JP2007172572A - Memory card packaging method and structure - Google Patents

Memory card packaging method and structure Download PDF

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JP2007172572A
JP2007172572A JP2006123777A JP2006123777A JP2007172572A JP 2007172572 A JP2007172572 A JP 2007172572A JP 2006123777 A JP2006123777 A JP 2006123777A JP 2006123777 A JP2006123777 A JP 2006123777A JP 2007172572 A JP2007172572 A JP 2007172572A
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memory card
housing shell
circuit board
electric circuit
card structure
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Chin-Tong Liu
欽棟 劉
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures

Abstract

<P>PROBLEM TO BE SOLVED: To provide a memory card packaging method and structure that increase a yield rate and reduce production costs. <P>SOLUTION: The memory card packaging method and structure basically set an electric circuit board in a housing shell, mount a pressure plate over the housing shell, and enclose the periphery of the housing shell and pressure plate by injection insert molding. This forms the shape of a memory card and completely seals the joints of the parts to provide an appreciable waterproof effect for the memory card and reduce percent defective and production costs in the production process. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は一種のメモリカード技術、特に一種の射出インサート成型により、メモリカードに良い実装効果を与える設計に関わる。   The present invention relates to a kind of memory card technology, and particularly to a design that gives a good mounting effect to a memory card by a kind of injection insert molding.

デジタルカメラ、携帯電話、ＰＤＡ、ビデオ・オーディオなどのデジタル製品は次から次へと発売し、その製品技術も次第に成熟したため、消費者がフラッシュメモリカードに対する需要度も高い。現在、フラッシュメモリカードはコンパクトフラッシュ（登録商標）メモリカード（ＣｏｍＰａｃｔ Ｆｌａｓｈ Ｃａｒｄ， ＣＦ）、スマートメディアカード（ＳｍａｒｔＭｅｄｉａ（登録商標） Ｃａｒｄ， ＳＭＣ）、マルチメディアカード（Ｍｕｌｔｉｍｅｄｉａ Ｃａｒｄ， ＭＭＣ）、セキュアデジタルカード（Ｓｅｃｕｒｅ Ｄｉｇｉｔａｌ Ｃａｒｄ， ＳＤ Ｃａｒｄ）、メモリスティックカード（Ｍｅｍｏｒｙ Ｓｔｉｃｋ Ｃａｒｄ， ＭＳ）などが主流である。さらに、ｘＤ−Ｐｉｃｔｕｒｅ ｃａｒｄはもっとも新しいメモリカードである。メモリ容量が向上した結果、保存データの量も数倍に増えている。しかしながら、メモリカードが破損すると、多くの貴重なデータもたちまち消えてしまうことを意味する。このため、業者はメモリカードの設計にあたり、絶えずに改善を努めてきたため、本体が薄いわりに、適切な防水効果を持たせる製品を研究している。   As digital products such as digital cameras, mobile phones, PDAs, and video / audio are released one after another, and their product technologies have gradually matured, consumers are highly demanded for flash memory cards. Currently, flash memory cards are compact flash (registered trademark) memory cards (ComPact Flash Card, CF), smart media cards (SmartMedia (registered trademark) Card, SMC), multimedia cards (Multimedia Card, MMC), secure digital cards ( Secure Digital Card (SD Card), Memory Stick Card (Memory Stick Card, MS), etc. are the mainstream. Furthermore, xD-Picture card is the newest memory card. As a result of the increased memory capacity, the amount of stored data has increased several times. However, if the memory card is damaged, it means that a lot of valuable data will be lost immediately. For this reason, manufacturers have continually strived to improve the design of memory cards, so they are researching products that provide an appropriate waterproofing effect despite the fact that the main body is thin.

