements adjacent to and aligned along the first side and a plurality of second light sensing elements adjacent to and aligned along the second side.

In one embodiment, in the step of forming the molded base panel, the plurality of connectors includes a plurality of first connectors arranged in a row and a plurality of second connectors arranged in a row, the first side of the molded photo-sensor module panel is connected to the plurality of first connectors and each of the first connectors corresponds to a respective one of the first photo-sensors, and the second side of the molded photo-sensor module panel is connected to the plurality of second connectors and each of the second connectors corresponds to a respective one of the second photo-sensors.

In one embodiment, the step of forming the molded base panel forms a plurality of the molded photosensitive element panels on a substrate.

In one embodiment, the step of forming the molded base panel includes the steps of forming the molded base panel with each of the first connectors having a first end and an opposite second end, the first ends of the first connectors being attached to a first side of the molded photo-sensor assembly panel, the second ends of the first connectors being attached to a second connector or an edge of the substrate; each of the second connectors has a first end and an opposite second end, and the first ends of the second connectors are connected to the second side of the panels of the molded photo-responsive component, and the second ends of the second connectors are connected to the first connectors or the edges of the substrate.

In one embodiment, in the step of forming the molded base panel, the molded photo component panel further has a third side intersecting the first side and the second side, the third side being connected to an extension.

In one embodiment, the step of forming a molded base panel forms a plurality of the molded photosensitive component panels on a substrate, each of the molded photosensitive component panels further having a third side intersecting the first side and the second side and the third side connecting an extension; wherein the extensions connected to the respective panels of the plurality of molded photosensitive assemblies are joined together.

In one embodiment, the step of forming the molded base panel forms a plurality of light windows, each light window corresponding to a location of one of the plurality of light sensing elements.

In one embodiment, in the step of forming the molded base plate, an included angle between at least a part of an inner side surface of the molded base plate and an optical axis line corresponding to the photosensitive element is 10 ° to 80 °.

In one embodiment, in the step of forming the molded base plate, the molded base plate has an outer side surface linearly extending from the rigid region of the rigid-flexible board, wherein an inclined angle γ for facilitating mold release is formed between the outer side surface of the molded base plate and the optical axis line corresponding to the photosensitive element, and the size of γ ranges from 3 ° to 45 °.

In one embodiment, in the step of forming the molded base plate, a pressing distance is reserved between the rigid regions corresponding to the molded photosensitive assembly plate and the outer side of the outer side surface of the molded base plate; the pressing distance is the distance of a forming die in the molding process which is convenient for pressing.

In one embodiment, in the step of forming the molded base panels, the pressing distance is in a range of 0.1 to 0.6 mm.

In one embodiment, in the step of forming the molded base plate, an included angle between at least a part of an inner side surface of the molded base plate and an optical axis line corresponding to the photosensitive element is 15 ° to 55 °.

In one embodiment, in the step of forming the molded base panels, the inclination angle γ ranges from 3 ° to 15 °.

In one embodiment, in the step of preparing the substrate, the substrate is a rigid-flex board, the first region is a rigid region, and the second region is a flexible region.

In one embodiment, the step of forming the molded base panels comprises:

In one embodiment, in the step of disposing a molding die on the substrate, a plurality of optical window molding blocks and a base molding guide groove around each optical window molding block are disposed in the molding cavity;

Further, in one embodiment, there is provided a method of manufacturing a molded photosensitive assembly, including:

In one embodiment, in the cutting step, the cut molded photosensitive assembly is provided with a vertical flat surface, and the vertical flat surface is formed by cutting the molded base jointed board and the substrate.

In one embodiment, in the cutting step, at least a portion of the molded photosensitive component is provided with two or three cut surfaces (see fig. 21) formed by cutting the molded base panel and the substrate.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A molded panel of photosensitive components, comprising:

a substrate having a first region and a second region, wherein the second region has a hollowed-out portion and includes a plurality of connectors;

a plurality of photosensitive elements mounted on the first region of the substrate; and

a molded base panel formed from a molding material over the first region of the substrate and over the plurality of light sensing elements,

the molding material surrounds each photosensitive element corresponding to the first area, extends towards and contacts the surrounding photosensitive element and extends away from the surrounding photosensitive element, so that the molding material forms an integral molding base jointed board.

2. The molded light sensing component panel of claim 1, wherein the plurality of connectors of the second region are arranged in rows; and there is a space between two adjacent connectors in the same row.

3. The molded light assembly panel of claim 2, wherein the second region includes one or two rows of connectors.

4. The molded light sensing component panel of claim 3, wherein the plurality of light sensing elements are arranged in rows, the molded base panel being formed on the first region of the substrate corresponding to two adjacent rows of light sensing elements, forming the molded light sensing component panel with a unitary structure.

