CN112738982B - Base with metal circuit and voice coil motor - Google Patents

Abstract

The invention relates to a base with a metal circuit, which comprises: the metal circuit comprises a base and a fixing column, wherein the fixing column is buckled with an external shell, the plastic body comprises a bottom and is formed by protruding from the bottom, the fixing column is positioned at the outer edge part of the plastic body, the branch further comprises a fixing column branch embedded in the fixing column, and one end of the fixing column branch extends out of the outer surface of the fixing column. Through set up the metal circuit in the fixed column, strengthened the intensity of fixed column, fully expanded metal circuit occupation space, be favorable to miniaturized development trend.

Description

Base with metal circuit and voice coil motor

Technical Field

The invention relates to the technical field of metal circuits, in particular to a base with a metal circuit and a voice coil motor.

Background

In the existing base and voice coil motor with metal circuit, the surface assembly process of flexible FPC is usually adopted to achieve the circuit communication effect. However, the assembly process is limited by the requirements of the precision of the form and position tolerance of the component, the repeated positioning precision and the like, so that the assembly has high overall reject ratio and poor mass production.

As for the patent with application number CN201811114105.4 and the invention with publication number CN110703536A, the single-layer metal circuit is embedded inside the plastic product and connected to the electronic component to achieve the circuit connection function, and the number of the metal circuits designed by the single-layer metal circuit is limited on the premise of limited product space; along with market development, product function demand is more and more, and the quantity demand of the inside metal circuit of product is more and more, if need appear a plurality of electronic components on the circuit board, but the horizontal minimum width of the branch of single circuit board is established, and the area that fixed quantity of electronic components pin branch road probably covers of arranging is fixed, if there are a plurality of electronic components, then there may be not enough problem in a planar overall arrangement area of voice coil drive motor, the overall arrangement plane of a plurality of circuits need appear.

Among the prior art, the base periphery of voice coil motor sets up the projection structure for the location support usually, projection structure itself only is the plastic material of moulding plastics of simplicity, holistic structural strength is not enough, cause the damage easily in the assembly, and the inside metal circuit of the base of current voice coil motor all forms in the inside of base main part through injection moulding's mode, metal circuit and external circuit's connection needs to be realized through the electric property pin and the external circuit UNICOM that extend, but there are higher space size precision demand and the demand of connection stability in arranging of electric property pin, consequently, the requirement of electric property pin overall arrangement is higher.

Therefore, there is a need to provide a new base and voice coil motor with metal circuit to overcome the above-mentioned drawbacks.

Disclosure of Invention

The invention aims to provide a base with a metal circuit and a voice coil motor, which can meet the diversified arrangement requirements of the metal circuit and enhance the strength of a plastic body.

The purpose of the invention is realized by the following technical scheme one: a submount with metal circuitry comprising: the electronic component comprises an electronic component, a metal circuit welded with the electronic component and a plastic body integrally injection-molded with the metal circuit, wherein the metal circuit comprises a plurality of branches, the branches are electrically connected with pins of the electronic component, the branches comprise pins connected with an external circuit and welding pins formed by arranging the other ends of the pins corresponding to the pins of the electronic component, the plastic body comprises a bottom and fixing columns protruding from the bottom, the fixing columns are positioned on the outer edge part of the plastic body, part of the branches further comprise fixing column branches embedded in the fixing columns, and one ends of the fixing column branches extend beyond the outer surfaces of the fixing columns.

Furthermore, the branch circuit also comprises a main branch circuit buried at the bottom, the fixed column branch circuit is positioned on the peripheral side of the main branch circuit, and the fixed column branch circuit is connected with the corresponding main branch circuit.

Further, the fixing column comprises an exposed top surface, and the fixing column branch is injection-molded in an extension part in the fixing column and the pin is bent from a free end of the extension part and exposed on the top surface.

Further, the base is rectangular, and the fixed columns are located at four corners of the base.

Further, the pins of the fixed column branch are arranged in a rectangular track.

Further, the pins of the fixed post legs are located in the same plane and are flush with the top surface of the fixed post.

Further, the extending directions of the pins of at least two adjacent fixed column branches are opposite.

Furthermore, the solder feet of the fixed column branch and the solder feet of other main body branches welded on the same electronic element are positioned on the same plane.

Furthermore, the metal circuit comprises a first metal circuit and a second metal circuit which are arranged in a double-layer interval manner in a first direction, and the fixed column branch constitutes a part of the first metal circuit and/or the second metal circuit.

Furthermore, a connecting portion is formed between the solder foot and the pin of each branch, and the connecting portion of at least one branch of the first metal circuit and the connecting portion of at least one branch of the second metal circuit are overlapped in a projection manner in the first direction.

The purpose of the invention is realized by the following technical scheme II: a voice coil motor comprises the base with the metal circuit.

