JPH11175685A - Electronic card and its manufacture - Google Patents

Electronic card and its manufacture

Info

Publication number
JPH11175685A
JPH11175685A JP34645297A JP34645297A JPH11175685A JP H11175685 A JPH11175685 A JP H11175685A JP 34645297 A JP34645297 A JP 34645297A JP 34645297 A JP34645297 A JP 34645297A JP H11175685 A JPH11175685 A JP H11175685A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
metal cover
connector
electronic card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP34645297A
Other languages
Japanese (ja)
Inventor
Tomohiro Morikawa
智宏 森川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Aviation Electronics Industry Ltd
Original Assignee
Japan Aviation Electronics Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Aviation Electronics Industry Ltd filed Critical Japan Aviation Electronics Industry Ltd
Priority to JP34645297A priority Critical patent/JPH11175685A/en
Publication of JPH11175685A publication Critical patent/JPH11175685A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electronic card with a high strength and strong against noise. SOLUTION: A metal cover 30 is applied onto a printed wiring board 10 formed by mounting a connector 20 on one side and on which electronic parts are mounted. The metal cover 30 is provided with a folded chips 31 whose surfaces are brought into contact along three other sides except the side on which the connector 20 is mounted, a laminated projecting part is molded by a resin material at a state that the laminated projecting part projected by laminating the folded chips 31 and the printed wiring board 10 is projected in three directions and a frame coupled with three sides is formed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は例えばノート型パ
ソコンのカードスロット等に挿入して使用するモデムカ
ード、メモリカードその他の機能のカード或いはディジ
タル式カメラのカードスロットに挿入して使用するメモ
リカード等の各種のカードに適用して好適な電子カード
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a modem card, a memory card or other function card inserted into a card slot or the like of a notebook personal computer or a memory card inserted and used in a card slot of a digital camera. The present invention relates to an electronic card suitable for application to various types of cards.

【0002】[0002]

【従来の技術】例えば特開平3−78184号公報に見
られるように、従来の電子カードはメモリ等の半導体集
積回路電子等を実装したプリント配線板110と(図5
参照)、このプリント配線板110の一辺に装着したカ
ードコネクタ120と、プリント配線板110の両面を
覆いシールド効果を得る金属カバー130A、130B
と、これらプリント配線板110と金属カバー130
A、130Bを一体化して保持する樹脂フレーム140
とによって構成され、金属カバー130Aと130B及
びプリント配線板110はそれぞれ重ね合わされて例え
ば超音溶着等により相互間を溶接し一体化している、ま
た、金属板130Aと130Bの間を電気的に導通させ
ることと、これら金属板130A、130Bをプリント
配線板110の共通電位点に接続するために、コイルス
プリング150と、導電スリーブ160を設け、コイル
スプリング150によって金属板130Aと130Bの
相互間を電気的に導通させると共に、導電スリーブ16
0をプリント配線板110の共通電位に接触させ、この
導電スリーブ160とコイルスプリング150を通じて
金属板130Aと130Bをプリント配線板110の共
通電位点に接続する構造としている。
2. Description of the Related Art As shown in, for example, Japanese Patent Application Laid-Open No. 3-78184, a conventional electronic card includes a printed wiring board 110 on which semiconductor integrated circuit electronics such as a memory are mounted (FIG. 5).
), A card connector 120 mounted on one side of the printed wiring board 110, and metal covers 130A and 130B that cover both sides of the printed wiring board 110 and obtain a shielding effect.
And the printed wiring board 110 and the metal cover 130
A, resin frame 140 integrally holding 130B
The metal covers 130A and 130B and the printed wiring board 110 are overlapped with each other and welded together by, for example, supersonic welding or the like, and are electrically connected. The metal plates 130A and 130B are electrically connected to each other. In order to connect the metal plates 130A and 130B to the common potential point of the printed wiring board 110, a coil spring 150 and a conductive sleeve 160 are provided, and the coil spring 150 electrically connects the metal plates 130A and 130B to each other. Conductive sleeve 16
0 is brought into contact with the common potential of the printed wiring board 110, and the metal plates 130A and 130B are connected to the common potential point of the printed wiring board 110 through the conductive sleeve 160 and the coil spring 150.