公知技術のメモリカード構造は通常２片式、つまり、上・下２片に電気回路板を挟み、高周波溶着技術により、上・下２片を結合して、メモリカード構造を形成する。しかしながら、欠点は繰り返して電子製品より挿抜することにより、結合場所が破裂や破損し、または結合場所に小さいひびができるなど、水気が内部の電気回路板に浸入してしまい、使用寿命を短縮させる。   The memory card structure of the known technology is usually a two-piece type, that is, an electric circuit board is sandwiched between two upper and lower pieces, and the upper and lower two pieces are joined by a high frequency welding technique to form a memory card structure. However, the drawback is that repeated insertion and removal from the electronic product will cause the water to enter the internal electric circuit board, for example, the bonding location will be ruptured or damaged, or the bonding location may be cracked. .

本発明の主な目的は、最終段階の射出インサート成型工程において、原料を各部品の周りに分布させることにより、包み層を形成し、射出インサート成型のとき、原料が電気回路板に衝撃することによる破損を避けて、製品良品率を向上し、生産コストを軽減するメモリカード実装方法の提供を主な目的とする。万が一、実装工程において不良品があっても、不良品の部分をカットして、使用可能な電気回路板を取り出して、再使用できるため、仕損品を軽減できる。   The main object of the present invention is to form a wrapping layer by distributing the raw material around each part in the final injection insert molding process, and at the time of injection insert molding, the raw material impacts the electric circuit board. The main purpose is to provide a memory card mounting method that avoids damage caused by, improves product yield and reduces production costs. In the unlikely event that there is a defective product in the mounting process, the defective product can be cut, the usable electrical circuit board can be taken out and reused.

本発明の次の主な目的は、包み層は射出インサート成型により、原料を各部品の周りおよび接合場所に融合し、各部品に良好なシールを提供し、極めて良い防水効果を提供する。   The next main object of the present invention is that the wrapping layer is formed by injection insert molding to fuse the raw material around each part and at the joining location, providing a good seal for each part and providing a very good waterproof effect.

本発明のさらに一つの目的は、２片式構造により、電気回路板を実装する各種のメモリカードがすべて利用可能な実装方法と構造を提供する。   Still another object of the present invention is to provide a mounting method and structure in which various memory cards for mounting an electric circuit board can be used by a two-piece structure.

請求項１の発明は、一種のメモリカード実装方法において、以下の手順を含まれ、
ａ.電気回路板をハウジングシェルに取り付け、電気回路板の電気接続部を露出させ、
ｂ.押え板をハウジングシェルの天面に取り付け、前記の電気接続部を露出させ、
ｃ.射出インサート成型により、包み層をハウジングシェルと押え板の周りに覆い、メモリカード構造を形成することを特徴とするメモリカード実装方法としている。
請求項２の発明は、請求項１記載のメモリカード実装方法において、手順ａにおいて、該ハウジングシェル天面に引き込んだ収容空間を設け、該電気接回路板をとの内部に取り付けることを特徴とするメモリカード実装方法としている。
請求項３の発明は、請求項１記載のメモリカード実装方法において、手順ｃにおいて、包み層最後の成型区域は、ハウジングシェルと押え板の周り、および電気接回路板の電気接続部周りとハウジングシェル、および押え板の接合場所を含まれることを特徴とするメモリカード実装方法としている。 The invention of claim 1 is a kind of memory card mounting method, and includes the following steps:
a. Attach the electrical circuit board to the housing shell, expose the electrical connections of the electrical circuit board,
b. Attach the presser plate to the top surface of the housing shell to expose the electrical connection part,
c. A memory card mounting method characterized by forming a memory card structure by covering the housing layer and the holding plate by injection insert molding.
According to a second aspect of the present invention, in the memory card mounting method according to the first aspect, in step a, an accommodation space drawn into the top surface of the housing shell is provided, and the electrical connection circuit board is attached to the interior. It is a memory card mounting method.
According to a third aspect of the present invention, in the method for mounting a memory card according to the first aspect, in step c, the last molding area of the wrapping layer is around the housing shell and the holding plate, and around the electric connection portion of the electric contact circuit board and The memory card mounting method is characterized in that the joint location of the shell and the pressing plate is included.