5. The molded light sensing component panel of claim 4, wherein the molded light sensing component panel has a first side and an opposite second side, and the two adjacent rows of light sensing elements comprise a first plurality of light sensing elements disposed adjacent to and along the first side and a second plurality of light sensing elements disposed adjacent to and along the second side.

6. The molded light sensing component panel of claim 5, wherein the plurality of connectors comprises a plurality of first connectors arranged in a row and a plurality of second connectors arranged in a row, wherein a first side of the molded light sensing component panel is connected to the plurality of first connectors and wherein each first connector corresponds to a respective one of the first light sensing elements, and wherein a second side of the molded light sensing component panel is connected to the plurality of second connectors and wherein each second connector corresponds to a respective one of the second light sensing elements.

7. The molded light sensing component panel of claim 6, wherein a plurality of the molded light sensing component panels are formed on one of the substrates.

8. The molded light sensing component panel of claim 6, wherein each of the first connectors has a first end and an opposite second end, and the first ends of the first connectors are connected to a first side of the molded light sensing component panel, and the second ends of the first connectors are connected to a second connector or an edge of the substrate; each of the second connectors has a first end and an opposite second end, and the first ends of the second connectors are connected to the second side of the panels of the molded photo-responsive component, and the second ends of the second connectors are connected to the first connectors or the edges of the substrate.

9. The molded light sensing component panel as defined in claim 5, further comprising a third side intersecting the first side and the second side, the third side being connected to an extension.

10. The molded photosensitive component panel of claim 5, wherein a plurality of the molded photosensitive component panels are formed on one of the base plates, each of the molded photosensitive component panels further having a third side intersecting the first and second sides and the third side connecting an extension; wherein the extensions connected to the respective panels of the plurality of molded photosensitive assemblies are joined together.

11. The molded light sensing component panel of claim 1, wherein the molded base panel forms a plurality of light windows, each light window corresponding to a location of one of the plurality of light sensing elements.

12. The molded light sensing assembly panel of claim 11, wherein an angle α between the inner surface of the base of the molded base panel and a line of the optical axis corresponding to the light sensing element is 10 ° to 80 °.

13. The molded light sensing component panel as defined in claim 1, wherein the substrate is a rigid-flexible board, the molded base panel has an outer side integrally and linearly extending from a rigid region of the rigid-flexible board, wherein the outer side of the molded base panel and a line of an optical axis corresponding to the light sensing element have an inclination angle γ therebetween for facilitating mold release, wherein γ ranges from 3 ° to 45 °.

14. The molded light sensing component panel as defined in claim 1 wherein the rigid regions of the molded light sensing component panel are spaced outwardly of the outer side of the molded base panel by a press fit distance; the pressing distance is the distance of a forming die in the molding process which is convenient for pressing.

15. The molded light sensing component panel of claim 14, wherein the stitching distance has a value in the range of 0.1 mm to 0.6 mm.

16. The molded light sensing assembly panel of claim 12, wherein an angle α between the inner base surface of the molded base panel and a line of the optical axis corresponding to the light sensing element is 10 ° -55 °.

17. The molded photo sensitive component panel as defined in claim 13, wherein the tilt angle γ is in a range of 3 ° -15 °.

18. The molded light sensing component panel of any one of claims 1-17, wherein the first region is a rigid region and the second region is a flexible region.

19. A molded light sensitive component obtained by cutting the molded light sensitive component panel of any one of claims 1 to 17.

20. The molded photosensitive component of claim 19, wherein the cut molded photosensitive component has a vertical flat surface formed by cutting the molded base panel and the substrate.

21. The molded light sensitive component of claim 19, wherein at least a portion of the molded light sensitive component has two or three cut surfaces formed by cutting the molded base panel and the substrate.

22. A camera module comprising the molded photosensitive component of any one of claims 19-21.

23. A method for manufacturing a jointed board of a molded photosensitive component is characterized by comprising the following steps:

preparing a substrate, wherein the substrate is provided with a first area and a second area, the second area is provided with a hollow part and comprises a plurality of connectors arranged in a row;

24. The method of making a molded panel of photosensitive components of claim 23, wherein said step of preparing a substrate includes providing a space between two adjacent connectors in a same row.

25. The method of making a molded panel of photosensitive components of claim 24, wherein said step of preparing a substrate includes said second region including one or two rows of connectors.