【0003】[0003]

【発明が解決しようとする課題】図5に示した従来の電
子カードの構造によればフレーム140にプリント配線
板110と金属板130A、130Bを重ね合わせ、そ
の重ね合わせた状態で3者間に超音波溶接機から超音波
振動を与え、その超音波振動によって相互の接合面を加
熱し溶接する構造であるため、その接合強度は弱く破損
の原因になっている。つまり強度が弱く耐久性に欠ける
欠点がある。更に、金属板130Aと130Bをプリン
ト配線板110の共通電位点に接続する接続回路は接触
面積が小さいために接触抵抗が大きくなり、このために
シールド効果が不完全になる不都合がある。
According to the structure of the conventional electronic card shown in FIG. 5, the printed wiring board 110 and the metal plates 130A and 130B are superimposed on the frame 140, and the superimposed state is set between three persons. Ultrasonic vibration is applied from an ultrasonic welding machine, and the joint surface is heated and welded by the ultrasonic vibration. Therefore, the bonding strength is weak and causes breakage. That is, there is a disadvantage that the strength is weak and the durability is lacking. Furthermore, the connection circuit for connecting the metal plates 130A and 130B to the common potential point of the printed wiring board 110 has a small contact area, so that the contact resistance becomes large, and thus the shielding effect becomes incomplete.

【0004】この発明の第1の目的は強度が強く、耐久
性の高い構造とした電子カードを提供しようとするもの
である。この発明の第2の目的は金属板とプリント配線
板の共通電位との間の接触抵抗を小さくし、完全なシー
ルド効果を得ることが出来る構造とした電子カードを提
供しようとするものである。
A first object of the present invention is to provide an electronic card having a strong structure and a high durability. A second object of the present invention is to provide an electronic card having a structure capable of reducing a contact resistance between a metal plate and a common potential of a printed wiring board and obtaining a complete shielding effect.

【0005】[0005]

【課題を解決するための手段】この発明では、電子部品
を実装したプリント配線板と、このプリント配線板の一
辺に装着したコネクタと、プリント配線板の両面に被せ
られ、プリント配線板のコネクタが装着されない辺に沿
ってプリント配線板に面接触する折曲片を具備した金属
カバーと、この金属カバーに形成された折曲片とプリン
ト配線板が積層された積層突出部分を被覆したモールド
樹脂材によって成形したフレームと、によって電子カー
ドを構成したものである。つまり、この発明による電子
カードは電子部品とコネクタを実装した状態にあるプリ
ント配線板の両面に金属カバーを被せ、金属カバーに形
成した折曲片をプリント配線板のコネクタを装着しない
他の3辺に沿って積層させ、その積層させた3辺を樹脂
材によってモールドする製造方法を採るから、プリント
配線板と金属カバーはモールドされて形成されたフレー
ムによって固着され、強度の強い電子カードを得ること
が出来る。
According to the present invention, there is provided a printed wiring board on which electronic components are mounted, a connector mounted on one side of the printed wiring board, and a connector of the printed wiring board which is put on both sides of the printed wiring board. A metal cover having a bent piece that comes into surface contact with the printed wiring board along a side that is not mounted, and a mold resin material that covers a laminated protruding portion where the bent piece formed on the metal cover and the printed wiring board are stacked. An electronic card is constituted by a frame molded by the above method. That is, in the electronic card according to the present invention, the metal parts are put on both sides of the printed wiring board in which the electronic parts and the connector are mounted, and the bent pieces formed on the metal cover are attached to the other three sides where the printed wiring board connector is not mounted. The printed wiring board and the metal cover are fixed by a molded frame to obtain an electronic card with high strength because the printed wiring board and the metal cover are fixed by a molded frame. Can be done.