請求項４の発明は、一種のメモリカード構造は、ハウジングシェル、電気回路板、押え板及び包み層を含み、
ハウジングシェルはその天面に引き込んだ収容空間を設けて、電気回路板を取り付け、 電気回路板はハウジングシェルに取り付け、一つの側面に備える電気接続部を露出させ、
押え板を前記のハウジングシェルに被せて、電気接続部以外の電気回路板を覆い、
包み層は原料を押え板とハウジングシェルの周り、電気回路板と押え板との接合場所に、射出インサート成型し、標準規格のメモリカードを形成し、部品の接合場所を完全にシールすることを特徴とするメモリカード構造としている。
請求項５の発明は、請求項４記載のメモリカード構造において、該包み層は射出インサート成型により、原料を押え板、ハウジングシェルおよび電気接回路板を結合することを特徴とするメモリカード構造としている。
請求項６の発明は、請求項４記載のメモリカード構造において、該収容空間内部は、さらに一つ以上の収容空間と複数の対応溝を設けることを特徴とするメモリカード構造としている。
請求項７の発明は、請求項４記載のメモリカード構造において、該ハウジングシェルは少なくとも二つの側面に傾斜面を形成することを特徴とするメモリカード構造としている。
請求項８の発明は、請求項４記載のメモリカード構造において、該押え板周りは少なくとも二つの側面に傾斜面を形成することを特徴とするメモリカード構造としている。
請求項９の発明は、請求項４記載のメモリカード構造において、該押え板の下部に大きい面積の突起塊を設け、該突起塊は該ハウジングシェル収容空間の形状に対応し、組み立てるとき、該突起塊を収容空間に取り付けることを特徴とするメモリカード構造としている。
請求項１０の発明は、請求項４記載のメモリカード構造において、該押え板とハウジングシェルの片側を接着し、該押え板を折り畳んでハウジングシェル天面に被せることを特徴とするメモリカード構造としている。 According to the invention of claim 4, a kind of memory card structure includes a housing shell, an electric circuit board, a holding plate and a wrapping layer,
The housing shell is provided with an accommodation space drawn into the top surface, and an electric circuit board is attached, the electric circuit board is attached to the housing shell, and an electric connection portion provided on one side surface is exposed,
Cover the presser plate over the housing shell and cover the electrical circuit board other than the electrical connection part,
The wrapping layer is made by injection-molding the raw material around the presser plate and housing shell, and at the place where the electric circuit board and presser plate are joined, to form a standard memory card, and to completely seal the joint location of the parts The memory card structure is characteristic.
According to a fifth aspect of the present invention, there is provided a memory card structure according to the fourth aspect, wherein the wrapping layer is formed by injection insert molding, and the raw material is joined to the holding plate, the housing shell, and the electric circuit board. Yes.
According to a sixth aspect of the present invention, in the memory card structure according to the fourth aspect, the inside of the accommodation space is further provided with one or more accommodation spaces and a plurality of corresponding grooves.
A seventh aspect of the present invention is the memory card structure according to the fourth aspect, wherein the housing shell is formed with inclined surfaces on at least two side surfaces.
According to an eighth aspect of the present invention, there is provided a memory card structure according to the fourth aspect, wherein an inclined surface is formed on at least two side surfaces around the pressing plate.
According to a ninth aspect of the present invention, in the memory card structure according to the fourth aspect of the present invention, a protrusion lump having a large area is provided at a lower portion of the holding plate, and the protrusion lump corresponds to the shape of the housing shell receiving space. The memory card structure is characterized in that the protrusion lump is attached to the accommodation space.
A tenth aspect of the present invention is the memory card structure according to the fourth aspect, wherein the presser plate and one side of the housing shell are bonded together, and the presser plate is folded and covered on the top surface of the housing shell. Yes.

