JP2510694B2 - IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an IC card in which an IC module is mounted.

(Prior art) In recent years, chip cards, memory cards, microcomputer cards or cards called electronic cards on which IC chips such as microcomputers and memories are mounted (hereinafter simply referred to as IC cards).
Various researches have been carried out.

Compared to conventional magnetic cards, such IC cards
Because of its large storage capacity, it is planned to store the history of savings and deposits instead of the bankbook in the case of banks and the history of transactions such as shopping in the case of credits.

Such an IC card is composed of an IC module on which an IC chip is mounted, and a card base on which a recess for mounting the IC module is formed. Further, the IC module is adhesively fixed in the recess of the card base material with an adhesive.

Among them, the IC module is formed by providing external terminals on one surface of the substrate, providing a pattern layer and an IC chip on the other surface of the substrate, and resin-molding the periphery of the IC chip and the wiring portion.

Furthermore, a plurality of through holes are provided through the substrate, and the conductive plating (for example, copper plating + nickel plating + gold plating) formed on the inner surface of the through holes electrically connects the external terminals to the pattern layer. .

(Problems to be Solved by the Invention) As described above, the IC card is configured by mounting the IC module in the concave portion of the card base material and fixing it by adhesion.

Further, generally, the IC card is subjected to a bending action during use, but this bending action is transmitted from the card base material to the IC module through the adhesive region of the recess, and the bending action transmitted to the IC module is It is transmitted from the board to the IC chip.

In this case, the card base material is generally set to 0.76 mm, which is extremely thin according to the ISO standard.Therefore, if the bending action applied to the IC card increases, the bending action transmitted from the substrate to the IC chip also increases and the IC chip is damaged. I may end up doing it.

The present invention has been made in consideration of such points, and it is possible to suppress the bending action transmitted to the IC module side even if a large bending action is applied to the IC card.
The purpose is to provide an IC card.

[Structure of Invention]

(Means for Solving the Problems) According to the present invention, an external terminal is provided on one surface of a substrate, and an IC chip and a pattern layer are provided on the other surface of the substrate.
IC formed by resin molding around chip and wiring
In an IC card provided with a module and a card base material in which a recess is formed on the surface and the IC module is mounted and fixed in the recess, the IC module has a convex cross-section with a resin mold portion as a projection. None, the recess of the card base is a first recess, and the first recess is disposed inside the first recess.
A second recess formed deeper than the recess and accommodating the resin mold portion, and a notch is provided at a predetermined interval from the second recess along the peripheral edge of the first recess, and the notch is provided from the outside. The IC card is characterized by absorbing the bending action of.

(Operation) According to the present invention, the resin mold part obtained by resin-molding the IC chip is housed in the second recess formed inside the first recess and formed deeper than the first recess, and the peripheral edge in the first recess Since the notch is provided along with the second recess at a predetermined interval, the notch can absorb the bending action from the outside applied from above or below. In this case, even if a bending action is applied to the cutout from the outside, the second recess in which the resin mold portion is housed and the cutout are separated from each other by a predetermined distance. Will not be transmitted to.

Embodiments Embodiments of the present invention will be described below with reference to the drawings.

1 and 2 are diagrams showing a first embodiment of an IC module and an IC card according to the present invention. Here, FIG. 1 is a cross-sectional view of the IC card, and FIG. 2 is a plan view showing the concave portion of the card base material.

In FIG. 1, an external terminal 13 is provided on one surface of a substrate (eg, glass epoxy, glass BT resin, polyimide, etc.) 12 made of a material having excellent flexibility and strength, and a pattern layer 15 is provided on the other surface. Provided in this way
The IC module 11 is formed.

Both the external terminal 13 and the pattern layer 15 are formed by applying copper plating, nickel plating, and gold plating of copper foil. In addition, an insulating groove 13a is formed in the external terminal 13.

Further, the IC chip 17 is adhered and fixed to the surface of the substrate 12 on the pattern layer 15 side through the die bonding adhesive 20, and necessary wiring is performed between the IC chip 17 and the pattern layer 15 by the bonding wire 18.

