1275098 〜 九、發明說明： 【發明所屬之技術領域】 本發明為-種記憶卡的技術領域，尤其指-種射出成 型方式使記憶卡獲得良好封裝之設計。 ^ 【先前技術】 隨著數位相機、行動電話、個人數位助理器、影音播放器 • 等數位產品的不斷推陳出新，產品技術日漸成熟，使得消費者 對於快閃記憶卡需求量只增不減。目前市場上常見的快閃記憶 卡產品主要分為快閃記憶卡。mpaet F丨ash (GF) eard、1275098~ IX. Description of the Invention: [Technical Field] The present invention is a technical field of a memory card, and particularly refers to a design in which an injection molding method is used to obtain a good package of a memory card. ^ [Prior Art] With the continuous development of digital cameras, mobile phones, personal digital assistants, video players, etc., the product technology is becoming more and more mature, making consumers' demand for flash memory cards only increasing. Currently, flash memory card products commonly found on the market are mainly classified into flash memory cards. Mpaet F丨ash (GF) eard,
Media Card (SMG 卡）、多媒針隨丨 Media ㈣（MMc)、Media Card (SMG card), multi-media pin with Media (4) (MMc),
Secure Digital (SD) Card ^ Memory Stick (MS) Card(MS 卡）等。另外 xD-picture eani _____ 卡。由於讀體容量不斷地提昇，所能存取的資料量也提昇 • 數倍’相對地一旦破裂損壞，也代表使用者珍貴的眾多資料立 即消失殆盡’因此廠商在研發擴充記憶卡容量的同時，亦不斷 改良結構’使之雖薄但不易破損，並具有適當的防水效果。 傳統的記憶卡結構通常為二片式，即利用上下兩片結構將 電路板夾設其中’再利用高週波溶接技術將上下兩片接合在一 起’形成-記憶卡結構’但缺點是長時間多次抽取於電子產品 時，容易使接合處破裂而損壞，或是接合處容易產生極小的空 1275098 隙’使水份滲透至内部電路板處，故使用壽命不長。因此本於 月人即研丸-些以身十出成型;^式戶斤完成記憶+夕卜型或殼體的 技術’但為了更加提昇產品的良率，節省製造的成本，又經不 斷地研究改良，乃設計出此-記憶卡封裝方法與結構。 【發明内容】 本發明之主要目較提供-缝產良率高且崎低成本 • ❸記憶卡封裝方法’主要是以原料於最後射出成型過程中僅分 佈於各構件的關，II此成—包覆層，能魏猶在射出成型 中直接衝擊電路基板而使其損壞的情形發生，因此產品良率 高。再者萬-聰過程出現不良品，亦可將此不良品的結構切 開’取出仍可使用的電路基板，降低損耗成本。 立本發明之次要目的是提供一種能獲得良好防水效果的記 鲁，隐卡封裝方法，由於包覆層是以原料射出成型方式結合於各構 件周圍及接合處，使各構件獲得良好的密封，進而達到極佳的 防水效要。 13之#目的是提供—種能廣泛運驗各式記憶卡的 愤方法與結構’只妓制兩片式結構而將電路板封裝其中 的記憶卡，皆可_本發日狀撕，_範圍廣。 l275〇98 為達上狀目的，本發縣要將_電路基減置—基殼 於其Μ使Γ路基板之電性接觸部裸露出來，之後將—反設置 • I"又頂^ ’雖遮敝了大部份電路基板，但其電性接觸部仍裸 最後形成—包覆層設於基殼與壓板顯，該包覆層是 =成型方式使原料成型，如此形成—記憶卡的形狀，而此 方式所形_記針結構，其防雜及強度極佳。 為使審查委員清楚了解本發明之詳細流程及技術内容，本 务明人將配合町之圖歧詳蚊舰， 解本發明之精神所在： 一安貝収了 【實施方式】 如弟-®所為本發明之記憶卡封裝方法之流程圖， /、步驟為： 步驟1W繪電路基城置—基糾 接觸部裸露出來； π路基板之電性 _12、翁-壓板設置於基殼頂部，其雖遮蔽了大部份電 路基板’但其電性接觸部仍裸露出來；以及 麵13、以射出成型方式形成—包覆層於基殼與壓板周圍， 為包覆層的設置區域包括：基殼與壓板之接合處，以及恭 路基板之電性接觸圍與基殼及壓板的接合處。而原料成2 硬化過程中並能與先前之基殼與壓板溶合在—起，形成完全密 7 1275098 朗結獅，做電路基板之紐接觸部裸露㈣，如此即為 一記憶卡的形狀。 為使審查委員更清楚了解本發明之運作方式，本實施例以 數位安全卡(SD卡）的結構來輔助解說，但並不因此限制本發 明僅能使用於此種記憶卡，任何運用本發明之技術所完成的記 憶卡結構，皆為本發明之齡。如第二圖示，該基殼2與壓板 ， 3〜形狀為事先射出成型。該基殼2之頂部區域設有略為凹陷的 容置空間21’該容置如21雜是配合該電路基板4的外型， 而於容置空間21内另外形成深度較深之容置槽211及較淺之 數個對應槽212，該容置槽211數目最少一個，是對應電路基 板4之記憶晶片41的位置及形狀（如果該電路基板設有兩個 記憶晶片則設有兩個容置槽或用一個更大面積的容置槽），而 該對應槽212是對應其他較小的晶片42及數焊接點奶、44 1 處’每一個對應槽212的形狀並不固定，只要能使對應的物件 在蓋合後隱藏於槽内即可。使得電路基板4蓋合於基殼2時， 相關的電路與連接點不會受到干擾。該電路基板4的另一面設 有數個電性接觸部45(即俗稱的金手指）（可參閱第三A圖所 示），用以配合插置時與電子產品使用。該基殼2與壓板3的 總厚度是等於此類SD卡的標準厚度。由於本發明是以射出成 型方式使原料（即包覆層）成型於基殼2與壓板3之周圍，今 1275098 基设2的外型可較標準規格小一些，並於周圍至少二侧邊形成 有斜面22，而該壓板3周圍至少二側邊也形成有斜面幻，以 增加黏合時的牢固性。該壓板3的長度較小，蓋合於基殼2頂 部時，並未遮蔽前述電路基板4之電性接觸部45。 如第二A及三B圖所示，為本發明電路基板4設置於基殼 2之谷置空間21内，該壓板3並蓋合於基殼2頂部之立體圖 及口〗面示思圖（该電路基板僅以示意方式表示，未剖面），此為 上述步驟12所述之狀態，該電路基板4僅電性接觸部45裸 露，該壓板3是覆蓋於基殼2頂部。在本發明中該壓板3的目 的是避免射出成型時之強大壓力直接施壓於電路基板4處，造 成電路基板4的破裂或損壞。 如第四A及四B圖所示’為本發明之成品的立體圖及剖示 意圖，此亦為進行前述步驟13後之成品圖。由於射出成型的 包覆層A之原料與基殼2及壓板3皆為相同材料，故在凝固後 會結合為-體，密封效絲。另外基殼2卵之斜面22與壓 板3之斜面31並有助於黏合後更加相。如圖所示，最後包 覆層A之·成斜是主要分佈於基殼2龍板3周圍，以及 於電路基板4之電性接觸部45處，形成—電路基板4被完全 密封的記憶卡雜。由於是以射出方式成型，能確絲殼2與 1275098 壓板3及電路基板4接合處，完全被密封，使整體獲得極佳的 防水效果。 綜合以上所述，運用本發明之方法所製成的記憶卡，其結 構包括： -基殼，頂部設相_容置雜，精有—電路基板設置立 中； -電路基板’設基殼處’其_側面之電性接觸部係裸露出 來； -壓板，蓋合於前述基殼蘭’ 了大部份之電路基板僅使 其電性接觸部裸露出來；以及 -包覆層，其係將原料射出成型於壓板與基殼周圍，以及· 基板與壓板及基殼的接合處，並形成一標準規格之記憶卡 形狀’且完全使構件之接合處密封。 