本発明は、主に電気回路板をハウジングシェルに取り付け、電気回路板の電気接続部を露出させる。引き続きに、押え板をハウジングシェルに取り付けて、電気接続部以外の部分を覆った包み層をハウジングシェルと押え板の周りに形成する。該包み層は射出インサート成型により原料をメモリカードに成型する。この方式で成型するメモリカード構造の防水性および強度は極めて強いである。   The present invention mainly attaches the electric circuit board to the housing shell and exposes the electric connection portion of the electric circuit board. Subsequently, the holding plate is attached to the housing shell, and a wrapping layer covering a portion other than the electrical connection portion is formed around the housing shell and the holding plate. The wrapping layer is formed from a raw material into a memory card by injection insert molding. The waterproofness and strength of the memory card structure molded by this method are extremely strong.

図１に示すものは、本発明のメモリカード実装方法の生産フロー図である。以下の手順を含まれる。
手順１１、電気回路板をハウジングシェルに取り付け、電気回路板の電気接続部を露出さる。
手順１２、押え板をハウジングシェル上部に取り付け、電気回路板の電気接続部のみを露出させる。
手順１３、射出インサート成型により、ハウジングシェルと押え板の周りに包み層を形成し、該包み層の区域は、ハウジングシェルと押え板周りの接合場所、および電気回路板の電気接続部周りとハウジングシェルと押え板の接合場所を含まれる。原料は硬化する過程に前工程で生産したハウジングシェルと押え板を融合して、電気接続部のみを露出させ、完全にシールした構造体を形成する。これにより、メモリカードの形状を仕上げる。 FIG. 1 is a production flow diagram of the memory card mounting method of the present invention. The following procedures are included.
Step 11: Attach the electrical circuit board to the housing shell and expose the electrical connections of the electrical circuit board.
Step 12: Attach the presser plate to the upper part of the housing shell and expose only the electrical connection part of the electric circuit board.
Step 13: A wrapping layer is formed around the housing shell and the presser plate by injection insert molding, and the area of the wrapping layer includes the joint portion around the housing shell and the presser plate, and the electrical connection portion of the electric circuit board and the housing. It includes the place where the shell and presser plate are joined. The raw material fuses the housing shell and presser plate produced in the previous process during the curing process to expose only the electrical connection and form a completely sealed structure. As a result, the shape of the memory card is finished.

