JPH084310Y2 - IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an IC card having an IC module mounted therein.

(Prior art) In recent years, chip cards, memory cards, microcomputer cards or cards called electronic cards on which IC chips such as microcomputers and memories are mounted (hereinafter simply referred to as IC cards).
Various researches have been carried out.

Compared to conventional magnetic cards, such IC cards
Because of its large storage capacity, it is planned to store the history of savings and deposits instead of the bankbook in the case of banks and the history of transactions such as shopping in the case of credits.

Such an IC card is composed of an IC module on which an IC chip is mounted, and a card base on which a recess for mounting the IC module is formed.

Among them, the IC module is formed by providing external terminals on one surface of the substrate, providing a pattern layer and an IC chip on the other surface of the substrate, and resin-molding the periphery of the IC chip and the wiring portion. The IC chip is adhered to the substantially central portion of the substrate via a die bond adhesive or the like. Moreover, since the resin mold portion is generally formed in a substantially rectangular parallelepiped shape so as to cover the IC chip, the IC module has a convex cross section as a whole.

Further, a plurality of through holes are provided so as to penetrate the portion of the substrate which is not resin-molded, and the conductive layer (for example, copper plating + nickel plating + gold plating) formed on the inner surface of the through holes is used to form an external terminal. The pattern layer is electrically connected.

(Problems to be Solved by the Invention) As described above, the resin mold portion is formed in a substantially rectangular parallelepiped shape, and the IC module as a whole has a convex cross-section at the cut surface perpendicular to the substrate.

Since the IC module has a convex cross section in this manner, when the bending action is transmitted from the IC card to the IC module, it is conceivable that stress is concentrated on the side surface of the resin mold portion due to the bending action.

That is, in an IC module having a convex cross-section, the section modulus of the IC module greatly changes along the side surface of the resin mold portion, so that the bending action transmitted to the IC module causes stress concentration on the side surface of the resin mold portion. . When the stress concentration occurs on the side surface of the resin mold portion, the resin mold portion and the IC chip may be damaged.

In addition, the resin mold portion is generally formed by transfer molding. In such a case, it is convenient to manufacture the IC module quickly and accurately if the mold of the resin mold portion is improved.

The present invention has been made in consideration of such a point, and an IC card capable of preventing damage to the resin mold portion and the IC chip and improving the mold deviation of the resin mold portion. The purpose is to provide.

[Constitution of device]

(Means for Solving the Problems) According to the present invention, an external terminal is provided on one surface of a substrate, and a 1C chip and a pattern layer are provided on the other surface of the substrate.
An IC module formed by forming a resin mold part around the chip and the wiring part, and a card substrate having an upper opening type recess in which the IC module is mounted are provided, and the cross-sectional shape of the resin mold part as a whole is a substrate. A cutting line parallel to the substrate is formed so as to become smaller as it goes away from the substrate, and the recess includes a first recess for housing the substrate and a second recess for housing the resin mold portion, and a cross section of the second recess. The IC card is characterized in that a shape is made relatively larger than a cross-sectional shape of the resin mold portion to form a gap between the resin mold portion and the second recess.

(Function) The concave portion of the card base on which the IC module is mounted is an upward opening type, and the cross-sectional shape of the resin mold portion is formed so that the cutting line parallel to the substrate as a whole becomes smaller as the distance from the substrate increases. Since the cross-sectional shape of the second recess is made relatively larger than the cross-sectional shape of the resin mold part, when inserting the IC module into the recess of the card substrate,
The resin mold portion does not come into contact with the wall surface of the concave portion of the card base material.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing an embodiment of an IC card according to the present invention.

In FIG. 1, an external terminal 13 is provided on one surface of a substrate (for example, glass epoxy, glass BT resin, polyimide, etc.) 12 made of a material having excellent flexibility and strength, and a pattern layer 15 is provided on the other surface. Provided, IC module 11
Are formed.

Both the external terminal 13 and the pattern layer 15 are formed by applying copper plating, nickel plating, and gold plating to a copper foil.

Further, the IC chip 17 is adhered and fixed to the surface of the substrate 12 on the pattern layer 15 side through the die bonding adhesive 20, and necessary wiring is performed between the IC chip 17 and the pattern layer 15 by the bonding wire 18. Further, the periphery of the wiring portion including the IC chip 17 and the bonding wire 18 is resin-molded with a molding resin to form a resin-molded portion 19.

In this case, the resin molding is preferably performed by a transfer molding method, and the size and shape of the molding resin are appropriately determined according to the IC chip 17 and the card base material 30 described later. Further, the height of the resin mold portion 19 is smaller than the depth of the second recess 35b described later.

A plurality of through holes 14 are provided so as to penetrate the external terminals 13, the substrate 12, and the pattern layer 15.
Conductive plating 14a is formed on the inner surface of 14 to electrically connect the external terminal 13 and the pattern layer 15.

 Next, the shape of the resin mold portion 19 will be described.

The resin mold portion 19 has an inverted trapezoidal cross-sectional shape of a cut surface perpendicular to the substrate 12. That is, the cutting area of the resin mold portion 19 parallel to the substrate 12 becomes gradually smaller as the distance from the substrate 12 increases (the cross-sectional shape of the resin mold portion 19 becomes smaller as the cutting line parallel to the substrate 12 becomes farther from the substrate 12 as a whole. ), The side surface of the resin mold portion 19 is inclined with respect to the substrate 12.

