JPH1131890A - Circuit board - Google Patents

Circuit board

Info

Publication number
JPH1131890A
JPH1131890A JP18482597A JP18482597A JPH1131890A JP H1131890 A JPH1131890 A JP H1131890A JP 18482597 A JP18482597 A JP 18482597A JP 18482597 A JP18482597 A JP 18482597A JP H1131890 A JPH1131890 A JP H1131890A
Authority
JP
Japan
Prior art keywords
circuit board
circuit
board
exposed
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18482597A
Other languages
Japanese (ja)
Inventor
Hiroshi Iwamoto
洋 岩本
Takao Hisakado
隆雄 久角
Shoichi Irie
正一 入江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP18482597A priority Critical patent/JPH1131890A/en
Publication of JPH1131890A publication Critical patent/JPH1131890A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce the cost of a circuit board by eliminating the need of any connector, by exposing one side face of an external connecting terminal section constituting a wiring circuit pattern on the end section side of a circuit board. SOLUTION: A required wiring pattern 2 is formed on a circuit board 1 by punching a metallic sheet, and the board 1 is molded with an insulating resin 3. On a circuit board to be connected, a step section is provided at the end section of the board at a height which is about a half of the thickness of the board, and the surface of the external connecting terminals 6a of a wiring circuit pattern are exposed. The circuit board to be connected is provided with contact sections having spring properties, by cutting and raising the wiring circuit pattern on the opposite side of the insulating resin by means of a means, such as the press working, etc. When the two circuit boards are connected to each other, in addition, the step sections of both circuit boards are oppositely faced to each other, both circuit boards are connected to each other by aligning positioning holes 9 of both circuit boards with each other by using check pins, and the two circuit boards are electrically connected to each other by putting the contact sections having spring properties on the exposed sections 6a.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、配線回路パターン
を形成した金属板を絶縁性樹脂でモールドしてなる回路
基板と、その相互接続構造に関する。
The present invention relates to a circuit board formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin, and an interconnection structure thereof.

【0002】[0002]

【従来の技術】従来、回路基板の相互接続方法として
は、図5に示すものが一般的である。図5において、5
1a、51bは回路基板、52は基板対基板を接続する
コネクタのプラグ、53はコネクタのソケットである。
回路基板51aには、コネクタのプラグ52を実装し、
回路基板51bには、コネクタのソケット53を実装す
る。そして、プラグ52をソケット53に勘合させ、回
路基板51aと回路基板51bが電気的に接続される。
2. Description of the Related Art Conventionally, as a method of interconnecting circuit boards, the method shown in FIG. 5 is generally used. In FIG. 5, 5
1a and 51b are circuit boards, 52 is a connector plug for connecting the board to the board, and 53 is a connector socket.
A connector plug 52 is mounted on the circuit board 51a,
The socket 53 of the connector is mounted on the circuit board 51b. Then, the plug 52 is fitted into the socket 53, and the circuit board 51a and the circuit board 51b are electrically connected.

【0003】[0003]

【発明が解決しようとする課題】上記従来の回路基板の
接続方法では、以上のように接続されているので、コネ
クタを必要とし、コストが高かった。
In the above-mentioned conventional method of connecting circuit boards, since the connection is made as described above, a connector is required and the cost is high.

【0004】[0004]

【課題を解決するための手段】前記課題を解決するため
に本発明の回路基板は、金属板で作製した配線回路パタ
ーンを樹脂モールドしてなる回路基板において、前記配
線回路パターンを構成する外部接続端子部の片面側を前
記回路基板の端部側で露出させてなる。
In order to solve the above-mentioned problems, a circuit board according to the present invention is a circuit board formed by resin-molding a wiring circuit pattern made of a metal plate. One side of the terminal is exposed at the end of the circuit board.