如第五圖所示，為本發明之第二種實施例之立體分解圖， 在本實施例中，主要是改變該壓板3之形狀，其設有一較大面 積之突塊32，該突塊32是對應於基殼2之容置空間21的形 狀。如第六A圖所示，組裝時該電路基板4係先置於基殼2内 之容置空間21内，之後該壓板3蓋合時，其突塊32也設置於 各置空間21内。此目的在於：一、當最後射出成型時，壓板 1275098 3不會因文原料注入的衝擊而產生位移；二、原料較不會經壓 板與基殼之接合處，進一步滲透至内部。因此以此方式製成之 記憶卡良率較高。如第六B圖所示，為以第二實施例所製成之 記憶卡成品之剖面圖。 第七圖所示，為本發明之第三種實施例之立體圖，在本實 施例中，該基殼2是與壓板3之一側邊黏合在此一起，黏合處 的厚度非常薄，使該壓板3能在組裝時摺合覆蓋於基殼2之 上，敢後乃以射出成型方式形成一記憶卡的形狀。本實施例的 優點在於基设2與壓板3能一起射出成变，成為單一構件，在 後續組裝過程中較為方便，生產時也不用須要二套模具分別生 產基殼與壓板，較為方便成本也較低。 以上所述者，僅為本創作之較佳實施例而已，並非用來限定 本創作實施例之範圍。即凡依本創作申請專利範圍所作的均等 變化及修飾，皆為本創作之專利範圍所涵蓋。 11 1275098 【圖式簡單說明】 第一圖為本發明之流程圖； 第二圖為本發明運用於S D記憶卡之殼基、電路基板與壓板之 立體圖； 第三A圖為本發明之電路基板設置於殼基内，壓板蓋合其上的 立體圖； 第三B圖為第三A圖之剖面圖； 第四A圖為本發明之成品的立體圖； 第四B圖為本發明之成品的剖視圖； 第五圖為本發明之第二實施例之殼基、壓板與電路基板之立體 圖； 第六A圖為本發明第二實施例之電路基板設置於殼基内，壓板 蓋合後之剖面圖； 第六B圖為本發明第二實施例之成品的剖視圖； 第七圖為本發明第三實施例之殼基與壓板之立體圖。 【主要元件符號說明】 2 基殼 21 容置空間 211容置槽 212對應槽 22 斜面 3 壓板 31 斜面 4 電路基板 12 1275098 41 記憶晶片 42 晶片 43 焊接點 44 焊接點 45 電性接觸部Secure Digital (SD) Card ^ Memory Stick (MS) Card, etc. Also xD-picture eani _____ card. As the reading capacity continues to increase, the amount of data that can be accessed is also increased. • Several times 'relatively, if the rupture is damaged, it means that the user's precious data disappears immediately.' Therefore, the manufacturer is developing and expanding the capacity of the memory card. It is also constantly improving the structure 'making it thin but not easily damaged, and has a proper waterproof effect. The traditional memory card structure is usually two-piece, that is, the upper and lower two structures are used to sandwich the circuit board. 'The high-frequency welding technology is used to join the upper and lower pieces together to form a memory card structure. However, the disadvantage is that it is long time. When it is extracted from an electronic product, it is easy to break the joint and damage it, or the joint is prone to generate a very small space 1275098 gap 'to allow water to penetrate to the internal circuit board, so the service life is not long. Therefore, this month, the people are researching pills - some of them are formed in the form of a body; ^ type of households complete the memory + eve type or shell technology 'but in order to further improve the product yield, save manufacturing costs, and constantly The research improvement is to design this - memory card packaging method and structure. SUMMARY OF THE INVENTION The main object of the present invention is to provide a high yield and low cost of sewing. The method of packaging a memory card is mainly based on the fact that the raw materials are only distributed in the components during the final injection molding process. The coating layer can cause damage to the circuit substrate directly in the injection molding, and thus the product yield is high. In addition, in the Wan-Cong process, defective products can be found, and the structure of the defective product can be cut off to remove the circuit board that can still be used, thereby reducing the cost of loss. The secondary object of the present invention is to provide a Keelu, hidden card packaging method capable of obtaining a good waterproof effect, since the coating layer is bonded to the periphery of the members and the joints by means of injection molding, so that the members are well sealed. , in order to achieve excellent waterproof effect. 