On the other hand, a concave portion 35 is formed on the surface of the rectangular card base material 30 made of synthetic resin, and the IC module 11 is attached to the concave portion 35 via the adhesive 34 to form the IC card 10.

The recess 35 of the card substrate 30 has a bottom surface at the bottom and is of an upward opening type, and the first recess 35 having a relatively shallow shape.
It is composed of a and a second recess 35b having a relatively deep shape. Of these, the second concave portion 35b is a portion to which the resin mold portion 19 is mainly mounted.

In this case, it is important that the depth of the second recess 35b is such that a space is created between the resin mold portion 19 of the IC module 11 and the second recess 35b when the IC module 11 is mounted. Is.

The recess 35 formed in the card substrate 30 is preferably equal to or slightly larger than the IC module 11 so that the embedded IC module 11 can be easily inserted.

 Next, a method of manufacturing an IC card will be described.

First, the external terminals 13 are provided on one surface of the substrate 12 and the substrate 12
The pattern layer 15 and the IC chip 17 are provided on the other surface of the
The IC module 11 is formed by resin-molding the periphery of the IC chip 17 and the bonding wire 18 by transfer molding.

Next, the adhesive 34 is placed on the bottom surface of the first recess 35a formed in the card substrate 30, and the IC module 11 is inserted. In this case, the recess of the card substrate 30 on which the IC module 11 is mounted
35 is an upper opening type, and further, the cross-sectional shape of the resin mold portion 19 is formed so that the cutting line parallel to the substrate 12 becomes smaller as it goes away from the substrate as a whole, and the cross-sectional shape of the second recess 35b is made by resin molding. Since the cross-sectional shape of the portion 19 is made relatively large, the resin mold portion 19 and the second portion
A sufficient gap is secured with the recess 35b. Therefore, when the IC module 11 is inserted into the concave portion 35 of the card base material 30, the resin mold portion 19 causes the second concave portion 35b of the card base material 30.
It does not touch the wall surface of. Therefore, IC module 11
The IC module 11 can be mounted safely and easily without any risk of being damaged when it is inserted. Next, a hot stamper (not shown) locally heat-presses only the surface of the external terminal 13 (for example, 100 to 170 ° C., 5 to 15 kg / c).
m ² , 5 seconds is enough)
Install the IC card 11 in the recess 35 of the card substrate 30 and fix it
Can be obtained.

In this case, as the adhesive 34, for example, a polyester-based thermal adhesive sheet is preferably used.

Alternatively, the adhesive 34 may be formed of a double-sided adhesive tape in which an acrylic adhesive is applied to both surfaces of a non-woven fabric, or a room temperature curable urethane adhesive. In this case, normal temperature pressing may be performed without hot pressing.

 Next, the bending action when using the IC card will be described.

When the IC card 10 receives a bending action, this bending action is
It is also transmitted to the IC module 11 side.

In this case, the cross-sectional shape of the resin mold portion 19 on the cut surface perpendicular to the substrate 12 is a substantially inverted trapezoid, that is, the resin mold portion.
The cross-sectional shape of 19 as a whole becomes smaller as the cutting line parallel to the substrate 12 becomes further away from the substrate 12, and the side surface of the resin mold portion 19 is inclined with respect to the substrate 12,
The section modulus of the IC module does not change significantly across the side of the resin mold. Therefore, stress concentration does not occur on the side surface of the resin mold portion 19 due to the bending action transmitted to the IC module 11 side.

As described above, according to the present embodiment, since the cross-sectional shape of the resin mold portion 19 on the cut surface perpendicular to the substrate 12 is an inverted trapezoid, stress concentration does not occur on the side surface of the resin mold portion due to the bending action. . Further, since the cross-sectional shape of the resin mold portion 19 is an inverted trapezoid, it is possible to improve the mold deviation during resin molding by transfer molding.

[Effect of device]

As described above, according to the present invention, the concave portion of the card base on which the IC module is mounted is the upper opening type, and the cutting line parallel to the substrate as a whole has the sectional shape of the resin mold portion separated from the substrate. Since the second concave portion has a cross-sectional shape that is relatively larger than the cross-sectional shape of the resin molded portion, when the IC module is inserted into the concave portion of the card substrate, the resin molded portion is It does not come into contact with the wall surface of the recess of the card substrate. Therefore, the IC module can be safely and easily mounted without any risk of damage when the IC module is inserted.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of an IC card according to the present invention. 10 …… IC card, 11 …… IC module, 12 …… Board, 13
...... External terminal, 14 ...... Through hole, 14a ...... Conductive plating, 15 ...... Pattern layer, 17 …… IC chip, 18 …… Bonding wire, 19 …… Resin mold part, 20 …… Die bonding adhesive, 30 …… Card base material, 34 …… Adhesive, 35…
… Recessed.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display area // B42D 109: 00

Claims (1)

[Scope of utility model registration request] 1. An IC provided with external terminals on one surface of a substrate and a 1C chip and a pattern layer on the other surface of the substrate.
An IC module formed by forming a resin mold part around the chip and the wiring part, and a card substrate having an upper opening type recess in which the IC module is mounted are provided. A cut line parallel to the substrate is formed so as to become smaller as it goes away from the substrate, and the recess includes a first recess for housing the substrate and a second recess for housing the resin mold portion, and a cross section of the second recess. An IC card characterized in that a shape is made relatively larger than a cross-sectional shape of the resin mold portion to form a gap between the resin mold portion and the second recess.