In the invention, the metal circuit is arranged in the fixed column 22, so that the mechanical strength of the fixed column 22 is greatly increased, the fixation with the shell is enhanced, the occupied space of the metal circuit is fully expanded through the structure of the fixed column 22, and the development trend of miniaturization is facilitated.

Drawings

Fig. 1 is a schematic view of a periscopic lens module according to the present invention.

Fig. 2 is a top view of a metal circuit substrate of the present invention.

FIG. 3 is a top view of the plastic body injection molded on the metal circuit substrate.

Fig. 4 is a perspective view of the metal circuit substrate of fig. 3.

Fig. 5 is a schematic perspective view illustrating a diffuse reflection layer coated in the groove of the plastic body of fig. 4.

Fig. 6 is a perspective view of the base.

Fig. 7 is an exploded perspective view of the base.

Fig. 8 is a further exploded perspective view of the base.

Fig. 9 is a perspective view of a metal circuit.

Fig. 10 is a side view of a metal circuit.

Fig. 11 is a top view of a metal circuit.

Fig. 12 is an exploded perspective view of a metal circuit.

Fig. 13 is a side view of fig. 12.

Detailed Description

In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or assembly must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that the term "connected" is to be interpreted broadly, unless otherwise explicitly specified or limited, and the specific meaning of the above terms in the present invention will be specifically understood by those skilled in the art.

In the prior art, electronic equipment has more and more functional requirements and smaller size requirements so as to obtain more and more light, thin and portable electronic equipment with more rich functions, a camera assembly is usually arranged in the electronic equipment, the precision requirement of the camera assembly and the adaptability requirement of a complex scene are higher and higher, and the quantity requirement of metal circuits in the camera assembly is more and more. The invention designs a double-layer metal circuit for the layout of at least 2 electronic elements, the double-layer metal circuit adopts a specific stamping mode, a first metal circuit 1a with a first material belt S1 is firstly formed, a second metal circuit 1b with a second material belt S2 is formed, and then the first metal circuit 1a and the second metal circuit 1b are arranged in a stacking mode, so that the first material belt S1 and the second material belt S2 are at least partially overlapped to realize overlapping stamping. Hereinafter, the base 100 and the voice coil motor having the base 100 according to the present invention will be described with reference to fig. 1 to 13.

In the present invention, the base 100 and the voice coil motor can be applied to a periscopic lens module in a mobile phone. Due to the limitation of the thickness of the mobile phone, the camera of the mobile phone which is vertically arranged conventionally (i.e. towards the outside on the surface of the mobile phone) has a small focal length and limited optical zooming capability, but in the invention, the camera is transversely arranged in the mobile phone, which is different from the vertical arrangement mode of the traditional lens, as shown in fig. 1. A periscopic camera module 1000 comprises a photosensitive element 1001, an optical lens 1002, a magnetic element 1004 fixed on the optical lens 1002, a reflecting element 1003 and a voice coil motor. The optical lens 1002 is located between the photosensitive component 1001 and the reflective element 1003, so that the ambient light is reflected by the reflective element 1003 to change the propagation direction of the ambient light (the light entering the mobile phone camera in the vertical direction is changed into the light in the transverse direction), and after passing through the optical lens 1002, the ambient light is received by the photosensitive component 1001 to acquire an image. The voice coil motor at least comprises the base 100, a plurality of metal circuits 1 electrically connected with the base 100, a plurality of magnetic elements 1004 arranged opposite to the plurality of metal circuits 1 and capable of interacting with each other, and a lens holder controlled by the metal circuits 1 and the magnetic elements 1004 to move. The metal circuit may interact with the magnetic element after being powered on to drive the lens holder to move, so as to assist the optical lens 1002 to focus. At this time, the moving direction of the optical lens 1002 is the direction of the optical path. Hereinafter, a detailed description will be given.

Referring to fig. 1 to 13, the voice coil motor includes a base 100. The base 100 comprises a plurality of electronic elements 3, a double-layer metal circuit 1 welded with the electronic elements 3, and a plastic body 2 integrally injection-molded with the metal circuit 1. The integral injection Molding can be realized by Insert-Molding (IM) or Molded-Interconnect-Device (MID) technology.