本発明の製造方式について、セキュアデジタルカード（ＳＤ Ｃａｒｄ）の構造をもって説明する。ただし、これにより本発明に制限を加わるべきではない。本発明の技術によるメモリカード構造はすべて本発明の請求範疇に含まれるべきとする。図２に示すとおり、該ハウジングシェル２と押え板３の形状をあらかじめに成型する。該ハウジングシェル２の天面区域にやや引き込んだ収容空間２１を設け、該収容空間２１の形状は、該電気回路板４の外形による。収容空間２１内部は新たに収容溝２１１深く設け、複数の対応溝２１２を浅く設ける。該収容溝２１１は一つ以上とし、電気回路板４に設けるメモリチップ４１の場所と形状による（該電気回路板に二つのメモリチップを設けるときは、二つの収容溝または一つの大きめの収容溝を設ける）。該対応溝２１２は小さいチップ４２と複数のハンダ付け場所４３、４４に対応し、それぞれの対応溝２１２の形状は一定しない。対応する部品をかぶせた後に、溝に隠せば良い。電気回路板４をハウジングシェル２にかぶせたとき、関連の電気回路と接点とも干渉されないようにする。該電気回路板４は電子製品に挿入するため、他面に複数の電気接続部４５（ゴールドフィンガー）（図３）を設ける。該ハウジングシェル２と押え板３の合計厚みはこの種のセキュアデジタルカード（ＳＤ Ｃａｒｄ）規格の厚みと同様である。本発明は射出インサート成型により、原料（包み層）をハウジングシェル２と押え板３の周りに成型するため、該ハウジングシェル２の外形は標準規格よりやや小さく設ける。その周り二つ以上の側面に傾斜面２２を形成し、該押え板３周りもこれに合わせて、二つ以上の側面に傾斜面３１を設けて、粘着するときの頑丈度を向上する。該押え板３の長さを短く、ハウジングシェル２の天面にかぶせるとき、前記の電気回路板４の電気接続部４５を遮らない。   The manufacturing method of the present invention will be described with the structure of a secure digital card (SD Card). However, this should not limit the present invention. All memory card structures according to the technology of the present invention should be included in the scope of the claims of the present invention. As shown in FIG. 2, the shapes of the housing shell 2 and the presser plate 3 are molded in advance. A housing space 21 that is slightly retracted is provided in the top surface area of the housing shell 2, and the shape of the housing space 21 depends on the outer shape of the electric circuit board 4. The interior of the accommodation space 21 is newly provided deeper in the accommodation groove 211 and a plurality of corresponding grooves 212 are provided shallower. According to the location and shape of the memory chip 41 provided on the electric circuit board 4 (when two memory chips are provided on the electric circuit board, there are two receiving grooves or one larger receiving groove. Is provided). The corresponding groove 212 corresponds to the small chip 42 and the plurality of soldering locations 43 and 44, and the shape of each corresponding groove 212 is not constant. After covering the corresponding parts, they can be hidden in the groove. When the electric circuit board 4 is placed on the housing shell 2, the related electric circuit and the contacts are prevented from interfering with each other. In order to insert the electric circuit board 4 into an electronic product, a plurality of electric connection portions 45 (gold fingers) (FIG. 3) are provided on the other surface. The total thickness of the housing shell 2 and the presser plate 3 is the same as the thickness of this type of secure digital card (SD Card) standard. In the present invention, since the raw material (wrapping layer) is molded around the housing shell 2 and the presser plate 3 by injection insert molding, the outer shape of the housing shell 2 is slightly smaller than the standard. The inclined surface 22 is formed on two or more side surfaces around it, and the periphery of the pressing plate 3 is also provided with the inclined surfaces 31 on two or more side surfaces to improve the robustness when sticking. When the length of the presser plate 3 is short and covers the top surface of the housing shell 2, the electric connection portion 45 of the electric circuit plate 4 is not blocked.

図３と図４に示すものは、本発明の電気回路板４をハウジングシェル２の収容空間２１に取り付け、該押え板３をハウジングシェル２天面にかぶせた立体図と断面概略図である（該電気回路板は概略を示し、断面を示していない）。これは前記の手順１２の状態であり、該電気回路板４は電気接続部４５のみを露出させ、該押え板３はハウジングシェル２の天面に覆う。本発明において、該押え板３は、射出インサート成型により原料を勢い力で電気回路板４に射出することにより、電気回路板４の破裂や破損を防止するために設ける。   3 and 4 are a three-dimensional view and a schematic cross-sectional view in which the electric circuit board 4 of the present invention is attached to the housing space 21 of the housing shell 2 and the pressing plate 3 is placed on the top surface of the housing shell 2 ( The electrical circuit board is shown schematically and not in cross section). This is the state of the procedure 12 described above, and the electric circuit board 4 exposes only the electric connection portion 45, and the pressing plate 3 covers the top surface of the housing shell 2. In the present invention, the presser plate 3 is provided in order to prevent the electric circuit board 4 from being ruptured or damaged by injecting the raw material onto the electric circuit board 4 with a force by injection insert molding.

