JPH02216896A - Electronic component fixing structure using flexible board and securing method thereof - Google Patents

Abstract

PURPOSE:To prevent a pattern forming part from deforming and disconnecting when an electronic component is inserted into a resin case by using a board by exposing one or both front and rear faces of a conductive pattern forming part of a flexible board from the case, and holding both front and rear face of a desired part of a part not formed with the pattern with synthetic resin for forming the case. CONSTITUTION:A flexible board 13 is formed with a doughnut-shaped resistor pattern 131 and a current collecting pattern 132 on the upper face of a resin film by screen printing, etc., and patterns 131, 132 are exposed in the bottom of a case 1. In order to insert the board 13 into the case 1, the board 13 is first held between molds A and B. Resin material heated and melted is press-fitted from the through hole B1 of the mold B, and filled in the recess B1 of the mold B and the peripheral groove A2 of the mold A. In this case, the rear face side of the board facing an air gap J is supported by a protrusion B3, and the board is not deformed even if a downward force is applied to the board. A part of the board corresponding to the hole A3 of the mold A is broken by the press-fitting pressure of the resin material, and the resin material is filled in the hole A3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure for fixing electronic components using a flexible substrate and a method for fixing the same.

[Conventional technology]

Conventionally, various electronic components such as rotary variable resistors, sliding variable resistors, rotary code switches, and sliding code switches used in electronic devices are formed with various patterns such as resistor patterns and current collection patterns. A sliding body having a contact point that slides on the pattern is placed on the patterned hard substrate, and a case is placed over the sliding body.

In order to make this type of electronic component smaller and thinner,
The applicant has developed an electronic component with a structure in which various patterns are formed on a synthetic resin film to form a flexible board, and the board is inserted into a synthetic resin case (
For example, Japanese Patent Application No. 62-207433).

FIG. 23 is a diagram showing an example in which this type of electronic component is used in a rotary variable resistor.

As shown in the figure, this rotary variable resistor 9 has a case 9.
1, a flexible substrate 93, and a metal terminal 95.

Here, the case 91 is made of synthetic resin.

On the other hand, the flexible substrate 93 is made of a synthetic resin film, and on its upper surface are printed a resistor pattern 931 and a current collector pattern 932, with which the sliding contact of the slider comes into sliding contact.

Further, terminal connecting portions 99 are provided to connect various patterns on the flexible substrate 93 to metal terminals 95. To fix the metal terminal 95 in this terminal connection part 99, first place the metal terminal 95 on each of the ends of the resistor pattern 931 and the current collector pattern 932, and fix both with a conductive adhesive. Further, a reinforcing plate 97 made of a synthetic resin film is placed on the metal terminal 95, and the synthetic resin film on the part of the reinforcing plate 97 where the metal terminal 95 is not located is connected to the flexible substrate 93 opposite thereto.
The metal terminal 95 is welded to the synthetic resin film that constitutes the metal terminal 95.
is firmly fixed.

Then, this flexible substrate 93 is placed on the mold surface, and then a synthetic resin is poured into the mold, and after the synthetic resin has solidified, the mold is removed, as shown in FIG. 23. A flexible board 9 is placed inside a case 91.
The rotary variable resistor 9 in which 3 is insert-molded is completed.

[Problem to be solved by the invention]

By the way, FIG. 24 is an enlarged view of the terminal connection portion 99 when the flexible substrate 93 is sandwiched between two molds.

As shown in the figure, both sides of the flexible substrate 93 are sandwiched between a first mold 0 and a second mold P. Then, the surface of the flexible substrate 93, the metal terminal 95 and the reinforcing plate 9
There is a step between the terminal connection parts 99 to which the terminals 7 are attached. Therefore, the first mold 0 also has a stepped portion 01 corresponding to this step.
However, it is necessary to provide a gap Q2 in this stepped portion 01 in consideration of a connection error between the reinforcing plate 97 and the metal terminal 95.

However, since this gap Q2 was provided, this gap Q
The mold does not come into direct contact with either the upper or lower surfaces of the flexible substrate 93 portion (93a) facing 2.

When the synthetic resin is press-fitted into this mold, the synthetic resin enters the gap formed by both molds, but at this time, for example, the synthetic resin enters the gap Ql on the second mold P side and the first mold O side If the synthetic resin flows into the gap Q2 before entering, an upward force is applied to the portion 93a of the flexible substrate 93. However, neither the upper nor lower molds are in direct contact with this portion 93a, and since this flexible substrate 93 has a visible part, this flexible substrate 93 is not in direct contact with the upper or lower molds, so that the flexible substrate 93 is moved upward as shown by 93' in the figure. curve.

Conversely, if the synthetic resin flows into the gap Q2 on the first mold 0 side before it flows into the gap Ql on the second mold P side, the flexible substrate 93 is indicated by 93'' in the figure. (Note that the portion of the flexible substrate 93 to which the metal terminal 95 is attached will not curve even if synthetic resin gets into both sides of the flexible substrate 93 because the metal terminal 95 has rigidity.)

