JPH0662026B2 - IC memory card - Google Patents

Description

The present invention relates to a memory card having an IC memory mounted therein. More specifically, I
The present invention relates to an IC memory card equipped with a C chip and used as an identification card, a credit card, various games, an educational card, or the like.

[Prior Art] An IC memory card in which an IC chip is mounted on a thin plate of polyvinyl chloride, ABS resin, or the like has a larger storage capacity than a conventional magnetic card and is difficult to forge. Cards, credit cards, various games,
Recently, it has been widely used as an educational card.

Conventionally, as an IC memory card of this type, an IC chip and an external terminal connected to the IC chip are provided together on an IC substrate, and the IC substrate is embedded in a recess formed in a card base. There is provided one in which the surface of the IC substrate and the surface of the card substrate are fixed and integrated by thermocompression bonding or an adhesive so that they are substantially flush with each other.

Such an IC memory card has a predetermined size, and external terminals provided on the IC substrate and connection terminals provided in an insertion portion of a device such as a computer come into contact with each other to exert an arithmetic function. Therefore, the IC substrate needs to be accurately embedded and fixed at a predetermined position of the card base.

However, when the IC chip and the external terminals connected to the IC chip are provided on the IC substrate, when the IC substrate is fixed to the recess of the card base, it is easily dislocated from the correct position, and as a result, the IC memory card. However, there is a drawback that the position of the external terminal may be deviated from a predetermined position, and a non-contact portion may be formed between the external terminal and the contact terminal of a device such as a computer so that the original calculation function cannot be exerted.

[Problems to be solved by the invention]

The present invention eliminates the above-mentioned conventional drawbacks,
By separately fitting and fixing the IC board having the IC chip and the terminal board having the external terminals in the fitting holes of the card base, they can be easily fixed, and the terminal board can be accurately placed at a predetermined position. The present invention provides an IC memory card which can be embedded and in which the IC substrate can be replaced.

[Means for solving problems]

In the IC memory card according to the present invention, an IC substrate having an IC chip and a terminal substrate having external terminals connected to the IC chip are separately fitted and fixed in fitting holes formed in a card base. . The IC chip of the IC substrate and the external terminal of the terminal substrate are characterized in that they are connected to each other through a through hole penetrating the IC substrate or a through hole penetrating the IC substrate and the terminal substrate.

[Operation of the invention]

According to the present invention, the IC substrate having the IC chip and the terminal substrate having the external terminals are separately fitted and fixed, so that the terminal substrate can be easily fixed at a predetermined accurate position.
Further, since the IC chip and the external terminals are connected through the through holes penetrating the IC substrate and the terminal substrate, it is easy to fix the IC substrate even if the position of the IC substrate may be slightly shifted, and the IC substrate is also detached. Be free.

〔Example〕

 Next, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view showing an embodiment of an IC memory card of the present invention, FIG. 2 is a partially enlarged sectional view of the IC memory card of FIG. 1, and FIG. 3 is an explanatory view showing a molding process of a card base. FIG. 4 is a partially enlarged sectional view of an IC memory card showing another embodiment.

In FIGS. 1 and 2, 1 is an IC substrate, 2 is a terminal substrate, 3 is a card base, and these are separately molded. The IC substrate 1 is made of glass epoxy resin or polyimide. As shown in FIG. 1, the IC substrate 1 has one chip of ROM, EPROM, EEPROM or the like, or two chips of EPROM and microprocessor I chip.
The C chip 4 is covered with a mold and mounted. Also,
A large number of printed wirings 5 are provided on the IC substrate 1, the IC chip 4 is connected to each printed wiring 5, and a through hole 6 penetrating the IC substrate 1 is formed at an end of the IC substrate 1. There is. This through hole 6 is I
This is for connecting the IC chip 4 of the C substrate 1 to each external terminal 7 of the terminal substrate 2 via the printed wiring 5.

On the other hand, the terminal board 2 is made of PBT resin or the like, and a large number of external terminals 7 for connecting to a device such as a computer are provided on the upper surface thereof. Further, on the lower surface of the terminal board 2, the leg pieces 8 of the external terminals 7 are bent and projected in a substantially crank shape.
The leg piece 8 is inserted into the through hole 6 of the IC substrate 1 so that the external terminal 7 is connected to the IC chip 4 via the printed wiring 5.
It is connected to the.

The card base 3 is a thin plate made of a synthetic resin such as polyvinyl chloride or ABS resin, and has a fitting hole 9 into which the IC board 1 and the terminal board 2 are fitted. The fitting hole 9 is formed so that the upper surface of the terminal board 2 and the upper surface of the card base 3 are substantially flush with each other when the terminal board 2 is fitted and fixed.
The IC substrate 1 can be embedded in the fitting hole 9.