図５と図６に示すものは、本発明の製品の立体図と断面概略図である。これは前記の手順１３を実施した後の製品図である。射出インサート成型による包み層Ａの原料、ハウジングシェル２および押え板３とも同じ材料を使用するため、固まった後は融合して、一体構造となる。シール効果は極めて良い。さらに、ハウジングシェル２周りの傾斜面２２と押え板３の傾斜面３１は粘着後の締結強度を強化する。図示のとおり、最後に包み層Ａは成型するとき、原料は主にハウジングシェル２と押え板３の周り、および電気回路板４の電気接続部４５に分布し、電気回路板４を完全にシールしたメモリカード構造を形成する。射出インサート成型により、ハウジングシェル２と押え板３および電気回路板４の接合場所を完全にシールしているため、極めて良い防水効果が得られる。   5 and 6 are a three-dimensional view and a schematic cross-sectional view of the product of the present invention. This is a product drawing after carrying out the above-mentioned procedure 13. Since the same material is used for the raw material of the wrapping layer A by injection insert molding, the housing shell 2 and the presser plate 3, they are fused to form an integral structure after they are hardened. The sealing effect is very good. Furthermore, the inclined surface 22 around the housing shell 2 and the inclined surface 31 of the presser plate 3 reinforce the fastening strength after adhesion. As shown in the figure, when the wrapping layer A is finally molded, the raw material is mainly distributed around the housing shell 2 and the presser plate 3 and in the electric connection portion 45 of the electric circuit board 4 to completely seal the electric circuit board 4. A memory card structure is formed. Since the place where the housing shell 2, the presser plate 3 and the electric circuit board 4 are joined is completely sealed by injection insert molding, a very good waterproof effect can be obtained.

前記に説明したとおり、本発明を利用したメモリカードの構造は、以下の部品を含まれる。
ハウジングシェルを設け、その天面に引き込んだ収容空間を設けて、電気回路板を取り付ける。
電気回路板をハウジングシェルに取り付け、一つの側面に備える電気接続部を露出させる。
押え板を前記のハウジングシェルに被せて、電気接続部以外の電気回路板を覆う。
包み層を設け、原料を押え板とハウジングシェルの周り、電気回路板と押え板との接合場所に、射出インサート成型し、標準規格のメモリカードを形成し、部品の接合場所を完全にシールする。 As described above, the structure of the memory card using the present invention includes the following parts.
A housing shell is provided, an accommodation space drawn into the top surface is provided, and an electric circuit board is attached.
An electrical circuit board is attached to the housing shell to expose an electrical connection provided on one side.
The holding plate is placed on the housing shell to cover the electric circuit board other than the electric connection portion.
A wrapping layer is provided, and the raw material is injection-molded around the presser plate and housing shell, and at the place where the electric circuit board and presser plate are joined, to form a standard memory card, and the part joining location is completely sealed .

図７に示すものは、本発明実施例２における立体分解図である。本実施例は、主に該押え板３の形状を改変し、大きい面積の突起塊３２を設け、該突起塊３２はハウジングシェル２の収容空間２１の形状に対応する。図８に示すとおり、本発明を組み立てるとき、該電気回路板４をハウジングシェル２内部の収容空間２１を設けた後、該押え板３を被せて、突起塊３２を該収容空間２１に取り付ける。その目的は、１.最後の射出インサート成型のとき、押え板３は原料注入の衝撃による位置ずれを発生しない。２ .原料は押え板とハウジングシェルの接合場所から内部に浸入することがない。よって、この方法で実装したメモリカードの良品率は高いである。図９に示すものは、本発明実施例２によるメモリカード製品の断面図である。   FIG. 7 is a three-dimensional exploded view of Example 2 of the present invention. In the present embodiment, the shape of the presser plate 3 is mainly modified to provide a large projecting mass 32, which corresponds to the shape of the housing space 21 of the housing shell 2. As shown in FIG. 8, when assembling the present invention, the electric circuit board 4 is provided with the accommodating space 21 inside the housing shell 2, and then the pressing plate 3 is covered to attach the protruding mass 32 to the accommodating space 21. The purpose is as follows: 1. At the time of the final injection insert molding, the presser plate 3 is not displaced due to the impact of the raw material injection. 2. The raw material does not enter the inside from the place where the holding plate and the housing shell are joined. Therefore, the yield rate of memory cards mounted by this method is high. FIG. 9 is a cross-sectional view of a memory card product according to Embodiment 2 of the present invention.