【0006】この発明では更にプリント配線板のコネク
タを装着しない他の辺に沿ってグランドパターンを形成
し、このグランドパターンに金属カバーに形成した折曲
片を面接触させる構造を提案する。この構造を探ること
により、金属カバーはプリント配線板の共通電位点に直
接、然も面接触させて接続することができる。よって金
属カバーを低い接触抵抗で共通電位に接続することがで
きる。この結果、ノイズに強い電子カードを得ることが
できる利点が得られる。
The present invention further proposes a structure in which a ground pattern is formed along the other side of the printed wiring board on which no connector is mounted, and a bent piece formed on a metal cover is brought into surface contact with the ground pattern. By exploring this structure, the metal cover can be connected directly to the common potential point of the printed wiring board by surface contact. Therefore, the metal cover can be connected to the common potential with low contact resistance. As a result, there is obtained an advantage that an electronic card resistant to noise can be obtained.

【0007】[0007]

【発明の実施の形態】図1及び図4を用いてこの発明に
よる電子カードの構造及びその製造方法の一例を説明す
る。先ず図1に示すように電子部品AとB及びコネクタ
20を実装したプリント配線板10を用意する。電子部
品AとBは半導体メモリ或はモデム等を内蔵した混成I
Cその他任意の電子部品が考えられる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of an electronic card according to the present invention and an example of a method for manufacturing the same will be described with reference to FIGS. First, as shown in FIG. 1, a printed wiring board 10 on which electronic components A and B and a connector 20 are mounted is prepared. The electronic components A and B are a hybrid I with a built-in semiconductor memory or modem.
C and any other electronic components are conceivable.

【0008】コネクタ20はプリント配線板10の装着
すべき辺の長さと同程度の長さを持つ絶縁ボディ21
と、この絶縁ボディ21の前面に形成した凹溝22と、
この凹溝22の内部に配列して装着したコンタクト23
と、コンタクト23と一体に形成され絶縁ボディ21の
背面側から導出され、プリント配線板11に形成した導
電パターンに半田付されるコネクタ端子(特に図示しな
い)とによって構成される。
The connector 20 has an insulating body 21 having a length substantially equal to the length of a side on which the printed wiring board 10 is to be mounted.
And a concave groove 22 formed on the front surface of the insulating body 21;
Contacts 23 arranged and mounted inside the concave grooves 22
And a connector terminal (not shown) formed integrally with the contact 23 and led out from the back side of the insulating body 21 and soldered to a conductive pattern formed on the printed wiring board 11.

【0009】このように、電子部品AとB及びコネクタ
20を実装したプリント配線板10に対して金属カバー
30を被せる。金属カバー30は上下どちらの金属板も
同じ構造である。つまり、プリント配線板10のコネク
タ20を装着した辺を除く他の3辺に対して折曲片を設
ける。その折曲片31は折曲片32によって金属カバー
30の板面から離れた位置で外向きに折曲げられ、金属
カバー30の板面と平行する向に折曲られて構成され
る。
Thus, the metal cover 30 is put on the printed wiring board 10 on which the electronic components A and B and the connector 20 are mounted. The upper and lower metal plates of the metal cover 30 have the same structure. That is, bent pieces are provided on the other three sides of the printed wiring board 10 except for the side on which the connector 20 is mounted. The bent piece 31 is bent outward by a bent piece 32 at a position away from the plate surface of the metal cover 30, and is bent in a direction parallel to the plate surface of the metal cover 30.

【0010】折曲片32の長さLを適当に設定し、折曲
片31をプリント配線板10の板面に接触させると金属
カバー30の裏面がコネクタ20の絶縁ボディ21の面
に頂度接触するように構成する。金属カバー30の前端
側に位置決め突片33Aと33Bを形成し、この位置決
め突片33Aと33Bをコネクタ20の絶縁ボディ21
に形成した溝24に嵌め込み、金属カバー30の位置を
固定する。従ってこの状態で金属カバー30に形成した
各折曲片31はプリント配線板10の各3辺に沿って配
置される。図2はその状態を示す。
When the length L of the bent piece 32 is appropriately set and the bent piece 31 is brought into contact with the surface of the printed wiring board 10, the back surface of the metal cover 30 is positioned above the surface of the insulating body 21 of the connector 20. Configure to make contact. Positioning projections 33A and 33B are formed on the front end side of the metal cover 30, and these positioning projections 33A and 33B are attached to the insulating body 21 of the connector 20.
And the position of the metal cover 30 is fixed. Accordingly, in this state, each bent piece 31 formed on the metal cover 30 is arranged along each of the three sides of the printed wiring board 10. FIG. 2 shows this state.