13# The purpose of the ## is to provide an indignant method and structure that can widely test all kinds of memory cards. 'The memory card that only encloses the two-piece structure and encloses the circuit board, can be _ this hair-shaped tear, _ range wide. L275〇98 In order to achieve the purpose of the top, the county should reduce the _ circuit base - the base shell is exposed to the electrical contact portion of the circuit board, and then - the reverse set - I " Concealing most of the circuit substrate, but the electrical contact portion is still barely formed - the cladding layer is formed on the base shell and the pressure plate, the cladding layer is = molding method to shape the raw material, so formed - the shape of the memory card And this method is shaped like a needle structure, which has excellent anti-jamming and strength. In order to make the review committee clearly understand the detailed process and technical content of the present invention, the incumbent will cooperate with the map of the town to explain the spirit of the invention: One amperage is received [Implementation] The flow chart of the memory card encapsulation method of the present invention, /, the steps are: Step 1W drawing circuit base-base correction contact is exposed; π road substrate electrical _12, Weng-press plate is placed on the top of the base shell, Although the majority of the circuit substrate is shielded, but the electrical contact portion is still exposed; and the surface 13 is formed by injection molding - the cladding layer is around the base shell and the pressure plate, and the installation region for the cladding layer includes: the base shell The junction with the pressure plate, and the electrical contact of the Christine substrate with the joint of the base shell and the pressure plate. When the raw material is 2 hardened, it can be fused with the previous base shell and the pressure plate to form a completely dense 7 1275098 lang lion, and the contact portion of the circuit board is bare (4), which is the shape of a memory card. In order to make the reviewer more clearly understand the operation mode of the present invention, the present embodiment assists in explaining the structure of the digital security card (SD card), but does not limit the present invention to the memory card alone, and any application of the present invention. The memory card structure completed by the technology is the age of the invention. As shown in the second illustration, the base shell 2 and the pressure plate, 3 to the shape are previously injection molded. The accommodating space 21 ′ of the base case 2 is provided with a slightly recessed accommodating space 21 ′. The accommodating space 21 211 is formed to fit the outer shape of the circuit board 4 , and a deeper depth accommodating groove 211 is formed in the accommodating space 21 . And a plurality of corresponding slots 212 of the shallower ones, the number of the receiving slots 211 being at least one, corresponding to the position and shape of the memory chip 41 corresponding to the circuit substrate 4 (if the circuit substrate is provided with two memory chips, two housings are provided The groove or a larger area of the receiving groove), and the corresponding groove 212 corresponds to the other smaller wafer 42 and the number of solder joints, 44 1 'the shape of each corresponding groove 212 is not fixed, as long as The corresponding object can be