26. The method of constructing a molded panel of photosensitive assemblies as claimed in claim 25, wherein said step of mounting a plurality of photosensitive elements, said plurality of photosensitive elements are arranged in rows;

27. The method as defined in claim 26, wherein said step of forming a molded base panel includes providing said molded base panel with a first side and an opposite second side, and wherein said two adjacent rows of photosensitive elements include a plurality of first photosensitive elements disposed adjacent said first side and along said first side, and a plurality of second photosensitive elements disposed adjacent said second side and along said second side.

28. The method as defined in claim 27, wherein the step of forming the molded base panel includes a plurality of first connectors arranged in rows and a plurality of second connectors arranged in rows, the first side of the molded base panel is connected to the plurality of first connectors and each of the first connectors corresponds to a respective one of the first photosensitive elements, the second side of the molded base panel is connected to the plurality of second connectors and each of the second connectors corresponds to a respective one of the second photosensitive elements.

29. The method as defined in claim 28, wherein said step of forming a molded base panel forms a plurality of said molded light sensing assembly panels on a substrate.

30. The method of making a molded light sensitive component panel as defined in claim 28 wherein, in the step of forming the molded base panel, each of the first connectors has a first end and an opposite second end, and the first ends of the first connectors are connected to a first side of the molded light sensitive component panel, and the second ends of the first connectors are connected to a second connector or an edge of the substrate; each of the second connectors has a first end and an opposite second end, and the first ends of the second connectors are connected to the second side of the panels of the molded photo-responsive component, and the second ends of the second connectors are connected to the first connectors or the edges of the substrate.

31. The method as defined in claim 27, wherein the step of forming the molded base panel further includes a third side intersecting the first side and the second side, the third side being connected to an extension.

32. The method of making a molded photo conductor assembly panel as in claim 27, wherein the step of forming a molded base panel forms a plurality of the molded photo conductor assembly panels on a substrate, each of the molded photo conductor assembly panels further having a third side intersecting the first side and the second side and the third side connecting an extension; wherein the extensions connected to the respective panels of the plurality of molded photosensitive assemblies are joined together.

33. The method as defined in claim 23, wherein the step of forming the molded base panel forms a plurality of light windows, each light window corresponding to a location of one of the plurality of light sensing elements.

34. The method for making the molded photo conductor assembly panel as claimed in claim 33, wherein in the step of forming the molded base panel, an included angle α between the inner side surface of the base of the molded base panel and the optical axis line corresponding to the photo conductor element is 10 ° to 80 °.

35. The method as claimed in claim 23, wherein the step of forming the molded base panel is a rigid-flex board having an outer side surface linearly extending from a rigid region of the rigid-flex board, wherein an angle of inclination γ for facilitating mold release is provided between the outer side surface of the molded base panel and an optical axis line corresponding to the photosensitive element, wherein γ is in a range of 3 ° to 45 °.

36. The method as claimed in claim 23, wherein the step of forming the molded base panel further comprises providing a rigid region on an outer side of the outer surface of the molded base panel, the rigid region corresponding to the molded base panel having a pressing distance; the pressing distance is the distance of a forming die in the molding process which is convenient for pressing.

37. The method as claimed in claim 36, wherein the step of forming the molded base panel includes a pressing distance of 0.1-0.6 mm.

38. The method of making a molded panel of photosensitive assemblies as claimed in claim 34, wherein in said step of forming a molded base panel, an included angle α between an inner surface of the base of the molded base panel and an optical axis line corresponding to the photosensitive element is 10 ° -55 °.

39. The method of making a molded panel of photosensitive components of claim 35, wherein said step of forming a molded base panel has an angle of inclination γ in the range of 3 ° to 15 °.

40. The method of making a molded panel of photosensitive components of any of claims 23 to 39, wherein said step of preparing a substrate comprises providing said first region as a rigid region and providing said second region as a flexible region.

41. The method for making a molded panel of light sensing components as claimed in any one of claims 23 to 39, wherein the step of forming the molded base panel comprises:

42. The method as claimed in claim 41, wherein in the step of disposing a molding mold on the substrate, a plurality of optical window molding blocks and base molding guide grooves around each optical window molding block are disposed in the molding cavity, and the plurality of base molding guide grooves are communicated with each other;

43. A method of making a molded photosensitive assembly, comprising:

the method for manufacturing a molded photo-sensitive component panel according to any one of claims 23 to 39; and

44. The method of claim 43 wherein the cutting step provides the cut molded photosensitive element with a vertical flat surface formed by cutting the molded base panel and the substrate.

45. The method of claim 43 wherein the cutting step provides at least a portion of the molded photosensitive component with two or three cut surfaces formed by cutting the molded base panel and the substrate.