【0005】上記構成によれば回路基板相互の接続に際
し、コネクタを不要にし、コストダウンを図れる。ま
た、接続部品が減少し接続の信頼性が向上する。
According to the above configuration, a connector is not required for connection between circuit boards, and cost can be reduced. In addition, the number of connection components is reduced, and the connection reliability is improved.

【0006】[0006]

【発明の実施の形態】本発明の第1の発明は、配線回路
パターンを形成した金属板を、絶縁性樹脂でモールドし
てなる回路基板において、前記回路基板の側端から所定
間隔離れた位置に少なくとも1つの位置決め孔を有し、
前記回路基板の端部を、前記回路基板厚みの半分の高さ
位置で段差状にし、モールドされた前記配線回路パター
ン表面を露出させたことを特徴とする回路基板としたも
ので、回路基板同士の接続時に、コネクタを不要にし、
コストダウンを図れるとともに、接続部品が減少するた
め、接続信頼性が向上する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first invention of the present invention relates to a circuit board formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin, at a position separated by a predetermined distance from a side end of the circuit board. Has at least one positioning hole,
An end portion of the circuit board is formed in a stepped shape at a height of half the thickness of the circuit board, and the surface of the molded wiring circuit pattern is exposed. When connecting, eliminates the need for connectors,
Since the cost can be reduced and the number of connection parts is reduced, the connection reliability is improved.

【0007】さらに、第2の発明は、配線回路パターン
を形成した金属板を、絶縁性樹脂でモールドしてなる回
路基板において、前記回路基板の側端から所定間隔離れ
た位置に少なくとも1つの位置決め孔を有し、前記回路
基板の端部を、前記回路基板厚みの半分の高さ位置で段
差状にし、モールドされた前記配線回路パターン表面を
露出させた前記回路基板と、前記回路基板の端部の露出
した前記配線回路パターンに、前記絶縁性樹脂層の反対
側に切りおこしを施し、バネ性を持つ接点部を設けたも
うひとつの前記回路基板を対向させて、前記回路基板の
端部を重ね合わせ、前記回路基板を接続させたことを特
徴とする回路基板接続方法としたものであり、回路基板
同士の接続時に、コネクタを不要にし、コストダウンを
図れるとともに、接続部品が減少するため、接続信頼性
が向上する。
Further, according to a second aspect of the present invention, in a circuit board formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin, at least one positioning member is positioned at a predetermined distance from a side end of the circuit board. A circuit board having a hole, the end of the circuit board being stepped at a height of half the thickness of the circuit board, and exposing the molded wiring circuit pattern surface; and an end of the circuit board. The exposed portion of the wiring circuit pattern is cut and cut on the opposite side of the insulating resin layer, and another circuit board provided with a contact portion having spring properties is opposed to an end of the circuit board. And a circuit board connection method characterized in that the circuit boards are connected to each other.When connecting the circuit boards, a connector is not required, and cost can be reduced. Since connection parts decreases, the connection reliability is improved.

【0008】さらに、第3の発明は、配線回路パターン
を形成した金属板を、絶縁性樹脂でモールドしてなる回
路基板において、前記回路基板の側端から所定間隔離れ
た位置に少なくとも1つの位置決め孔を有し、前記回路
基板の端部を、前記回路基板厚みの高さ位置で段差状に
し、モールドされた前記配線回路パターン表面を露出さ
せた前記回路基板と、前記回路基板の端部の露出した前
記配線回路パターンに、前記絶縁性樹脂層の反対側に切
りおこしを施し、バネ性を持つ接点部を設けたもうひと
つの前記回路基板を対向させて、前記回路基板の端部を
重ね合わせた回路基板接続方法を用いて、少なくとも2
枚以上の前記回路基板を接続させたことを特徴とする回
路基板としたものであり、回路基板同士の接続時にコネ
クタを不要にし、コストダウンを図れるとともに、接続
部品が減少するため、接続信頼性が向上する。
Further, a third aspect of the present invention relates to a circuit board formed by molding a metal plate on which a wiring circuit pattern is formed with an insulating resin, wherein at least one positioning member is positioned at a predetermined distance from a side end of the circuit board. Having a hole, the end of the circuit board is stepped at a height position of the circuit board thickness, the circuit board exposing the surface of the molded wiring circuit pattern, and the end of the circuit board The exposed wiring circuit pattern is cut and cut on the opposite side of the insulating resin layer, and another circuit board provided with a contact portion having a spring property is opposed to each other, and the ends of the circuit board are overlapped. At least 2 using the combined circuit board connection method
A circuit board characterized by connecting at least two circuit boards, eliminating the need for a connector when connecting the circuit boards to each other, reducing costs and reducing the number of connection parts, thereby reducing connection reliability. Is improved.