The plastic body 2 includes a bottom 21 and a fixing post 22 protruding from the bottom 21 to support the external case. The fixing post 22 is positioned at the outer edge part of the plastic body 2. In the present invention, the fixing posts 22 are located at the corners of the plastic body 2. Because the plastic body 2 is rectangular, the fixing posts 22 are located at four corners of the plastic body 2. In other embodiments, the shape of the plastic body 2 is not limited. The bottom 21 is also provided with a recess 23. The bottom 21 has a first side 211 and a third side 213, and a second side 212 and a fourth side 214 connecting the first side 211 and the third side 213 in a direction parallel to the optical path. The fixing posts 22 include a first fixing post 221 and a second fixing post 222 located at both ends of the first side 211, a fourth fixing post 224 located at the opposite side of the first fixing post 221, and a third fixing post 223 located at the opposite side of the second fixing post 222. Each of the fixing posts 22 also includes an internally disposed receiving pocket 225 and an exposed top surface 226 at the top surface of the fixing post 22. The plastic body 2 further includes a punching hole 24 corresponding to a joint 1g of the adjacent branches 10 described below, so that an external jig is inserted into the punching hole 24 and punches the joint 1g when the base 100 is molded.

In the invention, in order to ensure the precision of the optical path, the light reflection rate of the surface of the plastic body in the optical path direction needs to be reduced, and the light reflection rate is required to be lower than 2%. The general method is to form a rough surface on the surface of the plastic body 2, and the injection mold is generally designed, but even if the rough surface is made, the light reflection rate is still higher than 2%. Therefore, in the present invention, the base 100 has the first side 211 close to the optical lens 1002 and the third side 213 disposed opposite to the first side 211, the first side 211 of the base 100 is disposed with a coating area D in a direction parallel to the optical path, and the coating area D is coated with a diffuse reflection coating 4. The coating region D is disposed on the plastic body 2 covering the metal circuit 1. The manner of applying the diffuse reflection coating 4 in the coating area D is spraying. The width dimension of the coating region D in the width direction perpendicular to the direction of the light path is larger than the width dimension of the light path, so that the reflectivity of the light path can be reduced, and the optical performance of the product can be improved. The reflectivity of the diffuse reflective coating 4 is less than 2%, in the present invention the reflectivity is less than 1%.

The groove 23 is disposed in the coating region D on the first side 211 and is recessed toward the third side 213 such that the groove 23 is parallel to the direction of the optical path. Work as recess 23 width direction's size is greater than the size of light path width, 4 parts of diffuse reflection coating coat in corresponding the light path width recess 23, only need at this moment correspond the scope coating of light path width with recess 23 diffuse reflection coating 4 can make the light path when propagating, owing to reduced the reflectivity of the plastic body in the light path width scope, guaranteed the precision of light path. When the dimension of the groove 23 in the width direction is not greater than the dimension of the width of the light path, two conditions exist at this time, one is that the groove 23 is equal to the width of the light path, and the diffuse reflection coating 4 is completely coated on the groove 23, that is, the groove 23 is completely coated at this time, so that the requirement that the region corresponding to the light path width range is coated with the diffuse reflection coating 4 can be met, the reflectivity of the plastic body 2 in the corresponding region is reduced, and the luminosity precision is ensured; secondly the recess 23 is less than the width of light path, diffuse reflection coating 4 coat in completely recess 23, diffuse reflection coating 4 still need coat in other parts except that recess 23 corresponds the light path width scope in addition, promptly diffuse reflection coating 4 coating correspond the light path width expose in the surface department of the metal circuit 1 of plastic body 2, this moment the upper surface of metal circuit 1 with recess 23 surface parallel and level. In other embodiments, the range of the optical path width corresponds to a portion of the metal circuit 2 corresponding to the optical path width exposed on the plastic body 2, and at this time, the diffuse reflection coating 4 is coated on the portion of the metal circuit 1 corresponding to the optical path width exposed on the plastic body 2. In the present embodiment, the area of the groove 23 is not smaller than the range of the optical path width, and in this case, the diffuse reflection coating 4 is coated on all the surfaces of the groove 23. Further, the thickness of the diffuse reflection coating 4 is not more than 30 μm, and although it is preferable that the diffuse reflection coating 4 is thinner from the viewpoint of space saving and material saving, the reflectance of the optical path cannot be satisfied if the diffuse reflection coating 4 is too thin. Specifically, the thickness of the diffuse reflection coating 4 is 25 μm, and the reflectance of the light path is less than 1%.

In the present invention, each of the bases 100 includes a double layer of the metal circuit 1. The base material of the metal circuit is made of copper or stainless steel. The double-layer metal circuit 1 is formed by respectively stamping and then overlapping two plates, specifically, the metal circuit 1 comprises a first metal circuit 1a cut from a first material belt S1 and a second metal circuit 1b cut from a second material belt S2. The metal circuit 1 is provided with a main branch embedded in a bottom 21 and a fixed column branch 19 embedded in the fixed column 22 and located on the periphery of the main branch, and one end of the fixed column branch 19 extends beyond the outer surface of the fixed column 22. The fixed column branch 19 is conducted with the main branch.