図１０に示すものは、本発明の実施例３における立体図である。本実施例において、該ハウジングシェル２は押え板３の片側に結合し、結合場所の厚みが薄いため、該押え板３は組み立てるとき、折り畳んでハウジングシェル２に被せた上、最後に射出インサート成型により、メモリカード構造を形成する。本実施例の長所は、ハウジングシェル２と押え板３を一緒に射出インサート成型し、単独部品を形成して、後工程を順調に進められるほか、生産のとき、ハウジングシェルと押え板を別々の金型を使用する必要がない。生産コストを軽減できる。   FIG. 10 is a three-dimensional view of the third embodiment of the present invention. In this embodiment, the housing shell 2 is joined to one side of the presser plate 3, and the thickness of the connecting place is thin. Thus, a memory card structure is formed. The advantage of this embodiment is that the housing shell 2 and the presser plate 3 are injection-molded together to form a single part, and the subsequent process can proceed smoothly. There is no need to use a mold. Production costs can be reduced.

本発明のフロー図である。It is a flowchart of this invention. 本発明をセキュアデジタルカード（ＳＤ）のハウジングシェル、電気回路板と押え板に応用した立体図である。3 is a three-dimensional view in which the present invention is applied to a housing shell, an electric circuit board, and a presser board of a secure digital card (SD). FIG. 本発明の電気回路板をハウジングシェルに取り付けた後、押え板をその上にかぶせた立体図である。FIG. 3 is a three-dimensional view of the electric circuit board of the present invention attached to the housing shell and a presser plate placed thereon. 図３の断面図である。FIG. 4 is a cross-sectional view of FIG. 3. 本発明の製品の立体図である。It is a three-dimensional view of the product of the present invention. 本発明の製品の断面図である。It is sectional drawing of the product of this invention. 本発明の実施例２におけるハウジングシェル、押え板と電気回路板の立体図である。It is a three-dimensional view of a housing shell, a presser plate, and an electric circuit board in Example 2 of the present invention. 本発明の実施例２における電気回路板をハウジングシェルに取り付けた後、押え板をかぶせた断面図である。It is sectional drawing which covered the pressing plate after attaching the electric circuit board in Example 2 of this invention to the housing shell. 本発明実施例２における製品の断面図である。It is sectional drawing of the product in this invention Example 2. FIG. 本発明実施例３におけるハウジングシェルと押え板の立体図である。It is a three-dimensional view of the housing shell and the presser plate in Example 3 of the present invention.

符号の説明Explanation of symbols

２ ハウジングシェル
２１ 収容空間
２１１ 収容溝
２１２ 対応溝
２２ 傾斜面
３ 押え板
３１ 傾斜面
４ 電気回路板
４１ メモリチップ
４２ チップ
４３ ハンダ付け場所
４４ ハンダ付け場所
４５ 電気接続部 2 Housing shell 21 Housing space 211 Housing groove 212 Corresponding groove 22 Inclined surface 3 Press plate 31 Inclined surface 4 Electric circuit board 41 Memory chip 42 Chip 43 Soldering place 44 Soldering place 45 Electrical connection part

Claims (10)