When the flexible substrate 93 is curved upward or downward in this way, the resistor pattern 931 or current collector pattern 932 printed on the curved flexible substrate 93
There was a problem in that the wires would break and the resistance value would increase.

Furthermore, this phenomenon is not limited to these areas;
In short, when inserting a flexible substrate made of a synthetic resin film with a conductor pattern such as a resistor pattern or current collector pattern formed into a synthetic resin case, the portion of the synthetic resin film on which the conductor pattern is formed is inserted into a synthetic resin case. This phenomenon occurs when the mold is not brought into contact with any of the molds.

The present invention has been made in view of the above points, and even when an electronic component using a flexible substrate is inserted into a synthetic resin case, the portion of the flexible substrate on which the conductive pattern is formed does not deform. It is an object of the present invention to provide a structure for fixing an electronic component and a method for fixing the same in which the conductor pattern does not cause disconnection or the like.

[Means to solve the problem]

In order to solve the above problems, the present invention provides a fixing structure for electronic components using a flexible substrate by inserting a flexible substrate formed by forming a conductive pattern on a synthetic resin film into a synthetic resin case. A fixing structure for electronic components using a flexible substrate having a structure in which the flexible substrate and a case are integrated, wherein at least one of the front and back surfaces of a portion of the flexible substrate on which a conductive pattern is formed is exposed from the case. The front and back surfaces of a desired portion of the flexible substrate on which no conductor pattern is formed are sandwiched between the synthetic resin constituting the case.

The present invention also provides a method for fixing electronic components using a flexible substrate, which includes inserting a flexible substrate formed by forming a conductor pattern on a synthetic resin film into a mold, and filling the mold with synthetic resin. is a method of fixing an electronic component using a flexible substrate in a case, comprising: directly bringing the mold surface into contact with at least the front or back surface of a portion of the flexible substrate on which a conductor pattern is formed;
The mold was then filled with synthetic resin.

[Effect]

By configuring the fixing structure and method for fixing electronic components using flexible substrates as described above, even if electronic components using flexible substrates are inserted into a synthetic resin case, the conductor pattern on the flexible substrate The portion where the conductor pattern is formed will not curve, and the conductor pattern will not be disconnected or its resistance value will increase.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a diagram showing the structure of a case of a rotary variable resistor with a built-in flexible substrate according to this embodiment, and FIG.
) is a plan view, (b) is an upper sectional view taken along line A--A in (a), and (c) is a back view.

As shown in the figure, the case of this rotary variable resistor is
It has an external appearance in which a metal terminal 15 protrudes from the side of a resin-molded case 1, and a flexible substrate 13 is inserted inside the case 1.

The resin-molded case 1 has a circular interior, and a side wall 113 is provided at the edge thereof, and a column 117 rotatably supports a rotary slider, which will be described later, at the center of the bottom.
is provided.

Further, a long hole 111 is provided on the back surface of the case 1. This elongated hole 111 exposes the back surface of the flexible substrate 13 at its bottom.

The flexible substrate 13 has a donut-shaped resistor pattern 131 and a current collector pattern 132 formed on the upper surface of a resin film by techniques such as screen printing and etching. Resistor pattern 131 of this flexible substrate 13
The current collecting pattern 132 is exposed at the bottom of the case 1.

Below, the structure of each part of case 1 of the rotary variable resistor,
The shape and its manufacturing method will be explained.

Figures 2 and 3 show metal terminals' on the flexible board 13 inserted into the case 1 of the rotary variable resistor.
15 is a diagram showing a method of connecting 15.

As shown in FIG. 2, the flexible substrate 13 is made by first preparing a strip of thermoplastic and heat-resistant synthetic resin film, and then bonding metal foil (for example, copper or aluminum) onto this film, or by bonding metal foil (for example, copper or aluminum) onto this film. Next, this metal foil is etched to form a current collection pattern 132 of a desired shape, a terminal connection pattern 132a that will become the end of this current collection pattern 132, and an end of the resistor pattern 131. Two terminal connection patterns 131a are formed (it goes without saying that these patterns may be created by other methods such as screen printing), and further a pattern is formed between the two terminal connection patterns 131m and 131a. A pattern for a rotary variable resistor is completed by printing a resistor pattern 131 for connection. Thereafter, this strip-shaped film is cut into a shape as shown in FIG. 2 to produce a large number of flexible substrates 13 connected by supporting parts 130. As the synthetic resin film, for example, polyparabanic acid, polyetherimide, polyethylene terephthalate, etc. are used.

Next, the metal terminal 15 integrally formed with the support member 150
, and connect the tip portions of the metal terminals 15 to the terminal connection patterns 132a, 131a of the flexible substrate 13.
It is placed on the hot melt type conductive adhesive layer formed above.

Next, the metal terminal 1 placed on the flexible substrate 13
5, a terminal fixing film 17 made of a synthetic resin film of the same quality as the flexible substrate 13 is placed.

Subsequently, as shown in FIG. 3, the terminal fixing film 17 is
An ultrasonic emitting horn (not shown) is placed on the part where the upper metal terminal 15 is not located (the part 171 in the figure), and the ultrasonic wave is emitted from the horn, and the terminal fixing film 17 and flexible The synthetic resin film constituting the substrate 13 is locally and firmly melted and fixed by ultrasonic heating.