The main part branch road includes a plurality of branch roads 10, and is a plurality of branch road 10 and a plurality of pin electric connection of electronic component 3, the one end of a plurality of branch roads 10 is parallel and the interval is arranged in order to form and exposes in pin 1c outside the plastic body 2, the other end of branch road 10 is arranged and is formed electric connection to leg 1d of the pin of electronic component 3, be formed with connecting portion 1f between leg 1d and pin 1c of each branch road 10, be formed with junction 1g between the adjacent branch road 10. The fillet 1d includes a soldering portion 1d1 soldered to the electronic component 3 and a transition portion 1d2 connected to the connecting portion 1 f. The soldering portions 1d1 are each provided with a soldering face 1d11 soldered to the electronic component 3, and the plurality of soldering faces 1d11 collectively define a second plane p 2.

The fixed pillar branch 19 also has the pin 1c connected to an external circuit and the solder leg 1d having the other end electrically connected to a pin of the electronic component 3. The fixed column branch 19 is embedded in the accommodating groove 225 of the fixed column 22 and has the pin 1c exposed on the top surface 226. The fixed pillar via 19 is injection molded in the receiving groove 225 and includes an extending portion embedded in the receiving groove 225 and the lead 1c exposed on the top surface 226 and bent from a free end of the extending portion. The fixed column branches 19 include a first fixed column branch 191 fixed in the first fixed column 221, a second fixed column branch 192 fixed in the second fixed column 222, and a third fixed column branch 193 fixed in the third fixed column 223 and the fourth fixed column 224. The first fixed column leg 191 includes a first fixed column pin 1911 exposed to the top surface 226 of the first fixed column 221, a first extension portion 1912 received in the receiving slot 225 of the first fixed column 221, and a first fixed column fillet 1913 embedded in the bottom 21 and soldered to the electronic component 3. The second fixed column branch 192 includes a second fixed column pin 1921 exposed to the top surface 226 of the second fixed column 222, a second extending portion 1922 received in the receiving slot 225 of the second fixed column 222, and a second fixed column fillet 1923 embedded in the bottom 21 and soldered to the electronic component 3, and being coplanar with the first fixed column fillet 1913. The third fixed column branch 193 includes a third fixed column pin 1931 exposed to the top surface 226 of the third fixed column 223 and a fourth fixed column pin 1932 exposed to the top surface 226 of the fourth fixed column 224 and a third extending portion 1933 embedded in the receiving groove 225 of the third fixed column 223 and a fourth extending portion 1934 embedded in the receiving groove 225 of the fourth fixed column 224. Since the fixed column branches 19 are located at four corners of the plastic body 2, the pins 1c of the fixed column branches 19 are arranged in a rectangular track, and specifically, the first fixed column pin 1911, the second fixed column pin 1921, the third fixed column pin 1931 and the fourth fixed column pin 1932 are arranged in a rectangular track and located on the same plane. The leads 1c of the fixed post legs 19 adjacent to each other are oppositely oriented, specifically, the first fixed post lead 1911 is oppositely oriented to the second fixed post lead 1921, and the third fixed post lead 1931 and the fourth fixed post lead 1932 are oppositely oriented. The solder tail 1913/1923 of the fixed pillar branch 19 is located on the same plane as the solder tail 1d of the other main body branch soldered to the same electronic component 3. The fixed pillar via 19 is a part of at least one of the first metal circuit 1a and the second metal circuit 1b, which are described below, and the fixed pillar via 19 may be a part of the first metal circuit 1a or a part of the second metal circuit 1b, and of course, the fixed pillar via 19 may also be a part of the first metal circuit 1a and the second metal circuit 1b in common. In the present application, the fixed pillar via 19 is part of the second metal circuit 1 b.

In this embodiment, the first metal circuit 1a and the second metal circuit 1b are disposed at an interval in the vertical direction, that is, the metal circuits 1 are disposed in two layers in the vertical direction. The arrangement direction of the first metal circuit 1a and the second metal circuit 1b is defined as a first direction. In another embodiment, the first metal circuit 1a and the second metal circuit 1b are disposed in the horizontal left-right direction or the horizontal front-back direction, that is, the metal circuits 1 are disposed in two layers in the horizontal left-right direction or the horizontal front-back direction. Of course, the first metal circuit 1a may be disposed in the horizontal direction and the second metal circuit 1b may be disposed in the vertical direction, but there must be a portion between them that overlaps and intersects in the vertical direction or the horizontal direction. The connection portion 1f of at least one of the branches 10 of the first metal circuit 1a and the connection portion 1f of at least one of the branches 10 of the second metal circuit 1b are overlapped in a projection manner in at least one of a vertical direction or a horizontal direction. When the first metal circuit 1a and the second metal circuit 1b are stacked in the vertical direction, the projection of the connection portion 1f of one branch 10 of the first metal circuit 1a and the projection of the connection portion 1f of one branch 10 of the second metal circuit 1b in the vertical direction are overlapped, that is, the first metal circuit 1a and the second metal circuit 1b are crossed in the vertical direction; when the first metal circuit 1a and the second metal circuit 1b are stacked in the horizontal direction, the projection of the connection portion 1f of one branch 10 of the first metal circuit 1a and the projection of the connection portion 1f of one branch 10 of the second metal circuit 1b in the horizontal direction are overlapped, that is, the first metal circuit 1a and the second metal circuit 1b are crossed in the horizontal direction; when the first metal circuit 1a and the second metal circuit 1b are three-dimensional circuits, that is, the first metal circuit 1a and the second metal circuit 1b are provided with a part in both the horizontal direction and the vertical direction, partial projections of the connecting portion 1f of one branch 10 of the first metal circuit 1a and the connecting portion 1f of one branch 10 of the second metal circuit 1b in both the vertical direction and the horizontal direction are overlapped, that is, the first metal circuit 1a and the second metal circuit 1b are crossed in both the horizontal direction and the vertical direction.