【0009】以下に、本発明の実施の形態における回路
基板について図面を用いて説明する。
A circuit board according to an embodiment of the present invention will be described below with reference to the drawings.

【0010】(実施の形態)図1(A)は本発明の一実
施の形態における回路基板の平面図、図1(B)は図1
(A)を切断線A−Aで切断した断面図、図2は本発明
の一実施の形態における回路基板の接続構造を示す断面
図、図3は本発明の一実施の形態における回路基板の接
続状態の斜視図を示す。図1〜図3において、本発明の
回路基板1は、金属板を打ち抜いて所要の配線回路パタ
ーン2を形成し、絶縁性樹脂3でモールドしてなる。接
続する回路基板1aは、回路基板端部4aに基板厚みの
約半分の高さ位置において段差部5aを設け、配線回路
パターン2aの外部接続端子部6aの表面を露出させて
なる。
(Embodiment) FIG. 1A is a plan view of a circuit board according to an embodiment of the present invention, and FIG.
FIG. 2A is a cross-sectional view taken along a cutting line AA, FIG. 2 is a cross-sectional view illustrating a connection structure of a circuit board according to an embodiment of the present invention, and FIG. The perspective view of a connection state is shown. 1 to 3, a circuit board 1 of the present invention is formed by punching a metal plate to form a required wiring circuit pattern 2 and molding the same with an insulating resin 3. The circuit board 1a to be connected is provided with a step 5a at a position about half the thickness of the board at the end 4a of the circuit board, exposing the surface of the external connection terminal 6a of the wiring circuit pattern 2a.

【0011】もう一方の回路基板1bは、回路基板端部
4bの段差部5bにおいて、配線回路パターン2bをプ
レス加工等の手段により、絶縁性樹脂3b層の反対側に
切りおこし7bを施し、バネ性を持つ接点部8bを設け
てある。そして、これらの回路基板の接続時には、これ
らの回路基板の段差部5a,5bを対向させ、互いの位
置決め孔9を合わせて、止めピン11により接続させ、
バネ性を持つ接点部8bと露出部6aが重なり合うこと
により、コネクタの構造となり、2枚の回路基板が電気
的に接続される。
The other circuit board 1b cuts and raises the wiring circuit pattern 2b on the opposite side of the insulating resin 3b layer by means such as press working at the stepped portion 5b of the circuit board end 4b and applies a spring 7b. A contact portion 8b having a property is provided. When these circuit boards are connected, the step portions 5a and 5b of these circuit boards are opposed to each other, the positioning holes 9 are aligned with each other, and the circuit boards are connected by the stopper pins 11.
The contact portion 8b having the spring property and the exposed portion 6a overlap each other to form a connector structure, and the two circuit boards are electrically connected.

【0012】また、図4に示すように、本発明により構
成した3枚の回路基板の内、1枚の回路基板の端部にそ
れぞれ段差部を設け、かつ、外部接続端子部を露出させ
ることにより、3枚の回路基板を一体的に接続できる。
Further, as shown in FIG. 4, of the three circuit boards constructed according to the present invention, a step is provided at each end of one circuit board, and the external connection terminal is exposed. Thereby, three circuit boards can be integrally connected.