Next, the terminal fixing film 17 or the flexible substrate 13
The metal terminal 15 is reliably fixed onto the terminal reading patterns 131a and 132a by heating the metal terminal 15 from above with a heating edge to melt the conductive adhesive layer.

Note that the melting and fixing of the synthetic resin film by the ultrasonic heating is strong, so the adhesion using the conductive adhesive and the thermal welding process using the heating edge may be omitted in some cases.

Next, a method of inserting this flexible substrate 13 into the synthetic resin case 1 shown in FIG. 1 will be explained.

First, as shown in FIG. 4(a), the flexible substrate 13
is inserted between the first mold A and the second mold B.

Here, the first mold A has a flat surface A1 in the center thereof.
A circumferential groove A2 is formed around the flat surface A1, and a hole A3 is formed in the center of the flat surface A1.

Here, the flat surface A1 is the flexible substrate 13 shown in FIG.
This is the surface where the upper resistor pattern 131 and the current collecting pattern 132 come into close contact, the circumferential groove A2 is the groove where the side wall 113 of the case 1 is formed, and the hole A3 is the groove where the side wall 113 of the case 1 is formed.
It is a hole with a bottom that is formed.

The second mold B has a flat surface A1 of the first mold A and a circumferential groove A.
A recess B1 is formed in a portion corresponding to 2, and the recess B1 is
A through hole B2 is formed approximately in the center of the hole.

Further, a convex portion B3 is provided in the recess B1 to directly contact the back surface of the flexible substrate 13 and support the flexible substrate 13 from below. The convex portion B3 extends a predetermined distance in the width direction of the flexible substrate 13, and its width is approximately the same as the width of the outermost portion of the three metal terminals 15 shown in FIG. Here, FIG. 5 is an enlarged view showing the convex portion B3. As shown in the figure, the convex portion B3 is formed on the flexible substrate 13 facing the gap J formed between the connecting portion of the flexible substrate 13 and the metal terminal 15 and the first mold A.
It is attached at a position where it comes into contact with and supports the back side of the

Here, the recess B1 is a recess for forming the bottom 11 of the case 1, and the protrusion B3 forms the elongated hole 11 of the case 1.
1 is formed.

Next, as shown in FIG. 4(a)G, a heated and melted resin material (for example, resin such as polyphenylene sulfite, polyethylene terephthalate, polybutylene terephthalate, etc.) is press-fitted from the through hole B2 of the second mold B. (arrow Di),
Recess B1 of second mold B and circumferential groove A2 of first mold A
The inside is filled with the molten resin material.

At this time, the molten resin material is also filled in the gap 1 shown in FIG. Even if a directional force is applied, the flexible substrate 13 will not be deformed.

At this time, as shown in FIG. 4(b), the part of the synthetic resin film of the flexible substrate 13 corresponding to 6A3 of the first mold A is pierced by the press-fitting pressure of the molten resin material, and the molten resin material is The resin material is filled into the hole A3 that forms the pillar 117 of the case 1 (arrow D2). By breaking through the flexible substrate 13 and filling the hole A3 with the molten resin material, the synthetic resin film is filled with the hole A3. It adheres closely to the inner surface of A3 and will not peel off.

As described above, after the molten resin material is filled between the first mold A and the second mold B and the molten resin material is solidified, the first mold A and the second mold B are removed. , this flexible substrate 1
3 on the lines B--B, C--C, and D--D in FIG. 3, the case of the rotary variable resistor with a built-in flexible substrate as shown in FIG. 1 is completed.

FIG. 6 is an exploded perspective view showing a rotary variable resistor using the case 1 described above.

As shown in the figure, this rotary variable resistor includes a case 1 of a rotary variable resistor with a built-in flexible substrate according to the present invention, a metal slider 23 and a synthetic resin sliding member 2.
It has a sliding body 2-, which integrates the slider 23 and the sliding molded object 21 by inserting it into the sliding body 2-1, and a cover 3,
The sliding body 2 is housed in the case 1, and the sliding body 2 is
The upper part of the cover 3 is covered with a cover 3.

FIG. 7 is a diagram showing another embodiment of the rotary variable resistor case with a built-in flexible substrate.

As shown in the figure, in the case 1' according to this embodiment, the same film as the flexible substrate 13 is inserted from inside the case 1 without providing the metal terminal 15 as shown in FIG. Direct draw, conductor pattern 19-1~1
9-. 3, a terminal pattern 19-4 is formed at the tip thereof.

In the case 1 of the rotary variable resistor having such a structure, in order to reliably mold the flexible substrate 13 integrally with the case 1, the case 1 of the flexible substrate 13 must be
Since it is necessary to resin mold the upper and lower surfaces of the portion pulled out from ', a side wall 113a is provided at this portion.