Further, the periphery of the wiring portion including the IC chip 17 and the bonding wire 18 is resin-molded with a molding resin to form a resin mold portion 19. The board 12
The resin mold part 19 and the board are
A protective resist layer 16 is provided in order to enhance the adhesiveness with 12.

In this case, the resin molding is preferably performed by a transfer molding method, and the size and shape of the molding resin are appropriately determined according to the IC chip 17 and the card base material 30 described later. Further, the height of the resin mold portion 19 is smaller than the depth of the second recess 35b described later.

A plurality of through holes 14 are provided so as to penetrate the external terminals 13, the substrate 12, and the pattern layer 15.
Conductive plating 14a is formed on the inner surface of 14 to electrically connect the external terminal 13 and the pattern layer 15.

By the way, since the IC chip 17 is provided in a substantially central portion of the substrate 12 and the resin mold portion 19 covers the IC chip 17, the IC module 11 as a whole has a convex shape in cross section.

On the other hand, a recess 35 is formed on the surface of the card base 30 made of synthetic resin, and the IC module 11 is formed in the recess 35 with an adhesive 34.
The IC card 10 is configured by mounting. In this case, the longitudinal direction of the card base material 30 and the longitudinal direction of the substrate 12 coincide with each other (direction of arrow L in FIG. 1).

The concave portion 35 of the card substrate 30 has a relatively shallow first concave portion 35.
It is composed of a and a second recess 35b having a relatively deep shape. Of these, the second recess 35b is a part to which the resin mold part 19 is mainly mounted.

In this case, the depth of the second recess 35b is such that a space is formed between the resin mold portion 19 of the IC module 11 and the second recess 35b when the IC module 11 is mounted, or a bonded state or a non-bonded state. It is essential that the depth is such that it makes contact with.

Further, the horizontal length of the recess 35 formed in the card substrate 30 is preferably equal to or slightly larger than that of the IC module 11 so that the embedded IC module 11 can be easily inserted (0.05 to 0.1 mm).

Further, a notch 36 is provided around the entire circumference of the first recess 35a of the card substrate 30 so as to surround the first recess 35a at a predetermined distance from the second recess 35b. The notch 36 forms a strip-like quadrangle when viewed from the plane. The notch 36 includes a notch 36a orthogonal to the longitudinal direction of the card substrate 30 and a notch 36b parallel to the longitudinal direction of the card substrate 30, and has a function of absorbing a bending action from the outside. Further, in this case, the notch 36 is arranged so that the outer end thereof substantially contacts the outer end of the IC module 11.

 Next, a method of manufacturing an IC card will be described.

First, the adhesive 34 is placed on the bottom surface of the first recess 35a formed in the card substrate 30, and the IC module 11 is inserted. The shape of the adhesive 34 is such that it fits inside the notch 36 (solid line in FIG. 1). Subsequently, a hot stamper (not shown) locally heat-presses only the surface of the external terminal 13 (for example, 100 to 170 ° C., 5 to 15 kg / cm ² , and 5 seconds are sufficient), so that the IC The IC card 10 can be obtained by mounting and fixing the module 11 in the recess 35 of the card base 30.

In this case, as the adhesive 34, for example, a polyester-based thermal adhesive sheet is preferably used.

In addition, as the adhesive 34, a double-sided adhesive tape obtained by coating an acrylic adhesive on both sides of a non-woven fabric, a room temperature curable urenta adhesive, or an epoxy adhesive, a liquid adhesive such as a cyanoacrylate adhesive You can also In this case, normal temperature pressing may be performed without hot pressing.

As described above, the shape of the adhesive 34 is such that it fits inside the notch 36, so that the adhesive 34 fulfills an adhesive function as a whole. Therefore, the IC module 11 and the first recess
The adhesion area between the bottom surface of 35a and the bottom surface of 35a matches the size of the adhesive 34.

On the other hand, the shape of the adhesive 34 may be such that it reaches the side wall of the first recess 35a (dotted line in FIG. 1). In this case, the adhesive 34 inside the notch 36 forms an adhesive area,
The adhesive 34 on the portion 36 hangs downward. For this reason the adhesive 34
Even when the shape is formed so as to reach the side wall of the first recess 35a, the bonding region is arranged inside the notch 36.