hidden in the slot after the cover. When the circuit substrate 4 is covered with the base case 2, the associated circuits and connection points are not disturbed. The other surface of the circuit board 4 is provided with a plurality of electrical contact portions 45 (referred to as the gold fingers) (refer to the third A-picture) for use with electronic products during insertion. The total thickness of the base shell 2 and the pressure plate 3 is equal to the standard thickness of such an SD card. Since the present invention molds the raw material (ie, the coating layer) around the base shell 2 and the pressure plate 3 by injection molding, the shape of the 1275098 base 2 can be smaller than the standard specification and formed at least two sides around it. There is a slope 22, and at least two sides of the pressure plate 3 are also formed with a sloped illusion to increase the firmness at the time of bonding. The platen 3 has a small length and does not shield the electrical contact portion 45 of the circuit board 4 when it is covered at the top of the base case 2. As shown in the second embodiment of FIG. 2 and FIG. 3B, the circuit board 4 of the present invention is disposed in the valley space 21 of the base shell 2, and the pressure plate 3 is covered on the top of the base shell 2 and the mouth and surface diagrams are The circuit board is shown only in a schematic manner, not in cross section. This is the state described in the above step 12. The circuit board 4 is only exposed by the electrical contact portion 45, and the pressure plate 3 covers the top of the base case 2. In the present invention, the purpose of the platen 3 is to prevent the strong pressure at the time of injection molding from being directly applied to the circuit substrate 4, resulting in cracking or damage of the circuit substrate 4. As shown in Figures 4A and 4B, the perspective view and the cross-sectional view of the finished product of the present invention are also the finished drawings after the foregoing step 13. Since the raw material of the injection-molded coating layer A and the base material 2 and the pressure plate 3 are all the same material, they are combined into a body after sealing, and the effect filament is sealed. In addition, the inclined surface 22 of the base shell 2 and the inclined surface 31 of the pressure plate 3 contribute to the phase after bonding. As shown in the figure, the final cladding layer A is mainly distributed around the base plate 2, and at the electrical contact portion 45 of the circuit substrate 4, forming a memory card in which the circuit substrate 4 is completely sealed. miscellaneous. Since it is formed by injection molding, the joint between the wire shell 2 and the 1275098 pressure plate 3 and the circuit substrate 4 can be completely sealed, so that the overall waterproofing effect is obtained. In summary, the memory card manufactured by the method of the present invention has the following structure: - a base shell, a top layer is provided with a phase impurity, and a circuit board is disposed in a center; - a circuit substrate is provided at a base shell 'The electrical contact portion of the side is bare; - the pressure plate is covered with the base shell blue'; most of the circuit substrate only exposes its electrical contact; and - the cladding layer The material is injection molded around the platen and the base shell, and the joint between the substrate and the platen and the base shell, and forms a standard-sized memory card shape' and completely seals the joint of the member. As shown in FIG. 5, it is an exploded perspective view of a second embodiment of the present invention. In this embodiment, the shape of the pressure plate 3 is mainly changed, and a large area of the protrusion 32 is provided. 