Conventionally, as shown in FIG. 8(a), this side wall 113a has a flexible recess A'2 formed in the first mold A' and a recess B'1 formed in the second mold B'. Since the flexible substrate 13 was formed so as to face each other with the substrate 13 in between, in this case as well, the portion 13a of the flexible substrate 13 facing both the recess A2 and the recess B'1 is curved. There was a fear that cracks would occur in the conductor patterns 19-1 to 19-3 formed thereon.

Therefore, as shown in FIG. 8(b), when creating the side wall 113a portion shown in FIG. It was made to come into contact with A' or the second mold B'.

In this way, either the upper or lower surface of the portion of the flexible substrate 13 on which the conductor patterns 19-1 to 19-3 are formed will always be supported by the mold, so the flexible substrate 13 will not curve. There isn't.

FIG. 9 is a diagram showing a case where the electronic component fixing structure using a flexible substrate according to the present invention is applied to a sliding variable resistor, and FIG. 9(a) is a plan view, and FIG. 9(b) is a plan view thereof. A partial side view, and the same figure (c) is a back view.

As shown in the figure, this case 4 has a flexible substrate 43 inserted therein, and has three metal terminals 45 protruding from both sides of the case 4.

The case 4 has a side wall portion 413 erected around the outer periphery of a bottomed hole portion 41 made of a rectangular synthetic resin.

The flexible substrate 43 has a resistor pattern 431 and a current collection pattern 432 printed on the upper surface of a resin film.
Both patterns 431 and 432 are formed on the bottom plate portion 4 of the case 4.
1 is exposed above.

Three metal terminals 45 are connected and fixed to each end of the flexible substrate 43 in the same manner as the terminal connection method for the rotary variable resistor shown in FIGS. 2 and 3.

Further, on the back surface of this case 4, elongated holes 411 are provided at two locations. The back surface of the flexible substrate 43 is exposed through the elongated hole 411.

This case 4 is manufactured in the same manner as the case 1 shown in FIG. 4 above.

That is, as shown in FIG.
sandwiched between two molds A′ and B″, and press-fit synthetic resin into the molds from two six B″3 formed in a second mold B″,
After solidification, the mold is removed, thereby completing the case 4 shown in FIG. 9.

Here, in the recess B''i, there is a convex portion B''2. B''2 is provided. This convex portion B''2 extends a predetermined distance in the width direction of the flexible substrate 43, and its width is larger than that of the three metal terminals 45 shown in FIG.
The width is approximately the same as the outermost width of the .

That is, as shown in FIG. 5, the convex portion B''2 contacts and supports the back side of the flexible substrate 43 facing the gap formed between the metal terminal 45 and the first mold A''. Therefore, when the molten resin material is press-fitted, the portion of the flexible substrate 13 is not deformed, and the resistor pattern 4
31 and the current collection pattern 432 will not be disconnected.

Here, the concave portion B''1 is a concave portion for forming the bottom plate portion 41 of the case 4, and the elongated hole 411 of the case 4 is formed by the convex portion B''2.

FIG. 11 is a side sectional view showing the structure of a sliding variable resistor using the case 4 of this sliding variable resistor.

As shown in the figure, a sliding body 47 having a metal slider 47a is placed on a flexible substrate 43 inserted into the case 4. If a cover 49 is placed over this sliding body 47, this sliding type variable resistor is completed. The guide bar 49 is fixed by a projection 415 provided on the case 4. This sliding variable resistor is also attached to the substrate 48. At this time, the protrusion 417 formed on the case 4
The metal terminal 45 is inserted into the hole provided in this board 4B.

12 and 13 are diagrams showing the structure of the case of another variable resistor with a built-in flexible substrate according to the present invention, in which FIG. 12 is a perspective view, FIG. 13(a) is a plan view, and FIG. b)
is a partially sectional side view, the same figure (C) is its back view, and the same figure (
d) is a cross-sectional view taken along the line J-J in the same figure (a), and the same figure (e)
is a cross-sectional view taken along the line - in the same figure (b).

As shown in the figure, the case 5 of this variable resistor has a structure in which a flexible substrate 53 is inserted and two metal terminals 55 protrude from both sides of the case 5. Furthermore, in case 5,
As shown in FIG. 13(d), the flexible substrate 53 is also exposed on the inner side wall of the circle.

The case 5 has a substantially rectangular bottom plate part 51 and a side wall part 513 standing on the outer periphery of the bottom plate part 51, and two protrusions 515 are formed at both ends of one side wall part 513. There is.

Further, on the back surface of this case 5, elongated holes 511 are provided at two locations. The back surface of the flexible substrate 53 is exposed through the elongated hole 511.

The flexible substrate 53 has a resistor pattern 551 and a current collector pattern 552 printed on the upper surface of the resin film.
The resistor pattern 551 is exposed on the bottom plate portion 51 of the case 5, and the current collection pattern 552 is exposed on the inner surface of the side wall portion 513 of the case 5.

FIG. 14 is a plan view showing the flexible substrate 53 of this embodiment. As shown in the figure, the metal terminals 55 are connected to the flexible substrate 53 by connecting two terminals at both ends thereof in the same manner as the terminal connection method in the case of the rotary variable resistor shown in FIG. 2 and FIG.
They are connected and fixed one by one. In addition, the current collection pattern 552
are formed on both sides of the flexible substrate 53, as shown in the figure. The current collecting pattern 552 is bent by the resin material press-fitted when the flexible substrate 53 is inserted into the case 5, and is
The structure is as shown in FIG. 13.