【0013】[0013]

【発明の効果】以上のように本発明の回路基板によれ
ば、回路基板相互の接続に際しコネクタを不要にし、コ
ストダウンを図れる。また、接続部品が減少し接続の信
頼性が向上する。
As described above, according to the circuit board of the present invention, a connector is not required for connection between the circuit boards, and the cost can be reduced. In addition, the number of connection components is reduced, and the connection reliability is improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(A)本発明の一実施の形態における回路基板
の平面図 (B)図1(A)を切断線A−Aで切断した断面図
FIG. 1A is a plan view of a circuit board according to an embodiment of the present invention. FIG. 1B is a cross-sectional view taken along a line AA in FIG.

【図2】本発明の一実施の形態における回路基板の接続
過程を示す要部断面図
FIG. 2 is an essential part cross sectional view showing a process of connecting circuit boards in one embodiment of the present invention.

【図3】本発明の一実施の形態における回路基板の接続
後の斜視図
FIG. 3 is a perspective view after connection of a circuit board in one embodiment of the present invention.

【図4】本発明のもう一つの実施の形態における回路基
板の接続後の斜視図
FIG. 4 is a perspective view after connection of a circuit board according to another embodiment of the present invention.

【図5】従来の回路基板の接続状態の斜視図FIG. 5 is a perspective view of a connection state of a conventional circuit board.

【符号の説明】[Explanation of symbols]

1、1a,1b 回路基板 2、2a,2b 配線回路パターン 3、3a,3b 絶縁性樹脂 4a,4b 回路基板端部 5a,5b 段差部 6a 外部接続端子部 7b 切り起こし 8b 接点部 9 位置決め孔 10 止めピン 1, 1a, 1b Circuit board 2, 2a, 2b Wiring circuit pattern 3, 3a, 3b Insulating resin 4a, 4b Circuit board end 5a, 5b Step 6a External connection terminal 7b Cut and raised 8b Contact 9 Positioning hole 10 Stop pin

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 金属板で作製した配線回路パターンを樹
脂モールドしてなる回路基板において、前記配線回路パ
ターンを構成する外部接続端子部を前記回路基板の端部
側で露出させたことを特徴とする回路基板。
1. A circuit board formed by resin-molding a wiring circuit pattern made of a metal plate, wherein an external connection terminal portion constituting the wiring circuit pattern is exposed at an end of the circuit board. Circuit board.
【請求項2】 外部接続端子部を前記回路基板の両端部
側で露出させたことを特徴とする請求項1記載の回路基
板。
2. The circuit board according to claim 1, wherein the external connection terminal portions are exposed at both ends of the circuit board.
【請求項3】 露出面の位置を回路基板の板厚より小さ
くしたことを特徴とする請求項1記載の回路基板。
3. The circuit board according to claim 1, wherein the position of the exposed surface is smaller than the thickness of the circuit board.
【請求項4】 露出面の位置を回路基板の略1/2の厚
さ寸法としたことを特徴とする請求項3記載の回路基
板。
4. The circuit board according to claim 3, wherein the position of the exposed surface is approximately half the thickness of the circuit board.
【請求項5】 外部接続端子部の露出側に切り起こしを
突起させたことを特徴とする請求項3記載の回路基板。
5. The circuit board according to claim 3, wherein a cut-and-raised portion is projected on an exposed side of the external connection terminal portion.
【請求項6】 主面に少なくとも1つの位置決め孔を設
けたことを特徴とする請求項3記載の回路基板。
6. The circuit board according to claim 3, wherein at least one positioning hole is provided on the main surface.
【請求項7】 請求項1記載の回路基板を2枚用意し、
1枚の回路基板の端部に他の回路基板を積層し、外部接
続端子部の露出面側を相互に接触させ電気的に接続した
ことを特徴とする回路基板。
7. Two circuit boards according to claim 1 are prepared,
A circuit board, wherein another circuit board is laminated on an end of one circuit board, and the exposed surfaces of the external connection terminals are brought into contact with each other to be electrically connected.
【請求項8】 請求項1記載の回路基板を3枚用意し、
1枚の回路基板の両端部に他の2枚の回路基板をそれぞ
れ積層し、外部接続端子部の露出面側を相互に接触させ
電気的に接続したことを特徴とする回路基板。
8. Three circuit boards according to claim 1 are prepared,
A circuit board, wherein two other circuit boards are laminated on both ends of one circuit board, and the exposed surfaces of the external connection terminals are brought into contact with each other to be electrically connected.
JP18482597A 1997-07-10 1997-07-10 Circuit board Pending JPH1131890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18482597A JPH1131890A (en) 1997-07-10 1997-07-10 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18482597A JPH1131890A (en) 1997-07-10 1997-07-10 Circuit board