32 is a shape corresponding to the accommodation space 21 of the base case 2. As shown in Fig. 6A, the circuit board 4 is placed in the accommodating space 21 in the base case 2 at the time of assembly. When the platen 3 is closed, the projections 32 are also disposed in the respective spaces 21. The purpose of this is: First, when the final injection molding, the pressure plate 1275098 3 will not be displaced due to the impact of the material injection; Second, the raw material will not penetrate the joint between the pressure plate and the base shell, and further penetrate into the interior. Therefore, the memory card produced in this way has a high yield. As shown in Fig. 6B, a sectional view of the finished memory card produced in the second embodiment. 7 is a perspective view of a third embodiment of the present invention. In the present embodiment, the base shell 2 is bonded to one side of the pressure plate 3, and the thickness of the bond is very thin. The pressure plate 3 can be folded over the base shell 2 during assembly, and then formed into a shape of a memory card by injection molding. The advantage of this embodiment is that the base 2 and the pressure plate 3 can be injected and transformed together into a single component, which is convenient in the subsequent assembly process, and does not require two sets of molds to separately produce the base shell and the pressure plate during production, which is convenient and cost-effective. low. The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present embodiments. All changes and modifications made in accordance with the scope of the patent application for this creation are covered by the scope of the patent. 11 1275098 BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart of the present invention; the second figure is a perspective view of a shell base, a circuit board and a pressure plate applied to an SD memory card according to the present invention; 3B is a perspective view of the finished product of the present invention; FIG. 4B is a cross-sectional view of the finished product of the present invention; 5 is a perspective view of a shell base, a pressure plate and a circuit board according to a second embodiment of the present invention; and FIG. 6A is a cross-sectional view of the circuit board according to the second embodiment of the present invention, which is disposed in the shell base, and the pressure plate is closed; 6 is a cross-sectional view of the finished product of the second embodiment of the present invention; and FIG. 7 is a perspective view of the shell base and the press plate of the third embodiment of the present invention. [Main component symbol description] 2 Base case 21 accommodating space 211 accommodating groove 212 corresponding groove 22 slant surface 3 pressure plate 31 slant surface 4 circuit board 12 1275098 41 memory chip 42 wafer 43 solder joint 44 solder joint 45 electrical contact
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