FIG. 15 is a diagram for explaining a method of inserting this flexible substrate 53 into a resin material.

As shown in FIG. 5(a), the flexible substrate 53 is
Sandwich between the mold E and the second mold F.

Here, the first mold E has a flat surface E1 where the surface of the flexible substrate 53 on which the resistor pattern 551 and the current collecting pattern 552 are formed is in close contact, and a flat surface E1 where the portion where the flexible substrate 53 and the metal terminal 55 are connected is in contact with each other. A surface E3 and a circumferential groove E2 forming the side wall portion 513 of the case 5 are formed.

- The mold F of younger brother 2 has a flat surface E1 of the first mold E.
, a recess F1 forming the bottom plate portion 51 of the case 5 is formed in a portion corresponding to the flat surface E3 and the circumferential groove E2, and a recess F1 is formed in the recess F1 in direct contact with the back surface of the flexible substrate 53 to hold the flexible substrate 53. Convex part F that supports from below
2, F2 is provided. This convex portion F2 extends a predetermined distance in the width direction of the flexible substrate 53, and its width is approximately the same as the width of the outermost side of the two metal terminals 55 shown in FIG. 13.

That is, the convex portion F2 is located on the lower surface side of the flexible substrate 53 facing the gap formed between the connection portion of the metal terminal 55 to the flexible substrate 53 and the first mold E, as shown in FIG. It is attached at a position where it abuts and supports it.

Note that the elongated hole 511 of the case 5 is formed by this convex portion F2.

Then, as shown in Fig. 15, two molds E from 6F3
, When a molten resin material is press-fitted into F, this molten resin material flows into the recess F1 of the second mold F. Here, since the convex portions F4 and F4 having a predetermined width in the width direction are formed in the concave portion F1, the flow of the molten resin material in the width direction of the flexible substrate 53 is promoted more than in the vertical direction. Therefore, as shown in FIG. 5B, the current collecting pattern 552 portions on both sides of the flexible substrate 53 are pressed by this molten resin material and the mold E
It is folded along the , and is tightly attached to the side.

Further, at this time, since the convex portion F2 acts in the same manner as in the case of FIG. 5, the flexible substrate 53 is not deformed.

After the above operations are completed, the first mold E and the second mold F are removed after the resin material has hardened, and a sliding variable resistor as shown in FIG. 13 is completed.

Figure 16 shows the sliding body 5 used in this sliding variable resistor.
6 is a diagram showing a state when the case 6 is attached to the case 5, and FIG. Front view (L of !50(a)
-L sectional view), as shown in the same figure, the sliding body 5
6 is composed of a sliding mold 561 and a metal slider 565. The sliding molded object 561 includes a sliding molded object main body 56.
Legs 562 are provided extending downward from both sides of the upper part of the case 5 along the outer periphery of the case 5, and claws 563 that engage with the case 5 are attached to the lower ends of the legs 562.

Further, a slider 565 is inserted into the slider body 564 of the slider 561, and each slider 565 is provided with sliding contacts 567 and 568.

The sliding contacts 567 and 568 are connected to the case 5, respectively.
It comes into sliding contact with the resistor pattern 551 and the current collecting pattern 552 exposed on the inner surface. Note that 569 is a knob that protrudes from one leg 562 to the outside.

By moving this knob 569, the sliding body 56 moves relative to the case 5, and the resistance value between the metal terminals 55 can be changed.

FIG. 17 is a perspective view showing a case of a rotary foot switch using still another flexible substrate according to the present invention.

Further, FIG. 18 is a sectional view showing a state in which the rotary code switch using the case shown in FIG. 17 is mounted on a printed wiring board 600.

As shown in both figures, this case 6 has a flexible substrate 6
3 is inserted so as to be exposed on the inner bottom surface of the case 6, the inner surface of the side wall 615 of the case 6, and the outer peripheral side surface of the support column 611. On the flexible substrate 63 exposed on the inner bottom surface of the case 6, the inner surface of the side wall 615 of the case 6, and the outer peripheral side surface of the support column 611, a current collecting pattern 631 and a desired portion of the current collecting pattern 631 are further printed. A code pattern is formed by forming the insulating pattern 632. Note that 65 is a metal terminal.

Further, on the back surface of this case 6, an elongated hole 613 is provided as shown in FIG. The back surface of the flexible substrate 63 is exposed through the elongated hole 613.

Note that this elongated hole 613 is used to insert the flexible board 63 into the case 6.
As in the various embodiments described above, 3 is an elongated portion formed by a convex portion of the mold that is brought into direct contact with this portion to prevent deformation.

The method of inserting the flexible substrate 63 into the case 6 is substantially the same as that shown in FIG. 4, so its explanation will be omitted.