Publications (1)

Publication Number Publication Date
JPH1131890A true JPH1131890A (en) 1999-02-02

Family

ID=16159962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18482597A Pending JPH1131890A (en) 1997-07-10 1997-07-10 Circuit board

Country Status (1)

Country Link
JP (1) JPH1131890A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358421A (en) * 2000-06-12 2001-12-26 Matsushita Electric Ind Co Ltd Bonding structure of printed wiring board
WO2003081087A1 (en) * 2002-03-27 2003-10-02 Aisin Aw Co., Ltd. Control device with shift position detector, and power train with the control device
JPWO2004021479A1 (en) * 2002-08-30 2005-12-22 タイコ エレクトロニクス レイケム株式会社 Energizing terminal and adapter for energizing terminal
JP2007116609A (en) * 2005-10-24 2007-05-10 Murata Mfg Co Ltd Coil antenna structure and portable electronic device
WO2012165520A1 (en) * 2011-06-03 2012-12-06 住友電気工業株式会社 Wiring body connecting structure, wiring body, electronic device, illumination device, and method for producing electronic device
WO2015121325A1 (en) * 2014-02-17 2015-08-20 Zumtobel Lighting Gmbh Printed circuit board comprising specific coupling regions
CN112399721A (en) * 2020-11-24 2021-02-23 赣州市硕祺电子科技有限公司 Automatic punching equipment for mounting hole of PCB

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358421A (en) * 2000-06-12 2001-12-26 Matsushita Electric Ind Co Ltd Bonding structure of printed wiring board
WO2003081087A1 (en) * 2002-03-27 2003-10-02 Aisin Aw Co., Ltd. Control device with shift position detector, and power train with the control device
US7178419B2 (en) 2002-03-27 2007-02-20 Aisin Aw Co., Ltd. Control device with shift position detector, and power train with the control device
JPWO2004021479A1 (en) * 2002-08-30 2005-12-22 タイコ エレクトロニクス レイケム株式会社 Energizing terminal and adapter for energizing terminal
JP2010278022A (en) * 2002-08-30 2010-12-09 Tyco Electronics Japan Kk Current conducting terminal, and adapter for current conducting terminal
JP2007116609A (en) * 2005-10-24 2007-05-10 Murata Mfg Co Ltd Coil antenna structure and portable electronic device
WO2012165520A1 (en) * 2011-06-03 2012-12-06 住友電気工業株式会社 Wiring body connecting structure, wiring body, electronic device, illumination device, and method for producing electronic device
JP2012253213A (en) * 2011-06-03 2012-12-20 Sumitomo Electric Ind Ltd Connection structure of wiring bodies, wiring body, electronic apparatus, and manufacturing method of electronic apparatus
WO2015121325A1 (en) * 2014-02-17 2015-08-20 Zumtobel Lighting Gmbh Printed circuit board comprising specific coupling regions
CN112399721A (en) * 2020-11-24 2021-02-23 赣州市硕祺电子科技有限公司 Automatic punching equipment for mounting hole of PCB

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