In the present invention, each of the electronic components 3 is soldered with the solder tail 1d of the first metal circuit 1a or the solder tail 1d of the second metal circuit 1b, and all the solder tails 1d soldered with the same electronic component 3 are located on the same plane, i.e., the second plane p 2. The solder fillets 1d for soldering the same electronic component 3 are arranged at intervals in a rectangular track. The connecting portion 1f of the branch 10 of one of the first metal circuit 1a and the second metal circuit 1b is bent to overlap with a projection of the connecting portion 1f of the other branch 10 in the first direction, and the corresponding transition portion 1d2 is bent in the first direction so that the soldering portion 1d1 and the other soldering portion 1d1 are disposed on the same plane.

All the pins 1c of the main body branches of the first metal circuit 1a and the second metal circuit 1b are located on the same plane and are defined as a first plane p1, and the pins 1c are arranged in a linear track, and the pins 1c may be disposed on one side of the base 100, in this embodiment, the pins 1c are located around the base 100. The pin 1c further includes a bending portion 1e connected to the connecting portion 1 f. The plane where the pin 1c of the main body branch is located and the plane where the solder leg 1d of the main body branch is located may be the same plane or different planes. In the present invention, the plane of the pin 1c of the main body branch and the plane of the solder foot 1d of the main body branch are located on different planes, that is, the first plane p1 and the second plane p2 are located on different planes.

Specifically, in the present embodiment, as shown in fig. 7 to 13, the metal circuit 1 includes a main branch and a fixed branch 19 located on the peripheral side of the main branch. The main branch comprises a first branch 11, a second branch 12, a third branch 13, a fourth branch 14, a fifth branch 15, a sixth branch 16, a seventh branch 17 and an eighth branch 18 which are arranged from left to right. The first branch 11, the fifth branch 15, and the eighth branch 18 constitute the first metal circuit 1a located on an upper layer, and the second branch 12, the third branch 13, the fourth branch 14, the sixth branch 16, the seventh branch 17, and the fixed column branch 19 constitute the second metal circuit 1b located on a lower layer.

The first branch 11 includes a first lead 111 located on the second side 212 of the plastic body 2, a first sub-lead 112 located on the third side 213 of the plastic body 2, a first solder leg 113 soldered to the electronic component 3, a first connection portion 114 connected between the first solder leg 113 and the first lead 111, and a first bending portion 115 located inside the first lead 111 and connected to the first connection portion 114.

The second branch 12 includes a second pin 121 located on the second side 212, a second solder leg 123 soldered to the same electronic component 3 as the first solder leg 113 and located on the same plane, a second connecting portion 124 connected between the second pin 121 and the second solder leg 123, and a second bending portion 125 located inside the second solder leg 123 and connected to the second connecting portion 124.

The third branch 13 includes a third lead 131 located on the second side 212, a third solder leg 133 soldered to the same electronic component 3 as the first solder leg 113 and located on the same plane, a third connection portion 134 connected between the third lead 131 and the third solder leg 133, and a third bending portion 135 connected to the third connection portion 134 and located inside the third solder leg 133.

The fourth branch 14 includes a fourth lead 141 located on the second side 212, a fourth solder leg 143 soldered to the same electronic component 3 as the first solder leg 113 and located on the same plane, a fourth connecting portion 144 connected between the fourth lead 141 and the fourth solder leg 143, and a fourth bending portion 145 connected to the fourth connecting portion 144 and located inside the fourth solder leg 143.

The fifth branch 15 includes a fifth pin 151 located on the second side 212 of the plastic body 2, a fifth sub-pin 152 located on the third side 213 of the plastic body 2, a fifth solder 153 soldered to a different electronic component 3 with the first solder 113, a fifth connecting portion 154 connected between the fifth solder 153 and the fifth pin 151, and a fifth bent portion 155 located inside the fifth pin 151 and connected to the fifth connecting portion 154.