To assemble this rotary code switch, as shown in FIG.
into the hole 661 formed in the. Next, the engaging claw 663,
663 into holes 671 and 671 of knob 67, and
The engaging claw 663 is attached to the stepped portion formed on the wall surface of 71.671.
．． 663 to attach the knob 67 to the rotor 66.

In the rotary code switch of the above structure, the knob 67
When rotated, the rotor 66 rotates, and the slider 665 attached to the bottom surface of the rotor 66 moves the current collecting pattern 631.
The slider 665', which is attached to the inner circumferential surface of the rotor 66 and in sliding contact with the insulation pattern 632, is in sliding contact with the current collecting pattern 631 on the support 611, and the slider 665' is attached to the outer circumferential surface of the rotor 66. The mover 665# slides on the current collecting pattern 631 and the insulating pattern 632 exposed on the inner surface of the side wall 615. As a result, the code signal between the metal terminals 65 changes.

The structure and method for fixing electronic components using a flexible substrate according to the present invention have been described above using examples in which they are used in a rotary variable resistor, a sliding variable resistor, and a rotary code switch. is not limited to these examples, but can be used for electronic components of any structure as long as it has a structure in which various patterns are formed on a flexible substrate and is inserted into a synthetic resin. It's good.

19 and 20 are diagrams showing an embodiment in which the electronic component fixing structure using a flexible substrate according to the present invention is used as a light receiving element fixing structure of a pickup mechanism in an optical disc. An external perspective view of the light-receiving element fixing structure, FIG. 20(a) is a plan view of the light-receiving element fixing structure,
Fig. 20(b) is a side view seen from the direction of arrow A in Fig. 20(SL), Fig. 20(c) is a side view seen from the direction of arrow B in Fig. 20(a), and Fig. 20(d). 20(e) is a bottom view of the light-receiving element fixing structure, FIG.
Figure (f') is a sectional view taken along line DD in Figure (d), and Figure 20 (g).
) is a sectional view taken along line C-C in the same figure (d).

In the figure, 71 is a case of the light receiving element fixing structure 7. The case 71 is made of synthetic resin, and a fixing member 71a for fixing the case 71 to another member is provided at its lower side. Further, each of the fixing members 71a is provided with a mounting hole 71c. Also 71b
is a cavity for introducing laser light into the light receiving element 73.

The light receiving element 73 is a commercially available light receiving element.
Metal terminals 735 protrude outward from both sides. As will be described later, the light-receiving element fixing structure 7 is completed by connecting a conductive pattern formed on the flexible substrate 72 to the metal terminal 735 and inserting it into the synthetic resin constituting the case 71.

FIG. 21 is a diagram showing a state in which the light receiving element 73 is mounted on the flexible substrate 72, and FIG. 21C is a plan view, and FIG.
) is a back view, (c) is a cross-sectional view taken along line FF in (a), and (d) is a cross-sectional view taken along line G--G in (a).

The method of connecting the metal terminal 735 protruding from the light receiving element 73 to the conductor pattern 721 on the flexible substrate 72 is to connect the terminal connection patterns 131a, 132a of the flexible substrate 13 and the metal terminal 15 shown in FIGS. 2 and 3 above.
The connection method is the same as the connection method. That is, a metal terminal 735 is placed on the conductor pattern 721 on the flexible substrate 72, a terminal fixing film 727 is placed on top of the metal terminal 735, and an ultrasonic wave is applied from above to separate the flexible substrate 72 and the terminal fixing film 727. This is done by gluing them together.

Further, the method of connecting the metal terminal 74 to the conductor pattern 721 of the flexible substrate 72 is also the method of connecting the terminal connection pattern 131a of the flexible substrate 13 shown in FIGS. 2 and 3 above.
The method for connecting 132a and metal terminal 15 is the same.

Next, a method for inserting the flexible substrate 72 on which the light receiving element 73 is mounted into the base body 71 will be explained.

Here, FIG. 22 is a diagram showing the structure of a mold when resin molding this flexible substrate 72, and FIG.
a) is a cross-sectional view of the mold corresponding to the part in FIG. 20(e), FIG. 20(b) is a cross-sectional view of the mold corresponding to the part in FIG. 20(f), and FIG. It is a sectional view of the mold corresponding to part (g).

As shown in the figure, first, a flexible substrate 72 on which a light receiving element 73 is mounted is sandwiched between a first mold M and a second mold N.

Here, supporting members Na, Nb, and Nc that support the light receiving element 73 and the flexible substrate 72 are completely formed in the second mold N, and the supporting member Na in the center supports the light receiving element 73 and the 20th This is for forming the cavity 71b shown in Figure (e). At the center of the support member Na, the surface of the support member Na is directly connected to the surface 73a of the light receiving element 73.
A hole Nd is formed in order to prevent the front receiver from damaging the surface 73a when it comes into contact with it. Both left and right ends of the second mold N are side wall members Ne that come into contact with the first mold M, which will be described later.
Nt is formed. Note that positioning support pins Ng are provided at four corners of the outer periphery of the support member Na to sandwich and support the light receiving element 73.
It is designed to be inserted into a hole provided in a mold M. This support pin Ng forms a hole 71d shown in FIGS. 20(a) and 20(d).