When the IC card 10 receives a bending action in the longitudinal direction of the card substrate 30, the bending action applied to the card substrate 30 is the card substrate.
It is absorbed by the notch 36a portion of 30.

That is, the notch 36 portion of the card substrate 30 is a portion whose rigidity is lowered and is easily deformed. Therefore, when the bending action of the card base 30 in the longitudinal direction is received, the notch 36a portion orthogonal to the longitudinal direction of the card base 30 is deformed and the bending action of the card base 30 in the longitudinal direction is absorbed.

On the other hand, when the IC card 10 is subjected to a bending action in a direction orthogonal to the longitudinal direction of the card substrate 30, the bending action applied to the card substrate 30 is a notch 36b parallel to the longitudinal direction of the card substrate 30.
Partially absorbed.

As described above, according to the present embodiment, the bending action applied to the IC card 10 can be absorbed by the notches 36a and 36b arranged outside the bonding area, so that the IC from the card base material 30 through the bonding area. The bending action transmitted to the module 11 side can be suppressed small. In addition, the card substrate 30 of the cutout 36
Since the notch 36a orthogonal to the longitudinal direction of the IC module 11 is located below the through hole 14 of the IC module 11, the adhesive 34 enters the through hole 14 when the IC module 11 is mounted in the recess 35 of the card substrate 30. However, there is an effect that it does not exude to the surface of the external terminal 13.

Further, the same effect can be obtained when the IC module 11 is exuded from the outer periphery.

 Next, a second embodiment of the present invention will be described.

FIG. 3 is a diagram showing a second embodiment of the IC card of the present invention.

The second embodiment is the same as the first embodiment except that the arrangement of the notches 36 is different.

In FIG. 3, a notch 36 that forms a quadrangular shape in a band shape when seen from a plane is formed on the entire circumference slightly inward of the peripheral edge of the first recess 35a.
a and 36b are provided. Further, the adhesive 34 is sized so as to fit inside the notch 36.

 Next, a third embodiment of the present invention will be described.

FIG. 4 is a diagram showing a third embodiment of the IC card according to the present invention.

The third embodiment is the same as the first embodiment except that the arrangement of the notches 36 is different.

In FIG. 4, notches 36a and 36b are formed around the entire circumference of the first recess 35a of the card substrate 30 so as to surround the first recess 35a and form a square shape in a band shape when seen from a plane. Further, the notch 36 is arranged such that the outer end thereof is located outside the outer end of the IC module 11.

 Next, a fourth embodiment of the present invention will be described.

FIG. 5 is a diagram showing a fourth embodiment of the IC card according to the present invention.

The fourth embodiment is the same as the first embodiment except that the arrangement of the notches 36 is different.

In FIG. 5, notches 36a and 36b are formed around the entire circumference of the first recess 35a of the card base material 30 so as to surround the first recess 35a and form a square shape in a band shape when viewed from the plane. Further, the notch 36 is arranged so that its inner end substantially coincides with the outer end of the IC module 11. In this case, the inner edge of the notch 36
The IC module 11 may be arranged outside the outer edge.

 Next, a fifth embodiment of the present invention will be described.

FIG. 9 is a diagram showing a fifth embodiment of the IC card according to the present invention.

In FIG. 9, the card base material 30 is provided with notches 36a and 36b which are open at the upper end and which form a band-shaped quadrangle when viewed from above, all around the outer periphery of the periphery of the first recess 35a.

The length a from the outer edge of the first recess 35a to the inner edge of the notch 36a is IC
The length is within 60% of the length b of the module 11. By setting the length a within 60% of the length in this way, it is possible to obtain an appropriate bending action absorption effect by the notch 36 portion. Further, if the length a is within 30% of the length b, a better bending action absorption effect can be obtained.

In each of the above-described embodiments, the cutouts 36a and 36b are provided so as to form a quadrangular shape when viewed from the plane, but the present invention is not limited to this, and may be provided as shown in FIG. 6 or 7. .