The sixth branch 16 includes a sixth pin 161 located on the second side 212 of the plastic body 2, a sixth sub-pin 162 located on the fourth side 214 of the plastic body 2, a sixth solder 163 soldered to the same electronic component 3 as the fifth solder 153, a sixth connection portion 164 connected between the sixth solder 163 and the sixth pin 161, and a sixth bent portion 165 located inside the sixth pin 161 and connected to the sixth connection portion 164.

The seventh branch 17 includes a seventh pin 171 located on the second side 212 of the plastic body 2, a seventh fillet 173 soldered to the same electronic element 3 as the fifth fillet 153, another seventh fillet 173 soldered to another electronic element 3 different from the electronic element 3 soldered to the first fillet 113 and the fifth fillet 153, a seventh connecting portion 174 connecting the seventh fillet 173 and the seventh pin 171, and a seventh bent portion 175 located inside the seventh pin 171 and connected to the seventh connecting portion 174.

The eighth branch 18 includes an eighth pin 181 located on the second side 212 of the plastic body 2, two eighth sub-pins 1821/1822 located on the first side 211, an eighth sub-pin 1823 located on the fourth side 214, an eighth sub-pin 1824 located on the third side 213, an eighth fillet 183 soldered to the same electronic element 3 as the fifth fillet 153, another eighth fillet 183 soldered to the same electronic element 3 as the another seventh fillet 173, an eighth connecting portion 184 connecting the eighth fillet 183 and the eighth pin 181, and an eighth bent portion 185 located inside the eighth pin 181 and connected to the eighth connecting portion 184. The seventh branch 17 has two seventh fillets 173, and the eighth branch 18 has two eighth fillets 183.

In the present embodiment, there are three electronic components 3. The first lead 111, the second lead 121, the third lead 131, the fourth lead 141, the fifth lead 151, the sixth lead 161, the seventh lead 171, the eighth lead 181, the first sub-lead 112, the fifth sub-lead 152, the sixth sub-lead 162, and the eighth sub-lead 1821/1822/1823/1824 are all referred to as leads 1 c.

The first fillet 113, the second fillet 123, the third fillet 133, the fourth fillet 143, the fifth fillet 153, the sixth fillet 163, the seventh fillet 173 and the eighth fillet 183 are all referred to as a fillet 1 d. The first connection portion 114, the second connection portion 124, the third connection portion 134, the fourth connection portion 144, the fifth connection portion 154, the sixth connection portion 164, the seventh connection portion 174, and the eighth connection portion 184 are all referred to as connection portions 1 f. The first bent portion 115, the second bent portion 125, the third bent portion 135, the fourth bent portion 145, the fifth bent portion 155, the sixth bent portion 165, the seventh bent portion 175, and the eighth bent portion 185 are all referred to as bent portions 1 e.

The first solder leg 113, the second solder leg 123, the third solder leg 133 and the fourth solder leg 143 are soldered to the same electronic component 3 and all located on the same plane, and the four solder legs are arranged in a rectangular track and all have the soldering portion 1d1, the transition portion 1d2 and the soldering surface 1d11, and the soldering surface 1d11 is defined as a second plane p 2. Here, the first connection portion 114 of the first branch 11 belonging to the first metal circuit 1a overlaps the projection of the fourth connection portion 144 of the fourth branch 14 belonging to the second metal circuit 1b in the vertical direction at a position close to the first solder leg 113, and at this time, the transition portion 1d2 of the first branch 11 is bent toward the lower side of the fourth branch 14 of the second metal circuit 1b so that the first solder leg 113 and the fourth solder leg 143 are located on the same plane.

The fifth solder tail 153, the sixth solder tail 163, the seventh solder tail 173 and the eighth solder tail 183 are soldered to another electronic element 3 and located on the same plane. Since the electronic component 3 has six leads, the first fixed column pad 1913 and the second fixed column pad 1923 are located on the same plane as the fifth pad 153, the sixth pad 163, the seventh pad 173 and the eighth pad 183, and the six pads are arranged in a rectangular track and have the soldering portion 1d1, the transition portion 1d2 and the soldering surface 1d 11. Here, the fifth connection portion 154 of the fifth branch 15 belonging to the first metal circuit 1a overlaps the sixth connection portion 164 of the sixth branch 16 belonging to the second metal circuit 1b and the seventh connection portion 174 of the seventh branch 17 in the vertical direction at a position close to the fifth solder tail 153, and at this time, the transition portion 1d2 of the fifth branch 15 is bent downward under the sixth branch 16 and the seventh branch 17 of the second metal circuit 1b so that the fifth solder tail 153, the sixth solder tail 163 and the seventh solder tail 173 are located on the same plane.