In addition, the first mold M has a supporting member Na of the second mold N.
, Nb, and Nc are formed, and on both sides of the recesses Mg, wall members Ma and Mb that come into contact with the lower surface of the second mold N are formed, as shown in FIG. There is. Moreover, the wall member Ma.

A fixing member 71 of the case 71 is provided at the bottom of each Mb.
Recesses Me and Md are formed for forming a.

Further, a pin gate Me for injecting the molten resin material is formed in the center portion of the first mold M. Also, the same figure (
As shown in a), this first mold M is provided with protrusions Mf and Mf' that directly abut the portion of the flexible substrate 72 to which the metal terminal 735 is connected. These projections Mf
', Mf by the elongated hole 711 shown in FIG. 20(a).
．． 711 is formed.

Then, a light receiving element 7 is placed on the upper surface of the support member Na of the second mold N.
3, the light receiving element 73 mounted on the flexible substrate 72 is placed so that the surface 73a side is located, and the support pin Ng of the second mold N is inserted into the hole of the first mold M. , second
By incorporating the first mold M into the 6 mold N, the 22nd mold
As shown in FIG.
As shown in FIGS. 22(b) and 22(c), the side portions of the wall member Mb are bent along the wall member Mb. At this time, the protruding support part Nh provided on the second mold N and the wall member Mb shown in FIG. 22(c)
The flexible substrate 72 is bent approximately at right angles by the side walls of the flexible substrate 72 . Note that this protruding support portion Nh allows the 20th
A hole 71h shown in Figure (g) is formed.

In this state, a molten resin material is injected from the pin gate Me of the first mold M, the gap formed by the first mold M and the second mold N is filled with the molten resin material, and the molten resin material is cured. , the light receiving element fixing structure of the pickup mechanism shown in FIGS. 19 and 20 is completed. At this time, Fig. 22 (C
) The portion of the flexible substrate 72 bent at a substantially right angle by the protruding support part Nh is pressed against the side surface of the protruding support part Nh by the press-fitting pressure of this molten resin material.

In this embodiment as well, the protrusions Mr and Mr are connected to the flexible substrate 72 and the metal terminal 7 as in the case shown in FIG.
35 and the second mold N, so that when the molten resin material is poured, As in the case of FIG. 5, this portion of the flexible substrate 72 is not deformed.

Further, as shown in FIG. 21, a conductive pattern 721 is formed on almost the entire surface of the flexible substrate 72, but at least one surface of the portion of the flexible substrate 72 on which the conductive pattern 721 is formed is directly connected to the flexible substrate 72. It is necessary to bring it into contact with a mold and rub it once so that the flexible substrate 72 at the conductor pattern 721 portion does not deform. Therefore, in this embodiment, among the portions of the flexible substrate 72 shown in FIG. 21(a) on which the conductor pattern 721 is formed, portions 72a and 72b are as shown in FIG. 20(d).

As shown in (e), a recessed hole 71e formed in the case 71
, 71f' is exposed on the bottom surface. That is, this means that these portions 72a and 72b form the second mold N shown in FIG. 22(a).
This is because the support members Nb and Nc are in contact with the upper surfaces of the support members Nb and Nc, and the parts 72a and 72b are not deformed due to this contact.

Next, the part of the flexible substrate 72 shown in FIG. 21(a)? 2c is the side surface 71e of the recessed hole 71e shown in FIG. 20(d).
-1 exposure.

Next, the portion 72d of the flexible substrate 72 shown in FIG. 21(a) is exposed at the side surface 71g shown in FIGS. 20(a) and 20(b).

Next, a portion 72e of the flexible substrate 72 shown in FIG. 21(a) is exposed on the side surface of the hole 71h shown in FIGS. 20(d) and (g).

As described above, at least one side of the portion of the flexible substrate 72 on which the conductive pattern 721 is formed comes into contact with the mold (therefore, that portion will be exposed after the mold is removed). , conductor pattern 721
This means that there will be no deformation and no breakage or the like.

Note that this light-receiving element fixing structure 7 is shown in FIGS.
It operates by introducing laser light from the cavity 71b side shown in f), receiving it on the light receiving element 73, converting it into an electrical signal, and sending this electrical signal to the metal terminal 74.

Although the embodiments of the electronic component fixing structure and its fixing method using a flexible substrate according to the present invention have been described in detail above, the present invention is not limited thereto and can be modified in various ways. That is, the present invention has a flexible substrate formed by forming a conductor pattern (including various patterns such as a current collector pattern, a resistor pattern, and a conductor pattern) on a synthetic resin film, by inserting it into a synthetic resin case. , it can be used in any structure as long as it has a structure that integrates the flexible substrate and the case.