【0011】この発明では図2に示した状態で成形金型
に挿入し、図3に示す破線で示す部分に樹脂を注入し、
折曲片31とプリント配線板10とが積層されて突出し
ている積層突出部分Mを樹脂によってモールドし、積層
突出部分Mを樹脂の内部にインサートし固定する。図4
は樹脂をインサート成形した後の完成品の状態を示す。
図4に示す40はインサート成形して得られたフレーム
を示す。尚、41はフレーム40の前端部の一方に形成
して誤挿入防止用のキィー溝を示す。このキィー溝41
もインサート成形時に一体に形成される。
According to the present invention, the resin is inserted into a molding die in a state shown in FIG. 2, and a resin is injected into a portion shown by a broken line in FIG.
The laminated protruding portion M in which the bent piece 31 and the printed wiring board 10 are laminated and protruded is molded with resin, and the laminated protruding portion M is inserted and fixed in the resin. FIG.
Indicates the state of the finished product after insert molding of the resin.
Reference numeral 40 shown in FIG. 4 indicates a frame obtained by insert molding. Reference numeral 41 denotes a key groove formed at one of the front ends of the frame 40 for preventing erroneous insertion. This key groove 41
Are also integrally formed during insert molding.

【0012】また、図3に示すように金属カバー30の
後方に突出させる折曲片31はプリント配線板10の後
縁より長く突出させ、その突出部分に孔33を形成する
ことにより、この孔33を通じて樹脂を流通させ、折曲
片31の対向間隙内にも樹脂が流れ込むように構成する
と共に孔33を通じて樹脂を折曲片31の表と裏に連通
させて硬化させることにより、樹脂で形成されるフレー
ム40と金属カバー30との結合力を強化し、フレーム
40が金属カバー30とプリント配線板10の合体した
ものから抜け出す事故を防止する作用効果も得るように
している。
Further, as shown in FIG. 3, the bent piece 31 protruding rearward of the metal cover 30 is protruded longer than the rear edge of the printed wiring board 10, and a hole 33 is formed in the protruding portion. The resin is formed by flowing the resin through the opening 33 and flowing into the opposed gap of the bent piece 31 and by curing the resin by connecting the resin to the front and back of the bent piece 31 through the hole 33. The bonding force between the frame 40 and the metal cover 30 is strengthened, and an effect of preventing an accident that the frame 40 comes off from the united structure of the metal cover 30 and the printed wiring board 10 is also obtained.

【0013】このように、この発明によればプリント配
線板10に金属カバー30を積層合体し、その積層合体
した状態で樹脂成形用の金型に挿入し、樹脂をインサー
ト成形することにより図4に示す完成品を得ることがで
きるから組立に手間が掛かることなく短時間に多量の電
子カードを作ることができる。またプリント配線板10
と金属カバー30に形成した折曲片31を積層合体し、
この積層合体した積層突出部分Mを樹脂材によってモー
ルドするから強度の強い電子カードを得ることができ
る。
As described above, according to the present invention, the metal cover 30 is laminated on the printed wiring board 10 and inserted into a resin molding die in the laminated state, and the resin is insert-molded. (1), a large number of electronic cards can be produced in a short time without any trouble in assembling. The printed wiring board 10
And the bent piece 31 formed on the metal cover 30 are laminated and united,
Since the laminated combined protruding portion M is molded with a resin material, a strong electronic card can be obtained.