The external terminal 7 of the terminal board 2 fixed to the fitting hole 9 and the IC chip 4 of the IC board 1 are connected via the through hole 6 formed in the IC board 1. An example is shown in which the leg piece 8 of the external terminal 7 is inserted into the through hole 6 of the IC board 1, the IC board 1 is fixed in the fitting hole 9, and the leg piece 8 is soldered at the through hole 6. is there. If it is like this,
Even if the position of the IC substrate 1 is slightly displaced, the IC chip 4 and the external terminal 7 can be reliably connected.

In FIGS. 1 and 2, the cover plate 10 is further provided with a fitting hole 9.
The one that is fitted and fixed to is illustrated. The lid plate 10 is made of polyvinyl chloride and ABS resin like the card base 3, and fits into the fitting hole 9 on the lower surface side of the card base 3,
The lower surface of the lid plate 10 and the lower surface of the card base 3 are formed so as to be substantially flush with each other when the 10 is fitted and fixed in the fitting hole 9. To fix the cover plate 10 and the card base 3 to each other, for example,
Use screws, epoxy adhesive, ultrasonic seal, etc. It is preferable to fix the cover plate 10 in this manner, because the IC substrate 1 is not exposed on the lower surface of the card base 3 and moreover moisture or the like is prevented from entering.

In order to fix the IC substrate 1 and the terminal substrate 2 to the card base 3, they are fitted into the fitting holes 9 of the card base 3 and thermocompression bonded, adhesive with an epoxy or hot melt adhesive, or screwed. Appropriate means such as stopping may be used. However, as shown in the example, if the screws 11 are fixed, they are firmly fixed, and in addition, inspection and repair of the IC chip 4 and replacement of the IC substrate 1 can be performed, which is preferable.

In order to embed and fix the terminal board 2 in the card base 3,
This can be performed simultaneously with the molding of the card substrate 3. Third
In the figure, reference numeral 12 denotes two split molds, each having a cavity 13 having the same shape as the card base 3. A nest 14 for fixing the terminal board 2 provided with the external terminals 7 in the cavity 13 of one mold and forming a fitting hole 9 in the other cavity.
And the leg piece 8 of the external terminal 7 is inserted into the insert 14. Next, a synthetic resin may be injected and injected into the cavity 13, and after curing, may be removed from the mold. It is preferable that the terminal board 2 be fixedly embedded in the card base 3 in this manner, because the fixation becomes even stronger and the terminal board 2 can be fixed at a predetermined accurate position.

The present invention is not limited to those shown in FIGS. 1 and 2, and may be as shown in FIG. 4, for example.

In FIG. 4, through holes 6 are provided in the IC substrate 1 and the terminal substrate 2, and the IC substrate 1 and the terminal substrate 2 are superposed and fixed so that the through holes 6 are aligned with each other. An example is shown in which the IC chip 4 of the IC substrate 1 and the external terminals 7 of the terminal substrate 2 are connected via the through holes 6. With this structure, the external terminal 7 and the IC chip 4 can be connected without necessarily matching the through hole 6 of the IC substrate 1 with the through hole 6 of the terminal substrate 2, and the IC substrate 1 is embedded. It is preferable because it becomes easier to fix.

〔The invention's effect〕

Since the present invention has the above-described configuration, it is easy to fix the terminal board having the external terminals to a predetermined accurate position, and as a result, the IC
There is no risk that the external terminals of the memory card will come into contact with the contact terminals of a computer or the like, causing non-contact or inoperability or malfunction. Further, even if the position of the IC substrate is slightly displaced, the IC chip can be connected to the external terminal of the terminal substrate, and the IC substrate can be easily fixed.
There are numerous advantages such as easy inspection and repair of the C chip and replacement of the IC substrate.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of an IC memory card of the present invention, FIG. 2 is a partially enlarged sectional view of the IC memory card of FIG. 1, and FIG. 3 is an explanatory view showing a molding process of a card base. FIG. 4 is a partially enlarged sectional view of an IC memory card showing another embodiment. In the figure, 1 is an IC substrate, 2 is a terminal substrate, 3 is a card base,
4 is an IC chip, 5 is a printed wiring, 6 is a through hole, 7 is an external terminal, and 9 is a fitting hole.

Claims (1)

[Claims] 1. An IC substrate having an IC chip and a terminal substrate having external terminals connected to the IC chip are separately embedded and fixed to a card base, and the IC substrate or I
IC through a through hole that penetrates the C board and terminal board
I characterized in that the chip and the external terminal are connected
C memory card.