〔Effect of the invention〕

As explained in detail above, according to the structure for fixing electronic components using a flexible substrate and the method for fixing the same according to the present invention, even if an electronic component using a flexible substrate is inserted into a case made of synthetic resin, This has the excellent effect that the portion of the flexible substrate on which the conductor pattern is formed will not curve, and the conductor pattern will not be disconnected or its resistance value will increase.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing the structure of a case of a rotary variable resistor with a built-in flexible substrate according to an embodiment of the present invention, and FIGS. FIG. 4 is a diagram illustrating a method for inserting the flexible substrate 13 into the synthetic resin case 1 shown in FIG. 1, and FIG. Figure 4(a)
Figure 6 is an enlarged view of the convex portion B3 of case 1.
FIG. 7 is a diagram showing another example of the case of the rotary variable resistor with built-in flexible substrate, and FIG. 8 is the rotary variable resistor shown in FIG. 7. Figure 9 shows the state of the mold when creating the side wall 113a of the resistor case, and shows the case where the electronic component fixing structure using the flexible substrate according to the present invention is used in a sliding variable resistor. Figure 10 is a diagram showing the state of the mold when making the sliding variable resistor shown in Figure 9, and Figure 11 is a sliding variable resistor using case 4 of this sliding variable resistor. FIGS. 12 and 13 are side sectional views showing the structure of the variable resistor of the present invention, and FIGS.
4 is a plan view showing the flexible substrate 53, FIG. 15 is a diagram for explaining the method of inserting the flexible substrate 53 into a resin material, and FIG. 16 is a plan view showing the flexible substrate 53 in the case. FIG. 17 is a perspective view showing a fixing structure of a rotary foot switch using a flexible substrate according to the present invention, and FIG. 19 and 20 are cross-sectional views showing a state mounted on a printed wiring board 600, in which the electronic component fixing structure using the flexible substrate according to the present invention is used in the fixing structure of a light receiving element of a pickup mechanism in an optical disc. 21 is a diagram showing a state in which a light receiving element 73 is mounted on a flexible substrate 72, FIG. 22 is a diagram showing the structure of a mold when resin molding the flexible substrate 72, and FIG. 23 is a diagram showing an embodiment. 24 is a diagram showing an example of a conventional rotary variable resistor, and FIG. 24 is an enlarged view of a terminal connection portion 99 when a flexible substrate 93 is sandwiched between two molds. In the figure, 1.1', 4, 5, 6.71...cases,
13.43.72...Flexible board, 131°4
31.551...Resistor pattern (conductor pattern)
, 132, 432, 552, 631... Current collection pattern (conductor pattern), 721... Conductor pattern (conductor pattern), 632... Insulating pattern, A, A'
, A', E, M...first mold, B, B, B''
, F, N... second mold, 7... light receiving element fixing structure, 73... light receiving element.

Claims (4)

[Claims] (1) By inserting a flexible substrate formed by forming a conductor pattern on a synthetic resin film into a synthetic resin case, it is possible to create an electronic component using a flexible substrate with a structure in which the flexible substrate and the case are integrated. A fixed structure in which at least one of the front and back surfaces of the portion of the flexible substrate on which the conductor pattern is formed is exposed from the case, and the portion of the flexible substrate on which the conductor pattern is not formed is exposed from the case. A fixing structure for an electronic component using a flexible substrate, characterized in that both the front and back surfaces of a desired portion are sandwiched between synthetic resin constituting the case. (2) By inserting a flexible substrate made by forming a conductor pattern on a synthetic resin film into a mold and filling the mold with synthetic resin, electronic components using the flexible substrate can be placed inside the case. A fixing method, characterized in that the mold surface is brought into direct contact with at least the front or back surface of a portion of the flexible substrate on which the conductive pattern is formed, and then the mold is filled with a synthetic resin. A method for fixing electronic components using a flexible substrate. (3) A flexible substrate with a structure in which a conductive pattern on which a metal slider slides is formed on a synthetic resin film, and a metal terminal is connected to the end of the conductive pattern, with the metal terminal protruding outside. A fixing structure for an electronic component using a flexible board having a structure in which the flexible board and the case are integrated by inserting the flexible board into a synthetic resin case, wherein the metal terminal of the flexible board is attached. A portion on the back side of the surface corresponding to the end of the metal terminal is exposed from the case, and a portion on which a conductive pattern of another flexible substrate is formed is exposed from the case, and the conductive pattern of the flexible substrate is exposed from the case. 1. A structure for fixing an electronic component using a flexible substrate, characterized in that both the front and back surfaces of a desired portion of the portion where no body pattern is formed are sandwiched between synthetic resin constituting the case. (4) A flexible substrate having a structure in which a conductor pattern is formed on a synthetic resin film and a terminal of a light receiving element is connected to a predetermined portion of the conductor pattern is inserted into a synthetic resin case. A light-receiving element fixing structure using a flexible substrate having a structure in which a case and a case are integrated, the portion of the flexible substrate on the back side of the surface on which the terminal of the light-receiving element is attached and corresponding to the end of the terminal. of,
At least one of the front and back surfaces of a portion of another flexible substrate on which a conductive pattern is formed is exposed from the case, and a portion of the flexible substrate on which a conductive pattern is not formed is exposed from the case. 1. A fixing structure for a light receiving element using a flexible substrate, characterized in that both the front and back sides of a desired portion of the interior are sandwiched between synthetic resin constituting the case.