The seventh solder tail 173 and the eighth solder tail 183 are soldered to a third electronic element 3 and located on the same plane. And the two welding feet are arranged in a rectangular track and are provided with the welding part 1d1, the transition part 1d2 and a welding surface 1d 11. Here, the eighth connection portion 184 belonging to the eighth branch 18 of the first metal circuit 1a overlaps the seventh connection portion 164 belonging to the seventh branch 16 of the second metal circuit 1b in a projection in the vertical direction near the other eighth fillet 183, and at this time, the transition portion 1d2 of the eighth branch 18 is bent toward the lower side of the seventh branch 17 of the second metal circuit 1b, so that the other eighth fillet 183 and the other seventh fillet 173 are located on the same plane.

Each of the electronic components 3 is soldered with a solder leg 1d of the first metal circuit 1a and a solder leg 1d of the second metal circuit 1 b.

The first pin 111, the second pin 121, the third pin 131, the fourth pin 141, the fifth pin 151, the sixth pin 161, the seventh pin 171, and the eighth pin 181 are located on the second side 212 of the plastic body 2 and arranged in a straight track. The first sub-lead 112, the fifth sub-lead 152 and the eighth sub-lead 1824 are located on the third side 213 of the plastic body 2 and arranged in a straight track. The sixth sub-lead 162 and the eighth sub-lead 1823 are located on the fourth side 214 of the plastic body 2 and are arranged in a straight track. The two eighth sub-leads 1821 and 1822 are located on the first side 211 of the plastic body 2 and arranged in a straight track. The leads are arranged around the base 100. All the leads 1c are located on the same plane and are defined as a first plane p1, and the first plane p1 and the second plane p2 are different planes or may be the same plane, which is not limited in the present invention, and in the present invention, the first plane p1 and the second plane p2 are different planes.

The present embodiment also relates to a voice coil motor including the base 100 having the metal circuit 1 described above. The production process of the base with the metal circuit is simplified, the spatial layout density of the metal circuit 1 is increased to the greatest extent, the spatial layout possibility of the product is increased, and meanwhile, the cost is reduced, so that the assembly process of the voice coil motor is facilitated to be simplified, and the production efficiency of the voice coil motor is improved.

The embodiment also relates to a manufacturing method for manufacturing the base with the metal circuit, which specifically comprises the following steps:

respectively punching and forming a first metal circuit 1a with a first material strap S1 and a second metal circuit 1b with a second material strap S2 on the two plates;

laminating a first metal circuit 1a and a second metal circuit 1b to form a double-layer metal circuit 1, wherein the corresponding first tape S1 and second tape S2 are at least partially overlapped, the metal circuit 1 includes a plurality of branches 10, one end of each branch 10 is arranged in parallel and at intervals to form a pin 1c exposed outside the plastic body 2, the other end of each branch 10 is arranged to form a solder foot 1d electrically connected to a pin of the electronic component 3, and a connecting part 1f is formed between the solder foot 1d and the pin 1c of each branch 10;

the first connection portion 114/the fifth connection portion 154/the eighth connection portion 184 of the first branch 11/the fifth branch 15/the eighth branch 18 of the first metal circuit 1a and the fourth connection portion 144/the sixth connection portion 164 (the seventh connection portion 174)/the seventh connection portion 174 of the fourth branch 14/the sixth branch 16 (the seventh branch 17)/the seventh branch 17 of the second metal circuit 1b are bent to overlap in a vertical projection; in other embodiments, the connection portions 1f of the first metal circuit 1a and the second metal circuit 1b may be projected and overlapped in the horizontal direction or in both the vertical direction and the horizontal direction, which depends on the arrangement direction of the first metal circuit 1a and the second metal circuit 1b, and the foregoing has been described and is not repeated herein;

bending the transition portion 1d2 of the first branch 11/the fifth branch 15/the eighth branch 18 to make the first fillet 113/the fifth fillet 153/the further eighth fillet 183 and the fourth fillet 143/the sixth fillet 163 (the seventh fillet 173)/the further seventh fillet 173 on the same plane;

the arranged metal circuit 1 is plastically packaged in a plastic mould;

injection molding a plastic body 2 to form a plastic base semi-finished product with a double-layer metal circuit 1, and reserving a welding groove for accommodating an electronic element 3, wherein the welding groove is set as a welding position;

welding the electronic element 3 on the welding position which is reserved on the semi-finished product of the plastic base and corresponds to the welding leg 1d through an SMT process to manufacture an integrated semi-finished product of the plastic base with the electronic element 3 and the metal circuit 1;

the excess tapes S1 and S2 and the connecting part 1g are removed by a tape cutting process to manufacture the integrated plastic base 100 with the electronic element 3 and the metal circuit 1. Because the plastic body 2 is provided with the punching hole 24 at the corresponding joint 1g, the punching hole 24 accommodates an external jig to be inserted and punches the corresponding joint 1 g.