一種のメモリカード実装方法において、以下の手順を含まれ、
ａ.電気回路板をハウジングシェルに取り付け、電気回路板の電気接続部を露出させ、
ｂ.押え板をハウジングシェルの天面に取り付け、前記の電気接続部を露出させ、
ｃ.射出インサート成型により、包み層をハウジングシェルと押え板の周りに覆い、メモリカード構造を形成することを特徴とするメモリカード実装方法。 In a kind of memory card mounting method, the following steps are included,
a. Attach the electrical circuit board to the housing shell, expose the electrical connections of the electrical circuit board,
b. Attach the presser plate to the top surface of the housing shell to expose the electrical connection part,
c. A memory card mounting method comprising forming a memory card structure by covering the housing layer and the holding plate by injection insert molding. 請求項１記載のメモリカード実装方法において、手順ａにおいて、該ハウジングシェル天面に引き込んだ収容空間を設け、該電気接回路板をとの内部に取り付けることを特徴とするメモリカード実装方法。   2. The memory card mounting method according to claim 1, wherein in step a, an accommodation space drawn into the top surface of the housing shell is provided and the electric circuit board is attached to the inside. 請求項１記載のメモリカード実装方法において、手順ｃにおいて、包み層最後の成型区域は、ハウジングシェルと押え板の周り、および電気接回路板の電気接続部周りとハウジングシェル、および押え板の接合場所を含まれることを特徴とするメモリカード実装方法。   2. The memory card mounting method according to claim 1, wherein in step c, the molding area at the end of the wrapping layer is formed around the housing shell and the holding plate, and around the electric connection portion of the electric circuit board and the housing shell and the holding plate. A memory card mounting method comprising a location. 一種のメモリカード構造は、ハウジングシェル、電気回路板、押え板及び包み層を含み、
ハウジングシェルはその天面に引き込んだ収容空間を設けて、電気回路板を取り付け、 電気回路板はハウジングシェルに取り付け、一つの側面に備える電気接続部を露出させ、
押え板を前記のハウジングシェルに被せて、電気接続部以外の電気回路板を覆い、
包み層は原料を押え板とハウジングシェルの周り、電気回路板と押え板との接合場所に、射出インサート成型し、標準規格のメモリカードを形成し、部品の接合場所を完全にシールすることを特徴とするメモリカード構造。 A type of memory card structure includes a housing shell, an electrical circuit board, a presser plate and a wrapping layer,
The housing shell is provided with an accommodation space drawn into the top surface, and an electric circuit board is attached, the electric circuit board is attached to the housing shell, and an electric connection portion provided on one side surface is exposed,
Cover the presser plate over the housing shell and cover the electrical circuit board other than the electrical connection part,
The wrapping layer is made by injection-molding the raw material around the presser plate and housing shell, and at the place where the electric circuit board and presser plate are joined, to form a standard memory card, and to completely seal the joint location of the parts A featured memory card structure. 請求項４記載のメモリカード構造において、該包み層は射出インサート成型により、原料を押え板、ハウジングシェルおよび電気接回路板を結合することを特徴とするメモリカード構造。   5. The memory card structure according to claim 4, wherein the wrapping layer is formed by injection insert molding, and the presser plate, the housing shell, and the electric contact circuit board are joined to each other. 請求項４記載のメモリカード構造において、該収容空間内部は、さらに一つ以上の収容空間と複数の対応溝を設けることを特徴とするメモリカード構造。   5. The memory card structure according to claim 4, further comprising one or more housing spaces and a plurality of corresponding grooves in the housing space. 請求項４記載のメモリカード構造において、該ハウジングシェルは少なくとも二つの側面に傾斜面を形成することを特徴とするメモリカード構造。   5. The memory card structure according to claim 4, wherein the housing shell has inclined surfaces on at least two side surfaces. 請求項４記載のメモリカード構造において、該押え板周りは少なくとも二つの側面に傾斜面を形成することを特徴とするメモリカード構造。   5. The memory card structure according to claim 4, wherein an inclined surface is formed on at least two side surfaces around the pressing plate. 請求項４記載のメモリカード構造において、該押え板の下部に大きい面積の突起塊を設け、該突起塊は該ハウジングシェル収容空間の形状に対応し、組み立てるとき、該突起塊を収容空間に取り付けることを特徴とするメモリカード構造。   5. The memory card structure according to claim 4, wherein a protrusion lump having a large area is provided at a lower portion of the pressing plate, and the protrusion lump corresponds to a shape of the housing shell receiving space, and the protruding lump is attached to the receiving space when assembled. A memory card structure characterized by that. 請求項４記載のメモリカード構造において、該押え板とハウジングシェルの片側を接着し、該押え板を折り畳んでハウジングシェル天面に被せることを特徴とするメモリカード構造。
5. The memory card structure according to claim 4, wherein the holding plate and one side of the housing shell are bonded together, and the holding plate is folded and covered on the top surface of the housing shell.
JP2006123777A 2005-12-23 2006-04-27 Memory card packaging method and structure Pending JP2007172572A (en)

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