That is, in FIG. 6, a notch 36a orthogonal to the longitudinal direction of the card substrate 30 is provided at one side edge of the first recess 35a. When the IC card 10 is subjected to the bending action in the longitudinal direction of the card base material 30 when the notch 36a is provided as shown in FIG. 6,
The bending action applied to the card base material 30 is due to the notch 36 of the card base material 30.
Absorbed in part a.

Further, in FIG. 7, a pair of notches 36a orthogonal to the longitudinal direction of the card substrate 30 are provided on both side edges of the first recess 35a. Further, only the notch 36b may be provided on one side edge or both side edges (not shown). In this case, when the I card 10 is subjected to a bending action orthogonal to the longitudinal direction of the card base material 30, a bending action absorbing effect is exhibited.

Furthermore, in each of the above-described embodiments, an example in which the cutouts 36a and 36b have a quadrangular cross section is shown, but the cutouts 36a and 36b may have a V-shaped cross section (FIG. 8A). In addition, a trapezoidal cross section (Fig. 8 (b)) or a U-shaped cross section (Fig. 8)
It may be as shown in FIG.

Further, although the example in which the notches 36a and 36b are formed continuously when viewed from the plane is shown, the present invention is not limited to this and may be formed intermittently. Furthermore, although an example is shown in which the cross section of the IC module 11 is substantially convex, the present invention is not limited to this, and the IC module 11 may be formed in a rectangular parallelepiped shape.

〔The invention's effect〕

According to the present invention, it is possible to absorb the bending action from the outside that is applied from above or below due to the notch. In this case, even if a bending action is applied to the cutout from the outside, the second recess in which the resin mold portion is housed and the cutout are separated from each other by a predetermined distance. Is not transmitted to the
The IC chip can be reliably protected. Further, by providing the notch, it is possible to prevent the adhesive from seeping out from the outer periphery of the IC module or the through hole to the external terminal side.

[Brief description of drawings]

1 and 2 are views showing a first embodiment of an IC card according to the present invention. FIG. 1 is a side sectional view of the same, and FIG. 2 is a plan view showing a concave portion of a card base material. Figure shows the second of the present invention
4 is a side sectional view of an IC card showing an embodiment of the present invention, FIG. 4 is a side sectional view of an IC card showing a third embodiment of the present invention, and FIG. 5 is an IC card showing the fourth embodiment of the present invention. Fig. 6 is a side sectional view, Fig. 6 is a plan view showing a card base material in which a notch orthogonal to the longitudinal direction of the card base material is provided at one side edge of the first recessed portion, and Fig. 7 is a card base material at both ends of the first recessed portion. FIG. 8 is a plan view showing a card substrate provided with a cutout orthogonal to the longitudinal direction of FIG. 8, FIG. 8 is a view showing each cross-sectional shape of the cutout, and FIG. 9 is a side cross-section of an IC card showing a fifth embodiment of the present invention. It is a figure. 10 …… IC card, 11 …… IC module, 12 …… Board, 13
...... External terminal, 13a …… Insulation groove, 14 …… Through hole, 1
4a ... Conductive plating, 15 ... Pattern layer, 16 ... Solder resist layer, 17 ... IC chip, 18 ... Bonding wire,
19: Resin mold part, 20: Die bonding adhesive, 30: Card substrate, 34: Adhesive, 35: Recess, 36
…… Notch.

Claims (1)

(57) [Claims] 1. An external terminal is provided on one surface of a substrate, and an IC chip and a pattern layer are provided on the other surface of the substrate.
IC formed by resin molding around chip and wiring
In an IC card provided with a module and a card base material in which a recess is formed on the surface and the IC module is mounted and fixed in the recess, the IC module has a convex cross-section with a resin mold portion as a projection. None, the recess of the card base is a first recess, and the first recess is disposed inside the first recess.
A second recess formed deeper than the recess and accommodating the resin mold portion, and a notch is provided at a predetermined interval from the second recess along the peripheral edge of the first recess, and the notch is provided from the outside. An IC card characterized by absorbing the bending action of.