First, in the present invention, the first connection portion 114 of at least one branch 11 of the first metal circuit 1a is bent so that the first connection portion 114 overlaps the fourth connection portion 144 of one branch 14 in the second metal circuit 1b in a first direction (vertical direction in the present invention), and the transition portion 1d2 of the first connection portion 114 close to the first solder leg 113 is bent so that the soldering portion 1d1 of the first solder leg 113 and the soldering portion 1d1 of the fourth solder leg 143 are located on the same plane and soldered to the same electronic component, and in the present invention, a plurality of electronic components are provided, and each electronic component 3 is soldered with a solder leg of the first metal circuit 1a and a solder leg of the second metal circuit 1 b. So set up, realized the overlap punching press, formed two-layer metal circuit, can solve current product inner space restricted problem, increase metal circuit's the density of arranging, expand the circuit space, can realize that metal circuit increases nearly one time in the equal product space.

Secondly, through set up fixed column 22 on the outer edge of plastic body 2, set up metal circuit (fixed column branch 19) in fixed column 22, and metal circuit's pin (1911/1921/1931/1932) set up the upper surface at fixed column 22, not only greatly increased the mechanical strength of fixed column 22, strengthened and the casing between the immobilization, metal circuit occupation space has also been fully expanded through the structure of fixed column 22, be favorable to the miniaturized development trend, and double-deck circuit and three-dimensional circuit novel structure have been formed, can further promote circuit density of arranging, be favorable to the product miniaturized development trend.

In addition, since the diffuse reflection coating 4 is coated on the coating area D parallel to the optical path on the base 100, specifically, the diffuse reflection coating 4 is coated in the groove 23 formed in the plastic body 2, the reflectivity of the optical path can be reduced, and the optical performance of the product can be improved.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

The above description is only a part of the embodiments of the present invention, and not all embodiments, and any equivalent variations of the technical solutions of the present invention, which are made by those skilled in the art through reading the present specification, are covered by the claims of the present invention.

Claims (11)

1. A submount (100) with metal circuitry, comprising: electronic component (3), with electronic component (3) welded metal circuit (1), with metal circuit (1) integrative injection moulding's plastic body (2), metal circuit (1) includes a plurality of branches (10), branch road (10) with electronic component (3)'s pin electric connection, branch road (10) include pin (1c) and the other end of being connected with external circuit correspond electronic component's pin arranges fillet (1d) that form, its characterized in that: the plastic body (2) comprises a bottom (21) and a fixing column (22) formed by protruding from the bottom (21), the fixing column (22) is positioned at the outer edge part of the plastic body (2), part of the branch (10) further comprises a fixing column branch (19) embedded in the fixing column (22), and one end of the fixing column branch (19) extends beyond the outer surface of the fixing column (22).

2. The base (100) with the metal circuit of claim 1, wherein: the branch (10) further comprises a main branch embedded in the bottom (21), the fixed column branches (19) are located on the periphery of the main branch, and the fixed column branches (19) are connected with the corresponding main branches.

3. The base (100) with the metal circuit of claim 2, wherein: the fixing post (22) comprises an exposed top surface (226), and the fixing post branch (19) is injection-molded in an extension part in the fixing post (22) and the pin (1c) bent from a free end of the extension part and exposed on the top surface (226).

4. The base (100) with the metal circuit of claim 3, wherein: the base (100) is rectangular, and the fixing columns (22) are located at four corners of the base (100).

5. The base (100) with the metal circuit of claim 4, wherein: the pins (1c) of the fixed column branch (19) are arranged in a rectangular track.

6. The base (100) with the metal circuit of claim 3, wherein: the pins (1c) of the fixed post legs (19) are located in the same plane and flush with the top surface of the fixed post.

7. The base (100) with the metal circuit of claim 6, wherein: the leads (1c) of at least two adjacent fixed leg (19) extend in opposite directions.

8. The base (100) with the metal circuit of claim 7, wherein: the welding feet (1d) of the fixed column branch (19) and the welding feet (1d) of other main body branches welded on the same electronic element (3) are positioned on the same plane.

9. The base (100) with the metal circuit of claim 1, wherein: the metal circuit (1) comprises a first metal circuit (1a) and a second metal circuit (1b) which are arranged at intervals in a double-layer mode in a first direction, and the fixed column branch (19) forms a part of the first metal circuit and/or the second metal circuit.

10. The base (100) with the metal circuit of claim 9, wherein: a connecting part (1f) is formed between a welding foot (1d) and a pin (1c) of each branch (10), and the connecting part (1f) of at least one branch of the first metal circuit (1a) and the connecting part (1f) of at least one branch of the second metal circuit (1b) are overlapped in a projection mode in the first direction.

11. A voice coil motor, comprising: comprising a base (100) with a metal circuit (1) according to any of claims 1 to 10.

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