【0014】この発明では更にシールドを完全にするた
めの構造を提案する。このためには図1に示すようにプ
リント配線板10のコネクタ20を装着しない各辺に沿
って共通電位点に電気的に接続したグランドパターン1
1を形成し、このグランドパターン11に金属カバー3
0に形成した折曲片31を面接触させるこの構成により
金属カバー30は低い接触抵抗で共通電位点に接続され
るため、シールド効果を高めることができる。
The present invention further proposes a structure for completing the shield. For this purpose, as shown in FIG. 1, a ground pattern 1 electrically connected to a common potential point along each side of the printed wiring board 10 where the connector 20 is not mounted.
1 and a metal cover 3 is formed on the ground pattern 11.
Since the metal cover 30 is connected to the common potential point with low contact resistance by this configuration in which the bent pieces 31 formed in zero are in surface contact, the shielding effect can be enhanced.

【0015】[0015]

【発明の効果】以上説明したように、この発明によれば
コネクタ20と所要の電子部品A、Bを実装したプリン
ト配線板10に金属カバー30を被せ、その状態で樹脂
成形用金型に入れて周縁を樹脂材によってモールドし、
樹脂材によってフレーム40を形成したから、強度の強
い電子カードを得ることができる。特にモールドによっ
て固めてしまうため分解することができる構造となり、
利用者が勝手に分解し破損させるような事故を防止でき
る。またプリント配線板10に金属カバー30を積層合
体して、金型に挿入するだけの作業によって組立が完了
するから、組立に手間が掛からず量産に適している。更
に、金属カバー30を確実に共通電位点に接続する構造
を装備しているからノイズに強い電子カードを提供でき
る利点も得られ、その効果は実用に供して頗る大であ
る。
As described above, according to the present invention, the metal cover 30 is put on the connector 20 and the printed wiring board 10 on which the required electronic components A and B are mounted, and then placed in a resin molding die. And mold the periphery with resin material,
Since the frame 40 is formed of a resin material, a strong electronic card can be obtained. Especially it becomes a structure that can be disassembled because it is hardened by the mold,
It is possible to prevent an accident in which a user disassembles and breaks without permission. Further, since the assembly is completed by the work of simply stacking the metal cover 30 on the printed wiring board 10 and inserting the metal cover 30 into a mold, the assembly is not troublesome and suitable for mass production. Furthermore, since the structure for securely connecting the metal cover 30 to the common potential point is provided, an advantage that an electronic card resistant to noise can be provided is obtained, and the effect is extremely large for practical use.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明による電子カードの構造及び製造方法
を説明するための分解斜視図。
FIG. 1 is an exploded perspective view for explaining a structure and a manufacturing method of an electronic card according to the present invention.

【図2】図1の状態からプリント配線板と金属カバーと
を合体した状態を示す斜視図。
FIG. 2 is a perspective view showing a state where the printed wiring board and the metal cover are combined from the state of FIG. 1;

【図3】図2に示した状態でモールド成形する様子を説
明するための平面図。
FIG. 3 is a plan view for explaining how to perform molding in the state shown in FIG. 2;

【図4】この発明の製造方法によって得られた電子カー
ドの一例を説明するための斜視図。
FIG. 4 is a perspective view illustrating an example of an electronic card obtained by the manufacturing method of the present invention.

【図5】従来の技術を説明するための分解斜視図。FIG. 5 is an exploded perspective view for explaining a conventional technique.

【符号の説明】[Explanation of symbols]

10 プリント配線板 11 グランドパターン 20 コネクタ 21 絶縁ボディ 22 凹溝 23 コンタクト 24 溝 30 金属カバー 31 折曲片 40 フレーム M 積層突出部分 Reference Signs List 10 printed wiring board 11 ground pattern 20 connector 21 insulating body 22 concave groove 23 contact 24 groove 30 metal cover 31 bent piece 40 frame M laminated protruding portion

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 A、電子部品を実装したプリント配線板
と、 B、このプリント配線板の一辺に装着したコネクタと、 C、上記プリント配線板の両面に被せられ、上記プリン
ト配線板の上記コネクタが装着されない辺に沿って上記
プリント配線板に面接触する折曲片を具備した金属カバ
ーと、 D、上記金属カバーに形成された折曲片とプリント配線
板が積層された部分を被覆し、上記プリント配線板の3
辺に接合し、樹脂材によって形成されたフレームと、 によって構成したことを特徴とする電子カード。
1. A printed wiring board on which electronic components are mounted; B; a connector mounted on one side of the printed wiring board; C. the connector of the printed wiring board which is put on both sides of the printed wiring board. D, a metal cover having a bent piece that is in surface contact with the printed wiring board along the side where D is not attached, D, covering a portion where the bent piece formed on the metal cover and the printed wiring board are laminated, 3 of the above printed wiring board
An electronic card, comprising: a frame bonded to a side and formed of a resin material.
【請求項2】 請求項1記載の電子カードにおいて、上
記金属カバーに形成した折曲片が接触するプリント配線
板の面に共通電位点に電気的に接続されたグランドパタ
ーンを形成し、このグランドパターンを通じて上記金属
カバーを共通電位点に接続した構造としたことを特徴と
する電子カード。
2. The electronic card according to claim 1, wherein a ground pattern electrically connected to a common potential point is formed on a surface of the printed wiring board in contact with the bent piece formed on the metal cover. An electronic card, wherein the metal cover is connected to a common potential point through a pattern.
【請求項3】 一辺にコネクタが装着され、板面に電子
部品が実装されたプリント配線板と、このプリント基板
の上記コネクタが装着されない辺に沿ってプリント配線
の板面と面接触する折面片を具備する金属カバーとを用
意し、 上記プリント配線板の両面に上記金属カバーを被せ、上
記プリント配線板のコネクタが装着されていない辺に形
成される上記金属カバーの折曲片とプリント配線板を積
層した積層突出部分を樹脂成形金型に挿入し、上記積層
突出部分に樹脂材をモールド成形してフレームを形成
し、このフレームによって上記積層突出部分を固定した
ことを特徴とする電子カードの製造方法。
3. A printed wiring board on which a connector is mounted on one side and electronic components are mounted on a board surface, and a folded surface which comes into surface contact with the board surface of the printed wiring along a side of the printed board on which the connector is not mounted. A metal cover having a piece; a metal cover provided on both sides of the printed wiring board; a bent piece of the metal cover formed on a side of the printed wiring board where the connector is not mounted; An electronic card, wherein a laminated protruding portion obtained by laminating plates is inserted into a resin molding die, a resin material is molded on the laminated protruding portion to form a frame, and the laminated protruding portion is fixed by the frame. Manufacturing method.
JP34645297A 1997-12-16 1997-12-16 Electronic card and its manufacture Withdrawn JPH11175685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34645297A JPH11175685A (en) 1997-12-16 1997-12-16 Electronic card and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34645297A JPH11175685A (en) 1997-12-16 1997-12-16 Electronic card and its manufacture

Publications (1)

Publication Number Publication Date
JPH11175685A true JPH11175685A (en) 1999-07-02

Family

ID=18383535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34645297A Withdrawn JPH11175685A (en) 1997-12-16 1997-12-16 Electronic card and its manufacture

Country Status (1)

Country Link
JP (1) JPH11175685A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005602A1 (en) * 1999-07-21 2001-01-25 Ibiden Co., Ltd. Pc card and method for manufacturing the same
JP2006178701A (en) * 2004-12-22 2006-07-06 Renesas Technology Corp Memory card
JP2007172572A (en) * 2005-12-23 2007-07-05 Chin-Tong Liu Memory card packaging method and structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001005602A1 (en) * 1999-07-21 2001-01-25 Ibiden Co., Ltd. Pc card and method for manufacturing the same
JP2006178701A (en) * 2004-12-22 2006-07-06 Renesas Technology Corp Memory card
JP2007172572A (en) * 2005-12-23 2007-07-05 Chin-Tong Liu Memory card packaging method and structure

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